JP7689430B2 - 測定装置 - Google Patents

測定装置 Download PDF

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Publication number
JP7689430B2
JP7689430B2 JP2021024594A JP2021024594A JP7689430B2 JP 7689430 B2 JP7689430 B2 JP 7689430B2 JP 2021024594 A JP2021024594 A JP 2021024594A JP 2021024594 A JP2021024594 A JP 2021024594A JP 7689430 B2 JP7689430 B2 JP 7689430B2
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Japan
Prior art keywords
disk
measuring
section
measured
unit
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JP2021024594A
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English (en)
Japanese (ja)
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JP2022126489A5 (https=
JP2022126489A (ja
Inventor
信夫 中澤
和則 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
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Toyo Kohan Co Ltd
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Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Priority to JP2021024594A priority Critical patent/JP7689430B2/ja
Priority to CN202280013719.1A priority patent/CN116917690A/zh
Priority to PCT/JP2022/006272 priority patent/WO2022176931A1/ja
Priority to TW111106026A priority patent/TWI904335B/zh
Publication of JP2022126489A publication Critical patent/JP2022126489A/ja
Publication of JP2022126489A5 publication Critical patent/JP2022126489A5/ja
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Publication of JP7689430B2 publication Critical patent/JP7689430B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
JP2021024594A 2021-02-18 2021-02-18 測定装置 Active JP7689430B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021024594A JP7689430B2 (ja) 2021-02-18 2021-02-18 測定装置
CN202280013719.1A CN116917690A (zh) 2021-02-18 2022-02-16 测量装置
PCT/JP2022/006272 WO2022176931A1 (ja) 2021-02-18 2022-02-16 測定装置
TW111106026A TWI904335B (zh) 2021-02-18 2022-02-18 測定裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021024594A JP7689430B2 (ja) 2021-02-18 2021-02-18 測定装置

Publications (3)

Publication Number Publication Date
JP2022126489A JP2022126489A (ja) 2022-08-30
JP2022126489A5 JP2022126489A5 (https=) 2023-10-30
JP7689430B2 true JP7689430B2 (ja) 2025-06-06

Family

ID=82932258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021024594A Active JP7689430B2 (ja) 2021-02-18 2021-02-18 測定装置

Country Status (4)

Country Link
JP (1) JP7689430B2 (https=)
CN (1) CN116917690A (https=)
TW (1) TWI904335B (https=)
WO (1) WO2022176931A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119334305B (zh) * 2024-12-20 2025-03-11 临沂龙成塑业有限公司 一种聚氯乙烯塑膜表面平整度检测装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001108426A (ja) 1999-10-12 2001-04-20 Toovan Kogyo Kk 非接触式歪検査装置
JP2007057502A (ja) 2005-08-26 2007-03-08 Toshiba Mach Co Ltd 基板の両面形状測定システム
JP2016095276A (ja) 2014-11-17 2016-05-26 株式会社神戸製鋼所 形状測定装置
US20200041248A1 (en) 2018-08-02 2020-02-06 Corning Incorporated Systems for and methods of measuring photomask flatness with reduced gravity-induced error

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0540018A (ja) * 1991-08-06 1993-02-19 Idemitsu Petrochem Co Ltd 円盤厚み測定器
US5511005A (en) * 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system
WO2006078025A1 (ja) * 2005-01-24 2006-07-27 Nikon Corporation 計測方法、計測システム、検査方法、検査システム、露光方法及び露光システム
JP4885154B2 (ja) * 2007-01-31 2012-02-29 国立大学法人東京工業大学 複数波長による表面形状の測定方法およびこれを用いた装置
TWI840811B (zh) * 2015-02-23 2024-05-01 日商尼康股份有限公司 基板處理系統及基板處理方法、以及元件製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001108426A (ja) 1999-10-12 2001-04-20 Toovan Kogyo Kk 非接触式歪検査装置
JP2007057502A (ja) 2005-08-26 2007-03-08 Toshiba Mach Co Ltd 基板の両面形状測定システム
JP2016095276A (ja) 2014-11-17 2016-05-26 株式会社神戸製鋼所 形状測定装置
US20200041248A1 (en) 2018-08-02 2020-02-06 Corning Incorporated Systems for and methods of measuring photomask flatness with reduced gravity-induced error

Also Published As

Publication number Publication date
WO2022176931A1 (ja) 2022-08-25
TWI904335B (zh) 2025-11-11
CN116917690A (zh) 2023-10-20
JP2022126489A (ja) 2022-08-30
TW202242338A (zh) 2022-11-01

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