WO2022163191A1 - 樹脂被覆超薄板ガラス - Google Patents
樹脂被覆超薄板ガラス Download PDFInfo
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- WO2022163191A1 WO2022163191A1 PCT/JP2021/046480 JP2021046480W WO2022163191A1 WO 2022163191 A1 WO2022163191 A1 WO 2022163191A1 JP 2021046480 W JP2021046480 W JP 2021046480W WO 2022163191 A1 WO2022163191 A1 WO 2022163191A1
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- WIPO (PCT)
- Prior art keywords
- resin
- thin glass
- organic film
- ultra
- coated ultra
- Prior art date
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- 229920005989 resin Polymers 0.000 title claims abstract description 187
- 239000011347 resin Substances 0.000 title claims abstract description 187
- 239000011521 glass Substances 0.000 title claims abstract description 136
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims abstract description 81
- 239000000203 mixture Substances 0.000 claims abstract description 74
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 35
- -1 acrylate compound Chemical class 0.000 claims description 80
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 35
- 239000007787 solid Substances 0.000 claims description 26
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 6
- 239000000872 buffer Substances 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 34
- 239000004094 surface-active agent Substances 0.000 description 38
- 239000002904 solvent Substances 0.000 description 36
- 238000000034 method Methods 0.000 description 34
- 150000001875 compounds Chemical class 0.000 description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 25
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 23
- 238000011156 evaluation Methods 0.000 description 23
- 239000003505 polymerization initiator Substances 0.000 description 23
- 229910052726 zirconium Inorganic materials 0.000 description 23
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 20
- 239000000243 solution Substances 0.000 description 20
- 125000004432 carbon atom Chemical group C* 0.000 description 19
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 19
- 229910052731 fluorine Inorganic materials 0.000 description 18
- 125000003566 oxetanyl group Chemical group 0.000 description 18
- 239000005357 flat glass Substances 0.000 description 17
- 239000010410 layer Substances 0.000 description 17
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 16
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 15
- 239000011737 fluorine Substances 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 238000004132 cross linking Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 125000000217 alkyl group Chemical group 0.000 description 12
- 238000006460 hydrolysis reaction Methods 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000003112 inhibitor Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 8
- 238000009835 boiling Methods 0.000 description 8
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 8
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 8
- 229940093858 ethyl acetoacetate Drugs 0.000 description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 7
- 239000003963 antioxidant agent Substances 0.000 description 7
- 125000004429 atom Chemical group 0.000 description 7
- 239000006059 cover glass Substances 0.000 description 7
- 239000003999 initiator Substances 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 6
- GQCZPFJGIXHZMB-UHFFFAOYSA-N 1-tert-Butoxy-2-propanol Chemical compound CC(O)COC(C)(C)C GQCZPFJGIXHZMB-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- 239000007983 Tris buffer Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 6
- 239000013522 chelant Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000006482 condensation reaction Methods 0.000 description 6
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 6
- XAOGXQMKWQFZEM-UHFFFAOYSA-N isoamyl propanoate Chemical compound CCC(=O)OCCC(C)C XAOGXQMKWQFZEM-UHFFFAOYSA-N 0.000 description 6
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000005341 toughened glass Substances 0.000 description 6
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 5
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000003377 acid catalyst Substances 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 5
- 239000012965 benzophenone Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 229940093499 ethyl acetate Drugs 0.000 description 5
- 235000019439 ethyl acetate Nutrition 0.000 description 5
- 230000003301 hydrolyzing effect Effects 0.000 description 5
- XVTQAXXMUNXFMU-UHFFFAOYSA-N methyl 2-(3-oxo-2-pyridin-2-yl-1h-pyrazol-5-yl)acetate Chemical compound N1C(CC(=O)OC)=CC(=O)N1C1=CC=CC=N1 XVTQAXXMUNXFMU-UHFFFAOYSA-N 0.000 description 5
- 125000006299 oxetan-3-yl group Chemical group [H]C1([H])OC([H])([H])C1([H])* 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- DOVZUKKPYKRVIK-UHFFFAOYSA-N 1-methoxypropan-2-yl propanoate Chemical compound CCC(=O)OC(C)COC DOVZUKKPYKRVIK-UHFFFAOYSA-N 0.000 description 4
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 4
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000003759 ester based solvent Substances 0.000 description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 4
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 3
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 3
- LTMRRSWNXVJMBA-UHFFFAOYSA-L 2,2-diethylpropanedioate Chemical compound CCC(CC)(C([O-])=O)C([O-])=O LTMRRSWNXVJMBA-UHFFFAOYSA-L 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 3
- WOYWLLHHWAMFCB-UHFFFAOYSA-N 2-ethylhexyl acetate Chemical compound CCCCC(CC)COC(C)=O WOYWLLHHWAMFCB-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 3
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 3
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 241000501754 Astronotus ocellatus Species 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Natural products OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000001476 alcoholic effect Effects 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- 229940007550 benzyl acetate Drugs 0.000 description 3
- 229940043232 butyl acetate Drugs 0.000 description 3
- 239000005345 chemically strengthened glass Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 3
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 3
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229940116333 ethyl lactate Drugs 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 150000007974 melamines Chemical class 0.000 description 3
- 229940095102 methyl benzoate Drugs 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 3
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 3
- 150000002923 oximes Chemical class 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- OGHBATFHNDZKSO-UHFFFAOYSA-N propan-2-olate Chemical compound CC(C)[O-] OGHBATFHNDZKSO-UHFFFAOYSA-N 0.000 description 3
- 239000007870 radical polymerization initiator Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 2
- AMSDWLOANMAILF-UHFFFAOYSA-O 2-(1h-imidazol-3-ium-3-yl)ethanol Chemical compound OCC[NH+]1C=CN=C1 AMSDWLOANMAILF-UHFFFAOYSA-O 0.000 description 2
- HQLKZWRSOHTERR-UHFFFAOYSA-N 2-Ethylbutyl acetate Chemical compound CCC(CC)COC(C)=O HQLKZWRSOHTERR-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 2
- ZADOWCXTUZWAKL-UHFFFAOYSA-N 3-(3-trimethoxysilylpropyl)oxolane-2,5-dione Chemical compound CO[Si](OC)(OC)CCCC1CC(=O)OC1=O ZADOWCXTUZWAKL-UHFFFAOYSA-N 0.000 description 2
- BNDRWEVUODOUDW-UHFFFAOYSA-N 3-Hydroxy-3-methylbutan-2-one Chemical compound CC(=O)C(C)(C)O BNDRWEVUODOUDW-UHFFFAOYSA-N 0.000 description 2
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 2
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 2
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- BWGVNBUKYGTDLS-UHFFFAOYSA-N O1CC(C1)C(C1COC1)(C1COC1)[SiH2]OCCC Chemical compound O1CC(C1)C(C1COC1)(C1COC1)[SiH2]OCCC BWGVNBUKYGTDLS-UHFFFAOYSA-N 0.000 description 2
- HTWVYSONCMBOMO-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OCCC)C Chemical compound O1CC(C1)C(C1COC1)[SiH](OCCC)C HTWVYSONCMBOMO-UHFFFAOYSA-N 0.000 description 2
- FZZBMTWWAYFEBF-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OCCC)C1=CC=CC=C1 Chemical compound O1CC(C1)C(C1COC1)[SiH](OCCC)C1=CC=CC=C1 FZZBMTWWAYFEBF-UHFFFAOYSA-N 0.000 description 2
- PDEKVCAHENNRSR-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OCCC)CC Chemical compound O1CC(C1)C(C1COC1)[SiH](OCCC)CC PDEKVCAHENNRSR-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- HVUMOYIDDBPOLL-XWVZOOPGSA-N Sorbitan monostearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O HVUMOYIDDBPOLL-XWVZOOPGSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- FVQVTTMDOISRDX-UHFFFAOYSA-J [Zr+4].CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC Chemical compound [Zr+4].CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC FVQVTTMDOISRDX-UHFFFAOYSA-J 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 229940022663 acetate Drugs 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- IKHOZNOYZQPPCK-UHFFFAOYSA-K aluminum;4,4-diethyl-3-oxohexanoate Chemical compound [Al+3].CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O IKHOZNOYZQPPCK-UHFFFAOYSA-K 0.000 description 2
- BTBJBAZGXNKLQC-UHFFFAOYSA-N ammonium lauryl sulfate Chemical compound [NH4+].CCCCCCCCCCCCOS([O-])(=O)=O BTBJBAZGXNKLQC-UHFFFAOYSA-N 0.000 description 2
- 229940063953 ammonium lauryl sulfate Drugs 0.000 description 2
- 239000002280 amphoteric surfactant Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 229960003237 betaine Drugs 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- DAPPVOWTHPTRGQ-UHFFFAOYSA-K bis[(4,4-dimethyl-3-oxopentanoyl)oxy]alumanyl 4,4-dimethyl-3-oxopentanoate Chemical compound CC(C(CC(=O)[O-])=O)(C)C.[Al+3].CC(C(CC(=O)[O-])=O)(C)C.CC(C(CC(=O)[O-])=O)(C)C DAPPVOWTHPTRGQ-UHFFFAOYSA-K 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 238000003426 chemical strengthening reaction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 150000001923 cyclic compounds Chemical class 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- CGZZMOTZOONQIA-UHFFFAOYSA-N cycloheptanone Chemical compound O=C1CCCCCC1 CGZZMOTZOONQIA-UHFFFAOYSA-N 0.000 description 2
- ATGKAFZFOALBOF-UHFFFAOYSA-N cyclohexyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C1CCCCC1 ATGKAFZFOALBOF-UHFFFAOYSA-N 0.000 description 2
- MEWFSXFFGFDHGV-UHFFFAOYSA-N cyclohexyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C1CCCCC1 MEWFSXFFGFDHGV-UHFFFAOYSA-N 0.000 description 2
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 2
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 2
- VSYLGGHSEIWGJV-UHFFFAOYSA-N diethyl(dimethoxy)silane Chemical compound CC[Si](CC)(OC)OC VSYLGGHSEIWGJV-UHFFFAOYSA-N 0.000 description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 2
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 2
- SYELZBGXAIXKHU-UHFFFAOYSA-N dodecyldimethylamine N-oxide Chemical compound CCCCCCCCCCCC[N+](C)(C)[O-] SYELZBGXAIXKHU-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 125000002541 furyl group Chemical group 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000005453 ketone based solvent Substances 0.000 description 2
- 150000002596 lactones Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 2
- HLXDKGBELJJMHR-UHFFFAOYSA-N methyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](C)(OC(C)C)OC(C)C HLXDKGBELJJMHR-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000006606 n-butoxy group Chemical group 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- UPHWVVKYDQHTCF-UHFFFAOYSA-N octadecylazanium;acetate Chemical compound CC(O)=O.CCCCCCCCCCCCCCCCCCN UPHWVVKYDQHTCF-UHFFFAOYSA-N 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 2
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- LMHHRCOWPQNFTF-UHFFFAOYSA-N s-propan-2-yl azepane-1-carbothioate Chemical compound CC(C)SC(=O)N1CCCCCC1 LMHHRCOWPQNFTF-UHFFFAOYSA-N 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 239000001587 sorbitan monostearate Substances 0.000 description 2
- 235000011076 sorbitan monostearate Nutrition 0.000 description 2
- 229940035048 sorbitan monostearate Drugs 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 125000005504 styryl group Chemical group 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 125000001544 thienyl group Chemical group 0.000 description 2
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 2
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- 150000003672 ureas Chemical class 0.000 description 2
- DJIFSIBYHXVGSS-UHFFFAOYSA-J zirconium(4+);tetraphenoxide Chemical compound [Zr+4].[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1 DJIFSIBYHXVGSS-UHFFFAOYSA-J 0.000 description 2
- BKQXXLVXLSREHB-UHFFFAOYSA-N (1,3-dioxobenzo[de]isoquinolin-2-yl) 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)ON(C1=O)C(=O)C2=C3C1=CC=CC3=CC=C2 BKQXXLVXLSREHB-UHFFFAOYSA-N 0.000 description 1
- LWHOMMCIJIJIGV-UHFFFAOYSA-N (1,3-dioxobenzo[de]isoquinolin-2-yl) trifluoromethanesulfonate Chemical compound C1=CC(C(N(OS(=O)(=O)C(F)(F)F)C2=O)=O)=C3C2=CC=CC3=C1 LWHOMMCIJIJIGV-UHFFFAOYSA-N 0.000 description 1
- BXUXSXCCCXEWLQ-UHFFFAOYSA-M (4-acetyloxyphenyl)-dimethylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C[S+](C)C1=CC=C(OC(C)=O)C=C1 BXUXSXCCCXEWLQ-UHFFFAOYSA-M 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- NVFDHSAAXWUULH-UHFFFAOYSA-N (4-hydroxyphenyl)-dimethylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C[S+](C)C1=CC=C(O)C=C1 NVFDHSAAXWUULH-UHFFFAOYSA-N 0.000 description 1
- UVHRTARARHMINK-UHFFFAOYSA-N (4-hydroxyphenyl)methyl-[(2-methylphenyl)methyl]sulfanium trifluoromethanesulfonate Chemical compound S(=O)(=O)(C(F)(F)F)[O-].CC1=C(C[SH+]CC2=CC=C(C=C2)O)C=CC=C1 UVHRTARARHMINK-UHFFFAOYSA-N 0.000 description 1
- OXMQIZSDZOTXOY-UHFFFAOYSA-M (4-methoxycarbonyloxyphenyl)-dimethylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.COC(=O)OC1=CC=C([S+](C)C)C=C1 OXMQIZSDZOTXOY-UHFFFAOYSA-M 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- IFPMZBBHBZQTOV-UHFFFAOYSA-N 1,3,5-trinitro-2-(2,4,6-trinitrophenyl)-4-[2,4,6-trinitro-3-(2,4,6-trinitrophenyl)phenyl]benzene Chemical compound [O-][N+](=O)C1=CC([N+](=O)[O-])=CC([N+]([O-])=O)=C1C1=C([N+]([O-])=O)C=C([N+]([O-])=O)C(C=2C(=C(C=3C(=CC(=CC=3[N+]([O-])=O)[N+]([O-])=O)[N+]([O-])=O)C(=CC=2[N+]([O-])=O)[N+]([O-])=O)[N+]([O-])=O)=C1[N+]([O-])=O IFPMZBBHBZQTOV-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- YQJPWWLJDNCSCN-UHFFFAOYSA-N 1,3-diphenyltetramethyldisiloxane Chemical compound C=1C=CC=CC=1[Si](C)(C)O[Si](C)(C)C1=CC=CC=C1 YQJPWWLJDNCSCN-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- UVFAJUBGAKFZEF-UHFFFAOYSA-N 1-[4-(2-phenylethylsulfanyl)phenoxy]ethylideneoxidanium trifluoromethanesulfonate Chemical compound S(=O)(=O)(C(F)(F)F)[O-].C(C)(=O)OC1=CC=C(C=C1)[SH+]CCC1=CC=CC=C1 UVFAJUBGAKFZEF-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- GVJSGABMOHZNSD-UHFFFAOYSA-N 1-triphenylsilylethanone Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C(=O)C)C1=CC=CC=C1 GVJSGABMOHZNSD-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- CLDZVCMRASJQFO-UHFFFAOYSA-N 2,5-bis(2,4,4-trimethylpentan-2-yl)benzene-1,4-diol Chemical compound CC(C)(C)CC(C)(C)C1=CC(O)=C(C(C)(C)CC(C)(C)C)C=C1O CLDZVCMRASJQFO-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- LEVFXWNQQSSNAC-UHFFFAOYSA-N 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexoxyphenol Chemical compound OC1=CC(OCCCCCC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 LEVFXWNQQSSNAC-UHFFFAOYSA-N 0.000 description 1
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 1
- VQMHSKWEJGIXGA-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-dodecyl-4-methylphenol Chemical compound CCCCCCCCCCCCC1=CC(C)=CC(N2N=C3C=CC=CC3=N2)=C1O VQMHSKWEJGIXGA-UHFFFAOYSA-N 0.000 description 1
- FJGQBLRYBUAASW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)phenol Chemical compound OC1=CC=CC=C1N1N=C2C=CC=CC2=N1 FJGQBLRYBUAASW-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- VCYCUECVHJJFIQ-UHFFFAOYSA-N 2-[3-(benzotriazol-2-yl)-4-hydroxyphenyl]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 VCYCUECVHJJFIQ-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- KRBZSCWNFQRJOU-UHFFFAOYSA-N 2-butoxyethyl 3-oxobutanoate;zirconium Chemical compound [Zr].CCCCOCCOC(=O)CC(C)=O KRBZSCWNFQRJOU-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- GXDMUOPCQNLBCZ-UHFFFAOYSA-N 3-(3-triethoxysilylpropyl)oxolane-2,5-dione Chemical compound CCO[Si](OCC)(OCC)CCCC1CC(=O)OC1=O GXDMUOPCQNLBCZ-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- UDWIZRDPCQAYRF-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C=C UDWIZRDPCQAYRF-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- NTKBNCABAMQDIG-UHFFFAOYSA-N 3-butoxypropan-1-ol Chemical compound CCCCOCCCO NTKBNCABAMQDIG-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- JHEXHONJLZFOFQ-UHFFFAOYSA-N 4-(benzylsulfanylmethyl)phenol trifluoromethanesulfonic acid Chemical compound [O-]S(=O)(=O)C(F)(F)F.Oc1ccc(C[SH+]Cc2ccccc2)cc1 JHEXHONJLZFOFQ-UHFFFAOYSA-N 0.000 description 1
- VVSRECWZBBJOTG-UHFFFAOYSA-N 4-Hydroxy-3-methyl-2-butanone Chemical compound OCC(C)C(C)=O VVSRECWZBBJOTG-UHFFFAOYSA-N 0.000 description 1
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 1
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 description 1
- JSHPTIGHEWEXRW-UHFFFAOYSA-N 5-hydroxypentan-2-one Chemical compound CC(=O)CCCO JSHPTIGHEWEXRW-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- FIPWRIJSWJWJAI-UHFFFAOYSA-N Butyl carbitol 6-propylpiperonyl ether Chemical compound C1=C(CCC)C(COCCOCCOCCCC)=CC2=C1OCO2 FIPWRIJSWJWJAI-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- RMCDHQBSSNUODT-UHFFFAOYSA-J CC(C(=O)[O-])C(=O)C(C)(C)C.[Zr+4].CC(C(=O)[O-])C(=O)C(C)(C)C.CC(C(=O)[O-])C(=O)C(C)(C)C.CC(C(=O)[O-])C(=O)C(C)(C)C Chemical compound CC(C(=O)[O-])C(=O)C(C)(C)C.[Zr+4].CC(C(=O)[O-])C(=O)C(C)(C)C.CC(C(=O)[O-])C(=O)C(C)(C)C.CC(C(=O)[O-])C(=O)C(C)(C)C RMCDHQBSSNUODT-UHFFFAOYSA-J 0.000 description 1
- SXNICUVVDOTUPD-UHFFFAOYSA-N CC1=CC(C)=CC(C)=C1C(=O)P(=O)C1=CC=CC=C1 Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)C1=CC=CC=C1 SXNICUVVDOTUPD-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 241000282575 Gorilla Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical group CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- GVRNHWLDAMJUEN-UHFFFAOYSA-N O1CC(C1)C(C)(O[SiH](CC)C)C1COC1 Chemical compound O1CC(C1)C(C)(O[SiH](CC)C)C1COC1 GVRNHWLDAMJUEN-UHFFFAOYSA-N 0.000 description 1
- HLUZDXHRDVCWKF-UHFFFAOYSA-N O1CC(C1)C(C1COC1)(C1COC1)CC(=O)O[SiH3] Chemical compound O1CC(C1)C(C1COC1)(C1COC1)CC(=O)O[SiH3] HLUZDXHRDVCWKF-UHFFFAOYSA-N 0.000 description 1
- BWGWCGPOTWRHSU-UHFFFAOYSA-N O1CC(C1)C(C1COC1)(C1COC1)[SiH2]OC Chemical compound O1CC(C1)C(C1COC1)(C1COC1)[SiH2]OC BWGWCGPOTWRHSU-UHFFFAOYSA-N 0.000 description 1
- URXLKRIDHFPMSU-UHFFFAOYSA-N O1CC(C1)C(C1COC1)(C1COC1)[SiH2]OCC Chemical compound O1CC(C1)C(C1COC1)(C1COC1)[SiH2]OCC URXLKRIDHFPMSU-UHFFFAOYSA-N 0.000 description 1
- DHISAIOPHWNNNS-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH2]OC(CC)=O Chemical compound O1CC(C1)C(C1COC1)[SiH2]OC(CC)=O DHISAIOPHWNNNS-UHFFFAOYSA-N 0.000 description 1
- UKBKKSRLYMHHOB-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH2]OC(CC1=CC=CC=C1)=O Chemical compound O1CC(C1)C(C1COC1)[SiH2]OC(CC1=CC=CC=C1)=O UKBKKSRLYMHHOB-UHFFFAOYSA-N 0.000 description 1
- UJTGSMOYEVTHOU-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH2]OC(CCC)=O Chemical compound O1CC(C1)C(C1COC1)[SiH2]OC(CCC)=O UJTGSMOYEVTHOU-UHFFFAOYSA-N 0.000 description 1
- YPNGTCAELNZBDV-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH2]OCC1=CC=CC=C1 Chemical compound O1CC(C1)C(C1COC1)[SiH2]OCC1=CC=CC=C1 YPNGTCAELNZBDV-UHFFFAOYSA-N 0.000 description 1
- ZYYUUOJANHLAAJ-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OC)C Chemical compound O1CC(C1)C(C1COC1)[SiH](OC)C ZYYUUOJANHLAAJ-UHFFFAOYSA-N 0.000 description 1
- LSCCYHNIFCYSBG-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OC)CC Chemical compound O1CC(C1)C(C1COC1)[SiH](OC)CC LSCCYHNIFCYSBG-UHFFFAOYSA-N 0.000 description 1
- RRKISGTWEPWSKT-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OC)OC Chemical compound O1CC(C1)C(C1COC1)[SiH](OC)OC RRKISGTWEPWSKT-UHFFFAOYSA-N 0.000 description 1
- KRXBGQOUACNZHC-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OCC)C Chemical compound O1CC(C1)C(C1COC1)[SiH](OCC)C KRXBGQOUACNZHC-UHFFFAOYSA-N 0.000 description 1
- JDWPXPCBWPYVNY-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OCC)OCC Chemical compound O1CC(C1)C(C1COC1)[SiH](OCC)OCC JDWPXPCBWPYVNY-UHFFFAOYSA-N 0.000 description 1
- XRXLGFZIFKCPAC-UHFFFAOYSA-N O1CC(C1)C(C1COC1)[SiH](OCCC)OCCC Chemical compound O1CC(C1)C(C1COC1)[SiH](OCCC)OCCC XRXLGFZIFKCPAC-UHFFFAOYSA-N 0.000 description 1
- YOTTZMPWTZSBAJ-UHFFFAOYSA-N O1CC(C1)C[Si](OC(C)=O)(OC(C)=O)C1=CC=CC=C1 Chemical compound O1CC(C1)C[Si](OC(C)=O)(OC(C)=O)C1=CC=CC=C1 YOTTZMPWTZSBAJ-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- WYWZRNAHINYAEF-UHFFFAOYSA-N Padimate O Chemical compound CCCCC(CC)COC(=O)C1=CC=C(N(C)C)C=C1 WYWZRNAHINYAEF-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 241000124033 Salix Species 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- BRHJUILQKFBMTL-UHFFFAOYSA-N [4,4-bis(dimethylamino)cyclohexa-1,5-dien-1-yl]-phenylmethanone Chemical compound C1=CC(N(C)C)(N(C)C)CC=C1C(=O)C1=CC=CC=C1 BRHJUILQKFBMTL-UHFFFAOYSA-N 0.000 description 1
- ASCFQVPXKDQFEW-UHFFFAOYSA-N [4-(benzylsulfanylmethyl)phenyl] methyl carbonate trifluoromethanesulfonic acid Chemical compound [O-]S(=O)(=O)C(F)(F)F.COC(=O)Oc1ccc(C[SH+]Cc2ccccc2)cc1 ASCFQVPXKDQFEW-UHFFFAOYSA-N 0.000 description 1
- QPEDLBMZHHQIQY-UHFFFAOYSA-N [acetyloxy-ethyl-(oxetan-3-ylmethyl)silyl] acetate Chemical compound O1CC(C1)C[Si](OC(C)=O)(OC(C)=O)CC QPEDLBMZHHQIQY-UHFFFAOYSA-N 0.000 description 1
- ZAWFBVPLAZNMHQ-UHFFFAOYSA-N [acetyloxy-methyl-(oxetan-3-ylmethyl)silyl] acetate Chemical compound O1CC(C1)C[Si](OC(C)=O)(OC(C)=O)C ZAWFBVPLAZNMHQ-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- LEGUOUDEJOAHPO-UHFFFAOYSA-N [diacetyloxy(oxetan-3-ylmethyl)silyl] acetate Chemical compound O1CC(C1)C[Si](OC(C)=O)(OC(C)=O)OC(C)=O LEGUOUDEJOAHPO-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- OSWRVYBYIGOAEZ-UHFFFAOYSA-N acetic acid;2-hydroxypropanoic acid Chemical class CC(O)=O.CC(O)C(O)=O OSWRVYBYIGOAEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- HJZCNLHTOYUECS-UHFFFAOYSA-N benzhydryloxymethylsilane Chemical compound C1(=CC=CC=C1)C(OC[SiH3])C1=CC=CC=C1 HJZCNLHTOYUECS-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- RFXODRCAZTVEOH-UHFFFAOYSA-N benzyl-ethoxy-dimethylsilane Chemical compound CCO[Si](C)(C)CC1=CC=CC=C1 RFXODRCAZTVEOH-UHFFFAOYSA-N 0.000 description 1
- FIQWLKKNIDPHPE-UHFFFAOYSA-N benzyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)CC1=CC=CC=C1 FIQWLKKNIDPHPE-UHFFFAOYSA-N 0.000 description 1
- 125000000051 benzyloxy group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])O* 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- FFOWIEZZYLIBTD-UHFFFAOYSA-N butan-2-olate zirconium(4+) Chemical compound CCC(C)O[Zr](OC(C)CC)(OC(C)CC)OC(C)CC FFOWIEZZYLIBTD-UHFFFAOYSA-N 0.000 description 1
- LLJNVGRIQKGYCB-UHFFFAOYSA-N butyl 3-oxohexaneperoxoate;zirconium Chemical compound [Zr].CCCCOOC(=O)CC(=O)CCC.CCCCOOC(=O)CC(=O)CCC LLJNVGRIQKGYCB-UHFFFAOYSA-N 0.000 description 1
- RYBVCZSZPZFJOK-UHFFFAOYSA-N butyl-[butyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound CCCC[Si](C)(C)O[Si](C)(C)CCCC RYBVCZSZPZFJOK-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- AONDIGWFVXEZGD-UHFFFAOYSA-N diacetyloxy(methyl)silicon Chemical compound CC(=O)O[Si](C)OC(C)=O AONDIGWFVXEZGD-UHFFFAOYSA-N 0.000 description 1
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 1
- FIWXQYYRYINJDX-UHFFFAOYSA-N diethoxy-(oxetan-3-ylmethyl)-phenylsilane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)CC1COC1 FIWXQYYRYINJDX-UHFFFAOYSA-N 0.000 description 1
- ZEORWOWLTRLPJP-UHFFFAOYSA-N diethoxy-ethyl-(oxetan-3-ylmethyl)silane Chemical compound CCO[Si](CC)(OCC)CC1COC1 ZEORWOWLTRLPJP-UHFFFAOYSA-N 0.000 description 1
- MNFGEHQPOWJJBH-UHFFFAOYSA-N diethoxy-methyl-phenylsilane Chemical compound CCO[Si](C)(OCC)C1=CC=CC=C1 MNFGEHQPOWJJBH-UHFFFAOYSA-N 0.000 description 1
- VKJWRHASAVFGPS-UHFFFAOYSA-N diethoxy-methyl-prop-2-enylsilane Chemical compound CCO[Si](C)(CC=C)OCC VKJWRHASAVFGPS-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- DRYYDJUMIYXWFL-UHFFFAOYSA-N dimethoxy-(oxetan-3-ylmethyl)-phenylsilane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)CC1COC1 DRYYDJUMIYXWFL-UHFFFAOYSA-N 0.000 description 1
- NHYFIJRXGOQNFS-UHFFFAOYSA-N dimethoxy-bis(2-methylpropyl)silane Chemical compound CC(C)C[Si](OC)(CC(C)C)OC NHYFIJRXGOQNFS-UHFFFAOYSA-N 0.000 description 1
- VHPUZTHRFWIGAW-UHFFFAOYSA-N dimethoxy-di(propan-2-yl)silane Chemical compound CO[Si](OC)(C(C)C)C(C)C VHPUZTHRFWIGAW-UHFFFAOYSA-N 0.000 description 1
- OATGZEGQSRQQQN-UHFFFAOYSA-N dimethoxy-methyl-(oxetan-3-ylmethyl)silane Chemical compound CO[Si](C)(OC)CC1COC1 OATGZEGQSRQQQN-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- WQTNGCZMPUCIEX-UHFFFAOYSA-N dimethoxy-methyl-prop-2-enylsilane Chemical compound CO[Si](C)(OC)CC=C WQTNGCZMPUCIEX-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- DFJDZTPFNSXNAX-UHFFFAOYSA-N ethoxy(triethyl)silane Chemical compound CCO[Si](CC)(CC)CC DFJDZTPFNSXNAX-UHFFFAOYSA-N 0.000 description 1
- RSIHJDGMBDPTIM-UHFFFAOYSA-N ethoxy(trimethyl)silane Chemical compound CCO[Si](C)(C)C RSIHJDGMBDPTIM-UHFFFAOYSA-N 0.000 description 1
- ZVJXKUWNRVOUTI-UHFFFAOYSA-N ethoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OCC)C1=CC=CC=C1 ZVJXKUWNRVOUTI-UHFFFAOYSA-N 0.000 description 1
- STBFUFDKXHQVMJ-UHFFFAOYSA-N ethoxy(tripropyl)silane Chemical compound CCC[Si](CCC)(CCC)OCC STBFUFDKXHQVMJ-UHFFFAOYSA-N 0.000 description 1
- ADLWTVQIBZEAGJ-UHFFFAOYSA-N ethoxy-methyl-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C)(OCC)C1=CC=CC=C1 ADLWTVQIBZEAGJ-UHFFFAOYSA-N 0.000 description 1
- XPKFLEVLLPKCIW-UHFFFAOYSA-N ethyl 4-(diethylamino)benzoate Chemical compound CCOC(=O)C1=CC=C(N(CC)CC)C=C1 XPKFLEVLLPKCIW-UHFFFAOYSA-N 0.000 description 1
- VXDAIMIDSARDRS-UHFFFAOYSA-N ethyl-(oxetan-3-ylmethyl)-dipropoxysilane Chemical compound O1CC(C1)C[Si](OCCC)(OCCC)CC VXDAIMIDSARDRS-UHFFFAOYSA-N 0.000 description 1
- LOVWJZGJINFVDQ-UHFFFAOYSA-N ethyl-dimethoxy-(oxetan-3-ylmethyl)silane Chemical compound CC[Si](OC)(OC)CC1COC1 LOVWJZGJINFVDQ-UHFFFAOYSA-N 0.000 description 1
- UKFXDFUAPNAMPJ-UHFFFAOYSA-N ethylmalonic acid Chemical compound CCC(C(O)=O)C(O)=O UKFXDFUAPNAMPJ-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000005400 gorilla glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical group OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- IOANYFLVSWZRND-UHFFFAOYSA-N hydroxy(tripropyl)silane Chemical compound CCC[Si](O)(CCC)CCC IOANYFLVSWZRND-UHFFFAOYSA-N 0.000 description 1
- XLSMFKSTNGKWQX-UHFFFAOYSA-N hydroxyacetone Chemical compound CC(=O)CO XLSMFKSTNGKWQX-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- FUMSHFZKHQOOIX-UHFFFAOYSA-N methoxy(tripropyl)silane Chemical compound CCC[Si](CCC)(CCC)OC FUMSHFZKHQOOIX-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- DRXHEPWCWBIQFJ-UHFFFAOYSA-N methyl(triphenoxy)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(C)OC1=CC=CC=C1 DRXHEPWCWBIQFJ-UHFFFAOYSA-N 0.000 description 1
- HHQPXGQTYPORHR-UHFFFAOYSA-N methyl-(oxetan-3-ylmethyl)-dipropoxysilane Chemical compound O1CC(C1)C[Si](OCCC)(OCCC)C HHQPXGQTYPORHR-UHFFFAOYSA-N 0.000 description 1
- RFGGTTPASBFBTB-UHFFFAOYSA-N methyl-[methyl(diphenyl)silyl]oxy-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C)O[Si](C)(C=1C=CC=CC=1)C1=CC=CC=C1 RFGGTTPASBFBTB-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- COFVRPWBLYEZQV-UHFFFAOYSA-N oxetan-3-ylmethyl(tripropoxy)silane Chemical compound O1CC(C1)C[Si](OCCC)(OCCC)OCCC COFVRPWBLYEZQV-UHFFFAOYSA-N 0.000 description 1
- CFPOWLUHTSWMNN-UHFFFAOYSA-N oxetan-3-ylmethyl-phenyl-dipropoxysilane Chemical compound O1CC(C1)C[Si](OCCC)(OCCC)C1=CC=CC=C1 CFPOWLUHTSWMNN-UHFFFAOYSA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 125000005004 perfluoroethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000005009 perfluoropropyl group Chemical group FC(C(C(F)(F)F)(F)F)(F)* 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- IKNCGYCHMGNBCP-UHFFFAOYSA-N propan-1-olate Chemical compound CCC[O-] IKNCGYCHMGNBCP-UHFFFAOYSA-N 0.000 description 1
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 1
- 150000003151 propanoic acid esters Chemical class 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007342 radical addition reaction Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- GYZQBXUDWTVJDF-UHFFFAOYSA-N tributoxy(methyl)silane Chemical compound CCCCO[Si](C)(OCCCC)OCCCC GYZQBXUDWTVJDF-UHFFFAOYSA-N 0.000 description 1
- MYWQGROTKMBNKN-UHFFFAOYSA-N tributoxyalumane Chemical compound [Al+3].CCCC[O-].CCCC[O-].CCCC[O-] MYWQGROTKMBNKN-UHFFFAOYSA-N 0.000 description 1
- JYVWRCIOZLRMKO-UHFFFAOYSA-N tributyl(hydroxy)silane Chemical compound CCCC[Si](O)(CCCC)CCCC JYVWRCIOZLRMKO-UHFFFAOYSA-N 0.000 description 1
- ALVYUZIFSCKIFP-UHFFFAOYSA-N triethoxy(2-methylpropyl)silane Chemical compound CCO[Si](CC(C)C)(OCC)OCC ALVYUZIFSCKIFP-UHFFFAOYSA-N 0.000 description 1
- ZLGWXNBXAXOQBG-UHFFFAOYSA-N triethoxy(3,3,3-trifluoropropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC(F)(F)F ZLGWXNBXAXOQBG-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- WIQOIEUAUQPZBD-UHFFFAOYSA-N triethoxy(oxetan-3-ylmethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC1COC1 WIQOIEUAUQPZBD-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- BOVWGKNFLVZRDU-UHFFFAOYSA-N triethoxy(trifluoromethyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)F BOVWGKNFLVZRDU-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- WVMSIBFANXCZKT-UHFFFAOYSA-N triethyl(hydroxy)silane Chemical compound CC[Si](O)(CC)CC WVMSIBFANXCZKT-UHFFFAOYSA-N 0.000 description 1
- AAURKQPZJJMXER-UHFFFAOYSA-N triethylsilyl acetate Chemical compound CC[Si](CC)(CC)OC(C)=O AAURKQPZJJMXER-UHFFFAOYSA-N 0.000 description 1
- BSECONLXOCDYBU-UHFFFAOYSA-N triethylsilyl benzoate Chemical compound CC[Si](CC)(CC)OC(=O)C1=CC=CC=C1 BSECONLXOCDYBU-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- NEQIHOVWPNMKMX-UHFFFAOYSA-N trimethoxy(oxetan-3-ylmethyl)silane Chemical compound CO[Si](OC)(OC)CC1COC1 NEQIHOVWPNMKMX-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- LGROXJWYRXANBB-UHFFFAOYSA-N trimethoxy(propan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)C LGROXJWYRXANBB-UHFFFAOYSA-N 0.000 description 1
- ORVBHOQTQDOUIW-UHFFFAOYSA-N trimethoxy(trifluoromethyl)silane Chemical compound CO[Si](OC)(OC)C(F)(F)F ORVBHOQTQDOUIW-UHFFFAOYSA-N 0.000 description 1
- AAPLIUHOKVUFCC-UHFFFAOYSA-N trimethylsilanol Chemical compound C[Si](C)(C)O AAPLIUHOKVUFCC-UHFFFAOYSA-N 0.000 description 1
- QHUNJMXHQHHWQP-UHFFFAOYSA-N trimethylsilyl acetate Chemical compound CC(=O)O[Si](C)(C)C QHUNJMXHQHHWQP-UHFFFAOYSA-N 0.000 description 1
- VFFKJOXNCSJSAQ-UHFFFAOYSA-N trimethylsilyl benzoate Chemical compound C[Si](C)(C)OC(=O)C1=CC=CC=C1 VFFKJOXNCSJSAQ-UHFFFAOYSA-N 0.000 description 1
- OPSWAWSNPREEFQ-UHFFFAOYSA-K triphenoxyalumane Chemical compound [Al+3].[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1 OPSWAWSNPREEFQ-UHFFFAOYSA-K 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- OBROYCQXICMORW-UHFFFAOYSA-N tripropoxyalumane Chemical compound [Al+3].CCC[O-].CCC[O-].CCC[O-] OBROYCQXICMORW-UHFFFAOYSA-N 0.000 description 1
- KHQZLUVCZCAMFU-UHFFFAOYSA-N tripropyl(tripropylsilyloxy)silane Chemical compound CCC[Si](CCC)(CCC)O[Si](CCC)(CCC)CCC KHQZLUVCZCAMFU-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- JLQFVGYYVXALAG-CFEVTAHFSA-N yasmin 28 Chemical compound OC1=CC=C2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1.C([C@]12[C@H]3C[C@H]3[C@H]3[C@H]4[C@@H]([C@]5(CCC(=O)C=C5[C@@H]5C[C@@H]54)C)CC[C@@]31C)CC(=O)O2 JLQFVGYYVXALAG-CFEVTAHFSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3405—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of organic materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/38—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal at least one coating being a coating of an organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/365—Coating different sides of a glass substrate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
- H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
Definitions
- the present invention relates to resin-coated ultra-thin glass.
- the cover glass that protects the display and housing needs to be thin enough to bend, and the thickness of the glass must be ultra-thin to about 0.1 mm or less.
- a thickness of 0.1 mm or less may be referred to as ultra-thin. Since the strength of a glass substrate largely depends on its thickness, an ultra-thin glass substrate with a thin glass has a problem of reduced impact resistance and breaking with a slight impact. On the other hand, if the thickness of the ultra-thin glass substrate is increased in order to improve the impact resistance, there is a problem that the bending resistance deteriorates, and it has been difficult to achieve both impact resistance and bending resistance.
- a tempered glass substrate represented by Corning's "Gorilla Glass (registered trademark)" is known. This is a technique of treating a glass substrate with a chemical solution or the like to provide compressive stress layers on both sides of the glass, thereby increasing the strength of the glass compared to ordinary glass.
- a film on the glass substrate For example, a composite comprising a glass substrate having microcracks on its surface and a resin layer disposed on the glass substrate, wherein the resin of the resin layer enters at least part of the interior of the microcracks.
- Patent Document 1 a glass protective film produced using a composition containing a polyfunctional epoxy (meth)acrylate compound, a polyfunctional thiol compound, and a radical polymerization initiator (see, for example, Patent Document 2) , a glass reinforced substrate having a cured film containing siloxane resin and silica particles on at least one side of the reinforced glass substrate (see, for example, Patent Document 3), a glass film having a thickness of between 10 ⁇ m and 500 ⁇ m, glass- In a plastic composite film, a glass-plastic composite film in which a polymer layer having a thickness between 1 ⁇ m and 200 ⁇ m is directly attached to at least one side of the glass film (see, for example, Patent Document 4), etc. is proposed.
- the object of the present invention is to provide a resin-coated ultra-thin glass having high impact resistance, good bending resistance, and high transparency.
- the present invention provides a three-layer resin-coated ultra-thin glass (A) having a thickness of 10 ⁇ m or more and 100 ⁇ m or less, in which an organic film (B) is formed on one side and an organic film (C) is formed on the other side.
- the ultra-thin glass (A) in the present invention must have a thickness of 10 ⁇ m or more and 100 ⁇ m or less. From the viewpoint of impact resistance of the resin-coated ultra-thin glass, the thickness is required to be 10 ⁇ m or more, preferably 20 ⁇ m or more, and more preferably 30 ⁇ m or more. From the viewpoint of bending resistance of the resin-coated ultra-thin sheet glass, the thickness must be 100 ⁇ m or less, and 80 ⁇ m or less is more preferable.
- the ultra-thin glass (A) in the present invention is not particularly limited, and examples thereof include aluminosilicate glass, soda glass, and alkali-free glass. Preferably.
- the tempered glass referred to here refers to a tempered glass substrate, and preferably has a compressive stress layer on the glass surface.
- Examples of methods for forming a compressive stress layer include a physical strengthening method that utilizes expansion and contraction of glass by heating and cooling, a chemical strengthening method that exchanges alkali ions in glass with other alkali ions having a larger ionic radius, and the like.
- a physical strengthening method that utilizes expansion and contraction of glass by heating and cooling
- a chemical strengthening method that exchanges alkali ions in glass with other alkali ions having a larger ionic radius, and the like.
- All of these methods are known, and any method can be selected.
- glass tempered by a chemical strengthening method so-called chemically tempered glass, is preferable.
- chemically strengthened glasses aluminosilicate chemically strengthened glass, soda lime chemically strengthened glass, etc. are more preferable.
- Examples of the unstrengthened ultra-thin glass (A) include “AF32 (registered trademark)” eco series (manufactured by Schott), “Corning (registered trademark)", and “Willow (registered trademark)” Glass series (manufactured by CORNING). ), “G-Leaf (registered trademark)” series (manufactured by Nippon Electric Glass Co., Ltd.), and “SPOOL (registered trademark)” series (manufactured by AGC Corporation).
- ultra-thin glass for example, "Xensation (registered trademark)” series (manufactured by Schott), “Corning (registered trademark)”, “Gorilla (registered trademark)” Glass series (manufactured by CORNING ), “Dinorex (registered trademark)” series (manufactured by Nippon Electric Glass Co., Ltd.), “Dragontrail (registered trademark)” (manufactured by AGC Corporation) series, and the like.
- Organic film (B) The present invention has an organic film (B) formed from a composition containing a thermoplastic resin (D) having a weight average molecular weight of 1,000 to 70,000 on one side of an ultra-thin glass (A).
- a thermoplastic resin (D) having a weight average molecular weight of 1,000 to 70,000 on one side of an ultra-thin glass (A).
- the organic film (B) is preferably a buffer film (b).
- the buffer film (b) is an organic film that softens an external impact on the resin-coated ultra-thin glass plate to improve impact resistance.
- the film thickness of the organic film (B) is preferably 10 ⁇ m or more and 100 ⁇ m or less. From the viewpoint of further improving the impact resistance of the resin-coated ultra-thin glass of the present invention, the thickness is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, and even more preferably 30 ⁇ m or more. From the viewpoint of further improving the bending resistance of the resin-coated ultra-thin glass of the present invention, the thickness is preferably 100 ⁇ m or less, more preferably 70 ⁇ m or less, and even more preferably 50 ⁇ m or less.
- the organic film (B) in the present invention has a yellowness index (YI) of transmitted light from a CIE standard D65 light source defined in JISK7373:2006
- a hard coat layer is preferably laminated on the surface of the organic film (B) that is not on the ultra-thin glass (A) side.
- the thickness of the hard coat layer is preferably 1 ⁇ m or more and 20 ⁇ m or less. From the viewpoint of further improving the surface hardness and impact resistance of the resin-coated ultra-thin glass of the present invention, the thickness is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more.
- the surface hardness refers to hardness determined in a pencil hardness test (load of 750 g) according to JIS K5600-5-4 (1999). From the viewpoint of further improving the bending resistance of the resin-coated ultra-thin glass, the thickness is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less.
- the hard coat layer can be formed of a thermosetting resin, a resin having a radically polymerizable group, or the like, but since it can be cured with ultraviolet rays, it preferably contains a resin having a radically polymerizable group from the viewpoint of productivity.
- a resin having a radically polymerizable group a vinyl group, an allyl group, an acrylic group, a methacrylic group, and the like are preferable.
- the resin having a radically polymerizable group include monomers having a radically polymerizable group and high molecular weight polymers having a radically polymerizable group.
- one type of resin having a radically polymerizable group may be used alone, or two or more types may be mixed and used at the same time.
- resins having these radically polymerizable groups include photoradical initiators, photosensitizers, surfactants, thermosetting resins, metal oxides, fine particles and ultrafine particles composed of solvents, acrylic components, etc.
- One or two or more third components may be added and used.
- a resin composition suitable for the organic film (B) in the present invention preferably contains a thermoplastic resin (D) as an essential component and contains a solvent from the viewpoint of coatability.
- Thermoplastic resin (D) in the present invention should have a weight average molecular weight of 1,000 to 70,000.
- the weight average molecular weight is required to be 1,000 or more, more preferably 5,000 or more, and even more preferably 10,000 or more.
- the weight average molecular weight must be 70,000 or less, more preferably 35,000 or less, and even more preferably 25,000 or less.
- the weight average molecular weight refers to a standard polystyrene conversion value determined by gel permeation chromatography.
- the glass transition temperature (Tg) of the thermoplastic resin (D) in the present invention is preferably 40°C to 110°C. From the viewpoint of further improving the impact resistance of the resin-coated ultra-thin glass, the temperature is preferably 40°C or higher, more preferably 50°C or higher, and even more preferably 60°C or higher. From the viewpoint of further improving the impact resistance of the resin-coated ultra-thin glass, the temperature is preferably 110° C. or lower, more preferably 100° C. or lower, and even more preferably 75° C. or lower.
- the glass transition temperature (Tg) means the glass transition temperature measured by differential scanning calorimetry (DSC).
- the thermoplastic resin (D) in the present invention includes polyester resins, (meth)acrylic acid ester resins, polyester urethane resins, urethane resins, silicone resins, cellulose resins, polyolefin resins, epoxy resins, and vinyl chloride-vinyl acetate copolymer resins. etc. are preferably mentioned.
- polyester resins and (meth)acrylic acid ester resins are preferred from the viewpoint of impact resistance and transparency of the resin-coated ultra-thin glass of the present invention. These can be used alone or in combination of two or more.
- polyester resin examples include "Vylon (registered trademark)" 200 (weight average molecular weight: 17000, Tg: 67°C), “Vylon” 220 (weight average molecular weight: 3000, Tg: 53°C), and "Vylon” 226.
- the organic film (B) preferably contains a thermosetting resin.
- the organic film (B) is formed from a composition containing a thermoplastic resin (D) having a weight average molecular weight of 1000 to 70000, and the composition containing the thermoplastic resin (D) is It is preferable to contain a thermosetting resin from the viewpoint of further improving the surface hardness.
- Thermosetting resins include (meth)acrylate compounds, epoxy compounds, and melamine compounds, but (meth)acrylate compounds are preferred from the viewpoint of stability over time.
- As the (meth)acrylate compound a urethane (meth)acrylate compound is preferable from the viewpoint of achieving both bending resistance and surface hardness of the organic film (B).
- the content of the urethane (meth)acrylate compound is preferably 5 to 35% by weight based on the total solid content of the organic film (B). From the viewpoint of further improving the surface hardness and impact resistance of the organic film (B), it is preferably 5% by weight or more. From the viewpoint of further improving the bending resistance and yellowness of the organic film (B), it is preferably 35% by weight or less, more preferably 25% by weight or less, and even more preferably 15% by weight or less.
- the total solid content refers to all components other than the solvent in the organic film (B).
- the urethane (meth)acrylate of the present invention preferably has a double bond equivalent weight of 100 to 600 g/mol.
- the bending resistance of the organic film (B) it is preferably 100 g/mol or more. From the viewpoint of further improving the surface hardness of the resin-coated ultra-thin glass, it is preferably 600 g/mol or less, more preferably 250 g/mol or less, and even more preferably 150 g/mol or less.
- a composition containing a thermoplastic resin (D) preferably contains a solvent from the viewpoint of coating properties.
- solvents include ester-based solvents, ether-based solvents, acetate-based solvents, alcohol-based solvents, ketone-based solvents, and lactone-based solvents. You may contain 2 or more types of these. Solvents such as xylene, ethylbenzene, and solvent naphtha may also be used in combination.
- ester solvents examples include benzyl acetate, ethyl benzoate, ⁇ -butyrolactone, methyl benzoate, diethyl malonate, 2-ethylhexyl acetate, 2-butoxyethyl acetate, 3-methoxy-3-methyl-butyl acetate, and diethyl oxalate.
- ethyl acetoacetate 3-methoxy-butyl acetate, methyl acetoacetate, ethyl-3-ethoxypropionate, 2-ethylbutyl acetate, isopentyl propionate, propylene glycol monomethyl ether propionate, propylene glycol monoethyl ether Acetate, pentyl acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, ethyl acetate, butyl acetate, isopentyl acetate and the like.
- 3-methoxy-3-methyl-butyl acetate acetic acid ester solvents such as propylene glycol monoethyl ether acetate, propionic acid ester solvents such as propylene glycol monomethyl ether propionate are preferable, and 3-methoxy-butyl More preferred are acetate and propylene glycol monomethyl ether acetate.
- ether-based solvents examples include propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol tertiary butyl ether, diethylene glycol methyl ethyl ether, and dipropylene glycol monomethyl ether.
- alcoholic solvents examples include butanol, 3-methyl-2-butanol, and 3-methyl-3-methoxybutanol.
- ketone-based solvents examples include cyclopentanone and cyclohexanone.
- lactone solvents examples include ⁇ -butyrolactone, ⁇ -valerolactone, ⁇ -valerolactone and the like.
- composition containing the thermoplastic resin (D) may contain other additives.
- Other additives include, for example, adhesion improvers, surfactants, polymerization inhibitors, antioxidants, and the like.
- Adhesion improvers include, for example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-amino ethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyl trimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane
- surfactants include fluorine-based surfactants; silicone-based surfactants; fluorine-containing thermally decomposable surfactants; polyether-modified siloxane-based surfactants; polyalkylene oxide-based surfactants; Acrylate-based surfactants; anionic surfactants such as ammonium lauryl sulfate and triethanolamine polyoxyethylene alkyl ether sulfate; cationic surfactants such as stearylamine acetate and lauryltrimethylammonium chloride; lauryldimethylamine oxide and laurylcarboxymethyl amphoteric surfactants such as hydroxyethylimidazolium betaine; and nonionic surfactants such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether and sorbitan monostearate. You may contain 2 or more types of these.
- fluorine-based surfactants silicone-based surfactants, and fluorine-containing thermally decomposable interfaces are used from the viewpoint of suppressing poor coating properties such as repellency and reducing surface tension to suppress unevenness during drying of the coating film.
- the active agent is preferably a polyether-modified siloxane-based surfactant, more preferably a fluorine-containing thermally decomposable surfactant.
- fluorosurfactants include, for example, "Megafac (registered trademark)” F142D, F172, F173, F183, F445, F470, F475, F477 (manufactured by DIC Corporation). ), NBX-15, FTX-218 (manufactured by Neos Co., Ltd.) and the like.
- silicone surfactants include "BYK (registered trademark)” -333, BYK-301, BYK-331, BYK-345, BYK-307 (manufactured by BYK-Chemie Japan Co., Ltd.). be done.
- fluorine-containing thermally decomposable surfactants include, for example, “Megafac (registered trademark)” DS-21 (manufactured by DIC Corporation).
- polyether-modified siloxane surfactants include, for example, “BYK (registered trademark)”-345, BYK-346, BYK-347, BYK-348, BYK-349 (manufactured by BYK-Chemie Japan Co., Ltd.).
- Polymerization inhibitors include, for example, hydroquinone-based and catechol-based polymerization inhibitors.
- hydroquinone-based polymerization inhibitors include hydroquinone, tert-butylhydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl)hydroquinone, and 2,5-bis(1,1-dimethylbutyl). hydroquinone and the like.
- catechol-based polymerization inhibitors include catechol and tert-butyl catechol.
- Antioxidants include phenol antioxidants, phosphorus antioxidants, sulfur antioxidants, and the like. You may contain 2 or more types of these.
- thermoplastic resin (D) the method for producing the composition containing the thermoplastic resin (D) will be explained below.
- thermoplastic resin (D) As a method for producing a composition containing a thermoplastic resin (D), the thermoplastic resin (D) is heated and stirred in a solvent to prepare a solution of the thermoplastic resin (D).
- a method of mixing a predetermined amount of other raw materials such as a solvent, a thermosetting resin, an adhesion improver, a surfactant, a polymerization inhibitor, an antioxidant, etc. with the solution of the thermoplastic resin (D) and stirring as necessary. Common.
- Organic film (C) The side of the ultra-thin glass (A) of the present invention on which the organic film (B) is not formed has an organic film (C) formed from a composition containing a siloxane resin (E).
- the organic film (C) is preferably a reinforced film (c).
- the reinforcing film (c) is an organic film that prevents cracks in the bent portion of the resin-coated ultra-thin glass and improves the bending resistance of the resin-coated ultra-thin glass.
- the organic film (C) in the present invention is preferably a cured film of a composition containing the siloxane resin (E).
- the organic film (C) is a “cured film” because the siloxane resin in the composition is crosslinked by a condensation reaction of silanol groups (thermal crosslinking) or a radical addition reaction of radically polymerizable groups (photocrosslinking). Point to what you did.
- thermal crosslinking thermal crosslinking
- photocrosslinking radical addition reaction of radically polymerizable groups
- the film thickness of the organic film (C) is preferably 1 ⁇ m or more and 20 ⁇ m or less. From the viewpoint of further improving the glass strength of the resin-coated ultra-thin glass, the thickness is preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, and even more preferably 3 ⁇ m or more. From the viewpoint of further improving the bending resistance of the resin-coated ultra-thin sheet glass, the thickness is preferably 20 ⁇ m or less, preferably 15 ⁇ m or less, and more preferably 10 ⁇ m or less.
- a transparent adhesive layer is preferably laminated on the surface of the organic film (C) that is not on the ultra-thin glass (A) side.
- the transparent adhesive layer include OCR (Optically Clear Resin), OCA (Optical Clear Adhesive), LOCA (Liquid Optically Clear Adhesives), and the like.
- the thickness of the transparent adhesive layer is preferably 10 ⁇ m or more and 200 ⁇ m or less. From the viewpoint of further improving adhesive strength, the thickness is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, and even more preferably 20 ⁇ m or more. From the viewpoint of further improving the bending resistance of the resin-coated ultra-thin sheet glass, the thickness is preferably 200 ⁇ m or less, more preferably 100 ⁇ m or less, and even more preferably 30 ⁇ m or less.
- the total light transmittance of the transparent adhesive layer is preferably 90% or more. From the viewpoint of further improving the brightness of the display, it is preferably 90% or more, more preferably 95% or more, and even more preferably 98% or more.
- the total light transmittance referred to here refers to a value measured according to JIS K7361-1.
- the haze value of the transparent adhesive layer is preferably 10% or less. From the viewpoint of further improving the transparency of the display, it is preferably 10% or less, more preferably 5% or less, and even more preferably 3% or less.
- the haze value referred to here refers to a value measured according to JIS K7136.
- the storage elastic modulus of the transparent adhesive layer at 25°C is preferably 0.05 MPa or more and 1.5 MPa or less.
- the pressure is preferably 0.05 Mpa or more, more preferably 0.10 Mpa or more, and even more preferably 0.15 Mpa or more.
- the pressure is preferably 1.5 Mpa or less, more preferably 1.0 Mpa or less, and even more preferably 0.5 Mpa or less.
- resins that make up the transparent adhesive layer include (meth)acrylic resins, silicone resins, and urethane resins, but (meth)acrylic resins are preferred from the viewpoint of transparency and stability in the visible light range.
- one type of resin may be used alone, or two or more types may be mixed and used at the same time.
- these resins contain one or more third components such as monomers, cross-linking agents, solvents, silane coupling agents, antistatic agents, tackifiers, antioxidants, ultraviolet absorbers, and leveling agents. It can be added and used.
- Siloxane resin (E) A resin composition suitable for the organic film (C) in the present invention preferably contains the siloxane resin (E) as an essential component and contains a solvent from the viewpoint of coatability.
- the siloxane resin (E) in the present invention refers to a polymer having repeating units having a siloxane skeleton, and is preferably a hydrolyzed condensate of an organosilane compound.
- siloxane resin (E) when it has an oxetanyl group, it shall be classified as a "siloxane compound having an oxetanyl group" described later.
- the weight average molecular weight of the siloxane resin (E) in the present invention is preferably 2,000 to 7,000 from the viewpoint of improving coatability.
- the phenyl group content of the siloxane resin (E) in the present invention is preferably 5 to 60 mol% relative to Si atoms.
- the content of phenyl groups in the siloxane resin (E) is preferably 5 mol % or more relative to Si atoms.
- the amount is preferably 60 mol % or less.
- the siloxane resin (E) in the present invention preferably has a radically polymerizable group.
- a radical photopolymerization initiator to be described later, the degree of crosslinking of the organic film (C) in the present invention is increased by the progress of radical polymerization reaction by radicals generated by light irradiation, and the resin-coated ultra-thin sheet glass is obtained.
- the bending resistance of the can be further improved.
- radically polymerizable groups examples include vinyl groups, ⁇ -methylvinyl groups, allyl groups, styryl groups, and (meth)acryloyl groups.
- a (meth)acryloyl group is preferred from the viewpoint of further increasing the degree of cross-linking of the organic film (C) in the present invention.
- the siloxane resin having a radically polymerizable group a hydrolytic condensate of an organosilane compound having a radically polymerizable group is preferred.
- a hydrolytic condensate of an organosilane compound having a radically polymerizable group and another organosilane compound may also be used.
- Organosilane compounds having a radically polymerizable group include, for example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltri(2-methoxyethoxy)silane, vinyltriacetoxysilane, vinylmethyldimethoxysilane, vinyl methyldiethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, allylmethyldimethoxysilane, allylmethyldiethoxysilane, p-styryltrimethoxysilane, p-styryltriethoxysilane, p-styrylmethyldimethoxysilane, p-styryl methyldiethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyltriethoxysilane, 3-acryloxypropylmethyldimethoxysilane, 3-acryloxypropylmethyldiethoxys
- 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyltriethoxysilane, 3-acryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane and 3-methacryloxypropyltriethoxysilane are preferred.
- organosilane compounds include, for example, methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, methyltriisopropoxysilane, methyltributoxysilane, methyltriphenoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, Ethyltrimethoxysilane, Ethyltriethoxysilane, Diethyldimethoxysilane, n-Propyltrimethoxysilane, Isopropyltrimethoxysilane, Diisopropyldimethoxysilane, n-Butyltrimethoxysilane, Isobutyltrimethoxysilane, Isobutyltriethoxysilane, Diisobutyldimethoxysilane , n-hexyltrimethoxysilane, n-hexyltriethoxysilane,
- the siloxane resin (E) in the present invention can be obtained by hydrolytic condensation of an organosilane compound.
- it can be obtained by hydrolyzing an organosilane compound and then subjecting the obtained silanol compound to a condensation reaction in the presence or absence of a solvent.
- Various conditions for the hydrolysis reaction can be appropriately set in consideration of the reaction scale, the size and shape of the reaction vessel, and so on. For example, it is preferable to add an acid catalyst and water to an organosilane compound in a solvent over 1 to 180 minutes, and then react the mixture at room temperature to 110° C. for 1 to 180 minutes. By carrying out the hydrolysis reaction under such conditions, a rapid reaction can be suppressed.
- the reaction temperature is more preferably 30-105°C.
- the hydrolysis reaction is preferably carried out in the presence of an acid catalyst.
- an acid catalyst an acidic aqueous solution containing formic acid, acetic acid and phosphoric acid is preferred.
- the amount of the acid catalyst to be added is preferably 0.1 to 5 parts by weight with respect to 100 parts by weight of all the organosilane compounds used in the hydrolysis reaction. By setting the amount of the acid catalyst within the above range, the hydrolysis reaction can proceed more efficiently.
- the reaction solution After obtaining the silanol compound by the hydrolysis reaction of the organosilane compound, it is preferable to heat the reaction solution as it is at 50°C or higher and below the boiling point of the solvent for 1 to 100 hours to carry out the condensation reaction. Further, reheating or addition of a base catalyst may be performed in order to increase the degree of polymerization of the polysiloxane.
- the solvent used for the hydrolysis reaction of the organosilane compound and the condensation reaction of the silanol compound include methanol, ethanol, propanol, isopropanol, butanol, isobutanol, t-butanol, pentanol, and 4-methyl-2-pentanol.
- ethylene glycol, Glycols such as propylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene ethers such as glycol dibutyl ether and diethyl ether; ketones such as methyl ethyl ketone, acetylacetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclopentanone and 2-heptanone;
- a solvent When a solvent is generated by the hydrolysis reaction, it is possible to hydrolyze without a solvent. After completion of the reaction, it is also preferable to adjust the concentration to be suitable for the composition by further adding a solvent. Further, depending on the purpose, after hydrolysis, an appropriate amount of the alcohol produced may be distilled off under heating and/or under reduced pressure, and then a suitable solvent may be added.
- the amount of solvent used in the hydrolysis reaction is preferably 80 to 500 parts by weight with respect to 100 parts by weight of all organosilane compounds. By setting the amount of the solvent within the above range, the hydrolysis reaction can proceed more efficiently.
- the water used for the hydrolysis reaction is preferably ion-exchanged water.
- the amount of water is preferably 1.0 to 4.0 mol per 1 mol of silane atoms.
- the content of the siloxane resin (E) in the composition containing the siloxane resin (E) is preferably 15% by weight or more based on the total solid content from the viewpoint of further improving the bending resistance and transparency of the resin-coated ultra-thin glass. , more preferably 25% by weight or more.
- the content of the siloxane resin is preferably 90% by weight or less, more preferably 80% by weight or less, based on the total solid content.
- the composition containing the siloxane resin (E) preferably contains a solvent from the viewpoint of coatability.
- a solvent By containing a solvent, each component can be uniformly dissolved.
- solvents include aliphatic hydrocarbons, carboxylic acid esters, ketones, ethers, and alcohols. You may contain 2 or more types of these.
- a compound having an alcoholic hydroxyl group and a cyclic compound having a carbonyl group are preferable from the viewpoint of uniformly dissolving each component and improving the transparency of the resulting coating film.
- Examples of compounds having an alcoholic hydroxyl group include acetol, 3-hydroxy-3-methyl-2-butanone, 4-hydroxy-3-methyl-2-butanone, 5-hydroxy-2-pentanone, 4-hydroxy-4 -methyl-2-pentanone (diacetone alcohol), ethyl lactate, butyl lactate, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, propylene glycol mono-t-butyl ether , 3-methoxy-1-butanol, 3-methyl-3-methoxy-1-butanol, and the like.
- diacetone alcohol and 3-methyl-3-methoxy-1-butanol are preferred from the viewpoint of storage stability.
- cyclic compounds having a carbonyl group include ⁇ -butyrolactone, ⁇ -valerolactone, ⁇ -valerolactone, propylene carbonate, N-methylpyrrolidone, cyclohexanone and cycloheptanone.
- ⁇ -butyrolactone is particularly preferably used.
- aliphatic hydrocarbons examples include xylene, ethylbenzene, and solvent naphtha.
- carboxylic acid esters examples include benzyl acetate, ethyl benzoate, ⁇ -butyrolactone, methyl benzoate, diethyl malonate, 2-ethylhexyl acetate, 2-butoxyethyl acetate, 3-methoxy-3-methyl-butyl acetate, and diethyl oxalate.
- ethyl acetoacetate cyclohexyl acetate, 3-methoxy-butyl acetate, methyl acetoacetate, ethyl-3-ethoxypropionate, 2-ethylbutyl acetate, isopentyl propionate, propylene glycol monomethyl ether propionate, propylene glycol Monoethyl ether acetate, ethyl acetate, butyl acetate, isopentyl acetate, pentyl acetate, propylene glycol monomethyl ether acetate and the like.
- Ketones include, for example, cyclopentanone and cyclohexanone.
- ethers include aliphatic ethers such as propylene glycol derivatives such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol tertiary butyl ether, and dipropylene glycol monomethyl ether.
- propylene glycol derivatives such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol tertiary butyl ether, and dipropylene glycol monomethyl ether.
- the boiling point under atmospheric pressure is 150 ° C. or higher. It is preferable to contain a solvent having a temperature of 250° C. or less and a solvent having a boiling point of less than 150° C. under atmospheric pressure.
- the boiling point of the solvent having a boiling point of 150° C. or higher and 250° C. or lower under atmospheric pressure is more preferably 150° C. or higher and 200° C. or lower.
- Solvents having a boiling point of 150° C. or higher and 250° C. or lower under atmospheric pressure include, for example, 4-hydroxy-4-methyl-2-pentanone (diacetone alcohol), ethyl lactate, butyl lactate, propylene glycol mono-t-butyl ether, 3 -Methoxy-1-butanol, 3-methyl-3-methoxy-1-butanol, benzyl acetate, ethyl benzoate, methyl benzoate, diethyl malonate, 2-ethylhexyl acetate, 2-butoxyethyl acetate, 3-methoxy-3-methyl -butyl acetate, diethyl oxalate, ethyl acetoacetate, cyclohexyl acetate, 3-methoxy-butyl acetate, methyl acetoacetate, ethyl-3-ethoxypropionate, isopentyl propionate, propylene glyco
- 4-hydroxy-4-methyl-2-pentanone diacetone alcohol
- 3-methyl-3-methoxy-1-butanol 3-methoxy-3-methyl-butyl acetate
- 3-methoxy-butyl acetate 3-methoxy-butyl acetate
- ⁇ -butyrolactone are particularly preferably used.
- Solvents having a boiling point of less than 150° C. under atmospheric pressure include, for example, methyl acetate, ethyl acetate, isopropyl acetate, n-propyl acetate, butyl acetate, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, Propylene glycol monomethyl ether, Propylene glycol monoethyl ether, ethylene glycol ethyl ether, ethylene glycol methyl ether, butanol, isobutanol, n-propyl alcohol, ethyl acetate and the like.
- propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether are particularly preferably used.
- the composition containing the siloxane resin (E) preferably contains silica particles and may further contain other components. By containing silica particles, the composition containing the siloxane resin (E) can achieve both bending resistance and transparency of the resin-coated ultra-thin glass at a high level.
- the composition containing the siloxane resin preferably has a silica particle content of 10% by weight or more and 40% by weight or less based on the total solids.
- the total solid content refers to all components other than the solvent in the composition containing the siloxane resin (E).
- the silica particle content By setting the silica particle content to 10% by weight or more in the total solid content, the silanol condensation reaction between the siloxane resin (E) and the silica particles promotes cross-linking, and the degree of cross-linking of the organic film (C) in the present invention is increased. It is possible to further improve the bending resistance of the resin-coated ultra-thin sheet glass. In addition, the difference in refractive index between the ultra-thin plate glass (A) and the organic film (C) can be reduced, and unevenness caused by film thickness variations of the organic film (C) can be reduced. By setting the silica particle content to 40% by weight or less in the total solid content, an organic film (C) having good bending resistance and adhesion can be obtained.
- the average particle size of the silica particles is preferably 1 to 200 nm, more preferably 1 to 70 nm.
- the average particle size of silica particles can be determined by a dynamic light scattering method. Specifically, a dispersion liquid having a silica particle concentration of 10 to 30% by weight is irradiated with light having a wavelength of 780 nm by a semiconductor laser, and after measuring the scattered light, frequency analysis is performed by the FFT-heterodyne method. Particle size can be determined.
- silica particles examples include sicastar (manufactured by Corefront Co., Ltd.) and "Reolosil (registered trademark)" (manufactured by Tokuyama Corporation). These may be pulverized or dispersed using a dispersing machine such as a bead mill.
- Silica particle dispersions include, for example, IPA-ST, MIBK-ST, IPA-ST-L, IPA-ST-ZL, PGM-ST, PMA-ST (all manufactured by Nissan Chemical Industries, Ltd.), " Oscar (registered trademark)” 101, “Oscar” 105, “Oscar” 106, “Cataloid (registered trademark)”-S (all manufactured by Nikki Shokubai Kasei Co., Ltd.), “Quatron (registered trademark)” PL-1- IPA, PL-1-TOL, PL-2L-PGME, PL-2L-MEK, PL-2L, GP-2L (all manufactured by Fuso Chemical Industry Co., Ltd.) and the like. You may contain 2 or more types of these.
- the composition containing the siloxane resin (E) preferably contains a radical photopolymerization initiator, and is combined with the siloxane resin (E) having a radically polymerizable group to crosslink the organic film (C) in the present invention. It is possible to further improve the bending resistance of the resin-coated ultra-thin glass by increasing the strength of the resin-coated ultra-thin sheet glass.
- the content of the radical photopolymerization initiator in the composition containing the siloxane resin (E) is determined from the viewpoint of sufficiently advancing the reaction of the radically polymerizable groups and further improving the bending resistance of the resin-coated ultra-thin glass. , preferably 0.5% by weight or more, more preferably 1% by weight or more, based on the total solid content.
- the content of the radical photopolymerization initiator is preferably 20% by weight or less, more preferably 10% by weight or less, based on the total solid content from the viewpoint of further improving the transparency of the organic film (C) in the present invention.
- photoradical polymerization initiators include alkylphenone photoradical polymerization initiators such as ⁇ -aminoalkylphenone photoradical polymerization initiators and ⁇ -hydroxyalkylphenone photoradical polymerization initiators; acylphosphine oxide photoradicals; Polymerization initiator; oxime ester-based photoradical polymerization initiator; benzophenone-based photoradical polymerization initiator; oxanthone-based photoradical polymerization initiator; imidazole-based photoradical polymerization initiator; benzothiazole-based photoradical polymerization initiator; Radical polymerization initiator; carbazole-based radical photopolymerization initiator; triazine-based photoradical polymerization initiator; benzoic acid ester-based photoradical polymerization initiator; phosphorus-based photoradical polymerization initiator; is mentioned. You may contain 2 or more types of these.
- ⁇ -aminoalkylphenone-based photoradical polymerization initiators and acylphosphine oxide-based photopolymerization initiators are used from the viewpoint of increasing the degree of cross-linking of the organic film (C) in the present invention and further improving the bending resistance of the resin-coated ultra-thin glass plate.
- a radical polymerization initiator, an oxime ester photoradical polymerization initiator, a benzophenone photoradical polymerization initiator having an amino group, and a benzoic acid ester photoradical polymerization initiator having an amino group are preferred.
- Examples of ⁇ -aminoalkylphenone photoradical polymerization initiators include 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-dimethylamino-2-(4-methyl benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 and the like .
- acylphosphine oxide photoradical polymerization initiators include 2,4,6-trimethylbenzoylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxy benzoyl)-(2,4,4-trimethylpentyl)-phosphine oxide and the like.
- oxime ester photoradical polymerization initiators include 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, 1,2-octanedione, 1-[4-(phenylthio)- 2-(O-benzoyloxime)], 1-phenyl-1,2-butadione-2-(o-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(o-ethoxycarbonyl)oxime, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(0-acetyloxime) and the like.
- Benzophenone photoradical polymerization initiators having an amino group include, for example, 4,4-bis(dimethylamino)benzophenone and 4,4-bis(diethylamino)benzophenone.
- Benzoic acid ester photoradical polymerization initiators having an amino group include, for example, ethyl p-dimethylaminobenzoate, 2-ethylhexyl-p-dimethylaminobenzoate, and ethyl p-diethylaminobenzoate.
- the composition containing the siloxane resin (E) preferably further contains a compound having two or more radically polymerizable groups.
- a compound having two or more radically polymerizable groups By containing a compound having two or more radically polymerizable groups, the degree of crosslinking of the organic film (C) in the present invention is increased by a radical polymerization reaction with the radically polymerizable groups contained in the siloxane resin (E). It is possible to further improve the bending resistance of the resin-coated ultra-thin glass.
- Examples of the radically polymerizable group include those exemplified as the radically polymerizable group possessed by the siloxane resin.
- a polyfunctional (meth)acrylate is preferable as the compound having two or more radically polymerizable groups.
- Polyfunctional (meth)acrylate refers to a compound having two or more (meth)acrylate groups, for example, 2,2-[9H-fluorene-9,9-diylbis(1,4-phenylene)bisoxy]diethanol Di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, dimethyloltricyclodecane di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate , glycerin di(meth)acrylate, tripropylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate,
- the content of the compound having two or more radically polymerizable groups in the composition containing the siloxane resin (E) increases the degree of cross-linking of the organic film (C) and further improves the bending resistance of the resin-coated ultra-thin glass. From a viewpoint, 5 weight% or more is preferable in a total solid content, and 10 weight% or more is more preferable. On the other hand, from the viewpoint of further improving the flexibility of the organic film (C), the content of the compound having two or more radically polymerizable groups is preferably 50% by weight or less, more preferably 30% by weight or less, based on the total solid content. .
- the composition containing the siloxane resin (E) may contain a siloxane compound having an oxetanyl group.
- a siloxane compound having an oxetanyl group By containing the siloxane compound having an oxetanyl group, the stress of the organic film (C) is relieved by the ring-opening reaction of the oxetane ring, and the adhesion between the ultra-thin glass plate (A) and the organic film (C) is improved. can be done.
- siloxane compounds having an oxetanyl group include compounds represented by the following general formula (1).
- R 1 to R 4 each represent a hydrogen atom, an alkyl group, a cycloalkyl group, or a group represented by general formula (2) below. However, at least one of R 1 to R 4 is a group represented by the following general formula (2). w represents an integer of 1-10. From the viewpoint of reactivity, the alkyl group preferably has 1 to 6 carbon atoms, and the cycloalkyl group preferably has 3 to 6 carbon atoms.
- R 5 to R 9 each represent a hydrogen atom, a fluorine atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group or a perfluoroalkyl group having 1 to 4 carbon atoms.
- p represents an integer of 1 to 6;
- the siloxane compound represented by the general formula (1) can be obtained by hydrolyzing an alkoxysilane compound having an oxetanyl group, optionally together with an alkoxysilane compound having no oxetanyl group.
- alkoxysilane compounds having an oxetanyl group examples include (oxetan-3-yl)methyltrimethoxysilane, (oxetan-3-yl)methyltriethoxysilane, (oxetan-3-yl)methyltri-n-propyloxysilane.
- alkoxysilane compounds having no oxetanyl group include tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, methyltriisopropoxysilane, ethyltrimethoxysilane, ethyl triethoxysilane, propyltriethoxysilane, butyltrimethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, dimethyldiethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldi Ethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methylphenyl
- siloxane compound having an oxetanyl group for example, "Aron Oxetane (registered trademark)" OXT-191 (trade name, manufactured by Toagosei Co., Ltd.) (R 1 to R 4 in general formula (1) are (3-ethyl -3-oxetanyl)methyl group, w averages 5), and compounds represented by the following general formula (3) or (6). You may contain 2 or more types of these.
- R 10 and R 12 are a hydrogen atom, a fluorine atom, an alkyl group having 1 to 6 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 18 carbon atoms, represents a furyl group or a thienyl group.
- R 11 represents a group represented by the following general formula (4).
- d represents an integer of 0 to 3; Examples of alkyl groups having 1 to 6 carbon atoms include methyl group, ethyl group, propyl group, butyl group, pentyl group and hexyl group.
- the fluoroalkyl group having 1 to 6 carbon atoms includes, for example, a trifluoromethyl group, a perfluoroethyl group, a perfluoropropyl group and the like.
- Examples of the aryl group having 6 to 18 carbon atoms include phenyl group and naphthyl group.
- R 13 , R 15 , R 16 and R 18 represent an alkyl group having 1 to 4 carbon atoms and an aryl group having 6 to 18 carbon atoms, and R 14 and R 17 each have 1 carbon atom. to 4 alkyl groups, aryl groups having 6 to 18 carbon atoms, or groups represented by the following general formula (5).
- u represents an integer from 0 to 200; When u is 2 or more, multiple R 14 and R 17 may be the same or different.
- R 19 to R 23 each represent an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms.
- Z represents an integer from 0 to 100; When z is 2 or more, multiple R 19 and R 23 may be the same or different.
- R 24 is a hydrogen atom, a fluorine atom, an alkyl group having 1 to 6 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 18 carbon atoms, a furyl group, or represents a thienyl group
- R 25 represents a 3- to 10-valent organic group. Examples thereof include linear, branched or cage-like polysiloxane-containing groups represented by any of the following general formulas (7) to (9).
- j represents an integer of 3 to 10 equal to the valence of R25 .
- siloxane compound having a cage-shaped oxetanyl group represented by the general formula (9) examples include, for example, silsesquioxane derivatives OX-SQ TX-100 and OX-SQ SI-20 (trade names, Toagosei Co., Ltd.) and the like.
- those having a plurality of oxetanyl groups are preferred.
- the stress relaxation effect of the organic film (C) due to the ring-opening reaction of the oxetane ring is improved, and the adhesion to the glass substrate can be further improved.
- the content of the siloxane compound having an oxetanyl group in the composition containing the siloxane resin (E) is 0.1 in the total solid content from the viewpoint of further relaxing the stress of the organic film (C) and further improving adhesion. % by weight or more is preferable, and 0.5% by weight or more is more preferable.
- the content of the siloxane compound having an oxetanyl group is preferably 10% by weight or less in the total solid content from the viewpoint of improving the stress of the organic film (C) and further improving the bending resistance of the resin-coated ultra-thin glass. 6% by weight or less is more preferable.
- the composition containing the siloxane resin (E) may contain a metal chelate compound represented by the following general formula (10). Since the metal chelate compound acts as a catalyst for the silanol condensation reaction of the siloxane resin (E), the degree of cross-linking of the organic film (C) increases, and the bending resistance of the resin-coated ultra-thin glass can be further improved.
- M represents a metal atom
- R26 represents hydrogen, an alkyl group, an aryl group or an alkenyl group
- R27 and R28 each independently represents a hydrogen, alkyl group, aryl group or alkenyl group. or represents an alkoxy group.
- the alkyl group, aryl group, alkenyl group or alkoxy group may be substituted with a substituent.
- e represents the valence of the metal atom M
- f represents an integer from 0 to e. From the viewpoint of reactivity, ef is preferably 0.
- the metal atom M is preferably titanium, zirconium, aluminum, zinc, cobalt, molybdenum, lanthanum, barium, strontium, magnesium, or calcium, and more preferably zirconium or aluminum.
- R 26 examples include hydrogen, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n- octyl group, n-nonyl group, n-decyl group, n-octadecyl group, phenyl group, vinyl group, allyl group, oleyl group and the like.
- R 27 and R 28 include hydrogen, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, t-butyl group, phenyl group, vinyl group, methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, sec-butoxy group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, n-octadecyl group, benzyloxy group and the like.
- Zirconium chelate compounds in which the metal atom M is zirconium include, for example, zirconium tetra-n-propoxide, zirconium tetra-n-butoxide, zirconium tetra-sec-butoxide, zirconium tetraphenoxide, zirconium tetraacetylacetonate, zirconium tetra(2, 2,6,6-tetramethyl-3,5-heptanedionate), zirconium tetramethylacetoacetate, zirconium tetraethylacetoacetate, zirconium tetramethylmalonate, zirconium tetraethylmalonate, zirconium tetrabenzoylacetonate, zirconium tetradibenzoyl methanate, zirconium mono n-butoxyacetylacetonate bis(ethylacetoacetate), zirconium mono n
- Aluminum chelate compounds in which the metal atom M is aluminum include, for example, aluminum tris isopropoxide, aluminum tris n-propoxide, aluminum tris sec-butoxide, aluminum tris n-butoxide, aluminum trisphenoxide, aluminum tris acetylacetonate, aluminum Tris (2,2,6,6-tetramethyl-3,5-heptanedionate), aluminum trisethylacetoacetate, aluminum trismethylacetoacetate, aluminum trismethylmalonate, aluminum trisethylmalonate, aluminum ethylacetate di (isopropoxide), aluminum acetylacetonate) di(isopropoxide), aluminum methylacetoacetate di(isopropoxide), aluminum octadecylacetoacetate di(isopropylate), aluminum monoacetylacetonate bis(ethylacetoacetate) etc.
- the content of the metal chelate compound in the composition containing the siloxane resin (E) is the total solid content from the viewpoint of further improving the degree of crosslinking of the organic film (C) and further improving the bending resistance of the resin-coated ultra-thin glass. 0.1% by weight or more is preferable, and 0.5% by weight or more is more preferable.
- the content of the metal chelate compound is preferably 10% by weight or less, more preferably 7% by weight or less, based on the total solid content, from the viewpoint of the stability of the composition containing the siloxane resin (E) over time.
- the composition containing the siloxane resin (E) may contain an adhesion improver.
- an adhesion improver By containing the adhesion improver, the adhesion between the organic film (C) and the ultra-thin plate glass (A) can be further improved.
- adhesion improvers include silane coupling agents having functional groups such as vinyl groups, epoxy groups, styryl groups, (meth)acryloxy groups, and amino groups.
- functional groups such as vinyl groups, epoxy groups, styryl groups, (meth)acryloxy groups, and amino groups.
- the content of the adhesion improver in the composition containing the siloxane resin (E) is 0.1 wt. % or more is preferable, and 0.5% by weight or more is more preferable. On the other hand, from the viewpoint of stability over time of the composition containing the siloxane resin (E), it is preferably 10% by weight or less, more preferably 5% by weight or less, of the total solid content.
- the composition containing the siloxane resin (E) may contain various cross-linking agents to promote or facilitate cross-linking.
- cross-linking agents include nitrogen-containing organic substances, silicone resin cross-linking agents, isocyanate compounds and their polymers, methylolated melamine derivatives, and methylolated urea derivatives. You may contain 2 or more types of these. Among them, a methylolated melamine derivative and a methylolated urea derivative are preferably used from the viewpoint of crosslinkability and stability over time.
- the composition containing the siloxane resin (E) may contain a curing catalyst such as a thermal acid generator or a photoacid generator.
- thermal acid generators include SI-60, SI-80, SI-100, SI-110, SI-145, SI-150, SI-60L, SI-80L, SI-100L, SI-110L, SI -145L, SI-150L, SI-160L, SI-180L (manufactured by Sanshin Chemical Industry Co., Ltd.), 4-hydroxyphenyldimethylsulfonium trifluoromethanesulfonate, benzyl-4-hydroxyphenylmethylsulfonium trifluoromethanesulfonate , 2-methylbenzyl-4-hydroxyphenylmethylsulfonium trifluoromethanesulfonate, 4-acetoxyphenyldimethylsulfonium trifluoromethanesulfonate, 4-acetoxyphenyldimethylsulfonium trifluoromethanes
- photoacid generators examples include SI-100, SI-101, SI-105, SI-106, SI-109, PI-105, PI-106, PI-109, NAI-100, NAI-1002, NAI -1003, NAI-1004, NAI-101, NAI-105, NAI-106, NAI-109, NDI-101, NDI-105, NDI-106, NDI-109, PAI-01, PAI-101, PAI-106 , PAI-1001 (manufactured by Midori Chemical Co., Ltd.), SP-077, SP-082 (manufactured by ADEKA Co., Ltd.), TPS-PFBS (manufactured by Toyo Gosei Co., Ltd.), MDT (manufactured by , Heraeus), WPAG-281, WPAG-336, WPAG-339, WPAG-342, WPAG-344, WPAG-350, WPAG-370, WPAG-3
- the content of a curing catalyst such as a thermal acid generator or a photoacid generator in the composition containing the siloxane resin (E) improves the degree of crosslinking of the organic film (C) and increases the bending resistance of the resin-coated ultra-thin glass. From the viewpoint of further improvement, it is preferably 0.1% by weight or more, more preferably 0.3% by weight or more, in the total solid content. On the other hand, from the viewpoint of the stability over time of the composition containing the siloxane resin (E), the content of the curing catalyst such as a thermal acid generator or a photoacid generator is preferably 5% by weight or less in the total solid content. Weight % or less is more preferable.
- the composition containing the siloxane resin (E) may contain a polymerization inhibitor. Stability over time can be improved by containing a polymerization inhibitor.
- polymerization inhibitors include phenol, catechol, resorcinol, hydroquinone, 4-t-butylcatechol, 2,6-di(t-butyl)-p-cresol, phenothiazine, and 4-methoxyphenol.
- the content of the polymerization inhibitor in the composition containing the siloxane resin (E) is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, based on the total solid content.
- it is preferably 5% by weight or less, more preferably 1% by weight or less, based on the total solid content.
- the composition containing the siloxane resin (E) may contain an ultraviolet absorber.
- an ultraviolet absorber By containing an ultraviolet absorber, the light resistance of the organic film (C) can be improved.
- Benzotriazole-based compounds, benzophenone-based compounds, and triazine-based compounds are preferably used as the ultraviolet absorber in terms of transparency and non-coloring properties.
- benzotriazole compounds include 2-(2H benzotriazol-2-yl)phenol, 2-(2H-benzotriazol-2-yl)-4,6-t-pentylphenol, 2-(2H benzotriazole -2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2(2H-benzotriazol-2-yl)-6-dodecyl-4-methylphenol, 2-(2'- hydroxy-5′-methacryloxyethylphenyl)-2H-benzotriazole and the like.
- Benzophenone-based compounds include, for example, 2-hydroxy-4-methoxybenzophenone.
- triazine compounds examples include 2-(4,6-diphenyl-1,3,5 triazin-2-yl)-5-[(hexyl)oxy]-phenol and the like.
- the content of the ultraviolet absorber in the composition containing the siloxane resin (E) is 10% by weight or less in the total solid content from the viewpoint of improving the adhesion between the organic film (C) and the ultra-thin glass plate (A). Preferably, 5% by weight or less is more preferable.
- the composition containing the siloxane resin (E) may contain a surfactant.
- a surfactant By containing a surfactant, it is possible to improve flowability during application.
- surfactants include fluorine-based surfactants; silicone-based surfactants; fluorine-containing thermally decomposable surfactants; polyether-modified siloxane-based surfactants; polyalkylene oxide-based surfactants; Acrylate-based surfactants; anionic surfactants such as ammonium lauryl sulfate and triethanolamine polyoxyethylene alkyl ether sulfate; cationic surfactants such as stearylamine acetate and lauryltrimethylammonium chloride; lauryldimethylamine oxide and laurylcarboxymethyl amphoteric surfactants such as hydroxyethylimidazolium betaine; and nonionic surfactants such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether and sorbitan
- fluorine-based surfactants silicone-based surfactants, and fluorine-containing thermally decomposable interfaces are used from the viewpoint of suppressing poor coating properties such as repellency and reducing surface tension to suppress unevenness during drying of the coating film.
- the active agent is preferably a polyether-modified siloxane-based surfactant, more preferably a fluorine-containing thermally decomposable surfactant.
- fluorosurfactants include, for example, "Megafac (registered trademark)” F142D, F172, F173, F183, F445, F470, F475, F477 (manufactured by DIC Corporation). ), NBX-15, FTX-218 (manufactured by Neos Co., Ltd.) and the like.
- silicone surfactants include "BYK (registered trademark)” -333, BYK-301, BYK-331, BYK-345, BYK-307 (manufactured by BYK-Chemie Japan Co., Ltd.). be done.
- fluorine-containing thermally decomposable surfactants include, for example, “Megafac (registered trademark)” DS-21 (manufactured by DIC Corporation).
- polyether-modified siloxane surfactants include, for example, “BYK (registered trademark)”-345, BYK-346, BYK-347, BYK-348, BYK-349 (manufactured by BYK-Chemie Japan Co., Ltd.).
- a method of mixing predetermined amounts of raw materials and stirring them is common.
- an organic film having hardness different from that of the organic film (B) and the hard coat layer may be formed between the organic film (B) and the hard coat layer.
- the resin-coated ultra-thin glass of the present invention can be suitably used for display devices such as smartphones and tablet PCs, vehicle-mounted displays, and instrument panel cover glasses with the organic buffer film (B) on the surface side.
- the front side is the side that is located on the user's side and can be touched by fingers when the resin-coated ultra-thin sheet glass is used as the cover glass on the front side of the display device.
- the back side is the side that cannot be touched by the user when the resin-coated ultra-thin glass is used as the cover glass on the front side of the display device.
- OCA (trade name “OPTERIA (registered trademark)” MO-3017; manufactured by Lintec Corporation) with a thickness of 50 ⁇ m is placed on the upper side of the organic film (C) side (back side) formed on the ultra-thin plate glass (A). pasted.
- OCA trade name “OPTERIA (registered trademark)” MO-3017; manufactured by Lintec Corporation
- the upper side of the OCA was attached to a SUS304 plate having a thickness of 10 mm, and the ultra-thin glass plate (A) was placed so that the SUS304 was on the lower side.
- a ball-point pen with a weight of 5.7 g and a core diameter of 0.7 mm was dropped from a predetermined height on the organic film (B) side (surface side) of the ultra-thin glass (A) to prevent cracking of the ultra-thin glass. observed whether or not When no cracking was observed, the same evaluation was performed by increasing the drop height of the ballpoint pen, and the minimum height (PT1) at which the ultra-thin plate glass cracked was measured and evaluated according to the following criteria. ⁇ : 15 ⁇ PT1 ⁇ : 5 ⁇ PT1 ⁇ 15 ⁇ : PT1 ⁇ 5.
- the transmittance was measured at a measurement wavelength of 380 nm to 780 nm using an ultraviolet-visible spectrophotometer UV-2600 (manufactured by Shimadzu Corporation). From the measured transmittance, the yellowness index (YI) of the transmitted light under the D65 light source was obtained. It can be said that the smaller the value, the better the yellowness index (YI).
- Resin-coated glass obtained in each example and comparative example was produced by using alkali-free glass with a thickness of 0.5 mm instead of ultra-thin glass. Using a pencil hardness tester, trace the organic film (B) side (surface side) of the non-alkali glass with a pencil having a predetermined hardness at a load of 750 g and an angle of 45 degrees, and observe the presence or absence of scratches. was measured.
- a phosphoric acid aqueous solution in which 0.391 g of phosphoric acid (0.2 parts by weight based on the charged monomer) was dissolved was added over 10 minutes using a dropping funnel. After stirring at 40° C. for 1 hour, the temperature of the oil bath was set to 70° C., stirring was continued for 1 hour, and the temperature of the oil bath was increased to 115° C. over 30 minutes. After 1 hour from the start of heating, the internal temperature of the solution reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.). A total of 120 g of methanol and water, which are by-products, were distilled during the reaction.
- Mw weight average molecular weight
- a phosphoric acid aqueous solution was prepared by dissolving 0.535 g of phosphoric acid (0.3 parts by weight with respect to the charged monomer) in 54.0 g of water. was added via a dropping funnel over 10 minutes. After stirring at 40° C. for 1 hour, the temperature of the oil bath was set to 70° C., stirring was continued for 1 hour, and the temperature of the oil bath was increased to 115° C. over 30 minutes. After 1 hour from the start of heating, the internal temperature of the solution reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.). A total of 120 g of methanol and water, which are by-products, were distilled during the reaction.
- a siloxane resin (PS-2) solution was added to the obtained DAA solution of the siloxane resin so that the polymer concentration was 40% by weight to obtain a siloxane resin (PS-2) solution.
- the Mw of the obtained siloxane resin (PS-2) was measured by GPC and found to be 5,000 (converted to polystyrene).
- composition (GR-1) containing siloxane resin) Under a yellow light, 1.52 g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (trade name “Omnirad (registered trademark)” 819; manufactured by IGM) and zirconium tetraacetylacetonate (trade name "Orgatics (registered trademark)"ZC-150"; manufactured by Matsumoto Fine Chemical Co., Ltd.) 1.30 g, DAA 23.96 g, propylene glycol monomethyl ether acetate (hereinafter, "PGMEA”) 1.53 g, 3-methyl- 3-Methoxy-1-butanol (hereinafter, "MMB”) was dissolved in a mixed solvent of 14.80 g, and a siloxane compound having an oxetanyl group ""Aron oxetane (registered trademark)"OXT-191"; manufactured by Toagosei Co.
- thermoplastic polyester resin trade name “Vylon (registered trademark)” 200; manufactured by Toyobo Co., Ltd. (hereinafter referred to as “Vylon 200”) and 84.90 g of PGMEA at 60°C. , and mixed and stirred until Vylon 200 was dissolved.
- a PGMEA 5% by weight solution (equivalent to a concentration of 50 ppm) of a fluorine-containing pyrolytic surfactant (trade name “DS-21”; manufactured by DIC Corporation) was added, Stirred. Then, the mixture was filtered through a 1.00 ⁇ m filter to prepare a composition (GB-1) containing a thermoplastic resin with a solid concentration of 15% by weight.
- a fluorine-containing pyrolytic surfactant trade name “DS-21”; manufactured by DIC Corporation
- Example 1 A spray coating device ( Using a product name ““rCoater (registered trademark)” ES1533 (manufactured by Asahi Sunac Co., Ltd.), a composition containing a siloxane resin (GR-1) was spray-coated, and then using a hot plate at 100 ° C. It was pre-baked for 2 minutes to obtain a pre-baked film. After that, using an exposure machine “XG-5000” manufactured by Dainippon Screen Co., Ltd., exposure was performed at 500 mJ/cm 2 (converted to i-line), and curing was performed using a hot air oven at 180° C. for 40 minutes to obtain an organic film having a film thickness of 5 ⁇ m. A film (C-1) was obtained.
- a composition (GB-1) containing a thermoplastic resin was spray-coated using a spray coating device on the side (surface side) of the ultra-thin glass on which the organic film (C-1) was not formed. After that, it was pre-baked for 6 minutes using a hot plate at 90° C. to obtain a pre-baked film. Next, it was cured in a hot air oven at 210° C. for 40 minutes to obtain an organic film (B-1) with a film thickness of 20 ⁇ m.
- a hard coat material (trade name “Riodulas (registered trademark)” LCH2391; manufactured by Toyochem Co., Ltd.) was spray-coated, and then a hot plate at 80° C. was used. and prebaked for 1 minute to obtain a prebaked film. After that, exposure was performed at 1500 mJ using an exposure machine "UVC-1212S1WF01" manufactured by Ushio Inc. to prepare a 7 ⁇ m hard coat layer (H-1), thereby obtaining resin-coated ultra-thin glass (SG-1). rice field. Table 2 shows the results of evaluation by the method described above.
- Example 2 A resin-coated ultra-thin glass (SG-2) was produced in the same manner as in Example 1, except that the hard coat layer was not formed. Table 2 shows the results of evaluation by the method described above.
- Example 3 Resin-coated ultra-thin glass (SG-3) was prepared in the same manner as in Example 1, except that the composition (GR-2) containing a siloxane resin was used to prepare an organic film (C-2) having a thickness of 5 ⁇ m. made. Table 2 shows the results of evaluation by the method described above.
- Example 4 An organic film (B-2) having a film thickness of 40 ⁇ m was obtained by adjusting the spray speed and discharge amount during the preparation of the organic film (B-1). A resin-coated ultra-thin glass plate (SG-4) was produced in the same manner as in Example 1, except that the film thickness of the organic film (B-1) was changed. Table 2 shows the results of evaluation by the method described above.
- Example 5 A composition containing a thermoplastic resin (GB-2) was prepared.
- a resin-coated ultra-thin glass (SG-5) was produced in the same manner as in Example 1, except that the obtained GB-2 was used to produce an organic film (B-3).
- Table 2 shows the results of evaluation by the method described above.
- Example 6 In the same manner as GB-1, except that Vylon 200 was changed to a vinyl chloride-vinyl acetate copolymer resin (trade name “Solbin (registered trademark)” TA-5R; manufactured by Nissin Chemical Industry Co., Ltd.). A composition (GB-3) containing a thermoplastic resin was prepared.
- a resin-coated ultra-thin glass (SG-6) was produced in the same manner as in Example 1, except that the obtained GB-3 was used to produce an organic film (B-4).
- Table 2 shows the results of evaluation by the method described above.
- Example 7 Thermoplastic resin was used in the same manner as GB-1, except that Vylon 200 was changed to (meth) acrylic acid ester resin (trade name “Hyper (registered trademark) M-4006”; manufactured by Negami Kogyo Co., Ltd.). A containing composition (GB-4) was prepared.
- a resin-coated ultra-thin glass (SG-7) was produced in the same manner as in Example 1, except that the obtained GB-4 was used to produce an organic film (B-5).
- Table 2 shows the results of evaluation by the method described above.
- Example 8 A composition containing a thermoplastic resin in the same manner as GB-1 except that Vylon 200 was changed to a thermoplastic polyester resin (trade name “Vylon (registered trademark)” GK-360; manufactured by Toyobo Co., Ltd.) Product (GB-6) was prepared.
- a resin-coated ultra-thin glass (SG-12) was produced in the same manner as in Example 1, except that the obtained GB-6 was used to produce an organic film (B-8).
- Table 2 shows the results of evaluation by the method described above.
- Example 9 A composition containing a thermoplastic resin ( GB-7) was prepared.
- a resin-coated ultra-thin glass (SG-13) was produced in the same manner as in Example 1, except that the obtained GB-7 was used to produce an organic film (B-9).
- Table 2 shows the results of evaluation by the method described above.
- Example 10 A composition containing a thermoplastic resin in the same manner as GB-1, except that Vylon 200 was changed to a thermoplastic polyester resin (trade name “Vylon (registered trademark)” GK-880; manufactured by Toyobo Co., Ltd.) Product (GB-8) was prepared.
- Vylon registered trademark
- GK-880 thermoplastic polyester resin
- a resin-coated ultra-thin glass (SG-14) was produced in the same manner as in Example 1, except that the obtained GB-8 was used to produce an organic film (B-10).
- Table 2 shows the results of evaluation by the method described above.
- thermosetting urethane acrylate (trade name “NK Oligo (registered trademark)” U-6LPA; manufactured by Shin-Nakamura Chemical Co., Ltd.) (double bond equivalent: 127 g / mol) (hereinafter , “U-6LPA”) was changed to 1.50 g, in the same manner as GB-1, to prepare a composition (GB-9) containing a thermoplastic resin.
- a resin-coated ultra-thin glass (SG-15) was produced in the same manner as in Example 1, except that the resulting GB-9 was used to produce an organic film (B-11).
- Table 2 shows the results of evaluation by the method described above.
- Example 12 A resin-coated ultra-thin glass (SG-16) was produced in the same manner as in Example 11, except that the hard coat layer was not formed. Table 2 shows the results of evaluation by the method described above.
- Example 13 A composition containing a thermoplastic resin (GB-10) was prepared in the same manner as GB-1, except that Vylon 200 was changed to 12.00 g and U-6LPA to 3.00 g.
- a resin-coated ultra-thin glass (SG-17) was produced in the same manner as in Example 1, except that the obtained GB-10 was used to produce an organic film (B-12).
- Table 2 shows the results of evaluation by the method described above.
- Example 14 A composition containing a thermoplastic resin (GB-11) was prepared in the same manner as GB-1 except that Vylon 200 was changed to 10.50 g and U-6LPA to 4.50 g.
- a resin-coated ultra-thin glass (SG-18) was produced in the same manner as in Example 1, except that the obtained GB-11 was used to produce an organic film (B-13).
- Table 2 shows the results of evaluation by the method described above.
- thermosetting urethane acrylate (trade name “NK Oligo (registered trademark)” UA-122P; manufactured by Shin-Nakamura Chemical Co., Ltd.) (double bond equivalent: 550 g / mol)
- GB-12 thermoplastic resin
- a resin-coated ultra-thin glass (SG-19) was produced in the same manner as in Example 1, except that the obtained GB-12 was used to produce an organic film (B-14).
- Table 2 shows the results of evaluation by the method described above.
- Example 16 Except for changing U-6LPA to a thermosetting urethane acrylate (trade name “NK Oligo (registered trademark)” U-2HA; manufactured by Shin-Nakamura Chemical Co., Ltd.) (double bond equivalent: 200 g / mol) , GB-9, a composition containing a thermoplastic resin (GB-13) was prepared.
- a thermosetting urethane acrylate trade name “NK Oligo (registered trademark)” U-2HA; manufactured by Shin-Nakamura Chemical Co., Ltd.
- a resin-coated ultra-thin glass (SG-20) was produced in the same manner as in Example 1, except that the resulting GB-13 was used to produce an organic film (B-15).
- Table 2 shows the results of evaluation by the method described above.
- Table 2 shows the results of evaluating the organic film (B), the organic film (C), and the ultra-thin glass without forming the hard coat layer by the method described above.
- Example 2 A resin-coated ultra-thin glass plate (SG-8) was produced in the same manner as in Example 1, except that the organic film (B-1) was not formed. Table 2 shows the results of evaluation by the method described above.
- Example 4 A resin-coated ultra-thin sheet glass (SG-10) was produced in the same manner as in Example 1, except that the organic film (C-1) was not formed. Table 2 shows the results of evaluation by the method described above.
- a resin-coated ultra-thin glass (SG-11) was produced in the same manner as in Example 1, except that the obtained GB-5 was used to produce an organic film (B-7).
- Table 2 shows the results of evaluation by the method described above.
- the resin-coated ultra-thin glass of the present invention has high impact resistance, good bending resistance, and high transparency, so it can be used as a flexible cover glass for display devices.
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Abstract
Description
本発明における超薄板ガラス(A)は、厚み10μm以上100μm以下であることが必要である。樹脂被覆超薄板ガラスの衝撃耐性の観点から、10μm以上が必要であり、20μm以上が好ましく、30μm以上がより好ましい。樹脂被覆超薄板ガラスの折り曲げ耐性の観点から、100μm以下が必要であり、80μm以下がより好ましい。
本発明は、超薄板ガラス(A)の片面側に重量平均分子量1000~70000である熱可塑性樹脂(D)を含有する組成物から形成された有機膜(B)を有する。
本発明における熱可塑性樹脂(D)は、重量平均分子量が1000~70000であることが必要である。本発明の樹脂被覆超薄板ガラスの衝撃耐性の観点から、重量平均分子量が1000以上であることが必要であり、5000以上がより好ましく、10000以上がさらに好ましい。一方、本発明の有機膜(B)の折り曲げ耐性の観点から、重量平均分子量が70000以下であることが必要であり、35000以下であることがより好ましく、25000以下であることがさらに好ましい。ここで、重量平均分子量とは、ゲルパーミエーションクロマトグラフィーにより求めた標準ポリスチレン換算値を指す。
素熱分解性界面活性剤がより好ましい。
本発明における超薄板ガラス(A)の有機膜(B)が形成されていない側には、シロキサン樹脂(E)を含有する組成物から形成されている有機膜(C)を有する。
本発明における有機膜(C)として好適な樹脂組成物としては、シロキサン樹脂(E)を必須成分とし、塗布性の観点から溶媒を含有することが好ましい。
<衝撃耐性>
超薄板ガラス(A)に形成した有機膜(C)側(裏面側)の上側に、厚さ50μmのOCA(商品名「“OPTERIA(登録商標)”MO-3017;リンテック(株)製」)を貼り付けた。次に、OCAの上側を厚さ10mmのSUS304の板に貼り付け、SUS304が下側になるように超薄板ガラス(A)を置いた。
◎:15≦PT1
○:5≦PT1<15
×:PT1<5。
超薄板ガラス(A)に形成した有機膜(C)側が下側になるようにして、耐久試験機DMLHB(ユアサシステム機器(株)製)を用いて、曲率半径(R)2mmにおけるガラスや有機膜に割れ又はひびが発生する回数(BT1)を測定した。最大試験回数は10000回であり、以下の基準で評価した。
◎:BT1=10000(ガラスや有機膜に割れ又はひびの発生無し)
〇:1000≦BT1<10000
×:BT1<1000。
超薄板ガラスの替わりに、厚さ0.5mmの無アルカリガラスを用いて、各実施例および比較例に記載の有機膜(B)を作製した。
超薄板ガラスの替わりに、厚さ0.5mmの無アルカリガラスを用いて、各実施例および比較例により得られた樹脂被覆ガラスを作製した。無アルカリガラスの有機膜(B)側(表面側)に、鉛筆硬度試験器を用いて、所定硬度の鉛筆により、荷重750g、角度45度でなぞり、傷の有無を観察することにより、鉛筆硬度を測定した。
500mLの三口フラスコにメチルトリメトキシシラン47.67g(0.35mol)、フェニルトリメトキシシラン39.66g(0.20mol)、3-トリメトキシシリルプロピルコハク酸無水物26.23g(0.10mol)、3-アクリロキシプロピルトリメトキシシラン82.04g(0.35mol)、ダイアセトンアルコール(以下、「DAA」)182.88gを仕込み、40℃のオイルバスに漬けて撹拌しながら、水55.8gにリン酸0.391g(仕込みモノマーに対して0.2重量部)を溶かしたリン酸水溶液を滴下ロートで10分間かけて添加した。40℃で1時間撹拌した後、オイルバス温度を70℃に設定して1時間撹拌し、さらにオイルバスを30分間かけて115℃まで昇温した。昇温開始1時間後に溶液の内温が100℃に到達し、そこから2時間加熱撹拌した(内温は100~110℃)。反応中に副生成物であるメタノール及び水が合計120g留出した。得られたシロキサン樹脂のDAA溶液に、ポリマー濃度が40重量%となるようにDAAを加えてシロキサン樹脂(PS-1)溶液を得た。なお、得られたシロキサン樹脂(PS-1)の重量平均分子量(以下、「Mw」)をGPCにより測定したところ5,000(ポリスチレン換算)であった。
500mLの三口フラスコにメチルトリメトキシシラン54.48g(0.40mol)、フェニルトリメトキシシラン99.15g(0.50mol)、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン24.64g(0.10mol)、DAA163.35gを仕込み、40℃のオイルバスに漬けて撹拌しながら、水54.0gにリン酸0.535g(仕込みモノマに対して0.3重量部)を溶かしたリン酸水溶液を滴下ロートで10分間かけて添加した。40℃で1時間撹拌した後、オイルバス温度を70℃に設定して1時間撹拌し、さらにオイルバスを30分間かけて115℃まで昇温した。昇温開始1時間後に溶液の内温が100℃に到達し、そこから2時間加熱撹拌した(内温は100~110℃)。反応中に副生成物であるメタノール及び水が合計120g留出した。得られたシロキサン樹脂のDAA溶液に、ポリマー濃度が40重量%となるようにDAAを加えてシロキサン樹脂(PS-2)溶液を得た。なお、得られたシロキサン樹脂(PS-2)のMwをGPCにより測定したところ5,000(ポリスチレン換算)であった。
黄色灯下にてフェニルビス(2,4,6-トリメチルベンゾイル)ホスフィンオキシド(商品名「“Omnirad(登録商標)”819」;IGM社製)1.52gと、ジルコニウムテトラアセチルアセトナート(商品名「“オルガチックス(登録商標)”ZC-150」;マツモトファインケミカル(株)製)1.30gを、DAA23.96g、プロピレングリコールモノメチルエーテルアセテート(以下、「PGMEA」)1.53g、3-メチル-3-メトキシ-1-ブタノール(以下、「MMB」)14.80gの混合溶媒に溶解させ、オキセタニル基を有するシロキサン化合物「“アロンオキセタン(登録商標)”OXT-191」;東亞合成(株)製)0.98g、3-アミノプロピルトリメトキシシラン(商品名「KBM-903」;信越化学工業(株)製)0.43g、トリス(2-ヒドロキシエチル)イソシアヌル酸のアクリル酸エステル(商品名「“アロニックス(登録商標)”M-315」;東亞合成(株)製)4.35g、シリカ粒子のPGMEA30重量%分散液(平均粒子径=20~30nm、商品名「PMA-ST」;日産化学工業(株)製)28.99g、シロキサン樹脂(PS-1)溶液21.74g、含フッ素熱分解性界面活性剤(商品名「DS-21」;DIC(株)製)のPGMEA5重量%溶液0.20g(濃度100ppmに相当)、シリコーン変性アクリル系界面活性剤(商品名「“BYK(登録商標)”-3550」;ビックケミー社製)のPGMEA5重量%溶液0.20g(濃度100ppmに相当)を加え、撹拌した。次いで1.00μmのフィルターでろ過を行い、固形分濃度26重量%のシロキサン樹脂を含有する組成物(GR-1)を調製した。
黄色灯下にてトリフルオロメタンスルホン酸エステル(商品名「MDT」;ヘレウス社製)0.36gを、DAA4.00g、PGMEA8.80g、3-メトキシ-3-メチル-1-ブチルアセテート(沸点=188℃)22.20gの混合溶媒に溶解させ、シラン変性イソシアヌル酸エステル系化合物(商品名「KBM-9659」;信越化学工業(株)製)0.54g、シリカ粒子のPGMEA30重量%分散液(平均粒子径=20~30nm、商品名「PMA-ST」;日産化学工業(株)製)23.89g、シロキサン樹脂(PS-2)溶液39.82g、含フッ素熱分解性界面活性剤(商品名「DS-21」;DIC(株)製)のPGMEA5重量%溶液0.20g(濃度100ppmに相当)、シリコーン変性アクリル系界面活性剤(商品名「“BYK(登録商標)”-3550」;ビックケミー社製)のPGMEA5重量%溶液0.20g(濃度100ppmに相当)を加え、撹拌した。次いで1.00μmのフィルターでろ過を行い、固形分濃度26重量%のシロキサン樹脂を含有する組成物(GR-2)を調製した。
500mLの三口フラスコに熱可塑性ポリエステル樹脂(商品名「“バイロン(登録商標)”200」;東洋紡(株)製)(以下、「バイロン200」)15.00g、PGMEAを84.90g仕込み、60℃のオイルバスにつけて、バイロン200が溶解するまで混合攪拌した。得られたバイロン200のPGMEA溶液に、含フッ素熱分解性界面活性剤(商品名「DS-21」;DIC(株)製)のPGMEA5重量%溶液0.10g(濃度50ppmに相当)を加え、攪拌した。次いで1.00μmのフィルターでろ過を行い、固形分濃度15重量%の熱可塑性樹脂を含有する組成物(GB-1)を調製した。
基板である厚さ50μmの化学強化された超薄板ガラス(商品名「“Dinorex(登録商標)”T2X-1」;日本電気硝子(株)製)の一方(裏面側)に、スプレー塗布装置(商品名「“rCoater(登録商標)”ES1533」;旭サナック(株)製)を用いて、シロキサン樹脂を含有する組成物(GR-1)をスプレー塗布した後、100℃のホットプレートを用いて2分間プリベイクし、プリベイク膜を得た。その後、大日本スクリーン(株)製露光機“XG-5000”を用いて500mJ/cm2(i線換算)で露光し、180℃の熱風オーブンを用いて40分間キュアし、膜厚5μmの有機膜(C-1)を得た。
ハードコート層を製膜しない以外は、実施例1と同様にして樹脂被覆超薄板ガラス(SG-2)を作製した。前述の方法により評価した結果を表2に示す。
シロキサン樹脂を含有する組成物(GR-2)を用いて膜厚5μmの有機膜(C-2)を作製した以外は、実施例1と同様にして樹脂被覆超薄板ガラス(SG-3)を作製した。前述の方法により評価した結果を表2に示す。
有機膜(B-1)作製時のスプレー速度と吐出量を調整することにより、膜厚40μmの有機膜(B-2)を得た。有機膜(B-1)の膜厚を変更した以外は、実施例1と同様にして樹脂被覆超薄板ガラス(SG-4)を作製した。前述の方法により評価した結果を表2に示す。
バイロン200を熱可塑性ポリエステル樹脂(商品名「“バイロン(登録商標)”600」;東洋紡(株)製)に変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-2)を調製した。
バイロン200を塩化ビニル-酢酸ビニル共重合樹脂(商品名「“ソルバイン(登録商標)”TA-5R」;日信化学工業(株)製)に変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-3)を調製した。
バイロン200を(メタ)アクリル酸エステル樹脂(商品名「“ハイパール(登録商標)M-4006」;根上工業(株)製)に変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-4)を調製した。
バイロン200を熱可塑性ポリエステル樹脂(商品名「“バイロン(登録商標)”GK-360」;東洋紡(株)製)に変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-6)を調製した。
バイロン200を熱可塑性ポリエステル樹脂(商品名「“バイロン(登録商標)”270」;東洋紡(株)製)に変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-7)を調製した。
バイロン200を熱可塑性ポリエステル樹脂(商品名「“バイロン(登録商標)”GK-880」;東洋紡(株)製)に変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-8)を調製した。
バイロン200を13.50g、熱硬化性ウレタンアクリレート(商品名「“NKオリゴ(登録商標)”U-6LPA」;新中村化学工業(株)製)(二重結合当量:127g/mol)(以下、「U-6LPA」)を1.50gに変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-9)を調製した。
ハードコート層を製膜しない以外は、実施例11と同様にして樹脂被覆超薄板ガラス(SG-16)を作製した。前述の方法により評価した結果を表2に示す。
バイロン200を12.00g、U-6LPAを3.00gに変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-10)を調製した。
バイロン200を10.50g、U-6LPAを4.50gに変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-11)を調製した。
U-6LPAを熱硬化性ウレタンアクリレート(商品名「“NKオリゴ(登録商標)”UA-122P」;新中村化学工業(株)製)(二重結合当量:550g/mol)に変更した以外は、GB-9と同様にして、熱可塑性樹脂を含有する組成物(GB-12)を調製した。
U-6LPAを熱硬化性ウレタンアクリレート(商品名「“NKオリゴ(登録商標)”U-2HA」;新中村化学工業(株)製)(二重結合当量:200g/mol)に変更した以外は、GB-9と同様にして、熱可塑性樹脂を含有する組成物(GB-13)を調製した。
有機膜(B)、有機膜(C)、ハードコート層を製膜しない超薄板ガラスについて、前述の方法により評価した結果を表2に示す。
有機膜(B-1)を製膜しない以外は、実施例1と同様にして樹脂被覆超薄板ガラス(SG-8)を作製した。前述の方法により評価した結果を表2に示す。
有機膜(C-1)と同様の方法で、超薄板ガラスの表面側に、膜厚5μmのシロキサン樹脂を含有する組成物(GR-1)の有機膜(B-6)を作製した。B-6以外は、実施例1と同様にして樹脂被覆超薄板ガラス(SG-9)を作製した。前述の方法により評価した結果を表2に示す。
有機膜(C-1)を製膜しない以外は、実施例1と同様にして樹脂被覆超薄板ガラス(SG-10)を作製した。前述の方法により評価した結果を表2に示す。
バイロン200を(メタ)アクリル酸エステル樹脂(商品名「“オプティマス(登録商標)”7500」;三菱ガス化学(株)製)に変更した以外は、GB-1と同様にして、熱可塑性樹脂を含有する組成物(GB-5)を調整した。
Claims (16)
- 厚みが10μm以上100μm以下の超薄板ガラス(A)の片側面に有機膜(B)が、他方の面に有機膜(C)が形成された3層からなる樹脂被覆超薄板ガラスであって、前記有機膜(B)が重量平均分子量1000~70000である熱可塑性樹脂(D)を含有する組成物から形成されており、前記有機膜(C)がシロキサン樹脂(E)を含有する組成物から形成されている、樹脂被覆超薄板ガラス。
- 前記有機膜(B)が緩衝膜(b)であり、前記有機膜(C)が強化膜(c)であり、かつ、前記超薄板ガラス(A)の厚みが20μm以上100μm以下である請求項1に記載の樹脂被覆超薄板ガラス。
- 前記有機膜(B)の膜厚が10μm以上100μm以下である請求項1または2に記載の樹脂被覆超薄板ガラス。
- 前記有機膜(C)の膜厚が1μm以上20μm以下である請求項1~3のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記シロキサン樹脂(E)中にあるフェニル基の含有率がSi原子に対して5~60モル%である請求項1~4のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記熱可塑性樹脂(D)のガラス転移温度が40℃~110℃である請求項1~5のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記熱可塑性樹脂(D)がポリエステル樹脂または(メタ)アクリル酸エステル樹脂である請求項1~6のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記有機膜(B)が熱硬化性樹脂を含有する請求項1~7のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記熱硬化性樹脂がウレタン(メタ)アクリレート化合物である請求項1~8のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記ウレタン(メタ)アクリレート化合物を、前記有機膜(B)の全固形中5~35重量%含有する請求項1~9のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記ウレタン(メタ)アクリレートの二重結合当量が100~600g/molである請求項1~10のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記有機膜(B)の黄色度(YI)が|YI|<20である請求項1~11のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記シロキサン樹脂(E)がラジカル重合性基を有する請求項1~12のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記超薄板ガラス(A)が化学強化されている請求項1~13のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 前記有機膜(B)の超薄板ガラス(A)側でない面にハードコート層が積層されている請求項1~14のいずれか一項に記載の樹脂被覆超薄板ガラス。
- 請求項1~15のいずれか一項に記載の樹脂被覆超薄板ガラスを具備する表示デバイスであって、有機膜(B)を表面側にしている表示デバイス。
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CN115636595B (zh) * | 2022-10-17 | 2024-05-31 | 蓝思科技(长沙)有限公司 | 超薄玻璃边缘加工方法 |
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CN116648353A (zh) | 2023-08-25 |
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