WO2022186016A1 - Film de liaison pour connexion de circuit et corps connecté - Google Patents

Film de liaison pour connexion de circuit et corps connecté Download PDF

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Publication number
WO2022186016A1
WO2022186016A1 PCT/JP2022/007383 JP2022007383W WO2022186016A1 WO 2022186016 A1 WO2022186016 A1 WO 2022186016A1 JP 2022007383 W JP2022007383 W JP 2022007383W WO 2022186016 A1 WO2022186016 A1 WO 2022186016A1
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Prior art keywords
circuit
adhesive film
particles
connection
meth
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PCT/JP2022/007383
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English (en)
Japanese (ja)
Inventor
譲 小林
直 工藤
翔太 三島
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昭和電工マテリアルズ株式会社
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Priority to CN202280016266.8A priority Critical patent/CN116917429A/zh
Priority to JP2023503743A priority patent/JPWO2022186016A1/ja
Priority to KR1020237031590A priority patent/KR20230154877A/ko
Publication of WO2022186016A1 publication Critical patent/WO2022186016A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Definitions

  • the present disclosure relates to an adhesive film for circuit connection and a connection body of circuit members.
  • various adhesive compositions have conventionally been used as circuit connecting materials for the purpose of bonding various members in the devices.
  • the adhesive composition is required to have various properties such as heat resistance and reliability under high temperature and high humidity conditions, in addition to adhesiveness.
  • wearable terminals In recent years, mobile terminals have become smaller, and the development of wearable terminals has also become active. Furthermore, wearable terminals are required to have excellent weather resistance due to their intended use. As the weather resistance, salt water resistance has been required in recent years.
  • the present disclosure has been made in view of the above problems of the prior art, and an adhesive film for circuit connection capable of forming a connection body having excellent salt water resistance, and a circuit member connection body using the same intended to provide
  • the present disclosure provides a first circuit member having a first circuit electrode formed on the main surface of a first substrate and a second circuit on the main surface of the second substrate.
  • An adhesive film for circuit connection for connecting a second circuit member having electrodes formed thereon with the first circuit electrode and the second circuit electrode facing each other, wherein the adhesive film is , (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, and (d) insulating particles, wherein the (b) radically polymerizable compound is a (meth)acrylate compound
  • the flow rate of the adhesive film is 140% or more at a heating temperature of 160 ° C., a pressure of 2 MPa, and a heating time of 5 seconds, and the linear expansion coefficient of the cured product of the adhesive film is 130 ppm on average at 80 to 90 ° C. /K or less to provide an adhesive film for circuit connection.
  • the adhesive film for circuit connection since it is in the form of a film, it is possible to easily connect circuit members and seal the circuit connection part in a small mobile terminal such as a wearable terminal, and it has excellent salt resistance. Connections having aqueous properties can be formed.
  • the present inventors speculate as follows about the reason why excellent salt water resistance is obtained. First, chloride ions, which are components of salt water, are more likely to permeate the interface between the circuit member and the connection member, which is a cured adhesive film, than the water component, thereby easily causing separation between the circuit member and the connection member. Therefore, even if the connector does not peel when exposed to normal water, it is likely to peel when exposed to salt water.
  • the linear expansion coefficient of the cured product is within the above range, so that the adhesion of the interface between the circuit member and the connection member is sufficient to prevent the salt water component from permeating. can be increased, and peeling can be suppressed even when the connector is exposed to salt water.
  • the flow rate is within the above range, so that the adhesive film flows when the circuit members are connected to each other and protrudes appropriately from between the circuit members, and the protruding portion is the circuit connection part. It will act as a protective lid. Since the lid portion also has high adhesion to the circuit member, it is possible to prevent salt water components from entering the interface between the circuit member and the connection member. Therefore, according to the adhesive film for circuit connection, it is possible to form a connecting body having excellent resistance to salt water. Moreover, the above effect is maximized when a (meth)acrylate compound is used as the radically polymerizable compound.
  • the (d) insulating particles may contain silica particles.
  • the (d) insulating particles may contain organic fine particles.
  • the organic fine particles may contain fine particles made of at least one kind of resin selected from the group consisting of polyurethane resins and silicone resins.
  • the average particle diameter of the (d) insulating particles may be 0.001 to 35 ⁇ m.
  • the circuit connection adhesive film may further contain (e) conductive particles. (e) By containing the conductive particles, the adhesive film for circuit connection can be imparted with conductivity or anisotropic conductivity, so the adhesive film can be more preferably used as a circuit connection material. Moreover, the connection resistance between the circuit electrodes electrically connected via the adhesive film can be more easily reduced.
  • the present disclosure also includes a pair of circuit members having circuit electrodes and arranged to face each other, and a connection member provided between the pair of circuit members and bonding the pair of circuit members together, The circuit electrode of the circuit member and the circuit electrode of the other circuit member are electrically connected, and the connection member is a cured product of the above adhesive film for circuit connection.
  • Such connectors can have excellent resistance to salt water.
  • an adhesive film for circuit connection capable of forming a connection body having excellent salt water resistance, and a circuit member connection body using the same.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a laminated film having an adhesive film for circuit connection;
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a connecting body;
  • FIG. It is a schematic sectional drawing which shows one Embodiment of the method of manufacturing a connection body.
  • each component in the composition means the total amount of the plurality of substances present in the composition unless otherwise specified when there are multiple substances corresponding to each component in the composition.
  • a numerical range indicated using "-" indicates a range including the numerical values before and after "-" as the minimum and maximum values, respectively.
  • the upper limit value or lower limit value of the numerical range at one step may be replaced with the upper limit value or lower limit value of the numerical range at another step.
  • (meth)acrylate means acrylate or its corresponding methacrylate
  • (meth)acryloyloxy means acryloyloxy or methacryloyloxy.
  • a first circuit member having first circuit electrodes formed on the main surface of a first substrate, and a second circuit having second circuit electrodes formed on the main surface of a second substrate A circuit connection adhesive film for connecting a member with the first circuit electrode and the second circuit electrode facing each other, the adhesive film comprising (a) a thermoplastic resin, ( b) a radically polymerizable compound, (c) a radical polymerization initiator, and (d) insulating particles, wherein the (b) radically polymerizable compound comprises a (meth)acrylate compound, and the flow rate of the adhesive film is 140% or more at a heating temperature of 160 ° C., a pressure of 2 MPa, and a heating time of 5 seconds, and the linear expansion coefficient of the cured product of the adhesive film is 130 ppm / K or less on average at 80 to 90 ° C., for circuit connection.
  • the adhesive film for circuit connection comprises (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, and (d) ) containing insulating particles.
  • the (b) radically polymerizable compound includes a (meth)acrylate compound.
  • the flow rate of the adhesive film is 140% or more at a heating temperature of 160° C., a pressure of 2 MPa, and a heating time of 5 seconds. Further, the coefficient of linear expansion (CTE) of the cured adhesive film is 130 ppm/K or less on average at 80 to 90°C.
  • the adhesive film having the above configuration comprises an adhesive composition containing the (a) thermoplastic resin, the (b) radically polymerizable compound, the (c) radical polymerization initiator, and the (d) insulating particles.
  • the adhesive film and adhesive composition may also contain (e) conductive particles. Each component will be described below.
  • thermoplastic resin is not particularly limited, but for example, one selected from polyimide resin, polyamide resin, phenoxy resin, poly(meth)acrylate resin, polyimide resin, polyester resin, polyurethane resin and polyvinyl butyral resin, Two or more resins are included.
  • the thermoplastic resin may contain siloxane bonds and/or fluorine groups. When two or more thermoplastic resins are used, the combination may be such that they are completely compatible or cause microphase separation to cause white turbidity.
  • the weight average molecular weight of the thermoplastic resin is not particularly limited, it may be 5,000 to 200,000, or 10,000 to 150,000.
  • the weight average molecular weight of the thermoplastic resin is 5000 or more, the adhesive strength of the adhesive film tends to improve.
  • the weight average molecular weight of the thermoplastic resin is 200,000 or less, there is a tendency that good compatibility with other components is likely to be obtained, and the fluidity of the adhesive film is likely to be improved.
  • the content of the thermoplastic resin may be 20 to 80% by mass, 25 to 70% by mass, or 30 to 60% by mass, based on the total amount of components (a) and (b). may be When the content of the thermoplastic resin is 20% by mass or more, the adhesive strength of the adhesive film tends to improve, and the film formability when forming the adhesive film from the adhesive composition tends to improve. If the amount is not more than % by mass, the adhesive film tends to be more fluid.
  • a rubber component can also be used as the thermoplastic resin for the purpose of relaxing stress and improving adhesion.
  • rubber components include acrylic rubber, polyisoprene, polybutadiene, carboxyl-terminated polybutadiene, hydroxyl-terminated polybutadiene, 1,2-polybutadiene, carboxyl-terminated 1,2-polybutadiene, hydroxyl-terminated 1,2-polybutadiene, and styrene-butadiene rubber.
  • the rubber component may have a cyano group or a carboxyl group, which are highly polar groups, as side chain groups or terminal groups. These rubber components can be used individually by 1 type or in combination of 2 or more types.
  • the adhesive film according to the present embodiment may contain any radically polymerizable compound (b), but it contains at least a (meth)acrylate compound.
  • This radically polymerizable compound may be either a monomer or an oligomer, or a combination of both.
  • the radically polymerizable compound may be one or more polyfunctional (meth)acrylate compounds having two or more (meth)acryloyloxy groups.
  • Such (meth)acrylate compounds are, for example, monomers or oligomers such as epoxy (meth)acrylates, urethane (meth)acrylates, polyether (meth)acrylates and polyester (meth)acrylates, trimethylolpropane tri(meth)acrylate , polyethylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, neopentyl glycol di(meth)acrylate, dipentaerythritol hexa (Meth) acrylate, isocyanuric acid-modified bifunctional (meth) acrylate, isocyanuric acid-modified tri-functional (meth) acrylate, epoxy (meth) produced by
  • the adhesive film may contain a monofunctional (meth)acrylate compound as the (b) radically polymerizable compound for the purpose of adjusting fluidity and the like.
  • Monofunctional (meth)acrylate compounds include, for example, pentaerythritol (meth)acrylate, 2-cyanoethyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate , 2-(2-ethoxyethoxy)ethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-hexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, hydroxy propyl (meth)acrylate, isobornyl (meth)acrylate, isodecyl (meth)acrylate, isoocty
  • the adhesive film contains, in addition to the above (meth)acrylate compound, a radically polymerizable functional group such as an aryl group, a maleimide group, and a vinyl group as the (b) radically polymerizable compound.
  • a radically polymerizable functional group such as an aryl group, a maleimide group, and a vinyl group as the (b) radically polymerizable compound.
  • N-vinylimidazole N-vinylpyridine, N-vinylpyrrolidone, N-vinylformamide, N-vinylcaprolactam, 4,4′-vinylidenebis(N,N-dimethylaniline), N -vinylacetamide, N,N-dimethylacrylamide, N-isopropylacrylamide and N,N-diethylacrylamide.
  • the adhesive film may contain a radically polymerizable compound having a phosphoric acid group as (b) a radically polymerizable compound for the purpose of improving adhesive strength.
  • radically polymerizable compounds having a phosphoric acid group include compounds represented by the following formulas (1), (2), and (3).
  • R 5 represents a (meth)acryloyloxy group
  • R 6 represents a hydrogen atom or a methyl group
  • w and x each independently represents an integer of 1-8.
  • Plural R 5 , R 6 , w and x in the same molecule may be the same or different.
  • R 7 represents a (meth)acryloyloxy group
  • y and z each independently represents an integer of 1-8.
  • Plural R 7 , y and z in the same molecule may be the same or different.
  • R 8 represents a hydrogen atom or a methyl group
  • R 9 represents a (meth)acryloyloxy group
  • b and c each independently represent an integer of 1-8.
  • R8 in the same molecule may be the same or different.
  • Radically polymerizable compounds having a phosphoric acid group include, for example, acid phosphooxyethyl methacrylate, acid phosphooxyethyl acrylate, acid phosphooxypropyl methacrylate, acid phosphooxypolyoxyethylene glycol monomethacrylate, acid phosphooxypolyoxypropylene glycol monomethacrylate. , 2,2′-di(meth)acryloyloxydiethyl phosphate, EO-modified dimethacrylate phosphate, phosphate-modified epoxy acrylate and vinyl phosphate.
  • the content of the radically polymerizable compound having a phosphoric acid group may be 0.1 to 15% by mass, or 0.5 to 10% by mass, based on the total amount of components (a) and (b). There may be. If the content of the radically polymerizable compound having a phosphate group is 0.1% by mass or more, high adhesive strength tends to be obtained, and if it is 15% by mass or less, the physical properties of the adhesive film after curing deteriorate. is less likely to occur, and the effect of improving reliability is good.
  • the total content of the (b) radically polymerizable compound contained in the adhesive film may be 20 to 80% by mass, preferably 25 to 70% by mass, based on the total amount of components (a) and (b). It may be present, and may be 30 to 60% by mass.
  • the total content is 20% by mass or more, the heat resistance tends to be improved, and when the total content is 80% by mass or less, the effect of suppressing peeling after being left in a high-temperature and high-humidity environment tends to increase.
  • the radical polymerization initiator can be arbitrarily selected from compounds such as peroxides and azo compounds. From the viewpoint of stability, reactivity and compatibility, a peroxide having a 1-minute half-life temperature of 90 to 175° C. and a molecular weight of 180 to 1,000 may be used. "1 minute half-life temperature” refers to the temperature at which the peroxide half-life is 1 minute. "Half-life” refers to the time it takes for the concentration of a compound to decrease to half of its initial value at a given temperature.
  • Radical polymerization initiators include, for example, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, di(4-t-butylcyclohexyl)peroxydicarbonate, di(2-ethylhexyl)peroxydicarbonate , cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethyl peroxyneodecanoate, t-hexyl peroxyneodecanoate, t-butyl peroxyneodecanoate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 2,5- Dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane, t-hexy
  • a compound that generates radicals upon irradiation with light having a wavelength of 150 to 750 nm can also be used as the radical polymerization initiator.
  • Such compounds are not particularly limited.
  • the adhesive film may contain a radical polymerization initiator that generates radicals by ultrasonic waves, electromagnetic waves, or the like.
  • the amount of chlorine ions or organic acid contained in the radical polymerization initiator may be 5000 ppm or less in order to suppress corrosion of the connection terminals (circuit electrodes) of the circuit members. From the same point of view, it may be a radically polymerizable compound that generates less organic acid after decomposition. It may be a radical polymerization initiator having a mass retention rate of 20% by mass or more after being left open for 24 hours at room temperature and normal pressure because it improves the stability of the circuit connecting material.
  • the content of the radical polymerization initiator may be 0.5 to 15 parts by mass, or 1.5 to 10 parts by mass, with respect to 100 parts by mass of the total amount of components (a) and (b). good too.
  • the adhesive film contains (d) insulating particles.
  • the insulating particles include organic fine particles and inorganic fine particles.
  • inorganic fine particles examples include metal oxide fine particles represented by silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles and zirconia fine particles, and nitride fine particles.
  • organic fine particles examples include urethane fine particles, silicone fine particles, methacrylate-butadiene-styrene fine particles, acryl-silicone fine particles, polyamide fine particles and polyimide fine particles.
  • the organic fine particles have a function as a shock absorbing agent having stress relaxation properties.
  • These insulating particles may have a uniform structure or a core-shell structure.
  • the insulating particles can be used singly or in combination of two or more.
  • inorganic fine particles and organic fine particles may be used in combination.
  • the salt water resistance of the connecting body formed using the adhesive film can be further improved.
  • the average particle diameter of the insulating particles may be 0.001-35 ⁇ m, 0.005-20 ⁇ m, or 0.001-10 ⁇ m.
  • the average particle size is 0.001 ⁇ m or more, the cohesive force of the insulating particles tends to improve, and when the average particle size is 35 ⁇ m or less, the dispersibility of the insulating particles tends to improve.
  • the average particle size in this specification can be measured, for example, with a scanning electron microscope (SEM).
  • the content of the insulating particles may be 5 parts by mass or more, 7.5 parts by mass or more, or 10 parts by mass with respect to 100 parts by mass as the total amount of components (a) and (b). parts or more, 15 parts by mass or more, or 20 parts by mass or more. If the content of the insulating particles is 5 parts by mass or more, it tends to be relatively easy to maintain the electrical connection between the facing electrodes. In addition, the content of the insulating particles may be 45 parts by mass or less, 40 parts by mass or less, or 35 parts by mass with respect to the total amount of 100 parts by mass of the components (a) and (b). It may be less than part.
  • the type and content of the insulating particles affect the flow rate and coefficient of linear expansion of the adhesive film. Therefore, the type and content of the insulating particles may be adjusted so that the flow rate and coefficient of linear expansion of the adhesive film are within specific ranges.
  • the adhesive film according to this embodiment may contain a silane coupling agent.
  • the silane coupling agent may be a compound represented by the following formula (4).
  • R 1 , R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxycarbonyl group having 1 to 5 carbon atoms, or represents an aryl group. At least one of R 1 , R 2 and R 3 is an alkoxy group.
  • R4 is a (meth)acryloyl group, vinyl group, isocyanate group, imidazole group, mercapto group, amino group, methylamino group, dimethylamino group, benzylamino group, phenylamino group, cyclohexylamino group, morpholino group, piperazino group, It represents a ureido group or a glycidyl group. a represents an integer of 1 to 10;
  • Silane coupling agents of formula (4) are, for example, vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyl Dimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2 (aminoethyl) 3-amino Propylmethyldimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, and 3-isocyanatopropyltriethoxysilane.
  • the content of the silane coupling agent may be 0.1 to 10 parts by mass, or 0.25 to 7 parts by mass, with respect to 100 parts by mass of the total amount of components (a) and (b). may be 0.5 to 5 parts by mass. If the content of the silane coupling agent is 0.1 parts by mass or more, the effect of suppressing the generation of peeling bubbles at the interface between the circuit member and the circuit connecting material tends to be greater, and the content of the silane coupling agent tends to be greater. When the content is 10 parts by mass or less, there is a tendency to easily suppress deterioration in fluidity when the adhesive film is stored for a long period of time.
  • the adhesive film according to the present embodiment may further contain (e) conductive particles.
  • An adhesive film containing conductive particles can be particularly suitably used as an anisotropically conductive adhesive film.
  • Examples of conductive particles include metal particles containing Au, Ag, Pd, Ni, Cu, solder, etc., and carbon particles.
  • the conductive particles are composite particles having core particles made of a non-conductive material such as glass, ceramic, plastic, etc., and a conductive layer containing a metal, metal particles, carbon, etc. covering the core particles. There may be.
  • the metal particles may be particles having copper particles and a silver layer coating the copper particles.
  • the core particles of the composite particles may be plastic particles.
  • the composite particles having the plastic particles as the core particles have the deformability of being deformed by heat and pressure, when the circuit members are bonded together, the contact area between the circuit electrodes of the circuit members and the conductive particles can be increased. Therefore, with an adhesive film containing these composite particles as conductive particles, it is possible to obtain a connected body that is even more excellent in terms of connection reliability.
  • the adhesive film may contain insulating coated conductive particles having the above conductive particles and an insulating layer or insulating particles covering at least part of the surface thereof.
  • the insulating layer can be provided by a method such as hybridization.
  • the insulating layer or insulating particles are formed from an insulating material such as a polymeric resin.
  • the average particle size of the conductive particles may be 1 to 18 ⁇ m from the viewpoint of obtaining good dispersibility and conductivity.
  • the particle size is measured by observation using a scanning electron microscope (SEM), and the average value of the obtained particle sizes is taken as the average particle size. .
  • the content of the conductive particles is not particularly limited, but may be 0.1 to 30% by volume, 0.1 to 10% by volume, or 0.1 to 10% by volume based on the total volume of the adhesive film. It may be 5 to 7.5% by volume. If the content of the conductive particles is 0.1% by volume or more, the conductivity tends to improve. If the content of the conductive particles is 30% by volume or less, short circuits between circuit electrodes tend to be less likely to occur.
  • the content (% by volume) of the conductive particles is determined based on the volume at 23° C. of each component constituting the adhesive film before curing or the adhesive composition before curing. The volume of each component can be determined by converting mass into volume using specific gravity.
  • An appropriate solvent water, alcohol, etc. that can wet the component well without dissolving or swelling the component whose volume is to be measured is placed in a graduated cylinder or the like, and the component to be measured is introduced into it. It is also possible to obtain the volume increased by
  • the adhesive film can contain stabilizers to control the curing speed and provide storage stability.
  • stabilizers include, but are not limited to, quinone derivatives such as benzoquinone and hydroquinone, phenol derivatives such as 4-methoxyphenol and 4-t-butylcatechol, and 2,2,6,6-tetramethylpiperidine.
  • quinone derivatives such as benzoquinone and hydroquinone
  • phenol derivatives such as 4-methoxyphenol and 4-t-butylcatechol
  • 2,2,6,6-tetramethylpiperidine 2,2,6,6-tetramethylpiperidine.
  • -1-oxyl and aminoxyl derivatives such as 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl
  • hindered amine derivatives such as tetramethylpiperidyl methacrylate.
  • the content of the stabilizer may be 0.01 to 30 parts by mass, or 0.05 to 10 parts by mass with respect to 100 parts by mass of the total amount of components (a) and (b). good.
  • the content of the stabilizer is 0.01 part by mass or more, the effect of the stabilizer tends to increase.
  • the content of the stabilizer is 30 parts by mass or less, there is a tendency that the decrease in compatibility with other components can be suppressed.
  • the adhesive film according to the present embodiment is a film-like adhesive obtained by molding the adhesive composition containing the components described above into a film.
  • the adhesive film can be obtained, for example, by applying a solution obtained by adding a solvent or the like to the adhesive composition as necessary on a release support such as a fluororesin film, polyethylene terephthalate film, or release paper, or It can be obtained by a method of impregnating a base material such as a non-woven fabric with the above solution, placing the base material on a peelable base material, and removing the solvent and the like.
  • Adhesive films are convenient in terms of handleability and the like.
  • the flow rate of the adhesive film according to this embodiment is 140% or more at a heating temperature of 160°C, a pressure of 2 MPa, and a heating time of 5 seconds.
  • the adhesive film flows when the circuit members are connected to each other and protrudes moderately from between the circuit members, and the protruding portion serves as a lid to protect the circuit connection part. be able to. Therefore, the connection body obtained using the adhesive film according to the present embodiment can prevent salt water components from entering the interface between the circuit member and the connection member, and has excellent salt water resistance.
  • the adhesive film may have a flow rate of 145% or more.
  • the flow rate of the adhesive film can be measured by the method shown in Examples.
  • the coefficient of linear expansion (CTE) of the cured product of the adhesive film according to this embodiment is 130 ppm/K or less on average at 80 to 90°C.
  • the cured product of the adhesive film has a CTE of 130 ppm/K or less, the adhesiveness of the interface between the circuit member and the connection member is increased to the extent that the infiltration of salt water components can be prevented when the connection body is formed.
  • the cured product of the adhesive film may have a CTE of 128 ppm/K or less.
  • the CTE of the cured product of the adhesive film can be measured by the method shown in Examples.
  • FIG. 1 is a schematic cross-sectional view showing one embodiment of a laminated film having an adhesive film.
  • a laminated film 100 shown in FIG. 1 has a support 8 and an adhesive film 40 provided on the support 8 .
  • the adhesive film 40 is the above-described adhesive composition formed into a film, and is composed of an insulating adhesive layer 5 and insulating particles 6 and conductive particles 7 dispersed in the insulating adhesive layer 5. be done.
  • the insulating adhesive layer 5 is composed of components other than the insulating particles and the conductive particles in the adhesive composition described above.
  • This adhesive film is easy to handle, can be easily installed on an adherend, and can be easily connected.
  • the adhesive film may have a multilayer construction consisting of two or more layers.
  • the adhesive film may not contain conductive particles, but when the adhesive film contains conductive particles, the adhesive film can be suitably used as an anisotropically conductive film.
  • the adherends can be adhered to each other by using both heating and pressure.
  • the heating temperature is not particularly limited, it may be 100 to 250°C.
  • the pressure is not particularly limited as long as it does not damage the adherend, but generally it may be 0.1 to 10 MPa. These heating and pressurization may be performed within the range of 0.5 seconds to 120 seconds.
  • the adhesive film according to this embodiment can be used as an adhesive for different types of adherends with different thermal expansion coefficients. Specifically, it is used as an anisotropic conductive adhesive, a circuit connection material represented by silver paste and silver film, or a semiconductor element adhesive material represented by elastomer for CSP, underfill material for CSP, and LOC tape. Film can be used.
  • FIG. 2 is a schematic cross-sectional view showing one embodiment of a connecting body provided with a connecting member made of a cured adhesive film according to this embodiment.
  • the connection body 1 shown in FIG. 2 includes a first circuit member 20 and a second circuit member 30 that are arranged to face each other.
  • a connection member 10 is provided between the first circuit member 20 and the second circuit member 30 to adhere and connect them.
  • the first circuit member 20 includes a first circuit board 21 and first circuit electrodes 22 formed on the main surface 21 a of the circuit board 21 .
  • An insulating layer may be formed on the main surface 21 a of the circuit board 21 .
  • the second circuit member 30 includes a second circuit board 31 and second circuit electrodes 32 formed on the main surface 31 a of the circuit board 31 .
  • An insulating layer may also be formed on the main surface 31 a of the circuit board 31 .
  • the first and second circuit members 20, 30 are not particularly limited as long as they have circuit electrodes that require electrical connection.
  • Examples of the circuit boards 21 and 31 include substrates of inorganic materials such as semiconductors, glass and ceramics, substrates of organic materials such as polyimide and polycarbonate, and substrates containing inorganic and organic materials such as glass/epoxy.
  • the first circuit board 21 may be a glass board
  • the second circuit board 31 may be a flexible board (for example, a resin film such as a polyimide film).
  • circuit members to be connected include glass or plastic substrates, printed wiring boards, ceramic wiring boards, and flexible wiring boards on which electrodes such as ITO (indium tin oxide) films are formed, which are used in liquid crystal displays. , semiconductor silicon chips, and the like. These are used in combination as necessary.
  • ITO indium tin oxide
  • the adhesive film according to the present embodiment in addition to members having surfaces formed of organic materials such as printed wiring boards and polyimide films, metals such as copper and aluminum, ITO, silicon nitride (SiN x ), and members having surfaces formed from inorganic materials such as silicon dioxide ( SiO2 ).
  • connection body obtained by connecting these is the solar cell
  • the solar cell module includes tab wires and a connecting member (cured product of an adhesive film) for bonding them.
  • connection member 10 is made of a cured adhesive film according to this embodiment.
  • the connection member 10 contains an insulating layer 11 and conductive particles 7 dispersed in the insulating layer 11 .
  • the conductive particles 7 are arranged not only between the opposing circuit electrodes 22 and 32, but also between the major surfaces 21a and 31a.
  • the circuit electrodes 22 , 32 are electrically connected via the conductive particles 7 .
  • Conductive particles 7 are in direct contact with both circuit electrodes 22 and 32 . Therefore, the connection resistance between the circuit electrodes 22 and 32 is sufficiently reduced. Therefore, the current flow between the circuit electrodes 22 and 32 can be made smooth, and the functions of the circuit can be fully exhibited.
  • the connection member does not contain conductive particles, the circuit electrodes 22 and the circuit electrodes 32 are electrically connected by direct contact.
  • connection member 10 is formed of the cured adhesive film according to this embodiment, the adhesion strength of the connection member 10 to the circuit member 20 or 30 is sufficiently high. Therefore, even after a reliability test (high-temperature, high-humidity test), it is possible to sufficiently suppress a decrease in adhesive strength and an increase in connection resistance.
  • connection body 1 is formed by, for example, a step of arranging a pair of circuit members having circuit electrodes and facing each other with an adhesive film made of an adhesive composition sandwiched therebetween, and bonding the pair of circuit members and the adhesive film. It can be manufactured by a method comprising a step of bonding a pair of circuit members via the cured adhesive film (main connecting step) by heating and curing while applying pressure to the film in the thickness direction.
  • FIG. 3 is a schematic cross-sectional view showing one embodiment of a method for manufacturing a connected body using the adhesive film according to this embodiment.
  • an adhesive film 40 is placed on the main surface of the first circuit member 20 on the circuit electrode 22 side.
  • the adhesive film 40 is provided on the support described above, the laminate of the adhesive film and the support is placed on the circuit member such that the adhesive film 40 faces the first circuit member 20 . Since the adhesive film 40 is in the form of a film, it is easy to handle. Therefore, the adhesive film 40 can be easily interposed between the first circuit member 20 and the second circuit member 30, and the work of connecting the first circuit member 20 and the second circuit member 30 can be performed. can be easily done.
  • the adhesive film 40 is the above-described adhesive composition (circuit connecting material) formed into a film, and has insulating particles 6 , conductive particles 7 and an insulating adhesive layer 5 . Even if the adhesive film does not contain conductive particles, it can be used as a circuit connecting material for anisotropic conductive adhesion.
  • a circuit-connecting material that does not contain conductive particles is sometimes called an NCF (Non-Conductive Film).
  • NCF Non-Conductive Film
  • ACF isotropic Conductive Film
  • the thickness of the adhesive film 40 may be 10-50 ⁇ m. If the thickness of the adhesive film 40 is 10 ⁇ m or more, the space between the circuit electrodes 22 and 32 tends to be easily filled with the adhesive film. If the thickness of the adhesive film is 50 ⁇ m or less, the adhesive film between the circuit electrodes 22 and 32 can be sufficiently removed, and the electrical connection between the circuit electrodes 22 and 32 can be easily secured.
  • the adhesive film 40 is temporarily connected to the first circuit member 20 by applying pressures A and B in the thickness direction of the adhesive film 40 as shown in FIG. ). At this time, the pressure may be applied while heating. However, the heating temperature is set to a temperature at which the adhesive composition in the adhesive film 40 does not cure, that is, a temperature sufficiently lower than the temperature at which the radical polymerization initiator rapidly generates radicals.
  • the second circuit member 30 is placed on the adhesive film 40 with the second circuit electrode facing the first circuit member 20 side.
  • the second circuit member 30 is placed on the adhesive film 40 after peeling off the support.
  • the adhesive film 40 is heated while applying pressures A and B in its thickness direction.
  • the heating temperature at this time is set to a temperature at which the radical polymerization initiator sufficiently generates radicals.
  • radicals are generated from the radical polymerization initiator, and polymerization of the radically polymerizable compound is initiated.
  • the insulating adhesive is cured to form the insulating layer 11 while the distance between the first circuit electrode 22 and the second circuit electrode 32 is sufficiently reduced.
  • the first circuit member 20 and the second circuit member 30 are firmly connected via the connection member 10 including the insulating layer 11 . With this permanent connection, the connection body shown in FIG. 2 is obtained.
  • This connection may be performed under the conditions of a heating temperature of 100 to 250°C, a pressure of 0.1 to 10 MPa, and a pressurization time of 0.5 to 120 seconds. These conditions are appropriately selected depending on the intended use, adhesive film, and circuit member. Post-curing may be performed after the main connection, if necessary.
  • the pressure of this connection is calculated from the applied load and the crimped area by the formula: load/crimped area.
  • the crimping area is the area of the portion to be pressed among the smallest rectangular regions surrounding the entire overlapping portion of the first circuit electrode and the second circuit electrode when viewed from the thickness direction of the adhesive film. .
  • the adhesive film contains a radical polymerization initiator that generates radicals upon irradiation with light
  • light irradiation may be performed instead of heating when curing the adhesive film for this connection.
  • a paste-like adhesive composition may be used as the circuit connecting material.
  • a coating liquid prepared by dissolving the adhesive composition in a solvent if necessary is applied to the first circuit member 20 or the second circuit member 30, and the adhesive film is formed by a method including the step of drying the coating film. can be formed.
  • the reaction was continued for 15 hours, and when it was confirmed that the NCO content was 0.2% by mass or less with an automatic potentiometric titrator (trade name: AT-510, manufactured by Kyoto Electronics Industry Co., Ltd.).
  • the reaction was terminated to obtain urethane acrylate.
  • the weight average molecular weight of urethane acrylate was 8500 (standard polystyrene conversion value).
  • the analysis by GPC was performed under the same conditions as the analysis of the weight average molecular weight of the polyurethane resin described above.
  • a nickel layer with a thickness of 0.2 ⁇ m was formed on the surface of the polystyrene particles, and a gold layer with a thickness of 0.04 ⁇ m was further formed on the outside of this nickel layer. In this way, conductive particles having an average particle size of 5 ⁇ m were produced.
  • Examples 1 to 5 and Comparative Examples 1 to 3 (Preparation of laminated film having adhesive film)
  • the raw materials shown in Table 2 were mixed at the mass ratio (solid content mass ratio) shown in Table 2 to obtain a coating liquid for forming an adhesive film.
  • This coating liquid was applied to a polyethylene terephthalate (PET) film having a thickness of 50 ⁇ m using a coating device.
  • PET polyethylene terephthalate
  • the coating film was dried with hot air at 70° C. for 10 minutes to form an adhesive film with a thickness of 16 ⁇ m.
  • a laminated film was obtained in which the adhesive film was laminated on the PET film as the support.
  • Phosphate acrylate P-2M (Kyoeisha Chemical Co., Ltd., trade name) ((c) component: radical polymerization initiator) Peroxide: 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate (trade name: Perocta O, manufactured by NOF Corporation, 1 minute half-life temperature: 124.3 ° C.) board.
  • silica fine particles R104 (manufactured by Nippon Aerosil Co., Ltd., trade name, average particle size: 12 nm) was dispersed in a mixed solvent of 45 g of toluene and 45 g of ethyl acetate, and used in the form of a dispersion having a solid content of 10% by mass.
  • Organic fine particles A 10 g of BTA 751 (manufactured by Rohm and Haas, trade name, core-shell type fine particles, average particle diameter: 0.2 to 0.3 ⁇ m) dispersed in 90 g of methyl ethyl ketone, dispersion liquid having a solid content of 10% by mass.
  • Organic fine particles B CE-800T (manufactured by Negami Kogyo Co., Ltd., trade name, polyurethane beads, average particle size: 6 ⁇ m) 10 g were dispersed in 90 g of methyl ethyl ketone, and used in the form of a dispersion having a solid content of 10% by mass.
  • Conductive particles Conductive particles prepared as described above were used.
  • Silane coupling agent KBM-503 (manufactured by Shin-Etsu Chemical Co., Ltd., trade name)
  • a flexible circuit board (FPC) having 220 copper circuits with a line width of 75 ⁇ m, a pitch of 150 ⁇ m, and a thickness of 18 ⁇ m was connected to a glass substrate using the above adhesive film as a circuit connecting material.
  • the connection was performed by heating and pressurizing at 160° C. and 2 MPa for 5 seconds using a thermocompression bonding device (heating method: constant heat type, manufactured by Nikka Setsubi Engineering Co., Ltd.).
  • a thermocompression bonding device heating method: constant heat type, manufactured by Nikka Setsubi Engineering Co., Ltd.
  • the connector prepared as described above was immersed in an aqueous solution of NaCl adjusted to a concentration of 5% by mass under conditions of 25° C. for 12 hours and then dried. This was confirmed using ECLIPSE L200 (manufactured by Nikon Corporation).
  • ECLIPSE L200 manufactured by Nikon Corporation.
  • A is for no peeling, and a small amount of peeling is occurring (the ratio of the peeled part is the total area (less than 20% of the total area) was rated B, and C was rated when peeling occurred (the percentage of the peeled portion was 20% or more of the total area).
  • Table 2 shows the results.
  • the flow rate is 140% or more at a heating temperature of 160° C., a pressure of 2 MPa, and a heating time of 5 seconds, and the CTE is 80 to 80%. It was confirmed that an average of 130 ppm/K or less at 90° C. exhibits excellent salt water resistance. On the other hand, it was confirmed that when the flow rate is less than 140% or the CTE is greater than 130 ppm/K, excellent saltwater resistance cannot be obtained.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention concerne un film de liaison pour connexion de circuit, le film de liaison étant utilisé dans le but de connecter un premier élément de circuit, qui est obtenu en formant une première électrode de circuit sur une surface principale d'un premier substrat, et un second élément de circuit, qui est obtenu en formant une seconde électrode de circuit sur une surface principale d'un second substrat, l'un avec l'autre de façon que la première électrode de circuit et la seconde électrode de circuit soient tournées l'une vers l'autre. Le film de liaison pour connexion de circuit selon l'invention contient (a) une résine thermoplastique, (b) un composé polymérisable par voie radicalaire, (c) un amorceur de polymérisation radicalaire et (d) des particules isolantes ; le composé polymérisable par voie radicalaire (b) contient : un composé (méth)acrylate ; le débit dudit film de liaison est supérieur ou égal à 140 % tel que déterminé à une température de chauffage de 160 °C sous une pression de 2 MPa avec un temps de chauffage de 5 secondes ; et le coefficient de dilatation linéaire d'un produit durci dudit film de liaison est inférieur ou égal à 130 ppm/K en moyenne pour la plage de températures de 80 °C à 90 °C.
PCT/JP2022/007383 2021-03-01 2022-02-22 Film de liaison pour connexion de circuit et corps connecté WO2022186016A1 (fr)

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CN202280016266.8A CN116917429A (zh) 2021-03-01 2022-02-22 电路连接用黏合膜及连接体
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KR1020237031590A KR20230154877A (ko) 2021-03-01 2022-02-22 회로 접속용 접착 필름 및 접속체

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Citations (5)

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Publication number Priority date Publication date Assignee Title
WO2013161713A1 (fr) * 2012-04-25 2013-10-31 日立化成株式会社 Matériau de connexion de circuit, structure de connexion de circuit, film adhésif et corps enroulé
JP2013227420A (ja) * 2012-04-25 2013-11-07 Hitachi Chemical Co Ltd 回路接続材料、回路接続構造体、接着フィルム及び巻重体。
JP2015166406A (ja) * 2014-03-03 2015-09-24 日立化成株式会社 接着剤組成物及び接続体
JP2016098329A (ja) * 2014-11-21 2016-05-30 デクセリアルズ株式会社 塗料組成物、及び超撥水フィルム
WO2018181589A1 (fr) * 2017-03-29 2018-10-04 日立化成株式会社 Composition adhésive et structure

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Publication number Priority date Publication date Assignee Title
JP2003151762A (ja) 2001-11-09 2003-05-23 Hitachi Ltd 表示装置
JP2012203628A (ja) 2011-03-25 2012-10-22 Hosiden Corp タッチパネル及びこれを備えた電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161713A1 (fr) * 2012-04-25 2013-10-31 日立化成株式会社 Matériau de connexion de circuit, structure de connexion de circuit, film adhésif et corps enroulé
JP2013227420A (ja) * 2012-04-25 2013-11-07 Hitachi Chemical Co Ltd 回路接続材料、回路接続構造体、接着フィルム及び巻重体。
JP2015166406A (ja) * 2014-03-03 2015-09-24 日立化成株式会社 接着剤組成物及び接続体
JP2016098329A (ja) * 2014-11-21 2016-05-30 デクセリアルズ株式会社 塗料組成物、及び超撥水フィルム
WO2018181589A1 (fr) * 2017-03-29 2018-10-04 日立化成株式会社 Composition adhésive et structure

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