WO2022127436A1 - 一种超厚pcb阻焊显影随行垫板 - Google Patents

一种超厚pcb阻焊显影随行垫板 Download PDF

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WO2022127436A1
WO2022127436A1 PCT/CN2021/129326 CN2021129326W WO2022127436A1 WO 2022127436 A1 WO2022127436 A1 WO 2022127436A1 CN 2021129326 W CN2021129326 W CN 2021129326W WO 2022127436 A1 WO2022127436 A1 WO 2022127436A1
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ultra
thick pcb
rectangular
hole
fixing groove
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PCT/CN2021/129326
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English (en)
French (fr)
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王康兵
周刚
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广东科翔电子科技股份有限公司
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Publication of WO2022127436A1 publication Critical patent/WO2022127436A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present application relates to the technical field of circuit boards, in particular to an ultra-thick PCB solder resist developing accompanying pad.
  • the present application provides an ultra-thick PCB solder resist development accompanying pad for improving the product yield in the development process.
  • An ultra-thick PCB solder resist developing accompanying pad disclosed in the present application includes: a bottom plate and a support frame arranged on the bottom plate, and a first rectangular through hole and a second rectangular through hole communicated with each other are opened in the middle of the bottom plate and the support frame; The diagonal of the first rectangular through hole and the second rectangular through hole is slightly smaller than the diagonal of the ultra-thick PCB.
  • the support frame is provided with an annular fixing groove, and the fixing groove is arranged around the second rectangular through hole. The width of the fixing groove is 4 ⁇ 6mm.
  • both the bottom plate and the support frame are made of aluminum alloy.
  • the corner portion of the fixing groove adopts a rounded structure.
  • the surface of the fixing groove is covered with a silica gel layer.
  • the support frame is provided with a blanking avoidance groove adjacent to the fixing groove.
  • a plurality of escape holes are provided through the bottom plate along the horizontal direction.
  • the ultra-thick PCB solder resist development accompanying pad of the present application is provided with a ring-shaped fixing groove on the support frame, and the ultra-thick PCB is placed through the fixing groove. Together with transportation and processing, the ultra-thick PCB can be padded, which greatly reduces the influence of the roller on the bottom of the ultra-thick PCB during the development process, and improves the production quality of the product.
  • FIG. 1 is a top view of an ultra-thick PCB solder resist developing accompanying pad in the application.
  • FIG. 2 is a side view of an ultra-thick PCB solder resist developing accompanying pad in the application.
  • the present application provides an ultra-thick PCB solder resist development accompanying pad, which is mainly used to cushion the ultra-thick PCB and reduce the influence of the roller on the bottom surface of the ultra-thick PCB during the development process.
  • the ultra-thick PCB solder mask and development accompanying pad is mainly It includes a bottom plate 100 and a support frame 200 disposed on the bottom plate 100.
  • the bottom plate 100 and the support frame 200 are provided with a first rectangular through hole 110 and a second rectangular through hole 210 in the middle.
  • the rectangular through holes 210 ensure that the bottom of the ultra-thick PCB is exposed, so that the upper and lower sides of the ultra-thick PCB can be processed simultaneously during the development process.
  • the bottom plate 100 and the support frame 200 are made of aluminum alloy material, which greatly reduces the weight of the ultra-thick PCB solder mask and development accompanying pad, facilitates the operator to grasp the ultra-thick PCB solder mask and development supporting pad, and improves its use. convenience in the process.
  • the diagonal of the first rectangular through hole 110 and the second rectangular through hole 210 is slightly smaller than the diagonal of the ultra-thick PCB, so that after the ultra-thick PCB is placed on the ultra-thick PCB solder resist development accompanying pad, the first rectangular through hole cannot be The hole 110 and the second rectangular through hole 210 are dropped to ensure the fixing effect on the ultra-thick PCB.
  • the support frame 200 is provided with an annular fixing groove 220, wherein the fixing groove 220 is arranged around the second rectangular through hole 210, in other words, the fixing groove 220 is adjacent to the second rectangular through hole 210, and the width of the fixing groove 220 is 4-6 mm , so that the ultra-thick PCB reserves an active space on the fixing slot 220 , so that the ultra-thick PCB can be easily loaded into the fixing slot 220 .
  • the ultra-thick PCB solder resist developing accompanying pad of the present application When using the ultra-thick PCB solder resist developing accompanying pad of the present application, after the ultra-thick PCB is subjected to solder mask exposure, the ultra-thick PCB is placed on the fixing groove 220 of the ultra-thick PCB solder resist developing accompanying pad, and then the solder resist During the development process, the ultra-thick PCB is transported and walked together on the ultra-thick PCB solder mask and development accompanying pad. After the ultra-thick PCB is developed, remove the ultra-thick PCB and clean the ultra-thick PCB solder mask and development accompanying pad, and wait. next time use.
  • the corners of the fixing slot 220 adopt a rounded structure, and the ultra-thick PCB is protected by the rounded structure, which effectively prevents the ultra-thick PCB from being scratched in the fixing slot 220 .
  • the surface of the fixing slot 220 is covered with a silicone layer, and the ultra-thick PCB is placed on the fixing slot 220 through the silicone layer.
  • the fixing effect on the fixing groove 220 can prevent scratches on the ultra-thick PCB board surface through the silica gel layer, and further improve the production quality of the product.
  • the support frame 200 is provided with a blanking avoidance groove 230 adjacent to the fixing groove 210 , wherein the blanking blanking groove 230 is the same as the emptying of human fingers, which is convenient for the operator's fingers from the blanking blanking groove 230.
  • the super-thick PCB is lifted and blanked at the same time, so as to effectively improve the blanking rate of the ultra-thick PCB and improve the production efficiency.
  • the bottom plate 100 is provided with a plurality of avoidance holes 120 along the horizontal direction, wherein the plurality of avoidance holes 120 are distributed at both ends of the bottom plate 100, wherein when the ultra-thick PCB solder resist development accompanying pad is grasped, the Fingers pass through the avoidance hole 120 to effectively reinforce the firmness of the operator's grip on the ultra-thick PCB solder mask and development accompanying pad, thereby facilitating the operator's handling of the ultra-thick PCB solder mask and development accompanying pad.
  • the super-thick PCB solder resist development accompanying pad of the present application is provided with a ring-shaped fixing groove on the support frame, and the super-thick PCB is placed through the fixing groove.
  • the welding and developing pads are transported and processed together to realize the padding of the ultra-thick PCB, which greatly reduces the influence of the roller on the bottom of the ultra-thick PCB during the development process, and improves the production quality of the product.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second” may expressly or implicitly include one or more of that feature. In the description of the present application, “plurality” means two or more, unless otherwise expressly and specifically defined.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract

本申请涉及一种超厚PCB阻焊显影随行垫板，包括：底板以及设置于底板上的支撑架，底板以及支撑架中部开设有相互连通的第一矩形通孔及第二矩形通孔，第一矩形通孔及第二矩形通孔对角线略小于超厚PCB对角线，支撑架上设置有环形的固定槽，固定槽绕设于第二矩形通孔，固定槽宽度为4～6mm。本申请的超厚PCB阻焊显影随行垫板在支撑架上设置有环形的固定槽，通过固定槽放置超厚PCB，阻焊显影过程中使得超厚PCB随超厚PCB阻焊显影随行垫板一起运输加工，实现将超厚PCB垫起，大大减少超厚PCB在显影过程中底面受滚轮的影响，提高产品的生产质量。

Description

一种超厚PCB阻焊显影随行垫板 技术领域
本申请涉及线路板技术领域，具体涉及一种超厚PCB阻焊显影随行垫板。
背景技术
超厚PCB在生产过程中，由于板厚≥4.0mm，经过丝印、预烤、曝光后，板面上的油墨还未充分固化，并且油墨硬度还不够高，使得在过显影机时，板面将受力于水平滚轮(上下滚轮将整体挤压板面)，同时下板面还需承受自身重力的影响，容易导致板面油墨受挤压严重，而部分未干着的油墨，容易受滚轮粘连，导致大面积脱落或硬度较大油墨受挤压到一边形成显影不净的现象，大大降低超厚PCB生产过程中良品率，增加企业生产成本。
申请内容
为了解决上述超厚PCB显影过程中板面油墨容易受压脱落或变形的技术问题，本申请提供一种提高显影过程产品良率的超厚PCB阻焊显影随行垫板。
本申请公开的一种超厚PCB阻焊显影随行垫板，包括：底板以及设置于底板上的支撑架，底板以及支撑架中部开设有相互连通的第一矩形通孔及第二矩形通孔，第一矩形通孔及第二矩形通孔对角线略小于超厚PCB对角线，支撑架上设置有环形的固定槽，固定槽绕设于第二矩形通孔，固定槽宽度为4～6mm。
根据本申请的一实施方式，底板及支撑架均采用铝合金材质。
根据本申请的一实施方式，固定槽角部采用圆角结构。
根据本申请的一实施方式，固定槽表面覆盖有硅胶层。
根据本申请的一实施方式，支撑架上设置有与固定槽邻接的下料避空槽。
根据本申请的一实施方式，底板上沿水平方向贯穿设置有多个避让孔。
本申请的超厚PCB阻焊显影随行垫板在支撑架上设置有环形的固定槽，通过固定槽放置超厚PCB，阻焊显影过程中使得超厚PCB随超厚PCB阻焊显影随行垫板一起运输加工，实现将超厚PCB垫起，大大减少超厚PCB在显影过程中底面受滚轮的影响，提高产品的生产质量。
附图说明
图1为本申请中超厚PCB阻焊显影随行垫板的俯视图。
图2为本申请中超厚PCB阻焊显影随行垫板的侧视图。
具体实施方式
下面将结合具体实施例及附图对本申请超厚PCB阻焊显影随行垫板作进一步详细描述。
请参考图1至2所示。
本申请提供一种超厚PCB阻焊显影随行垫板，主要用于对超厚PCB进行垫起，减少超厚PCB在显影过程中底面受滚轮的影响，超厚PCB阻焊显影随行垫板主要包括底板100以及设置于底板100上的支撑架200，底板100以及支撑架200中部开设有相互连通的第一矩形通孔110及第二矩形通孔210，利用第一矩形通孔110及第二矩形通孔210保证超厚PCB底部露出，便于显影过程中同时对超厚PCB的上下两面进行加工。在本申请中，底板100及支撑架200均采用铝合金材质，大大降低超厚PCB阻焊显影随行垫板重量，便于作业人员对超厚PCB阻焊显影随行垫板的抓持，提高其使用过程中的便利性。
其中第一矩形通孔110及第二矩形通孔210对角线略小于超厚PCB对角线，使得超厚PCB放置于超厚PCB阻焊显影随行垫板上后，无法从第一矩形通孔110及第二矩形通孔210掉落，保证对超厚PCB的固定效果。
支撑架200上设置有环形的固定槽220，其中固定槽220绕设于第二矩形通孔210，换句话说，固定槽220与第二矩形通孔210邻接，固定槽220宽度为4～6mm，使得超厚PCB于固定槽220上预留活动空间，从而便于将超厚PCB上料至固定槽220。
使用本申请的超厚PCB阻焊显影随行垫板时，在超厚PCB进行阻焊曝光后，将超厚PCB放置于超厚PCB阻焊显影随行垫板的固定槽220上，然后在阻焊显影过程中，超厚PCB于超厚PCB阻焊显影随行垫板上一起运输行走，超厚PCB完成显影加工后，将超厚PCB取下并对超厚PCB阻焊显影随行垫板清洗，等待下一次使用。
进一步的，固定槽220角部采用圆角结构，通过圆角结构对超厚PCB进行保护，有效防止超厚PCB于固定槽220造成刮损。值得注意的是，固定槽220表面覆盖有硅胶层，超厚PCB通过硅胶层放置于固定槽220上，利用硅胶层增大超厚PCB与固定槽220之间的摩擦系数，增强超厚PCB于固定槽220上的固定效果，同时通过硅胶层防止对超厚PCB板面造成刮损，进一步提高产品的生产质量。
进一步的，支撑架200上设置有与固定槽210邻接的下料避空槽230，其中下料避空槽230同于对人体手指进行避空，便于作业人员的手指从下料避空槽230处将超厚PCB顶起下料，从而有效提高下料超厚PCB的下料速率，提高生产效率。
又进一步的，底板100上沿水平方向贯穿设置有多个避让孔120，其中多个避让孔120分布于底板100两端，其中在对超厚PCB阻焊显影随行垫板进行抓持时，通过手指穿过避让孔120，有效加固对作业人员对超厚PCB阻焊显影随行垫板抓持牢固性，从而便于作业人员对超厚PCB阻焊显影随行垫 板的搬运。
综上所述，本申请的超厚PCB阻焊显影随行垫板在支撑架上设置有环形的固定槽，通过固定槽放置超厚PCB，阻焊显影过程中使得超厚PCB随超厚PCB阻焊显影随行垫板一起运输加工，实现将超厚PCB垫起，大大减少超厚PCB在显影过程中底面受滚轮的影响，提高产品的生产质量。
在本申请的描述中，需要理解的是，术语诸如“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
虽然对本申请的描述是结合以上具体实施例进行的，但是，熟悉本技术领域的人员能够根据上述的内容进行许多替换、修改和变化、是显而易见的。因此，所有这样的替代、改进和变化都包括在本申请的精神和范围内。

Claims (6)

  1. 一种超厚PCB阻焊显影随行垫板，其特征在于，包括：底板以及设置于所述底板上的支撑架，所述底板以及支撑架中部开设有相互连通的第一矩形通孔及第二矩形通孔，所述第一矩形通孔及第二矩形通孔对角线略小于超厚PCB对角线，所述支撑架上设置有环形的固定槽，所述固定槽绕设于所述第二矩形通孔，所述固定槽宽度为4～6mm。
  2. 根据权利要求1所述的超厚PCB阻焊显影随行垫板，其特征在于，所述底板及支撑架均采用铝合金材质。
  3. 根据权利要求1所述的超厚PCB阻焊显影随行垫板，其特征在于，所述固定槽角部采用圆角结构。
  4. 根据权利要求1所述的超厚PCB阻焊显影随行垫板，其特征在于，所述固定槽表面覆盖有硅胶层。
  5. 根据权利要求1所述的超厚PCB阻焊显影随行垫板，其特征在于，所述支撑架上设置有与所述固定槽邻接的下料避空槽。
  6. 根据权利要求1至5任一所述的超厚PCB阻焊显影随行垫板，其特征在于，所述底板上沿水平方向贯穿设置有多个避让孔。
PCT/CN2021/129326 2020-12-17 2021-11-08 一种超厚pcb阻焊显影随行垫板 WO2022127436A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115038250A (zh) * 2022-07-06 2022-09-09 广州美维电子有限公司 一种制作精细线路板的治具

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213991184U (zh) * 2020-12-17 2021-08-17 广东科翔电子科技股份有限公司 一种超厚pcb阻焊显影随行垫板
CN114190001B (zh) * 2021-11-16 2024-06-11 广州兴森快捷电路科技有限公司 显影保护装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06282075A (ja) * 1993-03-29 1994-10-07 Fujikura Ltd 回路基板形成用露光装置
CN207090124U (zh) * 2017-06-13 2018-03-13 广州美维电子有限公司 一种千层架
CN207884989U (zh) * 2018-03-13 2018-09-18 厦门市铂联科技股份有限公司 一种双面丝印治具
CN111800955A (zh) * 2020-07-17 2020-10-20 景旺电子科技(龙川)有限公司 一种5g功放板薄板双面阻焊印刷的方法
CN213991184U (zh) * 2020-12-17 2021-08-17 广东科翔电子科技股份有限公司 一种超厚pcb阻焊显影随行垫板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06282075A (ja) * 1993-03-29 1994-10-07 Fujikura Ltd 回路基板形成用露光装置
CN207090124U (zh) * 2017-06-13 2018-03-13 广州美维电子有限公司 一种千层架
CN207884989U (zh) * 2018-03-13 2018-09-18 厦门市铂联科技股份有限公司 一种双面丝印治具
CN111800955A (zh) * 2020-07-17 2020-10-20 景旺电子科技(龙川)有限公司 一种5g功放板薄板双面阻焊印刷的方法
CN213991184U (zh) * 2020-12-17 2021-08-17 广东科翔电子科技股份有限公司 一种超厚pcb阻焊显影随行垫板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115038250A (zh) * 2022-07-06 2022-09-09 广州美维电子有限公司 一种制作精细线路板的治具

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