WO2022134896A1 - 柔性电路板和显示装置 - Google Patents

柔性电路板和显示装置 Download PDF

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Publication number
WO2022134896A1
WO2022134896A1 PCT/CN2021/129373 CN2021129373W WO2022134896A1 WO 2022134896 A1 WO2022134896 A1 WO 2022134896A1 CN 2021129373 W CN2021129373 W CN 2021129373W WO 2022134896 A1 WO2022134896 A1 WO 2022134896A1
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WO
WIPO (PCT)
Prior art keywords
area
protective layer
circuit board
flexible circuit
substrate
Prior art date
Application number
PCT/CN2021/129373
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English (en)
French (fr)
Inventor
毕先磊
姚巡
吴建君
兰传艳
马倩
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/926,719 priority Critical patent/US20230209704A1/en
Publication of WO2022134896A1 publication Critical patent/WO2022134896A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a flexible circuit board and a display device.
  • Flexible Printed Circuit is a highly reliable and flexible printed circuit board made of polyimide or polyester film as the base material.
  • Flexible circuit boards have the characteristics of high wiring density, light weight, thin thickness and good bendability, so they are widely used in mobile phones, notebook computers, digital cameras and other products.
  • a flexible circuit board in one aspect, includes a substrate, a first conductive layer and a first protective layer.
  • the substrate has a body region, a first binding region, and a connecting region between the body region and the first binding region.
  • a first conductive layer is located on the first side of the substrate, and the first conductive layer extends from the body region to the first bonding region through the connection region.
  • a first protective layer is located on the side of the first conductive layer away from the substrate, the first protective layer extends from the body region to the connection region, and the first protective layer does not completely cover the connection area.
  • connection area includes a first area and a second area connected to each other, the first area is closer to the body area than the second area, and the first area is also connected to the body
  • the second area is also connected to the first binding area; the first protective layer covers the first area, and the first protective layer does not cover the second area.
  • the distance from any position on the interface between the first area and the second area to the main body area is smaller than the distance from the position to the first binding area.
  • the distance from any position on the interface between the first region and the second region to the main body region is greater than or equal to 0.5 mm.
  • an area of the connection area covered by the first protective layer is smaller than an area of the connection area not covered by the first protective layer.
  • the flexible circuit board further includes a second protective layer, the second protective layer is located on a side of the first conductive layer away from the substrate; the second protective layer at least covers the connection The area in the area that is not covered by the first protective layer.
  • the second protective layer also covers part of the first protective layer.
  • a portion where the orthographic projection of the second protective layer on the substrate overlaps with the orthographic projection of the first protective layer on the substrate is a first overlapping portion, and the first overlapping portion On the connection area, the distance between an end of the first overlapping portion close to the main body area and an end of the first overlapping portion away from the main body area is greater than or equal to 0.2 mm.
  • a portion of the first conductive layer located in the first binding area includes a plurality of conductive blocks; the flexible circuit board further includes a third protective layer, and the third protective layer includes a plurality of conductive blocks A conductive protective film, one of the conductive protective films covers one of the conductive blocks; the second protective layer also covers a partial area of the first binding area and a partial area of any one of the conductive protective films.
  • the overlapping portion of the orthographic projection of the second protective layer on the substrate and the orthographic projection of the conductive protective film on the substrate is a second overlapping portion, and the second overlapping portion On the first binding area, the distance between an end of the second overlapping portion close to the connection area and an end of the second overlapping portion away from the connection area is greater than or equal to 0.2 mm.
  • the second protective layer includes a green oil protective layer.
  • the thickness of the second protective layer is less than the thickness of the first protective layer.
  • the flexible circuit board further includes a second conductive layer and a fourth protective layer.
  • the second conductive layer is located on a second side of the substrate, and the second side is a side of the substrate opposite to the first side; the second conductive layer covers the main body region.
  • the fourth protective layer is located on the side of the second conductive layer away from the substrate, and the fourth protective layer extends from the main body region to the first binding region through the connection region; At least one first opening is disposed on the four protective layers, and an orthographic projection of the at least one first opening on the substrate is located in the connection area.
  • the fourth protective layer includes a first portion, a second portion and at least two rib structures.
  • the first part covers at least the main body area; the second part covers at least the first binding area; the orthographic projections of the at least two rib structures on the base are located in the connection area, each The opposite ends of the rib-shaped structure are respectively connected to the first part and the second part; between any two adjacent rib-shaped structures and the first part and the second part, a said The first opening.
  • the fourth protective layer includes two rib-shaped structures, and the two rib-shaped structures respectively extend along two opposite sides of the connecting region.
  • the width of each of the rib structures is 0.2 mm ⁇ 1 mm.
  • the distance from any point on the boundary of the orthographic projection of the first protective layer on the connection area to the orthographic projection of the first opening on the connection area is greater than or equal to 0.5 mm.
  • the first protective layer includes a first insulating layer and a first adhesive layer, the first adhesive layer being closer to the first conductive layer than the first insulating layer; and/or , the fourth protective layer includes a second insulating layer and a second adhesive layer, the second adhesive layer is closer to the second conductive layer than the second insulating layer.
  • the flexible circuit board further includes: an integrated chip located on a side of the fourth protective layer away from the substrate, and an orthographic projection of the integrated chip on the substrate is located in the main body area,
  • the integrated chip passes through the fourth protective layer to be electrically connected with the second conductive layer;
  • the reinforcing layer is located on the side of the first protective layer away from the substrate, and the reinforcing layer is located on the side of the first protective layer away from the substrate.
  • the orthographic projection on the substrate overlaps or partially overlaps the orthographic projection of the integrated chip on the substrate.
  • a display device in another aspect, includes a display panel and the flexible circuit board described in any one of the above embodiments. Wherein, the first binding area of the flexible circuit board is bound on the display panel.
  • FIG. 1 is a structural diagram of a flexible circuit board according to some embodiments
  • 2A is a cross-sectional view of a flexible circuit board at NN' according to some embodiments
  • 2B is a structural diagram of a flexible circuit board after bending according to some embodiments.
  • FIG. 3 is a partial bottom view of a flexible circuit board according to some embodiments.
  • 4A is a cross-sectional view of another flexible circuit board at NN' according to some embodiments.
  • 4B is a structural diagram of another flexible circuit board after bending according to some embodiments.
  • FIG. 5 is a partial top view of another flexible circuit board according to some embodiments.
  • FIG. 6 is a cross-sectional view of yet another flexible circuit board at NN' according to some embodiments.
  • FIG. 7 is a cross-sectional view of yet another flexible circuit board at M-M' according to some embodiments.
  • FIG. 8 is a structural diagram of a display device according to some embodiments.
  • FIG. 9 is a flowchart of a method of fabricating a flexible circuit board according to some embodiments.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • the expressions “coupled” and “connected” and their derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
  • the embodiments disclosed herein are not necessarily limited by the content herein.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes of the drawings due to, for example, manufacturing techniques and/or tolerances, are contemplated.
  • example embodiments should not be construed as limited to the shapes of the regions shown herein, but to include deviations in shapes due, for example, to manufacturing. For example, an etched area shown as a rectangle will typically have curved features.
  • the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • a display device mainly includes a display panel, a flexible circuit board and a control circuit board.
  • the first binding end of the flexible circuit board is bound to the display panel, and by bending the part of the flexible circuit board close to the first binding end, the rest of the flexible circuit board can be bent to the back side of the display panel, Therefore, the second binding end of the flexible circuit board can be bound to the control circuit board on the back side of the display panel.
  • the inventors of the present disclosure have found through research that the portion of the flexible circuit board in the related art that is bent to the back side of the display panel is prone to rebound and warp. At the same time, the bent part of the flexible circuit board is also prone to tearing.
  • the flexible circuit board 100 includes a substrate 1 , a first conductive layer 2 and a first protective layer 3 .
  • the substrate 1 has a main body area A, a first binding area B, and a connection area C between the main body area A and the first binding area B.
  • the main body area A includes a component mounting area
  • the component mounting area is an area on the substrate 1 for mounting devices such as chips.
  • the distance between the boundary position between the main body area A and the connection area C and the component mounting area is greater than a preset distance (for example, 0.8 mm), so that when the connection area B is bent, The main body region A is not easily affected by bending stress, which helps to improve the connection reliability of devices such as chips.
  • the first conductive layer 2 is located on the first side of the substrate 1 , and the first conductive layer 2 extends from the body region A to the first binding region B through the connection region C.
  • the first protective layer 3 is located on the side of the first conductive layer 2 away from the substrate 1 , the first protective layer 3 extends from the main body region A to the connection region C, and the first protective layer 3 does not completely cover the connection region C.
  • the material of the substrate 1 may be polyimide (Polyimide, PI for short).
  • the material of the first conductive layer 2 may be copper.
  • the material of the first protective layer 3 may include insulating materials.
  • the flexible circuit board 100 may be a main flexible circuit board (Main Flexible Printed Circuit, referred to as MFPC for short) for driving the display panel to realize a display function, or may also be a touch flexible circuit board for driving the display panel to realize a touch function A circuit board (Touch Flexible Printed Circuit, abbreviated as TFPC), which is not limited in this disclosure.
  • MFPC Main Flexible Printed Circuit
  • TFPC Touch Flexible Printed Circuit
  • the positions of the flexible circuit board 100 corresponding to the connection regions C that are not covered by the first protective layer 3 have fewer film layers and thinner thicknesses, so that the corresponding connection regions C in the flexible circuit board 100 are relatively thin.
  • the position of the connecting region C has better flexibility. Therefore, when the first binding area B of the flexible circuit board 100 is bound to the display panel, the position corresponding to the connecting area C in the flexible circuit board 100 can be bent (see FIG. 2B ), so that the flexible circuit board 100 is located in the display panel.
  • the part of the connection area C away from the first binding area B is easier to bend to the back side of the display panel, and can reduce the main body area A of the flexible circuit board 100 when the flexible circuit board 100 is bent to the back side of the display panel.
  • the rebound force F received at the place is perpendicular to the direction of the substrate 1 , thereby helping to improve the problem that the flexible circuit board 100 is prone to rebound and warp after bending.
  • the flexible circuit board 100 has better flexibility, in the display device having the flexible circuit board 100, the flexible circuit board can be bent more to the back side of the display panel of the display device, reducing the number of flexible circuits
  • the board occupies the surrounding space of the display panel, so that the frame of the display device can be set narrower.
  • the first protective layer 3 may not completely cover the connection region C, the use of the material of the first protective layer 3 can also be reduced, and the manufacturing cost of the flexible circuit board 100 can be reduced.
  • the first protective layer 3 does not completely cover the connection region C. In some embodiments, at least one opening may be provided on the portion of the first protective layer 3 covering the connection region C to expose part of the first conductive layer 2 .
  • connection area C may include a first area C1 and a second area C2 connected to each other, the first area C1 is closer to the main body area A than the second area C2, and the first area C1 is closer to the main body area A than the second area C2.
  • the area C1 is also connected to the main body area A, and the second area C2 is also connected to the first binding area B.
  • the first protective layer 3 covers the first region C1, and the first protective layer 3 does not cover the second region C2.
  • the first protective layer 3 covers the first area C1 close to the main body area A, but does not cover the second area C2, so that the overall film layer in the second area C2 of the flexible circuit board 100 is less, so that the flexible circuit can be bent by bending
  • the position of the board 100 corresponding to the second area C2 makes the part of the flexible circuit board 100 located on the side of the second area C2 away from the first binding area B easier to bend to the back side of the display panel, effectively improving the flexible circuit
  • the bending properties of the plate 100 is .
  • the distance d1 from any position on the interface between the first area C1 and the second area C2 to the main body area A is smaller than the distance d2 from the position to the first binding area B.
  • the area of the first region C1 is smaller than that of the second region C2, that is, the area of the easily bendable area in the connection area C is larger than the area of the connection area C that is not easily bendable, thereby further improving the flexible circuit board 100 The flexibility at the position corresponding to the connection region C in .
  • the present disclosure does not limit the shape of the orthographic projection of the interface between the first region C1 and the second region C2 on the substrate 1 .
  • the shape of the orthographic projection of the interface on the substrate 1 may be a straight line segment.
  • the shape of the orthographic projection of the interface on the substrate 1 may be a curve segment or a polyline segment.
  • the distance d1 from any position on the interface between the first region C1 and the second region C2 to the main body region A is greater than or equal to 0.5 mm.
  • the area of the first region C1 is small, that is, the area of the first protective layer 3 covering the connecting region C is small, and the area of the part of the connecting region C that is not covered by the first protective layer 3 is large, thereby improving flexibility The flexibility at the position corresponding to the connection area C in the circuit board 100 .
  • the area of the area of the connection area C covered by the first protective layer 3 is smaller than the area of the area of the connection area C not covered by the first protective layer 3 .
  • the present disclosure does not limit the shape of the portion of the first protective layer 3 covering the connection region C. In this way, the area of the area not covered by the first protective layer 3 in the connection area C is larger, and the area of the area where the flexible circuit board 100 is easily bent at the connection area C is larger, so that the flexible circuit board 100 corresponds to the area of the connection area C.
  • the position has better flexibility. Therefore, by bending the position of the flexible circuit board 100 corresponding to the connection area C, the part of the flexible circuit board 100 on the side of the connection area C away from the first binding area B can be easily bent to the back side of the display panel.
  • the flexible circuit board 100 further includes a second protective layer 4 .
  • the second protective layer 4 is located on the side of the first conductive layer 2 away from the substrate 1 .
  • the second protective layer 4 covers at least the area of the connection area C that is not covered by the first protective layer 3 (that is, the second protective layer 4 covers at least the part of the first conductive layer 2 corresponding to the connection area C that is not covered by the first protective layer 3 covered parts).
  • the second protective layer 4 can effectively protect the first conductive layer 2 and prevent the first conductive layer 2 from being exposed, thereby helping to prevent the wiring in the first conductive layer from being damaged due to corrosion of the first conductive layer, resulting in flexibility A situation occurs when the circuit of the circuit board fails.
  • the second protective layer 4 not only covers the area of the connection area C that is not covered by the first protective layer 3
  • the second protective layer 4 may also cover part of the first protective layer 3. That is, the second protective layer 4 covers the side surface of the first protective layer 3 close to the first binding area B and a part of the surface of the first protective layer 3 away from the substrate 1 that is close to the first binding area B.
  • the first conductive layer 2 is also completely covered, thereby effectively avoiding the exposure of the first conductive layer close to the edge of the first protective layer due to the process error existing in the formation of the second protective layer, and further protecting the first conductive layer.
  • the traces in 2 are not easily corroded, which helps to improve the service life of the flexible circuit board 100 .
  • the overlapping portion of the orthographic projection of the second protective layer 4 on the substrate 1 and the orthographic projection of the first protective layer 1 on the substrate 1 is the first overlapping portion 41 ,
  • the first overlapping portion 41 is located on the connecting region C, and the distance d3 between one end of the first overlapping portion 41 close to the main body region A and the end of the first overlapping portion 41 away from the main body region A is greater than or equal to 0.2 mm.
  • the second protective layer 4 can be completely overlapped on the first protective layer 3, which is beneficial to prevent the second protective layer from falling off the first protective layer and exposing the first protective layer due to the small overlapping size of the second protective layer.
  • the occurrence of the conductive layer enables the second protective layer 4 to better protect the first conductive layer 2 close to the boundary portion of the first protective layer 3, so that the traces in the first conductive layer 2 are less likely to be corroded, which helps In order to improve the service life of the flexible circuit board 100 .
  • the portion of the first conductive layer 2 located in the first bonding region B includes a plurality of conductive blocks 21 .
  • the flexible circuit board 100 may further include a third protective layer 5 , the third protective layer 5 includes a plurality of conductive protective films 51 , and one conductive protective film 51 covers one conductive block 21 .
  • the conductive protective film 51 covers the conductive block 21 to protect the conductive block 21 and prevent the conductive block 21 from being corroded.
  • the material of the conductive protective film 51 may include nickel and gold.
  • the second protective layer 4 may also cover the first binding area B Part of the area and any part of the conductive protective film 51 .
  • the second protective layer 4 covers part of the first binding area B, which may be the part of the first binding area B that is not covered by the conductive block 21 .
  • the first binding area B may correspond to The portion between any two adjacent conductive blocks 21 .
  • the part of the area where the second protective layer 4 covers any conductive protective film 51 may be the part of the second protective layer 4 covering the side of the conductive protective film 51 close to the connection area C and the surface of the conductive protective film 51 away from the substrate 1 close to the connection area C surface.
  • the second protective layer 4 can also better cover the part of the first conductive layer 2 close to the conductive protective layer 51 (for example, it may be a trace connected to the conductive block 21 ), so as to better protect the first conductive layer 2 , so that the first conductive layer 2 is not easily corroded, which helps to improve the service life of the flexible circuit board 100 .
  • the overlapping portion of the orthographic projection of the second protective layer 4 on the substrate 1 and the orthographic projection of the conductive protective film 51 on the substrate 1 is the second overlapping portion 42 .
  • the overlapping portion 42 is located on the first binding area B, and the distance d4 between the end of the second overlapping portion 42 close to the connecting area C and the end of the second overlapping portion 42 far from the connecting area C is greater than or equal to 0.2 mm.
  • the second protective layer 4 is completely overlapped on each conductive protective layer 51, and is not easy to fall off, thereby helping to protect the part of the first conductive layer 2 close to the conductive protective layer 51 (for example, it can be in phase with the conductive block 21). connected traces).
  • the second protective layer 4 may include a green oil (ie, liquid photoresist) protective layer. That is, the material of the second protective layer 4 may be green oil.
  • the material of the second protective layer 4 in the present disclosure is not limited to this. Exemplarily, the material of the second protective layer 4 may also be photosensitive ink or solder resist ink.
  • the thickness of the second protective layer 4 may be smaller than the thickness of the first protective layer 3 .
  • the thickness of the area covered with the second protection layer 4 in the connection area C of the flexible circuit board 100 is smaller than the thickness of the part covered with the first protection layer 3 in the connection area C, so that the connection area of the flexible circuit board 100 is covered with the second protection layer 4 .
  • the area of the layer 4 has a thinner thickness and better flexibility, which facilitates the bending of the flexible circuit board 100 .
  • the thickness of the second protective layer 4 may be 10 ⁇ m ⁇ 30 ⁇ m
  • the thickness of the first protective layer 3 may be 40 ⁇ m.
  • the flexible circuit board 100 further includes a second conductive layer 6 and a fourth protective layer 7 .
  • the second conductive layer 6 is located on the second side of the substrate 1 , and the second side is the side of the substrate 1 opposite to the first side.
  • the second conductive layer 6 covers the body region A.
  • the fourth protective layer 7 is located on the side of the second conductive layer 6 away from the substrate 1 , and the fourth protective layer 7 extends from the main body region A to the first binding region B through the connection region C.
  • the fourth protective layer 7 is provided with at least one first opening 71 , and the orthographic projection of the at least one first opening 71 on the substrate 1 is located in the connection region C. As shown in FIG.
  • At least one first opening 71 is provided at the position of the fourth protective layer 7 corresponding to the connection area C, so that the flexible circuit board 100 corresponds to the position of the first opening 71
  • the flexible circuit board 100 has better flexibility at the position corresponding to the first opening. Therefore, when the first binding area B of the flexible circuit board 100 is bound to the display panel, the position of the flexible circuit board 100 corresponding to the first opening 71 can be bent (see FIG. 4B ), so that the flexible circuit board 100 is located in the first opening 71 .
  • the part of the opening 71 away from the first binding area B is easier to bend to the back side of the display panel, and can reduce the rebound force F perpendicular to the direction of the substrate 1 on the main body area A of the flexible circuit board 100 , thereby helping It is used to improve the problem that the flexible circuit board is prone to rebound and warping after bending.
  • the flexible circuit board 100 has good flexibility, in the display device having the flexible circuit board 100, the flexible circuit board 100 can be bent more to the back side of the display panel of the display device, reducing the flexibility
  • the circuit board 100 occupies the surrounding space of the display panel, so that the frame of the display device can be set narrower.
  • the first protective layer 3 does not completely cover the connection area C, and at least one first opening 71 is provided at the position of the fourth protective layer 7 corresponding to the connection area C, which can also make The stress center line of the flexible circuit board is moved outward, which is beneficial to avoid the overlapping of the stress center line with the first conductive layer or the first protective layer, reducing the tension on the first conductive layer 2, thereby reducing the tearing and cracking of the flexible circuit board. risks of.
  • the fourth protective layer 7 extends from the main body region A to the first binding region B through the connecting region C, that is, the fourth protective layer 7 also covers the first binding region B.
  • This arrangement can also help to prevent the problem of wrinkles at the first binding area B due to the thin thickness of the flexible circuit board 100 at the first binding area B.
  • a plurality of conductive blocks 21 are provided on the first binding area B (for binding the flexible circuit board to the binding area of the display panel), such setting can also help to avoid wrinkles on the conductive blocks 21 , causing the binding failure to occur.
  • the fourth protective layer 7 may include a first portion 72 , a second portion 73 and at least two rib structures 74 .
  • the first part 72 covers at least the main body area A.
  • the second portion 73 covers at least the first binding area B.
  • the orthographic projections of the at least two rib structures 74 on the substrate 1 are located in the connecting region C, and opposite ends of each rib structure 74 are respectively connected to the first portion 72 and the second portion 73 .
  • a first opening 71 is defined between any two adjacent rib structures 74 , the first portion 72 , and the second portion 73 .
  • the first part 72 covers at least the main body area A, the first part 72 only covers the main body area A, or the first part 72 not only covers the main body area A, but also covers part of the connection area C (as shown in FIG. 5 ).
  • the second part 73 covers at least the first binding area B, the second part 73 may only cover the first binding area B, or the second part 73 not only covers the first binding part B, but also covers the first binding area B.
  • Connect area C (as shown in Figure 5).
  • the first opening 71 in the fourth protective layer 7 is surrounded by the first part 72 , the second part 73 and any two adjacent rib structures 74 , so that the first opening 71 is formed in the fourth protective layer 7 .
  • the orthographic projection of the opening 71 on the connection area C is located inside the connection area C, and there are many film layers at the edge of the connection area C of the flexible circuit board 100 and the thickness is larger. Therefore, it is beneficial to prevent the occurrence of cracks at the edge of the connection area due to the thin thickness of the connection area during the bending process of the flexible circuit board.
  • the fourth protective layer 7 includes at least two rib-shaped structures 74 .
  • the fourth protective layer 7 may include two rib-shaped structures 74 (as shown in FIG. 5 ), or the fourth protective layer 7 may further include Three rib structures 74 or more than three rib structures 74 .
  • the fourth protective layer 7 when the fourth protective layer 7 includes two rib structures 74 , the two rib structures 74 may extend along two opposite sides of the connection region C, respectively. In this way, the two rib-shaped structures 74 respectively make the thickness of the two opposite sides of the connection area C of the flexible circuit board 100 larger. When the flexible circuit board 100 is bent, the two opposite sides of the connection area C are Cracks are not easy to appear.
  • the width d5 of each rib-shaped structure 74 may be 0.2 mm ⁇ 1 mm.
  • the width of the rib-shaped structure 74 when the width of the rib-shaped structure 74 is close to 0.2 mm, the area of the part covered by the rib-shaped structure 74 in the connection area C is relatively small, which is beneficial to reduce the connection area C of the flexible circuit board 100 The area of the portion with a larger thickness in the middle, improves the flexibility at the connection area C of the flexible circuit board 100 .
  • the connection region C of the flexible circuit board 100 can have better flexibility, and the flexible circuit board 100 is less likely to be broken.
  • the distance d6 from any point on the boundary of the orthographic projection of the first protective layer 3 on the connection area C to the orthographic projection of the first opening 71 on the connection area C Greater than or equal to 0.5mm. That is, the distance d6 from the boundary of the orthographic projection of the first protective layer 3 on the connection area C to the boundary of the first opening 71 near the main body area A in the orthographic projection of the connection area C is greater than or equal to 0.5 mm.
  • the present disclosure only defines the distance relationship between the boundary of the orthographic projection of the first protective layer 3 on the connection region C and the boundary of the orthographic projection of the first opening 71 on the connection region C, and does not apply to the first
  • the relative position of the boundary of the orthographic projection of the protective layer 3 on the connection region C and the boundary of the first opening 71 close to the boundary of the main body region A in the orthographic projection of the connection region C is defined.
  • the boundary of the orthographic projection of the first protective layer 3 on the connection area C is different from that of the main body.
  • the distance between areas A is farther.
  • the boundary of the orthographic projection of the first protective layer 3 on the connection area C is the same as the boundary of the main body area A.
  • the distance between the main body regions A is relatively short.
  • the distance d6 between the orthographic boundary of the first protective layer 3 on the connection area C and the orthographic projection of the first opening 71 on the connection area C is greater than or equal to 0.5 mm, thereby preventing the flexible circuit board 100 from approaching the first opening 71
  • the problem of stress concentration occurs at the boundary of the main body region A or at the boundary where the first protective layer 3 is located on the connection region C.
  • the first protective layer 3 may further include a first insulating layer 31 and a first adhesive layer 32 , and the first adhesive layer 32 is closer to the first conductive layer than the first insulating layer 31 Layer 2.
  • the material of the first insulating layer 31 may be polyimide or polyethylene terephthalate (PET for short).
  • PET polyethylene terephthalate
  • the material of the first adhesive layer 32 may be double-sided tape.
  • the fourth protective layer 7 includes a second insulating layer 701 and a second adhesive layer 702 , and the second adhesive layer 702 is closer to the second conductive layer 6 than the second insulating layer 701 superior.
  • the material of the second insulating layer 701 may be polyimide or polyethylene terephthalate.
  • the material of the second adhesive layer 702 may be double-sided tape.
  • the flexible circuit board 100 further includes an integrated chip 8 and a reinforcement layer 9 .
  • the integrated chip 8 is located on the side of the fourth protective layer 7 away from the substrate 1 , the orthographic projection of the integrated chip 8 on the substrate 1 is located in the main body area A, and the integrated chip 8 passes through the fourth protective layer 7 to connect with the second conductive layer 6 electrical connection.
  • the reinforcing layer 9 is located on the side of the first protective layer 3 away from the substrate 1 , and the orthographic projection of the reinforcing layer 9 on the substrate 1 overlaps or partially overlaps the orthographic projection of the integrated chip 8 on the substrate 1 .
  • the reinforcement layer 9 may include a stainless steel layer.
  • the reinforcing layer 9 is disposed opposite to the integrated chip 8, thereby enhancing the supporting ability of the flexible circuit board 100 to the device (eg, the integrated chip), preventing the problem of bending and deformation of the main body area A of the flexible circuit board 100 caused by the excessive weight of the device, which is beneficial to The stability of the flexible circuit board 100 is improved.
  • the reinforcing layer 9 can also prevent virtual welding.
  • the flexible circuit board 100 may further include a third adhesive layer 91 located on the side of the reinforcing layer 9 away from the substrate 1 , and the third adhesive layer 91 allows the flexible circuit board 100 to be bent to The part on the back side of the display panel can be bonded on the back side of the display panel, which helps to improve the problem that the part of the flexible circuit board bent to the back side of the display panel is prone to rebound and warp.
  • a third adhesive layer 91 located on the side of the reinforcing layer 9 away from the substrate 1 , and the third adhesive layer 91 allows the flexible circuit board 100 to be bent to The part on the back side of the display panel can be bonded on the back side of the display panel, which helps to improve the problem that the part of the flexible circuit board bent to the back side of the display panel is prone to rebound and warp.
  • the flexible circuit board 100 may further include a release film 92 disposed on the side of the third adhesive layer 91 away from the reinforcing layer 9 .
  • the flexible circuit board 100 may further include a first electromagnetic shielding film 93 disposed on the side of the first protective layer 3 away from the substrate 1 and a first electromagnetic shielding film 93 disposed on the side of the fourth protective layer 7 away from the substrate 1 . on the second electromagnetic shielding film 94.
  • the second electromagnetic shielding film 94 does not cover the integrated chip 8 .
  • the substrate 1 further includes a second binding region B′ located on the side of the main body region A away from the connecting region C.
  • the first conductive layer 2 may also extend from the main body region A to the second binding region B', and the portion of the first conductive layer 2 corresponding to the second binding region B' may also have a plurality of conductive blocks 21, each conductive block. 21 is covered with a conductive protective film 51 .
  • the first protective layer 3 extends from the main body region A to the second binding region B', and the first protective layer 3 only covers part of the second binding region B'.
  • the fourth protective layer 7 may extend from the main body area A to the second binding area B' and completely cover the second binding area B'. Wherein, the second binding area B' of the flexible circuit board 100 can be bound to the control circuit board.
  • the display device 300 includes a display panel 200 and the flexible circuit board 100 provided in any of the foregoing embodiments.
  • the first binding area B of the flexible circuit board 100 is bound on the display panel 200 .
  • the display panel 200 may be an organic electroluminescent display panel (Organic Light-Emitting Diode, OLED for short).
  • OLED Organic Light-Emitting Diode
  • the above-mentioned display device 300 may be any component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, and a navigator.
  • a display function such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, and a navigator.
  • the beneficial effects that can be achieved by the display device 300 provided by the present disclosure are the same as the beneficial effects that can be achieved by the flexible circuit board 100 provided by the above technical solutions, and are not repeated here.
  • Some embodiments of the present disclosure also provide a manufacturing method of the flexible circuit board 100 , as shown in FIG. 9 , the manufacturing method includes:
  • the substrate 1 includes a main body area A, a first binding area B, and a connection area C between the main body area A and the first binding area B.
  • the first conductive layer 2 extends from the body region A to the first binding region B through the connection region C.
  • the first protective layer 3 extends from the body region A to the connection region C, and the first protective layer 3 does not completely cover the connection region C.
  • the flexible circuit board 100 manufactured by using the manufacturing method of the flexible circuit board 100 provided by some embodiments of the present disclosure has less film layers and thinner thickness at the position corresponding to the connection region C that is not covered by the first protective layer 3 , thereby making the flexible circuit board 100 more flexible.
  • the position corresponding to the connection area C in the circuit board 100 has better flexibility.
  • the part of the flexible circuit board 100 located on the side of the connection area C away from the first binding area B can be easily bent to the back side of the display panel,
  • the rebound force perpendicular to the direction of the substrate 1 on the main body area A of the flexible circuit board 100 can be reduced, thereby helping to improve the flexibility of the flexible circuit board 100 after bending. It is prone to rebound and warping problems.
  • the flexible circuit board 100 has good flexibility, in the display device having the flexible circuit board 100, the flexible circuit board can be bent more to the back side of the display panel of the display device, reducing the number of flexible circuits
  • the board occupies the surrounding space of the display panel, so that the frame of the display device can be set narrower.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种柔性电路板，包括基底、第一导电层和第一保护层。所述基底具有主体区域、第一绑定区域，以及位于所述主体区域与所述第一绑定区域之间的连接区域。第一导电层位于所述基底的第一侧，所述第一导电层从所述主体区域经所述连接区域延伸至所述第一绑定区域。第一保护层位于所述第一导电层远离所述基底的一侧，所述第一保护层从所述主体区域延伸至所述连接区域，且所述第一保护层不完全覆盖所述连接区域。

Description

柔性电路板和显示装置
本申请要求于2020年12月25日提交的、申请号为202011567078.3的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种柔性电路板和显示装置。
背景技术
柔性电路板(Flexible Printed Circuit简称FPC)是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性的印刷电路板。柔性电路板具有配线密度高、重量轻、厚度薄、弯折性好的特点，因此被广泛应用于手机、笔记本电脑、数码相机等产品中。
发明内容
一方面，提供一种柔性电路板。所述柔性电路板包括基底、第一导电层和第一保护层。所述基底具有主体区域、第一绑定区域，以及位于所述主体区域与所述第一绑定区域之间的连接区域。第一导电层位于所述基底的第一侧，所述第一导电层从所述主体区域经所述连接区域延伸至所述第一绑定区域。第一保护层位于所述第一导电层远离所述基底的一侧，所述第一保护层从所述主体区域延伸至所述连接区域，且所述第一保护层不完全覆盖所述连接区域。
在一些实施例中，所述连接区域包括彼此连接的第一区域和第二区域，所述第一区域比所述第二区域更靠近所述主体区域，所述第一区域还与所述主体区域相连，所述第二区域还与所述第一绑定区域相连；所述第一保护层覆盖所述第一区域，且所述第一保护层不覆盖所述第二区域。
在一些实施例中，所述第一区域与所述第二区域之间的分界面上的任一位置到所述主体区域的距离小于该位置到所述第一绑定区域的距离。
在一些实施例中，所述第一区域与所述第二区域之间的分界面上的任一位置到所述主体区域的距离大于或等于0.5mm。
在一些实施例中，所述连接区域中被所述第一保护层覆盖的区域的面积小于所述连接区域中未被所述第一保护层覆盖的区域的面积。
在一些实施例中，所述柔性电路板还包括第二保护层，所述第二保护层位于所述第一导电层远离所述基底的一侧；所述第二保护层至少覆盖所述连接区域中未被所述第一保护层覆盖的区域。
在一些实施例中，所述第二保护层还覆盖部分所述第一保护层。
在一些实施例中，所述第二保护层在所述基底上的正投影与所述第一保护层在所述基底上的正投影重叠的部分为第一重叠部分，所述第一重叠部分位于所述连接区域上，所述第一重叠部分靠近所述主体区域的一端与所述第一重叠部分远离所述主体区域的一端之间的距离大于或等于0.2mm。
在一些实施例中，所述第一导电层中位于所述第一绑定区域的部分包括多个导电块；所述柔性电路板还包括第三保护层，所述第三保护层包括多个导电保护膜，一个所述导电保护膜覆盖一个所述导电块；所述第二保护层还覆盖所述第一绑定区域的部分区域和任一所述导电保护膜的部分区域。
在一些实施例中，所述第二保护层在所述基底上的正投影与所述导电保护膜在所述基底上的正投影的重叠的部分为第二重叠部分，所述第二重叠部分位于所述第一绑定区域上，所述第二重叠部分靠近所述连接区域的一端与所述第二重叠部分远离所述连接区域的一端之间的距离大于或等于0.2mm。
在一些实施例中，所述第二保护层包括绿油保护层。
在一些实施例中，所述第二保护层的厚度小于所述第一保护层的厚度。
在一些实施例中，所述柔性电路板还包括第二导电层和第四保护层。所述第二导电层位于所述基底的第二侧，所述第二侧为所述基底中与所述第一侧相对的一侧；所述第二导电层覆盖所述主体区域。所述第四保护层位于所述第二导电层远离所述基底的一侧，所述第四保护层从所述主体区域经所述连接区域延伸至所述第一绑定区域；所述第四保护层上设置有至少一个第一开口，所述至少一个第一开口在所述基底上的正投影位于所述连接区域。
在一些实施例中，所述第四保护层包括第一部分、第二部分和至少两条肋形结构。所述第一部分至少覆盖所述主体区域；所述第二部分至少覆盖所述第一绑定区域；所述至少两条肋形结构在所述基底上的正投影位于所述连接区域，每条肋形结构的相对两端分别连接所述第一部分与所述第二部分；任意相邻的两条肋形结构与所述第一部分、所述第二部分四者之间围设出一个所述第一开口。
在一些实施例中，所述第四保护层包括两条所述肋形结构，两条所述肋形结构分别沿所述连接区域的相对的两个侧边延伸。
在一些实施例中，每条所述肋形结构的宽度为0.2mm～1mm。
在一些实施例中，所述第一保护层在所述连接区域上的正投影的边界上的任意一点到所述第一开口在所述连接区域上的正投影的距离大于或等于0.5mm。
在一些实施例中，所述第一保护层包括第一绝缘层和第一粘接层，所述 第一粘接层比所述第一绝缘层更靠近所述第一导电层；和/或，所述第四保护层包括第二绝缘层和第二粘接层，所述第二粘接层比所述第二绝缘层更靠近所述第二导电层。
在一些实施例中，所述柔性电路板还包括：集成芯片，位于所述第四保护层远离所述基底的一侧，所述集成芯片在所述基底上的正投影位于所述主体区域，所述集成芯片穿过所述第四保护层以与所述第二导电层电连接；补强层，位于所述第一保护层远离所述基底的一侧，所述补强层在所述基底上的正投影与所述集成芯片在所述基底上的正投影重叠或部分重叠。
另一方面，提供一种显示装置。所述显示装置包括显示面板和上述任一实施例所述的柔性电路板。其中，所述柔性电路板的第一绑定区域绑定在所述显示面板上。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的一种柔性电路板的结构图；
图2A为根据一些实施例的一种柔性电路板在N-N'处的截面图；
图2B为根据一些实施例的一种柔性电路板弯折后的结构图；
图3为根据一些实施例的一种柔性电路板的部分底视图；
图4A为根据一些实施例的另一种柔性电路板在N-N'处的截面图；
图4B为根据一些实施例的另一种柔性电路板弯折后的结构图；
图5为根据一些实施例的另一种柔性电路板的部分俯视图；
图6为根据一些实施例的再一种柔性电路板在N-N'处的截面图；
图7为根据一些实施例的又一种柔性电路板在M-M'处的截面图；
图8为根据一些实施例的一种显示装置的结构图；
图9为根据一些实施例的一种柔性电路板的制作方法的流程图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他 实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。这里所公开的实施例并不必然限制于本文内容。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样，“约”、“大致”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域 的实际形状，并且并非旨在限制示例性实施方式的范围。
相关技术中，显示装置主要包括显示面板、柔性电路板和控制电路板。其中，柔性电路板的第一绑定端绑定至显示面板上，通过弯折柔性电路板中靠近第一绑定端的部分，可以使柔性电路板的其余部分弯折到显示面板的背侧，从而使得柔性电路板的第二绑定端可以绑定至位于显示面板背侧的控制电路板上。然而，本公开发明人经研究发现，相关技术中的柔性电路板弯折至显示面板背侧的部分容易出现反弹翘起的问题。同时，柔性电路板弯折的部分还容易出现撕裂的问题。
基于此，本公开的一些实施例提供了一种柔性电路板100，参见图1和图2A，该柔性电路板100包括基底1、第一导电层2和第一保护层3。其中，基底1具有主体区域A、第一绑定区域B，以及位于主体区域A与第一绑定区域B之间的连接区域C。需要说明的是，该主体区域A中包括元件安装区，元件安装区为基底1上用于安装芯片等器件的区域。在此基础上，示例性的，主体区域A与连接区域C之间的分界位置与元件安装区之间的间距大于预设距离(例如0.8mm)，这样，在连接区域B发生弯折时，主体区域A不容易受到弯折应力的影响，有助于提高芯片等器件的连接可靠性。
第一导电层2位于基底1的第一侧，第一导电层2从主体区域A经连接区域C延伸至第一绑定区域B。
第一保护层3位于第一导电层2远离基底1的一侧，第一保护层3从主体区域A延伸至连接区域C，且第一保护层3不完全覆盖连接区域C。
其中，基底1的材料可以是聚酰亚胺(Polyimide，简称PI)。第一导电层2的材料可以是铜。第一保护层3的材料可以包括绝缘材料。
另外，该柔性电路板100可以是用于驱动显示面板实现显示功能的主柔性电路板(Main Flexible Printed Circuit，简称为MFPC)，或者也可以是用于驱动显示面板实现触控功能的触控柔性电路板(Touch Flexible Printed Circuit，简称为TFPC)，本公开不对此进行限制。
本公开一些实施例提供的柔性电路板100，使得柔性电路板100中对应连接区域C未被第一保护层3覆盖的位置处膜层较少，厚度较薄，进而使得柔性电路板100中对应连接区域C的位置具有较好的柔性。因此，在该柔性电路板100的第一绑定区域B绑定至显示面板时，可以通过弯折柔性电路板100中对应连接区域C的位置(参见图2B)，使柔性电路板100中位于连接区域C远离第一绑定区域B一侧的部分比较容易弯折至显示面板的背侧，并且可以减小柔性电路板100弯折至显示面板背侧时，柔性电路板100的主体区域A 处所受到的垂直于基底1方向的反弹力F，从而有助于改善柔性电路板100在弯折后容易出现反弹起翘的问题。
此外，由于柔性电路板100具有较好的柔性，因而在具有柔性电路板100的显示装置中，可以使柔性电路板更多的弯折至显示装置的显示面板的背侧，减小了柔性电路板对显示面板的周围空间的占用，进而使得显示装置的边框可以设置的较窄。
同时，由于第一保护层3可以不完全覆盖连接区域C，因而还可以减少第一保护层3的材料的使用，减小柔性电路板100的制作成本。
其中，第一保护层3不完全覆盖连接区域C，在一些实施例中，可以是第一保护层3覆盖连接区域C的部分上设置有至少一个开口，以暴露出部分第一导电层2。
或者，在另一些实施例中，如图2A所示，连接区域C可以包括彼此连接的第一区域C1和第二区域C2，第一区域C1比第二区域C2更靠近主体区域A，第一区域C1还与主体区域A相连，第二区域C2还与第一绑定区域B相连。第一保护层3覆盖第一区域C1，且第一保护层3不覆盖第二区域C2。
这样，第一保护层3覆盖靠近主体区域A的第一区域C1，不覆盖第二区域C2，使得柔性电路板100的第二区域C2处整体的膜层较少，从而可以通过弯折柔性电路板100中对应第二区域C2的位置，使柔性电路板100中位于第二区域C2远离第一绑定区域B一侧的部分比较容易弯折至显示面板的背侧，有效的提高了柔性电路板100的弯折性能。
示例性的，如图2A所示，第一区域C1与第二区域C2之间的分界面上的任一位置到主体区域A的距离d1小于该位置到第一绑定区域B的距离d2。这样，第一区域C1的面积小于第二区域C2的面积，即连接区域C中易于弯折的区域的面积大于连接区域C中不易于弯折的区域的面积，从而进一步提高了柔性电路板100中对应连接区域C的位置处的柔性。
需要说明的是，本公开并不对第一区域C1和第二区域C2之间的分界面在基底1上的正投影的形状进行限制。例如，该分界面在基底1上的正投影的形状可以是一条直线段。又例如，该分界面在基底1上的正投影的形状可以是一条曲线段或者折线段。
在一些实施例中，如图2A所示，第一区域C1与第二区域C2之间的分界面上的任一位置到主体区域A的距离d1大于或等于0.5mm。此时，第一区域C1的面积较小，也即第一保护层3覆盖连接区域C的区域面积较少，连接区域C未被第一保护层3覆盖的部分面积较大，从而提高了柔性电路板100 中对应连接区域C的位置处的柔性。
在一些实施例中，如图2A所示，连接区域C中被第一保护层3覆盖的区域的面积小于连接区域C中未被第一保护层3覆盖的区域的面积。其中，本公开对第一保护层3覆盖在连接区域C上的部分的形状不做限定。这样，连接区域C中未被第一保护层3覆盖的区域的面积较大，柔性电路板100在连接区域C处易于弯折的区域的面积更大，使得柔性电路板100对应连接区域C的位置具有较好的柔性。因此，可以通过弯折柔性电路板100中对应连接区域C的位置，使柔性电路板100中位于连接区域C远离第一绑定区域B一侧的部分比较容易弯折至显示面板的背侧。
在一些实施例中，如图2A、图2B和图3所示，柔性电路板100还包括第二保护层4。第二保护层4位于第一导电层2远离基底1的一侧。第二保护层4至少覆盖连接区域C中未被第一保护层3覆盖的区域(也即，第二保护层4至少覆盖第一导电层2对应连接区域C的部分中未被第一保护层3所覆盖的部分)。这样，第二保护层4能够有效的保护第一导电层2，防止第一导电层2暴露，从而有利于避免由于第一导电层被腐蚀，第一导电层中的走线被破坏，导致柔性电路板的电路出现故障的情况发生。
在一些实施例中，如图2A和图2B所示，第二保护层4不仅覆盖连接区域C中未被第一保护层3覆盖的区域，第二保护层4还可以覆盖部分第一保护层3。即，第二保护层4覆盖第一保护层3靠近第一绑定区域B的侧面以及第一保护层3远离基底1的表面中靠近第一绑定区域B的部分表面。这样，第二保护层4在基底1上的正投影与第一保护层3在基底1上的正投影之间不会有空隙，第二保护层4能够将靠近第一保护层3边缘处的第一导电层2也完全覆盖，从而有效的避免了因形成第二保护层时存在的工艺误差导致第一导电层靠近第一保护层边缘的部分暴露的情况发生，进一步保护了第一导电层2中的走线不容易被腐蚀，有助于提高柔性电路板100的使用寿命。
在一些实施例中，如图2A和图3所示，第二保护层4在基底1上的正投影与第一保护层1在基底1上的正投影重叠的部分为第一重叠部分41，第一重叠部分41位于连接区域C上，第一重叠部分41靠近主体区域A的一端与第一重叠部分41远离主体区域A的一端之间的距离d3大于或等于0.2mm。
这样设置，第二保护层4可以完全搭接在第一保护层3上，有利于防止因第二保护层的搭接尺寸较小，第二保护层从第一保护层上脱落暴露出第一导电层的情况发生，使得第二保护层4能够更好的保护靠近第一保护层3边界部分的第一导电层2，使得第一导电层2中的走线更加不容易被腐蚀，有助 于提高柔性电路板100的使用寿命。
在一些实施例中，如图2A、图2B和图3所示，第一导电层2中位于第一绑定区域B的部分包括多个导电块21。此时，柔性电路板100还可以包括第三保护层5，第三保护层5包括多个导电保护膜51，一个导电保护膜51覆盖一个导电块21。
其中，导电保护膜51覆盖在导电块21上，以保护导电块21，防止导电块21被腐蚀。其中，导电保护膜51的材料可以包括镍和金。
在柔性电路板100包括多个导电保护膜51，且每个导电保护膜51覆盖一个导电块21的情况下，如图3所示，第二保护层4还可以覆盖第一绑定区域B的部分区域和任一导电保护膜51的部分区域。
其中，第二保护层4覆盖第一绑定区域B的部分区域，可以是第一绑定区域B中未被导电块21覆盖的部分，示例性的，可以是第一绑定区域B对应于任意相邻的两个导电块21之间的部分。
第二保护层4覆盖任一导电保护膜51的部分区域可以是第二保护层4覆盖导电保护膜51靠近连接区域C的侧面和导电保护膜51远离基底1的表面中靠近连接区域C的部分表面。这样，第二保护层4还能够较好的覆盖第一导电层2靠近导电保护层51的部分(例如可以是与导电块21相连接的走线)，从而更好的保护第一导电层2，使得第一导电层2不容易被腐蚀，有助于提高柔性电路板100的使用寿命。
示例性的，如图2A和图3所示，第二保护层4在基底1上的正投影与导电保护膜51在基底1上的正投影的重叠的部分为第二重叠部分42，第二重叠部分42位于第一绑定区域B上，第二重叠部分42靠近连接区域C的一端与第二重叠部分42远离连接区域C的一端之间的距离d4大于或等于0.2mm。
这样设置，使得第二保护层4完全搭接在各个导电保护层51上，且不容易脱落，从而有利于保护第一导电层2靠近导电保护层51的部分(例如可以是与导电块21相连接的走线)。
在一些实施例中，第二保护层4可以包括绿油(即液态光致阻焊剂)保护层。即，第二保护层4的材料可以为绿油。本公开中第二保护层4的材料并不局限于此，示例性的，第二保护层4的材料还可以为感光油墨或阻焊油墨。
在一些实施例中，第二保护层4的厚度可以小于第一保护层3的厚度。这样柔性电路板100连接区域C中覆盖有第二保护层4的区域的厚度小于连接区域C中覆盖有第一保护层3的部分的厚度，使得柔性电路板100连接区 域中覆盖有第二保护层4的区域具有较薄的厚度以及较好的柔性，方便柔性电路板100弯折。示例性的，第二保护层4的厚度可以是10μm～30μm，第一保护层3的厚度可以是40μm。
在一些实施例中，如图4A和图4B所示，柔性电路板100还包括第二导电层6和第四保护层7。其中，第二导电层6位于基底1的第二侧，第二侧为基底1中与第一侧相对的一侧。第二导电层6覆盖主体区域A。第四保护层7位于第二导电层6远离基底1的一侧，第四保护层7从主体区域A经连接区域C延伸至第一绑定区域B。第四保护层7上设置有至少一个第一开口71，所述至少一个第一开口71在基底1上的正投影位于连接区域C。
这样，在第一保护层3覆盖部分连接区域C的基础上，第四保护层7对应连接区域C的位置处设置有至少一个第一开口71，使得柔性电路板100对应第一开口71的位置处的膜层更少，厚度更薄，柔性电路板对应第一开口的位置处具有更好的柔性。因此，在柔性电路板100的第一绑定区域B绑定至显示面板时，可以通过弯折柔性电路板100对应第一开口71的位置(参见图4B)，使柔性电路板100中位于第一开口71远离第一绑定区域B的部分比较容易弯折至显示面板的背侧，并且可以减小柔性电路板100主体区域A处所受到的垂直于基底1方向的反弹力F，从而有助于改善柔性电路板在弯折后容易出现反弹起翘的问题。
此外，由于柔性电路板100具有较好的柔性，因而在具有柔性电路板100的显示装置中，可以使柔性电路板100更多的弯折至显示装置的显示面板的背侧，减小了柔性电路板100对显示面板的周围空间的占用，进而使得显示装置的边框可以设置的较窄。
另外，本公开一些实施例所提供的柔性电路板100中第一保护层3不完全覆盖连接区域C，第四保护层7对应连接区域C的位置处设置至少一个第一开口71，还能使得柔性电路板的应力中心线外移，有利于避免应力中心线与第一导电层或第一保护层重叠，减小第一导电层2受到的张力，从而减小柔性电路板撕裂和出现裂痕的风险。
值得指出的是，第四保护层7由主体区域A经连接区域C延伸至第一绑定区域B，即第四保护层7还覆盖第一绑定区域B。这样设置还能够有利于防止由于柔性电路板100第一绑定区域B处的厚度较薄，导致第一绑定区域B处出现褶皱的问题。进一步的，当第一绑定区域B上设置有多个导电块21(用于使柔性电路板绑定到显示面板的绑定区域上)时，这样设置还能够有利于避免导电块21出现褶皱，使得绑定失败的情况发生。
在一些实施例中，如图5所示，第四保护层7可以包括第一部分72、第二部分73和至少两条肋形结构74。其中，第一部分72至少覆盖主体区域A。第二部分73至少覆盖第一绑定区域B。所述至少两条肋形结构74在基底1上的正投影位于连接区域C，每条肋形结构74的相对两端分别连接第一部分72与第二部分73。任意相邻的两条肋形结构74与第一部分72，第二部分73四者之间围设出一个第一开口71。
其中，第一部分72至少覆盖主体区域A，可以是第一部分72仅覆盖主体区域A，也可以是第一部分72不仅覆盖主体区域A，还覆盖部分连接区域C(如图5所示)。同理，第二部分73至少覆盖第一绑定区域B，可以是第二部分73仅覆盖第一绑定区域B，也可以是第二部分73不仅覆盖第一绑定部分B，还覆盖部分连接区域C(如图5所示)。
本公开一些实施例所提供的柔性电路板，利用第一部分72、第二部分73和任意相邻的两条肋形结构74围设出第四保护层7中的第一开口71，使得第一开口71在连接区域C上的正投影位于连接区域C内部，柔性电路板100的连接区域C的边缘位置处的膜层较多，厚度较大。从而有利于防止在柔性电路板的弯折过程中，因连接区域厚度较薄，连接区域边缘位置处出现裂痕的情况发生。
其中，第四保护层7包括至少两条肋形结构74，示例性的，第四保护层7可以包括两条肋形结构74(如图5所示)，或者第四保护层7还可以包括三条肋形结构74或三条以上肋形结构74。
在一些实施例中，如图5所示，当第四保护层7包括两条肋形结构74时，两条肋形结构74可以分别沿连接区域C的相对的两个侧边延伸。这样，两条肋形结构74分别使柔性电路板100的连接区域C相对的两个侧边处的厚度较大，在柔性电路板100在弯折时，连接区域C的相对的两个侧边处不容易出现裂痕。
在一些实施例中，如图5所示，每条肋形结构74的宽度d5可以为0.2mm～1mm。这样，一方面，当肋形结构74的宽度趋近于0.2mm时，连接区域C中被肋形结构74覆盖的部分的面积相对较小，从而有利于减小柔性电路板100的连接区域C中厚度较大的部分的面积，提高柔性电路板100的连接区域C处的柔性。另一方面，当肋形结构74的宽度趋近于1mm时，可以使柔性电路板100的连接区域C具有较好的柔性的同时，柔性电路板100处不易出现断裂的情况。
在一些实施例中，如图4A和图6所示，第一保护层3在连接区域C上的 正投影的边界上的任意一点到第一开口71在连接区域C上的正投影的距离d6大于或等于0.5mm。也即，第一保护层3在连接区域C上的正投影的边界到第一开口71在连接区域C上的正投影中靠近主体区域A的边界的距离d6大于或等于0.5mm。
其中，需要说明的是，本公开仅限定第一保护层3在连接区域C上的正投影的边界与第一开口71在连接区域C上正投影的边界之间的距离关系，并不对第一保护层3在连接区域C上的正投影的边界与第一开口71在连接区域C上的正投影中靠近主体区域A的边界的相对位置进行限定。示例性的，如图4A所示，与第一开口71在连接区域C上的正投影中靠近主体区域A的边界相比，第一保护层3在连接区域C上的正投影的边界与主体区域A之间的距离较远。又示例性的，如图6所示，与第一开口71在连接区域C上的正投影中靠近主体区域A的边界相比，第一保护层3在连接区域C上的正投影的边界与主体区域A之间的距离较近。
第一保护层3在连接区域C上的正投影边界与第一开口71在连接区域C上的正投影的距离d6大于或等于0.5mm，从而可以防止在柔性电路板100在第一开口71靠近主体区域A的边界处或第一保护层3位于连接区域C上的边界处出现应力集中的问题。
在一些实施例中，如图7所示，第一保护层3还可以包括第一绝缘层31和第一粘接层32，第一粘接层32比第一绝缘层31更靠近第一导电层2。示例性的，第一绝缘层31的材料可以是聚酰亚胺或聚对苯二甲酸乙二醇酯(polyethylene terephthalate，简称PET)。第一粘接层32的材料可以是双面胶。
在一些实施例中，如图7所示，第四保护层7包括第二绝缘层701和第二粘接层702，第二粘接层702比第二绝缘层701更靠近第二导电层6上。示例性的，第二绝缘层701的材料可以是聚酰亚胺或聚对苯二甲酸乙二醇酯。第二粘接层702的材料可以是双面胶。
在一些实施例中，如图7所示，柔性电路板100还包括集成芯片8和补强层9。其中，集成芯片8位于第四保护层7远离基底1的一侧，集成芯片8在基底1上的正投影位于主体区域A，集成芯片8穿过第四保护层7以与第二导电层6电连接。补强层9位于第一保护层3远离基底1的一侧，补强层9在基底1上的正投影与集成芯片8在基底1上的正投影重叠或部分重叠。
其中，补强层9可以包括不锈钢层。
补强层9与集成芯片8相对设置，从而增强了柔性电路板100的对器件 (例如集成芯片)的支撑能力，防止器件过重引起柔性电路板100主体区域A出现弯曲变形的问题，有利于提高柔性电路板100的稳定性。另外，补强层9还能够防止虚焊。
示例性的，如图7所示，柔性电路板100还可以包括位于在补强层9远离基底1一侧的第三粘接层91，第三粘接层91使得柔性电路板100弯折至显示面板背侧的部分可以粘接在显示面板的背面上，有助于改善柔性电路板弯折至显示面板背侧的部分容易出现反弹起翘的问题。
示例性的，如图7所示，柔性电路板100还可以包括设置在第三粘接层91远离补强层9一侧的离型膜92。
示例性的，如图7所示，柔性电路板100还可以包括设置在第一保护层3远离基底1一侧的第一电磁屏蔽膜93和设置在第四保护层7远离基底1的一侧上的第二电磁屏蔽膜94。其中，第二电磁屏蔽膜94不覆盖集成芯片8。
在一些实施例中，如图7所示，基底1还包括位于主体区域A远离连接区域C一侧的第二绑定区域B'。第一导电层2还可以由主体区域A延伸至第二绑定区域B'，且第一导电层2对应第二绑定区域B'的部分同样可以具有多个导电块21，每个导电块21上均覆盖有导电保护膜51。第一保护层3由主体区域A延伸至第二绑定区域B'，且第一保护层3仅覆盖部分第二绑定区域B'。第四保护层7可以由主体区域A延伸至第二绑定区域B'，且完全覆盖第二绑定区域B'。其中，柔性电路板100的第二绑定区域B'可以绑定至控制电路板上。
本公开的一些实施例中还提供了一种显示装置300，如图8所示，显示装置300包括显示面板200和上述任一实施例所提供的柔性电路板100。其中，柔性电路板100的第一绑定区域B绑定在显示面板200上。
示例性的，显示面板200可以是有机电致发光显示面板(Organic Light-Emitting Diode，简称OLED)。
上述显示装置300可以是电视、数码相机、手机、手表、平板电脑、笔记本电脑、导航仪等任何具有显示功能的部件。本公开提供的显示装置300所能实现的有益效果，与上述技术方案提供的柔性电路板100所能达到的有益效果相同，在此不做赘述。
本公开的一些实施例还提供了一种柔性电路板100的制作方法，如图9所示，该制作方法包括：
S1、提供基底1。其中，基底1包括主体区域A、第一绑定区域B，以及位于主体区域A与第一绑定区域B之间的连接区域C。
S2、在基底1的第一侧11沉积一层第一金属层，图案化第一金属层以形成第一导电层2。第一导电层2从主体区域A经连接区域C延伸至第一绑定区域B。
S3、在第一导电层2远离基底1的一侧形成第一保护层3。第一保护层3从主体区域A延伸至连接区域C，且第一保护层3不完全覆盖连接区域C。
利用本公开一些实施例所提供的柔性电路板100的制作方法制作得到的柔性电路板100对应连接区域C未被第一保护层3覆盖的位置处膜层较少，厚度较薄，进而使得柔性电路板100中对应连接区域C的位置具有较好的柔性。因此，可以通过弯折柔性电路板100中对应连接区域C的位置，使柔性电路板100中位于连接区域C远离第一绑定区域B一侧的部分比较容易弯折至显示面板的背侧，并且可以减小柔性电路板100弯折至显示面板背侧时，柔性电路板100的主体区域A处所受到的垂直于基底1方向的反弹力，从而有助于改善柔性电路板100在弯折后容易出现反弹起翘的问题。
此外，由于柔性电路板100具有较好的柔性，因而在具有柔性电路板100的显示装置中，可以使柔性电路板更多的弯折至显示装置的显示面板的背侧，减小了柔性电路板对显示面板的周围空间的占用，进而使得显示装置的边框可以设置的较窄。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (20)

  1. 一种柔性电路板，包括：
    基底，所述基底具有主体区域、第一绑定区域，以及位于所述主体区域与所述第一绑定区域之间的连接区域；
    第一导电层，位于所述基底的第一侧，所述第一导电层从所述主体区域经所述连接区域延伸至所述第一绑定区域；
    第一保护层，位于所述第一导电层远离所述基底的一侧，所述第一保护层从所述主体区域延伸至所述连接区域，且所述第一保护层不完全覆盖所述连接区域。
  2. 根据权利要求1所述的柔性电路板，其中，所述连接区域包括彼此连接的第一区域和第二区域，所述第一区域比所述第二区域更靠近所述主体区域，所述第一区域还与所述主体区域相连，所述第二区域还与所述第一绑定区域相连；
    所述第一保护层覆盖所述第一区域，且所述第一保护层不覆盖所述第二区域。
  3. 根据权利要求2所述的柔性电路板，其中，所述第一区域与所述第二区域之间的分界面上的任一位置到所述主体区域的距离小于该位置到所述第一绑定区域的距离。
  4. 根据权利要求3所述的柔性电路板，其中，所述第一区域与所述第二区域之间的分界面上的任一位置到所述主体区域的距离大于或等于0.5mm。
  5. 根据权利要求1～4中任一项所述的柔性电路板，其中，
    所述连接区域中被所述第一保护层覆盖的区域的面积小于所述连接区域中未被所述第一保护层覆盖的区域的面积。
  6. 根据权利要求1～5中任一项所述的柔性电路板，还包括：
    第二保护层，位于所述第一导电层远离所述基底的一侧；所述第二保护层至少覆盖所述连接区域中未被所述第一保护层覆盖的区域。
  7. 根据权利要求6所述的柔性电路板，其中，
    所述第二保护层还覆盖部分所述第一保护层。
  8. 根据权利要求7所述的柔性电路板，其中，
    所述第二保护层在所述基底上的正投影与所述第一保护层在所述基底上的正投影重叠的部分为第一重叠部分，所述第一重叠部分位于所述连接区域上，所述第一重叠部分靠近所述主体区域的一端与所述第一重叠部分远离所述主体区域的一端之间的距离大于或等于0.2mm。
  9. 根据权利要求6～8中任一项所述的柔性电路板，其中，
    所述第一导电层中位于所述第一绑定区域的部分包括多个导电块；
    所述柔性电路板还包括第三保护层，所述第三保护层包括多个导电保护膜，一个所述导电保护膜覆盖一个所述导电块；
    所述第二保护层还覆盖所述第一绑定区域的部分区域和任一所述导电保护膜的部分区域。
  10. 根据权利要求9所述的柔性电路板，其中，
    所述第二保护层在所述基底上的正投影与所述导电保护膜在所述基底上的正投影的重叠的部分为第二重叠部分，所述第二重叠部分位于所述第一绑定区域上，所述第二重叠部分靠近所述连接区域的一端与所述第二重叠部分远离所述连接区域的一端之间的距离大于或等于0.2mm。
  11. 根据权利要求6～10中任一项所述的柔性电路板，其中，
    所述第二保护层包括绿油保护层。
  12. 根据权利要求6～11中任一项所述的柔性电路板，其中，
    所述第二保护层的厚度小于所述第一保护层的厚度。
  13. 根据权利要求1～12中任一项所述的柔性电路板，还包括：
    第二导电层，位于所述基底的第二侧，所述第二侧为所述基底中与所述第一侧相对的一侧；所述第二导电层覆盖所述主体区域；
    第四保护层，位于所述第二导电层远离所述基底的一侧，所述第四保护层从所述主体区域经所述连接区域延伸至所述第一绑定区域；
    所述第四保护层上设置有至少一个第一开口，所述至少一个第一开口在所述基底上的正投影位于所述连接区域。
  14. 根据权利要求13所述的柔性电路板，其中，所述第四保护层包括：
    第一部分，所述第一部分至少覆盖所述主体区域；
    第二部分，所述第二部分至少覆盖所述第一绑定区域；
    至少两条肋形结构，所述至少两条肋形结构在所述基底上的正投影位于所述连接区域，每条肋形结构的相对两端分别连接所述第一部分与所述第二部分；任意相邻的两条肋形结构与所述第一部分、所述第二部分四者之间围设出一个所述第一开口。
  15. 根据权利要求14所述的柔性电路板，其中，所述第四保护层包括两条所述肋形结构，两条所述肋形结构分别沿所述连接区域的相对的两个侧边延伸。
  16. 根据权利要求14或15所述的柔性电路板，其中，每条所述肋形结 构的宽度为0.2mm～1mm。
  17. 根据权利要求13～16中任一项所述的柔性电路板，其中，
    所述第一保护层在所述连接区域上的正投影的边界上的任意一点到所述第一开口在所述连接区域上的正投影的距离大于或等于0.5mm。
  18. 根据权利要求13～17中任一项所述的柔性电路板，其中，
    所述第一保护层包括第一绝缘层和第一粘接层，所述第一粘接层比所述第一绝缘层更靠近所述第一导电层；和/或，
    所述第四保护层包括第二绝缘层和第二粘接层，所述第二粘接层比所述第二绝缘层更靠近所述第二导电层。
  19. 根据权利要求13～18中任一项所述的柔性电路板，还包括：
    集成芯片，位于所述第四保护层远离所述基底的一侧，所述集成芯片在所述基底上的正投影位于所述主体区域，所述集成芯片穿过所述第四保护层以与所述第二导电层电连接；
    补强层，位于所述第一保护层远离所述基底的一侧，所述补强层在所述基底上的正投影与所述集成芯片在所述基底上的正投影重叠或部分重叠。
  20. 一种显示装置，包括：
    显示面板；
    如权利要求1～19中任一项所述的柔性电路板；
    其中，所述柔性电路板的第一绑定区域绑定在所述显示面板上。
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