Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
  • H04N13/30—Image reproducers
  • H04N13/365—Image reproducers using digital micromirror devices [DMD]
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
  • H04N13/30—Image reproducers
  • H04N13/302—Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays
  • H04N13/32—Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays using arrays of controllable light sources; using moving apertures or moving light sources
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B30/00—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images
  • G02B30/20—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer's left and right eyes
  • G02B30/26—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer's left and right eyes of the autostereoscopic type
  • G02B30/27—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer's left and right eyes of the autostereoscopic type involving lenticular arrays
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
  • H04N13/30—Image reproducers
  • H04N13/302—Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays
  • H04N13/305—Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays using lenticular lenses, e.g. arrangements of cylindrical lenses
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
  • H04N13/30—Image reproducers
  • H04N13/366—Image reproducers using viewer tracking
  • H04N13/383—Image reproducers using viewer tracking for tracking with gaze detection, i.e. detecting the lines of sight of the viewer's eyes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
  • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
  • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
  • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/855—Optical field-shaping means, e.g. lenses

Definitions

• HPO horizontal parallax-only
• lenticular display lenticular display
• raster barrier display raster barrier display
• parallax barrier display incorporating various means of separating the distinct parallax views in one dimension (e.g., horizontally).
• This class of displays incorporates apertures or lenses to multiplex two-dimensional (2D) pixel arrays into specific and limited visibility angles, thus enabling presentation of distinct parallax or animation sequence scene views to each eye.
• the number of discrete parallax view channels is determined by the field angle of the lenticular lens used within the display, the separation between the pixels and the lens or aperture, the width of the lens or aperture, and the size of the pixels.
• the number of distinct samples in the pixel layer in the horizontal direction is greater than that in the vertical direction by at least a factor of two, and as much as a factor of a hundred or more.
• Standard display technologies such as those based on organic light emitting diode (OLED) or transmissive liquid crystal (LC) technology, are limited in the minimum size of pixels, and consequently the size of lenses or inter-aperture spacings, because the pixel size is constrained by the required display brightness and practical pixel-driver circuit size.
• a display device based on micro light emitting diodes includes a plurality of chiplets.
• Each chiplet includes one or more raxels, each raxel including a plurality of microLEDs supported on a substrate.
• the chiplet also includes a micro integrated circuit (microIC) electronically connected with the one or more raxels.
• MicroIC includes a plurality of interconnects supported on a backplane such that, when connected with the raxel, microIC may be used to electrically drive each one of the microLEDs of the raxel.
• a plurality of chiplets are disposed on a display substrate to for an auto-view horizontal parallax only 3D display.
• FIG. 1 illustrates a display system configuration, in accordance with an embodiment.
• FIG. 2 illustrates a display system pixel configuration including an alternative architecture, in accordance with an embodiment.
• FIGS. 3 and 4 illustrate an alternative display system configuration, in accordance with an embodiment.
• FIGS. 5 and 6 illustrate still another variation of the display system pixel configuration, in accordance with an embodiment.
• FIGS. 7 - 10 illustrate additional variations of the display system pixel configuration, in accordance with further embodiments.
• FIG. 11 illustrates another alternative embodiment of the display system pixel configuration.
• FIGS. 12 - 14 illustrate another exemplary display system configuration, in accordance with an embodiment.
• FIGS. 15 - 17 illustrate additional display system configurations, in accordance with further embodiments.
• FIGS. 18 - 20 illustrate yet another display system configuration, in accordance with an embodiment.
• first, second, third etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
• spatially relative terms such as “beneath,” “below,” “lower,” “under,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” or “under” other elements or features. Thus, the exemplary terms “below” and “under” can encompass both an orientation of above and below.
• the device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
• a layer is referred to as “between” two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
• Embodiments of the invention are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Accordingly, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the invention.
• the pixel density should be relatively high compared to the lens size and/or aperture spacing. Additionally, the luminous flux of the display should be equal to or greater than a 2D display counterpart.
• OLED organic light-emitting diode
• LCDs liquid crystal-based displays
• TFT thin film transistor
• LTPS low temperature polycrystalline silicon
• red-green-blue (“RGB”) pixel limits the size of a red-green-blue (“RGB”) pixel to approximately 30 microns by 30 microns (e.g., the Premium OLED display on the Sony Xperia Z5 phone), approximately 50 microns by 50 microns (e.g., the Liquid Retina display on the Apple iPhone 11), up to approximately 110 by 110 square microns (e.g., the Retina display on the Apple MacBook).
• RGB red-green-blue
• CMOS complementary metal-oxide-silicon
• TFT or LTPS backplanes silicon-based CMOS backplanes are more expensive than TFT or LTPS backplanes. It would not be cost effective to tile a large-scale LC or OLED display panel with a CMOS backplane.
• the lenslets or apertures are generally separately formed from the display pixels in large sheets using, for example, injection molding, extrusion, or printing techniques, and applied to the display pixels using for example, pressuresensitive adhesives.
• microLEDs inorganic micro light emitting diodes
• WO 2019/209945 Al, WO 2019/209957 Al, and WO 2019/209961 to He et al. all of which are incorporated herein by reference in their entirety.
• Emission flux from a single microLED emitter has been demonstrated to be orders of magnitude higher than an even larger area OLED device, and, similarly, higher than emission flux that is practically achievable with a transmissive LC and a backlight.
• the advent of smaller, higher density, brighter, and higher-efficiency emissive pixels allow unique solutions to the problems described above.
• a microLED provides extremely bright light emission at a fraction of the dimensions. For instance, a 10 micron by 10 micron square microLED can emit up to lOOOx the luminous flux of a 10,000 square micron OLED or LC pixel (e.g., 500,000 nits compared to 500 nits).
• the emitters within a microLED display may be spaced such that a full color red-green-blue (RGB) pixel unit can be located within a smaller pitch than 3 microns, where all three colors can be simultaneously and fundamentally emitted.
• RGB red-green-blue
• the microLED light emission area required is much smaller than for an OLED or LC pixel while similarly providing retinal- limited resolution and even higher luminous flux.
• FIG. 1 illustrates the concepts related to a display system incorporating microLEDs, in accordance with an embodiment.
• a microLED emitter array 100 includes a plurality of microLEDs supported on a wafer 104.
• microLEDs 110A, HOB, and 1 IOC are arranged in an array, with each microLED having a pitch ranging from on the order of approximately ten microns and down to the sub-micron level.
• MicroLEDs 110A, HOB, and 110C may each emit light energy that is different from each other in wavelength.
• microLED 110A may emit in a red wavelength range
• microLED 110B may emit in a blue wavelength
• microLEDs 110C may emit in a green wavelength range.
• microLEDs of similar colors are shown arranged in rows within inset 108, the microLEDs may be arranged in other configurations, such as in pairs, clusters, and other suitable formations for specific applications without departing from the scope hereof.
• a portion of microLED emitter array 100 is isolated as a cluster, or “raxel” 120.
• Raxel 120 may be created, for example, by dicing microLED array 100 into multiple raxels.
• raxel 120 includes one each of microLEDs 110A and 110B, and two of microLEDs HOC, supported on a substrate portion 122 of wafer 104.
• Raxel 120 is then electronically connected with a micro integrated circuit (microIC) 130.
• MicroIC 130 includes a plurality of interconnects 132 supported on a backplane portion 134 such that, when connected with raxel 120, microIC 130 may be used to electrically drive each one of microLEDs 110A, 110B, and HOC.
• raxel 120 When raxel 120 is electrically connected with microIC 130, together they form a “chiplet” 135 having an overall pitch on the order of ten microns or less.
• a plurality of chiplets 135 can be transferred to a display backplane to form a microLED display 140, a portion of which is shown in FIG 1.
• MicroLED display 140 includes a plurality of horizontal and vertical bus lines 142 and 144, respectively, supported on a display backplane 146.
• the distance between chiplets 135 may be 50 to 100 microns for the pixel size to remain within under the 150 micron size limit discussed above, while providing high brightness emission at one or more wavelengths, requiring simplified electronic connections, and leaving room on display backplane 146 for additional components, such as sensor elements and other small electronic or optical elements.
• microlenses or other optical elements which are optically coupled with light emitting pixels in a display for steering light from light emitting pixels to a desired location, have dimensions on the order of a hundred microns.
• the optical alignment of such optical elements with respect to chiplet 135 is simplified compared to conventional displays in which the light emitting element takes up most of the pixel real estate.
• artifacts due to shadowing or edge effects resulting from the edges of microlenses or optical elements obscuring portions of microLEDs 110 are eliminated, since microlenses or optical elements may readily cover chiplet 135.
• FIG. 1 shows a rax el 120 being diced from a dense array 100 of microLEDs
• rax el 120 may alternatively be formed by transferring each one or a group of microLEDs from microLED array 100 onto substrate portion 120.
• microLED array 100 may include microLEDs emitting at different wavelengths, as shown in FIG. 1, or all emitting at a single wavelength.
• chiplets e.g., chiplet 135
• a portion of a display 200 includes chiplets 202.
• Each chiplet 202 includes a raxel 210, which in turn includes a plurality of microLEDs 212A, 212B, and 212C supported on a substrate portion 214.
• each raxel 210 includes multiple microLEDs arranged in row(s), as will be described in further detail in FIG. 3 below.
• MicroLEDs 212A, 212B, and 212C are respective examples of microLEDs 110A, HOB, and HOC.
• Raxel 210 is an example of raxel 120.
• each of microLEDs 212A, 212B, and 212C emits light, which may be collected and re-directed by structures such as light cones 216.
• Each one of microLEDs 212A, 212B, and 212C includes an electrical connector 218, which is used for connecting electronically with a microIC 220 via an interconnect 222. Interconnects 222 are supported on a backplane portion 224.
• Chiplet 202 is then connected to a display backplane 230 via connectors 232.
• Connectors 232 may be conductive or nonconductive bonds, for example.
• Each chiplet 202 is overlaid with multi-view optics 240 configured for cooperating with the chiplet for directing light emission from the chiplet to a desired location. The combination of chiplet 202 and multi-view optics 240 forms a pixel 250, as shown in FIG. 2.
• a chiplet 300 includes a raxel 320, which includes a plurality of microLEDs (such as microLEDs 110A, 110B, and 110C from FIG. 1) supported on a substrate portion 322.
• a raxel 320 includes a plurality of microLEDs (such as microLEDs 110A, 110B, and 110C from FIG. 1) supported on a substrate portion 322.
• two rows of seventeen microLEDs are arrayed in raxel 320, forming multiple sub-raxels 324.
• Raxel 320 is configured for electronically connecting with a microIC 330, which in turn includes a plurality of interconnects 332 supported on a backplane portion 334.
• Raxel 320 is an example of raxel 210.
• chiplet 300 as shown in FIG. 3 includes a microlens array 350configured for optical alignment with raxel 320.
• Microlens array 350 includes a plurality of microlenses 352, In an example, each one of microlenses 352 may be configured for optical alignment with one of the microLEDs in raxel 320. Alternatively, each one of microlenses 352 may be sized and aligned to cover each one of sub-raxels 324. For instance, microlens array 350 may be bonded to raxel 320 such that chiplet 300 includes integrated microlenses thereon.
• microlenses 352 may be physically and functionally distinct from conventional lenslets or optical steering elements that are used for segregating light from different sub-raxels 324 to form distinct views. That is microlenses 352 may be considered part of chiplet 300, while a separate set of lenslets may be provided for forming the multiple views formed by an overall 3D display.
• a portion of a display 400 includes a plurality of chiplets 300 supported on a display backplane 410.
• Display backplane 410 includes a plurality of horizontal and vertical bus lines 412 and 414, respectively, such that the portion of display 400 shown includes a four-by-four array of pixels, each pixel including one chiplet 300.
• Each one of chiplets 300 is driven by horizontal and vertical bus lines 412 and 414, respectively, for contributing one of multiple views produced by display 400, such as first and second views 422 and 424, respectively, which are displayed at right and left eyes 432 and 434 respectively using for example, additional lenses or optical steering elements (not shown).
• each microLED emitter has a pixel pitch on the order of a few microns (e.g., less than 10 microns, less than 5 microns, or less than 3 microns), raxel 320 is supported on an equally small CMOS backplane for addressing each microLED, and each chiplet is as small as 10 microns by 60 microns in area.
• the resulting chiplet 300 may include circuitry to interface with an addressing array on a display backplane (e.g., horizontal and vertical bus lines 412 and 414, respectively) using a specific communication protocol.
• each chiplet 300 may be configured to be addressable by simpler TFT or LTPS display drive circuitry, thus greatly reducing the cost and complexity of the resulting display over a comparable OLED or LC display.
• drive circuitry may include one or more of decompression circuits, interpolator circuits, parallax sequencing circuits, or other circuits configured to provide processing functionality.
• the remaining area of display backplane 410 that is not covered by chiplets 300 may be populated with additional electronic or optical components, such as sensors or transistors.
• FIG. 5 An alternative layout of a chiplet is shown in FIG. 5, in accordance with an embodiment.
• a pixel cell 500 includes a chiplet 510 supported on a display back plane 512.
• Chiplet 510 includes a raxel 520, which in turn includes a substrate portion 522 supporting a plurality of microLEDs 524A, 524B, and 524C thereon.
• Raxel 520 is an example of raxel 320. Although each one of microLEDs 524A, 524B, and 524C is shown as emitting a different color of light in FIG.
• microLEDs other configurations are possible, such as where all of the microLEDs emit a single color, just two colors, or they emit a particular color, which is converted to additional wavelengths using color converter arrangements (not shown).
• Raxel 520 is electrically coupled with a microIC 530 (interconnects and other components of microIC 530 are not visible in FIG. 5).
• FIG. 6 illustrates an application of pixel 500 of FIG. 5, in accordance with an embodiment.
• a magnified portion of a display 600 is shown in FIG. 6.
• the portion of display 600 shown in FIG. 6 includes a four-by-four array of pixel cells 500.
• display 600 further includes an array of cylindrical lenslets 620 overlaid over each pixel cell column of display 600, thus providing horizontal-only parallax viewing by uniquely mapping raxel light to distinct angles radiating in the horizontal direction.
• cylindrical lenslets 620 may be replaced with or combined with parallax barriers, which may serve a similar function as the cylindrical lenslets.
• each pixel cell 500 contributes to a view as seen by a viewer 630 and represented by rays 632.
• each pixel cell 500 has dimensions of 150 microns by 150 microns or smaller such that the pixel cell spans approximately one arcmin or less when viewed at a working distance of 500 millimeters away. Since the width of each lenslet 620 is below the perception limit of viewer 630 and the microLED emitters on each chiplet 510 are even smaller than the width of each lenslet 620, display 600 is capable of generating a plurality of directionally distinct output fields. Thus, display 600 operates to provide a surface resolution percept that is equivalent to state-of-the-art 2D display, with the ability to portray high quality, auto-viewed 3D images. [0041] Alternative pixel configurations using linear chiplets similar to those shown in FIGS.
• FIG. 7 shows a pixel 700 including a backplane 710 supporting circuitry 712 thereon. It is noted that, while circuitry 712 are intended to represent the general concept of electronic components supported on backplane 710, and are not representative of specific circuit schematics in components or size. Pixel 700 also includes monochromatic first, second, and third chiplets 722, 724, and 726, respectively. Each one of first, second, and third chiplets 722, 724, and 726 may be separately formed and coupled with backplane 710. As an example, first chiplet 722 includes two rows of microLEDs emitting in a red wavelength range.
• Second chiplet 724 includes a row of microLEDs emitting in a green wavelength range
• third chiplet 726 includes a row of microLEDs emitting in a blue wavelength range.
• First chiplet 722 includes the additional row of red-emitting microLEDs, for example, to compensate for the lower efficiency and brightness commonly exhibited by red microLEDs in comparison to green- or blue-emitting microLEDs currently available.
• Pixel 700 is overlaid with a portion of a cylindrical lenslet 730 for directing light from pixel 700 to a desired location to contribute to a portion of the multiple views provided by the overall display including pixel 700.
• FIG. 8 shows another variation of a pixel using a linear chiplet.
• a pixel 800 includes many of the same components as pixel 700 of FIG. 7 where, again, circuitry 712 is representative, not specific, in terms of electronic components that may be supported on backplane 710.
• Pixel 800 includes a tri chrome chiplet 820, which includes three rows of microLEDs, each row of microLEDs emitting in a particular wavelength range such that each vertical column of microLEDs provides three different colors of light emission.
• This columnar arrangement is distinct from the hexagonal packed structure illustrated in FIG. 5, and may enable higher density packing of the emitters as well as, optionally, variable spacing between the colors. All three rows of microLED emitters, in this case, are driven as a single chiplet.
• FIG. 9 illustrates another variation of the linear chiplet pixel, configured here to increase the density of distinct parallax output fields.
• circuitry 712 shown in FIG. 9 are intended to represent the general concept of electronic components supported on backplane 710, not to indicate specific circuit schematics in components or size.
• a pixel 900 includes a first chiplet 922, including two rows of trichrome microLEDs forming a row of sub-raxels 924.
• Sub-raxel 924 is an example of sub-raxel 324 of FIG. 3. In the example shown in FIG.
• each sub-raxel 924 includes at least one microLED emitting light in a red wavelength range, at least one microLED emitting light in a green wavelength range, and at least one microLED emitting light in a blue wavelength range. While FIG. 9 shows a two-by-two array of microLEDs, other layouts and combinations of light emissions are possible.
• pixel 900 further includes a second chiplet 932, also including two rows of trichrome microLEDs forming a row of sub-pixels 934.
• Second chiplet 932 is offset from first chiplet 922 by half of a sub-pixel, as shown in the example in FIG. 9.
• the left-most sub-pixel of first chiplet 922 is configured for providing a left-most portion of a view
• the left-most sub-pixel of second chiplet 932 is configured for providing the second left-most portion of a view, and so on as shown in FIG. 10.
• a view 1020 seen by a viewer 1030 is a combination of views 1, 2, 3, 4... (shown in FIG. 10 forming view 1020) as provided by sub-pixels 1, 2, 3, 4... (shown as numbers adjacentto sub-pixels 924 and 934 corresponding to first and second chiplets 922 and 932, respectively).
• the resultant parallax views provided by each of first and second chiplets 922 and 932, respectively can be interlaced such that the horizontal parallax sampling is increased beyond pixel pitch limits, thus producing a higher angular resolution for a given pixel pitch by two chiplets as compared to that achievable with a single chiplet.
• a similar approach may be applied to parallax barrier-based display systems incorporating chiplets therein.
• a pixel 1100 includes first and second chiplets 1110A and 1 HOB, respectively.
• First chiplet 1110A is horizontally oriented along a top edge of pixel 1100, and includes a raxel 1120.
• Raxel 1120 is an example of raxel 120 of FIG. 1.
• Raxel 1120 is electrically coupled with a microIC (not visible in FIG. 11) as discussed above.
• Raxel 1120 includes a substrate portion 1122 supporting a row of sub-raxels 1124 thereon.
• Each sub-raxel 1124 includes first, second, and third microLEDs 1126A, 1126B, and 1126C, respectively.
• first, second, and third microLEDs 1126 A, 1126B, and 1126C emit light at different wavelength ranges, such as in the red, green, and blue wavelength ranges as an example.
• First chiplet 1110A is overlaid with a lens 1130. Alternatively, a parallax barrier may be provided in place of or in addition to lens 1130.
• Second chiplet 1110B includes essentially the same components as first chipl et 1110A, and is oriented vertically along a left edge of pixel 1100, as shown in the exemplary embodiment of FIG. 11.
• first and second chiplets 1110A and 1110B respectively, enables pixel 1100 to provide horizontal-only parallax 3D views even when the display is rotated.
• the display device may only use first chiplet 1110A when the display device is being held in a first position and, when the display device senses it has been turned by 90-degrees into a second position, then the display device deactivates first chiplet 1110A and activates second chiplet 1110B.
• Such a feature would be applicable, for example, for a cellphone or a tablet to be able to provide auto-view horizontal-only parallax views when the device is being held in a portrait or landscape mode.
• pixel 1100 of FIG. 11 further includes a single RGB emitter 1140.
• Single RGB emitter 1140 includes a substrate portion 1142 supporting a sub-pixel 1144. While substrate portion 1142 is shown as a square, other shapes (e.g., hexagonal) may be used for specific applications.
• Sub-pixel 1144 includes a first microLED 1146A emitting light in a red wavelength range, a second microLED 1146B emitting light in a green wavelength range, and a third microLED 1146C emitting light in a blue wavelength range.
• Single RGB emitter 1140 may be used, for example, for display of standard (i.e., no parallax) 2D image and thus does not require multi -view optics integrated thereon.
• Single RGB emitter 1140 may be used in the display of a 2D image when the display device incorporating pixel 1100 is not being used to display a 3D image.
• both 3D and 2D modes may be simultaneously activated such that a 2D image may be presented on the surface of the display device while a 3D image or a particular portion of the 2D image may be presented as a 3D obj ect floating above or below the surface of the display device.
• additional electronic or optical components may be incorporated into the available areas of pixel 1100.
• one or more sensors may be incorporated into pixel 1100 to perform tasks such as brightness sensing, motion sensing, depth sensing, and head/eye/gaze tracking.
• FIGS. 12 - 14 An alternative display architecture incorporating the chiplet concept is illustrated in FIGS. 12 - 14.
• a portion of a display 1200 includes a plurality of lenslets 1210 arranged in adjacent columns. Rather than being supported on a display backplane, a plurality of chiplets 1220 are attached directly to each lenslet 1210.
• the array of lenslets 1210 also includes signal-conducting bus lines 1230 embedded between the optically active regions of lenslets 1210 and connected to each chiplet 1220 via branch conductors 1232.
• Bus lines 1230 and branch conductors 1232 may be, for example, embedded within lenslets 1210 or printed on a surface of the array of lenslets 1210 using screen printing, metal deposition, or other suitable methods. Laterally-adjacent chiplets may be offset from each other as illustrated in Figure 12, or aligned, as illustrated in figure 6.
• FIG. 13 A side cross-sectional view of a portion of lenslet 1210 incorporating a chiplet 1220 is shown in FIG. 13. As shown in FIG. 13, chiplet 1220 may be held in place by mounting features 1310, as an example. Mounting features 1310 may be clip-like features configured for securely accommodating at least a portion of chiplet 1220 therein, and may be molded during the fabrication process of lenslet 1210, or added after the fabrication of lenslet 1210. Mounting features 1310 may also incorporate electronic wiring for connecting chiplet 1220 with branch conductors 1232.
• FIG. 14 A top cross-sectional view of a different portion of the array of lenslets 1210 is shown in FIG. 14.
• chiplets 1220 are attached to lenslets 1210 and electrically accessed via conductive bus lines 1230.
• a first portion of upper chiplet 1220 as shown in FIG. 14, emits light, represented by solid arrows 1410, that is directed downward in the figure by the curvature of lenslet 1210.
• a different second portion of the same upper chiplet 1220 emits light, represented by dashed arrows 1412, that is directed upward in the figure by the curvature of lenslet 1210, thus providing a different view from the first portion of upper chiplet 1220 and resulting in horizontal-only parallax views.
• the array of lenslets 1210 becomes the structural element of the display device, without requiring a display backplane, thus enabling thinner display.
• this architecture promotes higher precision alignment of chiplets 1220 with their associated optical elements, resulting a reduction of optical aberrations and image artifacts.
• optical emission fields may be more effectively isolated from pixel to pixel, thus reducing display crosstalk and further enhancing the image quality.
• manufacturability of the display device may be improved, for example, by constructing each row of lenslets as strips integrating the chiplets and branch conductors therein, then assembling the display device column by column from the strips.
• FIGS. 15 and 16 Another arrangement of such integration of chiplets directly with lenslets is illustrated in FIGS. 15 and 16.
• a flat display 1500 provides horizontal- only parallax views to a viewer 1510.
• Flat display 1500 includes chiplets 1530 supported by columns of lenslets 1540.
• a chiplet 1530A reliably provides parallax views with low aberration.
• extreme off-axis operation of the display will likely lead to visual artifacts and optical aberrations in the views presented to viewer 1510, for example, when chiplet 1530B and lenslet 1540B are still aligned with the plane of flat display 1500.
• the orientation angle of each column of lenslets may be adjusted from the center of the display to the edges in order to mitigate the aberrations that result from the display architecture illustrated in FIG. 15.
• a chiplet 1630B and lenslet 1640B located closer to the center of the display, may be rotated toward the central axis by some amount, a chiplet 1630C integrated into a lenslet 1640C near an edge of the flat display may be further rotated toward a central axis of the display (e.g. by 31 -degrees), and so on.
• edge effects and other optical aberrations may be reduced.
• a curved display 1700 is configured to provide horizontal-only parallax views to a viewer 1710.
• the curvature of the display is such that the lenslets, and consequently the chiplets integrated therein, are curved toward the eyebox of viewer 1710 as shown.
• FIGS. 18 - 20 Another display architecture is illustrated in FIGS. 18 - 20, shown here to illustrate an alternative type of lenslets and a conformally-curved emitter strip.
• a Luneburg lens with a graded refractive index varying from center to perimeter is designed with conjugate foci at infinity and, at the surface of the lens, produces high quality transforms.
• a lenslet portion 1800 includes a gradient-index Luneburg-type cylindrical lenslet 1810 with curved chiplets 1820 integrated thereon.
• FIG. 19 A top cross-sectional view of lenslet portion 1800 is shown in FIG. 19.
• lenslet 1810 is supported by a pre-formed bed 1910, which also includes conductive bus lines 1920 for electrically coupling with curved chiplets 1820. Due to the refractive properties of the Luneburg lens, light from different portions of curved chiplet 1820 produce collimated output emerging from the opposite surface as represented by light rays 1950 and 1955.
• curved chiplets 1820 may instead be integrated into pre-formed bed 1910 so as to conformally contact lenslet 1810 as shown in FIG. 19.
• multiple lenslets 1810 may be arranged in columns to form a display.
• Each of curved chiplets 1820 may be addressed for instance, via bus lines 2010. This Luneburg approach would have the advantage of providing much larger fields of view due to the high quality optical performance effected by the Luneburg lenses over large angles. This approach would also likely provide relative simplicity, in terms of optical components, in the manufacturing process.
• microLED chiplet approach for providing autoviewed 3D displays fundamentally separates the large pixel bed of the display from the parallax -generating optics sheet by discretizing individual pixel cell emitters into their own modules. This approach in conjunction with high speed, high resolution pick-and-place assembly systems or monolithically integrated microLED fabrication, enables heretofore unavailable display structural and system architectures.
• the ratios between the size and pitch of the pixels, the size and pitch of the lenslet, the field of view (or distribution angle) of the lenslet, and the focal length of the lenslet may be adjusted and optimized for each display application, such as for small form factor wearable displays to ultra high resolution displays and large scale displays.
• the positioning of the emitters within chiplets can be varied to meet the needs of the specific display system. For instance, nonlinear spacing of parallax views or compensation for optical distortion due to the lenslets may be achieved by appropriate microLED layout schemes.

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• 2021
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