WO2022095937A1 - 一种pcb防焊塞孔方法 - Google Patents

一种pcb防焊塞孔方法 Download PDF

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Publication number
WO2022095937A1
WO2022095937A1 PCT/CN2021/128787 CN2021128787W WO2022095937A1 WO 2022095937 A1 WO2022095937 A1 WO 2022095937A1 CN 2021128787 W CN2021128787 W CN 2021128787W WO 2022095937 A1 WO2022095937 A1 WO 2022095937A1
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Prior art keywords
pcb
aoi
yellowing
pcb board
automatic
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PCT/CN2021/128787
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English (en)
French (fr)
Inventor
曾祥福
周刚
张雪锋
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智恩电子(大亚湾)有限公司
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Publication of WO2022095937A1 publication Critical patent/WO2022095937A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Definitions

  • the present application belongs to the technical field of PCB, and in particular relates to a method for preventing solder plug holes of PCB.
  • the technical problem to be solved by the present application is to provide a PCB solder plug hole prevention method with simple process, avoiding ink bulge and saving man-hours.
  • the present application provides a method for preventing solder plugging of PCB.
  • AOI detection is performed on the yellowed PCB board, and the AOI judges the yellowing degree and yellowing position of the PCB board, and transmits the signal to the automatic inkjet machine.
  • the automatic inkjet machine accurately inkjets the yellowing position according to the signal sent by the AOI, and finally bakes and cures the PCB board.
  • the surface treatment is performed on the PCB board.
  • the AOI detects the position of the via hole on the PCB board.
  • the distance between the nozzle of the automatic inkjet machine and the PCB board is the thickness of the PCB board +1.5-2mm.
  • the diameter of the nozzle of the automatic inkjet machine is 0.1-0.15mm.
  • the ink jetting speed of the automatic ink jet machine is 4.0-4.2 L/min.
  • the baking and curing temperature is 50-60°C.
  • the baking and curing time is 25-30 min.
  • AOI can accurately detect the yellowing part of the PCB board, and the automatic inkjet machine inkjets the PCB board according to the signal transmitted by AOI; the combination of AOI and automatic inkjet technology is used to realize the yellowing area of the PCB board. Make precise remedies.
  • the surface treatment makes the surface of the PCB board clean and free of debris; only the inspection of the PCB board via holes is for the quality inspection that only requires no yellowing at the via holes, and does not require no yellowing outside the via holes of the PCB board. standard, which can reduce the detection time.
  • the inkjet is uniform and does not sputter; the diameter of the nozzle of the automatic inkjet machine is 0.1-0.15mm, and the diameter of the inkjet is suitable.
  • one time is enough; the inkjet speed of the automatic inkjet machine is 4.0-4.2L/min, and the ink is covered evenly; the baking and curing temperature is 50-60°C, which does not affect the board, and the drying efficiency is fast; the baking and curing time is 25- 30min, the ink is completely cured.
  • the method for preventing solder plugging of PCB in the present application is simple in process, avoids ink bulge, and saves man-hours.
  • FIG. 1 is a schematic flow chart of a method for solder-proof plug holes of a PCB according to the present application.
  • FIG. 1 shows a method for preventing solder plugging of PCBs disclosed in the present application.
  • AOI detection is performed on the yellowed PCB board, and the yellowing degree and yellowing position of the PCB board are judged by AOI, and the signal is transmitted to the automatic inkjet machine.
  • the automatic inkjet machine accurately inkjets the yellowing position according to the signal sent by the AOI, and finally bakes and cures the PCB board.
  • AOI can accurately detect the yellowing part of the PCB board, and the automatic inkjet machine inkjets the PCB board according to the signal transmitted by the AOI; the combination of AOI and automatic inkjet technology is used to realize the Precise remediation of the yellowed area of the PCB board.
  • the surface treatment is performed on the PCB board.
  • the AOI detects the position of the via hole on the PCB board.
  • the distance between the nozzle of the automatic inkjet machine and the PCB board is the thickness of the PCB board + 1.5-2mm.
  • the diameter of the nozzle of the automatic inkjet machine is 0.1-0.15mm.
  • the ink jet speed of the automatic ink jet machine is 4.0-4.2 L/min.
  • the baking and curing temperature is 50-60°C.
  • the baking and curing time is 25-30min.
  • yellowing (exposed copper) is not allowed at the via holes, and the yellowing of the circuit and the board surface does not exceed 4 places, so AOI inspects the entire PCB board, and AOI judges the PCB board.
  • the degree of yellowing and the position of yellowing are transmitted to the automatic inkjet machine.
  • the automatic inkjet machine adjusts the inkjet speed and inkjet spacing of the automatic inkjet machine according to the degree of yellowing and the yellowing position transmitted by AOI, and accurately prints the PCB.
  • the distance between the nozzle of the automatic inkjet machine and the PCB board is the thickness of the PCB board + 1.5mm, and the automatic spraying
  • the nozzle diameter of the ink jet was 0.1 mm
  • the ink jet speed of the automatic ink jet was 4.2 L/min
  • the baking curing temperature was 50°C
  • the baking curing time was 30 min.
  • AOI's detection of the PCB board is specifically set according to the customer's requirements for the PCB board, and is not specifically limited.
  • the method for preventing solder plugging of PCB in the present application is simple in process, avoids ink bulge, and saves man-hours.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

本申请涉及一种PCB防焊塞孔方法，首先对发黄的PCB板进行AOI检测，由AOI判断PCB板发黄程度以及发黄位置，将信号传送到自动喷墨机上，自动喷墨机根据AOI所传送信号对发黄位置进行喷墨，最后对PCB板进行烘烤固化；烘烤固化完成后，再对PCB板进行表面处理；AOI可以对PCB板发黄部位进行精准检测，自动喷墨机根据AOI所传递的信号对PCB板进行喷墨；使用AOI和自动喷墨结合的技术实现了对PCB板发黄区域进行精准补救。本方法工艺简单、避免油墨凸起、节省工时。

Description

一种PCB防焊塞孔方法 技术领域
本申请属于PCB技术领域，尤其涉及一种PCB防焊塞孔方法。
背景技术
近十几年来，我国印刷电路板制造行业发展迅速，总产值、总产量双双位居世界第一；由于电子产品日新月异，价格战改变了供应链的结构，中国兼具产业分布、成本和市场优势，已经成为全球最重要的印制电路板生产基地。现有的PCB板半孔通常是预锣PTH孔，此种方式容易造成锡面擦花的现象发生，从而导致图电后存在流锡隐患，并且油墨入孔反洗时会造成断板报废，极大的增加了产品报废率。
申请内容
本申请要解决的技术问题是提供一种工艺简单、避免油墨凸起、节省工时的PCB防焊塞孔方法。
为实现上述目的，本申请提供了一种PCB防焊塞孔方法，首先对发黄的PCB板进行AOI检测，由AOI判断PCB板发黄程度以及发黄位置，将信号传送到自动喷墨机上，自动喷墨机根据AOI所传送信号对发黄位置进行精准喷墨，最后对PCB板进行烘烤固化。
作为本申请的一种改进，所述烘烤固化完成后，再对PCB板进行表面处理。
作为本申请的一种改进，所述AOI针对PCB板导通孔位置进行检测。
作为本申请的一种改进，所述自动喷墨机喷头与PCB板之间的距离为PCB板板厚+1.5—2mm。
作为本申请的一种改进，所述自动喷墨机喷头直径为0.1-0.15mm。
作为本申请的一种改进，所述自动喷墨机喷墨速度为4.0-4.2L/min。
作为本申请的一种改进，所述烘烤固化温度为50-60℃。
作为本申请的一种改进，所述烘烤固化时间为25-30min。
由上可知，应用本申请技术方案的有益效果如下：
第一，AOI可以对PCB板发黄部位进行精准检测，自动喷墨机根据AOI所传递的信号对PCB板进行喷墨；使用了AOI和自动喷墨结合的技术实现了对PCB板发黄区域进行精准补救。
第二，表面处理使PCB板表面整洁、无碎屑；只对PCB板导通孔进行检测是针对仅要求导通孔处无发黄，不要求PCB板导通孔外无发黄的质检标准，能减少检测时长。
第三，自动喷墨机喷头与PCB板之间的距离为PCB板板厚+1.5—2mm时，喷墨均匀、不溅射；自动喷墨机喷头直径为0.1-0.15mm，喷墨直径合适，一次即可；自动喷墨机喷墨速度为4.0-4.2L/min，墨水覆盖均匀；烘烤固化温度为50-60℃，不影响板材，烘干效率快；烘烤固化时间为25-30min，墨水固化完全。
综上所述，本申请一种PCB防焊塞孔方法工艺简单、避免油墨凸起、节省工时。
附图说明
图1为本申请PCB防焊塞孔方法的流程示意图。
具体实施方式
下面结合附图对本申请的具体实施方式作进一步说明。在此需要说明的是，对于下述实施方式的说明用于帮忙理解申请，但并不构成对本申请的限定。
图1示出了本申请公开的一种PCB防焊塞孔方法，首先对发黄的PCB板进行AOI检测，由AOI判断PCB板发黄程度以及发黄位置，将信号传送到自动喷墨机上，自动喷墨机根据AOI所传送信号对发黄位置进行精准喷墨，最后对PCB板进行烘烤固化。
在上述一种技术方案中，AOI可以对PCB板发黄部位进行精准检测，自动喷墨机根据AOI所传递的信号对PCB板进行喷墨；使用了AOI和自动喷墨结合的技术实现了对PCB板发黄区域进行精准补救。
作为本申请的优选方案，烘烤固化完成后，再对PCB板进行表面处理。
作为本申请的优选方案，AOI针对PCB板导通孔位置进行检测。
作为本申请的优选方案，自动喷墨机喷头与PCB板之间的距离为PCB板板厚+1.5—2mm。
作为本申请的优选方案，自动喷墨机喷头直径为0.1-0.15mm。
作为本申请的优选方案，自动喷墨机喷墨速度为4.0-4.2L/min。
作为本申请的优选方案，烘烤固化温度为50-60℃。
作为本申请的优选方案，烘烤固化时间为25-30min。
在本实施例中，由于客户要求，导通孔处不允许出现发黄(露铜)，线路、板面发黄不超过4处，所以AOI对PCB板整体进行检测，由AOI判断PCB板发黄程度以及发黄位置，将信号传送到自动喷墨机上，自动喷墨机根据AOI所传送发黄程度以及发黄位置调整自动喷墨机的喷墨速度、喷墨间距，对PCB板进行精准喷墨，然后对PCB板进行烘烤固化，将油墨烘干；最后对PCB板表面进行吹风处理；其中自动喷墨机喷头与PCB板之间的距离为PCB板板厚+1.5mm，自动喷墨机喷头直径为0.1mm，自动喷墨机喷墨速度为4.2L/min，烘烤固化温度为50℃，烘烤固化时间为30min。
在本申请中，AOI对PCB板进行检测具体根据客户对PCB板的要求设定，不进行具体限定。
综上所述，本申请一种PCB防焊塞孔方法工艺简单、避免油墨凸起、节省工时。
以上所述仅为本申请的优选实施方式而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本实用申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (8)

  1. 一种PCB防焊塞孔方法，其特征在于，首先对发黄的PCB板进行AOI检测，由AOI判断PCB板发黄程度以及发黄位置，将信号传送到自动喷墨机上，自动喷墨机根据AOI所传送信号对发黄位置进行喷墨，最后对PCB板进行烘烤固化。
  2. 如权利要求1所述的一种PCB防焊塞孔方法，其特征在于，所述烘烤固化完成后，再对PCB板进行表面处理。
  3. 如权利要求1所述的一种PCB防焊塞孔方法，其特征在于，所述AOI针对PCB板导通孔位置进行检测。
  4. 如权利要求1所述的一种PCB防焊塞孔方法，其特征在于，所述自动喷墨机喷头与PCB板之间的距离为PCB板板厚+1.5—2mm。
  5. 如权利要求1所述的一种PCB防焊塞孔方法，其特征在于，所述自动喷墨机喷头直径为0.1-0.15mm。
  6. 如权利要求3所述的一种PCB防焊塞孔方法，其特征在于，所述自动喷墨机喷墨速度为4.0-4.2L/min。
  7. 如权利要求1所述的一种PCB防焊塞孔方法，其特征在于，所述烘烤固化温度为50-60℃。
  8. 如权利要求1所述的一种PCB防焊塞孔方法，其特征在于，所述烘烤固化时间为25-30min。
PCT/CN2021/128787 2020-11-04 2021-11-04 一种pcb防焊塞孔方法 WO2022095937A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN112739001A (zh) * 2020-11-04 2021-04-30 智恩电子(大亚湾)有限公司 一种pcb防焊塞孔方法
CN113382542B (zh) * 2021-05-14 2022-11-08 深圳市博敏电子有限公司 一种树脂塞孔板自动补树脂的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008066786A2 (en) * 2006-11-27 2008-06-05 Raytheon Company Method for manufacturing printed circuit boards
CN102576405A (zh) * 2009-07-06 2012-07-11 卡姆特有限公司 阻焊层检查的系统和方法
CN107367682A (zh) * 2017-06-26 2017-11-21 王俊 印制电路板检修方法及系统
CN208708022U (zh) * 2018-07-27 2019-04-05 深圳市深逸通电子有限公司 一种喷墨式树脂塞孔机构
CN110678003A (zh) * 2019-10-18 2020-01-10 深圳劲鑫科技有限公司 Pcb阻焊检测修补一体机及工艺方法
CN211047434U (zh) * 2019-10-18 2020-07-17 深圳劲鑫科技有限公司 一种pcb板阻焊膜检测修补一体机
CN112739001A (zh) * 2020-11-04 2021-04-30 智恩电子(大亚湾)有限公司 一种pcb防焊塞孔方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW594901B (en) * 2003-02-27 2004-06-21 Chi Mei Optoelectronics Corp Method for detecting and repairing defects
CN108207092A (zh) * 2017-12-29 2018-06-26 江苏弘信华印电路科技有限公司 改善刚挠结合板激光揭盖切伤挠性板的制作工艺
CN111707678B (zh) * 2020-07-24 2024-01-26 深圳芯通互联科技有限公司 一种pcb系统检测方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008066786A2 (en) * 2006-11-27 2008-06-05 Raytheon Company Method for manufacturing printed circuit boards
CN102576405A (zh) * 2009-07-06 2012-07-11 卡姆特有限公司 阻焊层检查的系统和方法
CN107367682A (zh) * 2017-06-26 2017-11-21 王俊 印制电路板检修方法及系统
CN208708022U (zh) * 2018-07-27 2019-04-05 深圳市深逸通电子有限公司 一种喷墨式树脂塞孔机构
CN110678003A (zh) * 2019-10-18 2020-01-10 深圳劲鑫科技有限公司 Pcb阻焊检测修补一体机及工艺方法
CN211047434U (zh) * 2019-10-18 2020-07-17 深圳劲鑫科技有限公司 一种pcb板阻焊膜检测修补一体机
CN112739001A (zh) * 2020-11-04 2021-04-30 智恩电子(大亚湾)有限公司 一种pcb防焊塞孔方法

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