JPH1142759A - Printing method and printing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a process in which the vibration of a plate for holding a printing paste is controlled/prevented, the paste is torn stably at a prescribed position between the plate and a matter to be printed, and high precision printing is done at a prescribed position appropriately. SOLUTION: Printing is done by transferring a printing paste 12 which is held in the opening part of a plate 11 separated from matter to be printed 14 to the matter 14 by adjusting tension given to the plate 11, by contacting a supporter with the facing surface to the matter 14 of the plate 11 around the matter 14, by separating the plate 11 and the matter 14 from one end in turn, or by combining these variously as required while controlling or preventing the vibration of a screen mask 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing method and an apparatus for transferring a printing paste held in an opening of a printing plate to a printing medium.

[0002]

2. Description of the Related Art Heretofore, as such a printing method and apparatus, for example, a flat plate stencil (screen) type printing in which cream solder is printed on a land of a printed circuit board is known.

In this printing, as shown in FIGS. 9A and 9B, a screen mask (metal mask) having openings c arranged in a predetermined pattern corresponding to lands b of a printed circuit board a. d is brought into contact with the circuit board a. Next, as shown in FIGS. 9A and 9B, the cream solder e supplied on the screen mask d is moved in the direction indicated by the arrow of the squeegee f to fill the opening c with the cream solder e. I do.

Next, as shown in FIGS. 9 (C) and 9 (D), by separating the screen mask d from the circuit board a, the cream solder e in the opening c of the screen mask d is removed from the land of the circuit board a. b. Printing is performed.

In order to separate the screen mask d from the circuit board a, the screen mask d is stretched in a frame member g and supported at a predetermined height as shown in FIG. On the other hand, the circuit board a is supported on a support base j that is raised and lowered by a screw shaft i and the like that is driven to rotate by a motor h, and is raised and lowered in a timely manner.
It is separated from and brought into contact with the screen mask d.

[0006]

However, in the conventional printing method and apparatus as described above, when the screen mask d is separated from the circuit board a as shown in FIG. As a result, the screen mask d is pulled toward the circuit board a to increase the tension,
At a certain point, the cream solder e is torn off because the tension of the screen mask d exceeds the adhesive strength of the cream solder e.
From that point, the screen mask d becomes free and starts vibrating.

The point at which the cream solder e separates from the screen mask d is determined by various factors such as the adhesive force of the cream solder e, the tension of the screen mask d, and the speed at which the screen mask d is separated from the circuit board a. The vibration behavior of the screen mask d is complicated due to the above-mentioned factors and a change in tension due to fatigue of the screen mask d with time, and it has not been possible to cope with this conventionally.

For this reason, the unstable state makes the releasability of the cream solder e from the screen mask d unstable, and as a result, as the screen mask d moves away from the circuit board a, the cream solder e becomes 9D is torn off at an uncertain position between d and the circuit board a, and a part of the cream solder e adheres to a portion other than the land b on the circuit board a as shown in FIG. Occasionally, there is a possibility that the ink will adhere to the inner periphery of the opening c of the screen mask d, particularly on the side of the circuit board a or the edge thereof.

[0010] The cream solder e attached to the portion other than the land b on the circuit board a impairs the electrical characteristics of the circuit board a. The cream solder e attached to the circuit board a side and the rim of the inner periphery of the opening c causes printing bleeding at the next printing, and erroneously attaches to the adjacent cream solder e on the circuit board a. The amount of cream solder e printed on the land b of the circuit board a is insufficient due to the occurrence of a bridge or the cream solder e attached to the screen mask d side. Impairs the characteristics.

SUMMARY OF THE INVENTION It is an object of the present invention to control / prevent vibration of a printing paste holding plate and to stably tear the printing paste at a predetermined position between the printing plate and a printing medium. An object of the present invention is to provide a printing method and a printing apparatus which are stable and do not impair the characteristics of a printing medium.

[0011]

According to a first aspect of the present invention, there is provided a printing method comprising: applying a printing plate having an opening of a predetermined pattern to a printing medium; After filling the paste, the plate and the printing medium are separated and the printing paste in the opening is transferred to the printing medium and printing is performed. Transferring the held printing paste to the printing medium,
The printing is performed while controlling or preventing the vibration of the plate, and printing is performed.

In such a configuration, in order to transfer the printing paste filled in the opening of the printing plate to the printing material on which the printing plate is applied, vibration of the printing plate when separating the printing material from the printing plate is determined. By the control / prevention means in the printing apparatus according to the ninth aspect, for example, the method according to the seventh aspect and the fifteenth aspect.
As in the apparatus of the invention, the printing paste is controlled or prevented in a predetermined state under the condition based on the empirical value verified in advance, so that the printing paste is prevented under the constant vibration of the plate or the vibration is prevented. Under the condition, the printing paste can be stably torn at a predetermined position between the plate and the printing medium with good separation from the printing plate. As a result, it is possible to solve the problem that the position and the state of the tearing of the printing paste become unstable and the characteristics of the printing medium are spoiled as in the related art. As in the printing method according to the eighth aspect and the printing apparatus according to the sixteenth aspect, when the above conditions are adjusted each time based on the detection result of the printing state at that time, the plate can be adjusted to the printing state at that time. In addition, control or prevention can be performed more appropriately.

The control or prevention of plate vibration can be performed by adjusting the tension applied to the plate as in the printing method of the second aspect of the invention or the tension adjusting mechanism of the printing apparatus of the tenth aspect of the invention. This tension adjustment is preferably performed in a plurality of directions of the plate, as in the printing method according to the third aspect of the invention or the tension adjustment mechanism of the printing apparatus according to the eleventh aspect of the present invention. The greater the number, the easier it is to control or prevent plate vibration.

The control or prevention of vibration can be performed by applying tension without using a frame as in the printing method of the invention of claim 4, and as in the tension adjustment mechanism of the invention of claim 12,
When adjusting the distance between the peripheral edges of the printing plate, it is easy to install a peripheral pulling means for adjusting the tension, and the adjustment width can be freely set.

According to the printing method of the fifth aspect and the separation mechanism of the printing apparatus of the thirteenth aspect, when the plate and the printing medium are separated from one end in order, each part of the plate Has a peeling boundary across the entire width of the plate between itself and the printing medium, and moves from one end to the other end, while supporting the plate on the printing medium side at the peeling boundary with the printing medium. Since the peeling proceeds sequentially, the vibration when the plate separates from the printing medium can be suppressed well, and the vibration of the peeling progressing portion of the plate can be sufficiently prevented.

In the printing method according to the sixth aspect of the present invention or the printing apparatus according to the fourteenth aspect of the present invention, when the plate is separated from the printing medium, a porter located around the printing medium is printed on the printing medium. Even when it is applied to the surface facing the body, the vibration when the plate is separated from the printing medium is controlled by the supporter to limit the vibration,
In addition, it can be prevented.

Each of the various means for controlling / preventing the vibration of the plate described above can be used in combination with various combinations and the number of combinations as required.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments according to the present invention will be described below in detail with reference to FIGS.

(Embodiment 1) The embodiment 1 is shown in FIG.
2 (B), a circuit board 1 on which a screen mask 11 which is a plate having a predetermined pattern of openings 11a as shown in FIG.
4, the cream solder 12 as a printing paste is applied to the opening 11a using a squeegee 13 or the like as shown in FIGS. 1 (B), 2 (A) and 2 (B). Fill, then screen mask 11 and circuit board 14
2C, a printing method in which the cream solder 12 held in the opening 11a is transferred to, for example, a land 15 on the circuit board 14 and printing is performed. And an example of a device. However, the present invention is not limited to this, but can be applied to any case where various printing pastes are printed on various printing materials by various types of plates having openings of various patterns.

In the first embodiment, in particular, the screen mask 11 and the circuit board 14 are separated from each other as shown in FIG. 2C, and the cream solder 12 held in the opening 11a of the screen mask 11 is applied to the circuit board 14. The transfer is performed while controlling or preventing the vibration of the screen mask 11, and printing is performed. As a result, the screen mask 11 and the circuit board 14 are separated, and the cream solder 12 is separated from the circuit board 1.
4 is controlled or prevented from vibrating the screen mask 11 when transferred onto the solder paste 4, so that the cream solder 12 is prevented from vibrating under the constant vibration of the screen mask 11 or prevented. Under the condition, at a predetermined position between the screen mask 11 and the circuit board 14, FIG.
As shown in FIG. 2 (C), the film is torn off stably with good separation from the screen, that is, with good separation from the screen mask 11, and hardly remains on the inner periphery of the opening 11a as shown in FIG. 2 (C). As shown in FIG. 2 (D), it is possible to print on the land 15 with high accuracy without any excess or shortage and without disturbance, as shown in FIG. Due to poor plate separation property, the position and state of tearing are unstable and printing failure occurs, and the circuit board 14
The problem of impairing the characteristics of the above is solved.

More specifically, the first embodiment is different from FIG.
(A), at least one of the screen mask 11 and the circuit board 14 is inclined with respect to the other, for example, so that both of them are separated from one end 11b in order. Is separated from the circuit board 14, and the cream solder 12 in the opening 11a is
The vibration of the screen mask 11 at the time of transfer onto the land 15 of No. 4 is controlled or prevented.

In this way, the screen mask 11
In the state where the separation boundary A across the entire width of the screen mask 11 moves from one end 11b to the other end 11c as shown by a virtual line in FIG. 11 at the peeling boundary A
Since the peeling proceeds sequentially while being supported on the fourth side, the vibration when the screen mask 11 separates from the circuit board 14 can be suppressed to a constant state. In particular, the vibration at the peeling boundary A portion can be sufficiently reduced. As a result, the cream solder 12 can be released more stably with good releasability, and the high-precision printing can be achieved steadily.

As described above, in the first embodiment, as an example of the separation / contact mechanism for separating the screen mask 11 and the circuit board 14 from one end, as shown in FIG. The substrate support table 22a of the substrate support device 22 for holding the circuit board 14 is moved to the axis 69 with respect to the screen mask 11 stretched and supported by the frame 11d as before.
, And the free end side of the substrate support base 22a is connected to and supported by the screw shaft 71 via a connecting pin 72 and a connecting tool 73. This screw shaft 7
1 is rotated by a motor 68 and a belt 70 to rotate the substrate support table 22a in the forward and reverse directions about the axis 69.
Is moved up and down while changing the inclination angle between a lower position separated from the screen mask 11 and an upper position where the circuit board 14 is brought into close contact with the lower surface of the screen mask 11 as shown in FIG.

In the substrate support device 22 shown in the figure, the substrate support table 22a uses the screen mask 1
In the upward movement position where the circuit board 14 is brought into close contact with the screen mask 11, the inclination is increased toward the downward movement position where the circuit board 14 is separated from the screen mask 11. As described above, by separating the circuit board 14 from the screen mask 11 while tilting the substrate support table 22a, the screen mask 1
1 and the circuit board 14 are connected to one end 11 of the screen mask 11.
From the side b to the side of the other end 11c, there is a peeling boundary A over the entire width of the screen mask 11 as shown by the imaginary line in FIG. 1A, and this extends from one end 11b to the other end 11c as described above. In the state of moving toward the peeling, the peeling proceeds sequentially while supporting the peeling boundary A of the screen mask 11 on the circuit board 14 side.

However, if a peeling state in which such a peeling boundary A portion is held and the position thereof moves sequentially from one end to the other end can be obtained, how is a specific separating / contact structure constructed? Is also good. For example, the screen mask 11 side may perform a separating / contacting operation with respect to the circuit board 14, or both the screen mask 11 and the circuit board 14 may perform a separating / contacting operation.

An example of the overall configuration of a printing apparatus equipped with such a separating mechanism is shown in an external view of FIG. 3 and a block connection diagram of FIG. To explain this, a stage unit 2 including a substrate loading / unloading device 21, a substrate support device 22, a screen mask 11, a squeegee head driving device 24, an XYθ position correcting unit 25 and a separation / contact unit 26.
0, the screen mask heating device 27 including the heating unit 28 and the timer 29 is driven under the control of the control unit 34. The control unit 34 includes the processing operation unit 3
Board position recognition / correction unit 3 including a camera 1 and a recognition camera unit 32
When the board position recognition correction information from 0 is input,
Printing inspection information is input from a printing inspection unit 38 including a processing operation unit 39, a printing state detection unit 40, and an inspection reference storage unit 41. The processing operation unit 36
Process information is input and output between a process control unit 35 having a non-defective print database 37 and the control unit 34, and printing state information is input from the print inspection unit 38 to perform process control. I have to. The control unit 34 displays information such as the state of the printed cream solder on the display unit 33 as necessary as a result of the operation and inspection.

In the specific device configuration shown in FIG. 3, the circuit board 14 is carried into the stage 20 by the carry-in device 21a of the board carry-in / carry-out device 21 in the direction indicated by the arrow, and the position of the circuit board 14 is corrected. , Screen mask 1
1 is moved to the lower printing position, and after the printing is performed at the printing position, the unloading device 21 of the substrate loading / unloading device 21 from the printing position.
By b, it is carried out of the printing apparatus in the direction shown by the arrow.

In the stage section 20, first, the stage section 2
The position is held by the above-mentioned substrate support table 22a of the substrate support device 22 arranged at 0. The position can be held, for example, by a method of vacuum-suctioning the circuit board 14 with a large number of suction holes opened on the surface of the board support table 22a, or a method of supporting the lower surface of the circuit board 14 with a large number of backup pins. In the first embodiment, since it is necessary to hold the circuit board 14 in a state where the board support base 22a is inclined, it is preferable to hold the circuit board 14 by suction. However, the present invention is not limited to this.

In the state where the position of the circuit board 14 is held, the position correcting mark on the circuit board 14 is recognized by the recognition camera section 32 of the board position recognition and correction section 30. The processing operation unit 31 calculates a position shift between the recognized position of the circuit board 14 and the position of the screen mask 11 and calculates a position correction amount of the circuit board 14 for correcting the position shift. Based on this calculation result, the XYθ position correcting means 25 of the stage unit 20 corrects the position of the circuit board 14 with respect to the screen mask 11. That is, the XYθ position correcting means 25 sets the X direction orthogonal to the screen mask 11 along the horizontal plane of the printing apparatus based on the position correction information.
The position of the circuit board 14 is corrected in the Y2 direction and the θ direction around the Z axis perpendicular to the horizontal plane. Although not shown, the XYθ position correcting means 25 places a Y-direction table movable in the Y direction on an X-direction table movable in the X direction (the loading / unloading direction of the circuit board 14). Further, a θ direction table rotatable in the θ direction is mounted thereon, and the tables are moved by the position correction amounts in the respective directions to correct the position of the circuit board 14. The position correction in the X direction is performed after the position correction in the Y direction and the θ direction is completed, and before the circuit board 14 comes into contact with the screen mask 11 after the circuit board 14 is moved to the printing position and stopped. To do it.

The circuit board 14 held by the board support device 22 is moved to a printing position in the X direction by the X direction driving device of the stage section 20. In this printing position, the circuit board 14 is located below the screen mask 11, and is raised to a horizontal position where the upper surface of the circuit board 14 contacts the lower surface of the screen mask 11 by the substrate support table 22 a of the substrate support device 22. Then, the cream solder 12 is supplied to one end in the X direction on the screen mask 11 in a state of FIG. 1B in which the lower surface of the screen mask 11 contacts the upper surface of the substrate 14, and the squeegee 13 is moved to the squeegee head driving device 24. From the other end 11c to one end 11b of the screen mask 11 in the X direction.
Move along the direction to open the screen mask 11
1a is filled with cream solder.

As a typical example, the screen mask 11 is formed, for example, on a nickel or stainless steel plate having a thickness of about 150 μm through a through hole corresponding to a land 15 which is one of the copper conductor patterns of the circuit board 14. The opening 11a is formed. The squeegee head driving device 24 moves the squeegee 13 for filling the opening portion 11a of the screen mask 11 with the cream solder 12 on the screen mask 11 in the directions of arrows shown in FIGS. It is to let. The squeegee 13
The squeegee head, which is composed of a flat plate or a sword-shaped (approximately pentagonal) cross-sectional shape, is driven by a motor, rotates a ball screw, and moves the squeegee head coupled to the ball screw back and forth along the axial direction of the ball screw. Then, the squeegee 13 is moved on the screen mask 11. The squeegee head can be moved up and down by a motor. Further, the inclination angle of the squeegee 13 with respect to the screen mask 11 can be adjusted by the cylinder. That is, the squeegee 13 is rotatably supported at a portion (not shown), and the cylinder is driven to move one end of the squeegee 13 up and down, whereby the squeegee 13 is rotated with the support point as a fulcrum so that the inclination can be adjusted.

The opening 11a of the screen mask 11
The lower end surface of the cream solder filled in the opening 11
a, the screen mask 11 and the circuit board 14 are separated from each other by the substrate support table 22a.
The layer of the cream solder 12 is formed on the land 15 of the circuit board 14.

As one embodiment of the material of the cream solder 12, one containing 90% by weight of metal powder and 10% by weight of flux is preferable. About 62% by weight of the metal powder is tin, the remainder is lead, and the particle size is 2%.
0 to 40 μm. The flux contains 75% to 40% by weight of alcohol or the like as a solvent, and has a remaining solid content of 25%.
６０60% by weight. This solid content is rosin, activator,
Contains thixotropic agents. As a specific product of the cream solder 12, a Panasonic solder (trade name) of product number MR7125 with 63% by weight of tin and 37% by weight of lead is exemplified.

The material of the screen mask 11 is preferably a stainless steel (eg, SUS304) such as nickel-chromium, or a metal such as nickel.
Also, the surface of the synthetic resin such as polyimide and the opening 11a
It is also effective to use a screen mask in which a conductive evaporation film or plating film is formed on the inner wall surface.

The print inspection section 38 measures the shape of the cream solder layer 12 formed on the land 15, that is, the shape and position of the cream solder layer by using a camera or a laser length measuring device as an example of the printing state detecting means 40. Based on the measurement results, the processing operation unit 39 calculates the volume and the amount of displacement of the layer of the cream solder 12. The laser length measuring device irradiates the cream solder 12 with a laser and calculates the height of the layer of the cream solder 12 from the position of the reflected light. The above calculation result is compared with the inspection standard stored in the inspection standard storage unit 41, and whether the printing is good or not is output to the control unit 34. And the numerical value is also output to the control unit 34. This judging operation is performed, for example, based on the image captured by the camera of the printing state detecting means 40 or the position data measured by the laser length measuring device.
The height, width, volume, etc. of the layer of the target are calculated, and the inspection reference storage unit 4
This is performed by comparing the determination data such as the height of the cream solder 12 stored in 1 with the calculated value in the processing operation unit 39 to determine whether the printing is good.

The process control unit 35 changes the setting of the printing apparatus parameters based on the printing state data of the layer of the cream solder 12 after printing by the printing inspection unit 38. Here, the above parameters are
As an example, it means the parameters (for example, the printing speed, the inclination angle of the squeegee 13, the printing pressure, etc.) of each facility stored in the non-defective print database 37. The relationship between these parameters and print quality is stored as a database 37, and the processing operation unit 36 calculates the optimal parameters.

Next, a printing method performed by the printing apparatus will be described with reference to a flowchart of FIG. The series of operations is controlled by the control unit 34.

In step S1, the substrate loading / unloading device 2
The circuit board 14 is moved to the stage 2 by the carry-in device 21a.
Transport to 0.

Next, in step S2, the stage section 20
Is held by the substrate support device 22.

Next, in step S3, the position of the circuit board 14 held by the board support device 22 is recognized by the board position recognition and correction unit 30, and the position correction amount of the circuit board 14 with respect to the screen mask 11 is calculated. .

Next, in step S4, the XYθ position correcting means 25 of the stage section 20 corrects the position of the circuit board 14 with respect to the screen mask 11 in the XYθ direction based on the calculated position correction amount.

Next, in step S5, the stage section 20
The circuit board 14 is positioned at a printing position below the screen mask 11 by the
4 is raised so that the screen mask 11 contacts the upper surface of the circuit board 14.

Next, in step S6, the squeegee 13 is moved on the screen mask 11, and the cream solder 12 is filled in the opening 11a of the screen mask 11.

In step S7, a plate separating operation for separating the screen mask 11 and the circuit board 14 is performed. That is, the substrate support table 22a in the stage section 20
By lowering the circuit board 14 obliquely with respect to the screen mask 11, the circuit board 14 is sequentially separated from the screen mask 11 from the one end 11b side to the other end 11c side as described above. Go. As a result, the cream solder 12 is
Is transferred and printed on the land 15 of the circuit board 14 with high precision as described above.

Next, in step S8, the print inspection unit 38
Inspects the shape and position of the layer of the cream solder 12 formed on the circuit board 14.

Next, in step S9, as a result of the inspection, it is determined whether or not the printing state is good.

If it is determined that the printing state is good, the process proceeds to step S10, where the circuit board 1
4 is unloaded from the printing device by the unloading device 21b, and a series of printing operations is completed.

If it is determined in step S9 that the printing state is defective, the process proceeds to step S11, where the process control unit 35 changes the design of the process parameters, and ends the printing operation. Screen mask 11
As for the adjustment of the separation property of the cream solder 12 due to the vibration, the printing condition is changed, for example, the lowering speed of the substrate support table 22a is adjusted.

In step S11, the design is changed.
The printing of the next cream solder 12 is performed based on the information on the optimal conditions, and the plate releasing process of step S7 after printing and the unloading of the circuit board 14 by the unloading device 21b in step S10 are performed. In some cases, the layer of cream solder 12 determined to be defective is removed,
Again, a new printing operation may be performed based on the conditions changed in design in step S11, and the lowering speed or the like of the substrate support table 22a may be changed in the plate release process in step S7 after printing. The screen mask 11
Various printing conditions to prevent the vibration of the initial setting of the conditions based on the experience value verified in advance,
The vibration is controlled or prevented in a constant state. When the initial setting condition is adjusted each time based on the detection result of the current printing state as described above, the screen mask 11 is adjusted to the current printing state. In addition, control or prevention can be performed more appropriately.

(Embodiment 2) This embodiment 2
As shown in (1), the control or prevention of the vibration of the screen mask 11 is performed by adjusting the tension applied to the screen mask 11 by the tension adjusting mechanism 81, which is different from the first embodiment. Therefore, here
Only the different parts will be described.

This tension adjusting mechanism 81 is shown in FIG.
As shown in (B), a pair of guide bars 60, 6 fixed laterally to the upper ends of the left and right support walls 171, 172.
0, the screen mask 11 is stretched over, and both ends protruding on both sides thereof are clamped by a chuck 61 a provided at a predetermined position of one support wall 171,
The other support wall 172 is clamped by a chuck 61b provided so as to be able to move up and down. For example, a cylinder 62 controlled by air pressure is connected to the chuck 61b, and the screen mask 11 is moved in one direction between the chucks 61a and 61b. For example, it is pulled in the X direction.

When the screen mask 11 is pulled by the cylinder 62, the vibration characteristic changes according to the difference in tension corresponding to the difference in the distance between both ends. And vibration can be substantially prevented depending on the magnitude of the tension. It is preferable that the chucks 61a and 61b clamp the entire width of each end of the screen mask 11 so that such a vibration control or prevention action covers the entire area of the screen mask 11.

In particular, the tension adjusting mechanism 81 can adjust and manage the tension in the screen mask 11 in addition to simply applying the set constant tension. Therefore, if the air adjustment to the cylinder 62 is performed by the controller, various settings and supports can be performed according to various conditions from the initial stage of use. In addition, the state of the printing result can be inspected and feedback controlled at each time, or the screen can be controlled. The first embodiment can always maintain the tension in an optimal state in response to the temporal change of the mask 11 itself, and the first embodiment can be performed under a constant vibration state of the screen mask 11 or under a state where the vibration is prevented. In the case of (1), high-precision printing can be performed.

One embodiment in which the entire width of each end of the screen mask 11 is clamped will be described.
It was preferable that the air pressure acting on the cylinder be, for example, about 3.0 kg / cm ² and the cylinder diameter be, for example, about 40 mm.

FIG. 8 shows a comparison between experimental results of the vibration state of the screen mask 11 of the conventional example shown in FIGS. 9 and 10 and an example of the second embodiment.

In the conventional example, as shown in FIG.
Vibration at the time of separation of the screen mask 11 from the circuit board 14 is large and unstable thereafter. On the other hand, according to the second embodiment, as shown in FIG. The width (amplitude) is small and stable thereafter. As a result, it is clear that a higher accuracy printing result can be obtained in the case of the second embodiment than in the case of the conventional example.

If the tension adjusting mechanism 81 adjusts the tension in a plurality of directions such as the X and Y directions orthogonal to the screen mask 11, the vibration of the screen mask 11 can be regulated from a plurality of directions. In addition, the vibration of the screen mask 11 can be controlled or prevented from a plurality of directions to a constant vibration state, and the control or prevention of vibration in a plurality of directions is synergistic to improve the vibration control / prevention efficiency. . Therefore, the greater the direction in which the tension is adjusted between the opposing edges of the screen mask 11, the easier it is to control or prevent the vibration of the screen mask 11.

Further, the tension adjusting mechanism 81 of the second embodiment
As described above, when the distance between the peripheral edges of the screen mask 11 is adjusted without using a frame, and the tension of the screen mask 11 is adjusted to control or prevent the vibration of the screen mask 11, the screen mask 11 has no frame. There are advantages that various types of peripheral pulling means can be easily installed and the adjustment width can be freely set.

As shown in FIG. 6B, for example, one of the guide bar 60 and the chuck 61a in the second embodiment is provided with a separation / contact means 26 of a tension adjusting mechanism in which a pneumatically controlled cylinder 82 is connected. When the guide bar 60 and the chuck 61a are lifted by the cylinder 82 to separate the screen mask 11 from the circuit board 14, the screen mask 11 is moved from the other end 11c to the one end 11b in order. And the operation and effect of the first embodiment can be combined with the operation and effect of the second embodiment. The upward moving speed of one of the guide bar 60 and the chuck 61a by the cylinder 82 is preferably, for example, about 1.0 mm / s. This is the same in the case of the first embodiment.

FIG. 7 shows still another embodiment of the second embodiment, in which left and right support walls 171 and 172 are connected by a screw shaft 63, and the screw shaft 63 is connected via a motor 64 and a belt 65. To move one or both of the support walls 171 and 172 in the X direction along the guide rail 83 to change the mutual interval and adjust the length of the screen mask 11 to be extended by the guide bars 60 and 60. A length adjusting mechanism 168 is provided.

Accordingly, the screen mask 11 can be set to the minimum necessary length corresponding to the size of the circuit board 14 so that vibration can be easily suppressed.

As shown by broken lines in FIG. 7, when the screen mask 11 is separated from the circuit board 14, the supporter 88 provided or positioned around the circuit board 14
When the screen mask 11 is applied to the surface facing the circuit board 14, the screen mask 11 is
The supporter 88 can limit and control the vibration when it is separated from the support 4 and also prevent it.

Even when each of the above-mentioned various means for controlling / preventing the vibration of the screen mask 11 is employed independently, the problems of the prior art can be alleviated and the effect of preventing them can be exhibited. As shown in the first and second embodiments and the examples thereof, various combinations and the number of combinations can be used as needed, if necessary. Other configurations may be the same as those of the two embodiments shown in FIG. 7, and overlapping description will be omitted.

(Effects of the Invention) According to the present invention, when the printing paste filled in the opening of the plate is transferred to the printing material on which the printing plate is applied, the printing plate is separated from the printing material. For example, by controlling or preventing the vibration of the plate to a predetermined state under conditions based on empirical values verified in advance, for example, the printing paste is prevented from vibrating under the constant vibration of the plate or the vibration is prevented. In a state where the printing is performed, the printing plate can be stably torn off at a predetermined position between the plate and the printing medium with good releasability, so that printing can be performed at a predetermined position on the printing medium with sufficient accuracy. This eliminates the problem that the position and state of tearing of the printing paste become unstable and the characteristics of the printing medium are impaired as in the related art.

The above conditions can be adjusted each time based on the detection result of the printing state at that time, and the vibration of the printing plate can be controlled or prevented more appropriately in accordance with the printing situation at that time.

The vibration of the plate can be controlled or prevented by adjusting the tension applied to the plate. This tension is preferably adjusted in a plurality of directions of the plate, and the direction of adjusting the tension is large. The easier it is to control or prevent plate vibration. In addition, by adjusting the tension in a stretched state without using a frame, when adjusting the distance between the peripheral edges of the plate, it becomes easier to install a peripheral pulling means for adjusting the tension, and the adjustment width is also increased. You can take it freely.

By separating the plate and the printing medium from one end in order, the separation proceeds sequentially while supporting the plate on the printing medium side at the separation boundary between the printing medium and the printing medium. Vibration at the time of leaving the body can be suppressed well, vibration of the separation boundary of the plate can be sufficiently prevented, and high-precision printing is steadily achieved.

When the plate is separated from the printing medium, control is performed by restricting vibration when the plate is separated from the printing medium by a supporter applied to the surface of the printing plate facing the printing medium. And can also be prevented.

[Brief description of the drawings]

FIG. 1 shows a main part of a printing apparatus according to a first embodiment of the present invention, in which (A) is a side view showing a mechanism for separating and connecting a screen mask and a circuit board, and (B) is a cream solder using a squeegee; It is a perspective view which shows the filling operation state of.

FIG. 2 shows an example of a printing state using the separation / contact mechanism of FIG. 1,
(A) shows the state of cream solder at the start of cream solder filling, (B) shows the state of completion of filling, (C) shows the state of separating the screen mask from the circuit board, and (D) shows the state of cream solder at the completion of printing. FIG.

FIG. 3 is a perspective view showing the overall schematic configuration of a printing apparatus equipped with the separation / contact mechanism of FIG. 1;

FIG. 4 is a block connection diagram showing an entire configuration including a control system of the apparatus of FIG. 3;

FIG. 5 is a flowchart showing a sequence of a printing operation of the printing apparatus shown in FIGS. 3 and 4;

FIGS. 6A and 6B show several examples of a tensioning structure having a tension adjusting mechanism for a screen mask, which is a main part according to a second embodiment of the present invention, wherein FIG. 6A is a perspective view and FIG. Is a schematic side view.

FIG. 7 is a perspective view showing some other examples of the second embodiment of the present invention.

8 is measurement data comparing the vibration state when the screen mask is separated from the circuit board of the conventional example shown in FIGS. 9 and 10 and one example of the second embodiment shown in FIG. 6 of the present invention. FIG.

9A and 9B show a conventional printing process, in which (A) is the start of filling the cream solder, (B) is the end of filling, (C) is the point of separating the screen and the circuit board, and (D) is It is sectional drawing which shows the state of a cream solder at the time of printing completion.

FIG. 10 is a side view showing a main part of a conventional printing apparatus.

[Description of sign]

 DESCRIPTION OF SYMBOLS 11 Screen mask 11a Opening 12 Cream solder 13 Squeegee 14 Circuit board 15 Land 20 Stage part 22 Substrate support device 22a Substrate support stand 26 Separation mechanism 34 Control part 35 Process control part 36 Processing operation part 37 Good print database 38 Print inspection part 39 processing operation unit 40 printing state detecting means 41 inspection reference storage unit 60 guide bar 61a, 61b chuck 62 cylinder 81 tension adjustment mechanism 82 cylinder 88 supporter

Claims (16)

[Claims] 1. A printing plate having an opening having a predetermined pattern is applied to a printing medium, and the opening is filled with a printing paste. The printing paste in the opening is separated by separating the printing plate from the printing medium. In a printing method in which printing is performed by transferring on a printing body, separating the plate and the printing medium to transfer the printing paste held in the opening of the printing plate to the printing medium, by controlling the vibration of the printing plate or A printing method characterized by performing printing while preventing it. 2. The printing method according to claim 1, wherein the control or prevention of plate vibration is performed by adjusting the tension applied to the plate. 3. The printing method according to claim 2, wherein the adjustment of the tension is performed in a plurality of directions of the plate. 4. The printing method according to claim 2, wherein the control or prevention of vibration is performed by applying tension without using a frame. 5. The printing method according to claim 1, wherein the control or prevention of the vibration of the printing plate is performed by sequentially separating the printing plate and the printing medium from one end. 6. The method according to claim 6, wherein the vibration is controlled or prevented by applying a supporter around the printing medium to a surface of the printing form opposite to the printing medium when separating the printing medium from the printing medium. 1 to
6. The printing method according to any one of 5. 7. The condition for controlling or preventing the vibration of the plate is determined on the basis of a previously verified experience value.
The printing method according to claim 1. 8. The printing method according to claim 1, wherein the condition is adjusted each time based on a detection result of a printing state at that time. 9. A separating / contacting mechanism for applying a plate having an opening of a predetermined pattern and a printing medium to each other and separating the printing medium and the printing medium,
In a printing apparatus that performs printing by filling a printing paste into an opening of a plate applied to a printing medium and then releasing the printing paste, vibration that controls or prevents vibration of the printing plate when the printing sheet is separated from the printing medium A printing device comprising a control / prevention means. 10. The printing apparatus according to claim 9, wherein the vibration control / prevention means is a tension adjusting mechanism for adjusting the tension of the plate. 11. The printing apparatus according to claim 10, wherein the tension adjusting mechanism adjusts the tension of the plate in a plurality of directions. 12. The printing apparatus according to claim 10, wherein the tension adjusting mechanism adjusts a distance between peripheral edges of the plate. 13. The printing apparatus according to claim 9, wherein the vibration control / prevention means is configured to separate the plate and the printing medium sequentially from one end by a separation / contact mechanism. . 14. The printing method according to claim 9, wherein a supporter provided around the printing medium is brought into contact with a surface of the printing plate facing the printing medium when separating the printing medium from the printing medium. The printing device according to claim 1. 15. The printing apparatus according to claim 9, wherein the condition setting of the vibration control / prevention means is performed based on an empirical value verified in advance. 16. The printing apparatus according to claim 15, wherein a condition setting is adjusted based on a detection result by the detection means for detecting the printing state, and the detection result by the detection means.