WO2013161713A1 - Matériau de connexion de circuit, structure de connexion de circuit, film adhésif et corps enroulé - Google Patents

Matériau de connexion de circuit, structure de connexion de circuit, film adhésif et corps enroulé Download PDF

Info

Publication number
WO2013161713A1
WO2013161713A1 PCT/JP2013/061658 JP2013061658W WO2013161713A1 WO 2013161713 A1 WO2013161713 A1 WO 2013161713A1 JP 2013061658 W JP2013061658 W JP 2013061658W WO 2013161713 A1 WO2013161713 A1 WO 2013161713A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
circuit
film
circuit connection
mass
Prior art date
Application number
PCT/JP2013/061658
Other languages
English (en)
Japanese (ja)
Inventor
直 工藤
松田　和也
藤縄　貢
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to CN201380014782.8A priority Critical patent/CN104169389B/zh
Priority to KR1020147024907A priority patent/KR20150005516A/ko
Priority to KR1020207011815A priority patent/KR102329065B1/ko
Priority to JP2014512528A priority patent/JP6090311B2/ja
Publication of WO2013161713A1 publication Critical patent/WO2013161713A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H01L2224/2743—Manufacturing methods by blanket deposition of the material of the layer connector in solid form
    • H01L2224/27436—Lamination of a preform, e.g. foil, sheet or layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29339—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29444—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29455—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
    • H01L2224/81901—Pressing the bump connector against the bonding areas by means of another connector
    • H01L2224/81903—Pressing the bump connector against the bonding areas by means of another connector by means of a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9211—Parallel connecting processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/913—Material designed to be responsive to temperature, light, moisture

Definitions

  • the present invention relates to a circuit connection material for electrically connecting two circuit members facing each other, and a circuit connection structure, an adhesive film and a wound body using the same.
  • circuit connection materials In a semiconductor element and a liquid crystal display element, various circuit connection materials have been conventionally used for the purpose of bonding various members in the element.
  • the characteristics required for circuit connection materials are diverse, including adhesiveness, heat resistance, reliability in high temperature and high humidity conditions, and the like.
  • Examples of adherends to be bonded with circuit connection materials include, for example, printed wiring boards, organic substrates such as polyimide, polyethylene terephthalate and polycarbonate, metal substrates such as copper and aluminum, and ITO, IZO, SiN. And inorganic base materials such as SiO 2, and base materials having various surface states are used. For this reason, the circuit connection material needs to have a molecular design tailored to each adherend (for example, Patent Documents 1 and 2).
  • thermosetting resin composition using an epoxy resin exhibiting high adhesion and high reliability has been used (for example, see Patent Document 1).
  • a thermosetting resin composition there are a curing agent such as an epoxy resin, a phenol resin having reactivity with the epoxy resin, and a thermal latent catalyst that promotes the reaction between the epoxy resin and the curing agent. Commonly used.
  • the above circuit connecting material was cured at a temperature of 170 to 250 ° C. for 1 to 3 hours to obtain a desired adhesion.
  • the pitch between elements and wirings is narrowed, and there is a risk that the peripheral members will be adversely affected by heating during curing.
  • a radical curable adhesive using an acrylate derivative and / or a methacrylate derivative (hereinafter referred to as a (meth) acrylate derivative) and a peroxide as a radical polymerization initiator has attracted attention.
  • the radical curable adhesive can be cured for a short time because radicals that are reactive species are rich in reactivity (see, for example, Patent Document 2).
  • the present invention has been made in view of the above-mentioned problems of the prior art, and is a radical polymerization type, and even when the circuit member is left in a high-temperature and high-humidity environment after being connected, peeling bubbles at the interface with the circuit member are present.
  • Circuit connection material capable of sufficiently suppressing the occurrence of the above and maintaining sufficient connection reliability, a circuit connection structure manufactured using the circuit connection material, and an adhesive film comprising a connection material layer made of the circuit connection material And a wound body of the adhesive film.
  • the present invention is a circuit connecting material for electrically connecting two circuit members facing each other, comprising a thermoplastic resin, a radical polymerizable compound, a radical polymerization initiator and inorganic fine particles, and the radical polymerizable
  • the content of the compound is 40% by mass or more based on the total amount of the circuit connecting material, and the content of a compound having a molecular weight of 1000 or less among the radical polymerizable compounds is 15% by mass or less based on the total amount of the circuit connecting material.
  • a circuit connection material is provided wherein the content of the inorganic fine particles is 5 to 30% by mass based on the total amount of the circuit connection material and contains at least a compound represented by the following formula (1).
  • R 1 , R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxycarbonyl group having 1 to 5 carbon atoms, or an aryl group.
  • At least one of R 1 , R 2 and R 3 is an alkoxy group having 1 to 5 carbon atoms
  • R 4 is a (meth) acryloyl group, a vinyl group, an isocyanate group, an imidazole group, a mercapto group, An amino group, a methylamino group, a dimethylamino group, a benzylamino group, a phenylamino group, a cyclohexylamino group, a morpholino group, a piperazino group, a ureido group, or a glycidyl group, and n represents an integer of 1 to 10. ]
  • circuit connecting material of the present invention is a radical curing type
  • circuit members can be bonded together at a low temperature and in a short time.
  • generation of peeling bubbles at the interface with the circuit member is sufficiently suppressed, and sufficient connection reliability is achieved. Is maintained.
  • the thermoplastic resin may contain at least one resin having a glass transition temperature of 25 ° C. or higher.
  • the average particle size of the inorganic fine particles may be less than 1 ⁇ m.
  • conductive particles may be dispersed. By dispersing the conductive particles, it is possible to impart conductivity or anisotropic conductivity to the circuit connection material.
  • Such a circuit connection material can be used for connecting circuit members having circuit electrodes to each other. It can be used suitably. Moreover, the connection resistance between the connected circuit electrodes can be sufficiently reduced by connecting with such a circuit connection material.
  • the present invention may be an anisotropic conductive adhesive containing the circuit connection material and conductive particles dispersed in the circuit connection material.
  • total amount of circuit connecting material does not include conductive particles.
  • the shape of the circuit connecting material of the present invention can be a film. Such a circuit connection material is excellent in handleability.
  • At least one of the two circuit members may be a glass substrate. Further, at least one of the two circuit members may be a flexible substrate.
  • the circuit connecting material of the present invention can be suitably used for connecting such circuit members.
  • the present invention also includes a pair of circuit members arranged opposite to each other and a cured product of the circuit connection material, and the circuit electrodes interposed between the pair of circuit members are electrically connected to each other.
  • a circuit connection structure including a connection member for connecting the circuit members to each other is provided.
  • circuit connection structure of the present invention since the circuit members are bonded to each other by the connection member containing the cured product of the circuit connection material, the interface between the circuit member and the connection member even when left under high temperature and high humidity conditions The generation of exfoliated bubbles in is sufficiently suppressed, and sufficient connection reliability is maintained.
  • the present invention also provides an adhesive film comprising a film base material and a film adhesive containing the circuit connecting material provided on one surface of the film base material. Since such an adhesive film is provided with the film adhesive containing the said circuit connection material, it can be utilized suitably for the connection of circuit members. In addition, the adhesive film of the present invention can be stored in a reel shape.
  • the film adhesive When a conventional circuit connection material is applied on one side of a film base material and wound in a reel, the film adhesive may be transferred onto the other side of the film base material and cannot be used effectively. is there.
  • the adhesive film of the present invention since the film adhesive contains the circuit connection material, even when the film adhesive is rolled up in a reel shape, the transfer of the film adhesive on the other surface of the film substrate is performed. Sufficiently suppressed.
  • the present invention further provides a wound body obtained by winding the adhesive film in a reel shape.
  • the wound body of this invention can be utilized suitably for the connection of circuit members. Moreover, in the wound body of this invention, transfer of the film adhesive on the other surface of a film base material is fully suppressed.
  • the present invention is an application of a composition containing a thermoplastic resin, a radical polymerizable compound, a radical polymerization initiator and inorganic fine particles as a circuit connection material for electrically connecting two opposing circuit members. It can also be said.
  • the content of the radical polymerizable compound is 40% by mass or more based on the total amount of the composition, and the content of a compound having a molecular weight of 1000 or less among the radical polymerizable compounds is based on the total amount of the composition.
  • the content of the inorganic fine particles is 5 to 30% by mass based on the total amount of the composition, and the composition contains at least the compound represented by the formula (1). .
  • the present invention also provides a method for producing a circuit connection material for electrically connecting two opposing circuit members of a composition containing a thermoplastic resin, a radical polymerizable compound, a radical polymerization initiator and inorganic fine particles. It can also be said to be an application for.
  • the content of the radical polymerizable compound is 40% by mass or more based on the total amount of the composition, and the content of a compound having a molecular weight of 1000 or less among the radical polymerizable compounds is based on the total amount of the composition.
  • the content of the inorganic fine particles is 5 to 30% by mass based on the total amount of the composition, and the composition contains at least the compound represented by the formula (1). .
  • circuit connection material capable of maintaining the properties can be obtained.
  • Circuit connection material that can maintain the above, a circuit connection structure manufactured using the circuit connection material, an adhesive film including a connection material layer made of the circuit connection material, and a wound body of the adhesive film are provided.
  • (meth) acrylic acid means acrylic acid or methacrylic acid corresponding thereto
  • (meth) acrylate means acrylate or methacrylate corresponding thereto
  • (meth) acryloyl group means acryloyl group. Or means a methacryloyl group.
  • the circuit connecting material of the present embodiment can be suitably used for electrically connecting two circuit members facing each other, and is a thermoplastic resin (hereinafter sometimes referred to as “component (a)”).
  • component (a) A radical polymerizable compound (hereinafter sometimes referred to as “component (b)”), a radical polymerization initiator (hereinafter sometimes referred to as “component (c)”), and inorganic fine particles (hereinafter referred to as case). (Referred to as “component (d)”).
  • the content of the component (b) is 40% by mass or more based on the total amount of the circuit connection material, and the content of the compound having a molecular weight of 1000 or less among the components (b) is based on the total amount of the circuit connection material.
  • the content of the component (d) is 5 to 30% by mass.
  • circuit connection material of the present embodiment contains a compound represented by the following formula (1) (hereinafter sometimes referred to as “silane coupling agent”).
  • R 1 , R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxycarbonyl group having 1 to 5 carbon atoms, Represents an aryl group, and at least one of R 1 , R 2 and R 3 is an alkoxy group having 1 to 5 carbon atoms, and R 4 represents a (meth) acryloyl group, a vinyl group, an isocyanate group, an imidazole group, a mercapto group Represents a group, amino group, methylamino group, dimethylamino group, benzylamino group, phenylamino group, cyclohexylamino group, morpholino group, piperazino group, ureido group or glycidyl group, and n represents an integer of 1 to 10.
  • the silane coupling agent may be blended in the circuit connecting material as a part of the radically polymerizable compound of the component (b), and may be blended in the circuit connecting material as a component other than the components (a) to (d). Also good.
  • R 4 in the formula (1) is a (meth) acryloyl group or a vinyl group
  • the silane coupling agent is included in the component (b).
  • the circuit connecting member of the present embodiment is a radical curing type, the circuit members can be bonded together at a low temperature and in a short time. Further, according to the circuit connection material of the present embodiment, even when the circuit member is left in a high-temperature and high-humidity environment after connection, the generation of peeling bubbles at the interface with the circuit member is sufficiently suppressed, and sufficient connection reliability is achieved. Sex is maintained.
  • thermoplastic resin As the component (a), a known thermoplastic resin can be used without particular limitation, and a plurality of known thermoplastic resins can also be mixed and used.
  • a component contains at least 1 sort (s) of resin whose glass transition temperature is 25 degreeC or more from a viewpoint which film forming property improves further.
  • resins include polyimide resins, polyamide resins, phenoxy resins, poly (meth) acrylate resins, polyester resins, polyurethane resins, and polyvinyl butyral resins.
  • (a) component may contain resin whose glass transition temperature is less than 25 degreeC.
  • the glass transition temperature of a thermoplastic resin can generally be calculated
  • thermoplastic resin of component (a) a siloxane bond or a fluorine substituent (for example, a fluorine atom, a fluorinated alkyl group or a fluorinated aryl group) may be contained.
  • a fluorine substituent for example, a fluorine atom, a fluorinated alkyl group or a fluorinated aryl group
  • thermoplastic resins to be mixed are completely compatible with each other, or microphase separation occurs to become a cloudy state.
  • the circuit connecting material preferably contains at least one resin having a glass transition temperature of 25 ° C. or higher as the component (a), and the weight average molecular weight of the resin is 5.0 ⁇ 10 3 to 2.0 ⁇ 10 5. Preferably, it is 1.0 ⁇ 10 4 to 1.5 ⁇ 10 5 .
  • a resin having a glass transition temperature of 25 ° C. or higher has a tendency that the adhesiveness of the circuit connecting material is inferior and film formability is sufficiently obtained when the weight average molecular weight is less than 5.0 ⁇ 10 3.
  • the weight average molecular weight exceeds 2.0 ⁇ 10 5 , the compatibility with other components of the circuit connecting material may be inferior, and the fluidity of the circuit connecting material may be reduced.
  • the resin having the weight average molecular weight within the above range it is possible to sufficiently suppress the decrease in the adhesive strength and the fluidity of the circuit connecting material, and the connection reliability can be further improved.
  • a weight average molecular weight shows the weight average molecular weight of polystyrene conversion measured by GPC method.
  • the circuit connection material may contain a known rubber component as the component (a).
  • a rubber component By adding a rubber component, stress relaxation and improvement in adhesion can be expected.
  • the rubber component include acrylic rubber, polyisoprene, polybutadiene, carboxyl group-terminated polybutadiene, hydroxyl group-terminated polybutadiene, 1,2-polybutadiene, carboxyl group-terminated 1,2-polybutadiene, hydroxyl group-terminated 1,2-polybutadiene, and styrene.
  • Butadiene rubber hydroxyl-terminated styrene-butadiene rubber, carboxyl group, hydroxyl group, carboxylated nitrile rubber, hydroxyl-terminated poly (oxypropylene), alkoxysilyl group-terminated poly (oxypropylene), poly (oxytetramethylene) glycol, polyolefin glycol and poly - ⁇ -caprolactone and the like.
  • the weight average molecular weight of the rubber component is preferably 2.0 ⁇ 10 5 to 1.0 ⁇ 10 6 . If the weight average molecular weight of the rubber component is less than 2.0 ⁇ 10 5 , a sufficient stress relaxation effect may not be obtained, and if it exceeds 1.0 ⁇ 10 6 , the fluidity of the circuit connecting material may decrease. is there. That is, according to the rubber component having the weight average molecular weight within the above range, a more excellent stress relaxation effect can be obtained while sufficiently suppressing the decrease in fluidity of the circuit connecting material.
  • a rubber component having a cyano group or a carboxyl group, which is a highly polar group, in the side chain or terminal is preferable from the viewpoint of improving adhesiveness.
  • a rubber component can be used individually by 1 type or in mixture of 2 or more types.
  • the content of the thermoplastic resin having a glass transition temperature of 25 ° C. or higher is preferably 10 to 50% by mass, more preferably 20 to 40% by mass, based on the total amount of the circuit connecting material. preferable.
  • the film-forming property may be inferior. Fluidity may decrease.
  • component (b) a known radical polymerizable compound can be used.
  • component (b) component can be used individually by 1 type or in mixture of 2 or more types.
  • the content of the component (b) is 40% by mass or more, preferably 40 to 70% by mass, and more preferably 45 to 65% by mass based on the total amount of the circuit connecting material.
  • component (b) a compound having a molecular weight exceeding 1000 (hereinafter sometimes referred to as “component (b-1)”) is mainly used, and a compound having a molecular weight of 1000 or less (hereinafter referred to as “component (b))”.
  • component (b) a compound having a molecular weight of 1000 or less
  • the content of “(b-2) component” in some cases is 15% by mass or less based on the total amount of the circuit connecting material.
  • the content of the component (b-2) is preferably 15% by mass or less, and more preferably 12.5% by mass or less.
  • the content of the component (b-2) may be 2.5% by mass or more, and may be 5% by mass or more.
  • the content of the component (b-1) is 25% by mass or more, preferably 30% by mass or more, more preferably 35% by mass or more, based on the total amount of the circuit connecting material. Further, the content of the component (b-1) may be 55% by mass or less and may be 50% by mass or less.
  • the molecular weight of the component (b-1) is preferably 20000 or less, more preferably 15000 or less.
  • the weight average molecular weight of the component (b-1) can be regarded as the molecular weight of (b-1).
  • the ratio (mass ratio) C 2 / C 1 of the content C 2 of the component (b-2) to the content C 1 of the component (b-1) is preferably 0 to 0.6. More preferably, it is 0.05 to 0.4, and further preferably 0.075 to 0.35.
  • Examples of the component (b-1) include oligomers such as epoxy (meth) acrylate oligomers, urethane (meth) acrylate oligomers, polyether (meth) acrylate oligomers, and polyester (meth) acrylate oligomers; trimethylolpropane tri (meth) Acrylate, polyethylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol Hexa (meth) acrylate, isocyanuric acid modified bifunctional (meth) acrylate, isocyanuric acid modified trifunctional (meth) acrylate, bisphenol fluorenediglycol Epoxy (meth) acrylate obtained by adding (meth) acrylic acid to glycidy
  • the component (b-2) includes pentaerythritol (meth) acrylate, 2-cyanoethyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dicyclopentenyloxyethyl (meth) acrylate.
  • the circuit connecting material preferably contains at least one compound having two or more (meth) acryloyl groups in the molecule as the component (b), and two or more in the molecule as the component (b-1). It is more preferable to contain at least one compound having a (meth) acryloyl group.
  • a compound having a (meth) acryloyl group is preferable, but as the component (b), a compound having a functional group that is polymerized by an active radical such as an allyl group, a maleimide group, and a vinyl group can also be used.
  • component (b) examples include N-vinylimidazole, N-vinylpyridine, N-vinylpyrrolidone, N-vinylformamide, N-vinylcaprolactam, 4,4′-vinylidenebis (N, N— Dimethylaniline), N-vinylacetamide, N, N-dimethylacrylamide, N-isopropylacrylamide, N, N-diethylacrylamide, methylolacrylamide, 4,4'-diphenylmethane bismaleimide, 3,3'-dimethyl-5,5 Examples include '-4,4'-diphenylmethane bismaleimide and 1,6-bismaleimide- (2,2,4-trimethyl) hexane.
  • the circuit connecting material may contain a radical polymerizable compound having a phosphate ester structure as the component (b).
  • examples of the radical polymerizable compound having a phosphate ester structure include radical polymerizable compounds having a phosphate ester structure represented by the following formulas (2) to (4).
  • R 5 represents a (meth) acryloyloxy group
  • R 6 represents a hydrogen atom or a methyl group
  • w and x each independently represents an integer of 1 to 8.
  • R 5 s , R 6 s , w s, and x s may be the same or different.
  • R 7 represents a (meth) acryloyloxy group
  • y and z each independently represents an integer of 1 to 8.
  • R 7 s , y s, and z s may be the same or different.
  • R 8 represents a (meth) acryloyloxy group
  • R 9 represents a hydrogen atom or a methyl group
  • a and b each independently represents an integer of 1 to 8.
  • radical polymerizable compound having a phosphate ester structure examples include acid phosphooxyethyl methacrylate, acid phosphooxyethyl acrylate, acid phosphooxypropyl methacrylate, acid phosphooxypolyoxyethylene glycol monomethacrylate, and acid phosphooxypolyoxypropylene.
  • examples include glycol monomethacrylate, 2,2′-di (meth) acryloyloxydiethyl phosphate, EO-modified phosphate dimethacrylate, phosphate-modified epoxy acrylate, and vinyl phosphate.
  • the content of the radically polymerizable compound having a phosphate ester structure is preferably 0.01 to 10% by mass, more preferably 0.5 to 5% by mass based on the total amount of the circuit connecting material.
  • a radical polymerizable compound having a phosphate ester structure a compound obtained by reacting phosphoric anhydride and 2-hydroxyethyl (meth) acrylate can be used.
  • examples of such radically polymerizable compounds having a phosphate ester structure include mono (2-methacryloyloxyethyl) acid phosphate, di (2-methacryloyloxyethyl) acid phosphate, and the like.
  • the compound which has a phosphate ester structure may be used individually by 1 type, or may mix and use 2 or more types.
  • the radical polymerizable compound having a phosphoric ester structure may be the component (b-1) or the component (b-2), and is preferably the component (b-2).
  • the circuit connecting material may also contain, as component (b), a radically polymerizable material among the silane coupling agents represented by the formula (1).
  • radical polymerization initiator of component (c) examples include compounds that decompose by heating to generate free radicals, and known compounds such as peroxides and azo compounds can be used.
  • a peroxide having a one-minute half-life temperature of 90 to 175 ° C. and a molecular weight of 180 to 1000 is preferably used from the viewpoint of having stability, reactivity, and compatibility. it can.
  • one-minute half-life temperature refers to the temperature at which the half-life is 1 minute
  • half-life refers to the time until the concentration of the compound decreases to half of the initial value.
  • component (c) examples include 1,1,3,3-tetramethylbutylperoxyneodecanoate, di (4-t-butylcyclohexyl) peroxydicarbonate, di (2-ethylhexyl) peroxy Dicarbonate, cumylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethylperoxyneodecanoate, t -Hexylperoxyneodecanoate, t-butylperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2, 5-Dimethyl-2,5-di (2-ethylhexanoylperoxy) hexane, t-hexylperoxy -2
  • a compound that generates radicals by light irradiation for example, light irradiation with a wavelength of 150 nm to 750 nm
  • light irradiation with a wavelength of 150 nm to 750 nm can also be used.
  • Such compounds include, for example, Photoinitiation, Photopolymerization, and Photocuring, J. Biol. -P. ⁇ -acetaminophenone derivatives and phosphine oxide derivatives described in Fouassier, Hanser Publishers (1995), p17 to p35 are more preferable because of their high sensitivity to light irradiation. These compounds may be used alone or in combination with the above peroxide or azo compound.
  • the amount of chlorine ion and organic acid contained in the component (c) is preferably 10000 mass ppm or less, more preferably 5000 mass ppm or less.
  • the quantity of the chlorine ion and organic acid which are contained in (c) component may be 500 mass ppm or more.
  • the component (c) preferably has a mass retention of 20% by mass or more after being left open for 24 hours at room temperature (25 ° C.) and normal pressure. According to the component (c) having such a mass retention rate, the storage stability of the circuit connecting material is further improved.
  • the mass retention rate can be measured by measuring the weight before and after standing.
  • the content of the component (c) is preferably 0.1 to 30% by mass and more preferably 1 to 20% by mass based on the total amount of the circuit connecting material.
  • the reaction rate for obtaining a sufficient adhesive force and a long pot life can be achieved at a higher level.
  • component (d) known inorganic fine particles can be used without particular limitation.
  • the component (d) include metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles.
  • (d) component can be used individually by 1 type or in mixture of 2 or more types.
  • the average particle size of the component (d) is preferably less than 1 ⁇ m, more preferably 0.1 to 0.5 ⁇ m.
  • the average particle diameter is the mode diameter in the major axis direction when present in the circuit connecting material.
  • the average primary particle diameter of the component (d) is preferably 100 nm or less, more preferably 10 to 30 nm.
  • an average particle diameter shows the value measured by image analysis.
  • the component (d) fine particles whose surface is modified with an organic group can be suitably used because of excellent dispersibility.
  • the organic group include a dimethylsiloxane group and a diphenylsiloxane group.
  • the content of the component (d) is preferably 5 to 30% by mass and more preferably 10 to 20% by mass based on the total amount of the circuit connecting material.
  • the content of the component (d) is in the above range, the connection resistance between the circuit electrodes to be connected can be further reduced, and the effect of the present invention is more remarkably exhibited.
  • the silane coupling agent represented by the formula (1) may be blended in the circuit connection material as a part of the component (b) as described above, and the circuit connection as a component other than the components (a) to (d). You may mix
  • R 1 , R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxycarbonyl group having 1 to 5 carbon atoms, Represents an aryl group, and at least one of R 1 , R 2 and R 3 is an alkoxy group having 1 to 5 carbon atoms, and R 4 represents a (meth) acryloyl group, a vinyl group, an isocyanate group, an imidazole group, a mercapto group Represents a group, amino group, methylamino group, dimethylamino group, benzylamino group, phenylamino group, cyclohexylamino group, morpholino group, piperazino group, ureido group or glycidyl group, and n represents an integer of 1 to 10.
  • R 4 in the formula (1) is a (meth) acryloyl group or a vinyl group
  • the silane coupling agent is included in the component (b).
  • R 1 , R 2 and R 3 are preferably a methyl group, an ethyl group, a methoxy group or an ethoxy group, and more preferably a methoxy group or an ethoxy group.
  • R 4 is preferably a (meth) acryloyl group, a glycidyl group, a mercapto group or a vinyl group, and more preferably a (meth) acryloyl group or a glycidyl group.
  • the content of the silane coupling agent is preferably 0.1 to 10% by mass and more preferably 0.25 to 5% by mass based on the total amount of the circuit connecting material.
  • the content of the silane coupling agent is within the above range, generation of exfoliated bubbles at the interface between the circuit member and the connecting member can be more significantly suppressed, and a longer pot life can be secured. .
  • the circuit connection material of this embodiment may contain components other than those described above.
  • a stabilizer may be added to the circuit connection material for reasons such as controlling the curing rate and imparting storage stability.
  • Stabilizers include quinone derivatives such as benzoquinone and hydroquinone; phenol derivatives such as 4-methoxyphenol and 4-t-butylcatechol; 2,2,6,6-tetramethylpiperidine-1-oxyl, 4-hydroxy- An aminoxyl derivative such as 2,2,6,6-tetramethylpiperidine-1-oxyl; a hindered amine derivative such as tetramethylpiperidyl methacrylate; and the like can be preferably used.
  • the content of the stabilizer is preferably 0.01 to 15% by mass, and 0.05 to 10% by mass based on the total amount of the circuit connecting material. It is more preferable.
  • the content of the stabilizer is less than 0.01% by mass, the effect of addition may not be sufficiently obtained.
  • the content exceeds 15% by mass, the polymerization reaction may be inhibited, and the low temperature rapid curability may be inferior.
  • organic fine particles may be added to the circuit connection material of the present embodiment for the purpose of stress relaxation and heat resistance improvement.
  • known organic fine particles can be used without particular limitation.
  • organic fine particles examples include silicone fine particles, methacrylate-butadiene-styrene fine particles, acrylic-silicone fine particles, polyamide fine particles, and polyimide fine particles. These organic fine particles may have a uniform structure or a core-shell structure.
  • the content of the organic fine particles is preferably 1.5 to 20% by mass, more preferably 2 to 15% by mass based on the total amount of the circuit connecting material. .
  • circuit connection material of the present embodiment conductive particles may be dispersed.
  • electroconductivity or anisotropic conductivity can be provided to a circuit connection material, and such a circuit connection material can be used suitably for the connection use etc. of the circuit members which have a circuit electrode.
  • connection resistance between the connected circuit electrodes can be sufficiently reduced by connecting with such a circuit connection material.
  • the present invention may be an anisotropic conductive adhesive containing a circuit connecting material and conductive particles dispersed in the circuit connecting material.
  • total amount of circuit connecting material does not include conductive particles.
  • the conductive particles include metal particles made of metal such as Au, Ag, Pd, Ni, Cu, and solder, and carbon particles.
  • the conductive particles may be particles made of a non-conductive material such as glass, ceramic, plastic, etc. as a core, and the core is coated with a conductive material such as the metal, metal particles, or carbon. Good.
  • the conductive particles hot-melt metal particles are preferable. Since such conductive particles have deformability due to heat and pressure, when connecting circuit members, the contact area between the conductive particles and the electrodes increases, and the connection reliability between the circuit members is improved. There is a tendency.
  • the blending amount of the conductive particles is preferably 0.1 to 30% by volume, more preferably 0.1 to 10% by volume with respect to the total volume of the anisotropic conductive adhesive. If the blending amount of the conductive particles is less than 0.1% by volume, the conductivity tends to be inferior, and if it exceeds 30% by volume, a short circuit between the circuit electrodes tends to occur.
  • the compounding quantity of electroconductive particle is determined based on the volume in 23 degreeC of each component of the circuit connection material before hardening. The volume of each component can be determined by converting mass to volume using specific gravity. Also, put an appropriate solvent (water, alcohol, etc.) that can wet the component well without dissolving or swelling the component whose volume is to be measured. It is also possible to obtain the volume increased by charging as the volume of the component.
  • the circuit connecting material of the present embodiment can be manufactured by mixing the above-described components without using a solvent. Moreover, it can also manufacture by mixing each above-mentioned component with the solvent which can melt
  • the circuit connection material of this embodiment can be used in the form of a film. By using the shape of the film, the handleability of the circuit connecting material becomes extremely good.
  • a film-like circuit connection material (hereinafter sometimes referred to as “film-like adhesive”) can be obtained.
  • a solution prepared by adding a solvent or the like to a circuit connecting material as necessary is impregnated into a base material such as a nonwoven fabric and placed on a peelable base material, and the solvent is removed.
  • An agent can be obtained.
  • electroconductive particle can be disperse
  • methyl ethyl ketone and toluene can be suitably used.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a circuit connection material of the present invention.
  • a film adhesive 1 shown in FIG. 1 is formed by forming the circuit connecting material into a film.
  • the film adhesive 1 is easy to handle and can be easily installed on the adherend. Therefore, according to the film adhesive 1, connection work can be performed easily.
  • the film adhesive 1 may have a multilayer structure (not shown) composed of two or more layers. Further, conductive particles (not shown) may be dispersed in the film adhesive 1.
  • the film adhesive in which the conductive particles are dispersed can be suitably used as an anisotropic conductive film adhesive. That is, the present invention may be an anisotropic conductive film adhesive containing the circuit connecting material and conductive particles.
  • connection method of the adherend using the circuit connection material (for example, the film adhesive 1) of the present embodiment include a connection method using heating and pressurization together.
  • the heating temperature is preferably 100 to 250 ° C.
  • the pressure is not particularly limited as long as it does not damage the adherend, but it is generally preferably 0.1 to 10 MPa. These heating and pressurization are preferably performed in the range of 0.5 to 120 seconds.
  • adherends can be sufficiently bonded to each other by heating and pressurizing for 10 seconds under the conditions of a heating temperature of 150 to 200 ° C. and a pressure of 3 MPa.
  • the circuit connection material of the present embodiment can be suitably used as an adhesive for different types of adherends having different thermal expansion coefficients.
  • the circuit connection material of the present embodiment may be formed in a film shape on one surface of the film substrate.
  • the present invention may be an adhesive film provided with a film base material and a film adhesive provided on one surface of the film base material and including the circuit connection material.
  • Such an adhesive film can be suitably used as the above-mentioned film adhesive by peeling the film substrate.
  • the film adhesive since the film adhesive includes the circuit connecting material having the above-described specific configuration, even when the film base is wound in a reel shape so that the other surface of the film base is in contact with the film adhesive, Transfer of the film adhesive onto the other surface of the material is sufficiently suppressed.
  • the circuit connection material When a similar wound body is produced with a conventional circuit connection material, the circuit connection material may ooze out from between the film base materials.
  • the circuit adhesive has the above-mentioned specific configuration. Since the material is included, even when the film is wound in a reel shape, the bleeding of the film adhesive from between the film base materials is sufficiently suppressed. Therefore, the adhesive film can be suitably stored as a roll wound in a reel shape, and is further excellent in handleability.
  • Examples of the film substrate include polyethylene terephthalate, polycarbonate, and polypropylene.
  • the adhesive film can be, for example, a width of 5 mm or less (preferably 0.5 to 5.0 mm) and a length of 1 m or more (preferably 10 to 500 m). Since the adhesive film having such a size is desirably stored in a reel shape, the above-described effect is particularly effective.
  • the adhesive film may further include a protective film provided on the film adhesive. Since the protective film needs to be peeled off before the adherend is connected, it is desirable that the protective film has excellent peelability.
  • circuit members having circuit electrodes formed on the main surface of a circuit board are connected to each other using the circuit connection material of the present embodiment.
  • the circuit connection material to form an anisotropic conductive adhesive
  • connection between members can be performed.
  • An anisotropic conductive adhesive is placed between the circuit electrodes facing each other on the circuit board and heated and pressed to perform electrical connection between the circuit electrodes facing each other and adhesion between the circuit boards. Can be connected.
  • the circuit board examples include a glass substrate; a flexible substrate made of an organic material such as polyimide, polyethylene terephthalate, and polycarbonate.
  • the effect of the present invention is particularly great when one of the circuit boards is a glass substrate and the other is a flexible board.
  • the board substrate which combined inorganic substance, such as glass / epoxy, and organic substance can also be used.
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of the circuit connection structure of the present invention.
  • the circuit connection structure shown in FIG. 2 includes a first circuit member 20 and a second circuit member 30 facing each other, and the first circuit member 20 and the second circuit member 30 are disposed between the first circuit member 20 and the second circuit member 30.
  • a connecting member 10 is provided to connect them.
  • the first circuit member 20 includes a circuit board (first circuit board) 21 and a circuit electrode (first circuit electrode) 22 formed on the main surface 21 a of the circuit board 21. Note that an insulating layer (not shown) may be formed on the main surface 21a of the circuit board 21 in some cases.
  • the second circuit member 30 includes a circuit board (second circuit board) 31 and a circuit electrode (second circuit electrode) 32 formed on the main surface 31 a of the circuit board 31.
  • an insulating layer (not shown) may be formed on the main surface 31a of the circuit board 31 according to circumstances.
  • the first and second circuit members 20 and 30 are not particularly limited as long as electrodes that require electrical connection are formed. Specific examples include glass or plastic substrates with electrodes formed of ITO, IZO, etc. used in liquid crystal displays, printed wiring boards, ceramic wiring boards, flexible wiring boards, semiconductor silicon chips, etc. Used in combination as needed. As described above, in the present embodiment, materials such as printed wiring boards and polyimides, metals such as copper and aluminum, ITO (indium tin oxide), silicon nitride (SiN x ), silicon dioxide (SiO 2 ) are used. Circuit members having various surface states such as inorganic materials such as the above can be used.
  • the connecting member 10 contains an insulating substance 11 and conductive particles 7.
  • the conductive particles 7 are disposed not only between the circuit electrode 22 and the circuit electrode 32 facing each other but also between the main surfaces 21a and 31a.
  • the circuit electrodes 22 and 32 are electrically connected via the conductive particles 7. That is, the conductive particles 7 are in direct contact with both the circuit electrodes 22 and 32.
  • the conductive particles 7 are the conductive particles described above, and the insulating substance 11 is a cured product of the circuit connection material.
  • the circuit electrode 22 and the circuit electrode 32 facing each other are electrically connected via the conductive particles 7. For this reason, the connection resistance between the circuit electrodes 22 and 32 is sufficiently reduced. Therefore, the flow of current between the circuit electrodes 22 and 32 can be made smooth, and the functions of the circuit can be fully exhibited.
  • the connection member 10 does not contain the conductive particles 7, the circuit electrode 22 and the circuit electrode 32 are in direct contact with each other to be electrically connected.
  • connection member 10 is composed of the cured product of the circuit connection material and conductive particles, the adhesion strength of the connection member 10 to the circuit member 20 or 30 is sufficiently high, and a reliability test (high temperature and high humidity) is performed. Even after the test), stable performance (good adhesive strength and connection resistance) can be maintained.
  • the film adhesive 40 is formed by forming a circuit connection material in which conductive particles are dispersed into a film shape, and includes the circuit connection material 5 and the conductive particles 7. Even when the conductive particles 7 are not dispersed in the film adhesive 40 (that is, when the film adhesive 40 is made of the circuit connecting material 5), the film adhesive is anisotropic as an insulating adhesive. It can be used for conductive bonding. At this time, the circuit connecting material is sometimes called NCP (Non-Conductive Paste). Moreover, when the electroconductive particle 7 is disperse
  • the thickness of the film adhesive 40 is preferably 6 to 50 ⁇ m.
  • the thickness of the film adhesive 40 is less than 6 ⁇ m, the circuit connecting material 5 tends to be insufficiently filled between the circuit electrodes 22 and 32.
  • the thickness exceeds 50 ⁇ m, the circuit connecting material 5 between the circuit electrodes 22 and 32 cannot be sufficiently removed, and it is difficult to ensure conduction between the circuit electrodes 22 and 32.
  • the film adhesive 40 is placed on the surface of the first circuit member 20 on which the circuit electrode 22 is formed.
  • the first circuit member 20 is arranged such that the film adhesive 40 side faces the first circuit member 20. Put it on top.
  • the film adhesive 40 is in a film form and is easy to handle. For this reason, the film adhesive 40 can be easily interposed between the first circuit member 20 and the second circuit member 30, and the connection between the first circuit member 20 and the second circuit member 30 is possible. Work can be done easily.
  • the film adhesive 40 is pressurized in the directions of arrows A and B in FIG. 3A to temporarily connect the film adhesive 40 to the first circuit member 20 (see FIG. 3B). At this time, you may pressurize, heating. However, the heating temperature is set to a temperature lower than the temperature at which the film adhesive 40 (the circuit connecting material 5 constituting the film adhesive 40) is not cured.
  • the second circuit member 30 is placed on the film adhesive 40 so that the second circuit electrode 32 faces the first circuit member 20.
  • the film adhesive 40 has adhered on the support body (for example, the above-mentioned film-form base material (not shown))
  • the 2nd circuit member 30 is made into a film form. Place on adhesive 40.
  • the first and second circuit electrodes 22 and 23 are aligned so that they face each other, and then the second circuit member 30 is temporarily fixed by heating and pressing from above the second circuit member 30. be able to. By doing so, it is possible to suppress the positional deviation of the electrodes during the subsequent main connection.
  • the heating temperature at the time of temporary fixing is set to a temperature lower than the temperature at which the circuit connecting material 5 in the film adhesive 40 is not cured, and the time from alignment to completion of temporary fixing is preferably 5 seconds or less for shortening the throughput. .
  • the film adhesive 40 is heated through the first and second circuit members 20 and 30 in the directions of arrows A and B in FIG.
  • the heating temperature at this time is set to a temperature at which the polymerization reaction can be started.
  • the film-like adhesive 40 is cured to perform the main connection, and a circuit connection structure as shown in FIG. 2 is obtained.
  • connection conditions are preferably a heating temperature of 100 to 250 ° C., a pressure of 0.1 to 10 MPa, and a connection time of 0.5 seconds to 120 seconds. These conditions are appropriately selected depending on the intended use, circuit connection material, and circuit member, and may be post-cured as necessary.
  • the conductive particles 7 can be brought into contact with both of the circuit electrodes 22 and 32 facing each other. The connection resistance between them can be sufficiently reduced.
  • the circuit connecting material 5 is cured to become the insulating substance 11 in a state where the distance between the circuit electrode 22 and the circuit electrode 32 is sufficiently small, and the first circuit member 20 is cured. And the second circuit member 30 are firmly connected via the connection member 10. That is, in the obtained circuit connection structure, since the connection member 10 includes the insulating substance 11 made of the circuit connection material described above, the bonding strength of the connection member 10 to the circuit member 20 or 30 is sufficiently high, The connection resistance between the electrically connected circuit electrodes can be sufficiently reduced.
  • connection member 10 even when left in a high-temperature and high-humidity environment for a long period of time, the generation of peeling bubbles at the interface between the circuit members 20 and 30 and the connection member 10 can be sufficiently suppressed, and the adhesive strength is reduced In addition, an increase in connection resistance can be sufficiently suppressed.
  • the present invention provides a circuit connection for electrically connecting two opposing circuit members of a composition containing the thermoplastic resin, the radical polymerizable compound, the radical polymerization initiator, and the inorganic fine particles. It can be said that it is applied as a material. Further, the present invention provides a circuit connection for electrically connecting two opposing circuit members of the composition containing the thermoplastic resin, the radical polymerizable compound, the radical polymerization initiator, and the inorganic fine particles. It can also be referred to as an application for the production of materials.
  • the content of the radical polymerizable compound is 40% by mass or more based on the total amount of the composition, and the content of a compound having a molecular weight of 1000 or less of the radical polymerizable compound is
  • the content of the inorganic fine particles is 5 to 30% by mass based on the total amount of the composition, and the composition contains at least the compound represented by the formula (1). contains.
  • circuit member is a radical polymerization type
  • the generation of exfoliated bubbles at the interface with the circuit member can be sufficiently suppressed and sufficient connection reliability can be achieved.
  • circuit connection material capable of maintaining the properties can be obtained.
  • the weight average molecular weight in terms of polystyrene of the obtained polyurethane resin was 320,000 as a result of measurement by GPC.
  • the GPC analysis conditions are shown in Table 1 below.
  • the reaction was continued for 15 hours after completion of the dropwise addition, and the reaction was terminated when NCO% (the amount of isocyanate group relative to the urethane group) was 0.2% or less, to obtain urethane acrylate.
  • NCO% the amount of isocyanate group relative to the urethane group
  • the weight average molecular weight of the obtained urethane acrylate was 8,500.
  • the GPC analysis was performed under the conditions shown in Table 1.
  • thermoplastic resin of component (a) As the thermoplastic resin of component (a), a phenoxy resin (PKHC, trade name of Union Carbide, weight average molecular weight 45000, represented as “PKHC” in the table) 40 g in 40 g of solid content dissolved in 60 g of methyl ethyl ketone. % Solution and a polyurethane resin (represented as “PU” in the table) obtained in Production Example 1 having a solid content concentration of 30 mass% were used.
  • PKHC phenoxy resin
  • % Solution and a polyurethane resin (represented as “PU” in the table) obtained in Production Example 1 having a solid content concentration of 30 mass% were used.
  • urethane acrylate obtained in Production Example 2 represented as “UA” in the table
  • cyclohexyl acrylate manufactured by Toagosei Co., Ltd., represented as “CHA” in the table
  • 2- (meth) acryloyloxyethyl phosphate light ester P-2M, trade name, manufactured by Kyoeisha Co., Ltd., indicated as “P-2M” in the table
  • 3-methacryloxypropyltri Methoxysilane KBM503, trade name manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent, represented as “KBM” in the table
  • t-hexyl peroxy-2-ethylhexanoate (Perhexyl O, trade name, manufactured by Yushi Co., Ltd., represented as “peroxide” in the table) is used. It was.
  • component (d) 10 g of R711 (product name manufactured by Nippon Aerosil Co., Ltd., represented as “R711” in the table) is dispersed in a mixed solvent of 45 g of toluene and 45 g of ethyl acetate. Used as a solution.
  • the above components are blended so as to have a solid weight ratio shown in Table 2, and then the conductive particles obtained in Production Example 3 are blended at 1.5% by volume with respect to the total volume of the adhesive component and dispersed.
  • the obtained coating solution was applied to a polyethylene terephthalate (PET) film having a thickness of 50 ⁇ m by using a coating apparatus, followed by drying with hot air at 70 ° C. for 10 minutes to obtain a film adhesive having a thickness of 16 ⁇ m. .
  • PET polyethylene terephthalate
  • the content of the radically polymerizable compound in the film-like adhesives of the examples and comparative examples the content of the radically polymerizable compound (component (b-1)) having a molecular weight exceeding 1000, and the radically polymerizable compound having a molecular weight of 1000 or less (
  • the content of the component (b-2) and the content of the inorganic fine particles were as shown in Table 3 calculated from the respective compounding amounts (both circuit connection materials (conductive particles of the film adhesive) %) Based on the total amount of components other than The silane coupling agent 3-methacryloxypropyltrimethoxysilane is included in the component (b-2).
  • Example 6 to 10 and Comparative Examples 6 to 10 Using the film adhesives of Examples 1 to 5 and Comparative Examples 1 to 5, connection structures of Examples 6 to 10 and Comparative Examples 6 to 10 were produced.
  • the film-like adhesive is a glass substrate (thickness 1.1 mm) on which a thin film of indium oxide (ITO) having a thickness of 0.2 ⁇ m is formed under conditions of 1 MPa and 2 seconds at a temperature of 70 ° C. ) Transcription.
  • this glass substrate and a flexible circuit board (FPC board) in which 500 copper circuits having a line width of 75 ⁇ m, a pitch of 150 ⁇ m, and a thickness of 18 ⁇ m are wired on polyimide with an epoxy resin adhesive are used as a film adhesive Were placed so as to face each other, and heated and pressurized at 3 MPa at a temperature of 160 ° C.
  • connection body circuit connection structure
  • connection body by which the FPC board and the glass substrate (ITO board
  • curing material connection member of the film adhesive over 2 mm in width was obtained.
  • Circuit connection structure evaluation 3 characteristic evaluation after high temperature and high humidity test
  • the circuit connection structures obtained in Examples and Comparative Examples were held for 250 hours under the conditions of 85 ° C. and 85% RH to obtain measurement samples.
  • the obtained sample, connection resistance and adhesive strength were evaluated by the same method as said evaluation 1 and 2.
  • the evaluation results are shown in Table 4.
  • circuit connection structure of Comparative Example 8 obtained using the film-like adhesive of Comparative Example 3 in which the content of the component (b-2) exceeds 15% by mass, and the Comparative Example not containing a silane coupling agent
  • the circuit connection structure of Comparative Example 10 obtained by using the film-like adhesive of No. 5
  • peeling occurred remarkably at the interface between the connection member and the circuit member after the high temperature and high humidity test.
  • the connection resistance is low. As a result, the adhesive force decreased, and the interface between the connecting member and the circuit member was remarkably peeled off.
  • Example 11 to 15 and Comparative Examples 11 to 15 Each of the coating solutions used in the production of the film adhesives of Examples 1 to 5 and Comparative Examples 1 to 5 was applied to a polyethylene terephthalate (PET) film having a thickness of 50 ⁇ m, and the coating solution was 70 ° C. for 10 minutes. Hot air drying was performed to form a film adhesive having a thickness of 16 ⁇ m on the PET film, and an adhesive film including the PET film and the film adhesive was obtained.
  • PET polyethylene terephthalate
  • the obtained adhesive film was cut into a width of 2 mm and wound into a reel having an inner diameter of 66 mm to obtain a roll of the adhesive film.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un matériau de connexion de circuit pour connecter électriquement deux éléments de circuit opposés l'un à l'autre, qui contient une résine thermoplastique, des composés polymérisables par voie radiculaire, un initiateur de polymérisation radicalaire et des particules fines inorganiques. La teneur des composés polymérisables par voie radiculaire est 40 % en masse ou plus sur la base du volume total du matériau de connexion de circuit, et la teneur de composés dont le poids moléculaire est de 1 000 ou moins parmi les composés polymérisables par voie radiculaire est de 15 % en masse ou moins sur la base du volume total de matériau de connexion de circuit. La teneur des particules fines inorganiques est de 5 à 30 % en masse sur la base du volume total du matériau de connexion de circuit, ce dernier contenant au moins un composé représenté par la formule (1).
PCT/JP2013/061658 2012-04-25 2013-04-19 Matériau de connexion de circuit, structure de connexion de circuit, film adhésif et corps enroulé WO2013161713A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201380014782.8A CN104169389B (zh) 2012-04-25 2013-04-19 电路连接材料、电路连接结构体、粘接膜以及卷绕体
KR1020147024907A KR20150005516A (ko) 2012-04-25 2013-04-19 회로 접속 재료, 회로 접속 구조체, 접착 필름 및 권중체
KR1020207011815A KR102329065B1 (ko) 2012-04-25 2013-04-19 회로 접속 재료, 회로 접속 구조체, 접착 필름 및 권중체
JP2014512528A JP6090311B2 (ja) 2012-04-25 2013-04-19 回路接続材料、回路接続構造体及び接着フィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-100207 2012-04-25
JP2012100207 2012-04-25

Publications (1)

Publication Number Publication Date
WO2013161713A1 true WO2013161713A1 (fr) 2013-10-31

Family

ID=49483032

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/061658 WO2013161713A1 (fr) 2012-04-25 2013-04-19 Matériau de connexion de circuit, structure de connexion de circuit, film adhésif et corps enroulé

Country Status (4)

Country Link
JP (1) JP6090311B2 (fr)
KR (2) KR102329065B1 (fr)
CN (1) CN104169389B (fr)
WO (1) WO2013161713A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016117853A (ja) * 2014-12-22 2016-06-30 日立化成株式会社 アンダーフィル材、電子部品装置の製造方法及び電子部品装置
JP2016152168A (ja) * 2015-02-18 2016-08-22 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板
WO2016199252A1 (fr) * 2015-06-10 2016-12-15 日立化成株式会社 Composition adhésive et objet connecté
JP2017103303A (ja) * 2015-11-30 2017-06-08 日立化成株式会社 半導体用接着剤、半導体装置、及び半導体装置の製造方法
TWI685554B (zh) * 2015-06-16 2020-02-21 日商日立化成股份有限公司 接著劑組成物及連接體
WO2022186016A1 (fr) * 2021-03-01 2022-09-09 昭和電工マテリアルズ株式会社 Film de liaison pour connexion de circuit et corps connecté

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016143640A1 (fr) * 2015-03-11 2016-09-15 セメダイン株式会社 Structure électroconductrice et son procédé de fabrication
CN104952702B (zh) * 2015-05-15 2017-11-28 张家港康得新光电材料有限公司 半导体器件及其制作方法
WO2017078087A1 (fr) * 2015-11-04 2017-05-11 日立化成株式会社 Composition et structure adhésive
KR102556357B1 (ko) * 2015-11-25 2023-07-14 가부시끼가이샤 레조낙 접착제 조성물 및 구조체
CN106549115B (zh) * 2016-10-27 2018-07-20 武汉华星光电技术有限公司 异方性导电胶膜及异方性导电胶膜的剥离方法
US11483936B2 (en) * 2017-11-08 2022-10-25 Showa Denko Materials Co., Ltd. Method for producing joined body, and joining material
CN114927256A (zh) * 2022-04-29 2022-08-19 常州德创高新材料科技有限公司 一种电路连接材料

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08325543A (ja) * 1995-06-05 1996-12-10 Soken Chem & Eng Co Ltd 異方導電性接着剤
JPH11284024A (ja) * 1998-03-31 1999-10-15 Hitachi Chem Co Ltd 回路板装置の製造法
JP2001126541A (ja) * 1999-10-28 2001-05-11 Sumitomo Bakelite Co Ltd 異方導電フィルム及び電気・電子部品
JP2004067908A (ja) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2010111846A (ja) * 2008-10-09 2010-05-20 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及び回路接続体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
JP4760070B2 (ja) * 2005-03-16 2011-08-31 日立化成工業株式会社 接着剤、回路接続用接着剤、接続体及び半導体装置
CN102127375B (zh) * 2006-08-22 2016-09-28 日立化成株式会社 电路连接材料、电路部件的连接结构及电路部件的连接结构的制造方法
KR100902714B1 (ko) * 2006-12-29 2009-06-15 제일모직주식회사 반열경화성 이방 도전성 필름 조성물
WO2009038190A1 (fr) * 2007-09-19 2009-03-26 Hitachi Chemical Company, Ltd. Composition adhésive et corps lié
JP2009110913A (ja) * 2007-10-30 2009-05-21 Cheil Industries Inc 半熱硬化性異方導電性フィルム組成物
JP4985700B2 (ja) * 2008-04-28 2012-07-25 日立化成工業株式会社 接着剤リール
JP5293779B2 (ja) * 2010-07-20 2013-09-18 日立化成株式会社 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
US9844067B2 (en) 2013-07-11 2017-12-12 Lg Electronics Inc. Broadcasting method using device-to-device (D2D) communication in wireless communication system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08325543A (ja) * 1995-06-05 1996-12-10 Soken Chem & Eng Co Ltd 異方導電性接着剤
JPH11284024A (ja) * 1998-03-31 1999-10-15 Hitachi Chem Co Ltd 回路板装置の製造法
JP2001126541A (ja) * 1999-10-28 2001-05-11 Sumitomo Bakelite Co Ltd 異方導電フィルム及び電気・電子部品
JP2004067908A (ja) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2010111846A (ja) * 2008-10-09 2010-05-20 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及び回路接続体

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016117853A (ja) * 2014-12-22 2016-06-30 日立化成株式会社 アンダーフィル材、電子部品装置の製造方法及び電子部品装置
JP2016152168A (ja) * 2015-02-18 2016-08-22 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板
WO2016199252A1 (fr) * 2015-06-10 2016-12-15 日立化成株式会社 Composition adhésive et objet connecté
JPWO2016199252A1 (ja) * 2015-06-10 2018-03-29 日立化成株式会社 接着剤組成物及び接続体
TWI685554B (zh) * 2015-06-16 2020-02-21 日商日立化成股份有限公司 接著劑組成物及連接體
JP2017103303A (ja) * 2015-11-30 2017-06-08 日立化成株式会社 半導体用接着剤、半導体装置、及び半導体装置の製造方法
WO2022186016A1 (fr) * 2021-03-01 2022-09-09 昭和電工マテリアルズ株式会社 Film de liaison pour connexion de circuit et corps connecté

Also Published As

Publication number Publication date
KR20150005516A (ko) 2015-01-14
KR102329065B1 (ko) 2021-11-18
CN104169389B (zh) 2018-07-13
CN104169389A (zh) 2014-11-26
JPWO2013161713A1 (ja) 2015-12-24
KR20200045015A (ko) 2020-04-29
JP6090311B2 (ja) 2017-03-08

Similar Documents

Publication Publication Date Title
JP6090311B2 (ja) 回路接続材料、回路接続構造体及び接着フィルム
JP4998468B2 (ja) 接着剤組成物及び回路部材の接続構造
JP5867508B2 (ja) 回路接続材料及び接続体
JP5223679B2 (ja) 接着剤及びこれを用いた接続構造体
JP6173928B2 (ja) 接着剤組成物、回路接続用接着剤及び接続体
JP5251393B2 (ja) 接着剤組成物、回路接続用接着剤及びそれを用いた接続体
KR102478959B1 (ko) 접착제 조성물 및 접속체
JP5292838B2 (ja) 接着剤、及び回路部材の接続構造体
JP5293779B2 (ja) 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
JP5577635B2 (ja) 接着剤組成物、回路接続用接着剤及び回路接続体
JP2011037953A (ja) 接着剤組成物、回路接続構造体及び半導体装置
JP2013028675A (ja) 回路接続材料及びそれを用いた回路接続構造体
JP2013227420A (ja) 回路接続材料、回路接続構造体、接着フィルム及び巻重体。
JP2022000530A (ja) 接着剤組成物及び構造体
TWI763551B (zh) 連接結構體、電路連接構件及接著劑組成物
JP2012204059A (ja) 回路接続材料及びそれを用いた回路接続構造体
JP6645499B2 (ja) 接着剤組成物及び接続体
TWI570208B (zh) 電路連接材料及連接體
WO2017037951A1 (fr) Composition adhésive, composition adhésive électroconductrice de façon anisotrope, matériau de connexion de circuit, et objet connecté

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13782245

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2014512528

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20147024907

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13782245

Country of ref document: EP

Kind code of ref document: A1