WO2022153703A1 - はんだペースト及び接合構造体 - Google Patents

はんだペースト及び接合構造体 Download PDF

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Publication number
WO2022153703A1
WO2022153703A1 PCT/JP2021/044189 JP2021044189W WO2022153703A1 WO 2022153703 A1 WO2022153703 A1 WO 2022153703A1 JP 2021044189 W JP2021044189 W JP 2021044189W WO 2022153703 A1 WO2022153703 A1 WO 2022153703A1
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Prior art keywords
solder
solder paste
solder powder
mass
powder
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Ceased
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PCT/JP2021/044189
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English (en)
French (fr)
Japanese (ja)
Inventor
直倫 大橋
靖弘 大川
行壮 松野
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2022575121A priority Critical patent/JPWO2022153703A1/ja
Priority to EP21919592.2A priority patent/EP4279621A4/en
Publication of WO2022153703A1 publication Critical patent/WO2022153703A1/ja
Priority to US18/346,297 priority patent/US12508677B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/108—Mixtures obtained by warm mixing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Definitions

  • the present invention relates to a solder paste for electrically joining a surface mount (SMT) component to a circuit board and a joining structure formed by using the solder paste.
  • SMT surface mount
  • solder paste is generally supplied to a printed circuit board by a screen printing method, a dispenser method, etc., surface mount components are mounted on it, and the solder is heated using a reflow furnace or the like. A method of melting and electrically joining parts is adopted.
  • the solder paste is produced by stirring and mixing a solder alloy powder and a flux composed of rosin (pine fat) or a liquid thermosetting resin, an activator such as an organic acid, a viscosity modifier, and the like.
  • Such a solder paste is required that the meltability of the solder powder during reflow does not decrease even if it is left in a room temperature environment, and that the viscosity of the paste is stable.
  • the main reason for the decrease in solder meltability in a room temperature environment is that the organic acid is consumed by the reaction of the organic acid contained in the oxide film of the solder powder and the flux forming a salt.
  • the organic acid salt produced by the above reaction promotes the cross-linking of the epoxy resin, and as a result, the paste thickens.
  • Patent Document 1 describes a carboxylic acid-based thickening having a low dissociation constant in the flux and compatibility with the resin component. It has been proposed to include an inhibitor. Further, Patent Document 2 discloses a method of coating an activator with a substance that is decomposed at a soldering temperature higher than the temperature at the time of preheating.
  • a means for adding In may be used to lower the melting point of the solder alloy.
  • In is added to the solder alloy, the melting point is lowered, while the free energy for forming oxide (In 2 O 3 ) of In at 298.15 ° K is as small as -830.7 kJ / mol, and Sn, Bi, Ag, Cu. It is more easily oxidized than the metal elements generally used for soldering. Therefore, the solder powder containing In easily forms an oxide film, and the reaction of the above-mentioned oxide film of the solder powder and the organic acid contained in the flux to form a salt easily proceeds.
  • One aspect of the present invention provides a solder paste comprising at least two types of solder powder, each containing at least two types of metallic elements, in the solder paste.
  • the molar ratio (Ai) of each metal element ( i ) based on all the metal elements constituting the solder powder contained in the solder paste and the free energy for forming the oxide of each metal element ( BikJ / mol).
  • the average free energy of the oxide of the solder powder on the molar basis which is the sum of the product of (Ai x Bi ), is -490 kJ / mol or more, and the total mass of the solder powder contained in the solder paste is calculated.
  • the average melting point of the mass-based solder powder which is the sum of the product (C j ⁇ D j ) of the mass ratio (C j ) of each reference solder powder (j) and the melting point (D j ° C) of the solder powder.
  • the temperature is 121 ° C. or lower.
  • FIG. 1 is a diagram showing an evaluation of a change in viscosity and meltability of a solder paste.
  • FIG. 2 is a diagram showing the free generation energy of the metal oxide.
  • the present invention has been made in view of the above-mentioned problems.
  • a solder alloy containing a metal element that lowers the melting point of an alloy such as In is used, and a solder paste containing an epoxy resin or the like is bonded at a low temperature. It is an object of the present invention to provide a solder paste capable of suppressing the influence on the meltability of a solder alloy even in a room temperature environment, and a mounting structure using the same.
  • one aspect of the present invention provides a solder paste containing at least two kinds of solder powder, each containing at least two kinds of metal elements.
  • solder paste The molar ratio (Ai) of each metal element ( i ) based on all the metal elements constituting the solder powder contained in the solder paste and the free energy for forming the oxide of each metal element ( BikJ / mol).
  • the average melting point of the mass-based solder powder which is the sum of the product (C j ⁇ D j ) of the mass ratio (C j ) of each reference solder powder (j) and the melting point (D j ° C) of the solder powder.
  • the temperature is 121 ° C. or lower.
  • solder powders mean different solder powders. Therefore, the two or more kinds of metal elements constituting the solder powder may be exactly the same between the solder powders, a part may be different and the other parts may be the same, or all the metal elements may be different. When two or more kinds of metal elements constituting each solder powder are the same between the solders, the composition of the metal elements is different between the solder powders. Such "at least two types of solder powder" have different characteristics from each other.
  • the average free energy of the oxide of the solder powder on the molar basis is expressed by the following formula (1):
  • m is an integer of at least 2 which is the number of types of metal elements constituting the solder powder contained in the solder paste, and i is a subscript for distinguishing those metal elements.
  • i 1,2,3, ..., m
  • a i is the molar ratio (non-dimensional) of the metal element i
  • Bi is the free oxide formation of the metal element i at 298.15 ° K. It is energy (kJ / mol)
  • ⁇ means the sum of these products (A i ⁇ Bi ), that is, A 1 ⁇ B 1 + A 2 ⁇ B 2 + ... + A m B m .
  • the sum of the above products is the ratio of the number of each metal element based on the number of all metal elements constituting the solder powder contained in the solder paste, that is, the molar ratio (or atomic ratio). It is, so to speak, the average free energy of oxide formation of solder powder, weighted by. Therefore, in the above-mentioned solder paste of the present invention, the average oxide formation free energy of the solder powder is ⁇ -490 kJ / mol or more. In a preferred embodiment, the average oxide formation free energy of the solder powder is ⁇ -485 kJ / mol or more.
  • the average melting point of the mass-based solder powder is expressed by a mathematical formula as shown in the following formula (2):
  • C j is the mass ratio (dimensionless) of the solder powder j
  • D j is the melting point (° C.) of the solder powder j
  • ⁇ is the product of these (C j ). It means the sum of ⁇ D j ), that is, C 1 ⁇ D 1 + C 2 ⁇ D 2 + ... + C n D n .
  • the average melting point of the solder paste is ⁇ 121 ° C.
  • the average melting point of the solder powder is ⁇ 110 ° C.
  • the solder paste of one aspect of the present invention further contains flux and removes the oxide film formed on the solder powder.
  • At least two types of solder powder include at least one type of solder powder containing In as a metal element.
  • solder paste of one aspect of the present invention 90% by mass or more of at least two kinds of solder powder has a particle size of 20 to 45 ⁇ m.
  • the flux contains an organic acid having a melting point of 60 ° C. or lower, and such an organic acid is a compound having an OH group in the molecule.
  • the flux comprises a thermosetting resin.
  • one aspect of the present invention is to join a bonded structure formed by joining electrical or electronic parts using the solder paste of one aspect of the present invention, for example, a substrate electrode and a component electrode.
  • a bonded structure formed by joining electrical or electronic parts using the solder paste of one aspect of the present invention for example, a substrate electrode and a component electrode.
  • an electrically conductive bonded structure is provided.
  • the solder paste of one aspect of the present invention contains two or more kinds of solder powders having different compositions. In one embodiment, even if the metal elements constituting the two or more kinds of solder powders are exactly the same, the composition may be different. In another aspect, at least one metal element of the metal elements constituting them may be the same among two or more kinds of solder powders.
  • the metal elements constituting the solder powder include, for example, two types of solder powder, and one of them is a solder alloy containing a metal element such as In which can lower the melting point (solder alloy).
  • the other is composed of a solder alloy (solder alloy ⁇ ) composed of a metal element that does not easily form an oxide.
  • the solder paste of one aspect of the present invention can have the characteristics of both solder alloys at least partially. That is, when the solder paste of one aspect of the present invention is used, for example, it is possible to solder at a temperature substantially equal to or close to the melting point of the solder alloy ⁇ , and further, the presence of the solder alloy ⁇ makes it possible to solder the solder oxide film. The reaction between the solder and the flux can be suppressed.
  • solder paste of one aspect of the present invention will be described in more detail by specifically explaining the solder paste of one aspect of the present invention.
  • the free energy ( BikJ / mol) of oxides of each metal element constituting the solder powder used in the above formula (1) is at 298.15 ° K, and is published in various handbooks, for example. There is. Specifically, the values of the standard generated Gibbs energy listed in Table 10.127 of the 5th edition of the Basic Edition of the Chemical Handbook (edited by the Chemical Society of Japan) can be used. When a plurality of oxides of metal elements are present, the one having the smaller absolute value of the standard generated Gibbs energy is selected as a reference.
  • the melting point of the solder powder used in the above formula (2) for example, information provided by the manufacturer of the solder powder can be used.
  • the solder paste of the present embodiment contains a flux component in addition to the solder powder satisfying the above formulas (1) and (2), but in addition to these, it is generally used for forming a solder paste. Other components may be included as needed.
  • solder powder contained in the solder paste of one aspect of the present invention for example, one formed from an alloy selected from two groups can be used.
  • One of them is, for example, Sn-Bi system, Sn-Bi-Sb system, Sn-Ag system, Sn-Cu system, Sn-Ag-Cu system, Sn-Ag-Bi system, Sn-Cu-Bi system, Sn.
  • At least one can be selected from various compositions of at least one solder alloy selected from the group consisting of -Ag-Cu-Bi system.
  • Sn-In system Sn-Bi-In system, Bi-In system, Sn-Ag system, Sn-Ag-Cu system, Sn-Ag-In system, Sn-Cu-In system, Sn- At least one can be selected from various compositions of at least one solder alloy selected from the group consisting of Ag-Cu-In series and Sn-Ag-Cu-Bi-In series. If the constituent elements are the same in both groups, the compositions are different.
  • At least three types of solder alloy solder powder may be mixed and used.
  • the flux component is, for example, an activator having a function of removing an oxide film formed on solder powder such as an organic acid or amine, a thermosetting resin (for example, an epoxy resin) as a binder for imparting the properties of a paste, and the like. It may be composed of rosin (pine fat), solvent or the like.
  • an electrode which is an adherend, an organic acid having a reducing power for removing an oxide film on the surface of alloy particles, a halogen salt of amine, an amine organic acid salt, etc. are used in a heating temperature range.
  • the organic acid include lauric acid, myristic acid, palmitic acid and stearic acid which are saturated aliphatic monocarboxylic acids; crotonic acid which is an unsaturated aliphatic monocarboxylic acid; oxalic acid and L (saturated aliphatic dicarboxylic acid).
  • -)-Apple acid malonic acid, succinic acid, glutaric acid, adipic acid, pimelli acid, suberic acid, azelaic acid, sebacic acid; unsaturated aliphatic dicarboxylic acids maleic acid, fumaric acid; aromatic carboxylic acids Examples thereof include phthalaldehyde acid, phenylbutyric acid, phenoxyacetic acid, phenylpropionic acid; diglycolic acid which is an ether-based dicarboxylic acid, and avietic acid and ascorbic acid which are other organic acids.
  • the halogen salts of amines include ethylamine hydrochloride, diethylamine hydrochloride, dimethylamine hydrochloride, cyclohexylamine hydrochloride, triethanolamine hydrochloride, glutamate, which are amine hydrochlorides; diethylamine odor, which is amine hydrobromide. Examples thereof include hydride and cyclohexylamine hydrobromide.
  • an organic acid having a melting point of 60 ° C. or lower such as levulinic acid, pyruvic acid, acetoacetic acid, and a compound having a melting point of 60 ° C. or lower and having an OH group in the molecule, such as glycerin and triethanolamine, can be used in combination.
  • thermosetting resin for example, a liquid epoxy resin
  • the epoxy resin is, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, glycidylamine type resin, alicyclic epoxy resin, aminopropane type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin.
  • Anthracene type epoxy resin, triazine type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin, fluorene type epoxy resin, phenol aralkyl type epoxy resin, novolak type epoxy resin and the like can be used. These may be used alone or in combination of two or more. Further, although a solid epoxy resin and a liquid epoxy resin can be combined, it is necessary to make the liquid at 25 ° C.
  • thermosetting resin a compound selected from the group of thiol-based compounds, modified amine-based compounds, polyfunctional phenol-based compounds, imidazole-based compounds, and acid anhydride-based compounds may be used. can. These may be used alone or in combination of two or more.
  • a suitable curing agent is selected according to the usage environment and application of the solder paste.
  • an inorganic or organic additive can be used as the viscosity adjusting / epoxy property-imparting additive.
  • silica or alumina is used, and if it is organic, it is solid.
  • Epoxy resin, low molecular weight amide, polyester type, organic derivative of castor oil, organic solvent, etc. are used. These may be used alone or in combination of two or more.
  • the above-mentioned solder paste according to one aspect of the present invention has a characteristic that the viscosity of the solder paste is stable even in an environment of 25 ° C., and also exhibits appropriate meltability at a low temperature, so that the temperature is relatively low, 120. Conduction can be ensured by joining electronic elements (for example, electrodes, electronic components, etc.) at a temperature of ° C. or lower, preferably 110 ° C. or lower. Therefore, one aspect of the present invention provides a bonded structure in which objects are joined using the solder paste of the one aspect of the present invention. Further, one aspect of the present invention also provides a method of joining objects using the solder paste of the one aspect of the present invention.
  • solder paste containing two types of solder powder (first solder powder and second solder powder) in various mass ratios was prepared.
  • first solder powder and second solder powder solder powder
  • second solder powder solder powder
  • 42Sn-58Bi was used as the first solder powder
  • 25Sn-55Bi-20In was used as the second solder powder.
  • 96.5 Sn-3Ag-0.5Cu was used as the first solder powder.
  • 25Sn-55Bi-20In was used as the second solder powder.
  • the change in viscosity of the solder paste was evaluated as follows: After preparing the solder paste, it was left in a freezer at ⁇ 20 ° C. for 24 hours or more to stabilize the viscosity, and then thawed to room temperature to obtain the initial viscosity. Next, the viscosity after storing the paste in a constant temperature bath at 25 ° C. for 24 hours was measured, and the change in viscosity from the initial stage was evaluated. As a method for measuring the viscosity, a viscometer (RE550U) manufactured by Toki Sangyo was used, and the viscosity value after rotating at 5 rpm for 60 seconds was adopted. Pass A if the change in viscosity is within 20% of the initial value after storage at 25 ° C for 24 hours from the initial value, pass B if the change is within 20 to 30%, and fail if the change is 31% or more. It was evaluated as C.
  • the solder meltability was evaluated as follows: After transferring the solder paste onto a ceramic plate with a diameter of 6.5 mm and a thickness of 0.2 mm and a thickness of 0.1 mm using a metal mask, the ceramic plate is placed on a hot plate set at 120 ° C. for 5 minutes. By heating, the solder in the transferred solder paste was melted.
  • the solder in the transferred solder paste becomes one large sphere, and the solder balls with a diameter of 75 ⁇ m or less are not arranged in a semi-continuous ring shape. Passed if the solder balls are arranged in a ring of half a circle or less B, the solder becomes one large sphere, and the solder balls with a diameter of 75 ⁇ m or less are arranged in a ring larger than a half circle around it, and the diameter is more than 75 ⁇ m. Those produced by large solder balls or those in which the solder did not form one large ball were evaluated as rejected C.
  • Example 1 42Sn-58Bi (melting point 139 ° C.) was used as the first solder powder, and 25Sn-55Bi-20In (melting point 96 ° C.) was used as the second solder powder.
  • the average particle size of the solder powder was 20 to 30 ⁇ m, and 90% by mass or more of the solder particles had a particle size of 20 to 45 ⁇ m.
  • thermosetting resin "806” manufactured by Mitsubishi Chemical Corporation, which is a bisphenol F type epoxy resin, was used.
  • activator for removing the oxide film of the solder powder a mixture of levulinic acid as the first material and glycerin as the second material was used.
  • 2P4MHZ manufactured by Shikoku Chemicals Corporation, which is an imidazole-based curing agent, was used.
  • a method for preparing the solder paste of Example 1 20 parts by mass of a bisphenol F type epoxy resin and 0.5 parts by mass of a thixotropy-based additive (THIXCIN R, manufactured by Elementis Japan) were added thereto as a thixotropy-imparting agent. Then, the thixotropy-imparting agent was dissolved by heating and stirring at 120 ° C., and the mixture was allowed to cool to room temperature. A resin mixture was obtained by adding 1 part by mass of an imidazole-based curing agent, 3 parts by mass of levulinic acid, and 1.2 parts by mass of glycerin and kneading with a vacuum planetary mixer for 10 minutes.
  • the average oxide free generation energy of solder powder was calculated as follows.
  • the solder powder contained in the solder paste is composed of 30 parts by mass of the first solder powder 42Sn-58Bi and 70 parts by mass of the second solder powder 25Sn-55Bi-20In.
  • the mass ratio of each metal element contained in 30 parts by mass of 42Sn-58Bi solder and 70 parts by mass of 25Sn-55Bi-20In solder is calculated.
  • the change in viscosity of the solder paste of Example 1 after being left at 25 ° C. for 24 hours was less than 10%, which was a pass A, and the meltability of the solder was such that the solder became one large ball and the diameter was 75 ⁇ m or less around it. Solder balls did not line up in a semi-continuous ring, and passed A.
  • Examples 2 to 6 and Comparative Examples 1 to 3 Similar to Example 1, the solder powders shown in FIG. 1 were mixed at a predetermined ratio to prepare the solder pastes of Examples 2 to 6 and Comparative Examples 1 to 3, and stored at 25 ° C. by the same method. The change in viscosity and the meltability of the solder were evaluated.
  • Example 4 96.5 Sn-3Ag-0.5Cu was used as the first solder powder, and its melting point was 219 ° C.
  • the average particle size of the first solder powder was 20 to 30 ⁇ m, and 90% by mass or more of the solder particles had a particle size of 20 to 45 ⁇ m.
  • the calculation of the average oxide free generation energy of the metal elements of Example 4 is shown below as an example.
  • the atomic weight of Sn is 118.7, the atomic weight of Ag is 107.9, the atomic weight of Cu is 63.6, the atomic weight of Bi is 209.0, and the atomic weight of In is 114.8, Sn is 32.15 mass.
  • the molar ratio of each metal element in the mixed powder composed of%, Ag is 0.3% by mass, Cu is 0.05% by mass, Bi is 49.5% by mass, and In is 18% by mass is as follows.
  • solder paste containing two or more kinds of solder powder
  • the melted solder and other solid solder powder are melted. Since it is compatible with the surface of the solder powder, it may show appropriate meltability even if not all the solder powder is melted.
  • the solder paste according to one aspect of the present invention is heated at 120 ° C., the average melting point of the solder powder is 121 ° C. or lower, so that it has been found to have excellent solder meltability.
  • the solder paste of one aspect of the present invention has the characteristics that it can be joined at a low melting point and the viscosity of the solder paste is stable even in an environment of 25 ° C. It is useful as a structure or the like.

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PCT/JP2021/044189 2021-01-18 2021-12-02 はんだペースト及び接合構造体 Ceased WO2022153703A1 (ja)

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JP2010285580A (ja) * 2009-06-15 2010-12-24 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物及び回路基板
JP2015530705A (ja) * 2012-08-09 2015-10-15 オーメット サーキッツ インク 非共晶はんだ合金を含む電気伝導性組成物
JP2019096616A (ja) * 2017-11-27 2019-06-20 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2020055032A (ja) * 2018-09-28 2020-04-09 株式会社タムラ製作所 成形はんだ及び成形はんだの製造方法

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JPS63180396A (ja) 1987-01-23 1988-07-25 Hitachi Ltd フラツクス
WO2008016140A1 (en) * 2006-08-04 2008-02-07 Panasonic Corporation Bonding material, bonded portion and circuit board
JP2010285580A (ja) * 2009-06-15 2010-12-24 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物及び回路基板
JP2015530705A (ja) * 2012-08-09 2015-10-15 オーメット サーキッツ インク 非共晶はんだ合金を含む電気伝導性組成物
JP2019096616A (ja) * 2017-11-27 2019-06-20 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2020055032A (ja) * 2018-09-28 2020-04-09 株式会社タムラ製作所 成形はんだ及び成形はんだの製造方法

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See also references of EP4279621A4

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