WO2022190450A1 - 樹脂成形装置および樹脂成形品の製造方法 - Google Patents

樹脂成形装置および樹脂成形品の製造方法 Download PDF

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Publication number
WO2022190450A1
WO2022190450A1 PCT/JP2021/038350 JP2021038350W WO2022190450A1 WO 2022190450 A1 WO2022190450 A1 WO 2022190450A1 JP 2021038350 W JP2021038350 W JP 2021038350W WO 2022190450 A1 WO2022190450 A1 WO 2022190450A1
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WIPO (PCT)
Prior art keywords
molded
substrate
pair
molded substrate
resin
Prior art date
Application number
PCT/JP2021/038350
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English (en)
French (fr)
Japanese (ja)
Inventor
和己 中山
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN202180093046.0A priority Critical patent/CN116802040A/zh
Priority to KR1020237026034A priority patent/KR20230125312A/ko
Publication of WO2022190450A1 publication Critical patent/WO2022190450A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C2045/1784—Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for

Definitions

  • the present disclosure relates to a resin molding apparatus and a method of manufacturing a resin molded product.
  • a transport device for transporting a substrate includes a heat insulating plate capable of suppressing the release of heat from the substrate when transporting the substrate, and a surface of the heat insulating plate facing the substrate.
  • a resin sealing device is described which is capable of suppressing a temperature drop during transportation of a substrate by including a heat reflecting plate having a function of reflecting heat.
  • the molded product which is the substrate after resin sealing, is carried out from the mold onto the cooling stage of the gate break section by the conveying device.
  • the molded product is clamped by metal plates arranged above and below the molded product, and air at room temperature is blown together with the metal plate to cool the molded product and correct the warpage of the molded product. After that, unnecessary portions (cull portions) are cut off (gate broken) from the cooled molded product.
  • a resin molding apparatus including a resin molding mechanism, wherein the resin molding mechanism includes a first mold, a second mold arranged to face the first mold, and the first mold. and a mold clamping mechanism configured to be capable of clamping the second mold, wherein the resin molding apparatus comprises a pair of substrates after the first mold and the second mold are clamped to resin-mold the pair of substrates. and an unnecessary resin removing mechanism capable of removing an unnecessary resin portion of the molded substrate, wherein the unnecessary resin removing mechanism comprises a pair of molded substrate mounting portions configured to mount the pair of molded substrates.
  • a resin molding apparatus comprising a heating unit capable of heating the first molded substrate and the second molded substrate from which unnecessary resin portions have been removed from the molded substrate.
  • a step of forming a pair of molded substrates by clamping a first mold and a second mold to mold the pair of substrates with resin;
  • the pair of molded substrates placed on the pair of molded substrate mounting parts is pressed by the pair of molded substrate holding parts to separate the pair of molded substrates.
  • forming a first molded substrate and a second molded substrate by removing unnecessary resin portions; 2. Heating the molded substrate can be provided.
  • FIG. 1 is a block diagram of an example configuration of a resin molding apparatus according to an embodiment
  • FIG. FIG. 2 is a schematic side view of an example of the resin molding mechanism shown in FIG. 1
  • 1 is a schematic plan view of an example of a pair of molded substrates of an embodiment
  • FIG. FIG. 2 is a schematic front view of an example of the unnecessary resin removing mechanism shown in FIG. 1
  • FIG. 10 is a schematic plan view illustrating a process of pressing a pair of molded substrates of the embodiment with a pair of molded substrate holding portions
  • FIG. 4 is a schematic plan view illustrating a step of forming a first molded substrate and a second molded substrate by removing unnecessary resin portions of a pair of molded substrates of the embodiment
  • FIG. 4A is a schematic plan view illustrating a step of heating the first molded substrate and the second molded substrate of the embodiment
  • 2 is a schematic front view of an example of the transport mechanism shown in FIG. 1
  • FIG. FIG. 9 is a schematic side view of the transport mechanism shown in FIG. 8
  • (a) is a schematic front view of an example of a transport mechanism performing a pressing process
  • (b) is a surface view of a first molded substrate or a second molded substrate undergoing a pressing process.
  • 1 is a schematic plan view of an example
  • FIG. FIG. 10 is a photograph of a first molded substrate and a second molded substrate of an experimental example after removing an unnecessary resin portion from a pair of molded substrates of an experimental example
  • FIG. 11 is a photograph of a first molded substrate and a second molded substrate of an experimental example after a heating process
  • FIG. 10A and 10B are photographs of the first molded substrate and the second molded substrate of the experimental example after being placed on the transport rail
  • It is a photograph after mounting the first molded substrate and the second molded substrate of the experimental example after the pressing step on the transport rail.
  • FIG. 1 shows a block diagram of an example configuration of a resin molding apparatus according to an embodiment.
  • the resin molding apparatus 10 shown in FIG. 1 includes a resin molding mechanism 20, an unnecessary resin removing mechanism 100, a conveying mechanism 300, and a controller 500.
  • the controller 500 is configured to be able to control the resin molding mechanism 20 , the unnecessary resin removing mechanism 100 and the transport mechanism 300 .
  • the resin molding apparatus 10 may have a configuration other than the resin molding mechanism 20, the unnecessary resin removing mechanism 100, the transport mechanism 300, and the controller 500.
  • the resin molding apparatus 10 may include a pre-molding substrate supply mechanism that supplies a substrate before resin molding and/or a resin material supply mechanism that supplies a resin material.
  • FIG. 2 shows a schematic side view of an example of the resin molding mechanism 20 shown in FIG.
  • the resin molding mechanism 20 shown in FIG. 2 is configured such that a first mold 21, a second mold 22 arranged to face the first mold 21, and the first mold 21 and the second mold 22 can be clamped. and a mold clamping mechanism 27 .
  • a first mold 21, the second mold 22 and the mold clamping mechanism 27 conventionally known ones can be used, for example.
  • the resin molding mechanism 20 further includes a first platen 23 with a first mold 21 , a movable platen 24 with a second mold 22 , and a second platen 25 with a mold clamping mechanism 27 .
  • the resin molding mechanism 20 further includes rod-shaped tie bars 26 that connect the first platen 23, the movable platen 24, and the second platen 25 with a space therebetween.
  • a first platen 23 is fixed to one end of the tie bar 26
  • a second platen 25 is fixed to the other end of the tie bar 26 .
  • Movable platen 24 is connected to tie bars 26 so as to be movable between first platen 23 and second platen 25 .
  • the resin molding mechanism 20 can also use a pair of vertically extending plate members instead of the tie bars 26 .
  • FIG. 3 shows a schematic plan view of an example of a pair of molded substrates 200 of the embodiment.
  • a pair of molded substrates 200 shown in FIG. 3 are formed by transfer molding using the resin molding mechanism 20 shown in FIG.
  • the pair of molded substrates 200 shown in FIG. 3 includes a first molded substrate 240a and a second molded substrate 240b, which are a pair of molded substrates, and a first molded substrate 240a and a second molded substrate. and an unnecessary resin portion 230 between the substrate 240b.
  • the first molded substrate 240a includes a first substrate 210a and a first molded resin portion 220a provided on the surface of the first substrate 210a.
  • the first molded resin portion 220a may be provided to seal an electronic element (not shown) such as a semiconductor chip connected on the surface of the first substrate 210a.
  • the surface of the first substrate 210a can be rectangular, for example.
  • the second molded substrate 240b includes a second substrate 210b and a second molded resin portion 220b provided on the surface of the second substrate 210b.
  • the second molded resin portion 220b may be provided to seal an electronic element (not shown) such as a semiconductor chip connected on the surface of the second substrate 210b.
  • the surface of the second substrate 210b can be rectangular, for example.
  • the unnecessary resin portions 230 are, for example, as shown in FIG. and two runner portions 234 that are spaced apart from each other and extend linearly.
  • a pair of molded substrates 200 shown in FIG. 3 can be manufactured, for example, by the following steps. First, a first substrate 210 a and a second substrate 210 b, which are a pair of substrates having electronic elements, are placed on either the first mold 21 or the second mold 22 .
  • a pair of molded substrates 200 can be formed by resin-molding the first substrate 210a and the second substrate 210b.
  • the mold clamping between the first mold 21 and the second mold 22 is performed by, for example, the mold clamping mechanism 27 moving the movable platen 24 with respect to the first platen 23 and the second mold 20 with respect to the first mold 10 . can be done by pressing
  • the first molding resin portion 220a is provided on the surface of the first substrate 210a, and the second substrate 210b is formed on the surface of the second substrate 210b. This can be accomplished by providing two molded resin portions 220b.
  • a lead frame, a printed wiring board, a metal board, a resin board, a semiconductor board, or a ceramic board can be used as the first board 210a and the second board 210b.
  • the resin used for resin molding for example, an epoxy resin or the like can be used.
  • FIG. 4 shows a schematic front view of an example of the unnecessary resin removing mechanism 100 shown in FIG.
  • the unnecessary resin removing mechanism 100 can remove the unnecessary resin portion 230 between the first molded substrate 240a and the second molded substrate 240b of the pair of molded substrates 200 configured as shown in FIG. It is configured.
  • the unnecessary resin removing mechanism 100 includes a pair of molded substrate mounting portions 130 configured to be capable of mounting a pair of molded substrates 200 and a pair of molded substrate mounting portions 130 mounted on the pair of molded substrate mounting portions 130 . and a pair of molded substrate pressing portions 140 configured to be able to press the substrate 200 .
  • the pair of molded substrate mounting portions 130 includes a first molded substrate mounting portion 130a and a second molded substrate mounting portion 130b.
  • the first molded substrate mounting portion 130a and the second molded substrate mounting portion 130b are arranged in parallel with a space therebetween.
  • the first molded substrate mounting portion 130a is configured to have a first mounting surface 131a on which the first molded substrate 240a can be mounted.
  • the second shaped substrate mounting portion 130b is configured to have a second mounting surface 131b configured to allow the second shaped substrate 240b to be placed thereon.
  • the pair of molded substrate mounting parts 130 is also configured to be able to heat the first molded substrate 240a and the second molded substrate 240b after the unnecessary resin portion has been removed from the pair of molded substrates 200.
  • a heating unit 170 is provided.
  • the heating unit 170 includes a first heating unit 170a capable of heating the first molded substrate 240a and a second heating unit 170b capable of heating the second molded substrate 240b. ing.
  • the first heating part 170a is provided in the first molded substrate mounting part 130a so as to be able to heat the first molded substrate 240a mounted on the first molded substrate mounting part 130a.
  • the second heating part 170b is provided on the second molded substrate mounting part 130b so as to be able to heat the second molded substrate 240b mounted on the second molded substrate mounting part 130b.
  • the heating unit 170 also detects the temperature of the first mounting surface 131a of the first formed substrate mounting unit 130a, which is an index of the heating temperature of the first formed substrate 240a by the first heating unit 170a.
  • a first temperature sensor (not shown) may be provided to measure the heating temperature of the second molded substrate 240b by the second heating unit 170b.
  • a second temperature sensor (not shown) may be provided to detect the temperature of the second placement surface 131b.
  • the pair of molded substrate holding portions 140 includes a first molded substrate holding portion 140a and a second molded substrate holding portion 140b.
  • the first molded substrate holding portion 140a and the second molded substrate holding portion 140b are arranged in parallel with a space therebetween.
  • the first molded substrate pressing portion 140a can press the first molded substrate 240a placed on the first molded substrate mounting portion 130a against the first molded substrate mounting portion 130a. It is configured.
  • the second molded substrate holding portion 140b can press the second molded substrate 240b placed on the second molded substrate mounting portion 130b against the second molded substrate mounting portion 130b. It is configured.
  • the unnecessary resin removing mechanism 100 includes a receiving member 120 configured to allow the cull portions 232 of the unnecessary resin portions 230 of the pair of molded substrates 200 to be placed thereon; 232 , and pressing portion pressing members 160 configured to press both ends of the pair of molded substrate pressing portions 140 .
  • the first mold 21 and the second mold 22 of the resin molding mechanism 20 shown in FIG. 3 is performed to form a pair of molded substrates 200 shown in FIG.
  • the process of forming the pair of molded substrates 200 can be performed, for example, as described above.
  • a step of placing the pair of molded substrates 200 on the pair of molded substrate mounting portions 130 is performed.
  • the first molded substrate 240a of the pair of molded substrates 200 is placed on the first molded substrate mounting portion 130a, and the second molded substrate of the pair of molded substrates 200 is placed.
  • 240b can be placed on the second molded substrate placement portion 130b.
  • the cull portions 232 of the pair of molded substrates 200 are placed on the receiving member 120 .
  • a step of pressing the pair of molded substrates 200 on the pair of molded substrate mounting portions 130 with the pair of molded substrate pressing portions 140 is performed.
  • a pair of molded substrates 200 are placed on a pair of molded substrate mounting portions 130, and the pair of molded substrates 200 on the pair of molded substrate mounting portions 130 are placed on a pair of substrates. This can be done by pressing with the molded substrate pressing portion 140 .
  • the first molded substrate 240a is mounted on the first molded substrate mounting portion 130a, and the first molded substrate 240a is mounted on the first molded substrate mounting portion 130a.
  • the substrate 240a is pressed by the first molded substrate pressing portion 140a, and the second molded substrate mounting portion 130b places the second molded substrate 240b on the second molded substrate mounting portion 130b. This can be done by pressing the second molded substrate 240b on the portion 130b with the second molded substrate pressing portion 140b.
  • the cull portions 232 of the pair of molded substrates 200 are pressed against the receiving member 120 by the cull pressing member 150 .
  • a step of forming a first molded substrate 240a and a second molded substrate 240b by removing the unnecessary resin portion 230 of the pair of molded substrates 200 is performed.
  • the pair of formed substrates 200 on the pair of formed substrate mounting portions 130 are pressed by the pair of formed substrate holding portions 140 , and the cull pressing member 150 presses the cull portion 232 against the receiving member 120 .
  • Pressing portion pressing member 160 presses both ends of the pair of molded substrate pressing portions 140 toward the pair of molded substrate pressing portions 140 side.
  • the unnecessary resin portion 230 is removed from the pair of molded substrates 200, and the first molded substrate 240a and the second molded substrate 240b can be formed.
  • a step of heating the first molded substrate 240a and the second molded substrate 240b by heating units 170 provided on the pair of molded substrate mounting units 130 (hereinafter simply referred to as referred to as a "heating step").
  • the pressure of the pressing portion pressing members 160 against both ends of the pair of molded substrate pressing portions 140 is released, and the pair of molded substrate pressing portions 140 are pressed against the first molded substrate 240a and the second substrate 240a.
  • the first heating unit 170a provided in the first molded substrate mounting unit 130a heats the first molded substrate 240a, and the second molded substrate is mounted. This can be done by heating the second molded substrate 240b with the second heating unit 170b provided in the placement unit 130b.
  • warping occurring in the first molded substrate 240a and the second molded substrate 240b after the unnecessary resin portion 230 is removed can be corrected.
  • the pair of substrates (first substrate 210a and second substrate 210b) and the molded resin portion are separated from each other.
  • the first molded substrate 240a and the second molded substrate 240b after the unnecessary resin portion 230 is removed may warp. may occur.
  • the first molded substrate 240a and the second molded substrate 240b are heated. Since the warp generated in the substrate 240b can be corrected, it is possible to manufacture the resin molded product with the warp corrected at a high yield.
  • the first molded substrate 240a and the second molded substrate 240b are heated by the heating unit 170 (the first heating unit 170a and the second heating unit 170b) while the substrate 200 is pressed by the pair of molded substrate pressing units 140. is preferably heated.
  • the above heating step is preferably performed with a pressure of 850 Pa or more and 1600 Pa or less applied to the first molded substrate 240a and the second molded substrate 240b, and is performed while a pressure of 900 Pa or more and 1400 Pa or less is applied. is more preferable, and it is even more preferable to carry out under the condition that a pressure of 950 Pa or more and 1200 Pa or less is applied. In these cases, there is a tendency that the warping of the first molded substrate 240a and the second molded substrate 240b can be corrected more effectively.
  • the surfaces of the pair of formed substrate mounting portions 130 are preferably heated to 140°C or higher and 175°C or lower. Heating to 165°C or less is more preferable, and heating to 150°C or more to 155°C or less is even more preferable. In these cases, there is a tendency that the warping of the first molded substrate 240a and the second molded substrate 240b can be corrected more effectively.
  • the first molded substrate 240a and the second molded substrate 240b are preferably heated for 15 seconds or more and 40 seconds or less, more preferably 20 seconds or more and 35 seconds or less, and 25 seconds or more. It is more preferable to heat for 30 seconds or less. In these cases, there is a tendency that the warping of the first molded substrate 240a and the second molded substrate 240b can be corrected more effectively.
  • FIG. 8 shows a schematic front view of an example of the transport mechanism 300 shown in FIG.
  • FIG. 9 shows a schematic side view of the transport mechanism 300 shown in FIG. 8 and 9 show the transport mechanism 300 holding the first molded substrate 240a and the second molded substrate 240b after the heating process described above.
  • a transport mechanism 300 shown in FIGS. 8 and 9 picks up the first molded substrate 240a and the second molded substrate 240b after the above-described heating process, and transports them connected to the storage unit for resin molded products. It is configured to be transportable on rails.
  • the first molded substrate 240a and the second molded substrate 240b are accommodated in a resin molded article accommodating portion (not shown) via a transport rail.
  • the transport mechanism 300 includes a pair of transport substrate contact portions 301 configured so that the first molded substrate 240a and the second molded substrate 240b can contact each other, and the pair of transport substrate contact portions 301 having the first molded substrate. 240a and a pair of transfer substrate pressing portions 302 capable of pressing the second molded substrate 240b.
  • the pair of transfer substrate contact portions 301 includes a first transfer substrate contact portion 301a configured to allow contact with the first molded substrate 240a and a second transfer substrate contact portion 301a configured to allow contact with the second molded substrate 240b. and a transfer substrate contact portion 301b.
  • the pair of transfer substrate pressing portions 302 are configured to press the peripheral edge of the first molded substrate 240a and the peripheral edge of the second molded substrate 240b. and a second transfer substrate holding portion 302b.
  • the transport mechanism 300 includes transport rails (not shown) configured to receive the first molded substrate 204a and the second molded substrate 204b placed from the transport mechanism 300. I have more.
  • the transport mechanism 300 can perform a process of picking up the first molded substrate 240a and the second molded substrate 240b.
  • the picking up step as shown in FIGS. 8 and 9, for example, the L-shaped first transfer substrate holding portion 302a and the second transfer substrate holding portion 302b are moved downward, and the L-shaped second holding portion 302b is moved downward.
  • 1 transport substrate pressing portion 302a picks up the first molded substrate 240a
  • the L-shaped second transport substrate pressing portion 302b picks up the second molded substrate 240b.
  • the transport mechanism 300 can perform a process of holding the first molded substrate 240a and the second molded substrate 240b after the above-described picking up process.
  • the L-shaped first transfer substrate pressing portion 302a picks up the first molded substrate 240a and holds the first substrate 240a.
  • the first molded substrate 240a is brought into contact with the first transport substrate contact portion 301a, and the L-shaped second transport substrate holding portion 302b moves to the second molded substrate holding portion 302b. This can be done by moving the substrate 240b picked up to the second transfer substrate contact portion 301b side and bringing the second molded substrate 240b into contact with the second transfer substrate contact portion 301b.
  • the transport mechanism 300 can perform a step of pressing the first molded substrate 240a and the second molded substrate 240b after the above picking up step or the above holding step.
  • the first molded substrate 240a and the second molded substrate 240b are pressed. (hereinafter simply referred to as a "pressing step") to suppress recurrence of warpage in the first molded substrate 240a and the second molded substrate 240b after being placed on the transport rail. can be done. More specifically, the first molded substrate 240a and the second molded substrate 240b, whose warpage has been corrected by heating, are cooled and pressed until they reach the same temperature as the ambient temperature. , the state in which the warp is corrected can be maintained.
  • FIG. 10(a) shows a schematic front view of an example of the transport mechanism 300 performing the pressing process described above.
  • FIG. 10(b) shows a schematic plan view of an example of the surface of the first molded substrate 240a or the second molded substrate 240b on which the pressing process is being performed.
  • the L-shaped first transfer substrate pressing portion 302a presses the peripheral edge of the first molded substrate 240a to the first position.
  • the L-shaped second transfer substrate pressing portion 302b presses the peripheral edge of the second molded substrate 240b against the second transfer substrate contact portion 301b.
  • the dimensions of the peripheral edge can be appropriately changed depending on the type of the pair of substrates or the resin.
  • a pressure of 5000 Pa or more and 7000 Pa or less is preferably applied to the first molded substrate 240a and the second molded substrate 240b, more preferably 5500 Pa or more and 6500 Pa or less. It is more preferable to apply a pressure of 6000 Pa or more and 6200 Pa or less. In these cases, it tends to be possible to suppress the recurrence of warping due to cooling of the first molded substrate 240a and the second molded substrate 240b by the surrounding atmosphere.
  • the step of pressing the first molded substrate 240a and the second molded substrate 240b is preferably performed for 10 seconds or more and 25 seconds or less, more preferably 12 seconds or more and 20 seconds or less, and more preferably 13 seconds or more and 15 seconds or less. It is more preferable to carry out in seconds or less. In these cases, it tends to be possible to suppress the recurrence of warping due to cooling of the first molded substrate 240a and the second molded substrate 240b by the surrounding atmosphere. More preferably, the pressing step is performed until the temperatures of the first molded substrate 240a and the second molded substrate 240b reach the same temperature as the ambient atmosphere.
  • the transport mechanism 300 performs a step of stopping the movement while the pair of transport substrate pressing portions 302 presses the first molded substrate 204a and the second molded substrate 204b against the pair of transport substrate contact portions 301. be able to.
  • the first transfer substrate holding portion 302a presses the first molded substrate 240a against the first transfer substrate contact portion 301a
  • the second transfer substrate holding portion 302b presses the second transfer substrate contact portion 301a.
  • This can be done by stopping the movement of the transport mechanism 300 while pressing the molded substrate 240b against the second transport substrate contact portion 301b. This makes it possible to more stably press the first molded substrate 240a by the first transfer substrate holding portion 302a and press the second molded substrate 204b by the second transfer substrate holding portion 302b.
  • the transport mechanism 300 can perform a process of placing the first molded substrate 240a and the second molded substrate 240b on the transport rails.
  • the step of placing on the transport rails is performed after the pressing step, as described above, the first molded substrate 240a and the second shaped substrate 240b after being placed on the transport rails are warped. Recurrence can be suppressed.
  • the transport mechanism 300 can carry out a process of transporting the first molded substrate 240a and the second molded substrate 240b to the storage section after the process of placing them on the transport rails.
  • the warp-corrected first molded substrates 240a and second molded substrates 240b can be manufactured with a high yield. It is possible to easily store the molded substrate 240b in the storage portion.
  • the above-described heating process is performed to prevent the first molded substrate 240a and the second molded substrate 240b from being warped. Since the warp generated in the second molded substrate 240b can be corrected, it is possible to manufacture the resin molded product with the warp corrected at a high yield.
  • the first molded substrate 240a and the second molded substrate 240b are pressed by the transport mechanism 300 before the step of placing them on the transport rails. Since it is possible to suppress the recurrence of the warp in the finished substrate 240a and the second molded substrate 240b, when the pressing process by the conveying mechanism 300 is performed, the warp-corrected resin molded product can be obtained at a higher yield. It is possible to manufacture in
  • the unnecessary resin portion 230 is removed from the pair of molded substrates 200 of the experimental example by the unnecessary resin removing mechanism 100 shown in FIGS.
  • a molded substrate 240a and a second molded substrate 240b were formed.
  • FIG. 11 shows photographs of the first molded substrate 240a and the second molded substrate 240b of the experimental example after removing the unnecessary resin portion 230 from the pair of molded substrates 200 of the experimental example. As shown in FIG. 11, it was confirmed that the first molded substrate 240a and the second molded substrate 240b of the experimental example after removing the unnecessary resin portion 230 were warped.
  • the first molded substrate is mounted while the pair of molded substrate pressing portions 140 are pressing the first molded substrate 240a and the second molded substrate 240b of the experimental example.
  • the first heating unit 170a mounted on the placement unit 130a heats the first molded substrate 240a of the experimental example
  • the second heating unit mounted on the second molded substrate mounting unit 130b. 170b performed a heating step for heating the second molded substrate 240b of the experimental example.
  • the first molded substrate 240a and the second molded substrate 240b of the experimental example were placed on the first mounting surface 131a and the second mounting surface 131b while a pressure of 950 Pa was applied. was heated to 150° C. for 30 seconds.
  • FIG. 12 shows photographs of the first molded substrate 240a and the second molded substrate 240b of the experimental example after the heating process. As shown in FIG. 12, it was confirmed that the warp shown in FIG. 11 was corrected in the first molded substrate 240a and the second molded substrate 240b of the experimental example after the heating process. .
  • FIG. 13 shows photographs of the first molded substrate 240a and the second molded substrate 240b of the experimental example after being placed on the transport rail. As shown in FIG. 13, it was confirmed that the first molded substrate 240a and the second molded substrate 240b of the experimental example after being placed on the transport rail were warped again.
  • the first transfer substrate pressing portion 302a presses the peripheral edge of the first molded substrate 240a to the first transfer substrate contact portion 301a.
  • the second transfer substrate holding portion 302b presses the peripheral edge of the second molded substrate 240b against the second transfer substrate contact portion 301b.
  • the first molded substrate 240a and the second molded substrate 240b of the experimental example were maintained at ambient temperature for 10 seconds with a pressure of 6000 Pa applied.
  • FIG. 14 shows a photograph after the first molded substrate 240a and the second molded substrate 240b of the experimental example after the pressing process were placed on the transport rail.
  • FIG. 14 it was confirmed that warping of the first molded substrate 240a and the second molded substrate 240b of the experimental example after the pressing process was corrected as compared with the case shown in FIG. rice field.
  • the same experiment as in the experimental example was conducted with the substrates 210a and 210b having a thickness of 0.1 mm, and it was confirmed that the warp was corrected in the same manner as in the experimental example.
  • the unnecessary resin portion is removed from the pair of molded substrates, and then the first molded substrate and the second molded substrate are subjected to the heating process, whereby the unnecessary resin is removed. It was confirmed that the warpage occurring in the first molded substrate and the second molded substrate after the removal of the resin portion could be corrected.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
PCT/JP2021/038350 2021-03-10 2021-10-18 樹脂成形装置および樹脂成形品の製造方法 WO2022190450A1 (ja)

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KR1020237026034A KR20230125312A (ko) 2021-03-10 2021-10-18 수지 성형 장치 및 수지 성형품의 제조 방법

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204273A (ja) * 1992-12-28 1994-07-22 Matsushita Electron Corp 半導体樹脂封止装置
JP2000114291A (ja) * 1998-09-30 2000-04-21 Fujitsu Ltd 半導体製造装置
JP2005150407A (ja) * 2003-11-17 2005-06-09 Apic Yamada Corp 樹脂封止装置
JP2014117888A (ja) * 2012-12-17 2014-06-30 Sumitomo Heavy Ind Ltd 樹脂封止装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6482616B2 (ja) * 2017-08-21 2019-03-13 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6560727B2 (ja) * 2017-10-25 2019-08-14 Ｔｏｗａ株式会社 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204273A (ja) * 1992-12-28 1994-07-22 Matsushita Electron Corp 半導体樹脂封止装置
JP2000114291A (ja) * 1998-09-30 2000-04-21 Fujitsu Ltd 半導体製造装置
JP2005150407A (ja) * 2003-11-17 2005-06-09 Apic Yamada Corp 樹脂封止装置
JP2014117888A (ja) * 2012-12-17 2014-06-30 Sumitomo Heavy Ind Ltd 樹脂封止装置

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JP2022138380A (ja) 2022-09-26
TW202235248A (zh) 2022-09-16

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