WO2022183411A1 - 高制程能力的塞孔压膜工艺 - Google Patents

高制程能力的塞孔压膜工艺 Download PDF

Info

Publication number
WO2022183411A1
WO2022183411A1 PCT/CN2021/078921 CN2021078921W WO2022183411A1 WO 2022183411 A1 WO2022183411 A1 WO 2022183411A1 CN 2021078921 W CN2021078921 W CN 2021078921W WO 2022183411 A1 WO2022183411 A1 WO 2022183411A1
Authority
WO
WIPO (PCT)
Prior art keywords
plug
hole
process capability
lamination
dry film
Prior art date
Application number
PCT/CN2021/078921
Other languages
English (en)
French (fr)
Inventor
李齐良
Original Assignee
柏承科技(昆山)股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 柏承科技(昆山)股份有限公司 filed Critical 柏承科技(昆山)股份有限公司
Priority to PCT/CN2021/078921 priority Critical patent/WO2022183411A1/zh
Publication of WO2022183411A1 publication Critical patent/WO2022183411A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the invention relates to the technical field of printed circuit board manufacturing, in particular to a plug-hole lamination process with high process capability.
  • the PCB board factory produces the traditional board/HDI board solder-proof plug hole three-machine process, which are all traditional screen printing point-to-point plug hole + surface printing mode. Air guide plate and other tools, and the printing alignment accuracy is low.
  • the three-machine connection in the production mode not only has a long process and high cost, but also has low efficiency.
  • the root of the problem is that after screen printing, the ink has a 1-2 mil overflow of ink, which leads to the risk of anti-sticking to the board surface, and the pass-through rate is often only about 90%.
  • the narrower the line width the more obvious the influence of ink spillage and diffusion, which directly restricts the improvement of process capability.
  • the main purpose of the present invention is to provide a plug-hole lamination process with high process capability, which can avoid the process capability restriction caused by the overflow and diffusion of plug-hole screen printing.
  • the present invention achieves the above object through the following technical solutions: a plug-hole lamination process with high process capability, the steps comprising:
  • Plug hole printing spray the UV curing inkjet printing ink on the spray area determined in step 1, and irradiate it with a UV lamp at the same time to let the ink solidify to obtain a plugged PCB board;
  • 3Vacuum lamination use the material tape as the carrier to attach the solder-resist photosensitive dry film to the front and back sides of the PCB board after the plug hole, then vacuumize, and then hot-press to keep the photosensitive dry film on the PCB;
  • the spraying area is obtained by a preset width according to the actual determined position of the plug hole where the edge is outwardly offset, and the preset width is 0-5 mil.
  • the particle size of the particles in the UV curing inkjet printing ink is 10-700 nm, and the ink viscosity is 0-100 mPa ⁇ s.
  • the material belt carrying the photosensitive dry film is a PET material.
  • the step (1) is to locate the plug hole by photographing the target on the PCB board.
  • the present invention performs continuous operation of plug hole + vacuum lamination attaching to the surface by spraying UV ink, which not only improves the plug hole accuracy and plug hole reliability, but also improves the flatness of the board surface by vacuum lamination, and shortens the preparation time. Time, speed up operation efficiency, reduce material cost and production cost, ensure product quality, and comprehensively improve the process capability of circuit board.
  • a plug-hole lamination process with high process capability of the present invention the steps of which include:
  • Plug hole printing spray the UV curing inkjet printing ink on the spray area determined in step 1, and irradiate it with a UV lamp at the same time to let the ink solidify to obtain a plugged PCB board;
  • 3Vacuum lamination use the material tape as the carrier to attach the solder-resist photosensitive dry film to the front and back sides of the PCB board after the plug hole, then vacuumize, and then hot-press to keep the photosensitive dry film on the PCB;
  • This method replaces the three-machine online operation of screen printing plug hole + surface A/B surface printing with two steps of plug hole jet printing and vacuum lamination.
  • the preparation for spraying only needs to be completed by taking pictures and then using the program design, without the need for tools such as wire meshes, which saves material costs and preparation time;
  • the initial fluidity of the ink is good, so it can be accurately sprayed within the required range of the plug hole, with high position accuracy and smooth surface, and high reliability of the plug hole;
  • the photosensitive dry film can be attached by a lamination method with low precision requirements and high processing efficiency, which has good processing continuity and shortens the processing time. time, but also to ensure product quality.
  • the spraying area is obtained by a preset width based on the actual determined position of the plug hole, where the edge is offset, and the preset width is 0-5 mil. Because the spraying accuracy is easy to control, when designing the spraying area online, only a width of 0 to 5 mils is required, and no larger distance is required to ensure the plugging effect. The narrowing of the spray area is also conducive to the design of the circuit can also be developed in the direction of higher density.
  • the particle size of the particles in the UV curing inkjet printing ink is 10-700nm, and the ink viscosity is 0-100mPa ⁇ s. This condition allows the ink to have sufficient fluidity to spread evenly on the board.
  • UV-curable inkjet printing inks are generally solder resist inks on the market, and can be creatively used in plugging operations to achieve external insulation effects on the via holes.
  • the material belt carrying the photosensitive dry film is PET material. PET raw materials are easy to obtain and economical, and can be reused.
  • Step 1 Position the plug hole by shooting the target on the PCB board. The target positioning accuracy is the highest.
  • the traditional screen printing method takes 240 minutes to plug holes in 72 PCB boards, while the new method only takes 80 minutes.
  • the lamination process has a higher appearance yield rate, and the finished product inspection pass rate is as high as 98%, and there is almost no foreign matter or copper leakage. Therefore, it has a very positive effect on the production capacity growth of enterprises.
  • the present invention performs continuous operation of plugging + vacuum lamination attaching to the surface by spraying UV ink, which not only improves the plugging accuracy and plugging reliability, but also improves the flatness of the board surface by vacuum lamination.
  • the preparation time is shortened, the operation efficiency is accelerated, the material cost and production cost are reduced, the product quality is guaranteed, and the process capability of the circuit board is comprehensively improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

本发明属于印刷电路板制造技术领域，涉及一种高制程能力的塞孔压膜工艺，步骤包括：喷涂区域确定、塞孔喷印、真空压膜和影像转移。本发明通过喷印UV油墨的方式进行塞孔作业，不仅提高了塞孔精度和塞孔可靠性，还缩短了准备时间，加快了作业效率，降低了材料成本和生产成本，保证了产品质量，全面提升了线路板的制程能力。

Description

高制程能力的塞孔压膜工艺 技术领域
本发明涉及印刷电路板制造技术领域，特别涉及一种高制程能力的塞孔压膜工艺。
背景技术
目前PCB板厂生产传统板/HDI板防焊塞孔三机工艺，均为传统网印点对点塞孔+表面印刷模式，对塞孔印刷+表面印刷外观要求严格，需使用专用底片、网板、导气垫板等工具，且印刷对位精度低。生产模式三机连线不仅流程长、成本高，而且效率低。其问题的根源在于丝网印刷后油墨存在1～2mil的溢墨扩散，导致反沾板面风险，直通率往往只在90％左右。线宽越窄，溢墨扩散带来的影响越明显，直接制约了制程能力的提升。
因此有必要开发一种新的工艺来解决以上问题。
发明内容
本发明的主要目的在于提供一种高制程能力的塞孔压膜工艺，能够避免对塞孔丝网印刷溢墨扩散带来的制程能力制约。
本发明通过如下技术方案实现上述目的：一种高制程能力的塞孔压膜工艺，步骤包括：
①喷涂区域确定：对PCB板的塞孔位置进行拍摄，确定喷涂区域；
②塞孔喷印：将UV型固化喷印油墨喷涂在步骤①确定的喷涂区域，同时用紫外灯照射，让油墨固化，得到塞孔后的PCB板；
③真空压膜：以料带为载体将阻焊型感光干膜贴附于塞孔后的PCB板正反两面，随后进行抽真空，然后热压，让感光干膜留在PCB板上；
④影像转移：通过曝光法在有感光干膜的板面上成型新的线路。
具体的，所述喷涂区域是根据实际确定的塞孔位置边缘外偏预设的宽度得到，所述预设的宽度为0～5mil。
具体的，所述UV型固化喷印油墨中颗粒物粒径为10～700nm，油墨粘度0～100mPa·s。
具体的，承载感光干膜的料带为PET材料。
具体的，所述步骤①通过PCB板上的靶标拍摄进行塞孔定位。
本发明技术方案的有益效果是：
本发明通过喷印UV油墨的方式进行塞孔+真空压膜贴附表面工艺连续作业，不仅提高了塞孔精度和塞孔可靠性，真空压膜使其板面平整度提高，还缩短了准备时间，加快了作业效率，降低了材料成本和生产成本，保证了产品质量，全面提升了线路板的制程能力。
具体实施方式
下面结合具体实施例对本发明作进一步详细说明。
实施例：
本发明的一种高制程能力的塞孔压膜工艺，其步骤包括：
①喷涂区域确定：对PCB板的塞孔位置进行拍摄，确定喷涂区域；
②塞孔喷印：将UV型固化喷印油墨喷涂在步骤①确定的喷涂区域，同时用紫外灯照射，让油墨固化，得到塞孔后的PCB板；
③真空压膜：以料带为载体将阻焊型感光干膜贴附于塞孔后的PCB板正反两面，随后进行抽真空，然后热压，让感光干膜留在PCB板上；
④影像转移：通过曝光法在有感光干膜的板面上成型新的线路。
本方法将丝网印刷塞孔+表面A/B面印刷三机联机作业替换为了塞孔喷 印和真空压膜两步。
喷印方式的优点在于：
1、喷涂准备只需要拍照后利用程序设计完成，用不到准备丝网等工具，节省了材料成本和准备时间；
2、油墨初始流动性较好，所以可以精确地喷涂在塞孔所需范围内，位置精度高且表面平整，塞孔可靠性高；
3、选用UV型固化喷印油墨，通过紫外灯照射就能保证快速固化，缩短了制造时间；
4、在塞孔喷印确保了孔缘不漏铜的效果之后，感光干膜就可采用精度要求低而加工效率高的压膜方式贴附，有很好的加工连续性，既缩短了加工时间，也保证了产品质量。
喷涂区域是根据实际确定的塞孔位置边缘外偏预设的宽度得到，所述预设的宽度为0～5mil。因为喷涂精度方便控制，所以在在线设计喷涂区域时，只需要0～5mil的宽度即可，而不需要留更大的距离来保证塞孔效果。喷涂区域变窄也有利于使线路的设计也可以往更高密度的方向发展。
UV型固化喷印油墨中颗粒物粒径为10～700nm，油墨粘度0～100mPa·s。这个条件让油墨具有足够的流动性，对板面的铺展均匀。
UV型固化喷印油墨在市面上一般属于防焊油墨，这里可以创造性的运用于塞孔作业当中，并对导通孔位置达到外部绝缘效果。
承载感光干膜的料带为PET材料。PET材料原料易得价格经济，可以反复利用。
步骤①通过PCB板上的靶标拍摄进行塞孔定位。采用靶标定位精度最高。
实施发现，传统网印法对72片PCB板塞孔所需时间为240min，而新方法只需要80min。压膜工艺较比传统网印外观良率高，成品检验直通率高达98％，几乎不存在异物或漏铜等不良情况。所以对于企业的产能增长有非常积极的作用。
综上，本发明通过喷印UV油墨的方式进行塞孔+真空压膜贴附表面工艺连续作业，不仅提高了塞孔精度和塞孔可靠性，真空压膜使其板面平整度提高，还缩短了准备时间，加快了作业效率，降低了材料成本和生产成本，保证了产品质量，全面提升了线路板的制程能力。
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (5)

  1. 一种高制程能力的塞孔压膜工艺，其特征在于步骤包括：
    ①喷涂区域确定：对PCB板的塞孔位置进行拍摄，确定喷涂区域；
    ②塞孔喷印：将UV型固化喷印油墨喷涂在步骤①确定的喷涂区域，同时用紫外灯照射，让油墨固化，得到塞孔后的PCB板；
    ③真空压膜：以料带为载体将阻焊型感光干膜贴附于塞孔后的PCB板正反两面，随后进行抽真空，然后热压，让感光干膜留在PCB板上；
    ④影像转移：通过曝光法在有感光干膜的板面上成型新的线路。
  2. 根据权利要求1所述的高制程能力的塞孔压膜工艺，其特征在于：所述喷涂区域是根据实际确定的塞孔位置边缘外偏预设的宽度得到，所述预设的宽度为0～5mil。
  3. 根据权利要求1所述的高制程能力的塞孔压膜工艺，其特征在于：所述UV型固化喷印油墨中颗粒物粒径为10～700nm，油墨粘度0～100mPa·s。
  4. 根据权利要求1所述的高制程能力的塞孔压膜工艺，其特征在于：承载感光干膜的料带为PET材料。
  5. 根据权利要求1所述的高制程能力的塞孔压膜工艺，其特征在于：所述步骤①通过PCB板上的靶标拍摄进行塞孔定位。
PCT/CN2021/078921 2021-03-03 2021-03-03 高制程能力的塞孔压膜工艺 WO2022183411A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/078921 WO2022183411A1 (zh) 2021-03-03 2021-03-03 高制程能力的塞孔压膜工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/078921 WO2022183411A1 (zh) 2021-03-03 2021-03-03 高制程能力的塞孔压膜工艺

Publications (1)

Publication Number Publication Date
WO2022183411A1 true WO2022183411A1 (zh) 2022-09-09

Family

ID=83153896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/078921 WO2022183411A1 (zh) 2021-03-03 2021-03-03 高制程能力的塞孔压膜工艺

Country Status (1)

Country Link
WO (1) WO2022183411A1 (zh)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0494185A (ja) * 1990-08-10 1992-03-26 Nec Toyama Ltd 印刷配線板の製造方法
CN201119124Y (zh) * 2007-11-29 2008-09-17 台湾欧特玛科技股份有限公司 真空塞孔机
CN102427678A (zh) * 2011-11-09 2012-04-25 金悦通电子（翁源）有限公司 Pcb板制作方法
CN106028663A (zh) * 2016-08-01 2016-10-12 安徽贝莱电子科技有限公司 一种雷达内置电路板的制造工艺
CN207266360U (zh) * 2017-06-13 2018-04-20 江西景旺精密电路有限公司 一种新型防焊低压喷涂高密度电路板
CN108112174A (zh) * 2018-02-01 2018-06-01 江西景旺精密电路有限公司 一种pcb自动塞孔及印刷方法及系统
CN108243573A (zh) * 2016-12-25 2018-07-03 青岛祥智电子技术有限公司 Pcb双面板生产方法
CN109511230A (zh) * 2018-09-20 2019-03-22 通元科技(惠州)有限公司 一种线路板阻焊喷印加工方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0494185A (ja) * 1990-08-10 1992-03-26 Nec Toyama Ltd 印刷配線板の製造方法
CN201119124Y (zh) * 2007-11-29 2008-09-17 台湾欧特玛科技股份有限公司 真空塞孔机
CN102427678A (zh) * 2011-11-09 2012-04-25 金悦通电子（翁源）有限公司 Pcb板制作方法
CN106028663A (zh) * 2016-08-01 2016-10-12 安徽贝莱电子科技有限公司 一种雷达内置电路板的制造工艺
CN108243573A (zh) * 2016-12-25 2018-07-03 青岛祥智电子技术有限公司 Pcb双面板生产方法
CN207266360U (zh) * 2017-06-13 2018-04-20 江西景旺精密电路有限公司 一种新型防焊低压喷涂高密度电路板
CN108112174A (zh) * 2018-02-01 2018-06-01 江西景旺精密电路有限公司 一种pcb自动塞孔及印刷方法及系统
CN109511230A (zh) * 2018-09-20 2019-03-22 通元科技(惠州)有限公司 一种线路板阻焊喷印加工方法

Similar Documents

Publication Publication Date Title
CN103917046A (zh) 包含盲孔的线路板及其制作方法
CN104777665B (zh) 黑色矩阵的制作方法
CN103325675A (zh) 一种窄线宽电极的电子元件制造方法
WO2017113837A1 (zh) Ic载板阻焊塞孔凹陷的改善方法及制造方法
CN104080275A (zh) 一种阶梯线路板的制作方法
CN102076176A (zh) 一种防焊油墨涂覆的方法
WO2020024937A1 (zh) 一种改善软硬结合pcb板高低差钻孔的方法
CN104117778B (zh) 一种电路板防焊层激光加工方法
CN106793531B (zh) 新型真空蚀刻机及应用该真空蚀刻机的pcb制造工艺
CN109504157B (zh) 一种碱性脱墨剂和治具上油墨的脱除工艺
CN103197472A (zh) 一种液晶面板的制备方法
CN105050330A (zh) 一种加厚网版的制作方法及使用加厚网版丝印蓝胶的方法
WO2021047424A1 (zh) 玻璃盖板的制作方法、玻璃盖板及移动终端
WO2022183411A1 (zh) 高制程能力的塞孔压膜工艺
CN113141733A (zh) 高制程能力的塞孔压膜工艺
CN116017869A (zh) 一种Mini LED PCB微小焊盘阻焊制作方法
CN105093853A (zh) 自动防焊曝光台框模组及曝光机
WO2022095937A1 (zh) 一种pcb防焊塞孔方法
CN103619126A (zh) 一种金属基厚铜板的外层线路的制作方法
CN104392934A (zh) 封装基板的阻焊制作方法
CN108882548A (zh) 一种led光源板阻焊油墨表面固化工艺
CN107309148B (zh) 一种线路板的垂直连续涂布vcc方法及装置
CN108929591B (zh) 一种光固化液态感光油墨
JP2009151069A (ja) 段差付きスクリーン印刷用マスクの作製方法
WO2021120638A1 (zh) 一种在pcb基材表面印字符的加工方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21928500

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21928500

Country of ref document: EP

Kind code of ref document: A1