TW202245980A - 研磨墊的製造方法 - Google Patents

研磨墊的製造方法 Download PDF

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Publication number
TW202245980A
TW202245980A TW111107133A TW111107133A TW202245980A TW 202245980 A TW202245980 A TW 202245980A TW 111107133 A TW111107133 A TW 111107133A TW 111107133 A TW111107133 A TW 111107133A TW 202245980 A TW202245980 A TW 202245980A
Authority
TW
Taiwan
Prior art keywords
mentioned
detection window
window member
end point
polishing pad
Prior art date
Application number
TW111107133A
Other languages
English (en)
Chinese (zh)
Inventor
川村佳秀
糸山光紀
関谷仁志
立野哲平
小池堅一
髙見沢大和
Original Assignee
日商富士紡控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021050341A external-priority patent/JP2022148596A/ja
Priority claimed from JP2021051702A external-priority patent/JP2022149504A/ja
Priority claimed from JP2021156483A external-priority patent/JP2023047519A/ja
Priority claimed from JP2021156530A external-priority patent/JP2023047558A/ja
Priority claimed from JP2021156497A external-priority patent/JP2023047530A/ja
Priority claimed from JP2021160631A external-priority patent/JP2023050503A/ja
Application filed by 日商富士紡控股股份有限公司 filed Critical 日商富士紡控股股份有限公司
Publication of TW202245980A publication Critical patent/TW202245980A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
TW111107133A 2021-03-24 2022-02-25 研磨墊的製造方法 TW202245980A (zh)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2021-050341 2021-03-24
JP2021050341A JP2022148596A (ja) 2021-03-24 2021-03-24 研磨パッドの製造方法
JP2021051702A JP2022149504A (ja) 2021-03-25 2021-03-25 研磨パッドの製造方法
JP2021-051702 2021-03-25
JP2021-156483 2021-09-27
JP2021-156530 2021-09-27
JP2021156483A JP2023047519A (ja) 2021-09-27 2021-09-27 研磨パッド及び研磨加工物の製造方法
JP2021156530A JP2023047558A (ja) 2021-09-27 2021-09-27 研磨パッドの製造方法
JP2021-156497 2021-09-27
JP2021156497A JP2023047530A (ja) 2021-09-27 2021-09-27 研磨パッドの製造方法
JP2021160631A JP2023050503A (ja) 2021-09-30 2021-09-30 終点検出用窓材の製造方法
JP2021-160631 2021-09-30

Publications (1)

Publication Number Publication Date
TW202245980A true TW202245980A (zh) 2022-12-01

Family

ID=83396976

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111107133A TW202245980A (zh) 2021-03-24 2022-02-25 研磨墊的製造方法

Country Status (2)

Country Link
TW (1) TW202245980A (fr)
WO (1) WO2022202059A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4530584B1 (fr) * 1965-12-02 1970-10-03
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
JP2006069158A (ja) * 2004-09-06 2006-03-16 Bridgestone Corp 成形用の金型及び成形方法
JP2006110686A (ja) * 2004-10-15 2006-04-27 Toyo Tire & Rubber Co Ltd 研磨パッド
US8585790B2 (en) * 2009-04-23 2013-11-19 Applied Materials, Inc. Treatment of polishing pad window
US8257545B2 (en) * 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
KR101495143B1 (ko) * 2010-09-30 2015-02-24 넥스플래너 코퍼레이션 와전류 종료­시점 검출을 위한 연마 패드를 제조하는 방법

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WO2022202059A1 (fr) 2022-09-29

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