TW501163B - Coating apparatus - Google Patents

Abstract

A nozzle provided with a plurality of discharge apertures in line discharging a resist solution as a coating solution toward a top surface to a substrate G held by a holding plate is provided at a lower portion of a main body of a coating head. The resist solution is simultaneously discharged from the plurality of discharge apertures while the nozzle is scan-moved in a direction orthogonal to an arranging direction of the discharge apertures. With the above configuration, the disadvantage of the coating solution dropping or the like is eliminated, the waste of the coating solution is avoided, and in addition, the time taken to perform coating processing is reduced.

Description

V. Description of the Invention (: ι) The present invention relates to a coating device, which belongs to the technical field of using glass lithography to process glass substrates such as semiconductor wafers or liquid crystal displays, and particularly uses For coating solutions such as a semiconductor wafer or a glass substrate. In the manufacturing process of a liquid crystal display device, in order to form an ITO film or an electrode pattern on a glass substrate, for example, the photolithography is used in the same manner as used in the semiconductor manufacturing process to reduce the exposure of the circuit pattern and transfer it to For the resin, a series of processes for the development process are performed. Such a series of processing is performed by a coating and developing processing system configured to be equipped with a cleaning device, an attachment processing device, and a conveying path that can be used to move a conveying device such as a glass substrate. Cooling treatment device, resist resin coating device, heat treatment device, developing device, etc. In this coating and development processing system, after the glass substrate is cleaned by a cleaning device, the glass substrate is then subjected to hydrophobic treatment by an adhesion processing device, and after being cooled by the cooling processing device, it is coated with a resist resin. A cloth device is applied to form a resist resin film. Subsequently, the resist resin film is heated in a heat treatment device, pre-baked, and further cooled. Exposure is performed on an exposure device connected to the system to form a predetermined pattern, and the exposed glass substrate is coated with a developing device. The developing solution is developed, and the developing solution is washed away by a cleaning solution, and then a post-baking process is performed to end a series of processes. However, in the above-mentioned resist resin coating apparatus, a spin coating method is used, for example, for placing a substrate on a square chuck and then rotating it, and then supplying a money-resistant resin solution to the center of the spin #, but there is a problem. Produced, that is, by the spin coating 501163 A7 B7 V. Description of the invention (2 When the anti-resin resin liquid is attached, 'the anti-resin resin liquid supplied on the glass substrate is scattered to the outside of the glass substrate due to telecentric force, forming Here, the present inventor provides a technique for scanning a glass substrate using a pointed tube nozzle for discharging an anti-resin resin solution, so that a resist resin solution can be applied to the required area as much as possible. To solve the waste of the resist resin solution. However, the nozzle with the above structure has a small scanning interval, and has the following problems. When the anti-resin solution is coated on the glass substrate, it takes a very long time. Especially when the viscosity of the anti-resin solution is high or the contact angle on the surface of the glass substrate is large, the diffusion of the anti-resistance resin solution on the surface of the glass substrate becomes smaller, so the scanning interval of the nozzle must be made more As a result, a longer time is required for the coating process of the resist resin solution. In addition, such a time is required for the coating process, and therefore a problem is also caused. The position of the resist resin solution on the glass substrate is initially coated. There is a considerable difference between the drying time and the drying time of the resist resin solution at the last coating position, and the uniformity of the film thickness of the talented shell. Here, Cao also tried to increase the diameter of the discharge hole provided at the front end of the nozzle. Method, but there is a problem, that is, when the diameter of the discharge hole is increased, when the nozzle stops supplying the resist resin liquid, the resist resin liquid cannot be held in the nozzle and is in a dripped state. A coating device is provided, which does not cause the above-mentioned problems such as dripping of the coating liquid, solves the waste of the coating liquid, and shortens the time required for coating processing. This paper standard is applicable to the China National Standard (CNS_ ) A4 specification (210 X 297 public love) -------------- install ----- (Please read the precautions on the back before filling this page); line · -III--5- 163 163 Fifth invention description (for the purpose of A coating device includes: a holding member, which is used to hold a substrate; a nozzle, which is provided with a plurality of ejection holes, and a plurality of ejection holes are used to face the aforementioned uA coating solution. And the mechanism, "the scanner that scans the nozzle on the substrate that has been held. The structure is such that one side of the nozzle can be scanned in a direction perpendicular to, for example, the discharge port rowing direction, and the surface is waited for." Most of the discharge holes simultaneously discharge the coating liquid, so that it can have a width of the width of the discharge hole array relative to the scanning direction of the nozzle, and the coating liquid is coated on the substrate. Therefore, the coating liquid is not wasted. The time required for the lung coating process can be eliminated. For each outlet, it is not necessary to enlarge the caliber, so that problems such as dripping of the coating liquid can also be eliminated. Simple illustration

Please read the note on the back first, and then fill in the SII. The first picture is the establishment of the coating and development system of the first embodiment of the present invention. It is a perspective view showing the structure of the coating and developing processing system shown in FIG. 1. Fig. 3 is a perspective view showing the structure of the cold clothes and cloth head of the coating device shown in Fig. 2. Fig. 4 is a schematic plan view showing a scanning example of the coating head shown in Fig. 2. Fig. 5 is an explanatory diagram (one form) of the coating pitch on the coating head shown in Fig. 2. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -6- 501163 A7 B7 V. Description of the invention (4 Figure 6 is the coating pitch on the coating head shown in Figure 2 Explanatory diagram (second form). Fig. 7 is an explanatory diagram of the second embodiment. Fig. 8 is a plan view of the coating apparatus of the second embodiment. Fig. 9 is of the coating apparatus shown in Fig. 8 Side view. Figure 10 is a perspective view of the coating device shown in Figure 8. Figure 11 is a side view of the coating device according to the third embodiment. Figure 12 is a view of the coating device according to the first embodiment. A schematic side view. Fig. 13 is a schematic plan view showing a scanning example of a coating head according to the fourth embodiment. Explanation of the symbols in the figure (please read the precautions on the back before filling this page). Printed by a consumer cooperative 1.... • Coating and development processing system 2...... Loading section 3 ..... • 1st processing section 4... ... Relay section 5 ....., 2nd processing section 6 " ...... Exposure device 7 .............. Transferring section 10 · ..... .. Cassette table 11, 12… .. Cassette 13 ·· ·. Board transfer out and into pin group 15 ........ · Main board transfer device 16 ·· …… Transfer path 17 ....... · Brush cleaning device 18 · ··· Developing device 19 ....... ·· Adhesive processing device 20 ···· Heat treatment device 21. ··· Cooling processing device 22 ···· Main substrate transfer device 23 ... ..... conveying path 24 .. ...... coating device 25....... Cassette 26 26... · 32 ...... .. Opening 33 · · ... X-direction conveying member • Line · This paper size is applicable to China National Standard (CNS) A4 specification (21〇X 297 mm) 5Λ1163 Economy Printed by the Consumers' Cooperative of the Ministry of Intellectual Property Bureau V. Invention Description (5) 34 ........ γ-direction conveying member 36 ........ Coating head 38 ........ Body 40 ........ Nozzle 42 ........ Storage tank 50 ........ Arrange direction 71 ........ Repeat area 83 .... .... inclined surface 85 ........ recovery path 87 ........ pump 92 ........ 35 ........ drive section 37 .. ...... Transportation section 39 ........ Ejection hole 41 ........ Control section 43 ........ Supply pipe 51 ........ Scanning direction 82 ........ covering member 84 ........ washing liquid discharge hole 86 ........ filter 91 ........ brush auxiliary washing liquid Supply Nozzle 93 ........ Shielding Plate Embodiments of the invention are described below with reference to the drawings. In this embodiment, a description will be given of a form in which the present invention is applied to a coating development processing system for forming a grease-resistant film on a glass substrate and developing the exposed glass substrate. The first BM is a perspective view showing the structure of the coating process system of this embodiment. The coating and developing system i shown in the figure mainly includes a loading section 2 for carrying substrates in and out, a first processing section 3 for substrate G, and a relay section 4 as an intermediary for the first processing Part 3 is connected to the second processing outside 5. In addition, the second processing section 5 can be connected with the transfer section 7 as an intermediary ^ an exposure penetration for exposing the resist resin film into a predetermined fine pattern

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π equipment -------- order --------- line I 501163 Α7 Β7 V. Description of the invention (6). 6 〇The above loading section 2 is provided with-^ 台 台 10 It can freely carry a plurality of cassettes u for accommodating the unprocessed substrate G and a plurality of cassettes 12 for accommodating the processed substrate G. Card cassettes 1 and 12 are each provided with a substrate group G that can carry in and out the substrate G, and can move and rotate (0) in the horizontal direction (χ, γ) and vertical direction (Z). _ The first processing unit 3 is arranged on one side of the main substrate conveying device 1 capable of moving in the directions of X, Y, Z, and 0 rotation. One of the six conveying paths 16 is provided with a scrubbing device 1 for scrubbing the substrate G. 7 and developing device 18, and on the other side of the conveying path 16 is a multilayer arrangement for attaching a processing device 19 for applying a hydrophobic treatment to the surface of the substrate 0, and applying a heating and baking after the developing treatment. A heat treatment device 20 and a cooling treatment device 21 for cooling the substrate g to a predetermined temperature. The second processing unit 5 is similar to the first processing unit 3 described above. It is printed on the main substrate transfer device that can move in X, γ, ζ directions and 0 rotations. The conveying path 23 is provided with a coating device 24 on one side, and the other side of the conveying path 23 is provided with a multilayer heat treatment device 20 for pre-baking for heating the substrate G after applying the resist resin solution, and A cooling processing device 21 for cooling the substrate G to a predetermined temperature. The transfer unit 7 is provided with a cassette 25 for temporarily waiting for the substrate G, a transfer pin set 26 'for transferring and removing the substrate to and from the cassette 25, and a transfer station 27 for the substrate G. . FIG. 2 is a perspective view showing the configuration of the coating device 24 described above. At the slightly center of the coating device 24, there is a device for maintaining the standard of this paper. The standard of the Zhongguan family standard (Q χ Norwegian public love)--~-5 points 1163

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The holding plate 31 of the holding member of the soil plate. The holding plate 31 is provided with a plurality of burials, which are used to support the substrate G from the surface of the child, and which can protrude and sneak freely. Then, the supporting pins are located on the surface protruding from the surface of the holding plate 31. In a sad state, the substrate G is transferred to the main substrate conveying device 22 through the opening 邛 32 of the coating device 24 as an intermediary, and then the support pin 31 is hidden from the surface of the holding phase 31 and the substrate G is placed on the holding plate 31. In this state 7, the coating process is performed. On the two sides of the cloth in the 24X direction, there is an x-direction conveying member 33 formed by an endless belt, for example, and Wei is provided with a Y-direction conveying member 34 between the X-direction conveying members 33. . A drive section h is provided at the end of the X-direction conveying member 33. The drive section 35 is used to drive the X-direction conveying member 3: such as an endless belt, so that the Υ-direction conveying member 34 faces Transporter in χ direction. A conveying unit _ is movable on the conveying member 34 in the direction, and is used to convey the applicator head in the direction of Υ and conveying the member 34 in the γ direction. "In this embodiment, the conveying unit is conveyed in the X direction. The component 33, the γ-direction conveying component drive 4 35, and the conveyance unit 37 constitute a scanning mechanism related to the present invention. Fig. 3 is a perspective view showing the structure of the coating head% described above. There are nozzles 40, and the nozzle 4 (series is provided with a plurality of discharge holes of anti-resin resin liquid that discharges the coating liquid toward the surface of the substrate G held by the material plate 31, for example, 5 discharge holes. This nozzle 40 is constructed It is not shown in the figure through ... The person who makes the anti-resin solution storage tank supply anti-resin solution. Also, the nozzle 4Q is borrowed—the rotation that is built into the frame 38 as the angle adjustment mechanism related to the present invention.

This paper size is applicable to China National Standard (CNS) A4 (210 X 297)

(Please read the precautions on the back before filling out this page) ----- ^ ---- Order --------- -10- 501163 A7 _ 1 Employee Consumption M V. Invention Description (8. It can be rotated in theta direction. The rotation mechanism can be, for example, a gas-driven rotary actuator or a motor, etc. In addition, it can be formed in the form of setting two angles in advance or adjusting the angle freely. The operation of the coating and developing processing system constructed in this way will be described. First, the unprocessed substrates stored in the card Π are taken out of the loading unit 13 by the substrate of the loading unit 2 and then taken out in the third processing unit 3 The main substrate transfer device 15 transfers and then transfers it to the scrubbing device 17. The substrate G that is cleaned in the scrubbing device 17 is subjected to a hydrophobization treatment by the attachment processing device 19 and cooled in the cooling processing device 21 before being placed. On the relay unit 4. The main substrate transfer device 22 of the second processing unit 5 picks up the substrate and then transfers it to the coating device 24. The cloth is placed on a support pin (not shown) by a support pin (not shown). The holding plate 31 is taken up by the main substrate conveying device 22 with the surface protruding. The plate g is then infiltrated from the surface of the holding plate 31, and the substrate G is placed on the holding plate 31. Next, a scanning mechanism constituted by the X-direction conveying member 33, the γ-direction conveying member M, the driving section 35, and the conveying section 37 During scanning, the coating head is scanned in 36 rows, and the resist resin liquid is supplied toward the base surface from each of the ejection holes 39 of the nozzle 40. The above scanning is, for example, a two-spindle rotation mechanism shown in FIG. 4 to adjust the nozzle The angle of 40 is not set, so that the arrangement direction of the ejection holes 39 of the nozzle 40 is parallel to the X direction. The coating mechanism is used to make coating = 36. The substrate G is transferred from the X direction to the end side in the γ direction (Fig. * Then, the scanning mechanism is used to move the coating head 36 in the χ direction—the extent to which the entire coating of the nozzle 40 can be applied (② in Figure 4), and the paper size of the scanning mechanism is adjusted to the Chinese national standard ( cns) a4 Regulate the Heart and Public Love) -11-

V. Description of the invention (9 Make the soil cloth head 36 帛 Y direction to be transported (hereinafter ③ in Figure 4). Repeat this scanning operation, so that the coating head 36 scans the entire surface of the substrate G, and applies the anti-resin resin solution to the substrate G in all directions. Here, in the above example, when the resist resin solution is coated on the substrate G by the coating head 36, as shown in FIG. 5, the angle Θ of the nozzle 40 is adjusted by the rotation mechanism to make the nozzle 40 The arrangement direction of the discharge holes 39 is 50 parallel to the X direction (the direction perpendicular to the scanning direction 51). This can maximize the distance P between the discharges & 39 adjacent to the scanning direction η, The coating process can be performed quickly. However, when the viscosity of the anti-resin solution is high or the contact angle on the surface of the glass substrate is large, the resist tree discharged from the discharge hole 39 adjacent to the nozzle 40 is not liquid. b. Contact with each other or the formation of recesses at the contact parts, which makes it impossible to apply the resist resin evenly. Here, in this embodiment, as shown in FIG. 6, the nozzle 40 is rotated by the rotation mechanism, so that the nozzle 40 can be rotated. There is a certain angle between the arrangement direction of the nozzle discharge holes 39 and the scanning direction 51. The distance p between the adjacent discharge holes 39 relative to the scanning direction 51 can be reduced. Therefore, a rotation mechanism can be set to adjust the distance P between the adjacent discharge holes 39, which can make the resist resin liquid It is uniformly coated on the substrate 0. The angle adjustment of the nozzle 40 can be automated by setting control such as described later. That is, as shown in FIG. 12, a resist resin is provided to the nozzle 40. The resist resin liquid supply pipe 43 of the resist resin liquid in the liquid storage tank 42 and a viscosity data of the resist resin liquid and the contact angle data of the substrate G are input, and the scanning direction 51 and The angle formed by the direction of the discharge holes in the direction of 50, and according to the calculation result, the control unit M that adjusts the angle of the nozzle 40 by the rotation mechanism, ------------- jjjH 装- ------- Order --------- Line 1 (Please read the notes on the back before filling out this page)

501163

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

This paper size _ + off specifications (〇〇297 public love) to make the angle adjustment into an automatic form. In addition, the control unit 41 can also calculate the scanning speed of the nozzle that can form the anti-resin film to a desired thickness based on the information of the viscosity data and the contact angle data of the substrate G, and then adjust it based on the calculation result. Scanners. Thereby, even if the distance P between the ejection holes 39 is changed and the film thickness of the resist resin film is different, the resist film can be realized by adjusting the scanning speed to a desired film thickness. In addition, the control unit 41 can also calculate the discharge pressure of the anti-resin resin liquid that is discharged from the discharge hole to form a desired thickness of the resist resin film based on the information of the viscosity data and the contact angle data of the substrate 0. Based on this calculation result, the discharge pressure is adjusted. Thus, even if the distance p between the ejection holes 39 is changed and the film thickness of the anti-resin resin film is different, the desired thickness of the resist resin film can be realized by adjusting the ejection pressure. In addition, it is also possible to obtain the angle formed by the contact angle data, etc. in advance, and the angle formed by the discharge hole arrangement direction 50 corresponding to the data, and store the information in the control unit for information. Then, the substrate G coated with the anti-residue resin solution is subjected to a baking treatment in the heat treatment device 20 and then cooled in the cooling treatment device 2 and then exposed in the exposure device 6 to form a predetermined pattern. Subsequently, the exposed substrate G is transported to the developing device 8 and developed by a developing solution and then washed away by a cleaning solution to complete the developing process. Subsequently, the heat treatment device 20 is heated and baked, and the cooling treatment device 21 is cooled, and then the processed substrate (}) is stored in the cassette 12 of the loading section 2 to end a series of processing. In the coating and developing processing system 1 of the present embodiment, the coating device 24 ′ is used, for example, the nozzle 40 is arranged in the direction of the ejection hole 39 in a direction of 50 °. 13-pack— (Please read the precautions on the back before filling (This page) · A7

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When scanning in the direction, the grease liquid can simultaneously spit out a wide sound with respect to the 4 holes 39 of the nozzle at the same time.... Therefore, it is possible to reduce the waste of the fine fat liquid ’and shorten the application of the anti-lipid liquid coating process. In addition, oblique ridges, mountains, and the respective discharge holes 39 do not need to be enlarged in diameter, and can be used to remove dripping of the resist resin. Next, a second embodiment of the present invention will be described. The anti-resin resin solution is not applied on the entire surface of the substrate G, but is as shown by the slanted lines in the figure and the figure. It is not necessary to apply a resist resin solution to the outer edge of the substrate G. In this embodiment, in the case of such a configuration, in the base core "ϋ40 'gp, the coating prohibited area of the anti-resin resin liquid belonging to the surface of the substrate G and the repeated area where the scanning area of the nozzle scanning is repeated 7: 上'As shown in Figs. 8 and 9' is provided with a shielding member 82. By using the address member 82, the nozzle 40 cannot prevent the application of the anti-Yu Yueyue liquid on the substrate g. Since the resist resin liquid is applied on top, it is not necessary to perform an end treatment, and the end portion is coated with the anti-absorptive liquid, and then the resist resin liquid located on the end is removed. In the form, the shielding member 82 has an inclined surface 83 that slopes downward toward the outside I, $, of the substrate c. Thereby, no excess resist resin liquid is dropped from the shielding member 82 onto the substrate G. Further, in this embodiment, as shown in FIG. 10, a plurality of washing liquid discharge holes 84 are provided above the inclined surface 83, and the washing is performed by flowing down from the upper portion of the inclined surface 83 of the shielding member 82 to the lower portion. Liquid cleaning device. A cleaning liquid recovery path 85 is provided along the end of the inclined surface 83 Make the recovery road 85

This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) ------------------ ^ --------- ( Please read the precautions on the back before filling this page) -14. 501163 A7 V. Description of the invention (12) The collected washing liquid has passed through; the washing liquid discharge hole 84 is supplied to the washing liquid 8 and the pump 87, Make it think that the washing liquid can be reused. In this embodiment, this configuration is adopted so that the resist resin liquid does not adhere to the inclined surface 83, and the used cleaning liquid is not wasted. In addition, the cleaning liquid can be discharged only to the portion where the nozzle 40 passes, and it can also be configured to sequentially switch the cleaning liquid discharge range. Thereby, the amount of the cleaning liquid to be used can be reduced, and the load of filtering and processing of the cleaning liquid through the trowel 86 can be reduced. As shown in FIG. 9, each shielding member 82 has a structure that can be moved left and right. As shown in FIG. 10, the washing liquid is always discharged from the washing liquid discharge hole 84, but it can also be implemented as the third embodiment. In the form, as shown in FIG. N, for example, the shielding member 82 can be moved to the left and right when the glass substrate G is alternated in and out, and the shielding member 82 is moved to the glass substrate G when the glass substrate G is alternated in and out. In this position, the brush 91 disposed in advance can contact the shielding member 82, and the auxiliary cleaning liquid supply nozzle 92 disposed above the brush 91 supplies the cleaning liquid to the brush 91 and the shielding member 82, and the drawing is omitted. The illustrated motor rotates the brush 91 to remove the resist resin solution attached to the shielding member 82. In addition, when the shielding member 82 is moved to the position where the glass substrate G retreats and waits during cleaning, the shielding plate 93 may be placed between the shielding member 82 and the holding plate 31 of the glass substrate g, for example, from below. Ascending to cover the shielding member 82 and the holding plate 31 for holding the glass substrate 0, so that the cleaning liquid dissipated on the auxiliary cleaning mechanism will not adhere to the holding plate n. 'The person who can remove the resist resin liquid attached to the shielding member 82 located above the cleaning liquid discharge & 84. ^ The paper rule jade is applicable to the Chinese national government. --- ^ --------- ^ (Please read the notes on the back before filling in this page) 501163 A7 V. Description of Invention (l3) Here, coating In the case of a resist resin film, there is a case in which the thickness of the film near the end portion is larger than the thickness of the central Deng film, and the resist resin film is applied. In this state, as in the fourth embodiment, as shown in Fig. 13, the angle of the nozzle 40 can be changed by scanning the scanner by changing the angle of the nozzle 40 according to the area in the same plane. In other words, when scanning along the vicinity of the end of the substrate, the nozzle 40 is arranged so that the scanning direction of the discharge holes arranged in the nozzle is scanned at a right angle to the scanning direction of the nozzle 40. When scanning the central part of the substrate, the nozzle 40 can also be arranged so that the arrangement direction of the soil outlet holes arranged on the nozzle is at an acute angle with the scanning direction of the nozzle 40, thereby allowing the nozzle 40 to be located at the G end of the substrate. The distance p between the discharge holes 39 on the upper portion 39 is larger than the distance p between the discharge holes 39 on the central portion of the substrate G. Therefore, the nozzle 40 can be scanned with the same discharge pressure and the same scanning speed in the substrate surface at all times, and a resist resin film with a film thickness almost uniform in the substrate surface can be formed. In this way, the nozzles 40 are scanned at different intervals P for coating in different areas in the same plane, and the uniform speed can be formed in the plane without changing the scanning speed of the nozzle and the discharge pressure of the resist resin liquid. Resist film. The invention is not limited to the embodiments described above. For example, the substrate may be not only a glass substrate but also a semiconductor wafer. Moreover, the coating liquid is not only an anti-money resin liquid, but also a coating liquid for an insulating film and the like. As described above, according to the present invention, problems such as dripping of the coating liquid do not occur, the coating liquid is not wasted, and the time required for the coating process can be shortened. _Loading (Please read the precautions on the back before filling out this page) Order --------- Line_ Printed by the Consumer Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -16

Claims (1)

2. Scope of patent application 1. A coating device, characterized in that it includes: a holding member for holding a substrate; a nozzle and a plurality of ejection holes provided in the series; The dagger is a person who dispenses the coating liquid on the substrate held by k 杲 巳, and a scanning mechanism is used to make a scanning operation on the nozzle plate. … The basis has been maintained, such as the scope of patent application! The coating device of this item further includes a 2 degree adjustment mechanism, which is used to adjust the scanning direction of the nozzle that performs the simple operation by the aforementioned scanning mechanism. Angle 3. · If the coating #H of the patent application scope is listed as follows, namely:-It contains and contains the following data for inputting at least the viscosity data of the coating liquid and the contact angle data of the substrate surface; I and I are used to calculate the angle formed by the scanning direction of the nozzle and the arrangement direction of the discharge holes according to the input data, and adjust the angle by the angle adjustment mechanism according to the calculation result. 4. Please refer to Patent Application No. 3 for the coating device, and have a mechanism to calculate the discharge pressure of the coating liquid discharged from the aforementioned discharge hole based on the input data. 5. For example, the coating device of item 3 of the patent application scope has a mechanism for calculating the speed-up and speed-up production of the nozzle based on the input data. Tian, You 6. The coating device in item i of the patent scope of China, including the following: The paper size is covered by the Chinese National Standard (CNS) A4 specification (210 X 297 mm) {Please read the note on the back first Please fill in this page again} Order: Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -17 7. 8. A8 B8 C8 D8 VI. Patent Application Shielding Member 'The shielding member is inserted into the coating liquid on the surface of the aforementioned substrate Between the coating prohibition area and the substrate and the nozzle on the scanning area or the overlapping area where the nozzle is scanned. For example, the coating device according to item 6 of the application, wherein the shielding member has an inclined surface extending to the outside of the substrate and inclined downward. For example, the coating device of the scope of patent application No. 7 further includes a mechanism for flowing the cleaning liquid from the upper part of the inclined surface of the shielding member to the lower part. 9. The coating device according to item 8 of the scope of patent application, which further includes: a recovery path for recovering the aforementioned cleaning solution, along the end of the inclined surface extending to the outside of the substrate just described The installer; and a mechanism for filtering the washing liquid recovered through the aforementioned recovery path, so as to reuse the aforementioned washing liquid. 10. If the second patent application scope is a coating device, where the nozzle is on the same surface of the aforementioned substrate, the angle adjustment mechanism is used to change the aforementioned angle, and then the scanning operation is performed #g 11. As the tenth patent application scope _; A coating device that makes an angle of the nozzle to be scanned at the end of the substrate different from an angle of the nozzle to be scanned at the center of the substrate. The paper size of the table applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -------------- installation -------- order ------- --Line (Please read the precautions on the back before filling out this page} Printed by the Ministry of Economic Affairs and Economic Affairs & Consumer Property Cooperatives-18-