WO2022176931A1 - 測定装置 - Google Patents

測定装置 Download PDF

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Publication number
WO2022176931A1
WO2022176931A1 PCT/JP2022/006272 JP2022006272W WO2022176931A1 WO 2022176931 A1 WO2022176931 A1 WO 2022176931A1 JP 2022006272 W JP2022006272 W JP 2022006272W WO 2022176931 A1 WO2022176931 A1 WO 2022176931A1
Authority
WO
WIPO (PCT)
Prior art keywords
measuring
section
measured
disc
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/006272
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
信夫 中澤
和則 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Kitagawa Gress Tech Co Ltd
Original Assignee
System Seiko Co Ltd
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by System Seiko Co Ltd, Toyo Kohan Co Ltd filed Critical System Seiko Co Ltd
Priority to CN202280013719.1A priority Critical patent/CN116917690A/zh
Publication of WO2022176931A1 publication Critical patent/WO2022176931A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces

Definitions

  • the posture of the disk 10 may become unstable.
  • the orientation of the disc 10 is changed in advance in the entry-side transfer section 51 and the exit-side transfer section 52, and the disc is transferred to the A-surface measurement section 23 and the B-surface measurement section 33 while maintaining the same orientation. handing over. Therefore, the influence of deflection due to its own weight can be suppressed, the posture of the object to be measured when attached to the A-surface measuring section 23 or the B-surface measuring section 33 can be stabilized, and more accurate measurement can be performed.
  • the conveyed disc 10 is transferred from the disc holding portion 43 to the entry-side transfer portion 51 of the first transfer portion 22.
  • the disc 10 is tilted, for example, from the vertical direction. It is held by the entry-side transfer section 51 of the first transfer section 22 after being converted into a 5° tilted posture.
  • the A-side measuring unit 23 and the B-side measuring unit 33 are arranged to face each other, so that the arrangement space for the components of the measuring device 20 is reduced. The effect that the device 20 can be made compact can be obtained.
  • the measuring apparatus 20A may be configured to have a structure in which the A-plane measuring section 23 and the B-plane measuring section 33 are arranged in parallel in the same direction, and the A-plane measuring section 23 and the B-plane measuring section 33 may be oriented in the same direction.
  • the measuring device 20B may have a structure in which they are arranged in parallel in different directions.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
PCT/JP2022/006272 2021-02-18 2022-02-16 測定装置 Ceased WO2022176931A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202280013719.1A CN116917690A (zh) 2021-02-18 2022-02-16 测量装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-024594 2021-02-18
JP2021024594A JP7689430B2 (ja) 2021-02-18 2021-02-18 測定装置

Publications (1)

Publication Number Publication Date
WO2022176931A1 true WO2022176931A1 (ja) 2022-08-25

Family

ID=82932258

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/006272 Ceased WO2022176931A1 (ja) 2021-02-18 2022-02-16 測定装置

Country Status (4)

Country Link
JP (1) JP7689430B2 (https=)
CN (1) CN116917690A (https=)
TW (1) TWI904335B (https=)
WO (1) WO2022176931A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119334305A (zh) * 2024-12-20 2025-01-21 临沂龙成塑业有限公司 一种聚氯乙烯塑膜表面平整度检测装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0540018A (ja) * 1991-08-06 1993-02-19 Idemitsu Petrochem Co Ltd 円盤厚み測定器
US5511005A (en) * 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system
JP2001108426A (ja) * 1999-10-12 2001-04-20 Toovan Kogyo Kk 非接触式歪検査装置
JP2007057502A (ja) * 2005-08-26 2007-03-08 Toshiba Mach Co Ltd 基板の両面形状測定システム
JP2016095276A (ja) * 2014-11-17 2016-05-26 株式会社神戸製鋼所 形状測定装置
US20200041248A1 (en) * 2018-08-02 2020-02-06 Corning Incorporated Systems for and methods of measuring photomask flatness with reduced gravity-induced error

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006078025A1 (ja) * 2005-01-24 2006-07-27 Nikon Corporation 計測方法、計測システム、検査方法、検査システム、露光方法及び露光システム
JP4885154B2 (ja) * 2007-01-31 2012-02-29 国立大学法人東京工業大学 複数波長による表面形状の測定方法およびこれを用いた装置
TWI840811B (zh) * 2015-02-23 2024-05-01 日商尼康股份有限公司 基板處理系統及基板處理方法、以及元件製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0540018A (ja) * 1991-08-06 1993-02-19 Idemitsu Petrochem Co Ltd 円盤厚み測定器
US5511005A (en) * 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system
JP2001108426A (ja) * 1999-10-12 2001-04-20 Toovan Kogyo Kk 非接触式歪検査装置
JP2007057502A (ja) * 2005-08-26 2007-03-08 Toshiba Mach Co Ltd 基板の両面形状測定システム
JP2016095276A (ja) * 2014-11-17 2016-05-26 株式会社神戸製鋼所 形状測定装置
US20200041248A1 (en) * 2018-08-02 2020-02-06 Corning Incorporated Systems for and methods of measuring photomask flatness with reduced gravity-induced error

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119334305A (zh) * 2024-12-20 2025-01-21 临沂龙成塑业有限公司 一种聚氯乙烯塑膜表面平整度检测装置

Also Published As

Publication number Publication date
TWI904335B (zh) 2025-11-11
CN116917690A (zh) 2023-10-20
JP7689430B2 (ja) 2025-06-06
JP2022126489A (ja) 2022-08-30
TW202242338A (zh) 2022-11-01

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