WO2022111737A2 - 一种焊片分料机构以及分料方法 - Google Patents

一种焊片分料机构以及分料方法 Download PDF

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Publication number
WO2022111737A2
WO2022111737A2 PCT/CN2021/142905 CN2021142905W WO2022111737A2 WO 2022111737 A2 WO2022111737 A2 WO 2022111737A2 CN 2021142905 W CN2021142905 W CN 2021142905W WO 2022111737 A2 WO2022111737 A2 WO 2022111737A2
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WO
WIPO (PCT)
Prior art keywords
rack
pressing plate
solder
slidably arranged
lower pressing
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PCT/CN2021/142905
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English (en)
French (fr)
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WO2022111737A3 (zh
Inventor
徐正方
王辉
魏鹏
方勇
邬驰昊
Original Assignee
杭州泰尚智能装备有限公司
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Application filed by 杭州泰尚智能装备有限公司 filed Critical 杭州泰尚智能装备有限公司
Priority to ZA2022/01798A priority Critical patent/ZA202201798B/en
Publication of WO2022111737A2 publication Critical patent/WO2022111737A2/zh
Publication of WO2022111737A3 publication Critical patent/WO2022111737A3/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00—Separating articles from piles
    • B65H3/08—Separating articles from piles using pneumatic force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00—Separating articles from piles
    • B65H3/08—Separating articles from piles using pneumatic force
    • B65H3/0808—Suction grippers
    • B65H3/0816—Suction grippers separating from the top of pile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00—Separating articles from piles
    • B65H3/66—Article guides or smoothers, e.g. movable in operation

Definitions

  • the invention relates to the technical field of material distribution equipment, in particular to a solder chip material distribution mechanism and a material distribution method.
  • Electric vehicle refers to a vehicle that is powered by on-board power supply and driven by a motor, and meets the requirements of road traffic and safety regulations. Due to its smaller impact on the environment than traditional cars, its prospects are widely optimistic.
  • the solder tab is a key accessory used in the refrigeration structure of the new electric vehicle.
  • the solder tab is an aluminum sheet. During the production process of the solder tab, multiple sheets are usually stacked together to improve the production efficiency of the solder tab. When using, it is necessary to separate multiple pieces of solder chips stacked together. At present, manual material separation is used.
  • the present invention provides a solder chip distribution mechanism and a material distribution method, which solve the technical problems of easy adhesion and low solder chip distribution efficiency during solder chip distribution.
  • the solder chip material distribution mechanism of the present invention includes:
  • the material distribution device includes a cutting component, a mounting column vertically arranged on the base, a pressing component slidably arranged on the mounting column, and a translation component arranged on the mounting column; the pressing component can be partially stacked on the material rack;
  • the material cutting assembly includes a material cutting frame slidably arranged on the translation assembly and a material cutting trough slidably arranged on the material cutting frame, and the material cutting trough can be partially stacked on the pressing component;
  • the lifting device includes a lifting plate slidably arranged on the installation column, and the lifting plate is detachably connected with the material rack.
  • the material rack includes a material rack seat slidably arranged on the base, a plurality of guide posts vertically arranged on the material rack seat, and a slider sleeved on the guide pillar, the installation hole of the slider and the lifting plate of the lifting plate
  • the column is connected, and a plurality of solder lugs are sleeved on the guide column and located above the slider.
  • the material rack base includes a mobile table and an installation table stacked on the mobile table, the guide column is vertically arranged on the installation table, the positioning shaft of the mobile table is detachably connected with the shaft sleeve of the installation table, and the mobile table passes through the material rack
  • the guide rail is slidably arranged on the base, and the central axis of the installation hole is parallel to the guide rail of the material rack.
  • the lower pressing assembly includes a lower pressing frame and a lower pressing plate
  • the lower pressing frame is slidably arranged on the installation column and located below the translation assembly
  • the lower pressing plate is horizontally arranged on the lower pressing frame and can be stacked on the material rack.
  • a loading window is provided on the lower pressing plate, and the solder piece can pass upward through the loading window; the guide post can be inserted into the loading window, and the top end is lower than the upper surface of the lower pressing plate.
  • the material cutting assembly further includes an upper pressing plate, a material cutting groove is opened on the lower surface of the upper pressing plate, and the depth value of the material cutting groove is smaller than the thickness value of the soldering piece.
  • the translation assembly includes a translation frame, and the material cutting frame is slidably arranged on the translation frame through a horizontally arranged material cutting guide rail.
  • the lifting device further comprises a lifting screw, and the lifting plate is connected with the nut of the lifting screw.
  • the solder chip feeding mechanism further includes a feeding device, the feeding device includes a feeding seat and a feeding table arranged on the feeding seat, the feeding seat is slidably arranged on the base through the feeding guide rail, and the feeding table is horizontally arranged.
  • the upper end face is provided with a material placement groove.
  • a solder chip material distribution method comprising:
  • the lower pressing plate moves down the first set distance, so that the lower pressing plate is sleeved on the material rack;
  • the upper pressing plate moves downward so that the upper pressing plate is stacked on the lower pressing plate;
  • the lifting plate lifts the welding piece on the material rack upwards, so that the topmost welding piece part of the material rack is cut into the material trough;
  • the upper pressing plate moves horizontally by a second set distance
  • the suction nozzle absorbs the solder piece at the top of the material rack, and the blowing hole blows air;
  • the upper pressing plate moves upward for a third set distance and then moves horizontally above the feeding table, and the upper pressing plate moves downward and places the solder piece on the feeding table.
  • the material distribution process of the solder piece of the invention does not require manual participation, the material separation efficiency is high, and the labor cost is low; only the solder piece at the top of the material rack can be accommodated in the material cutting trough at a time, and each time the material cutting trough is translated, the topmost solder piece can be accommodated.
  • the solder piece is peeled off, and after multiple operations, the solder piece can be accurately separated into a single piece, avoiding the occurrence of multiple pieces of adhesion in the manual material separation process, thereby effectively improving the material separation accuracy.
  • FIG. 1 is a schematic diagram of a three-dimensional structure from a first perspective of the present invention
  • Fig. 2 is the three-dimensional structure schematic diagram of the second angle of view of the present invention.
  • Fig. 3 is the structural representation of the material rack of the present invention.
  • FIG. 4 is a schematic three-dimensional structure diagram of the material cutting assembly of the present invention.
  • FIG. 6 is a flow chart of the present invention.
  • the present invention provides a solder chip material distribution mechanism, which includes a base 100 , a material rack 1 , a material distribution device 2 and a lifting device 3 .
  • the material rack 1 is slidably arranged on the base 100 .
  • On the material rack 1 are placed the solder tabs 101 stacked up and down.
  • the material distribution device 2 includes a mounting column 21 , a pressing component 22 , a material cutting component 23 and a translation component.
  • the mounting column 21 is vertically arranged on the base 100
  • the lower pressing component 22 is slidably arranged on the mounting column 21
  • the lower pressing component 22 can be partially stacked on the material rack 1 .
  • the material cutting assembly 23 includes a material cutting frame 231 and a material cutting groove 232.
  • the translation assembly is arranged on the mounting post 21.
  • the slot 232 can partially overlap the push-down assembly 22 .
  • the lifting device 3 includes a lifting plate 31 , and the lifting plate 31 is slidably arranged on the mounting column 21 and can be connected with the material rack 1 .
  • the shape of the cutting groove 232 is the same as that of the solder lug 101 .
  • the material rack 1 includes a material rack seat 11 , a sliding block 12 and a plurality of guide posts 13 (preferably two).
  • the material rack seat 11 is slidably arranged on the base 100
  • the guide post 13 is vertically arranged on the material rack seat 11 .
  • the slider can be sleeved on the two guide posts 13 at the same time, and the soldering piece 101 is located above the slider.
  • the sliding block 12 is provided with a mounting hole 14
  • the lifting plate 31 is provided with a lifting column
  • the central axis of the mounting hole 14 and the central axis of the lifting column are collinear and both are arranged horizontally.
  • the material rack 11 includes a moving table 111 and a mounting table 112 stacked on the moving table 111 .
  • the guide post 13 is vertically arranged on the mounting table 112 .
  • the moving table 111 is provided with a positioning shaft
  • the mounting table 112 is provided with a shaft sleeve 113
  • the shaft sleeve 113 is detachably connected with the positioning shaft.
  • the moving table 111 is slidably disposed on the base 100 through the material rack guide rails 114 , and the extension direction of the material rack guide rails 114 is perpendicular to the movement direction of the translation assembly.
  • the central axis of the mounting hole 14 is parallel to the guide rail 114 of the material rack.
  • the lower pressing assembly 22 includes a lower pressing frame 221 , a lower pressing plate 222 and a lower pressing cylinder 223 .
  • the lower pressing frame 221 is slidably arranged on the mounting column 21 , and the lower pressing frame 221 is located below the translation assembly.
  • the lowering cylinder 223 is disposed on the translation assembly, and the lowering cylinder 223 drives the lowering frame 221 to move up and down along the mounting column 21 .
  • the lower pressing plate 222 is horizontally arranged on the lower pressing frame 221 .
  • the lower pressing plate 222 is provided with a feeding window matching the shape of the solder tab 101 , and the height of the top of the guide post 13 is lower than the height of the upper surface of the lower pressing plate 222 .
  • the material cutting assembly 23 further includes an upper pressing plate 233 , a mounting plate 234 , a material cutting cylinder 235 and a material cutting guide rod 236 .
  • the cutting guide rod 236 is vertically arranged on the cutting frame 231 through the linear bearing 237 , and the cutting guide rod 236 can slide up and down relative to the cutting frame 231 .
  • the upper end of the cutting guide rod 236 is connected to the mounting plate 234 , and the upper pressing plate 233 is horizontally disposed on the lower end of the cutting guide rod 236 .
  • the cylinder body of the cutting cylinder 235 is arranged on the mounting plate 234, and the piston rod is connected to the translation frame 241 of the translation assembly.
  • the cutting frame 231 is slidably disposed on the translation frame 241 .
  • the cutting groove 232 is opened on the lower surface of the upper pressing plate 233 .
  • the shape of the cutting groove 232 matches the shape of the solder piece 101 , and the solder piece 101 at the top of the material rack 1 can enter the cutting groove 232 .
  • the depth H of the cutting groove 232 is smaller than the thickness D of the solder tab 101 .
  • a gap 1000 with a width L is set between the lower surface of the upper pressing plate 233 and the upper surface of the lower pressing plate 222 , L is less than D, and D ⁇ L+H ⁇ 2D.
  • a plurality of air blowing holes may be opened at the bottom of the cutting groove 232 to be connected to the air supply equipment.
  • a plurality of suction nozzles can also be provided, connected to the vacuum generator, and the suction nozzles can absorb the solder pieces 101 in the cutting groove 232 .
  • the translation assembly includes a translation frame 241 , a translation motor 242 and a translation screw 243 .
  • the material cutting frame 231 is slidably arranged on the translation frame 241 through the horizontally arranged material cutting guide rails 245 .
  • the translation motor 242 and the translation screw rod 243 are both arranged on the translation frame 241.
  • the screw rod of the translation screw rod 243 is parallel to the cutting guide rail 245. Nut connection.
  • the lifting device 3 further includes a lifting motor 32 and a lifting screw 33 .
  • the screw rod of the lifting screw rod 33 is vertically arranged on the base 100, and is connected to the base 100 through the bearing rotation.
  • the lifting motor 32 is arranged on the base 100 , the rotating shaft of the lifting motor 32 is connected with the screw rod, and the lifting plate 31 is connected with the nut of the lifting screw rod 33 .
  • the solder chip feeding mechanism further includes a feeding device 4 for receiving the separated solder chips 101 , including a feeding table 41 , a feeding seat 42 and a feeding driving assembly 43 .
  • the material placing seat 42 is disposed on the base 100 through the material placing guide rail 44
  • the material placing drive assembly 43 is disposed on the material placing seat 42 .
  • the material placement table 41 is arranged on the material placement seat 42 , the upper end surface is horizontal, and the height is the same as the level when the lower pressing plate 222 is stacked on the material rack 1 .
  • the upper end surface of the material placement table 41 is provided with a material placement groove 45 that matches the shape of the soldering piece 101, a plurality of vacuum suction heads are arranged at the bottom of the groove, and the lower pressing plate 222 places the soldering piece 101 in the material cutting groove 232 on the material groove 45.
  • the present invention also provides a method for distributing solder pieces, which includes:
  • the plurality of solder tabs 101 are sleeved on the rack 1 , and the rack 1 on which the plurality of solder tabs 101 are placed is slid to the lower part of the lower pressing plate 222 .
  • the lower pressing plate 222 is sleeved on the guide post 13 of the material rack 1 , and the height of the top of the guiding post 13 is lower than the height of the upper surface of the lower pressing plate 222 .
  • the upper pressing plate 233 moves downward and is stacked on the lower pressing plate 222 .
  • the lifting plate 31 lifts the soldering piece 101 on the material rack 1 upward, so that the soldering piece 101 at the top of the material rack 1 enters the material cutting groove 232 .
  • the upper pressing plate 233 moves horizontally for a short distance, and the dislocation between the two overlapping solder pieces 101 is caused by the dislocation of the upper pressing plate 233 and the lower pressing plate 222 .
  • the suction nozzle adsorbs the solder piece 101 at the top of the material rack 1, and blows air through the blowing hole, so that the two superimposed solder pieces 101 are completely separated.
  • the upper pressing plate 233 moves upwards and moves horizontally above the feeding table 41 , so that the topmost solder piece 101 is separated from the material rack 1 .
  • the material distribution process is as follows: First, the material rack 1 sends the solder piece into the material cutting groove 232, so that the upper part of the first solder piece is located in the material cutting groove 232, the lower part is located in the gap 1000, and the upper part of the second solder piece is located in the gap 1000. Located in gap 1000, the lower part is located in the loading window. Secondly, under the action of the translation component, the upper pressing plate 233 moves horizontally for a certain distance, and a relative movement occurs between the upper pressing plate 233 and the lower pressing plate 222 in the horizontal direction, and the first solder piece is affected by the cutting groove 232 and follows the upper pressing plate 233.
  • the suction nozzle sucks the first solder pad and separates the first solder pad from the second solder pad by blowing air.
  • the upper pressing plate 233 moves upward for a certain distance, so that the first soldering piece and the second soldering piece are completely separated, and the cutting frame 231 moves horizontally along the cutting guide rail 245 under the action of the translation assembly, so that the upper pressing plate 233 is located in the position above the feed table 41 .
  • the upper pressing plate 233 moves downward and places the first solder piece on the material placement table 41 to complete the material distribution process.

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Abstract

本发明涉及一种焊片分料机构以及分料方法，包括料架、分料装置和提升装置。分料装置包括安装柱、下压组件、切料组件和平移组件。下压组件和平移组件均设置于安装柱上，下压组件能够部分叠置于料架上。切料组件包括切料架和切料槽，切料架滑动设置于平移组件上，切料槽滑动设置于切料架上，能够部分叠置于下压组件上。提升装置包括滑动设置于安装柱上的提升板。焊片的分料过程无需人工参与，分料效率高。切料槽每次平移都将最顶端的焊片剥离，避免多片粘连的情况发生，有效地提高了分料精度。

Description

一种焊片分料机构以及分料方法 技术领域
本发明涉及分料设备技术领域，尤其涉及一种焊片分料机构以及分料方法。
背景技术
电动汽车是指以车载电源为动力，用电机驱动车轮行驶，符合道路交通、安全法规各项要求的车辆。由于对环境影响相对传统汽车较小，其前景被广泛看好。而焊片是电动汽车新产品上用于制冷结构中的关键配件，焊片是一种铝制薄片，焊片生产过程中通常将多片叠置在一起，以提高焊片的生产效率。在使用时需要先将叠置在一起多片焊片单片分离，目前均采用人工分料，人工分料的分料精度低，容易造成几片贴合的没有分离的情况发生，严重影响了后续对焊片的使用，并且人工分料效率低，人工成本高，无法与全自动高速生产设备相匹配。
发明内容
鉴于现有技术的上述缺点和不足，本发明提供一种焊片分料机构以及分料方法，其解决了焊片分料时易粘连和焊片分料效率低的技术问题。
为了达到上述目的，本发明的焊片分料机构，包括：
底座、滑动设置于底座上的料架、分料装置和提升装置，料架用于放置多个叠置的焊片；
分料装置包括切料组件、竖直设置于底座上的安装柱、滑动设置于安装柱上的下压组件和设置于安装柱上的平移组件；下压组件能够部分叠置于料架上；切料组件包括滑动设置于平移组件上的切料架和滑动设置于切料架上的切料槽，切料槽能够部分叠置于下压组件上；
提升装置包括滑动设置于安装柱上的提升板，提升板与料架可拆卸连接。
优选地，料架包括滑动设置于底座上的料架座、竖直设置于料架座上 的多个导柱和套设于导柱上的滑块，滑块的安装孔与提升板的提升柱连接，多个焊片均套设于导柱上，且位于滑块的上方。
优选地，料架座包括移动台和叠置于移动台上的安装台，导柱竖直设置于安装台上，移动台的定位轴与安装台的轴套可拆卸连接，移动台通过料架导轨滑动设置于底座上，安装孔的中轴线与料架导轨平行。
优选地，下压组件包括下压架和下压板，下压架滑动设置于安装柱上，位于平移组件的下方，下压板水平设置于下压架上，能够叠置于料架上。
优选地，下压板上开设有上料窗口，焊片能够向上穿过上料窗口；导柱能够插入上料窗口内，且顶端低于下压板的上表面。
优选地，切料组件还包括上压板，上压板的下表面开设有切料槽，切料槽的深度值小于焊片的厚度值。
优选地，平移组件包括平移架，切料架通过水平设置的切料导轨滑动设置于平移架上。
优选地，提升装置还包括提升丝杆，提升板与提升丝杆的螺母连接。
优选地，焊片分料机构还包括置料装置，置料装置包括置料座和设置于置料座的置料台，置料座通过置料导轨滑动设置于底座上，置料台水平的上端面开设有置料凹槽。
一种焊片分料方法，包括：
将放置有多个焊片的料架滑动至下压板的下方；
下压板向下运动第一设定距离，使下压板套设在料架上；
上压板向下运动使上压板叠置于下压板上；
提升板向上提升料架上的焊片，使料架上位于最顶端的焊片部分进行切料槽内；
上压板水平移动第二设定距离；
吸嘴吸附料架上位于最顶端的焊片，吹气孔吹气；
上压板向上运动第三设定距离后水平移动至置料台的上方，上压板向下运动并将焊片放置在置料台上。
本发明焊片的分料过程无需人工参与，分料效率高，人工成本低；切料槽内每次只能容纳料架上位于最顶端的焊片，切料槽每次平移都将最顶端的焊片剥离，通过多次操作后能够精准地将焊片单片分离，避免人工分料过程中出现的多片粘连的情况发生，从而有效地提高了分料精度。
附图说明
图1为本发明第一视角的立体结构示意图；
图2为本发明第二视角的立体结构示意图；
图3为本发明料架的结构示意图；
图4为本发明切料组件的立体结构示意图；
图5为本发明切料组件的仰视图；
图6为本发明流程图。
具体实施方式
如图1～2所示，本发明提供一种焊片分料机构，包括底座100、料架1、分料装置2和提升装置3。料架1滑动设置于底座100上。料架1上放置有上下叠置的焊片101。分料装置2包括安装柱21、下压组件22、切料组件23和平移组件。安装柱21竖直设置于底座100上，下压组件22滑动设置于安装柱21上，下压组件22能够部分叠置于料架1上。切料组件23包括切料架231和切料槽232，平移组件设置于安装柱21上，切料架231滑动设置于平移组件上，切料槽232滑动设置于切料架231上，切料槽232能够部分叠置于下压组件22上。提升装置3包括提升板31，提升板31滑动设置于安装柱21上，能够与料架1连接。切料槽232的形状与焊片101相同。
如图3所示，料架1包括料架座11、滑块12和多个导柱13(优选两个)。料架座11滑动设置于底座100上，导柱13竖直设置于料架座11上。滑块能够同时套设在两个导柱13上，焊片101位于滑块的上方。滑块12上开设有安装孔14，提升板31上设置有提升柱，安装孔14的中轴线与提升柱的中轴线共线且均水平设置。
如图3所示，料架座11包括移动台111和叠置于移动台111上的安装台112。导柱13竖直设置于安装台112上。移动台111上设置有定位轴，安装台112上开设有轴套113，轴套113与定位轴可拆卸连接。如图1所示，移动台111通过料架导轨114滑动设置于底座100上，料架导轨114的延伸方向与平移组件的运动方向垂直。安装孔14的中轴线与料架导轨114平行。
如图1～2所示，下压组件22包括下压架221、下压板222和下压气缸223。下压架221滑动设置于安装柱21上，下压架221位于平移组件的下方。下压气缸223设置于平移组件上，下压气缸223驱动下压架221沿着安装柱21上下运动。下压板222水平设置于下压架221上。在下压板222上开设有与焊片101的形状相匹配的上料窗口，导柱13顶端的高度低于下压板222的上表面的高度。
如图4～5所示，切料组件23还包括上压板233、安装板234、切料气缸235和切料导杆236。切料导杆236通过直线轴承237竖直设置于切料架231上，切料导杆236能够相对于切料架231上下滑动。切料导杆236的上端与安装板234连接，上压板233水平设置于切料导杆236的下端。切料气缸235的缸体设置于安装板234上，活塞杆连接平移组件的平移架241。切料架231滑动设置于平移架241上。切料槽232开设于上压板233的下表面，切料槽232的形状与焊片101的形状相匹配，料架1顶端的焊片101能够进入切料槽232内。切料槽232的深度H小于焊片101的厚度D。上压板233的下表面与下压板222的上表面之间设置有宽度L的间隙1000，L小于D，并且D＜L+H＜2D。
切料槽232的槽底可以开设有多个吹气孔，连接供气设备。还可以设置有多个吸嘴，连接真空发生器，吸嘴能够吸附切料槽232内的焊片101。
如图2所示，平移组件包括平移架241、平移电机242和平移丝杆243。切料架231通过水平设置的切料导轨245滑动设置于平移架241上。平移电机242和平移丝杆243均设置于平移架241上，平移丝杆243的丝杆与切料导轨245平行，平移电机242的转轴与丝杆连接，切料架231与平移丝杆243的螺母连接。
如图1～2所示，提升装置3还包括提升电机32和提升丝杆33。提升 丝杆33的丝杆竖直设置于底座100上，通过轴承转动连接底座100。提升电机32设置于底座100上，提升电机32的转轴与丝杆连接，提升板31与提升丝杆33的螺母连接。
如图2所示，焊片分料机构还包括用于承接分离后的焊片101的置料装置4，包括置料台41、置料座42和置料驱动组件43。置料座42通过置料导轨44设置于底座100上，置料驱动组件43设置于置料座42上。置料台41设置于置料座42上，上端面水平，高度与下压板222叠置于料架1上时的水平高度相同。置料台41的上端面开设有与焊片101的形状相匹配的置料凹槽45，槽底设置有多个真空吸头，下压板222将切料槽232内的焊片101放置于置料凹槽45内。
本发明还提供一种焊片分料方法，其包括：
将多个焊片101套设在料架1上，并将放置有多个焊片101的料架1滑动至下压板222的下方。
下压板222向下运动套设在料架1的导柱13上，并且导柱13顶端的高度低于下压板222的上表面的高度。
上压板233向下运动叠置于下压板222上。
提升板31向上提升料架1上的焊片101，使料架1最顶端的焊片101进入切料槽232内。
上压板233水平移动一小段距离，通过上压板233和下压板222的错位使相互叠置的两块焊片101之间产生错位。
吸嘴吸附料架1最顶端的焊片101，吹气孔吹气，使两块叠置的焊片101彻底分离。
上压板233向上运动，水平移动至置料台41的上方，使位于最顶端的焊片101脱离料架1，上压板233向下运动并将焊片101放置在置料台41上。
分料过程如下：首先，料架1将焊片送入切料槽232内，使第一焊片的上部分位于切料槽232内，下部分位于间隙1000中，第二焊片的上部分位于间隙1000内，下部分位于上料窗口内。其次，在平移组件的作用下，上压板233水平移动一段距离，上压板233与下压板222之间在水平方向上产生相对运动，第一焊片受切料槽232的作用而随上压板233一起 运动，第二焊片则受上料窗口的限制无法运动，第一焊片和第二焊片之间产生错位。接着，吸嘴吸住第一焊片，并通过吹气将第一焊片和第二焊片分开。同时，上压板233向上运动一段距离，使第一焊片和第二焊片之间彻底分离，并在平移组件的作用下切料架231沿着切料导轨245水平移动，使上压板233位于置料台41的上方。最后，上压板233向下运动并将第一焊片放置在置料台41上，完成分料过程。

Claims (10)

  1. 一种焊片分料机构，其特征在于，包括：底座、滑动设置于所述底座上的料架、分料装置和提升装置，所述料架用于放置多个叠置的焊片；
    所述分料装置包括切料组件、竖直设置于所述底座上的安装柱、滑动设置于所述安装柱上的下压组件和设置于所述安装柱上的平移组件；所述下压组件能够部分叠置于所述料架上；所述切料组件包括滑动设置于所述平移组件上的切料架和滑动设置于所述切料架上的切料槽，所述切料槽能够部分叠置于所述下压组件上；
    所述提升装置包括滑动设置于所述安装柱上的提升板，所述提升板与所述料架可拆卸连接。
  2. 如权利要求1所述的焊片分料机构，其特征在于，所述料架包括滑动设置于所述底座上的料架座、竖直设置于所述料架座上的多个导柱和套设于所述导柱上的滑块，所述滑块的安装孔与所述提升板的提升柱连接，多个焊片均套设于所述导柱上，且位于所述滑块的上方。
  3. 如权利要求2所述的焊片分料机构，其特征在于，所述料架座包括移动台和叠置于所述移动台上的安装台，所述导柱竖直设置于所述安装台上，所述移动台的定位轴与所述安装台的轴套可拆卸连接，所述移动台通过料架导轨滑动设置于所述底座上，所述安装孔的中轴线与所述料架导轨平行。
  4. 如权利要求2所述的焊片分料机构，其特征在于，所述下压组件包括下压架和下压板，所述下压架滑动设置于所述安装柱上，位于所述平移组件的下方，所述下压板水平设置于所述下压架上，能够叠置于所述料架上。
  5. 如权利要求4所述的焊片分料机构，其特征在于，所述下压板上开设有上料窗口，焊片能够向上穿过所述上料窗口；所述导柱能够插入所述上料窗口内，且顶端低于所述下压板的上表面。
  6. 如权利要求5所述的焊片分料机构，其特征在于，所述切料组件还包括上压板，所述上压板的下表面开设有切料槽，所述切料槽的深度值小 于焊片的厚度值。
  7. 如权利要求1-6任意一项所述的焊片分料机构，其特征在于，所述平移组件包括平移架，所述切料架通过水平设置的切料导轨滑动设置于所述平移架上。
  8. 如权利要求1-6任意一项所述的焊片分料机构，其特征在于，所述提升装置还包括提升丝杆，所述提升板与所述提升丝杆的螺母连接。
  9. 如权利要求1-6任意一项所述的焊片分料机构，其特征在于，焊片分料机构还包括置料装置，所述置料装置包括置料座和设置于所述置料座的置料台，所述置料座通过置料导轨滑动设置于所述底座上，所述置料台水平的上端面开设有置料凹槽。
  10. 一种焊片分料方法，其特征在于，包括：
    将放置有多个焊片的料架滑动至下压板的下方；
    下压板向下运动第一设定距离，使下压板套设在料架上；
    上压板向下运动使上压板叠置于下压板上；
    提升板向上提升料架上的焊片，使料架上位于最顶端的焊片部分进行切料槽内；
    上压板水平移动第二设定距离；
    吸嘴吸附料架上位于最顶端的焊片，吹气孔吹气；
    上压板向上运动第三设定距离后水平移动至置料台的上方，上压板向下运动并将焊片放置在置料台上。
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