201218291 六、發明說明： 【發明所屬之技術領域】 本發明關於一種半導體封裝基板。 本案主張2010年7月13日申請的第1〇_2〇1〇_〇〇67562號 韓國專利申請案之優先權’名稱為「半導體封裝基板之製 造方法」，其整體内容將併於本案以供參酌 【先前技術】 隨著電子產業發展，電子元件需成為具有高功能與高 積集之特性，基於此趨勢’ ICs之凸塊線距及基板則變成超 微細且多元。 因此’目前正發展與使用基板上形成凸塊的各種製 程，其中最常採用以金屬罩板印製焊料漿的製程。 不過，以金屬罩板印製焊料漿的製程，有難以保持品 質水準的問題’諸如細線距凸塊之高度、形狀等難以維持 在高水準。因此，為了解決此問題，已經揭露出許多研究 與專利。 傳統上，已知開放型刮漿板模組、覆蓋型刮漿板模組 與封閉型刮漿板模組。 參考圖1至5,於半導體封裝基板上形成凸塊的習知方 法將於下文說明。 首先，參考圖1，電路板14設置於真空板15，然後設 於金屬罩板13下。金屬罩板13上供應有凸塊用之焊料漿 3 201218291 12,金屬罩板13之一側上設置由胺基甲酸酯（urethane)材料 製成之一對到漿板11。 接著，參考圖2 ’自金屬罩板丨3之一側拖行該對到槳 板11至另一側之同時，滾動焊料漿12。其中，藉由該對到 衆板11轉動例’將該焊料漿12填入該金屬罩板13之圖案 中，如此於電路板14上初次印製凸塊。 接著’參考圖3與4，藉由上下輪流驅動該對到漿板 11，改變該對到漿板11拖行方向。 而後’參考圖5’由金屬罩板13另一側反向拖行該對 到漿板11至一側’使焊料装12滾動，如此則於印刷電路板 14上二次印製凸塊。 不過，根據此習知技術，因為該對到毁板1 1以相同材 料製成’當他們用於大型圖案化的電路板（如疊成封裝 (package on package，POP))時，則焊料漿丨2無法充分地填 入大型圖案化的電路板上，或即使焊料榮12填入但其體積 也無法固定。因此，此習知技術的問題在於覆晶接合用之 凸塊需要獨立印製’且以接合焊料球之製程形成POP用之 焊料凸塊，因此需要投資高價位的設備且需額外執行數個 製程。 【發明内容】 據此’為了解決上述問題而完成本發明，本發明以提 供一種半導體封裝基板之製造方法，其使用雙到聚板模式 而可同時形成不同類型的凸塊。 4 201218291 此外’本發明打算提供一種半導體封裝基板之製造方 法，其可減少設備投資成本與製程步驟的數目。 再者’本發明欲提供一種半導體封裝基板之製造方 法，其可同時形成覆晶接合用之凸塊以及POP用之焊料凸 塊。 本發明之一態樣提供一種半導體封裝基板之製造方 法，包括：提供一電路板，位於一網印用之罩板下；於該 罩板上設置一對到漿板，包括一第一到漿板與一第二到漿 板，具有不同硬度；自該罩板之一側拖行該第一到漿板到 另一側，以於該電路板上初次印製一凸塊；以及自該罩板 之該另一側拖行該第二刮漿板到該一側，以於該電路板上 二次印製一凸塊。 於該方法中，該第一刮漿板可由由一軟於該第二刮漿 板之材質製成，且該第一到漿板可包括胺基甲酸酯，而該 第二到漿板可包括一金屬。 該罩板可由一感光材料製成。 於初次印製中，該對到漿板可由該罩板之一側移動至 另一側之同時抬升該第二到漿板。於二次印製中，該對刮 聚板可由該罩板的該另一側移動至該一側之同時抬升該 第一刮漿板。 Λ 於二次印製後，該初次印製與該二次印製可反覆執行 一次以上。 該方法可更包括以下步驟：在設置該對到漿板之前或 之後’於該罩板上供應凸塊用之焊料漿。 201218291 該凸塊可包括一覆晶接合用之凸塊以及一疊成封裝 (package on package ’ POP)用之焊料凸塊。 本發明各種不同的目的、優點與特徵，由以下具體實 例參酌隨後圖示將更臻明確。 本說明書及申請專利範圍中所用名詞及字棄之解釋， 並不限於一般字義或字典上定義，而應根據發明人所做之 適當字義概念定義’依照本發明技術範圍相關之意義及概 念解釋本發明所用之名詞及字彙，藉此可對實施本發明者 做最適當之方法描述。 【實施方式】 本發明之目的、優點及特徵’可由以下較佳具體實之 詳細描述並參照圖式’更加清楚明瞭。所附圖式從頭至尾 中，使用相同圖式標號以標註相同元件，且刪除其多餘描 述。此外，於描述中’ 「第一」、「第二」、「一側」、 「另一側」及類似字詞，係用於區別一特定元件與另一元 件’但此類元件的構置不應被視為僅限於該些字詞《再者， 於本發明說明中’當本發明相關已知技術之詳細敘述會模 糊本發明之要點時，將省略該敘述。 參照隨後之圖示，後文將詳細描述本發明之具體實施 例0 圖ό至10係本發明一具體實例之半導體封裝基板之製 造方法的流程示意圖。 首先，參考圖6，使用真空吸附，將電路板1 05設於印 201218291 製接106上’然後放在網印用之罩板1〇4下。接著，將凸塊 用之烊料衆103供應至罩板1〇4上，然後將一對刮漿板（包含 不同硬度之第一刮漿板101與第二刮漿板102)置於位在罩 板104—側之第一起始點，其中可調換焊料漿1〇3之供應與 該對刮漿板之配置。 電路板105可包括具連接墊（諸如覆晶接合用之墊、 POP用之焊墊等）之印製電路板與半導體基板，因此根據本 發明之方法，可在一製程步驟中於上述連接墊同時形成覆 晶接合用之凸塊與p〇P用之焊料凸塊。 罩板104可由一感光材料製成。舉例而言，習知電路 形成製程中使用且為感光材料之乾膜，可做為罩板1〇4。 再者，在形成電路的一般程序中，使用黃光製程開設欲以 焊料，填充之開孔的情況下，可使用罩板1G4，其中因在 後續冋’皿回焊程序中採用乾膜，故可使用抗熱材料做為乾 膜。 田使用由感光材料製成之罩板丨〇4時，則可獲得凸塊 高度、形狀及類似特性能對應微線距凸塊之優點。 該對刮漿板藉由將焊料漿丨〇3推入罩板丨〇4之開孔 内’以於電路板H)5上印製凸塊。該對到衆板可離式地設 置於於到漿板支具上’且可藉由各到漿板驅動單元上下左 右移動。 於該對到漿板中，第-到聚板1〇1可由軟於第二到衆 板1〇2之材料製成，亦即第—到漿板⑼包括做為主成分之 胺基甲酸醋，而第二到漿板包括做為主成分之金屬，所以 201218291 第一刮漿板101可比第二到漿板1〇2柔軟β 如上所述，既然第一到漿板101與第二刮漿板102由不 同硬度的材料製成，便可於一製程步驟中同時印製各種不 同類型的凸塊》 同時，印製檯106、電路板105與罩板1〇4可使用本領 域通常知識者廣知的方法校準排列。 舉例而言，為了要達到上述排列，印製檯1〇6、電路 板105與罩板104可分別裝設有校準標幟，且可使用校準用 之攝影機（如CCD攝影機）判定排列標幟是否相互對應。印 製檯106與電路版105之校準排列可於其設置之同時達成。 本文中為了改善校準排列的精確度，可以形成複數個 校準標幟。舉例而言，可藉由校準用之攝影機辨識至少兩 個校準標幟，來改善校準排列的精確度。再者，校準標幟 能以校準孔的形式設於電路板105的空白區域與罩板104 邊緣。 而後，參考圖7,該對刮漿板由罩板1〇4的一側移動至 另一側（如向右的箭頭方向），且該些刮漿板中之第一刮漿 板101傾斜至位在罩板1〇4一側之第一印製起始點後被拖 行’其中焊料漿103由第一刮漿板101滾入欲被填充的罩板 1〇4開孔内，因此初次在電路板1〇5上印製凸塊。於初次印 製之製程中，在拖行第一刮漿板101的同時，較佳是抬升 移動第二刮漿板102。 接著’參考圖8’拖行第一刮漿板至位在罩板1〇4 另側之第一印製結束點’然後將其抬升，同時如圖9所 8 201218291 示’第二刮漿板102傾斜至位在罩板1 〇4另一側之第二印製 起始點後被拖行，其中刮漿板角度可調整成適合第二印製 方向（如向左之箭頭方向如果需要的話，當由第一到漿 板移動之剩餘焊料漿具有足夠的含量時，則重新使用剩餘 焊料漿，而當其含量不足時，則可在第二到漿板1〇2落下 之前或之後’額外施加焊料漿1〇3至罩板1〇4上》 接著’參考圖10，該對到漿板由罩板i 〇4的另一側移 動至一側（如向左的箭頭方向），且該些刮漿板中之第二刮 漿板102傾斜至位在罩板104另一側之第二印製起始點後 被拖行，其中焊料漿103由第二刮漿板1〇2滾入欲被填充的 罩板104開孔内，因此二次在電路板1〇5上印製凸塊。於二 次印製之製程中，在拖行第二到漿板1〇2的同時，較佳是 抬升移動第一刮漿板1〇b期間，若需要則在第二印製後， 初次印製製程與二次印製製程可重複執行一次以上。 最後，當第二到漿板1〇2到達至位在罩板1〇4一側之第 二印製結束點時，抬升第二刮漿板1〇2後移除罩板1〇4，或 下印製檯106使罩板1〇4自印在電路板1〇5上之凸塊脫離， 如此則完成凸塊印製製程。 期間，基於實際施用的元件種類，可在罩板自印製的 凸塊脫離之前或之後，執行相關領域中廣知的製程如回 焊製程或類似製程。 根據本發明，既然使用雙到漿板模組 板’如胺基T酸醋；以及第二硬到襞板，二軟：漿 %剞浆板，如金屬到漿板） 執仃兩:人凸塊印製製程，便可在—次製財同時形成各種201218291 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a semiconductor package substrate. The present application claims the priority of the Korean Patent Application No. 1〇2〇1〇_〇〇67562, filed on July 13, 2010, entitled "Manufacturing Method of Semiconductor Package Substrate", the overall content of which will be For the discretion [previous technology] With the development of the electronics industry, electronic components need to be characterized by high functionality and high accumulation. Based on this trend, the bump line spacing and substrate of ICs become ultra-fine and diverse. Therefore, various processes for forming bumps on a substrate are currently being developed, and a process of printing a solder paste with a metal cover is most often employed. However, the process of printing a solder paste with a metal cover plate has a problem that it is difficult to maintain the quality level. For example, the height and shape of the fine line pitch bumps are difficult to maintain at a high level. Therefore, in order to solve this problem, many research and patents have been revealed. Traditionally, open squeegee modules, cover squeegee modules and closed squeegee modules have been known. A conventional method of forming bumps on a semiconductor package substrate will be described below with reference to Figs. First, referring to Fig. 1, the circuit board 14 is disposed on the vacuum panel 15 and then under the metal cover panel 13. The metal cover plate 13 is supplied with a solder paste for bumps. 3 201218291 12, one side of the metal cover plate 13 is provided with a pair of urethane materials to the pulp sheet 11. Next, the solder paste 12 is rolled while the pair is pulled from one side of the metal cover plate 3 to the paddle 11 to the other side with reference to Fig. 2'. Here, the solder paste 12 is filled into the pattern of the metal cover plate 13 by the rotation of the pair of panels 11, so that the bumps are printed for the first time on the circuit board 14. Next, referring to Figures 3 and 4, the pair is applied to the pulp sheet 11 by up and down rotation to change the direction in which the pair is towed to the pulp sheet 11. Then, referring to Fig. 5', the other side of the metal cover 13 is reversely towed to the side of the blade 11 to the side to roll the solder package 12, so that the bumps are printed twice on the printed circuit board 14. However, according to this prior art, since the pair of slabs 1 1 are made of the same material 'When they are used for a large-patterned circuit board (such as a package on package (POP)), the solder paste丨2 cannot be filled sufficiently on a large patterned circuit board, or even if the solder is filled in, its volume cannot be fixed. Therefore, the problem of this prior art is that the bumps for flip chip bonding need to be printed separately and the solder bumps for POP are formed by the process of bonding solder balls, so it is necessary to invest in high-priced devices and perform several additional processes. . SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and provides a method of manufacturing a semiconductor package substrate which can simultaneously form different types of bumps using a dual-to-plate mode. 4 201218291 Further, the present invention is intended to provide a method of manufacturing a semiconductor package substrate which can reduce equipment investment cost and number of process steps. Further, the present invention is intended to provide a method of manufacturing a semiconductor package substrate which can simultaneously form bumps for flip chip bonding and solder bumps for POP. One aspect of the present invention provides a method of fabricating a semiconductor package substrate, comprising: providing a circuit board under a cover plate for screen printing; and providing a pair of pulp plates on the cover plate, including a first to slurry The plate and a second to the pulp plate have different hardnesses; the first to the pulp plate is towed from one side of the cover plate to the other side to first print a bump on the circuit board; and from the cover The other side of the board drags the second squeegee to the side to print a bump on the circuit board. In the method, the first squeegee may be made of a material softer than the second squeegee, and the first to the slab may include a urethane, and the second to the slab may Includes a metal. The cover sheet can be made of a photosensitive material. In the initial printing, the pair of pulp sheets can be lifted from one side of the cover panel to the other side while lifting the second to the pulp sheet. In the secondary printing, the pair of squeegees can be lifted by the other side of the hood to the one side while lifting the first squeegee.该 After the second printing, the initial printing and the secondary printing may be repeated more than once. The method may further comprise the step of: supplying a solder paste for the bumps on the cover sheet before or after the pair is set to the pulp sheet. 201218291 The bump may comprise a bump for flip chip bonding and a solder bump for a package on package POP. The various objects, advantages and features of the invention are apparent from the following detailed description. The explanations of the nouns and the words used in the specification and the scope of the patent application are not limited to the general meaning or dictionary definition, but should be defined according to the appropriate word meaning concept made by the inventor's meaning and concept explanation according to the technical scope of the present invention. The nouns and vocabulary used in the invention are used to describe the most appropriate method for carrying out the invention. The object, the advantages and the features of the present invention are more clearly described in the following detailed description. From the beginning to the end of the drawings, the same reference numerals are used to designate the same elements, and the redundant description is deleted. In addition, in the description, 'first', 'second', 'one', 'the other side', and the like are used to distinguish one particular element from another '' The wording of the present invention is not to be construed as being limited to the description of the present invention. When the detailed description of the related art of the present invention obscures the gist of the present invention, the description will be omitted. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the following drawings, a specific embodiment of the present invention will be described in detail. FIG. 10 to FIG. 10 are schematic flowcharts showing a method of manufacturing a semiconductor package substrate according to an embodiment of the present invention. First, referring to Fig. 6, using vacuum suction, the circuit board 105 is placed on the printed circuit board 106' and then placed under the cover plate 1〇4 for screen printing. Next, the bumps are supplied to the cover plate 1〇4, and then a pair of squeegees (including the first squeegee 101 and the second squeegee 102 having different hardnesses) are placed in position. The cover plate 104 is the first starting point of the side, wherein the supply of the solder paste 1〇3 and the configuration of the pair of squeegees are interchangeable. The circuit board 105 may include a printed circuit board having a connection pad (such as a pad for flip chip bonding, a pad for POP, etc.) and a semiconductor substrate. Therefore, according to the method of the present invention, the connection pad may be used in a process step. At the same time, bumps for flip chip bonding and solder bumps for p〇P are formed. The cover sheet 104 can be made of a photosensitive material. For example, a conventional circuit is used in a process to form a dry film of a photosensitive material, which can be used as a cover sheet 1〇4. Furthermore, in the general procedure for forming a circuit, in the case where a yellow light process is used to open a hole to be filled with solder, a cover plate 1G4 can be used, in which a dry film is used in the subsequent 回' dish reflow process, A heat resistant material can be used as the dry film. When the fascia 4 made of a photosensitive material is used in the field, the advantages of the height, shape, and the like of the micro-cord bumps can be obtained. The pair of squeegees are printed on the circuit board H) 5 by pushing the solder paste 3 into the opening of the hood 4. The pair of panels can be placed on the blade support and can be moved up and down by each of the blade drive units. In the pair of slabs, the first to the slabs 1 〇 1 may be made of a material softer than the second to the slabs 1 〇 2, that is, the first to the slab (9) includes the amino carboxylic acid vinegar as a main component. And the second to the pulp sheet includes the metal as the main component, so the 201218291 first squeegee 101 can be softer than the second to the slab 1 如上 2 as described above, since the first to the slab 101 and the second squeegee The plate 102 is made of materials of different hardnesses, and various types of bumps can be simultaneously printed in one process step. Meanwhile, the printing table 106, the circuit board 105 and the cover plate 1〇4 can be used by those skilled in the art. A well-known method of calibrating the alignment. For example, in order to achieve the above arrangement, the printing table 1〇6, the circuit board 105 and the cover plate 104 can be respectively provided with calibration marks, and the calibration camera (such as a CCD camera) can be used to determine whether the arrangement flag is Correspond to each other. The alignment of the printed circuit board 106 and the circuit board 105 can be achieved at the same time as its setting. In order to improve the accuracy of the calibration arrangement, a plurality of calibration flags can be formed in this paper. For example, at least two calibration flags can be identified by the calibration camera to improve the accuracy of the calibration alignment. Furthermore, the calibration flag can be provided in the form of a calibration hole in the blank area of the circuit board 105 and the edge of the mask 104. Then, referring to FIG. 7, the pair of squeegees are moved from one side of the hood 1 〇 4 to the other side (such as the arrow pointing to the right), and the first squeegee 101 of the squeegees is tilted to Positioned after the first printing start point on the side of the cover panel 1〇4, where the solder paste 103 is rolled by the first squeegee 101 into the opening of the cover plate 1〇4 to be filled, thus the first time A bump is printed on the board 1〇5. In the initial printing process, while the first squeegee 101 is being towed, it is preferable to lift and move the second squeegee 102. Then, 'refer to FIG. 8', the first squeegee is towed to the first printing end point on the other side of the hood 1 〇 4 and then lifted, and as shown in FIG. 9 8 201218291, the second squeegee is shown. 102 is tilted into position after the second printing starting point on the other side of the cover panel 1 〇 4, wherein the squeegee angle can be adjusted to suit the second printing direction (such as the direction of the left arrow if needed) When the remaining solder paste moved from the first to the pulp sheet has a sufficient content, the remaining solder paste is reused, and when the content is insufficient, it may be added before or after the second to the pulp sheet 1〇2 falls. Applying the solder paste 1〇3 to the cover plate 1〇4” Next, referring to FIG. 10, the pair of the pulp plates are moved from the other side of the cover plate i 〇4 to one side (such as the arrow to the left), and The second squeegee 102 of the squeegees is tilted to a position after the second printing start point on the other side of the hood 104, wherein the solder paste 103 is rolled in by the second squeegee 1〇2 The cover plate 104 to be filled is opened in the hole, so that the bumps are printed on the circuit board 1〇5 twice. In the process of the secondary printing, the second line is dragged. At the same time as the plate 1〇2, it is preferable to lift and move the first squeegee 1b, and if necessary, after the second printing, the initial printing process and the secondary printing process can be repeatedly performed more than once. Finally, When the second to the pulp plate 1〇2 reaches the second printing end point on the side of the cover plate 1〇4, the second squeegee plate 1〇2 is lifted, and the cover plate 1〇4 is removed, or the lower print is performed. The table 106 disengages the cover plate 1〇4 from the bumps printed on the circuit board 1〇5, thus completing the bump printing process. During the period, based on the type of components actually applied, the cover can be self-printed on the cover plate. Before or after the block detachment, a process known in the related art such as a reflow process or the like is performed. According to the present invention, since a double-to-ply board module board such as an amine-based T-sour vinegar is used; and a second hard-to-plate , two soft: pulp% pulp board, such as metal to pulp board) two: the bump printing process, you can form a variety of
S 9 201218291 類型的凸塊，包括覆晶接合用之凸塊及POP用之焊料凸塊〇 參考後續實施例，後文將更為詳述本發明，但本發明 之範疇不限於此。 比較例1 提供含覆晶接合用之墊與POP用之焊墊的印刷電路板 w。接著，如圖1所示’印刷電路板14設在真空板15上， 然後置於金屬罩板13之下。金屬罩板13上供應有凸塊用之 烊料漿12，胺基甲酸酯材料製成之一對刮漿板11置於金屬 罩板13之一側。 而後，如圖2所示，藉由自金屬罩板13之一側拖行該 對刮漿板12至另一側之同時，滾動焊料漿12，使焊料讓12 填入金屬罩板12的圖案中，如此則於印刷電路板14上初次 印製凸塊。 接著，如圖3與4所示，藉由上下輪流驅動該對刮漿板 11改變該對刮漿板11拖行方向。而後，如圖5所示，由金 屬罩板13另一側反向拖行該對刮漿板n至一側，使焊料漿 12滾動，如此則於印刷電路板14上二次印製凸塊。圖"顯 示印製在POP印刷電路板之焊塾上的凸塊形狀。 實施例1 提供含覆晶接合用之墊與POP用之焊墊的印刷電路板 105。接著，如圖6所示，使用真空吸附，將電路板丨〇5設 於印製檯106上，然後放在網印用之罩板1〇4下。接著將 凸塊用之焊料請供應至罩板1〇4上，然後將_對到聚板 (包含不同硬度之胺基曱酸酯到漿板1〇1與金屬刮漿板1〇2) 201218291 置於位在罩板104 —側之第一起始點，其中可調換焊料漿 103之供應與該對到漿板之配置。 而後，如圖7所示，該對到聚板在向右的箭頭方向上 移動，且該些到漿板中之胺基甲酸酯到漿板101傾斜至位 在罩板104—側之第一印製起始點後被拖行，如此於印刷 電路板105上初次印製凸塊。 接著’如圖8所示，拖行胺基甲酸酯刮漿板ιοί至第一 印製結束點，然後將其抬升，同時如圖9所示，金屬刮漿 板102傾斜至第二印製起始點。 然後，如圖10所示，該對刮漿板在向左的箭頭方向上 移動，且該些刮漿板中之金屬刮漿板102由第二印製起始 點拖行，如此則在印刷電路板上二次印製凸塊。圖12顯示 印製在POP印刷電路板之焊墊上的凸塊形狀。 參考圖11，當如同比較例1使用胺基甲酸酯刮漿板雙 向印製凸塊時’焊料漿無法充足地填入POP用之焊墊；相 反地’參考圖12 ’當如同實施例1使用含胺基曱酸酯刮漿 板與金屬刮漿板之雙刮漿板模組印製凸塊時，可以輕易將 焊料漿填入POP用之焊墊，如此可在一般凸塊形成製程中 同時形成POP用之焊料凸塊及覆晶接合用之凸塊，而無須 執行焊料球接合製程。 如上所述’根據本發明之方法，因使用不同硬度的一 對到漿板’則可以在一製程中同時印製不同類型的凸塊。 再者’根據本發明之方法，因可以省略焊料球接合製 程或類似程序’而可減少設備投資成本及製程數目》 201218291 此外，根據本發明之發法，可在同一製程中印製覆晶 接合用之凸塊與POP用之焊料凸塊。 雖然本發明為了說明而揭露出較佳具體實例，但本領 域熟悉技術之人士皆可知悉各種可能之修飾、添加及置 換，其皆未悖離如隨附申請專利範圍所述之本發明範疇及 精神。 簡單修飾、添加及置換本發明皆屬於本發明之範鳴 中，且本發明之具體範疇將清楚定於隨後申請專利範圍。 【圖式簡單說明】 本發明之上述及其他目的 '優點及特徵，可由接下來的詳 細描述及較佳具體實施例並參照圖式，更加清楚明瞭，其 中： 圖1至5係製造半導體封裝基板之習知方法的流程示意圖。 圖6至10係本發明一具體實例之半導體封裝基板之製造方 法的流程示意圖。 圖11係比較例1所形成之pop用的焊料凸塊之印製狀態照 圖12係實施例1所形成之POP用的焊料凸塊之印製狀態照 【主要元件符號說明】 電路板105 印製檯106 12 201218291 罩板104 焊料漿103 第一刮漿板101 第二刮漿板102 印刷電路板14 真空板15 金屬罩板13 焊料漿12 刮漿板11The bump of the type S 9 201218291, including the bump for flip chip bonding and the solder bump for POP. Referring to the subsequent embodiments, the present invention will be described in more detail hereinafter, but the scope of the invention is not limited thereto. Comparative Example 1 A printed circuit board w including a pad for flip chip bonding and a pad for POP was provided. Next, as shown in Fig. 1, the printed circuit board 14 is placed on the vacuum panel 15, and then placed under the metal cover 13. The metal cover plate 13 is supplied with a slurry 12 for bumps, and one of the urethane materials is placed on one side of the metal cover 13 to the squeegee 11. Then, as shown in FIG. 2, while the pair of squeegees 12 are pulled from one side of the metal cover 13 to the other side, the solder paste 12 is rolled so that the solder fills the pattern of the metal cover 12 with 12 In this case, the bumps are printed for the first time on the printed circuit board 14. Next, as shown in Figs. 3 and 4, the pair of squeegees 11 are driven up and down to change the direction in which the pair of squeegees 11 are towed. Then, as shown in FIG. 5, the pair of squeegees n are reversely pulled from the other side of the metal cover 13 to the side to roll the solder paste 12, so that the bumps are printed twice on the printed circuit board 14. . The figure " shows the shape of the bump printed on the pad of the POP printed circuit board. Example 1 A printed circuit board 105 comprising a pad for flip chip bonding and a pad for POP was provided. Next, as shown in Fig. 6, the circuit board 5 is placed on the printing table 106 by vacuum suction, and then placed under the cover plate 1〇4 for screen printing. Then, the solder for the bumps is supplied to the cover plate 1〇4, and then the _ pairs to the slabs (containing different hardness of the amine phthalate to the slab 1〇1 and the metal squeegee 1〇2) 201218291 Placed at a first starting point on the side of the shroud 104, wherein the supply of solder paste 103 and the configuration of the pair of plies are interchangeable. Then, as shown in FIG. 7, the pair of the slabs are moved in the direction of the right arrow, and the urethanes in the slab are tilted to the slab 101 to the side of the hood 104. After a printing start point is dragged, the bumps are printed for the first time on the printed circuit board 105. Then, as shown in FIG. 8, the urethane squeegee ιοί is towed to the first printing end point, and then lifted, and as shown in FIG. 9, the metal squeegee 102 is tilted to the second printing. Starting point. Then, as shown in FIG. 10, the pair of squeegees are moved in the direction of the left arrow, and the metal squeegee 102 in the squeegees is dragged by the second printing starting point, so that in the printing The bumps are printed twice on the board. Figure 12 shows the shape of the bumps printed on the pads of the POP printed circuit board. Referring to Fig. 11, when the bumps are bi-directionally printed using the urethane squeegee as in Comparative Example 1, the solder paste cannot sufficiently fill the pads for POP; conversely, 'refer to Fig. 12' as in the embodiment 1 When the bump is printed by the double squeegee module containing the amino phthalate squeegee and the metal squeegee, the solder paste can be easily filled into the POP pad, so that the general bump formation process can be performed. At the same time, solder bumps for POP and bumps for flip chip bonding are formed without performing a solder ball bonding process. As described above, according to the method of the present invention, different types of bumps can be simultaneously printed in one process by using a pair of pulp sheets of different hardnesses. Furthermore, according to the method of the present invention, the equipment investment cost and the number of processes can be reduced because the solder ball bonding process or the like can be omitted. 201218291 Further, according to the method of the present invention, flip chip bonding can be printed in the same process. Use bumps and solder bumps for POP. Although the present invention has been described in connection with the preferred embodiments of the present invention, various modifications, additions and substitutions may be made without departing from the scope of the invention as set forth in the appended claims. spirit. BRIEF DESCRIPTION OF THE DRAWINGS The present invention is intended to be within the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, advantages and features of the present invention will become more apparent from A schematic diagram of the flow of the conventional method. 6 to 10 are schematic flow charts showing a method of manufacturing a semiconductor package substrate according to an embodiment of the present invention. 11 is a printed state of a solder bump for pop formed in Comparative Example 1. FIG. 12 is a printed state of a solder bump for POP formed in Embodiment 1. [Main component symbol description] Circuit board 105 Table 106 12 201218291 Cover plate 104 Solder paste 103 First squeegee 101 Second squeegee 102 Printed circuit board 14 Vacuum board 15 Metal cover 13 Solder paste 12 Scraper 11