WO2022116158A1 - 显示面板及其制造方法，显示装置 - Google Patents

显示面板及其制造方法，显示装置 Download PDF

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Publication number
WO2022116158A1
WO2022116158A1 PCT/CN2020/133923 CN2020133923W WO2022116158A1 WO 2022116158 A1 WO2022116158 A1 WO 2022116158A1 CN 2020133923 W CN2020133923 W CN 2020133923W WO 2022116158 A1 WO2022116158 A1 WO 2022116158A1
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WIPO (PCT)
Prior art keywords
layer
substrate
adhesive film
color filter
thin film
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PCT/CN2020/133923
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English (en)
French (fr)
Inventor
浦超
杨盛际
卢鹏程
黄冠达
陈小川
魏俊波
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2020/133923 priority Critical patent/WO2022116158A1/zh
Priority to CN202080003201.0A priority patent/CN115039249A/zh
Priority to US17/437,460 priority patent/US12041812B2/en
Publication of WO2022116158A1 publication Critical patent/WO2022116158A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80515—Anodes characterised by their shape

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof, and a display device.
  • the silicon-based OLED microdisplay is based on monocrystalline silicon and uses a mature CMOS process to make its pixel size smaller and higher integration, which can be made into a near-eye display product comparable to a large-screen display. received widespread attention.
  • silicon-based OLED microdisplays will set off a new wave of near-eye displays, bringing users an unprecedented visual experience.
  • Some embodiments of the present disclosure provide a display panel, the display panel includes: a substrate; a light-emitting device layer disposed on the substrate; a first thin film encapsulation layer disposed on a side of the light-emitting device layer away from the substrate,
  • the first thin film encapsulation layer includes at least one organic layer; a color filter layer is disposed on the side of the first thin film encapsulation layer away from the substrate; and a second thin film encapsulation layer is disposed on the side of the color filter layer away from the substrate.
  • the second thin-film encapsulation layer includes at least one organic layer
  • the display panel further includes: an adhesive film layer disposed on at least one side of the color filter layer, the adhesive film layer and the The color filter layers are in direct contact and stacked, and the viscosity of the adhesive film layer material is greater than the viscosity of the organic layer material in each of the first thin film encapsulation layer and the second thin film encapsulation layer.
  • the adhesive film layer is in direct contact with the organic layer of at least one of the first thin film encapsulation layer and the second thin film encapsulation layer.
  • the adhesive film layer includes:
  • the second adhesive film layer is disposed between the color filter layer and the second thin film encapsulation layer.
  • the orthographic projection of the color filter layer on the substrate falls within the orthographic projection of at least one of the first adhesive film and the second adhesive film on the substrate.
  • the orthographic projection of the color filter layer on the substrate falls within the orthographic projection of the first thin film encapsulation layer on the substrate;
  • the orthographic projection of the first thin film encapsulation layer on the substrate falls within the orthographic projection of the first adhesive film layer on the substrate;
  • the orthographic projection of the first adhesive film layer on the substrate falls within the orthographic projection of the second adhesive film layer on the substrate;
  • the orthographic projection of the second adhesive film layer on the substrate falls within the orthographic projection of the second thin film encapsulation layer on the substrate.
  • positive positions of the color filter layer, the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer and the second thin film encapsulation layer on the substrate are The projected area increases sequentially.
  • the display panel includes a display area and a peripheral area surrounding the display area, the orthographic projection of the color filter layer on the substrate falls within the display area, and the first thin film encapsulates The edges of the layer, the first adhesive film layer, the second adhesive film layer, and the second thin film encapsulation layer are all located in the peripheral region.
  • the edge of the first thin film encapsulation layer, the edge of the first adhesive film layer, the edge of the second adhesive film layer and the The edges of the two thin-film encapsulation layers are arranged away from the display area in sequence, and are arranged at intervals in sequence.
  • the distance between the edge of the first thin film encapsulation layer and the edge of the first adhesive film layer is greater than four times the size of the pixel unit of the panel;
  • the distance between the edge of the first adhesive film layer and the edge of the second adhesive film layer is greater than four times the size of the pixel unit of the panel;
  • the distance between the edge of the second adhesive film layer and the edge of the second thin film encapsulation layer is greater than four times the size of the pixel unit of the panel.
  • the adhesive film layer includes an organic material including 1-methoxy-2-propanol, propylene glycol monomethyl ether ester, a multifunctional group of acrylic monomers, oxime derivatives, and acrylic acid At least one of resin derivatives.
  • the thickness of the first adhesive film layer is smaller than the thickness of the second adhesive film layer.
  • the thickness of the second adhesive film layer is approximately 3 times the thickness of the first adhesive film layer.
  • the first thin film encapsulation layer includes a first sub-layer, a second sub-layer and a third sub-layer that are disposed away from the substrate and are stacked in sequence, the first sub-layer, the second sub-layer and the The materials of the third sub-layer respectively include silicon nitride, aluminum oxide and parylene, and the first adhesive film layer is in direct contact with the third sub-layer.
  • the thickness of the first adhesive film layer is greater than half of the thickness of the third sub-layer.
  • the second thin film encapsulation layer includes a fourth sub-layer and a fifth sub-layer that are disposed away from the substrate and are stacked in sequence, and the materials of the fourth sub-layer and the fifth sub-layer respectively include condensed pairs Xylene and silicon oxide, the second adhesive film layer is in direct contact with the fourth sublayer.
  • the light-emitting device layer includes a plurality of light-emitting devices arranged in an array, and each light-emitting device includes a first electrode, a light-emitting functional portion, and a second electrode that are sequentially away from the substrate,
  • the first electrodes of the two adjacent light-emitting devices are spaced apart from each other, the light-emitting functional parts of the two adjacent light-emitting devices have an integrated structure, and the two adjacent light-emitting devices have an integrated structure.
  • the second electrode is an integrated structure
  • the color filter layer includes a plurality of color filters, which are in one-to-one correspondence with the plurality of light-emitting devices, and for each light-emitting device, the orthographic projection of the first electrode of the light-emitting device on the substrate falls into the light-emitting device The corresponding color filter is in the orthographic projection on the substrate.
  • the plurality of light emitting devices include a first light emitting device and a second light emitting device that are adjacent to each other in sequence, and between the first electrode of the first light emitting device and the first electrode of the second light emitting device has a gap,
  • the color filter layer includes a first color filter and a second color filter with different colors, the first color filter and the second color filter respectively correspond to the first light-emitting device and the second light-emitting device, the first color filter
  • the color filter and the second color filter have overlapping portions
  • the orthographic projection of the gap on the substrate falls within the orthographic projection of the overlap on the substrate.
  • an integrated structure composed of the light-emitting functional layer of the first light-emitting device and the light-emitting functional portion of the second light-emitting device fills the gap.
  • the substrate is a silicon substrate
  • the display panel is a silicon-based display panel
  • Some embodiments of the present disclosure provide a display device including the display panel according to the aforementioned embodiments.
  • Some embodiments of the present disclosure provide a method for manufacturing a display panel, the manufacturing method includes: forming a light emitting device layer on a substrate; forming a first thin film encapsulation layer on a side of the light emitting device layer away from the substrate, the first thin film encapsulation layer A thin film encapsulation layer includes at least one organic layer; a color filter layer is formed on the side of the first thin film encapsulation layer away from the substrate; and a second thin film encapsulation layer is formed on the side of the color filter layer away from the substrate, The second thin film encapsulation layer includes at least one organic layer, wherein the manufacturing method further includes: forming an adhesive film layer in contact with the color filter layer and stacked on at least one side of the color filter layer, the The viscosity of the adhesive film layer material is greater than the viscosity of the organic layer material in each of the first thin film encapsulation layer and the second thin film encapsulation layer.
  • FIG. 1 is a schematic cross-sectional view of a display panel according to some embodiments of the present disclosure
  • FIG. 2 is a schematic plan view of a display panel according to some embodiments of the present disclosure, wherein only the substrate, the first thin film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin film encapsulation layer are shown ;
  • Fig. 3 is the enlarged schematic diagram of M area in Fig. 1;
  • Fig. 4 is the enlarged schematic diagram of N area in Fig. 1;
  • Fig. 4A is the electron microscope image corresponding to Fig. 4.
  • FIG. 5 is an enlarged schematic view of the first electrode in FIG. 4;
  • FIG. 6 is a partial top view schematic diagram of a pixel definition layer according to an embodiment of the present disclosure.
  • FIG. 7 is a partial top plan view of a pixel definition layer and a first electrode layer according to an embodiment of the present disclosure
  • FIG. 8 is a schematic diagram of a display device provided according to some embodiments of the present disclosure.
  • FIG. 9 is a flow chart providing a method of manufacturing a display device according to some embodiments of the present disclosure.
  • the expressions “located on the same layer” and “disposed on the same layer” generally mean that the first part and the second part may use the same material and may be formed by the same patterning process.
  • the expressions “located on different layers”, “disposed of different layers” generally mean that the first part and the second part are formed by different patterning processes.
  • a second thin film encapsulation layer covering the color filter layer is formed on the side of the film layer away from the silicon substrate.
  • the first thin film encapsulation layer and the second thin film encapsulation layer usually adopt a laminated structure of inorganic layer+organic layer+inorganic layer.
  • both the first thin film encapsulation layer and the second thin film encapsulation layer in the related art are in direct contact with the color filter layer, and only play the role of sealing, which is difficult in the manufacturing process engineering.
  • the introduction of impurity particles located on the upper and lower surfaces of the color filter layer will precipitate water and oxygen, causing the color filter layer to be corroded by the internal water and oxygen, resulting in poor display.
  • each of the first thin film encapsulation layer and the second thin film encapsulation layer in contact with the color filter layer is an inorganic layer, and the stress at the interface between the inorganic layer and the color filter layer is relatively large, so that the thin film encapsulation layer is easily damaged.
  • the impurity particles on the surface of the color filter layer are pierced, causing the color filter layer to be corroded by external water and oxygen.
  • the present disclosure provides a display panel, the display panel includes: a substrate; a light-emitting device layer disposed on the substrate; a first thin-film encapsulation layer, is arranged on the side of the light-emitting device layer away from the substrate, the first thin-film encapsulation layer includes at least one organic layer; a color filter layer is arranged on the side of the first thin-film encapsulation layer away from the substrate; Two thin film encapsulation layers are disposed on the side of the color filter layer away from the substrate, the second thin film encapsulation layer includes at least one organic layer, and the display panel further includes: an adhesive film layer disposed on the color filter layer.
  • the adhesive film layer is in direct contact with the color filter layer and is stacked and arranged, and the viscosity of the adhesive film layer material is greater than that in each of the first thin film encapsulation layer and the second thin film encapsulation layer. viscosity of the organic layer material.
  • the adhesive film layer includes: a first adhesive film layer disposed between the first thin film encapsulation layer and the color filter layer; and a second adhesive film layer disposed on the color filter layer and the second thin film encapsulation layer.
  • an adhesive film layer is arranged between the color filter layer and the thin film encapsulation layer (the first thin film encapsulation layer and/or the second thin film encapsulation layer), which increases the adhesion between the color filter layer and the thin film encapsulation layer.
  • the adhesive film layer is placed next to the color adhesive, so that the impurity particles on the upper and lower surfaces of the color adhesive introduced during the manufacturing process enter the adhesive film layer and are covered by the adhesive film layer. It is completely wrapped.
  • the adhesive film is arranged between the color filter and the thin film encapsulation layer and has a predetermined thickness to prevent the thin film encapsulation layer from being punctured by impurity particles. , and then protect the color filter layer from external water and oxygen erosion.
  • the display panel 10 includes a substrate 1 , a driving circuit layer 2 and a light emitting device layer 3 disposed on the substrate 1 .
  • the substrate 1 is, for example, a silicon substrate, which is made of single crystal silicon.
  • the light emitting device layer 3 is disposed on the side of the driving circuit layer 2 away from the substrate 1 .
  • the light emitting device layer 3 includes a first electrode layer 31 , a light emitting functional layer 32 and a second electrode layer 33 which are disposed away from the substrate 1 in sequence.
  • the first electrode layer 31 is, for example, an anode layer; the second electrode layer 33 is, for example, a cathode layer; injection layer.
  • the light-emitting device layer 3 includes a plurality of light-emitting devices arranged in an array, such as OLEDs, and display is realized by controlling the light emission of the plurality of light-emitting devices.
  • the display panel 10 further includes a first thin film encapsulation layer 41 , the first thin film encapsulation layer 41 covers the light emitting device layer 3 and the driving circuit layer 2 , specifically, the first thin film encapsulation layer 41 covers the light emitting device layer 3
  • the side away from the substrate 1 covers the light emitting device layer 3 and the sidewall of the driving circuit layer 2 .
  • the orthographic projection of the light-emitting device layer 3 and the driving circuit layer 2 on the substrate 1 falls within the orthographic projection of the first thin-film encapsulation layer 41 on the substrate 1.
  • the first thin-film encapsulation layer 41 serves to seal the light-emitting device layer 3 and the driving circuit layer. 2 to prevent water and oxygen from eroding the light-emitting device layer 3 and the driving circuit layer 2 .
  • the display panel 10 further includes a first adhesive film layer 51 , the first adhesive film layer 51 covers the first thin film encapsulation layer 41 , specifically, the first adhesive film layer 51 covers the first thin film encapsulation layer 41 away from the one side of the substrate 1 and cover the sidewall of the first thin film encapsulation layer 41 .
  • the orthographic projection of the first thin film encapsulation layer 41 on the substrate 1 falls within the orthographic projection of the first adhesive film layer 51 on the substrate 1 .
  • the first adhesive film layer 51 is, for example, an organic adhesive, specifically 1-methoxy-2-propanol, propylene glycol monomethyl ether ester, a multifunctional group of acrylic monomers, oxime derivatives and acrylic acid One or more of resin derivatives.
  • the first adhesive film layer 51 is in direct contact with the subsequently formed color filter layer 6, and the impurity particles on the lower surface of the color filter layer 6, that is, the surface facing the substrate 1, can be immersed in the first adhesive film layer 51, and are removed by the first adhesive film layer 51.
  • An adhesive film layer 51 is completely covered to prevent the impurity particles from precipitating water and oxygen and corroding the color filter layer 6 .
  • the thickness of the first adhesive film layer 51 is, for example, 1000-3000 angstroms, so that the above-mentioned impurity particles can be completely encapsulated in the first adhesive film layer 51 to avoid puncturing the first thin film encapsulation layer 41 , to ensure the packaging effect.
  • the display panel 10 further includes a color filter layer 6 .
  • the color filter layer 6 is disposed on the side of the first adhesive film layer 51 away from the substrate 1 .
  • the color filter layer 6 includes, for example, a plurality of color filters, which are respectively Corresponding to the plurality of light-emitting devices in the light-emitting device layer 3, the plurality of light-emitting devices in the light-emitting device layer 3 are, for example, white light OLEDs.
  • white light OLEDs When the white light emitted by the white light OLEDs passes through the corresponding color filters, only certain extended light is allowed to pass through, thereby realizing the display panel. full-color display.
  • the orthographic projection of the color filter layer 6 on the substrate 1 is substantially coincident with the orthographic projection of the light-emitting device layer 3 on the substrate 1 .
  • the thickness of the color filter layer 6 is 9000-11000 angstroms.
  • the display panel 10 further includes a second adhesive film layer 52 .
  • the second adhesive film layer 5 covers the color filter layer 6 and the first adhesive film layer 51 .
  • the second adhesive film layer 52 covers the color film layer 51 .
  • the side of the film layer 6 away from the substrate 1 and the side wall of the color filter layer 6, and the second adhesive film layer 52 covers the part of the first adhesive film layer 51 that is not covered by the color filter layer.
  • the orthographic projections of the color filter layer 6 and the first adhesive layer 51 on the substrate 1 both fall within the orthographic projection of the second adhesive layer 52 on the substrate 1 .
  • the second adhesive film layer 52 is, for example, an organic adhesive, specifically 1-methoxy-2-propanol, propylene glycol monomethyl ether ester, a multifunctional group of acrylic monomers, oxime derivatives, and acrylic acid One or more of resin derivatives.
  • the design is such that the second adhesive film layer 53 is in direct contact with the color filter layer 6, and the impurity particles on the upper surface of the color filter layer 6, that is, the surface away from the substrate 1, can be immersed in the second adhesive film layer 52, and the second adhesive film is blocked by the second adhesive film.
  • the layer 52 is completely covered to prevent the impurity particles from precipitating water and oxygen and corroding the color filter layer 6 .
  • the thickness of the second adhesive film layer 52 is, for example, 3000-5000 angstroms, so that the above-mentioned impurity particles can be completely encapsulated in the second adhesive film layer 52 to avoid puncturing the second film formed subsequently
  • the encapsulation layer 42 ensures the encapsulation effect.
  • the display panel 10 further includes a second thin film encapsulation layer 42 , and the second thin film encapsulation layer 42 covers the second adhesive film layer 52 .
  • the second thin film encapsulation layer 42 covers the second adhesive film layer 52 away from the one side of the substrate 1 and cover the side wall of the second adhesive film layer 52 .
  • the orthographic projection of the second adhesive film layer 52 on the substrate 1 falls within the orthographic projection of the second thin film encapsulation layer 42 on the substrate 1 .
  • the display panel 10 further includes a cover plate 8 .
  • the cover plate 8 is made of a transparent material, and the cover plate 8 is, for example, a glass cover plate.
  • the cover plate 8 is attached to the substrate 1 after the second thin film encapsulation layer 8 is formed through the sealant 7 .
  • the sealant 7 and the cover plate 12 provide additional multiple guarantees for preventing the intrusion of water and oxygen from the outside.
  • an adhesive film layer (the first adhesive film layer and/or the second adhesive film layer) is provided between the color filter layer and the thin film encapsulation layer (the first thin film encapsulation layer and/or the second thin film encapsulation layer) ) to increase the adhesion between the color film layer and the film encapsulation layer, so that the film encapsulation layer has a stronger wrapping performance; and the adhesive film layer is placed next to the color glue, so that the color glue introduced in the manufacturing process is placed on the upper and lower sides.
  • the impurity particles on the side surface enter the adhesive film layer and are completely wrapped by the adhesive film layer.
  • these impurity particles cannot separate out water and oxygen to prevent the color filter from being eroded by the internal water and oxygen; There is a predetermined thickness in between, so as to prevent the thin film encapsulation layer from being punctured by impurity particles, thereby protecting the color filter layer from external water and oxygen erosion, and ensuring the service life of the display panel.
  • FIG. 2 is a schematic plan view of a display panel according to some embodiments of the present disclosure, showing only the substrate, the first thin film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin film encapsulation layer to reflect the relative positional relationship between the edges of the first thin film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer and the edges of the second thin film encapsulation layer.
  • the positional relationship between the layer and the second thin film encapsulation layer in the direction perpendicular to the substrate specifically referring to Figure 1, the first thin film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer and the second thin film encapsulation layer are sequentially Set away from the substrate.
  • the display panel 10 has a display area DA and a peripheral area PA surrounding the display area, and the light emitting device layer 3 and the color filter layer 6 are orthographically projected on the substrate 1 and fall into the display area DA.
  • the orthographic projections of the first thin film encapsulation layer 41 , the first adhesive film layer 51 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 on the substrate 1 all extend from the display area DA to the peripheral area PA. That is, the orthographic projections of the edges of the first thin film encapsulation layer 41 , the first adhesive film layer 51 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 on the substrate 1 are all located in the peripheral area PA.
  • the orthographic projections of the first thin film encapsulation layer 41 , the first adhesive film layer 51 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 on the substrate 1 all cover the display area DA and cover the peripheral area PA. part.
  • the orthographic projections of the first thin film encapsulation layer 41 , the first adhesive film layer 51 , the color filter layer 6 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 on the substrate 1 are all rectangles.
  • the first thin film encapsulation layer 41 , the first adhesive film layer 51 , the color filter layer 6 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 are on the substrate 1 .
  • the orthographic projections of are rectangles, and can also be other shapes, such as hexagons, circles, and so on.
  • the orthographic projection of the color filter layer 6 on the substrate 1 falls within the orthographic projection of the first thin film encapsulation layer 41 on the substrate 1 ; the first thin film encapsulation layer
  • the orthographic projection of 41 on the substrate 1 falls into the orthographic projection of the first adhesive film layer 51 on the substrate 1; the orthographic projection of the first adhesive film layer 51 on the substrate 1 falls into the orthographic projection of the second adhesive film layer 52 on the substrate 1 and the orthographic projection of the second adhesive film layer 52 on the substrate 1 falls within the orthographic projection of the second thin film encapsulation layer 42 on the substrate 1 .
  • the area of the orthographic projection of the color filter layer 6 , the first thin film encapsulation layer 41 , the first adhesive film layer 51 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 on the substrate 1 increases sequentially.
  • the edge of the first thin film encapsulation layer 41 , the edge of the first adhesive film layer 51 , and the edge of the second adhesive film layer 52 are disposed away from the display area in sequence, and are disposed at intervals in sequence.
  • the orthographic projections of the first thin film encapsulation layer 41 , the first adhesive film layer 51 , the color filter layer 6 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 on the substrate 1 are all rectangular, and the first thin film
  • the encapsulation layer 41 , the first adhesive film layer 51 , the color filter layer 6 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 all include four edges, namely the upper edge, the lower edge, the left edge and the lower edge as shown in FIG. 2 .
  • the right edge collectively called the edge.
  • the upper edges of the first thin film encapsulation layer 41, the first adhesive film layer 51, the color filter layer 6, the second adhesive film layer 52 and the second thin film encapsulation layer 42 are referred to as the upper edge group, and the first thin film
  • the lower edges of the encapsulation layer 41 , the first adhesive film layer 51 , the color filter layer 6 , the second adhesive film layer 52 and the second thin film encapsulation layer 42 are called the lower edge group
  • the edges of the layer 51, the color filter layer 6, the second film layer 52, and the second film encapsulation layer 42 are called the left edge group.
  • the right edge of the second adhesive film layer 52 and the second thin film encapsulation layer 42 is called a right edge group.
  • edge group among the upper edge group, the lower edge group, the left edge group and the right edge group, the edge of the first thin film encapsulation layer 41, the edge of the first adhesive film layer 51, the second adhesive film
  • the edge of the film layer 52 and the edge of the second thin film encapsulation layer 42 are disposed away from the display area in sequence, and are disposed at intervals in sequence.
  • the right edge of the first thin film encapsulation layer 41 in the first direction X, the right edge of the first thin film encapsulation layer 41 , the right edge of the first adhesive film layer 51 , and the second adhesive film
  • the right edge of the layer 52 and the right edge of the second thin film encapsulation layer 42 are disposed away from the display area DA in turn and spaced apart from each other.
  • the distance between the right edge of the first thin film encapsulation layer 41 and the right edge of the first adhesive film layer 51 is d1, which is called the first distance d1.
  • the first distance d1 is substantially greater than the sum of the alignment accuracy of the first thin film encapsulation layer 41 and the alignment accuracy of the first adhesive film layer 51 .
  • the first thin film encapsulation layer 41 is formed by an open mask process, and the alignment accuracy of the first thin film encapsulation layer 41 refers to the alignment between the mask plate and the substrate 10 used for forming the first thin film encapsulation layer 41 bit precision.
  • the first adhesive film layer 51 is also formed by an open mask process.
  • the alignment accuracy of the first adhesive film layer 51 refers to the alignment accuracy between the mask plate and the substrate 10 used for forming the first adhesive film layer 51 . In this way, the first film encapsulation layer 41 can be completely covered by the first adhesive film layer 51 . In an actual production process, even if there is a positional deviation between the first adhesive film layer 51 and the first thin film encapsulation layer 41 , the first adhesive film layer 51 will not expose the first thin film encapsulation layer 41 .
  • the distance between the right edge of the first adhesive film layer 51 and the right edge of the second adhesive film layer 52 is d2, which is called the second distance d2.
  • the second distance d2 is substantially greater than the sum of the alignment accuracy of the first adhesive film layer 51 and the alignment accuracy of the second adhesive film layer 52 .
  • the second adhesive film layer 52 is also formed by an open mask process, and the alignment accuracy of the second adhesive film layer 52 refers to the distance between the mask used for forming the second adhesive film layer 52 and the substrate 10 . Alignment accuracy. Thus, it can be ensured that the second adhesive film layer 52 completely covers the first adhesive film layer 51 . In an actual production process, even if there is a positional deviation between the first adhesive film layer 51 and the second adhesive film layer 52 , the second adhesive film layer 52 will not expose the first adhesive film layer 51 .
  • the distance between the right edge of the second adhesive film layer 52 and the right edge of the second thin film encapsulation layer 42 is d3, which is referred to as the third distance d3.
  • the third distance d3 is substantially greater than the sum of the alignment accuracy of the second adhesive film layer 52 and the alignment accuracy of the second thin film encapsulation layer 42 .
  • the second thin film encapsulation layer 42 is also formed by an open mask process, and the alignment accuracy of the second thin film encapsulation layer 42 refers to the mask and substrate used for forming the second thin film encapsulation layer 42 10 alignment accuracy. In this way, it can be ensured that the second film encapsulation layer 42 completely covers the second adhesive film layer 52 . In an actual production process, even if there is a positional deviation between the second thin film encapsulation layer 42 and the second adhesive film layer 52 , the second thin film encapsulation layer 42 will not expose the second adhesive film layer 52 .
  • the alignment accuracy of any two of the first thin film encapsulation layer 41 , the second thin film encapsulation layer 42 , the first adhesive film layer 51 and the second adhesive film layer 52 may be the same or different.
  • the alignment accuracy of the first thin film encapsulation layer 41 , the second thin film encapsulation layer 42 , the first adhesive film layer 51 and the second adhesive film layer 52 is, for example, 10 ⁇ m.
  • the size of the pixel unit in the display panel is about 4.6-5.2 ⁇ m, which is understood to be that each of the aforementioned first distance d1 , second distance d2 , and third distance d3 is larger than the pixels of the panel Four times the cell size.
  • the left edge of 52 and the left edge of the second thin film encapsulation layer 42 are disposed away from the display area DA in turn, and are spaced apart from each other; in the second direction Y perpendicular to the first direction X, the first thin film encapsulation layer
  • the upper edge of 41, the upper edge of the first adhesive film layer 51, the upper edge of the second adhesive film layer 52, and the upper edge of the second thin film encapsulation layer 42 are disposed away from the display area DA in turn, and spaced from each other; in the second direction Y, the lower edge of the first thin film encapsulation layer 41 , the lower edge of the first adhesive film layer 51 , the lower edge of the second adhesive film layer 52 and the second
  • the lower edges of the thin film encapsulation layer 42 are disposed away from the display area DA in sequence
  • FIG. 3 is an enlarged schematic view of the M region in FIG. 1 .
  • the first thin film encapsulation layer 41 includes a first sub-layer 411 , a second sub-layer 412 and a third sub-layer 413 that are separated from the substrate 1 in sequence.
  • the first sub-layer 411 is, for example, silicon nitride (SiNx), and its thickness is, for example, 2500 ⁇ 3500 angstroms.
  • the second sub-layer 412 is, for example, aluminum oxide (Al 2 O 3 ), and its thickness is, for example, 400-600 angstroms.
  • the third organic layer 413 is in direct contact with the first adhesive film layer 51 , and the third sub-layer 413 is, for example, parylene, and its thickness is, for example, 4500 ⁇ 5500 angstroms.
  • the third sub-layer 413 as the organic layer is attached to the first adhesive film layer 51, so that the first thin film encapsulation layer 41 and the first adhesive film layer 51 can be attached more closely.
  • the total thickness of the first thin film encapsulation layer 41 is, for example, 7400 ⁇ 9600 angstroms.
  • the second thin film encapsulation layer 42 includes a fourth sub-layer 421 and a fifth sub-layer 422 that are sequentially away from the substrate 1 .
  • the fourth sub-layer 421 is, for example, parylene, and its thickness is, for example, 4500-5500 angstroms.
  • the fifth sub-layer 422 is, for example, silicon oxide (SiO 2 ), and its thickness is, for example, 950 ⁇ 1050 angstroms.
  • the fourth organic layer 421 is in direct contact with the second adhesive film layer 52 , and the fourth sub-layer 421 as an organic layer is attached to the second adhesive film layer 52 , so that the second thin film encapsulation layer 42 and the second adhesive film layer 52 can be attached closer together.
  • the total thickness of the second thin film encapsulation layer 42 is, for example, 5450-6550 angstroms.
  • the organic layer in the adhesive film layer such as the first adhesive film layer 51 or the second adhesive film layer 52
  • the thin film encapsulation layer such as the first thin film encapsulation layer 41 or the second thin film encapsulation layer 42
  • Table 1 The characteristics of the third sublayer 413 or the fourth sublayer 421 are compared in Table 1 below:
  • the viscosity of the adhesive film layer is greater than that of the thin film encapsulation layer, such as the first thin film encapsulation layer or the second thin film encapsulation layer,
  • the viscosity of the organic layer in is easy to adsorb impurity particles, and the adhesive film layer has a certain fluidity, so it is easy to wrap the adsorbed impurity particles in it.
  • the refractive index and density of the adhesive film layer are both greater than those of the organic layer (Parylene), and the light transmittance of the adhesive film layer is substantially the same as the light transmittance of the organic layer (Parylene).
  • the thickness of the second adhesive film layer 52 is greater than the thickness of the first adhesive film layer 51 .
  • a thicker film layer can cover more impurity particles.
  • the impurity particles generated during the process of forming the color filter layer 6 are obviously more than the impurity particles generated during the formation of the third sub-layer 413 .
  • the color filter layer 6 includes three colors of color filters, which require three film formation processes to form.
  • the impurity particles generated during the process of forming the color filter layer 6 are approximately the impurities generated during the formation of the third sub-layer 413 .
  • the thickness of the second glue film layer 52 can be set to be about 3 times the thickness of the first glue film layer 51, or more, so that the impurity particles do not substantially affect the color filter layer.
  • the size of the formed impurity particles is generally less than half of the thickness of the third sub-layer 413, so that the impurity particles formed in the process are covered by the first adhesive film
  • the thickness of the first adhesive film layer 51 may be about half of the thickness of the third sub-layer 413 or more.
  • the adhesive film layer may only be provided on one side of the color filter layer.
  • the display panel only includes the first adhesive film layer or the second adhesive film layer, which can also solve the problem that the color filter layer is corroded by internal and external water and oxygen to a certain extent.
  • FIG. 4 is an enlarged schematic view of the N region in FIG. 1
  • FIG. 4A is an electron microscope image corresponding to FIG. 4
  • the light emitting device layer includes a plurality of light emitting devices P
  • each light emitting device P includes a first electrode 31 ′, a light emitting functional part 32 ′ and a second electrode 31 ′ which are in turn away from the substrate 1 .
  • Electrode 33' The first electrode 31' is, for example, an anode, and the second electrode 33' is, for example, a cathode.
  • first electrodes 31' are spaced apart from each other, for example, there is a gap T between the first electrodes 31' of two adjacent light-emitting devices P, to avoid two adjacent light-emitting devices
  • the first electrode 31' of P is electrically connected.
  • the light-emitting functional parts 32' of two adjacent light-emitting devices P have an integrated structure
  • the second electrodes 33' of two adjacent light-emitting devices P have an integrated structure. That is to say, the light-emitting functional parts 32' of the plurality of light-emitting devices P are connected together to form the aforementioned light-emitting functional layer 32 .
  • the second electrodes 33' of the plurality of light-emitting devices P are connected together to form the aforementioned second electrode layer 33.
  • the color filter layer 6 includes a plurality of color filters 61, which correspond to the plurality of light-emitting devices P one-to-one. For each light-emitting device P, the first electrode 31' of the light-emitting device P is in the The orthographic projection on the substrate 1 falls within the orthographic projection of the color filter 61 corresponding to the light emitting device P on the substrate.
  • Each light-emitting device P cooperates with its corresponding color filter 61 to form a pixel unit.
  • the light-emitting devices P all emit white light.
  • the white light emitted by the light-emitting device P passes through its corresponding color filter 61, allowing only light of a specific color to pass through the corresponding color filter. , thereby realizing the full-color display of the display panel.
  • the color filter layer 6 includes a first color filter 611 , a second color filter 612 and a third color filter 613 that are adjacent in sequence, which correspond to the adjacent first color filters 611 , 612 and 613 respectively.
  • the first color filter 611, the second color filter 612 and the third color filter 613 have different colors.
  • the first color filter 611 is a red color filter that only allows red light to pass through
  • the second color filter 612 is a green color filter.
  • the third color filter 613 is a blue color film, and only blue light is allowed to pass through.
  • the first color filter 611, the second color filter 612, and the third color filter 613 and their corresponding first light-emitting device P1, second light-emitting device P2, and third light-emitting device P3 respectively constitute a first pixel unit, a second pixel unit and a
  • the third pixel unit, the first pixel unit, the second pixel unit and the third pixel unit can emit red light, green light and blue light respectively, also known as red pixel unit, green pixel unit and blue pixel unit, and then realize the display panel full-color display.
  • any two adjacent pixel units they have color filters of different colors, and their color filters have overlapping portions, and the gap between the first electrodes of their light-emitting devices is orthographically projected on the substrate to fall into the The overlap is in an orthographic projection on the substrate.
  • the overlapping parts of the color filters of different colors are set to be opaque to light, so as to avoid the light output interference of two adjacent pixel units, and the way of partially overlapping the color filter parts of different colors can omit the difference between adjacent color filters in the related art. black matrix.
  • the adjacent first pixel unit and the second pixel unit are taken as an example for description.
  • the first color filter 61 of the first pixel unit and the second color filter of the second pixel unit 62 has an overlapping portion OP.
  • the first color filter 61 covers an edge portion of the second color filter 62 close to the first color filter 61 . Since the first color filter 61 and the second color filter 62 are respectively a red color filter and a green color filter, the overlapping portion OP of the first color filter 61 and the second color filter 62 of the second pixel unit is opaque to light, which can be avoided. The light output of the adjacent first pixel unit and the second pixel unit interferes.
  • the third color filter 63 is first formed, and then the second color filter 62 is formed, so that the second color filter 62 and the third color filter 63 are partially overlapped to form The overlapping portion between the second color filter 62 and the third color filter 63, and then the first color filter 61 is formed so that the first color filter 61 and the second color filter 62 partially overlap to form the first color filter 61 and the second color filter 62.
  • the overlapping portion between the second color filters 62 and the first color filter 61 and the third color filter 63 are partially overlapped to form the overlap portion between the first color filter 61 and the third color filter 63 .
  • the gap T is filled in the gap T as an integrated structure composed of the light-emitting functional portion 32' of the light-emitting device P, that is, the light-emitting functional layer 32 .
  • the driving circuit layer 2 includes a flat layer 20 close to the first electrode layer 31 , and the first electrode layer 3 is disposed on the flat layer 20 away from the substrate 1 . side, and is disposed adjacent to the flat layer 2, the display panel 10 further includes a pixel definition layer 9, wherein:
  • a plurality of separating grooves 201 are provided on the surface of the flat layer 20 away from the substrate 1 , so as to divide a plurality of driving regions 202 on the flat layer 20 , and the driving regions 202 are distributed in an array.
  • the orthographic projection of each separation groove 201 on the substrate 1 falls within the orthographic projection of its corresponding gap T on the substrate 1 .
  • FIG. 5 is an enlarged schematic view of the first electrode 31 ′ in FIG. 4 .
  • the first electrode layer 31 is disposed on the surface of the flat layer 20 away from the substrate 1 and includes a plurality of first electrodes distributed in an array 31 ′, the orthographic projections of the first electrodes 31 ′ on the flat layer 20 are located within the driving regions 202 in a one-to-one correspondence.
  • the first electrode 31 ′ includes a flat middle portion 310 and an edge portion 311 surrounding the middle portion 310 ; the edge portion 311 includes a flat portion 3110 surrounding the middle portion 310 and a climbing portion 3111 connected between the middle portion 310 and the flat portion 3110 , the thickness of the flat portion 3110 is smaller than that of the middle portion 310 .
  • the pixel definition layer 9 is disposed on the surface of the flat layer 20 away from the substrate 1, and exposes at least a part of the middle portion 310. It can be understood that the pixel definition layer 9 covers the edge portion 311 of the first electrode 31'.
  • the light-emitting functional layer 32 covers the pixel definition layer 9 and the intermediate portion 310 of the first electrode 31' exposed by the pixel definition layer 9 and the flat layer 2 .
  • the light-emitting functional layer 32 is filled in the separation groove 201 .
  • the second electrode layer 33 covers the entire surface of the light-emitting functional layer 32 .
  • the orthographic projections of the first electrodes 31' on the flat layer 20 are located within each driving region 202 in a one-to-one correspondence, so that the orthographic projections of the first electrodes 31' on the flat layer do not overlap with the separation grooves 201, it can be understood that, The orthographic projection of the dividing grooves 201 on the substrate 1 falls within the orthographic projection of their corresponding interval T on the substrate.
  • the light-emitting function layer 32 can be recessed toward the substrate 1 at the position of the separation groove 201 , so that the second electrode layer 33 forms a recess 331 at the recess, and the recess 331 is on the positive side of the flat layer 20 .
  • the projection does not overlap with the orthographic projection of the middle portion 310 of the first electrode 31 ′ on the flat layer 2 , so that the position of the recessed portion 331 of the second electrode layer 33 can be restricted by the separation groove 201 to prevent the recessed portion 331 from interacting with A tip discharge or even a short circuit occurs between the middle portion 310 of the first electrode 31 ′, which is beneficial to ensure stable light emission of the light emitting device.
  • light emission within the range of the recessed portion 331 can be reduced or even avoided, thereby reducing the mutual interference of light emission of adjacent light emitting devices.
  • the material of the substrate 1 can be a semiconductor material such as single crystal silicon or polycrystalline silicon, or other hard or soft materials such as glass.
  • a plurality of driving transistors may be provided on the substrate 1 for driving each light-emitting device to emit light to display an image.
  • the driving circuit layer 2 of the display panel 10 further includes a gate insulating layer GI, a gate G, a first insulating layer 21 and a first wiring layer 22, wherein: the material of the substrate 1 can be It is a semiconductor material such as monocrystalline silicon or polycrystalline silicon, and the substrate 1 includes an active region 101 and a source electrode 1011 and a drain electrode 1012 located at both ends of the active region 101 .
  • the gate insulating layer GI covers the active region 101 ; the gate G is disposed on the surface of the gate insulating layer GI away from the substrate 1 , and the material of the gate G may include polysilicon material.
  • the first insulating layer 21 covers the gate G and the substrate 1, and its material may include at least one of silicon oxide and silicon nitride.
  • the first wiring layer 22 is disposed on the surface of the first insulating layer 21 away from the substrate 1 , and the gate G, the source electrode 1011 and the drain electrode 1012 are all connected to the first wiring layer 10 through vias filled with tungsten or other metals.
  • the display panel 10 may further include a second insulating layer 23 and a second wiring layer 24, the second insulating layer 23 covers the first wiring layer 22 and the first insulating layer 21, and the second wiring layer 24 is provided on the second wiring layer 24.
  • the insulating layer 23 faces away from the surface of the substrate 1 .
  • the specific pattern of the second wiring layer 24 is not particularly limited here, and it can be connected to the first wiring layer 22 through vias filled with tungsten or other metals.
  • the flat layer 20 is disposed on one side of the substrate 1 .
  • the flat layer 20 may cover the second wiring layer 24 , and the first electrode 31 ′ may be filled with tungsten or other metals The vias are connected to the second wiring layer 24 .
  • the material of the flat layer 20 may include at least one of silicon nitride and silicon oxide, and of course, may also include other insulating materials.
  • the planarization layer 20 may be planarized by a polishing process.
  • a plurality of separation grooves 201 may be formed on the surface of the flat layer 20 facing away from the substrate 1 .
  • a plurality of driving regions 202 can be divided on the flat layer 20 through the separating grooves 201 , and the driving regions 202 are distributed in an array.
  • the shape of the orthographic projection of the driving region 202 on the substrate 1 may be a rectangle, a pentagon, a hexagon or other polygons, and of course, a circle or other shapes, which are not limited herein. Also, the shapes and sizes of different drive regions 202 may be different.
  • Each separation slot 201 may include two opposing side walls 2011 and a bottom wall 2012 connected between the two side walls 2011 .
  • the two side walls 2011 can be arranged in parallel, that is, in the direction perpendicular to the substrate 1, the two side walls 2011 and their extending surfaces do not intersect.
  • the two side walls 2011 may also be arranged at a certain angle.
  • the bottom wall 2012 may be substantially parallel to the surface of the flat layer 20 facing away from the substrate 1, or, as shown in FIG.
  • the shape and shape are not particularly limited here, and in the section perpendicular to the base 1, the contour of the bottom wall 2012 can be roughly arc-shaped, parabolic or wavy, and of course, can also be other regular or irregular shapes , as long as it protrudes in the direction away from the substrate 1 .
  • the two side walls 2011 shrink toward the direction close to the bottom wall 2012 , that is, the distance between the two side walls 2011 gradually decreases toward the direction close to the bottom wall 2012 , so that the side walls 2011 have a relatively flat
  • the slope of the surface of the layer 20 facing away from the substrate 1 is the angle between the side wall 2011 and the surface of the flat layer 20 facing away from the substrate 1 .
  • the gradient is not less than 70° and not greater than 90°, for example, the gradient can be 70°, 80°, 90°, and so on.
  • the distance between the two sidewalls 2011 of the separation groove 201 may be 0.2 ⁇ m-0.7 ⁇ m, for example, 0.2 ⁇ m, 0.3 ⁇ m, 0.5 ⁇ m, or 0.7 ⁇ m.
  • the first electrode layer 31 is disposed on the surface of the flat layer 20 away from the substrate 1 , and includes a plurality of first electrodes 31 ′ distributed in an array, and the orthographic projections of each first electrode 31 ′ on the flat layer 20 are one by one.
  • the corresponding ones are located within each driving region 202 , that is, each first electrode 31 ′ is located within the boundary of the orthographic projection of each driving region 202 on the substrate 1 in a one-to-one correspondence.
  • Only one first electrode 31' is provided on each driving region 202. Since the driving region 202 is separated by the separation groove 201, and the first electrode 31' is located on the driving region 202, the separation groove 201 is located outside the first electrode 31'.
  • the shape of the orthographic projection of each first electrode 31' on the flat layer 20 may be the same as the shape of the driving region 202 where it is located, and the boundary of the first electrode 31' is located within the driving region 202 where it is located.
  • the at least one first electrode 31 ′ may include a middle portion 310 and an edge portion 311 surrounding the middle portion 310 , wherein the middle portion 310 is a flat structure, that is, the middle portion 310 and the flat layer 20 face away from the substrate 1 The surfaces are roughly parallel.
  • the boundary of the orthographic projection of the substrate 1 of the middle portion 310 of each first electrode 31 ′ may be located within the boundary of the orthographic projection of the substrate 1 of the driving region 202 where it is located, that is, the middle portion
  • the boundary of the orthographic projection of 310 on the substrate 1 has a predetermined distance from the boundary of the orthographic projection of the substrate 1 where the driving region 202 is located.
  • the predetermined pitch is not less than 0.15 ⁇ m, for example, the pitch may be 0.15 ⁇ m, 0.2 ⁇ m, 0.25 ⁇ m, or the like.
  • the edge portion 311 may include a flat portion 3110 and a climbing portion 3111 , wherein the flat portion 3110 is located on the surface of the flat layer 20 facing away from the substrate 1 and is disposed around the middle portion 310 , and the flat portion 3110 is approximately the same as the surface of the flat layer 20 facing away from the substrate 1 . parallel. Meanwhile, the thickness of the flat portion 3110 is smaller than that of the intermediate portion 310 .
  • the flat portion 3110 has a predetermined distance between the boundary of the orthographic projection of the substrate 1 and the boundary of the orthographic projection of the substrate 1 where the driving region 202 is located.
  • the boundary of the orthographic projection of the flat portion 3110 on the substrate 1 overlaps with the boundary of the orthographic projection of the substrate 1 where the driving region 202 is located.
  • the climbing part 3111 is connected between the middle part 310 and the flat part 3110 , that is, the climbing part 3111 surrounds the middle part 310 and the flat part 3110 is arranged around the climbing part 3111 .
  • the slope of the climbing portion 3111 with respect to the surface of the flat layer 20 facing away from the substrate 1 is not less than 30°, which is a sandwich between the surface of the climbing portion 3111 and the surface of the flat layer 20 facing away from the substrate 1 horn.
  • the first electrode 31 ′ includes a first conductive layer 320 , a second conductive layer 321 and a third conductive layer 322 .
  • the first conductive layer 320 is provided on the surface of the flat layer 2 away from the substrate 1
  • the second conductive layer 321 is provided on the first conductive layer.
  • the layer 320 faces away from the surface of the substrate 1, and the third conductive layer 322 is provided on the surface of the second conductive layer 321 away from the substrate 1, and extends to the flat layer 20 with a certain gradient, thereby covering the first conductive layer 320 and the second conductive layer 321 , protecting the first conductive layer 320 and the second conductive layer 321 .
  • the middle portion 310 of the first electrode 31 ′ includes the third conductive layer 322 located in the region of the second conductive layer 321 away from the surface of the substrate 1 and the first conductive layer 320 and the second conductive layer 321 , and the edge portion 311 includes the third conductive layer 322
  • the area covering the edges of the first conductive layer 320 and the second conductive layer 321 is the area extending toward the flat layer 20 .
  • the material of the first conductive layer 320 may include titanium (Ti)
  • the material of the second conductive layer 321 may include silver (Ag)
  • the material of the third conductive layer 322 may include indium tin oxide (ITO). Use other materials.
  • the pixel definition layer 9 is made of an insulating material, and is disposed on the surface of the flat layer 20 away from the substrate 1 together with the first electrode layer 31 .
  • the pixel definition layer 9 covers the edge of the first electrode 31', for example, the pixel definition layer 9 covers the edge portion 311 of the first electrode 31'.
  • the pixel definition layer 9 exposes at least a partial area of the middle portion 310 of the first electrode 31 .
  • each first electrode 31 ′ does not completely cover the driving region 202 where it is located, and the flat portion 3110 of the first electrode 31 ′ is on the boundary of the orthographic projection of the substrate 1 and the driving region where it is located 202 has a certain distance on the boundary of the orthographic projection of the substrate 1 .
  • the pixel definition layer 9 extends to the side wall 2011 and the bottom wall 2012 of the separation groove 201 , that is, the pixel definition layer 9 is conformally attached to the driving region 202 not covered by the first electrode 31 ′, so that the pixel definition layer 9 is in the corresponding separation groove.
  • the area of 201 is recessed.
  • the pixel definition layer 9 is provided with a plurality of openings 901 exposing at least a part of each intermediate portion 310 in a one-to-one correspondence, so that the light-emitting range of the light-emitting device can be limited by the pixel definition layer 9, and the size of the pixel unit can be determined by the corresponding openings. 901 size representation.
  • FIG. 6 is a partial top schematic view of a pixel definition layer according to an embodiment of the present disclosure.
  • FIG. 7 is a partial top schematic view of a pixel definition layer and a first electrode layer according to an embodiment of the present disclosure.
  • the opening 901 of the pixel definition layer 9 may be a hexagonal or other polygonal structure, and the first electrode 31 ′ may also be a polygonal structure, and the openings 901 and 901 are the same in shape, of course, the first electrode 31 ′ can also be in other shapes.
  • the size d4 of the opening 901 is about 4.6-5.2 ⁇ m, that is, the size of the pixel unit is about 4.6-5.2 ⁇ m.
  • the light-emitting functional layer 32 can be a continuous film layer, and at least partially covers the middle portion 310 of each first electrode 31 ′, that is, covers the area exposed by the opening 901 , and at the same time, the light-emitting functional layer 32 also covers the pixels.
  • the definition layer 9 when the light-emitting functional layer 32 is formed by evaporation or other processes, the light-emitting functional layer 32 is recessed in the direction close to the substrate 1 in the region corresponding to the separation groove 201 .
  • the light-emitting functional layer 32 includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer sequentially stacked in a direction away from the substrate 1 .
  • the second electrode layer 33 covers the light-emitting functional layer 32 , and a driving signal can be applied to the first electrode 31 ′ and the second electrode 33 so that the light-emitting functional layer 32 is located on the first electrode 31 ′ and the second electrode layer 33 The part in between glows.
  • the morphology of the second electrode layer 33 matches that of the light-emitting functional layer 32 . It is recessed in the recess of the light-emitting functional layer 32 to form a recessed portion 331 , and a flat portion 332 is formed in a region corresponding to the middle portion 310 of the first electrode 31 . , so that the orthographic projection of the concave portion 331 on the flat layer 20 does not overlap with the orthographic projection of the middle portion 310 of the first electrode 31 ′ on the flat layer 20 , so as to reduce or avoid the difference between the first electrode 31 ′ and the second electrode layer 33 A tip discharge occurs in the recessed portion 61 .
  • the material of the second electrode layer 33 may be an alloy material, for example, the material of the second electrode layer 33 may include Mg and Ag; or, the second electrode layer 33 may also be an alloy of Al and Li. Of course, the second electrode layer 33 may also use other alloys or elemental metals, which will not be listed here.
  • the flat portion 332 may be away from the substrate in the region corresponding to the pixel definition layer 9 covering the middle portion 310 .
  • the direction of 1 is convex, but the height of the convex is smaller than the thickness of the first intermediate portion 310 , so that the flat portion 332 is generally flat.
  • the orthographic projection of the lowest point of the concave portion 331 of the second electrode layer 32 on the cross section perpendicular to the substrate 1 on the flat layer 20 is completely located in the separation groove 201 within.
  • the maximum depth of the separation trench 201 is 1000 angstroms to 3000 angstroms.
  • the display panel 10 may further include a light extraction layer 11 , the light extraction layer 11 covers the surface of the second electrode layer 33 away from the substrate 1 , and the light extraction layer 11 corresponds to the recessed portion 331 .
  • the region is recessed, and the first thin film encapsulation layer 41 is disposed on the side of the light extraction layer 11 away from the substrate 1 .
  • the refractive index of the light extraction layer 11 is larger than that of the second electrode layer 33, which can improve the light extraction efficiency, and the higher the refractive index, the higher the light extraction efficiency.
  • FIG. 8 is a schematic diagram of a display device provided according to some embodiments of the present disclosure.
  • the display device 100 includes the display panel 10 in the foregoing embodiment, and the display panel is, for example, OLED display panel.
  • the display device can be any product or component with display function, such as smart glasses, projector, TV, monitor, digital photo frame, mobile phone, smart watch, tablet computer, etc.
  • FIG. 9 is a flowchart of a method for manufacturing a display device according to some embodiments of the present disclosure. As shown in FIG. 9, the manufacturing method of the display panel includes the following steps:
  • the manufacturing method also includes:
  • An adhesive film layer is formed on at least one side of the color filter layer, which is in contact with the color filter layer and is stacked.
  • the manufacturing method further includes:
  • the manufacturing method further includes:
  • step S20, step S25, step S35, and step S40 the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer and the second thin film encapsulation layer are all formed by an open mask process.
  • an adhesive film layer (the first adhesive film layer and/or the Second adhesive layer), which increases the adhesion between the color filter layer and the film encapsulation layer, so that the packaging performance of the film encapsulation layer is stronger;
  • the impurity particles on the upper and lower surfaces of the color glue enter the film layer and are completely wrapped by the film layer.
  • these impurity particles cannot precipitate water and oxygen to prevent the color film from being eroded by the internal water and oxygen; on the other hand, the film is set on the color film.
  • There is a predetermined thickness between the film packaging layer and the film packaging layer to prevent the film packaging layer from being punctured by impurity particles, thereby protecting the color filter layer from external water and oxygen erosion, and ensuring the service life of the display panel.

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  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板(10)及其制造方法，显示装置，显示面板(10)包括：基底(1)；发光器件层(3)，设置在基底(1)上；第一薄膜封装层(41)，设置在发光器件层(3)远离基底(1)一侧，第一薄膜封装层(41)至少包括一层有机层（413）；彩膜层（6），设置在第一薄膜封装层(41)远离基底(1)一侧；以及第二薄膜封装层(42)，设置在彩膜层(6)远离基底(1)一侧，第二薄膜封装层(42)至少包括一层有机层(421)，其中显示面板(10)还包括：胶膜层（51,52），设置在彩膜层(6)至少一侧，胶膜层（51,52）与彩膜层（6）直接接触且层叠设置，胶膜层（51,52）材料的粘度大于第一薄膜封装层（41）和第二薄膜封装层（42）每一个中的有机层（413,421）材料的粘度。

Description

显示面板及其制造方法，显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种显示面板及其制造方法，显示装置。
背景技术
与传统的AMOLED显示技术相比，硅基OLED微显示以单晶硅为基底并借助于成熟的CMOS工艺使其像素尺寸更小、集成度更高，可制作成媲美大屏显示的近眼显示产品而受到广泛关注。基于其技术优势和广阔的市场，在军事以及消费电子领域，硅基OLED微显示都将掀起近眼显示的新浪潮，为用户带来前所未有的视觉体验。
公开内容
本公开一些实施例提供一种显示面板，所述显示面板包括：基底；发光器件层，设置在所述基底上；第一薄膜封装层，设置在所述发光器件层远离所述基底一侧，所述第一薄膜封装层至少包括一层有机层；彩膜层，设置在所述第一薄膜封装层远离所述基底一侧；以及第二薄膜封装层，设置在所述彩膜层远离所述基底一侧，所述第二薄膜封装层至少包括一层有机层，其中所述显示面板还包括：胶膜层，设置在所述彩膜层至少一侧，所述胶膜层与所述彩膜层直接接触且层叠设置，所述胶膜层材料的粘度大于所述第一薄膜封装层和第二薄膜封装层每一个中的所述有机层材料的粘度。
在一些实施例中，所述胶膜层与所述第一薄膜封装层和第二薄膜封装层中的至少一个的所述有机层直接接触。
在一些实施例中，所述胶膜层包括：
第一胶膜层，设置在所述第一薄膜封装层和所述彩膜层之间；以及
第二胶膜层，设置在所述彩膜层和所述第二薄膜封装层之间。
在一些实施例中，所述彩膜层在所述基底上的正投影落入所述第一胶膜和所述第二胶膜中的至少一个在所述基底上的正投影内。
在一些实施例中，所述彩膜层在所述基底上的正投影落入所述第一薄膜封装层在所述基底上的正投影内；
所述第一薄膜封装层在所述基底上的正投影落入所述第一胶膜层在所述基底上的正投影内；
所述第一胶膜层在所述基底上的正投影落入所述第二胶膜层在所述基底上的正投影内；以及
所述第二胶膜层在所述基底上的正投影落入所述第二薄膜封装层在所述基底上的正投影内。
在一些实施例中，所述彩膜层、所述第一薄膜封装层、所述第一胶膜层、所述第二胶膜层以及所述第二薄膜封装层在所述基底上的正投影的面积依次增大。
在一些实施例中，所述显示面板包括显示区域和围绕所述显示区域的周边区域，所述彩膜层在所述基底上的正投影落入所述显示区域内，所述第一薄膜封装层、所述第一胶膜层、所述第二胶膜层以及所述第二薄膜封装层的边缘均位于所述周边区域中。
在一些实施例中，在自显示区域朝向周边区域的方向上，所述第一薄膜封装层的边缘、所述第一胶膜层的边缘、所述第二胶膜层的边缘以及所述第二薄膜封装层的边缘依次远离所述显示区域设置，且依次间隔设置。
在一些实施例中，所述第一薄膜封装层的边缘与所述第一胶膜层的边缘之间的距离大于所述面板的像素单元的尺寸的四倍；
所述第一胶膜层的边缘与所述第二胶膜层的边缘之间的距离大于所述面板的像素单元的尺寸的四倍；以及
所述第二胶膜层的边缘与所述第二薄膜封装层的边缘之间的距离大于所述面板的像素单元尺寸的四倍。
在一些实施例中，所述胶膜层包括有机材料，所述有机材料包括1-甲氧基-2-丙醇、丙二醇单甲基醚酯、多功能组丙烯酸单体、肟衍生物和丙烯酸树脂衍生物中的至少一种。
在一些实施例中，所述第一胶膜层的厚度小于所述第二胶膜层的厚度。
在一些实施例中，所述第二胶膜层的厚度大约是第一胶膜层的厚度的3倍。
在一些实施例中，所述第一薄膜封装层包括依次远离所述基底且层叠设置的第一子层、第二子层和第三子层，所述第一子层、第二子层和第三子层的材料分别包括氮化硅、氧化铝和聚对二甲苯，所述第一胶膜层与所述第三子层直接接触。
在一些实施例中，所述第一胶膜层的厚度大于所述第三子层的厚度的一半。
在一些实施例中，所述第二薄膜封装层包括依次远离所述基底且层叠设置的第四子层和第五子层，所述第四子层和第五子层的材料分别包括聚对二甲苯和氧化硅，所述第二胶膜层与所述第四子层直接接触。
在一些实施例中，所述发光器件层包括阵列排布的多个发光器件，每个发光器件包括依次远离所述基底的第一电极、发光功能部以及第二电极，
对于任意相邻的两个发光器件，所述相邻两个发光器件的第一电极相互间隔设置，所述相邻两个发光器件的发光功能部为一体结构，所述相邻两个发光器件的第二电极为一体结构，
所述彩膜层包括多个彩膜，与所述多个发光器件一一对应，对于每个发光器件，所述发光器件的第一电极在所述基底上的正投影落入所述发光器件对应的彩膜在所述基底上的正投影内。
在一些实施例中，所述多个发光器件包括依次相邻的第一发光器件、第二发光器件，所述第一发光器件的第一电极和所述第二发光器件的第一电极之间具有间隙，
所述彩膜层包括具有不同颜色的第一彩膜和第二彩膜，所述第一彩膜和第二彩膜分别与所述第一发光器件和第二发光器件对应，所述第一彩膜和第二彩膜具有交叠部，
所述间隙在所述基底上的正投影落入所述交叠部在所述基底上的正投影内。
在一些实施例中，所述第一发光器件的发光功能层和所述第二发光器件的发光功能部组成的一体结构填充所述间隙。
在一些实施例中，所述基底为硅基底，所述显示面板为硅基显示面板。
本公开一些实施例提供一种显示装置，包括根据前述所述实施例的显示面板。
本公开一些实施例提供一种显示面板的制造方法，所述制造方法包括：在基底上形成发光器件层；在所述发光器件层远离所述基底一侧形成第一薄膜封装层，所述第一薄膜封装层至少包括一层有机层；在所述第一薄膜封装层远离所述基底一侧形成彩膜层；以及在所述彩膜层远离所述基底一侧形成第二薄膜封装层，所述第二薄膜封装层至少包括一层有机层，其中，所述制造方法还包括：在所述彩膜层至少一侧形成与所述彩膜层接触且层叠设置的胶膜层，所述胶膜层材料的粘度大于所述第一薄膜封装层和第二薄膜封装层每一个中的所述有机层材料的粘度。
附图说明
通过阅读参照以下附图所作的对非限制性实施例所作的详细描述，本公开的其它特征、目的和优点将会变得更明显：
图1为根据本公开一些实施例的显示面板的截面示意图；
图2为根据本公开一些实施例的显示面板的平面示意图，其中仅示出了基底、第一薄膜封装层、第一胶膜层、彩膜层、第二胶膜层以及第二薄膜封装层；
图3为图1中M区的放大示意图；
图4为图1中N区的放大示意图；
图4A为图4对应的电镜图；
图5为图4中第一电极的放大示意图；
图6为根据本公开实施例的像素定义层的局部俯视示意图；
图7为根据本公开实施例像素定义层和第一电极层的局部俯视示意图；
图8为根据本公开一些实施例提供的显示装置的示意图；以及
图9为根据本公开一些实施例提供显示装置的制造方法的流程图。
具体实施方式
下面结合附图和实施例对本公开作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释相关发明，而非对该发明的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与发明相关的部分。
需要说明的是，在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。
另外，在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。
应该理解的是，尽管在这里可使用术语第一、第二等来描述不同的元件，但是这些元件不应受这些术语的限制。这些术语仅是用来将一个元件与另一个元件区分开来。例如，在不脱离示例实施例的范围的情况下，第一元件可以被命名为第二元件，类似地，第二元件可以被命名为第一元件。如在这里使用的术语“和/或”包括一个或多个相关所列的项目的任意组合和所有组合。
应该理解的是，当元件或层被称作“形成在”另一元件或层“上”时，该元件或层可以直接地或间接地形成在另一元件或层上。也就是，例如，可以存在中间元件或中间层。相反，当元件或层被称作“直接形成在”另一元件或层“上”时，不存在中间元件或中间层。应当以类似的方式来解释其它用于描述元件或层之间的关系的词语(例如，“在...之间”与“直接在...之间”、“相邻的”与“直接相邻的”等)。
本文中使用的术语仅是为了描述特定实施例的目的，而不意图限制实施例。如本文中所使用的，除非上下文另外明确指出，否则单数形式也意图包括复数形式。还将理解的是，当在此使用术语“包含”和/或“包括”时，说明存在所述特征、整体、步骤、操作、元件和/或组件，但不排除存在或附加一个或多个其它特征、整体、步骤、操作、元件、组件和/或它们的组合。
在本文中，如无特别说明，表述“位于同一层”、“同层设置”一般表示的是：第一部件和第二部件可以使用相同的材料并且可以通过同一构图工艺形成。表述“位于不同层”、“不同层设置”一般表示的是：第一部件和第二部件通过不同构图工艺形成。
相关技术中的硅基OLED显示面板全彩化实现的方式大多数采用白光OLED(WOED)+彩膜(亦称为彩色滤光片，CF)技术。具体地，在硅基底上形成包括多个阵列排布的OLED的发光器件层后，对有发光器件层进行薄膜封装，例如在发光器件层远离硅基底一侧形成包覆发光器件层的第一薄膜封装层，随后在第一薄膜封装层上形成彩膜层用于实现硅基OLED显示面板的彩色显示，接下来对形成有彩膜层的硅基OLED显示面板再次进行薄膜封装，例如在彩膜层远离硅基底一侧形成包覆彩膜层的第二薄膜封装层。第一薄膜封装层和第二薄膜封装层通常采用无机层+有机层+无机层的叠层结构。
发明人发现相关技术中的硅基OLED显示面板存在以下问题：相关技术中的第一薄膜封装层和第二薄膜封装层均与彩膜层直接接触，仅仅起到密封的作用，在制造工艺工程引入位于彩膜层上下表面的杂质颗粒会析出水氧，导致彩膜层被内部水氧侵蚀，从而引起显示不良。另外，第一薄膜封装层和第二薄膜封装层中的每一个与彩膜层接触的子层为无机层，无机层与彩膜层的交界面处的应力较大，使得薄膜封装层容易被彩膜层表面处的杂质颗粒刺穿，导致彩膜层被外界水氧侵蚀。
为了解决相关技术中硅基OLED彩膜被水氧侵蚀的问题，本公开提供一种显 示面板，所述显示面板包括：基底；发光器件层，设置在所述基底上；第一薄膜封装层，设置在所述发光器件层远离所述基底一侧，所述第一薄膜封装层至少包括一层有机层；彩膜层，设置在所述第一薄膜封装层远离所述基底一侧；以及第二薄膜封装层，设置在所述彩膜层远离所述基底一侧，所述第二薄膜封装层至少包括一层有机层，其中所述显示面板还包括：胶膜层，设置在所述彩膜层至少一侧，所述胶膜层与所述彩膜层直接接触且层叠设置，所述胶膜层材料的粘度大于所述第一薄膜封装层和第二薄膜封装层每一个中的所述有机层材料的粘度。
在一些实施例中，所述胶膜层包括：第一胶膜层，设置在所述第一薄膜封装层和所述彩膜层之间；以及第二胶膜层，设置在所述彩膜层和所述第二薄膜封装层之间。
本公开的实施例中，在彩膜层和薄膜封装层(第一薄膜封装层和/或第二薄膜封装层)之间设置胶膜层，增加了彩膜层和薄膜封装层之间的粘附性，使该薄膜封装层的包裹性能更强；另外，胶膜层紧邻彩胶设置，使制造工艺过程中引入的彩胶上下两侧表面上的杂质颗粒进入胶膜层内被胶膜层完全包裹，一方面这些杂质颗粒无法析出水氧，避免彩膜被内部水氧侵蚀；另一方面胶膜设置在彩膜与薄膜封装层之间且具有预定厚度，避免薄膜封装层被杂质颗粒穿刺，进而保护彩膜层免受外界水氧侵蚀。
本公开的以下实施例以硅基OLED显示面板为例进行说明，本领域技术人员可以理解的是本公开的方案还可以应用至其他显示面板，例如玻璃基OLED等。
图1示出了根据本公开一些实施例的显示面板的截面示意图，如图1所示，显示面板10包括基底1以及设置在基底1上的驱动电路层2以及发光器件层3。基底1例如为硅基底，其采用单晶硅制成。发光器件层3设置在驱动电路层2远离基底1的一侧。发光器件层3包括依次远离基底1设置的第一电极层31、发光功能层32以及第二电极层33。第一电极层31例如为阳极层，第二电极层33例如为阴极层，发光功能层32例如包括依次远离基底1设置的空穴注入层、空穴传输层、发光层、电子传输层和电子注入层。在一些实施例中，发光器件层3包括多个阵列排布的多个发光器件，例如为OLED，通过控制多个发光器件的发光来实现显示。
如图1所示，显示面板10还包括第一薄膜封装层41，第一薄膜封装层41包覆发光器件层3以及驱动电路层2，具体地，第一薄膜封装层41覆盖发光器件 层3远离基底1的一侧，并包覆发光器件层3以及驱动电路层2的侧壁。发光器件层3以及驱动电路层2在基底1上的正投影落入第一薄膜封装层41在基底1的正投影内，第一薄膜封装层41起到密封包括发光器件层3以及驱动电路层2的作用，避免水氧对发光器件层3以及驱动电路层2造成侵蚀。
如图1所示，显示面板10还包括第一胶膜层51，第一胶膜层51包覆第一薄膜封装层41，具体地，第一胶膜层51覆盖第一薄膜封装层41远离基底1的一侧，并且包覆第一薄膜封装层41的侧壁。第一薄膜封装层41在基底1上的正投影落入第一胶膜层51在基底1的正投影内。
在一些实施例中，第一胶膜层51例如为有机胶，具体可以为1-甲氧基-2-丙醇、丙二醇单甲基醚酯、多功能组丙烯酸单体、肟衍生物和丙烯酸树脂衍生物中一种或多种。如此设计，使得第一胶膜层51与后续形成的彩膜层6直接接触，彩膜层6下表面即面向基底1的表面上的杂质颗粒可以浸入至第一胶膜层51中，被第一胶膜层51完全包覆，避免该些杂质颗粒析出水氧，腐蚀彩膜层6。
在一些实施例中，第一胶膜层51的厚度例如为1000～3000埃，由此可以使得上述杂质颗粒可以完全包覆在第一胶膜层51内，避免刺破第一薄膜封装层41，保障封装效果。
如图1所示，显示面板10还包括彩膜层6，彩膜层6设置在第一胶膜层51远离基底1一侧，彩膜层6例如包括多个彩膜，多个彩膜分别对应发光器件层3的多个发光器件，发光器件层3中的多个发光器件例如为白光OLED，白光OLED发射的白光经过对应的彩膜时仅允许特定延伸的光通过，由此实现显示面板的全彩显示。彩膜层6在基底1上的正投影与发光器件层3在基底1上的正投影基本重合。在一些实施例中，彩膜层6的厚度为9000～11000埃。
如图1所示，显示面板10还包括第二胶膜层52，第二胶膜层5包覆彩膜层6和第一胶膜层51，具体地，第二胶膜层52包覆彩膜层6远离基底1的一侧以及彩膜层6的侧壁，并且第二胶膜层52包覆第一胶膜层51未被彩膜层覆盖的部分。彩膜层6和第一胶膜层51在基底1上的正投影均落入第二胶膜层52在基底1的正投影内。
在一些实施例中，第二胶膜层52例如为有机胶，具体可以为1-甲氧基-2-丙醇、丙二醇单甲基醚酯、多功能组丙烯酸单体、肟衍生物和丙烯酸树脂衍生物中一种或多种。如此设计，使得第二胶膜层53与彩膜层6直接接触，彩膜层6上 表面即远离基底1的表面上的杂质颗粒可以浸入至第二胶膜层52中，被第二胶膜层52完全包覆，避免该些杂质颗粒析出水氧，腐蚀彩膜层6。
在一些实施例中，第二胶膜层52的厚度例如为3000～5000埃，由此可以使得上述杂质颗粒可以完全包覆在第二胶膜层52内，避免刺破后续形成的第二薄膜封装层42，保障封装效果。
如图1所示，显示面板10还包括第二薄膜封装层42，第二薄膜封装层42包覆第二胶膜层52，具体地，第二薄膜封装层42覆盖第二胶膜层52远离基底1的一侧，并且包覆第二胶膜层52的侧壁。第二胶膜层52在基底1上的正投影落入第二薄膜封装层42在基底1的正投影内。
如图1所示，显示面板10还包括盖板8，盖板8采用透明材料制成，盖板8例如为玻璃盖板。盖板8与形成第二薄膜封装层8后的基底1通过密封胶7贴合。密封胶7和盖板12为阻隔外界水氧入侵提供另外的多重保障。
在本公开的实施例中，彩膜层和薄膜封装层(第一薄膜封装层和/或第二薄膜封装层)之间设置胶膜层(第一胶膜层和/或第二胶层层)，增加了彩膜层和薄膜封装层之间的粘附性，使该薄膜封装层的包裹性能更强；并且，胶膜层紧邻彩胶设置，使制造工艺过程中引入的彩胶上下两侧表面上的杂质颗粒进入胶膜层内被胶膜层完全包裹，一方面这些杂质颗粒无法析出水氧，避免彩膜被内部水氧侵蚀；另一方面胶膜设置在彩膜与薄膜封装层之间且具有预定厚度，避免薄膜封装层被杂质颗粒穿刺，进而保护彩膜层免受外界水氧侵蚀，保障显示面板的使用寿命。
图2示出了根据本公开一些实施例的显示面板的平面示意图，仅示出了基底、第一薄膜封装层、第一胶膜层、彩膜层、第二胶膜层以及第二薄膜封装层，以体现第一薄膜封装层、第一胶膜层、彩膜层、第二胶膜层以及第二薄膜封装层的边缘的相对位置关系。
本领域技术人员可以理解的是，为了清楚体现第一薄膜封装层、第一胶膜层、彩膜层、第二胶膜层以及第二薄膜封装层的边缘，第一薄膜封装层、第一胶膜层、彩膜层、第二胶膜层以及第二薄膜封装层的边缘均采用实线绘制，并不表示第一薄膜封装层、第一胶膜层、彩膜层、第二胶膜层以及第二薄膜封装层在垂于基底方向上的位置关系，具体结合图1，第一薄膜封装层、第一胶膜层、彩膜层、第二胶膜层以及第二薄膜封装层依次远离基底设置。
参见图1和图2，显示面板10具有显示区域DA和围绕显示区域的周边区域 PA，发光器件层3和彩膜层6在基底1上正投影均落入显示区域DA中。第一薄膜封装层41、第一胶膜层51、第二胶膜层52以及第二薄膜封装层42在基底1上的正投影均自显示区域DA延伸至周边区域PA中。也就是说，第一薄膜封装层41、第一胶膜层51、第二胶膜层52以及第二薄膜封装层42的边缘在基底1上的正投影均位于周边区域PA内。可以认为，第一薄膜封装层41、第一胶膜层51、第二胶膜层52以及第二薄膜封装层42在在基底1上的正投影均覆盖显示区域DA，并覆盖周边区域PA的一部分。
如图2所示，第一薄膜封装层41、第一胶膜层51、彩膜层6、第二胶膜层52以及第二薄膜封装层42在基底1上的正投影均为矩形，本领域技术人员可以理解的是，在其他实施例中，第一薄膜封装层41、第一胶膜层51、彩膜层6、第二胶膜层52以及第二薄膜封装层42在基底1上的正投影均为矩形还可以为其他形状，例如为六边形、圆形等。
在一些实施例中，如图1和图2所示，彩膜层6在所述基底1上的正投影落入第一薄膜封装层41在基底1上的正投影内；第一薄膜封装层41在基底1上的正投影落入第一胶膜层51在基底1上的正投影内；第一胶膜层51在基底1上的正投影落入第二胶膜层52在基底1上的正投影内；以及第二胶膜层52在基底1上的正投影落入第二薄膜封装层42在基底1上的正投影内。彩膜层6、第一薄膜封装层41、第一胶膜层51、第二胶膜层52以及第二薄膜封装层42在基底1上的正投影的面积依次增大。
在一些实施例中，在自显示区域DA朝向周边区域PA的方向上，所述第一薄膜封装层41的边缘、所述第一胶膜层51的边缘、所述第二胶膜层52的边缘以及所述第二薄膜封装层42的边缘依次远离所述显示区域设置，且依次间隔设置。
具体地，第一薄膜封装层41、第一胶膜层51、彩膜层6、第二胶膜层52以及第二薄膜封装层42在基底1上的正投影均为矩形，且第一薄膜封装层41、第一胶膜层51、彩膜层6、第二胶膜层52以及第二薄膜封装层42均包括四个边缘，即如图2中的上边缘、下边缘、左边缘和右边缘，统称为边缘。
为了方便说明，将第一薄膜封装层41、第一胶膜层51、彩膜层6、第二胶膜层52以及第二薄膜封装层42的上边缘称为上边缘组，将第一薄膜封装层41、第一胶膜层51、彩膜层6、第二胶膜层52以及第二薄膜封装层42的下边缘称为下 边缘组，将第一薄膜封装层41、第一胶膜层51、彩膜层6、第二胶膜层52以及第二薄膜封装层42的作边缘称为左边缘组，将第一薄膜封装层41、第一胶膜层51、彩膜层6、第二胶膜层52以及第二薄膜封装层42的右边缘称为右边缘组。
对于上边缘组、下边缘组、左边缘组和右边缘组中的任一边缘组，所述第一薄膜封装层41的边缘、所述第一胶膜层51的边缘、所述第二胶膜层52的边缘以及所述第二薄膜封装层42的边缘依次远离所述显示区域设置，且依次间隔设置。
以右边缘组为例，参见图1和图2，第一方向X上，所述第一薄膜封装层41的右边缘、所述第一胶膜层51的右边缘、所述第二胶膜层52的右边缘以及所述第二薄膜封装层42的右边缘依次远离所述显示区域DA设置，且相互间隔。
具体地，在第一方向X上，第一薄膜封装层41的右边缘与第一胶膜层51的右边缘之间间距的距离为d1，称为第一距离d1。第一距离d1基本上大于所述第一薄膜封装层41的对位精度和所述第一胶膜层51的对位精度之和。在一些实施例中，第一薄膜封装层41采用open mask工艺来形成，第一薄膜封装层41的对位精度指的是形成第一薄膜封装层41时采用的掩膜板与基底10的对位精度。第一胶膜层51亦采用open mask工艺来形成，第一胶膜层51的对位精度指的是形成第一胶膜层51时采用的掩膜板与基底10的对位精度。由此可以保证第一胶膜层51对第一薄膜封装层41的完全覆盖。在实际生产工艺中，即使第一胶膜层51和第一薄膜封装层41均存在位置偏差的情况下，第一胶膜层51也不会暴露第一薄膜封装层41。
第一胶膜层51的右边缘与第二胶膜层52的右边缘之间间距的距离为d2，称为第二距离d2。第二距离d2基本上大于所述第一胶膜层51的对位精度和所述第二胶膜层52的对位精度之和。在一些实施例中，第二胶膜层52亦采用open mask工艺来形成，第二胶膜层52的对位精度指的是形成第二胶膜层52时采用的掩膜板与基底10的对位精度。由此可以保证第二胶膜层52对第一胶膜层51的完全覆盖。在实际生产工艺中，即使第一胶膜层51和第二胶膜层52均存在位置偏差的情况下，第二胶膜层52也不会暴露第一胶膜层51。
第二胶膜层52的右边缘与第二薄膜封装层42的右边缘之间间距的距离为d3，称为第三距离d3。第三距离d3基本上大于所述第二胶膜层52的对位精度和所述第二薄膜封装层42的对位精度之和。在一些实施例中，所述第二薄膜封装层42 亦采用open mask工艺来形成，第二薄膜封装层42的对位精度指的是形成第二薄膜封装层42时采用的掩膜板与基底10的对位精度。由此可以保证第二薄膜封装层42对第二胶膜层52的完全覆盖。在实际生产工艺中，即使第二薄膜封装层42和第二胶膜层52均存在位置偏差的情况下，第二薄膜封装层42也不会暴露第二胶膜层52。
在一些实施例中，第一薄膜封装层41、第二薄膜封装层42、第一胶膜层51和第二胶膜层52中任意两者的对位精度可以相同，也可以不同。第一薄膜封装层41、第二薄膜封装层42、第一胶膜层51和第二胶膜层52的对位精度例如均为10μm。
在一些实施例中，显示面板中的像素单元的尺寸约为4.6～5.2μm，可以理解地是前述的第一距离d1、第二距离d2，第三距离d3中每一个大于所述面板的像素单元尺寸的四倍。
本领域技术人员可以理解的是，类似地，在第一方向X上，所述第一薄膜封装层41的左边缘、所述第一胶膜层51的左边缘、所述第二胶膜层52的左边缘以及所述第二薄膜封装层42的左边缘依次远离所述显示区域DA设置，且相互间隔；在与第一方向X垂直的第二方向Y上，所述第一薄膜封装层41的上边缘、所述第一胶膜层51的上边缘、所述第二胶膜层52的上边缘以及所述第二薄膜封装层42的上边缘依次远离所述显示区域DA设置，且相互间隔；在第二方向Y上，所述第一薄膜封装层41的下边缘、所述第一胶膜层51的下边缘、所述第二胶膜层52的下边缘以及所述第二薄膜封装层42的下边缘依次远离所述显示区域DA设置，且相互间隔，在此不再赘述。
图3为图1中M区的放大示意图。在一些实施例中，结合图1和图3所示，第一薄膜封装层41包括依次远离基底1的第一子层411、第二子层412以及第三子层413。第一子层411例如为氮化硅(SiNx)，其厚度例如为2500～3500埃。第二子层412例如为氧化铝(Al 2O 3)，其厚度例如为400～600埃。第三有机层413与第一胶膜层51直接接触，第三子层413例如为聚对二甲苯(Parylene)，其厚度例如为4500～5500埃。作为有机层的第三子层413与第一胶膜层51贴合，可以使得第一薄膜封装层41与第一胶膜层51贴合更加紧密，第一薄膜封装层41的总厚度例如为7400～9600埃。
在一些实施例中，结合图1和图3所示，第二薄膜封装层42包括依次远离 基底1的第四子层421以及第五子层422。第四子层421例如为聚对二甲苯(Parylene)，其厚度例如为4500～5500埃。第五子层422例如为氧化硅(SiO 2)，其厚度例如为950～1050埃。第四有机层421与第二胶膜层52直接接触，作为有机层的第四子层421与第二胶膜层52贴合，可以使得第二薄膜封装层42与第二胶膜层52贴合更加紧密。第二薄膜封装层42的总厚度例如为5450～6550埃。
在一些实施例中，胶膜层，例如第一胶膜层51或第二胶膜层52，薄膜封装层，例如第一薄膜封装层41或第二薄膜封装层42，中的有机层，例如第三子层413或第四子层421的特性对照如下表1：
膜层 粘度(mPa·s) 折射率 密度(g/cm^3) 透光率
胶膜层 1.750 1.4034 0.922 0.90
有机层(Parylene) 0.648 1.592 1.289 0.95
在一些实施例中，如表1所示，胶膜层，例如第一胶膜层51或第二胶膜层52的粘度大于薄膜封装层，例如第一薄膜封装层或第二薄膜封装层，中的有机层，例如第三子层413或第四子层421，的粘度。由于粘度较大，胶膜层易于吸附杂质颗粒，并且胶膜层具有一定流动性，易于将吸附的杂质颗粒包覆在其中。
在一些实施例中，胶膜层的折射率和密度均大于有机层(Parylene)的折射率和密度，胶膜层的透光率与有机层(Parylene)的透光率基本相同。
在一些实施例中，第二胶膜层52的厚度大于第一胶膜层51的厚度。较厚的胶膜层可以包覆更多的杂质颗粒。在显示面板的形成工艺中，形成彩膜层6的工艺时产生的杂质颗粒明显要多于形成第三子层413时产生的杂质颗粒。在一些实施例中，彩膜层6包括三种颜色的彩膜，需要三次成膜工艺来形成，形成彩膜层6的工艺时产生的杂质颗粒大约为形成第三子层413时产生的杂质颗粒的三倍，为了使得杂质颗粒基本上不影响彩膜层，可以将第二胶膜层52的厚度设置为第一胶膜层51的厚度的大约3倍，或者更大。
在一些实施例中，在形成第三子层413的工艺中，形成的杂质颗粒的尺寸通常小于第三子层413的厚度的一半，为了使得在该工艺中形成的杂质颗粒被第一胶膜层51包覆，第一胶膜层51的厚度可以大约为第三子层413的厚度的一半或更大。
前述实施例中给出了彩膜层两侧均被胶膜层包覆的示例，本领域技术人员可以理解的是，在其他实施例中，胶膜层可以仅设置在彩膜层的一侧，即显示面板 仅包括第一胶膜层或第二胶膜层，亦可以在一定程度上解决彩膜层被内部和外界水氧侵蚀的问题。
图4为图1中N区的放大示意图，图4A为图4对应的电镜图。在一些实施例中，如图4和图4A所示，发光器件层包括多个发光器件P，每个发光器件P包括依次远离基底1的第一电极31’，发光功能部32’以及第二电极33’。第一电极31’例如为阳极，第二电极33’例如为阴极。对于任意相邻的两个发光器件P，它们的第一电极31’相互间隔设置，例如相邻两个发光器件P的第一电极31’之间具有间隙T，避免相邻的两个发光器件P的第一电极31’电连接。相邻两个发光器件P的发光功能部32’为一体结构，相邻两个发光器件P的第二电极33’为一体结构。也就是说，所述多个发光器件P的发光功能部32’连接为一体，构成前述的发光功能层32。所述多个发光器件P的第二电极33’连接为一体构成前述的第二电极层33。
在一些实施例中，彩膜层6包括多个彩膜61，与所述多个发光器件P一一对应，对于每个发光器件P，所述发光器件P的第一电极31’在所述基底1上的正投影落入所述发光器件P对应的彩膜61在所述基底上的正投影内。
每个发光器件P配合其对应的彩膜61构成一个像素单元，发光器件P均发白光，发光器件P发出的白光经过其对应的彩膜61，仅允许特定颜色的光透过对应的彩膜，由此实现显示面板的全彩显示。
在一些实施例中，如图4和图4A所示，彩膜层6包括依次相邻的第一彩膜611、第二彩膜612以及第三彩膜613，它们分别对应依次相邻的第一发光器件P1、第二发光器件P2以及第三发光器件P3。第一彩膜611、第二彩膜612以及第三彩膜613具有不同的颜色，例如第一彩膜611为红色彩膜，仅允许透光红光，第二彩膜612为绿色彩膜，仅允许透过绿光，第三彩膜613为蓝色彩膜，仅允许透光蓝光。第一彩膜611、第二彩膜612以及第三彩膜613与它们对应的第一发光器件P1、第二发光器件P2以及第三发光器件P3分别构成第一像素单元、第二像素单元和第三像素单元，第一像素单元、第二像素单元和第三像素单元分别可以发出红光、绿光和蓝光，亦称为红色像素单元、绿色像素单元和蓝色像素单元，进而实现显示面板的全彩显示。
对于任意相邻的两个像素单元来说，它们具有不同颜色的彩膜，且它们的彩膜具有交叠部，它们的发光器件的第一电极之间的间隙在基底上正投影落入所述 交叠部在所述基底上的正投影内。如此设置不同颜色的彩膜的交叠部不透光，避免相邻两个像素单元的出光干扰，采用不同颜色的彩膜部部分相交叠的方式可以省略相关技术中的相邻彩膜之间的黑矩阵。
具体地，以相邻的第一像素单元和第二像素单元为例进行说明，如图4和图4A所示，第一像素单元的第一彩膜61与第二像素单元的第二彩膜62具有交叠部OP，具体地，第一彩膜61覆盖第二彩膜62靠近所述第一彩膜61的边缘部。由于第一彩膜61和第二彩膜62分别为红色彩膜和绿色彩膜，第一彩膜61与第二像素单元的第二彩膜62的交叠部OP不透光，可以，避免相邻的第一像素单元和第二像素单元的出光干扰。第一像素单元的第一发光器件P1的第一电极31’与第二像素单元的第二发光器件P2的第一电极31’之间具有间隙T，间隙T在基底1上的正投影落入所述交叠部OP在基底1上的正投影内。
在一些实施例中，在形成彩膜层6的过程中，首先形成第三彩膜63，然后再形成第二彩膜62，使得第二彩膜62与第三彩膜63部分交叠来形成第二彩膜62和第三彩膜63之间的交叠部，而后再形成第一彩膜61使得第一彩膜61与第二彩膜62部分交叠来形成第一彩膜61和第二彩膜62之间的交叠部，并同时使得第一彩膜61与第三彩膜63部分交叠来形成第一彩膜61和第三彩膜63之间的交叠部。
在一些实施例中，如图4和图4A所示，发光器件P的发光功能部32’构成的一体结构即发光功能层32填充在所述间隙T中。
在一些实施例中，如图4和图4A所示，显示面板10中，驱动电路层2包括靠近第一电极层31的平坦层20、第一电极层3设置在平坦层20远离基底1一侧，且与平坦层2邻接设置、显示面板10还包括像素定义层9，其中：
平坦层20背离基底1的表面设有多个分隔槽201，以在平坦层20上分割出多个驱动区202，且各驱动区202阵列分布。每个分隔槽201在基底1上的正投影均落入其对应的间隙T在基底1上的正投影内。
图5为图4中第一电极31’的放大示意图，如图4和图5所示，第一电极层31设于平坦层20背离基底1的表面，且包括阵列分布的多个第一电极31’，各第一电极31’在平坦层20的正投影一一对应的位于各驱动区202以内。第一电极31’包括平坦的中间部310和围绕中间部310的边缘部311；边缘部311包括围绕中间部310的平坦部3110以及连接于中间部310和平坦部3110之间的爬坡部 3111，平坦部3110的厚度小于中间部310。
像素定义层9设于平坦层20背离基底1的表面，且露出中间部310的至少部分区域，可以理解为像素定义层9覆盖第一电极31’的边缘部311。
发光功能层32覆盖像素定义层9以及被像素定义层9露出的第一电极31’的中间部310和平坦层2。发光功能层32填充在分隔槽201内。第二电极层33整面覆盖发光功能层32。
由于第一电极31’在平坦层20的正投影一一对应的位于各驱动区202以内，使得第一电极31’在平坦层上的正投影与分隔槽201不交叠，可以理解的是，分割槽201在基底1上的正投影落入其相应的间隔T在基底上的正投影内。在形成发光功能32时，发光功能层32可在分隔槽201的位置向基底1凹陷，进而使第二电极层33在该凹陷处形成的凹陷部331，且凹陷部331在平坦层20的正投影与第一电极31’的中间部310在平坦层2的正投影不交叠，由此，可通过分隔槽201对第二电极层33的凹陷部331的位置进行限制，防止凹陷部331与第一电极31’的中间部310之间发生尖端放电，甚至短路，有利于保证发光器件的稳定发光。同时，可减少、甚至避免凹陷部331的范围内发光，从而降低相邻发光器件发光的互相干扰。
下面对本公开实施例中显示面板10的各部分进行详细说明。
如图4所示，基底1的材料可为单晶硅或多晶硅等半导体材料，也可以是玻璃等其它硬质或软质材料。
在本公开的一些实施方式中，基底1上可设有多个驱动晶体管，用于驱动各个发光器件发光，以显示图像。以一个顶栅结构的驱动晶体管为例，显示面板10的驱动电路层2还包括栅绝缘层GI、栅极G、第一绝缘层21和第一走线层22，其中：基底1的材料可为单晶硅或多晶硅等半导体材料，且基底1包括有源区101和位于有源区101两端的源极1011和漏极1012。栅绝缘层GI覆盖有源区101；栅极G设于栅绝缘层GI背离基底1的表面，栅极G的材料可包括多晶硅材料。第一绝缘层21覆盖栅极G和基底1，其材料可包括氧化硅和氮化硅中至少一个。第一走线层22设于第一绝缘层21背离基底1的表面，且栅极G、源极1011和漏极1012均通过钨或其它金属填充的过孔与第一走线层10连接。
此外，显示面板10还可包括第二绝缘层23和第二走线层24，第二绝缘层23覆盖第一走线层22和第一绝缘层21，第二走线层24设于第二绝缘层23背离 基底1的表面，第二走线层24的具体图案在此不做特殊限定，其可通过钨或其它金属填充的过孔与第一走线层22连接。
如图4所示，平坦层20设于基底1的一侧，在本公开的一些实施方式中，平坦层20可覆盖第二走线层24，第一电极31’可通过钨或其它金属填充的过孔与第二走线层24连接。平坦层20的材料可包括氮化硅和氧化硅中至少一种，当然，还可以包括其它绝缘材料。举例而言，平坦层20可通过抛光工艺实现平坦化。
平坦层20背离基底1的表面可开设多个分隔槽201，分隔槽201的深度小于平坦层20的厚度，即分隔槽201在深度方向上不会贯穿平坦层20。通过分隔槽201可在平坦层20上分割出多个驱动区202，且各驱动区202阵列分布。
驱动区202在基底1的正投影的形状可以是矩形、五边形、六边形或其它多边形，当然，也可以是圆形或其它形状，在此不作特殊限定。同时，不同驱动区202的形状和尺寸可以不同。
每个分隔槽201可包括两个相对的侧壁2011以及连接于两个侧壁2011之间的底壁2012。其中，两个侧壁2011可平行设置，即在垂直于基底1的方向上，两个侧壁2011及其延伸面不相交。或者，两个侧壁2011也可呈一定夹角设置。
在一些实施例中，底壁2012可与平坦层20背离基底1的表面大致平行，或者，如图4所示，底壁2012也可是沿背离基底1的方向凸起的曲面，该曲面的曲率和形状在此不做特殊限定，且在垂直于基底1的截面中，底壁2012的轮廓可以大致呈圆弧状、抛物线状或波浪线状，当然，也可以是其它规则或不规则的形状，只要向背离基底1的方向凸起即可。
在本公开的一些实施方式中，两个侧壁2011向靠近底壁2012的方向收缩，即两个侧壁2011的间距向靠近底壁2012的方向逐渐减小，使得侧壁2011具有相对于平坦层20背离基底1的表面的坡度，该坡度为侧壁2011与平坦层20背离基底1的表面的夹角。进一步的，该坡度不小于70°，且不大于90°，例如，该坡度可以是70°、80°和90°等。
在本公开的一些实施方式中，分隔槽201的两个侧壁2011的间距可为0.2μm-0.7μm，例如0.2μm 0.3μm、0.5μm或0.7μm等。
如图1所示，第一电极层31设于平坦层20背离基底1的表面，且包括阵列分布的多个第一电极31’，各第一电极31’在平坦层20的正投影一一对应的位于 各驱动区202以内，即各第一电极31’在基底1的正投影的边界一一对应的位于各驱动区202在基底1的正投影的边界以内。每个驱动区202上只设置一个第一电极31’。由于驱动区202是分隔槽201分隔而成，而第一电极31’位于驱动区202上，因此，分隔槽201位于第一电极31’以外。每个第一电极31’在平坦层20的正投影的形状可与其所处的驱动区202的形状相同，第一电极31’的边界位于其所处的驱动区202以内。
在平行于基底1的方向上，至少一个第一电极31’可包括中间部310和围绕中间部310边缘部311，其中，中间部310为平坦结构，即中间部310与平坦层20背离基底1的表面大致平行。
在本公开的一些实施例中，每个第一电极31’的中间部310在基底1的正投影的边界可位于其所处的驱动区202在基底1的正投影的边界以内，即中间部310在基底1的正投影的边界与其所处的驱动区202在基底1的正投影的边界具有预定间距。例如，该预定间距不小于0.15μm，例如，该间距可以是0.15μm、0.2μm、0.25μm等。
边缘部311可包括平坦部3110以及爬坡部3111，其中，平坦部3110位于平坦层20背离基底1的表面，并围绕中间部310设置，且平坦部3110与平坦层20背离基底1的表面大致平行。同时，平坦部3110的厚度小于中间部310的厚度。在本公开的一些实施方式中，平坦部3110在基底1的正投影的边界与其所处的驱动区202在基底1的正投影的边界之间具有预定间距。可选地，平坦部3110在基底1的正投影的边界与其所处的驱动区202在基底1的正投影的边界重叠。
爬坡部3111连接于中间部310和平坦部3110之间，即爬坡部3111围绕中间部310，平坦部3110围绕爬坡部3111设置。在本公开的一些实施方式中，爬坡部3111相对于平坦层20背离基底1的表面的坡度不小于30°，该坡度为爬坡部3111的表面与平坦层20背离基底1的表面的夹角。
第一电极31’包括第一导电层320、第二导电层321和第三导电层322，第一导电层320设于平坦层2背离基底1的表面，第二导电层321设于第一导电层320背离基底1的表面，第三导电层322设于第二导电层321背离基底1的表面，并以一定的坡度延伸至平坦层20，从而包覆第一导电层320和第二导电层321，对第一导电层320和第二导电层321进行保护。
第一电极31’的中间部310包括第三导电层322位于第二导电层321背离基 底1的表面的区域以及第一导电层320和第二导电层321，边缘部311包括第三导电层322包覆第一导电层320和第二导电层321边缘的区域，即向平坦层20延伸的区域。示例性的，第一导电层320的材料可包括钛(Ti)、第二导电层321的材料包括银(Ag)、第三导电层322的材料包括氧化铟锡(ITO)，当然，也可以采用其他材料。
如图1所示，像素定义层9为绝缘材质，且与第一电极层31均设于平坦层20背离基底1的表面。像素定义层9覆盖第一电极31’的边缘，例如像素定义层9覆盖第一电极31’的边缘部311。同时，像素定义层9露出第一电极31的中间部310的至少部分区域。
在本公开的一些实施方式中，每个第一电极31’不完全覆盖其所在的驱动区202，且第一电极31’的平坦部3110在基底1的正投影的边界与其所处的驱动区202在基底1的正投影的边界具有一定的间距。像素定义层9延伸至分隔槽201的侧壁2011和底壁2012，即像素定义层9与未被第一电极31’覆盖的驱动区202随形贴合，使得像素定义层9在对应分隔槽201的区域凹陷。像素定义层9设有一一对应露出各中间部310的至少部分区域的多个开口901，从而可通过像素定义层9对发光器件的发光范围进行限定，像素单元的尺寸可以由其对应的开口901的尺寸表示。
图6为根据本公开实施例的像素定义层的局部俯视示意图。图7为根据本公开实施例像素定义层和第一电极层的局部俯视示意图。如图6和图7所示，在本公开的一些实施方式中，像素定义层9的开口901可为六边形或其它多边形结构，第一电极31’也可为多边形结构，且与开口901的形状相同，当然，第一电极31’也可以是其它形状。如图6所示，开口901的尺寸d4约为4.6～5.2μm，即像素单元的尺寸约为4.6～5.2μm。
如图4所示，发光功能层32可为连续的膜层，且至少部分覆盖各第一电极31’的中间部310，即覆盖被开口901露出的区域，同时，发光功能层32还覆盖像素定义层9，在通过蒸镀或其它工艺形成发光功能层32时，发光功能层32在对应分隔槽201的区域向靠近基底1的方向凹陷。
在本公开的一些实施例中，发光功能层32包括沿远离基底1的方向依次层叠的空穴注入层、空穴传输层、发光层、电子传输层和电子注入层。
如图4所示，第二电极层33覆盖发光功能层32，可向第一电极31’和第二 电极33施加驱动信号，使发光功能层32位于第一电极31’和第二电极层33之间的部分发光。
第二电极层33的形貌与发光功能层32相匹配，其在发光功能层32的凹陷处凹陷，形成凹陷部331，并在对应于第一电极31的中间部310的区域形成平缓部332，使凹陷部331在平坦层20上的正投影与位于第一电极31’的中间部310在平坦层20上的正投影不重叠，减少或避免第一电极31’与第二电极层33的凹陷部61发生尖端放电。第二电极层33的材料可以是合金材料，例如第二电极层33的材料可包括Mg和Ag；或者，第二电极层33还可采用Al和Li合金。当然，第二电极层33还可以采用其他合金或单质金属，在此不再一一列举。
需要说明的是，在一些实施例中，若像素定义层9覆盖第一电极31’的中间部310的边缘，则平缓部332在对应于像素定义层9覆盖中间部310的区域可向背离基底1的方向凸起，但凸起的高度小于第一中间部310的厚度，以使平缓部332大致保持平缓。
进一步的，如图4所示，在本公开的一些实施例中，第二电极层32的凹陷部331在垂直于基底1的截面上的最低点在平坦层20的正投影完全位于分隔槽201以内。
在本公开的一些实施例中，分隔槽201的最大深度为1000埃-3000埃。
此外，在本公开的一些实例，如图4所示，显示面板10还可包括光提取层11，光提取层11覆盖于第二电极层33背离基底1的表面，且在对应与凹陷部331的区域凹陷，第一薄膜封装层41设于光提取层11背离基底1的一侧。光提取层11的折射率大于第二电极层33，可提高出光效率，且折射率越高，出光效率越高。
本公开一些实施例还提供一种显示装置，图8为根据本公开一些实施例提供的显示装置的示意图，如图8所示，显示装置100包括前述实施例中显示面板10，显示面板例如为OLED显示面板。显示装置可以为：智能眼镜、投影机、电视、显示器、数码相框、手机、智能手表、平板电脑等任何具有显示功能的产品或部件。
本公开一些实施例还提供一种显示面板的制造方法，图9为根据本公开一些实施例提供显示装置的制造方法的流程图。如图9所示，显示面板的制造方法包括以下步骤：
S10：在基底上形成发光器件层；
S20：在所述发光器件层远离所述基底一侧形成第一薄膜封装层；
S30：在所述第一薄膜封装层远离所述基底一侧形成彩膜层；以及
S40：在所述彩膜层远离所述基底一侧形成第二薄膜封装层，
其中，所述制造方法还包括：
在所述彩膜层至少一侧形成与所述彩膜层接触且层叠设置的胶膜层。
具体地，在所述第一薄膜封装层远离所述基底一侧形成彩膜层之前，所述制造方法还包括：
S25：在所述第一薄膜封装层远离所述基底一侧形成第一胶膜层；
在所述彩膜层远离所述基底一侧形成第二薄膜封装层之前，所述制造方法还包括：
S35：在所述彩膜层远离所述基底一侧形成第二胶膜层。
在步骤S20、步骤S25、步骤S35、步骤S40中，第一薄膜封装层、第一胶膜层、第二胶膜层以及第二薄膜封装层均采用open mask工艺制成。
采用上述制造方法制成的显示装置中，彩膜层和薄膜封装层(第一薄膜封装层和/或第二薄膜封装层)之间增设了胶膜层(第一胶膜层和/或第二胶层层)，增加了彩膜层和薄膜封装层之间的粘附性，使该薄膜封装层的包裹性能更强；并且，胶膜层紧邻彩胶设置，使制造工艺过程中引入的彩胶上下两侧表面上的杂质颗粒进入胶膜层内被胶膜层完全包裹，一方面这些杂质颗粒无法析出水氧，避免彩膜被内部水氧侵蚀；另一方面胶膜设置在彩膜与薄膜封装层之间且具有预定厚度，避免薄膜封装层被杂质颗粒穿刺，进而保护彩膜层免受外界水氧侵蚀，保障显示面板的使用寿命。
以上描述仅为本公开的较佳实施例以及对所运用技术原理的说明。本领域技术人员应当理解，本公开中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本公开中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (22)

  1. 一种显示面板，其特征在于，所述显示面板包括：
    基底；
    发光器件层，设置在所述基底上；
    第一薄膜封装层，设置在所述发光器件层远离所述基底一侧，所述第一薄膜封装层至少包括一层有机层；
    彩膜层，设置在所述第一薄膜封装层远离所述基底一侧；以及
    第二薄膜封装层，设置在所述彩膜层远离所述基底一侧，所述第二薄膜封装层至少包括一层有机层，
    其中所述显示面板还包括：
    胶膜层，设置在所述彩膜层至少一侧，所述胶膜层与所述彩膜层直接接触且层叠设置，所述胶膜层材料的粘度大于所述第一薄膜封装层和第二薄膜封装层每一个中的所述有机层材料的粘度。
  2. 根据权利要求1所述的显示面板，其中，所述胶膜层与所述第一薄膜封装层和第二薄膜封装层中的至少一个的所述有机层直接接触。
  3. 根据权利要求1或2所述显示面板，其中，所述胶膜层包括：
    第一胶膜层，设置在所述第一薄膜封装层和所述彩膜层之间；以及
    第二胶膜层，设置在所述彩膜层和所述第二薄膜封装层之间。
  4. 根据权利要求3所述的显示面板，其中，所述彩膜层在所述基底上的正投影落入所述第一胶膜和所述第二胶膜中的至少一个在所述基底上的正投影内。
  5. 根据权利要求3中所述的显示面板，其中，
    所述彩膜层在所述基底上的正投影落入所述第一薄膜封装层在所述基底上的正投影内；
    所述第一薄膜封装层在所述基底上的正投影落入所述第一胶膜层在所述基 底上的正投影内；
    所述第一胶膜层在所述基底上的正投影落入所述第二胶膜层在所述基底上的正投影内；以及
    所述第二胶膜层在所述基底上的正投影落入所述第二薄膜封装层在所述基底上的正投影内。
  6. 根据权利要求5所述的显示面板，其中，所述彩膜层、所述第一薄膜封装层、所述第一胶膜层、所述第二胶膜层以及所述第二薄膜封装层在所述基底上的正投影的面积依次增大。
  7. 根据权利要求5所述的显示面板，其中，所述显示面板包括显示区域和围绕所述显示区域的周边区域，所述彩膜层在所述基底上的正投影落入所述显示区域内，所述第一薄膜封装层、所述第一胶膜层、所述第二胶膜层以及所述第二薄膜封装层的边缘均位于所述周边区域中。
  8. 根据权利要求7所述的显示面板，其中，在自显示区域朝向周边区域的方向上，所述第一薄膜封装层的边缘、所述第一胶膜层的边缘、所述第二胶膜层的边缘以及所述第二薄膜封装层的边缘依次远离所述显示区域设置，且依次间隔设置。
  9. 根据权利要求8所述的显示面板，其中，
    所述第一薄膜封装层的边缘与所述第一胶膜层的边缘之间的距离大于所述面板的像素单元的尺寸的四倍；
    所述第一胶膜层的边缘与所述第二胶膜层的边缘之间的距离大于所述面板的像素单元的尺寸的四倍；以及
    所述第二胶膜层的边缘与所述第二薄膜封装层的边缘之间的距离大于所述面板的像素单元尺寸的四倍。
  10. 根据权利要求1或2所述的显示面板，其中，所述胶膜层包括有机材料，所述有机材料包括1-甲氧基-2-丙醇、丙二醇单甲基醚酯、多功能组丙烯酸单体、 肟衍生物和丙烯酸树脂衍生物中的至少一种。
  11. 根据权利要求3所述的显示面板，其中所述第一胶膜层的厚度小于所述第二胶膜层的厚度。
  12. 根据权利要求11所述的显示面板，其中所述第二胶膜层的厚度大约是第一胶膜层的厚度的3倍。
  13. 根据权利要求3所述的显示面板，其中，
    所述第一薄膜封装层包括依次远离所述基底且层叠设置的第一子层、第二子层和第三子层，所述第一子层、第二子层和第三子层的材料分别包括氮化硅、氧化铝和聚对二甲苯，所述第一胶膜层与所述第三子层直接接触。
  14. 根据权利要求13所述的显示面板，其中，所述第一胶膜层的厚度大于所述第三子层的厚度的一半。
  15. 根据权利要求3所述的显示面板，其中，所述第二薄膜封装层包括依次远离所述基底且层叠设置的第四子层和第五子层，所述第四子层和第五子层的材料分别包括聚对二甲苯和氧化硅，所述第二胶膜层与所述第四子层直接接触。
  16. 根据权利要求1或2所述的显示面板，其中，所述发光器件层包括阵列排布的多个发光器件，每个发光器件包括依次远离所述基底的第一电极、发光功能部以及第二电极，
    对于任意相邻的两个发光器件，所述相邻两个发光器件的第一电极相互间隔设置，所述相邻两个发光器件的发光功能部为一体结构，所述相邻两个发光器件的第二电极为一体结构，
    所述彩膜层包括多个彩膜，与所述多个发光器件一一对应，对于每个发光器件，所述发光器件的第一电极在所述基底上的正投影落入所述发光器件对应的彩膜在所述基底上的正投影内。
  17. 根据权利要求16所述的显示面板，其中，所述多个发光器件包括依次相邻的第一发光器件、第二发光器件，所述第一发光器件的第一电极和所述第二发光器件的第一电极之间具有间隙，
    所述彩膜层包括具有不同颜色的第一彩膜和第二彩膜，所述第一彩膜和第二彩膜分别与所述第一发光器件和第二发光器件对应，所述第一彩膜和第二彩膜具有交叠部，
    所述间隙在所述基底上的正投影落入所述交叠部在所述基底上的正投影内。
  18. 根据权利要求17所述的显示面板，其中，所述第一发光器件的发光功能层和所述第二发光器件的发光功能部组成的一体结构填充所述间隙。
  19. 根权利要求1或2所述显示面板，其中所述基底为硅基底，所述显示面板为硅基显示面板。
  20. 一种显示装置，包括权利要求1-19中任一所述的显示面板。
  21. 一种显示面板的制造方法，其特征在于，所述制造方法包括：
    在基底上形成发光器件层；
    在所述发光器件层远离所述基底一侧形成第一薄膜封装层，所述第一薄膜封装层至少包括一层有机层；
    在所述第一薄膜封装层远离所述基底一侧形成彩膜层；以及
    在所述彩膜层远离所述基底一侧形成第二薄膜封装层，所述第二薄膜封装层至少包括一层有机层，
    其中，所述制造方法还包括：
    在所述彩膜层至少一侧形成与所述彩膜层接触且层叠设置的胶膜层，所述胶膜层材料的粘度大于所述第一薄膜封装层和第二薄膜封装层每一个中的所述有机层材料的粘度。
  22. 根据权利要求21所述方法，其中，在所述第一薄膜封装层远离所述基底一侧形成彩膜层之前，所述制造方法还包括：在所述第一薄膜封装层远离所述基 底一侧形成第一胶膜层；
    在所述彩膜层远离所述基底一侧形成第二薄膜封装层之前，所述制造方法还包括：在所述彩膜层远离所述基底一侧形成第二胶膜层。
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KR20160029179A (ko) * 2014-09-04 2016-03-15 (주)엘지하우시스 Oled 디스플레이용 배리어 필름
CN104701349A (zh) * 2014-12-16 2015-06-10 友达光电股份有限公司 可挠式面板
CN107359271A (zh) * 2017-06-20 2017-11-17 合肥市惠科精密模具有限公司 一种一体式amoled封装结构
CN107833977A (zh) * 2017-08-23 2018-03-23 江苏集萃有机光电技术研究所有限公司 一种有机发光显示器件及其制备方法
CN210723099U (zh) * 2019-12-06 2020-06-09 中国乐凯集团有限公司 一种用于柔性oled器件的柔性封装胶膜

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