TWI904335B - 測定裝置 - Google Patents

測定裝置

Info

Publication number
TWI904335B
TWI904335B TW111106026A TW111106026A TWI904335B TW I904335 B TWI904335 B TW I904335B TW 111106026 A TW111106026 A TW 111106026A TW 111106026 A TW111106026 A TW 111106026A TW I904335 B TWI904335 B TW I904335B
Authority
TW
Taiwan
Prior art keywords
measuring
conveying
disc
aforementioned
unit
Prior art date
Application number
TW111106026A
Other languages
English (en)
Chinese (zh)
Other versions
TW202242338A (zh
Inventor
中澤信夫
木村和則
Original Assignee
日商東洋鋼鈑股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東洋鋼鈑股份有限公司 filed Critical 日商東洋鋼鈑股份有限公司
Publication of TW202242338A publication Critical patent/TW202242338A/zh
Application granted granted Critical
Publication of TWI904335B publication Critical patent/TWI904335B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
TW111106026A 2021-02-18 2022-02-18 測定裝置 TWI904335B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-024594 2021-02-18
JP2021024594A JP7689430B2 (ja) 2021-02-18 2021-02-18 測定装置

Publications (2)

Publication Number Publication Date
TW202242338A TW202242338A (zh) 2022-11-01
TWI904335B true TWI904335B (zh) 2025-11-11

Family

ID=82932258

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111106026A TWI904335B (zh) 2021-02-18 2022-02-18 測定裝置

Country Status (4)

Country Link
JP (1) JP7689430B2 (https=)
CN (1) CN116917690A (https=)
TW (1) TWI904335B (https=)
WO (1) WO2022176931A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119334305B (zh) * 2024-12-20 2025-03-11 临沂龙成塑业有限公司 一种聚氯乙烯塑膜表面平整度检测装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0540018A (ja) * 1991-08-06 1993-02-19 Idemitsu Petrochem Co Ltd 円盤厚み測定器
TW200644078A (en) * 2005-01-24 2006-12-16 Nikon Corp Measurement method, measurement system, inspection method, inspection system, exposure method, and exposure system
JP2007057502A (ja) * 2005-08-26 2007-03-08 Toshiba Mach Co Ltd 基板の両面形状測定システム
TW200839177A (en) * 2007-01-31 2008-10-01 Tokyo Inst Tech A measurement method of surface shape with plural wavelengths and an apparatus using the same method
TW202041980A (zh) * 2015-02-23 2020-11-16 日商尼康股份有限公司 基板處理系統及基板處理方法、以及元件製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5511005A (en) * 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system
JP2001108426A (ja) 1999-10-12 2001-04-20 Toovan Kogyo Kk 非接触式歪検査装置
JP6301815B2 (ja) 2014-11-17 2018-03-28 株式会社神戸製鋼所 形状測定装置
KR102735767B1 (ko) 2018-08-02 2024-11-28 코닝 인코포레이티드 중력으로 인한 에러가 감소된 포토마스크의 평탄도를 측정하는 시스템 및 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0540018A (ja) * 1991-08-06 1993-02-19 Idemitsu Petrochem Co Ltd 円盤厚み測定器
TW200644078A (en) * 2005-01-24 2006-12-16 Nikon Corp Measurement method, measurement system, inspection method, inspection system, exposure method, and exposure system
JP2007057502A (ja) * 2005-08-26 2007-03-08 Toshiba Mach Co Ltd 基板の両面形状測定システム
TW200839177A (en) * 2007-01-31 2008-10-01 Tokyo Inst Tech A measurement method of surface shape with plural wavelengths and an apparatus using the same method
TW202041980A (zh) * 2015-02-23 2020-11-16 日商尼康股份有限公司 基板處理系統及基板處理方法、以及元件製造方法

Also Published As

Publication number Publication date
WO2022176931A1 (ja) 2022-08-25
CN116917690A (zh) 2023-10-20
JP7689430B2 (ja) 2025-06-06
JP2022126489A (ja) 2022-08-30
TW202242338A (zh) 2022-11-01

Similar Documents

Publication Publication Date Title
TWI532663B (zh) 用於多個晶圓型工件的緩衝儲存的裝置和方法
TWI904335B (zh) 測定裝置
US7850817B2 (en) Polishing device and substrate processing device
KR102944323B1 (ko) 기판 가공 장치, 기판 처리 시스템 및 기판 처리 방법
JP6758247B2 (ja) 洗浄装置および基板処理装置、洗浄装置のメンテナンス方法、並びにプログラム
JP2019083302A (ja) ウエハ洗浄装置およびウエハ洗浄方法
TWI819165B (zh) 基板處理裝置及基板處理方法
JP7529408B2 (ja) 加工装置
CN114695227A (zh) 一种载台系统及采用该载台系统的晶圆驱动方法
EP1707309B1 (en) Lens stock device and lens processing system with the same
JP7678967B2 (ja) ワーク処理システム
JPH07335718A (ja) ウエハキャリア装置
JP2006242676A (ja) 外径測定装置、及び測定子
JP2899911B2 (ja) 板状体移載方法及びその装置
JP2022126489A5 (https=)
CN116031191A (zh) 一种晶圆的夹持装置
JP6957102B2 (ja) 切削装置の基準位置検出方法
CN120055910B (zh) 磨抛方法、系统及磨抛设备
JP4488729B2 (ja) 厚み計測装置及び研削装置
CN214152857U (zh) 一种晶圆导片用的辅助系统
JPH1177461A (ja) 切削装置
CN118664423B (zh) 法兰加工自动化设备
JP2020104240A (ja) 移載機及びベベル研磨装置
TWI892588B (zh) 治具校正方法及作業設備
JPH0463670A (ja) 研摩方法及び装置