WO2022111334A1 - 激光器和投影设备 - Google Patents

激光器和投影设备 Download PDF

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Publication number
WO2022111334A1
WO2022111334A1 PCT/CN2021/130868 CN2021130868W WO2022111334A1 WO 2022111334 A1 WO2022111334 A1 WO 2022111334A1 CN 2021130868 W CN2021130868 W CN 2021130868W WO 2022111334 A1 WO2022111334 A1 WO 2022111334A1
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Prior art keywords
light
emitting
laser
components
chip
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PCT/CN2021/130868
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English (en)
French (fr)
Inventor
周子楠
田有良
张昕
卢云琛
Original Assignee
青岛海信激光显示股份有限公司
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Priority to CN202180075747.1A priority Critical patent/CN117178448A/zh
Publication of WO2022111334A1 publication Critical patent/WO2022111334A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2033—LED or laser light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2013—Plural light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2066—Reflectors in illumination beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2073—Polarisers in the lamp house
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers

Definitions

  • the present application relates to the field of optoelectronic technology, and in particular, to a laser and projection equipment.
  • lasers can be used as light sources in projection equipment.
  • Different light-emitting chips in the laser can emit red laser, green laser and blue laser respectively.
  • the polarization direction of red laser is different from that of blue laser and green laser. After passing through the optical path of the projection device, there will be a loss of light efficiency. Even the phenomenon of image color cast appears, resulting in poor projection display effect of the projection device.
  • a laser comprising: a tube case with an opening on one side, and a plurality of light-emitting components located in the accommodating space of the tube case and arranged in multiple rows and columns;
  • the light-emitting assembly includes a light-emitting chip and a reflection prism, the light-emitting chip is used for emitting laser light to the reflection prism, and the reflection prism is used for reflecting the laser light to the opening;
  • the plurality of light-emitting components include: a first light-emitting component and a second light-emitting component, the light-emitting chip in the first light-emitting component is perpendicular to the light-emitting direction of the light-emitting chip in the second light-emitting component, and the first light-emitting component is The light-emitting chip in the assembly and the light-emitting chip in the second light-emitting assembly have the same polarization direction after being reflected by the reflecting prism
  • a projection device comprising: the above-mentioned laser, as well as an optical machine and a lens
  • FIG. 1 is a schematic structural diagram of a laser provided by the related art
  • FIG. 2 is a schematic diagram of the propagation of a P-polarized light provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of the propagation of an S-polarized light provided by an embodiment of the present application.
  • FIG. 4 is a partial structural schematic diagram of a projection device provided by the related art
  • FIG. 5 is a schematic structural diagram of a laser provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another laser provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of still another laser provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another laser provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a laser provided by another embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another laser provided by another embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of still another laser provided by another embodiment of the present application.
  • FIG. 12 is a schematic diagram of a light spot formed by a laser emitted by a laser provided by an embodiment of the present application
  • FIG. 13 is a schematic structural diagram of another laser provided by another embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a laser according to another embodiment of the present application.
  • FIG. 15 is a schematic structural diagram of a projection device provided by an embodiment of the present application.
  • the lasers emitted by the current lasers include two types of lasers whose polarization directions are vertical, and the display effect of the projection screen formed by using the lasers of various polarization directions is poor, so the projection display effect of the projection device is poor.
  • a half-wave plate is also arranged in the projection device in the light-emitting direction of the laser to modulate the polarization directions of the two lasers to the same direction.
  • the projection device includes many structures, the volume of the projection device is relatively large, and it is difficult to realize the miniaturization of the projection device.
  • the laser 00 includes 20 light-emitting chips 002 , and the 20 light-emitting chips 002 are arranged in four rows and five columns, and the 20 light-emitting chips 002 all emit light in the y1 direction.
  • the x1 direction in FIG. 1 may be the row direction of the light-emitting chip
  • the y1 direction may be the column direction of the light-emitting chip
  • the x1 direction is perpendicular to the y1 direction.
  • the plurality of light emitting chips 002 in the laser 00 may include a red light emitting chip for emitting red laser light, a green light emitting chip for emitting green laser light, and a blue light emitting chip for emitting blue laser light.
  • the red laser is P-polarized light
  • the blue and green lasers are S-polarized light
  • the polarization directions of P-polarized light and S-polarized light are perpendicular.
  • FIG. 2 is a schematic diagram of the propagation of P-polarized light provided by an embodiment of the present application.
  • the polarization direction of the P-polarized light may be the direction p shown in FIG.
  • FIG. 3 is a schematic diagram of the propagation of S-polarized light according to an embodiment of the present application.
  • the polarization direction of the S-polarized light may be the direction s shown in FIG. 3
  • the waveform in FIG. 3 refers to the waveform of the light wave of the S-polarized light.
  • the direction p in plane A is perpendicular to the direction s.
  • the polarization direction of the red laser in the laser 00 shown in FIG. 1 is reflected by the reflecting prism 003 and then exits the laser 20, the polarization direction of the red laser is parallel to the y1 direction; the blue laser and the green laser are After being reflected by the reflecting prism 003 and then emitted from the laser 20, the polarization directions of the blue laser and the green laser are parallel to the x1 direction. Therefore, the polarization direction of the red laser light in the laser light finally emitted by the laser 20 shown in FIG. 1 is still perpendicular to the polarization directions of the blue laser light and the green laser light.
  • FIG. 4 is a partial structural schematic diagram of a projection device provided by the related art.
  • the projection device may include a laser 00 and a half-wave plate B.
  • the half-wave plate B is arranged corresponding to the part of the laser light emitted by the laser 20 , for example, the half-wave plate B is arranged in the transmission direction of the part of the laser light.
  • This part of the laser includes blue laser and green laser.
  • the laser 00 shown in FIG. 4 may be a schematic diagram after the left view of the laser 00 shown in FIG. 1 is turned 180 degrees.
  • the half-wave plate can be used to rotate the polarization direction of the laser to change the polarization polarity of the laser, so the polarization direction of the blue laser and green laser after passing through the half-wave plate becomes the same as the polarization direction of the red laser, and the projection equipment can use polarization
  • the red laser, blue laser and green laser in the same direction are projected, so as to realize the color uniformity of the laser projection picture.
  • the thickness of the half-wave plate is related to the wavelength of the laser light it transmits, in the related art, it is necessary to design the half-wave plate with corresponding thickness according to the wavelengths of the blue laser and green laser emitted by the laser.
  • the half-wave plate is obtained by crystal growth, and the cost of the half-wave plate is relatively high.
  • the half-wave plate also needs to be fixed with a bracket, and the fixing of the half-wave plate is difficult, and the setting of the half-wave plate needs to occupy a lot of space in the projection equipment. Therefore, in the related art, the cost of the projection device is relatively high and the volume is relatively large.
  • the following embodiments of the present application provide a laser.
  • Using the laser as a light source of a projection device can improve the projection display effect of the projection device, reduce the volume of the projection device, reduce the cost of the projection device, and facilitate the miniaturization of the projection device.
  • FIG. 5 is a schematic structural diagram of a laser provided by an embodiment of the present application
  • FIG. 6 is a schematic structural schematic diagram of another laser provided by an embodiment of the present application
  • FIG. 5 may be a top view of the laser shown in FIG. 6
  • the laser 20 includes a case 201 with an opening on one side, and a plurality of light-emitting components (not shown in the figures) located in the accommodating space of the case 201 .
  • Each light-emitting component includes a light-emitting chip (such as a first-type light-emitting chip 202a or a second-type light-emitting chip 202b) and a reflection prism 203, the light-emitting chip is used to emit laser light to the reflection prism 203, and the reflection prism 203 is used to reflect the laser light to the opening of the package 201, thereby realizing the light emission of the laser.
  • the surface of the reflective prism 203 facing the light-emitting chip may be a reflective surface, and the reflective surface is used to reflect laser light.
  • the plurality of light-emitting components are arranged in multiple rows and columns. As shown in FIG. 5 and FIG. 6 , the row direction of the plurality of light-emitting components is the x2 direction, and the column direction is the y2 direction.
  • the plurality of light-emitting components include a first light-emitting component and a second light-emitting component, wherein the light-emitting direction of the light-emitting chip in the first light-emitting component is perpendicular to the light-emitting direction of the light-emitting chip in the second light-emitting component, and the light-emitting direction in the first light-emitting component is perpendicular to the light-emitting direction of the light-emitting chip in the second light-emitting component.
  • the polarization direction of the laser light emitted by the chip after being reflected by the reflective prism is the same as the polarization direction of the laser light emitted by the light-emitting chip in the second light-emitting component after being reflected by the reflective prism, that is, the laser light emitted by the first light-emitting component and the second light-emitting component. the same polarization direction.
  • the light-emitting direction of the light-emitting chip refers to the transmission direction of the main light in the laser beam emitted by the light-emitting chip.
  • the light-emitting chip in the first light-emitting component is the first-type light-emitting chip 202a
  • the light-emitting chip in the second light-emitting component is the second-type light-emitting chip 202b
  • the light-emitting direction of the first-type light-emitting chip 202a is the same as that of the second-type light-emitting chip 202a.
  • the light emitting direction of the chip 202b is vertical.
  • the light-emitting direction of the first type of light-emitting chip 202a is the y2 direction
  • the light-emitting direction of the second type of light-emitting chip 202b is the x2 direction
  • the x2 direction is perpendicular to the y2 direction.
  • the light-emitting directions of the first type light-emitting chips 202 a and the second type light-emitting chips 202 b may be parallel or substantially parallel to the bottom surface M of the accommodating space of the package 201 , and the bottom surface is opposite to the opening of the package 201 .
  • the casing 201 may include a base plate 2011 and an annular casing wall 2012 on the base plate 2011 .
  • the light-emitting chip and the reflective prism 203 are mounted on the bottom plate 2011 and surrounded by the shell wall 2012 .
  • the bottom surface M of the accommodating space of the package 201 is the mounting surface of the bottom plate 2011 , that is, the surface of the bottom plate 2011 surrounded by the shell wall 2012 .
  • the light-emitting components in the laser are arranged in multiple rows and columns as an example. It is only necessary to ensure that the light-emitting direction of the first type of light-emitting chip is perpendicular to the light-emitting direction of the second type of light-emitting chip.
  • the polarization directions of the laser light emitted by the first type light emitting chip 202a and the second type light emitting chip 202b are perpendicular (also referred to as orthogonal), that is, the first type light emitting chip 202a is directed to the corresponding reflection
  • the polarization direction of the laser light from the prism 203 is perpendicular to the polarization direction of the laser light emitted from the second type light-emitting chip 202a to the corresponding reflecting prism 203 .
  • Corresponding light-emitting chips and reflecting prisms in the embodiments of the present application refer to light-emitting chips and reflecting prisms in the same light-emitting assembly.
  • the polarization direction of the laser light is perpendicular to the transmission direction of the laser light.
  • the light emitting directions of the first type light emitting chip 202a and the second type light emitting chip 202b are both parallel to the bottom surface M, and the light emitting direction of the first type light emitting chip 202a is perpendicular to the light emitting direction of the second type light emitting chip 202b.
  • the polarization direction of the laser light emitted by one type of light-emitting chips is parallel to the bottom surface M
  • the polarization direction of the laser light emitted by the other type of light-emitting chips is perpendicular to the bottom surface M.
  • the polarization direction of the laser light emitted by the first type of light-emitting chip 202a is perpendicular to the bottom surface M
  • the polarization direction of the laser light emitted by the second type of light-emitting chip 202b is parallel to the bottom surface M.
  • the light-emitting direction of one type of light-emitting chip 202a is parallel to the bottom surface M
  • the reflecting surface of the reflecting prism forms an acute angle with the bottom surface M, for example, the acute angle may be 45 degrees.
  • the polarization direction of the laser light directed to the reflecting surface is parallel to the reflecting surface, the polarization direction of the laser light will not change after the laser light is reflected by the reflecting surface. If the polarization direction of the laser intersects the reflective surface, after the laser is reflected by the reflective surface, the polarization direction of the laser will change, and the angle at which the polarization direction changes can be the same as the angle between the incident light and the reflected light.
  • the polarization direction of the laser light is the line direction, and the bottom surface of the accommodating space of the tube case and the reflecting surface of the reflecting prism form an acute angle. Therefore, when the polarization direction of the laser is parallel to the bottom surface M, the polarization direction of the laser is parallel to the reflective surface, and the polarization direction of the laser will not change after being reflected on the reflective prism; when the polarization direction of the laser is perpendicular to the bottom surface M, the laser The polarization direction of the laser intersects the reflective surface of the reflective prism, and the polarization direction of the laser will change after being reflected on the reflective prism. For example, the polarization direction can be rotated by 90 degrees.
  • the polarization direction of the laser light changes, that is, the polarization polarity of the laser light changes.
  • the laser light emitted by the first type of light-emitting chip and the second type of light-emitting chip both change from a transmission direction parallel to the bottom surface to a transmission direction perpendicular to the bottom surface, and the angle between the incident light and the reflected light of the laser is 90 degrees.
  • the polarization direction of the laser light emitted by the first type of light-emitting chip intersects with the reflective surface to which the laser light is directed, and then the polarization direction of the laser light changes by 90 degrees, becoming parallel to the bottom surface and parallel to the original transmission direction of the laser light.
  • the polarization direction of the laser light emitted by the second type of light-emitting chip is parallel to the reflective surface to which the laser light is directed, so the polarization direction of the laser light remains unchanged and is still parallel to the original transmission direction of the laser light emitted by the first type of light-emitting chip. Therefore, after the laser light emitted by each light-emitting chip is reflected on the reflective prism and emitted, the polarization direction of the laser light is the same.
  • the laser light emitted by the first type of light-emitting chip 202a may be P-polarized light
  • the laser light emitted by the second type of light-emitting chip 202b may be S-polarized light
  • the transmission directions of the P-polarized light and the S-polarized light are vertical.
  • the first type of light-emitting chip 202a is used for emitting red laser light
  • the second type of light-emitting chip 202b includes: a light-emitting chip for emitting green laser light and a light-emitting chip for emitting blue laser light, the red laser light is P-polarized light, and the blue laser light is and green laser are S-polarized light.
  • FIG. 7 is a schematic structural diagram of another laser provided by an embodiment of the present application, and FIG. 7 may be a schematic diagram of a section a-a' in the laser shown in FIG. 5 and FIG. 6 , and FIG. 7 emits light to the first type of light-emitting chip.
  • the propagation mode of the laser light is illustrated, and the waveform shown in FIG. 7 is used to illustrate the waveform of the light wave of the laser light emitted by the first type of light-emitting chip. As shown in FIG.
  • the laser light propagates toward the corresponding reflecting prism 203, the transmission direction of the laser light is parallel to the direction y2, and the polarization direction of the laser light is perpendicular to the base plate 2011, also That is, it is perpendicular to the y2 direction and the x2 direction in FIG. 5 or FIG. 6 .
  • the polarization direction of the laser light emitted by the first type light-emitting chip 202a intersects with the reflection surface of the corresponding reflection prism 203, after the laser light is reflected on the reflection surface of the reflection prism 203 and propagates away from the base plate 201, the The polarization direction changes and becomes parallel to the y2 direction. This case is also the case where the polarity of the laser is switched by 90 degrees.
  • FIG. 8 is a schematic structural diagram of another laser provided by an embodiment of the present application, and FIG. 8 may be a schematic diagram of a section bb' in the laser shown in FIGS. 5 and 6 , and FIG. 8 emits light to the second type of light-emitting chip. The propagation mode of the laser light is illustrated. As shown in FIG.
  • the laser light propagates toward the corresponding reflecting prism 203, the transmission direction of the laser light is parallel to the direction x2, and the polarization direction of the laser light is parallel to the base plate 201, and Perpendicular to the transmission direction x2 of the laser light, the polarization direction of the laser light is the direction perpendicular to the paper surface.
  • the direction perpendicular to the paper surface in FIG. 8 is the x2 direction in FIG. 5 , FIG. 6 and FIG. 7 , so the polarization direction of the laser is parallel to the x2 direction.
  • the polarization direction of the laser light is parallel to the reflective surface of the reflective prism 203, after the laser light is reflected on the reflective surface of the reflective prism 203 and propagates away from the base plate 2011, the polarization direction of the laser light does not change, and the polarization direction remains the same. parallel to the y2 direction. The polarization polarity of the laser has not changed.
  • the lasers emitted by the first type light-emitting chip 202a and the second type light-emitting chip 202b in the embodiment of the present application have the same polarization direction after the laser is emitted, and the polarization direction is parallel to the y2 direction, so the laser 20 can emit Lasers with the same polarization direction.
  • the laser 20 includes 12 light-emitting chips as an example for illustration.
  • the number of light-emitting chips in the laser 20 may also be 16, 12 or other numbers.
  • the embodiments of the present application are not limited.
  • the light-emitting chip in the first light-emitting component is perpendicular to the light-emitting direction of the light-emitting chip in the second light-emitting component, and the light-emitting chip in the first light-emitting component and the light-emitting chip in the second light-emitting component are perpendicular to the light-emitting direction.
  • the laser light emitted by the light-emitting chip has the same polarization direction after being reflected by the reflective prism, that is, the laser emits laser light with only one polarization direction. In this way, when the laser is used as the light source of the projection device, the light with only one polarization direction can be directly used to form the projection picture, which avoids the color cast phenomenon of the projection picture and improves the display effect of the projection picture.
  • the polarization directions of the laser beams emitted by the lasers are all the same directly, which solves the problem of color cast of the projection image from the source, so there is no need to add an additional half-wave plate in the projection equipment to adjust the polarization direction of the laser beams. There is no need to set a bulky fixing device for fixing the half-wave plate, which is beneficial to the miniaturization of the projection equipment.
  • the laser 20 may further include a plurality of heat sinks 204 , and each light-emitting component may further include a heat sink.
  • the light-emitting chips in each light-emitting assembly can be mounted on the base plate 2011 through the heat sink 204 , that is, the heat sink 204 is mounted on the base plate 2011 , and the light-emitting chips are mounted on the surface of the heat sink 204 away from the base plate 2011 .
  • the thermal conductivity of the heat sink can be relatively large, so that when the light-emitting chip emits heat to generate heat, the heat can be quickly dissipated to avoid damage to the light-emitting chip by the heat.
  • Materials such as heat sinks may include one or more of aluminum nitride and silicon carbide.
  • the material of the base plate may include one or more of oxygen-free copper and kovar material.
  • the base plate can assist the heat sink to conduct heat generated by the light-emitting chip.
  • the thickness of the bottom plate may range from 1 mm to 3 mm.
  • the plurality of light-emitting components in the laser may have various specific arrangements, and the following four arrangements are used as examples to introduce:
  • the plurality of light-emitting components arranged in multiple rows and columns in the laser may include multiple rows of first light-emitting components and multiple rows of second light-emitting components, and the first light-emitting components and the first light-emitting components
  • the two light-emitting assemblies are respectively located in two different regions staggered in the accommodating space of the tube shell.
  • the plurality of light-emitting components in the laser includes two rows of first light-emitting components and two rows of second light-emitting components.
  • the first light-emitting components are located in the first area Q1 on the bottom surface M of the accommodating space, and the first light-emitting components are located in the first area Q1 on the bottom surface M of the accommodating space.
  • the two light-emitting components are located in the second region Q2 on the bottom surface M, and the two regions are independent of each other and do not overlap.
  • the two regions may be located on either side of the midline of the bottom surface, respectively.
  • the embodiment of the present application takes the arrangement of the first area Q1 and the second area Q2 along the y2 direction as an example.
  • the two areas may also be arranged along the x2 direction.
  • the number of columns of light-emitting chips in the laser may range from 3 to 5, so that the size of the laser can be prevented from being too large, which is beneficial to the miniaturization of the laser.
  • the shape of the boundary between the first area and the second area may be a congruent figure, that is, the size of the first area and the second area are the same.
  • the bottom surface M can be equally divided into two regions, and the two regions are the first region and the second region. In this way, it can be ensured that light-emitting chips can also be set in any one of the two regions in the same manner as the light-emitting chips in the other region, so the package can also be used to set only one type of light-emitting chips, which improves the performance of the package. Universality.
  • the light-emitting components arranged in multiple rows and columns in the laser may include: multiple rows of first light-emitting components and multiple rows of second light-emitting components that are alternately arranged one by one along the column direction .
  • FIG. 9 is a schematic structural diagram of a laser provided by another embodiment of the present application. As shown in FIG. 9 , the light-emitting components in the laser 20 are arranged in four rows and four columns, including two rows of first light-emitting components and two rows of second light-emitting components, and the first light-emitting components and the second light-emitting components are along the column direction ( That is, the y2 direction) is alternately arranged.
  • the light-emitting components in the first row are all first light-emitting components
  • the light-emitting components in the second row are all second light-emitting components
  • the light-emitting components in the third row are all second light-emitting components.
  • the light-emitting components of each are the first light-emitting components
  • the light-emitting components in the fourth row are all the second light-emitting components.
  • the light-emitting components in the odd-numbered rows may also be the second light-emitting components, and the light-emitting components in the even-numbered rows may be the first light-emitting components, which is not limited in the embodiment of the present application.
  • each row of light-emitting components includes first light-emitting components and second light-emitting components that are alternately arranged one by one or alternately arranged in pairs.
  • Two light-emitting components each row of light-emitting components includes a first light-emitting component and a second light-emitting component which are alternately arranged one by one or alternately arranged in two. It should be noted that this arrangement can include four specific arrangements.
  • the first is that each row of light-emitting components and each column of light-emitting components include first light-emitting components and second light-emitting components that are alternately arranged one by one.
  • each row of light-emitting components and each column of light-emitting components include first light-emitting components and second light-emitting components that are alternately arranged in pairs;
  • Light-emitting components and second light-emitting components each column of light-emitting components includes first light-emitting components and second light-emitting components alternately arranged one by one;
  • the fourth is that each row of light-emitting components includes first light-emitting components and second light-emitting components alternately arranged one by one.
  • Two light-emitting components each row of light-emitting components includes first light-emitting components and second light-emitting components arranged alternately in pairs.
  • the two objects (such as A and B) that are alternately arranged in a certain direction in the embodiment of the present application means that two A's are arranged in this direction, then two B's are arranged, and then two B's are arranged. A, and so on.
  • FIG. 10 is a schematic structural diagram of another laser provided by another embodiment of the present application
  • FIG. 11 is a structural schematic diagram of another laser provided by another embodiment of the present application
  • FIG. 10 is a schematic diagram of the above four specific arrangements.
  • the first one of the methods is illustrated
  • FIG. 11 illustrates the third one of the above four specific arrangements
  • FIGS. 10 and 11 both take the light-emitting components in the laser 20 arranged in four rows and six columns as an example.
  • FIG. 10 is a schematic structural diagram of another laser provided by another embodiment of the present application
  • FIG. 10 is a schematic diagram of the above four specific arrangements.
  • the first one of the methods is illustrated
  • FIG. 11 illustrates the third one of the above four specific arrangements
  • FIGS. 10 and 11 both take the light-emitting components in the laser 20 arranged in four rows and six columns as an example.
  • FIG. 10 is a schematic structural diagram of another laser provided by another embodiment of the present application
  • FIG. 10 is a schematic diagram of the above four specific arrangements
  • the (2i-1)th light-emitting component in each row of light-emitting components is the first light-emitting component
  • the 2i-th light-emitting component is the second light-emitting component
  • the (2i-1)th light-emitting component in each column emits light
  • the component is the first light-emitting component
  • the 2ith light-emitting component is the second light-emitting component, where i ⁇ 1, also 2i-1 is an odd number, and 2i is an even number.
  • the first, third and fifth light-emitting components of each row of light-emitting components are the first light-emitting components, and the second, fourth and sixth light-emitting components are the second light-emitting components; each column of light-emitting components
  • the first and third light-emitting components are first light-emitting components, and the second and fourth light-emitting components are second light-emitting components.
  • the (4i-3)th light-emitting component and the (4i-2)th light-emitting component in each row of light-emitting components are the first light-emitting component
  • the component is a second light-emitting component
  • the (2i-1)th light-emitting component in each column of light-emitting components is the first light-emitting component
  • the 2i-th light-emitting component is the second light-emitting component.
  • the first, second, fifth and sixth light-emitting components of each row of light-emitting components are the first light-emitting components, and the third and fourth light-emitting components are the second light-emitting components;
  • the first and third light-emitting components are first light-emitting components, and the second and fourth light-emitting components are second light-emitting components.
  • the arrangement of the first light-emitting components in the tube shell is relatively uniform and dispersed, and the second light-emitting components in the tube shell are relatively uniformly distributed.
  • the arrangement is also more evenly dispersed. In this way, it can be ensured that even if only the first light-emitting component emits light or only the second light-emitting component emits light, the overall size of the light spot formed by the emitted laser is smaller than the light spot size when all light-emitting components are emitting light, and the size of the outgoing light spot of the laser is guaranteed. and the laser light emitted by the first light-emitting component and the second light-emitting component has a better light mixing effect, and the laser light emitted by the laser has a higher uniformity.
  • the light-emitting chips in the laser may be arranged based on the structure of the tube and case.
  • the bottom surface M of the accommodating space of the package 201 may have a target edge
  • the light-emitting direction of the first type light-emitting chip 202a is parallel to the target side
  • the light-emitting direction of the second type light-emitting chip 202b is perpendicular to the target edge.
  • the target edge is a rectangle
  • the target side is a long side of the rectangle.
  • the target side may also be the short side of the rectangle, which is not limited in this embodiment of the present application.
  • the light-emitting direction of the light-emitting chip is related to the target edge of the bottom surface as an example.
  • the light-emitting direction of the light-emitting chip may also be independent of the shape of the bottom surface and the target edge.
  • the light-emitting direction of one type of light-emitting chip may be perpendicular to the light-emitting direction of the second type of light-emitting chip.
  • the row direction of the light-emitting chips is perpendicular to the target side, and the arrangement direction of the first area Q1 and the second area Q2 is parallel to the target side of the bottom surface.
  • the arrangement direction of the first region Q1 and the second region Q2 may also be perpendicular to the target edge of the bottom surface, which is not limited in the embodiment of the present application. Please continue to refer to FIG. 5 and FIG. 6 .
  • the first type light-emitting chips 202 a and the second type light-emitting chips 202 b can also be arranged in multiple rows and columns.
  • the row and column directions of the light-emitting chips are the light-emitting components.
  • the row direction is the same as the column direction.
  • the number of columns of the first type light emitting chips 202a may be equal to the number of columns of the second type light emitting chips 202b, and the plurality of columns of the first type light emitting chips 202a may correspond to the plurality of columns of the second type light emitting chips 202b one-to-one.
  • the distance between each column of the first type light emitting chips 202a and the corresponding column of the second type light emitting chips 202b in the row direction is smaller than the distance threshold, that is, the distance between each column of the first type light emitting chips 202a and the corresponding column of the second type light emitting chips 202b in the row direction
  • the upward distance is closer.
  • the light spots formed by the laser light emitted by the plurality of light-emitting components in the laser may be arranged in multiple rows and columns, the centers of the light spots in each row may be collinear, and the centers of the light spots in each column may also be collinear.
  • each row of light spots is formed by the laser light emitted by one row of light-emitting components
  • each column of light spots is formed by the laser light emitted by one column of light-emitting components.
  • the centers of the light spots formed by the laser light emitted by the light-emitting chips in each row of light-emitting components after being reflected by the reflective prism are collinear, and the centers of the light spots formed by the laser light emitted by the light-emitting chips in each column of light-emitting components after being reflected by the reflecting prisms are collinear. Wire.
  • FIG. 12 is a schematic diagram of a light spot formed by a laser emitted by a laser provided in an embodiment of the present application, and FIG. 12 takes the arrangement of light-emitting components in the laser based on the above-mentioned first arrangement as an example.
  • the multiple light spots formed by the laser light emitted by the laser are arranged in multiple rows and multiple columns, and each light spot is a light spot formed after the laser light emitted by a light-emitting chip is reflected on a reflective prism.
  • the first two lines of light spots can be the light spots formed by the reflection of the laser light emitted by the first type of light-emitting chip on the reflective prism
  • the last two lines of light spots can be the light spots formed by the reflection of the laser light from the second type of light-emitting chip on the reflective prism.
  • each column of light spots may be a light spot formed by a column of laser light emitted by a first type of light-emitting chip and a corresponding column of laser light emitted by a second type of light-emitting chip. As shown in FIG.
  • the centers of multiple light spots in each column of light spots can be collinear, and the centers of multiple light spots in each row of light spots can also be collinear;
  • the centers of the line spots may all be located on the straight line g2. In this way, it can be ensured that the laser light emitted by the laser is relatively concentrated, which facilitates the light mixing of the laser light emitted by the laser, and ensures that the laser light emitted by the laser has a high uniformity.
  • the center of each light spot is located on the same vertical line as the center of the laser-injected area on the reflective prism, so the center of the laser-injected area on the reflective prism in each row of light-emitting components is collinear, which ensures that the The centers of the light spots formed by the laser light emitted by the light-emitting components in this row are collinear; the centers of the areas where the laser light is incident on the reflective prisms in each column of light-emitting components are collinear, which can ensure that the centers of the light spots formed by the laser light emitted by the light-emitting components in this column are collinear. Wire.
  • the position of the reflective prism corresponding to each light-emitting chip can be adjusted to ensure that the center of the laser-incident area on the reflective prism in each row of light-emitting components is collinear, and that each column of The centers of the regions where the laser light is incident on the reflective prism in the light-emitting component are collinear.
  • the size of the light spot formed by the laser light emitted by the first type of light-emitting chip may be larger than the size of the light spot formed by the laser light emitted by the second type of light-emitting chip. If please continue to refer to FIG.
  • the light spot formed by the laser light emitted by the light-emitting chip is elliptical, and the long axis of the ellipse is parallel to the light-emitting direction of the light-emitting chip, and the short axis is perpendicular to the light-emitting direction of the light-emitting chip;
  • the size of the light spot formed by the red laser is larger, and the size of the light spot formed by the green laser and the blue laser emitted by the second type of light-emitting chip is smaller.
  • the arrangement direction of the first area Q1 and the second area Q2 is parallel to the target side of the bottom surface, and the light emitting direction of the first type of light-emitting chip 202a is parallel to the target side, and the light emitting direction of the second type of light-emitting chip 202b is parallel to the target side.
  • the direction is perpendicular to the target side, so the arrangement direction of the first region Q1 and the second region Q2 is parallel to the light emitting direction of the first type of light-emitting chip.
  • the long axis of the light spot formed by the laser light emitted by the first type light-emitting chip 202a is parallel to the target side
  • the short axis is perpendicular to the target side
  • the long axis of the light spot formed by the laser light emitted by the second type light-emitting chip 202b is perpendicular to the target side. edge with the minor axis parallel to the target edge.
  • the size of the light spot formed by the laser light emitted by the first type of light-emitting chip 202a is the same as that of the laser light emitted by the second type of light-emitting chip 202b.
  • the size of the light spot (that is, the width of the long axis of the light spot) has a small difference. In this way, it can be ensured that the light spots of the laser light emitted by the laser are relatively evenly distributed, and the uniformity of the laser light emitted by the laser is guaranteed to be high.
  • the number of the first type light emitting chips 202a in the laser may be equal to the number of the second type light emitting chips 202b, and the number of rows of the first type light emitting chips 202a may be equal to the number of rows of the second type light emitting chips 202b.
  • the laser may include six first-type light-emitting chips 202a and six second-type light-emitting chips 202b, and the six first-type light-emitting chips 202a are arranged in a In two rows, the six second-type light-emitting chips 202b are also arranged in two rows.
  • the two rows of first-type light-emitting chips 2020a may both be light-emitting chips for emitting red laser light
  • the two rows of second-type light-emitting chips 202a may include: a row of light-emitting chips for emitting blue laser light, and a row of light-emitting chips for emitting green laser light Laser light-emitting chip. Since the laser emits laser light, it needs to be mixed to obtain white light. The red laser, green laser and blue laser can be mixed in a ratio of 2:1:1 to obtain white light. Therefore, two rows of light-emitting chips can be set to emit red laser light, and one row emits light. Chips are used to emit blue laser light, and a row of light-emitting chips is used to emit green laser light.
  • the number of different light-emitting chips can also be adjusted accordingly, for example, two rows of light-emitting chips for emitting green lasers can be arranged;
  • the light-emitting chip that emits laser light of other colors for example, a light-emitting chip for emitting yellow laser light may also be provided, which is not limited in the embodiment of the present application.
  • the light-emitting chip is in the shape of a strip
  • the light-emitting direction of the light-emitting chip is the same as the extending direction of the light-emitting chip (that is, the length direction of the strip)
  • the arrangement direction of the light-emitting chip and the reflecting prism in the light-emitting assembly is also the same. in the light-emitting direction of the light-emitting chip.
  • the second type of light-emitting chips 202b Since the light-emitting direction of the first type of light-emitting chips 202b is perpendicular to the row direction, the second type of light-emitting chips 202b The light-emitting direction of the light-emitting chips 202b is parallel to the row direction, so in the row direction, the area occupied by the second light-emitting chips 202b in each column is wider than the area occupied by the first light-emitting chips 202a in each column, so the column spacing of the first-type light-emitting chips 202a can be It is larger than the column pitch of the second type of light-emitting chips 202b.
  • the row spacing of the light-emitting chips in the laser can be equal, for example, the spacing between two adjacent rows of the first type of light-emitting chips 202a can be equal, and the spacing between two adjacent rows of the second type of light-emitting chips 202b can be equal, and the adjacent row of the first type of light-emitting chips 202b can have equal spacing.
  • the spacing between the light-emitting chips 202a and the second-type light-emitting chips 202b can also be equal; in a specific implementation, the row spacing of the first-type light-emitting chips and the row spacing of the second-type light-emitting chips can also be unequal, such as the first-type light-emitting chips
  • the row pitch of the chips may be smaller than the row pitch of the second type of light-emitting chips.
  • each light-emitting chip is mounted on the corresponding heat sink and then fixed to the bottom plate, for example, the light-emitting chip can be mounted in the middle position of the corresponding heat sink
  • the first type of light-emitting chip in the embodiment of the present application is
  • the heat sinks corresponding to the chips and the heat sinks corresponding to the second type of light-emitting chips may be arranged in multiple rows and columns, respectively.
  • the distance between the heat sinks may be used to represent the distance between the light-emitting chips.
  • the heat sink is rectangular, the length direction of the heat sink is the same as the length direction of the light emitting chip mounted thereon, and the width direction of the heat sink is the same as the width direction of the light emitting chip mounted thereon.
  • the length of the heat sink may range from 1.7 mm to 2.7 mm, and the width may range from 1.4 mm to 2.4 mm.
  • the column spacing range of the heat sink corresponding to the first type of light-emitting chip may be 3.6 mm to 6.6 mm, and the column spacing range of the heat sink corresponding to the second type of light-emitting chip may be 3.3 mm to 6.3 mm;
  • the row spacing of the sinks may range from 3.3 mm to 6.3 mm, and the row spacing of the heat sinks corresponding to the second type of light-emitting chips may range from 1.6 mm to 6.6 mm.
  • the foregoing content introduces the position of the light-emitting chip by taking the row spacing and column spacing of the first type of light-emitting chip and the second type of light-emitting chip satisfying certain conditions as an example.
  • the light-emitting center of the light-emitting chip is The spacing of the luminescent chips can also satisfy a certain condition, and then the position of each light-emitting chip can be determined according to the condition.
  • the light-emitting chip has a light-emitting port, the laser light emitted by the light-emitting chip is emitted from the light-emitting port, and the center point of the light-emitting port is the light-emitting center of the light-emitting chip.
  • the distance between the light-emitting centers of two adjacent first-type light-emitting chips is equal to the distance between the light-emitting centers of two adjacent first-type light-emitting chips.
  • the range of the distance can be 6 mm to 8 mm. In this way, it can be ensured that the laser light emitted by the first type of light-emitting chips in each row and the laser light emitted by the corresponding row of the second type of light-emitting chips are collinear with the center of the light spot formed after being reflected by the reflective prism.
  • the distance between the light-emitting centers of two adjacent first-type light-emitting chips and the distance between the light-emitting centers of two adjacent first-type light-emitting chips may be equal or unequal, such as in the column direction.
  • the distance between the light-emitting centers of the two adjacent first-type light-emitting chips may range from 6 mm to 8 mm, and the distance between the light-emitting centers of the two adjacent second-type light-emitting chips in the column direction may also be 3 mm. ⁇ 8 mm.
  • the distance between adjacent light-emitting chips is relatively large, which can ensure a better heat dissipation effect of the light-emitting chips when emitting light, and avoid damage to the light-emitting chips caused by heat accumulation.
  • the light-emitting directions of the light-emitting chips in each row of the first light-emitting components are the same and are perpendicular to the row direction, and the first light-emitting components in each row
  • the reflecting prisms in the second light-emitting components in each row are formed integrally; the light-emitting directions of the light-emitting chips in each column of the second light-emitting components are the same and parallel to the row direction, and the reflecting prisms in the second light-emitting components in each column are integrally formed.
  • the reflective prism can be in the shape of a strip, each reflective prism can correspond to a plurality of light-emitting chips, the light-emitting directions of the plurality of light-emitting chips are the same, and the light-emitting direction is parallel to the extension direction (that is, the length direction) of the reflective prism. ).
  • the reflective prisms corresponding to the multiple light-emitting chips only need to be pasted once, and the reflective prisms corresponding to each light-emitting chip do not need to be pasted separately, which reduces the laser manufacturing process and reduces the laser manufacturing complexity.
  • 13 is a schematic structural diagram of another laser provided by another embodiment of the present application. As shown in FIG.
  • the light-emitting direction of the light-emitting chips in the first light-emitting components in each row is the y2 direction, and the light-emitting directions of the light-emitting chips in the first light-emitting components in each row are in the y2 direction.
  • the reflecting prism is integrally formed into a strip-shaped reflecting prism.
  • the light-emitting direction of the light-emitting chips in each row of the second light-emitting components is the x2 direction, and the reflecting prisms in each row of the second light-emitting components are integrally formed into a strip-shaped reflecting prism.
  • each row of the first-type light-emitting chips 202a corresponds to one reflecting prism 203, and the light-emitting direction (ie, the y2 direction) of each row of the first-type light-emitting chips 202a is perpendicular to the extending direction (ie, the x2 direction) of the corresponding reflecting prism 203.
  • Each row of the second type light emitting chips 202b corresponds to one reflecting prism 203, and the light emitting direction (ie the x2 direction) of each row of the second type light emitting chips 202b is perpendicular to the extending direction (ie the y2 direction) of the corresponding reflecting prism 203 .
  • only two adjacent light-emitting chips may correspond to the same reflecting prism, or three adjacent light-emitting chips may correspond to the same reflecting prism, which is not limited in the embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a laser according to another embodiment of the present application.
  • the laser 20 may further include a sealing cover plate 205 , a sealing light-transmitting layer 206 and a collimating lens group 207 .
  • the sealing cover plate 205 is annular, and the outer edge of the sealing cover plate 205 is fixed to the surface of the shell wall 2012 away from the bottom plate 2011 .
  • the sealing light-transmitting layer 206 is located on the side of the sealing cover plate 205 away from the bottom plate 2011 , and the edge of the sealing light-transmitting layer 206 is fixed to the inner edge of the sealing cover plate 205 .
  • the package 201 , the sealing cover 205 and the light-transmitting sealing layer 206 may form a sealed space, and the light-emitting chip and the reflection prism in the laser 20 may be located in the sealed space.
  • the sealed space may be filled with an inert gas, such as nitrogen, to protect the light-emitting chip and prevent the light-emitting chip from being oxidized.
  • the collimating lens group 207 is located on the side of the transparent sealing layer 206 away from the bottom plate 2011, and the edge of the collimating lens group 207 is fixed to the outer edge of the sealing cover plate 205 away from the surface of the bottom plate 2011.
  • the collimating lens group 207 can be fixed by sticking, or can also be mechanically fixed.
  • the collimating lens group 207 includes a plurality of collimating lenses T one-to-one corresponding to each light-emitting chip in the laser.
  • the laser light emitted by each light-emitting chip can be directed to the corresponding collimating lens T after being reflected by the corresponding reflecting prism 203 , and then the collimating lens T can collimate the laser light and then emit the laser light.
  • collimating the light means converging the light to a certain extent, so that the divergence angle of the light becomes smaller and closer to parallel light.
  • each collimating lens corresponding to the first type light-emitting chip 202a in the collimating lens group 207 may be integrally formed, and each collimating lens corresponding to the second type light-emitting chip 202b may be integrally formed.
  • the collimating lens group 207 may include a first lens group 2071 and a second lens group 2072 that are independent of each other.
  • the first lens group includes each collimating lens corresponding to the first type of light-emitting chip 202a
  • the second lens group 2072 includes the second type of lens.
  • the laser light emitted by the first type of light-emitting chip and the laser light emitted by the second type of light-emitting chip can be respectively coupled, so as to ensure that the laser light emitted by the first type of light-emitting chip can be more accurately injected into the corresponding collimating lens in the first lens group. , and it is ensured that the laser light emitted by the second type of light-emitting chip can accurately enter the corresponding collimating lens in the second mirror group.
  • the structural shapes of the first mirror group and the second mirror group can also be designed separately, which improves the preparation flexibility of the collimating mirror group.
  • the shape of the collimating lens can be designed according to the shape of the light spot directed to each collimating lens, as shown in FIG. Rectangular, to ensure that the collimating lens can collect all the incident laser light on the basis of small size.
  • each collimating lens includes an opposite first surface and a second surface, the first surface is a rectangular plane close to the base plate relative to the second surface, and the second surface is a convex arc surface away from the base plate relative to the first surface. In the collimating lens group with matching light spots shown in Fig.
  • the long side of the first surface of the collimating lens in the first lens group is parallel to the y2 direction, and the short side is parallel to the x2 direction;
  • the long side of the first surface of the straight lens is parallel to the x2 direction, and the short side is parallel to the y2 direction.
  • This design method may also be referred to as a vertical arrangement of collimating lenses in the first mirror group, and a horizontal arrangement of collimating lenses in the second mirror group.
  • the thickness of the outer edge of the sealing cover plate 205 may be smaller than the preset thickness threshold, the thickness of the outer edge is relatively thin, and the outer edge may be fixed on the surface of the shell wall 2012 away from the bottom plate by parallel sealing technology.
  • the sealing cover 205 may be a sheet metal part, and the thickness of each position of the sealing cover 205 is the same or approximately the same. It should be noted that, when the outer edge of the sealing cover 205 and the shell wall 2012 are fixed by the parallel welding technology, the sealing cover 205 is first placed on the side of the shell wall 2012 away from the bottom plate 2011, and the sealing cover 205 is The outer edge overlaps the surface of the shell wall 2012 of the tube shell 201 away from the bottom plate 2011 .
  • the light-transmitting sealing layer 206 and the sealing cover plate 205 can be fixed first, for example, the edge of the light-transmitting sealing layer 206 and the sealing cover can be fixed by a sealant.
  • the inner edge of the plate 205 is fixed.
  • the material of the tube shell may be copper, such as oxygen-free copper
  • the material of the light-transmitting sealing layer may be glass
  • the material of the sealing cover plate may be stainless steel.
  • the thermal conductivity of copper is relatively large, and the material of the tube shell in the embodiment of the present application is copper, which can ensure that the heat generated by the light-emitting chip arranged on the bottom plate of the tube shell during operation can be quickly conducted through the tube shell. , and then dissipate quickly, avoiding damage to the light-emitting chip due to heat accumulation.
  • the material of the tube shell can also be one or more of aluminum, aluminum nitride and silicon carbide.
  • the material of the sealing cover plate in the embodiment of the present application can also be other Kovar materials, such as iron-nickel-cobalt alloy or other alloys.
  • the material of the light-transmitting sealing layer may also be other light-transmitting and highly reliable materials, such as resin materials.
  • opposite sides of the housing wall 2012 may have a plurality of openings
  • the laser 20 may further include: a plurality of conductive pins 208 , the plurality of conductive pins 208 may be respectively It extends into the accommodating space of the tube shell 201 through the opening in the shell wall 2012 , and is then fixed with the shell wall 2012 .
  • the conductive pins 208 can be electrically connected to the electrodes of the light-emitting chip to transmit external power to the light-emitting chip, thereby exciting the light-emitting chip to emit laser light.
  • the diameter of the opening may be 1.2 mm
  • the diameter of the conductive pin 208 may be 0.55 mm.
  • a ring-shaped solder structure (such as a ring-shaped glass bead) can be placed in the opening on the shell wall of the tube shell, and the conductive pins can be passed through the hole.
  • the shell wall is placed on the surrounding edges of the bottom plate, and annular silver-copper solder is placed between the bottom plate and the tube shell, and then the structure of the bottom plate, shell wall and conductive pins is placed in a high-temperature furnace for sealing and sintering.
  • the bottom plate, the shell wall, the conductive pins and the solder can be integrated, thereby realizing the airtightness at the opening of the shell wall.
  • the light-transmitting sealing layer and the sealing cover plate can also be fixed, for example, the edge of the light-transmitting sealing layer is pasted on the inner edge of the sealing cover plate to obtain the upper cover assembly. Then, the light-emitting chip, the heat sink assembly, and the reflective prism can be welded on the bottom plate of the casing, and then the upper cover assembly can be welded on the surface of the casing wall away from the bottom plate using the parallel sealing technology.
  • the above embodiments of the present application are all described by taking the bottom plate and the shell wall of the tube shell as two separate structures that need to be assembled as an example.
  • the bottom plate and the shell wall can also be integrally formed.
  • the bottom plate can be prevented from wrinkling due to the different thermal expansion coefficients of the bottom plate and the shell wall when the bottom plate and the shell wall are welded at high temperature, thereby ensuring the flatness of the bottom plate, ensuring the reliability of the arrangement of the light-emitting chip on the bottom plate, and ensuring that the light-emitting chip emits light.
  • the light emitted by the laser is emitted according to a predetermined light-emitting angle, so as to improve the light-emitting effect of the laser.
  • the light-emitting directions of the first type of light-emitting chip and the second type of light-emitting chip are perpendicular, and the laser light emitted by the first type of light-emitting chip and the second type of light-emitting chip is reflected by the reflective prism.
  • the polarization directions are the same, that is, the laser emits laser light with only one polarization direction. In this way, when the laser is used as the light source of the projection device, the light with only one polarization direction can be directly used to form the projection picture, which avoids the color cast phenomenon of the projection picture and improves the display effect of the projection picture.
  • FIG. 15 is a schematic structural diagram of a projection device provided by an embodiment of the present application.
  • the projection device may include: a laser 20 , an optical machine 30 and a lens 40 .
  • the laser 20 is used to emit light to the optical machine 30, and the optical machine 30 is used to modulate the incident light and then send it to the lens 40, and the lens 40 is used to project the incident light.
  • the laser may be any of the lasers 20 described above. Since the polarization directions of the laser light emitted by the laser 20 are the same, a projection device using the laser as a light source can form a projection image with better display effect according to the laser light with the same polarization direction.
  • the optical machine may include a lens group, a total internal reflection (TIR) prism group, and a light modulation component.
  • the light emitted from the light source assembly sequentially passes through the lens group, the total internal reflection prism (TIR) prism group and the light modulation component and then exits to the lens.
  • the light emitting surface of the light pipe and the light incident surface of the light modulation device are in a conjugate object-image relationship with each other.
  • the light modulation component can be a liquid crystal on silicon (Liquid Crystal on Silicon, LCOS), a liquid crystal display (Liquid Crystal Display, LCD) or a digital micromirror device (Digital Micromirror Device, DMD).

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Abstract

一种激光器（20）和投影设备，属于光电技术领域。激光器（20）包括：一面具有开口的管壳（201），以及位于管壳（201）的容置空间中且排布成多行多列的多个发光组件；发光组件包括发光芯片（202a、202b）和反射棱镜（203），发光芯片（202a、202b）用于向反射棱镜（203）发出激光，反射棱镜（203）用于将激光反射至开口；多个发光组件包括第一发光组件和第二发光组件，第一发光组件中的发光芯片（202a）与第二发光组件中的发光芯片（202b）的出光方向垂直，且第一发光组件中的发光芯片（202a）与第二发光组件中的发光芯片（202b）发出的激光通过反射棱镜（203）反射后的偏振方向相同。

Description

激光器和投影设备
本申请要求在2020年11月26日提交中国专利局、申请号为202011349275.8，发明名称为激光器和投影设备的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光电技术领域，特别涉及一种激光器和投影设备。
背景技术
随着光电技术的发展，激光器被广泛应用，如激光器可以作为光源被应用于投影设备中。激光器中不同的发光芯片可以分别发出红色激光、绿色激光和蓝色激光，红色激光的偏振方向与蓝色激光和绿色激光的偏振方向不同，在经过投影设备的光路后，会出现光效损失，甚至出现图像画面偏色的现象，导致投影设备的投影显示效果较差。
发明内容
本申请提供了一种激光器和投影设备，技术方案如下：
一方面，提供了一种激光器，所述激光器包括：一面具有开口的管壳，以及位于所述管壳的容置空间中且排布成多行多列的多个发光组件；
所述发光组件包括发光芯片和反射棱镜，所述发光芯片用于向所述反射棱镜发出激光，所述反射棱镜用于将所述激光反射至所述开口；
所述多个发光组件包括：第一发光组件和第二发光组件，所述第一发光组件中的发光芯片与所述第二发光组件中的发光芯片的出光方向垂直，且所述第一发光组件中的发光芯片与所述第二发光组件中的发光芯片发出的激光通过所述反射棱镜反射后的偏振方向相同
另一方面，提供了一种投影设备，所述投影设备包括：上述的激光器，以及光机和镜头
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是相关技术提供的一种激光器的结构示意图；
图2是本申请实施例提供的一种P偏振光的传播示意图；
图3是本申请实施例提供的一种S偏振光的传播示意图；
图4是相关技术提供的一种投影设备的部分结构示意图；
图5是本申请实施例提供的一种激光器的结构示意图；
图6是本申请实施例提供的另一种激光器的结构示意图；
图7是本申请实施例提供的再一种激光器的结构示意图；
图8是本申请实施例提供的又一种激光器的结构示意图；
图9是本申请另一实施例提供的一种激光器的结构示意图；
图10是本申请另一实施例提供的另一种激光器的结构示意图；
图11是本申请另一实施例提供的再一种激光器的结构示意图；
图12是本申请实施例提供的一种激光器发出的激光形成的光斑示意图；
图13是本申请另一实施例提供的又一种激光器的结构示意图；
图14是本申请再一实施例提供的一种激光器的结构示意图；
图15是本申请实施例提供的一种投影设备的结构示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施方式作进一步地详细描述。
随着光电技术的发展，投影设备中广泛采用激光器作为光源。目前的激光器发出的激光包括偏振方向垂直的两种激光，而采用多种偏振方向的激光形成的投影画面的显示效果较差，故导致投影设备的投影显示效果较差。且相关技术中为了保证用仅具有一种偏振方向的激光形成投影画面，在投影设备中还在激光器的出光方向上设置半波片，以将该两种激光的偏振方向调制为同一方向。但是该投影设备包括的结构较多，投影设备的体积较大，较难实现投影设备的小型化。
请继续参考图1，相关技术中，激光器00包括20个发光芯片002，且该20个发光芯片002排布成四行五列，该20个发光芯片002均朝y1方向发光。图1中的x1方向可以为该发光芯片的行方向，y1方向可以为该发光芯片的列方向，x1方向垂直于y1方向。
激光器00中的多个发光芯片002可以包括用于发出红色激光的红色发光芯片，用于发出绿色激光的绿色发光芯片和用于发出蓝色激光的蓝色发光芯片。其中，红色激光为P偏振光，蓝色激光和绿色激光为S偏振光，P偏振光和S偏振光的偏振方向垂直。需要说明的是，在P偏振光以非垂直角度穿透光学元件的表面时，P偏振光的偏振矢量处于包含入射光线与反射光线的平面中；在S偏振光以非垂直角度穿透光学元件的表面时，S偏振光的偏振矢量垂直包含入射光线与反射光线的平面。图2是本申请实施例提供的一种P偏振光的传播示意图。当P偏振光穿过图2所示的平面A时，该P偏振光的偏振方向可以为图2所示的方向p，图2中的波形指的是P偏振光的光波的波形。图3是本申请实施例提供的一种S偏振光的传播示意图。当S偏振光穿过图3所示的平面A时，该S偏振光的偏振方向可以为图3所示的方向s，图3中的波形指的是S偏振光的光波的波形。平面A中该方向p垂直于方向s。
结合图1、图2和图3可知，图1所示的激光器00中红色激光在经过反射棱镜003反射进而射出激光器20后，该红色激光的偏振方向平行于y1方向；蓝色激光和绿色激光在经过反射棱镜003反射进而射出激光器20后，该蓝色激光和绿色激光的偏振方向平行于 x1方向。因此，图1所示的激光器20最终发出的激光中红色激光的偏振方向仍垂直于蓝色激光和绿色激光的偏振方向。
图4是相关技术提供的一种投影设备的部分结构示意图。如图4所示，投影设备可以包括激光器00和半波片B，半波片B与激光器20发出的部分激光对应设置，如半波片B设置在该部分激光的传输方向上。该部分激光包括蓝色激光和绿色激光。图4所示的激光器00可以为图1所示的激光器00的左视图翻转180度之后的示意图。半波片可以用于旋转激光的偏振方向以改变激光的偏振极性，故蓝色激光和绿色激光在穿过半波片后偏振方向变为与红色激光的偏振方向一致，进而投影设备可以采用偏振方向相同的红色激光、蓝色激光和绿色激光进行投影，以便于实现激光投影画面的颜色均匀性。
由于半波片的厚度与其透过的激光的波长相关，故相关技术中需要根据激光器发出的蓝色激光和绿色激光的波长设计对应厚度的半波片。且半波片通过晶体生长得到，半波片的成本较高。半波片还需要用支架固定，半波片的固定难度较大，且设置半波片需要占用投影设备中较多的空间。因此，相关技术中该投影设备的成本较高，体积较大。
本申请以下实施例提供了一种激光器，采用该激光器作为投影设备的光源可以提高投影设备的投影显示效果，并减小投影设备的体积，降低投影设备的成本，便于投影设备的小型化。
图5是本申请实施例提供的一种激光器的结构示意图，图6是本申请实施例提供的另一种激光器的结构示意图，且图5可以为图6所示的激光器的俯视图。如图5和图6所示，激光器20包括一面具有开口的管壳201，以及位于管壳201的容置空间中的多个发光组件(图中未标出)。每个发光组件均包括发光芯片(如第一类发光芯片202a或第二类发光芯片202b)和反射棱镜203，发光芯片用于向反射棱镜203发出激光，该反射棱镜203用于将该激光反射至管壳201的开口，进而实现激光器的发光。示例地，反射棱镜203中朝向发光芯片的表面可以为反射面，该反射面用于反射激光。
本申请实施例中，该多个发光组件排布成多行多列，如图5与图6中该多个发光组件的行方向为x2方向，列方向为y2方向。该多个发光组件包括第一发光组件和第二发光组件，其中第一发光组件中的发光芯片的出光方向垂直于第二发光组件中的发光芯片的出光方向，且第一发光组件中的发光芯片发出的激光通过反射棱镜反射后的偏振方向，与第二发光组件中的发光芯片发出的激光通过反射棱镜反射后的偏振方向相同，也即是第一发光组件与第二发光组件发出的激光的偏振方向相同。本申请实施例中，发光芯片的出光方向指的是发光芯片发出的激光束中主光线的传输方向。示例地，该第一发光组件中的发光芯片为第一类发光芯片202a，第二发光组件中的发光芯片为第二类发光芯片202b，第一类发光芯片202a的出光方向与第二类发光芯片202b的出光方向垂直。例如，第一类发光芯片202a的出光方向为y2方向，第二类发光芯片202b的出光方向为x2方向，x2方向垂直于y2方向。
本申请实施例中，第一类发光芯片202a与第二类发光芯片202b的出光方向可以均平行于或大致平行于管壳201的容置空间的底面M，该底面与管壳201的开口相对。管壳201可以包括底板2011，以及位于底板2011上的环形的壳壁2012。发光芯片与反射棱镜203 贴装在该底板2011上，且被该壳壁2012围绕。管壳201的容置空间的底面M为该底板2011的贴装面，也即是底板2011中被壳壁2012包围的表面。需要说明的是，本申请实施例以激光器中的各个发光组件排布成多行多列为例，在一具体实施中该多个发光组件也可以散乱排布，或者按照其他方式排布，仅需保证第一类发光芯片的出光方向垂直于第二类发光芯片的出光方向即可。
本申请实施例中，第一类发光芯片202a与第二类发光芯片202b发出的激光的偏振方向垂直(也可以称为正交)，也即是由第一类发光芯片202a射向对应的反射棱镜203的激光的偏振方向，垂直于由第二类发光芯片202a射向对应的反射棱镜203的激光的偏振方向。本申请实施例中所述的对应的发光芯片与反射棱镜指的是同一发光组件中的发光芯片与反射棱镜。需要说明的是，激光的偏振方向垂直于该激光的传输方向。本申请实施例中，第一类发光芯片202a与第二类发光芯片202b的出光方向均向平行于底面M，第一类发光芯片202a的出光方向与第二类发光芯片202b的出光方向垂直。故第一类发光芯片202a与第二类发光芯片202b中，一类发光芯片发出的激光的偏振方向平行于底面M，另一类发光芯片发出的激光的偏振方向垂直于底面M。例如，第一类发光芯片202a发出的激光的偏振方向垂直于底面M，第二类发光芯片202b发出的激光的偏振方向平行于底面M第二类发光芯片202b发出的激光的偏振方向平行于第一类发光芯片202a的出光方向。
本申请实施例中，反射棱镜的反射面与底面M成一锐角，如该锐角可以为45度。对于射向反射棱镜的反射面的激光，若射向反射面的激光的偏振方向与该反射面平行，则该激光在被该反射面反射后，激光的偏振方向不会改变。若激光的偏振方向与该反射面相交，则该激光在被该反射面反射后，激光的偏振方向会改变，且偏振方向改变的角度可以与入射光与反射光的夹角相同。本申请实施例中激光的偏振方向为线方向，且管壳的容置空间的底面与反射棱镜的反射面成锐角。因此，在激光的偏振方向与底面M平行时，该激光的偏振方向平行于反射面，进而该激光在反射棱镜上反射后偏振方向不会改变；在激光的偏振方向与底面M垂直时，激光的偏振方向与反射棱镜的反射面相交，进而该激光在反射棱镜上反射后偏振方向会发生改变，如偏振方向可以旋转90度。
需要说明的是，激光的偏振方向发生改变也即是该激光的偏振极性发生改变。如第一类发光芯片与第二类发光芯片发出的激光均由平行于底面的传输方向变为垂直底面的传输方向，激光的入射光与反射光的夹角为90度。第一类发光芯片发出的激光的偏振方向与该激光射向的反射面相交，进而该激光的偏振方向改变90度，变为平行于底面且平行于该激光的原传输方向。第二类发光芯片发出的激光的偏振方向与该激光射向的反射面平行，故该激光的偏振方向不变，仍平行于第一类发光芯片发出的激光的原传输方向。因此，各个发光芯片发出的激光在反射棱镜上反射并射出后，激光的偏振方向均相同。
示例地，本申请实施例中第一类发光芯片202a发出的激光可以为P偏振光，第二类发光芯片202b发出的激光为S偏振光，且该P偏振光与该S偏振光的传输方向垂直。如第一类发光芯片202a用于发出红色激光，第二类发光芯片202b包括：用于发出绿色激光的发光芯片和用于发出蓝色激光的发光芯片，红色激光为P偏振光，蓝色激光和绿色激光均为S偏振光。
图7是本申请实施例提供的再一种激光器的结构示意图，图7可以为图5和图6所示的激光器中的截面a-a’的示意图，且图7对第一类发光芯片发出的激光的传播方式进行了示意，图7中示出的波形用于示意该第一类发光芯片发出的激光的光波的波形。如图7所示，第一类发光芯片202a在将激光射出后，该激光朝对应的反射棱镜203传播，该激光的传输方向平行于方向y2，且该激光的偏振方向垂直于底板2011，也即是垂直于y2方向以及图5或图6中的x2方向。由于第一类发光芯片202a射出的激光的偏振方向与对应的反射棱镜203中的反射面相交，故该激光在反射棱镜203的反射面上反射并朝远离底板201的方向传播后，该激光的偏振方向发生改变并变为平行于y2方向。此种情况也即是该激光进行了90度的极性转换的情况。
图8是本申请实施例提供的又一种激光器的结构示意图，图8可以为图5和图6所示的激光器中的截面b-b’的示意图，且图8对第二类发光芯片发出的激光的传播方式进行了示意。如图8所示，第二类发光芯片202b在将激光射出后，该激光朝对应的反射棱镜203传播，该激光的传输方向平行于方向x2，且该激光的偏振方向平行于底板201，并垂直于激光的传输方向x2，该激光的偏振方向为垂直于纸面的方向。需要说明的是，图8中垂直于纸面的方向即为图5、图6和图7中的x2方向，故该激光的偏振方向平行于x2方向。由于该激光的偏振方向与该反射棱镜203的反射面平行，故该激光在反射棱镜203的反射面上反射并朝远离底板2011的方向传播后，该激光的偏振方向不变，该偏振方向仍平行于y2方向。该激光的偏振极性并未发生改变。
结合图7与图8可知，本申请实施例中第一类发光芯片202a与第二类发光芯片202b发出的激光在射出激光器后偏振方向相同，偏振方向均平行于y2方向，故激光器20能够发出偏振方向均相同的激光。
需要说明的是，本申请实施例中以激光器20包括12个发光芯片为例进行示意，在一具体实施中，激光器20中发光芯片的个数也可以为16个、12个或者其他个数，本申请实施例不作限定。
综上所述，本申请实施例提供的激光器中，第一发光组件中的发光芯片与第二发光组件中的发光芯片的出光方向垂直，第一发光组件中的发光芯片和第二发光组件中的发光芯片发出的激光通过反射棱镜反射后的偏振方向相同，也即是激光器发出仅具有一种偏振方向的激光。如此一来，采用该激光器作为投影设备的光源时，便可以直接采用仅具有一种偏振方向的光线形成投影画面，避免投影画面出现的偏色现象，提高了投影画面的显示效果。
另外，本申请实施例中直接使激光器射出的激光的偏振方向均相同，从源头解决了投影画面偏色的问题，故可以无需再在投影设备中额外增加半波片调整激光的偏振方向，也无需设置体积较大的用于固定半波片的固定装置，有利于投影设备的小型化。
请继续参考图5至图8，激光器20还可以包括多个热沉204，每个发光组件还可以包括一个热沉。每个发光组件中的发光芯片可以通过热沉204贴装在底板2011上，也即是，热沉204贴装在底板2011上，发光芯片贴装在热沉204远离底板2011的表面上。在一具体实施中，热沉的导热系数可以较大，进而可以在发光芯片发光产生热量时快速将该热量 导出，避免该热量对发光芯片的损坏。如热沉的材料可以包括氮化铝和碳化硅中的一种或多种。在一具体实施中，底板的材料可以包括无氧铜和可伐材料中的一种或多种。当底板的材料包括无氧铜时，由于无氧铜的导热系数也较大，此时底板可以辅助热沉对发光芯片产生的热量进行传导。在一具体实施中，底板的厚度范围可以为1毫米～3毫米。
本申请实施例中，激光器中该多个发光组件可以有多种具体排布方式，下面以其中的四种排布方式为例进行介绍：
在发光组件的第一种排布方式中，激光器中排布成多行多列的该多个发光组件可以包括多行第一发光组件和多行第二发光组件，且第一发光组件与第二发光组件分别位于管壳的容置空间中错开的两个不同区域。如图5与图6所示，激光器中的多个发光组件包括两行第一发光组件和两行第二发光组件，第一发光组件位于容置空间的底面M上的第一区域Q1，第二发光组件位于底面M上的第二区域Q2，该两个区域相互独立，不存在交叠。例如该两个区域可以分别位于底面的中线的两侧。需要说明的是，本申请实施例以该第一区域Q1与第二区域Q2沿y2方向排布为例，在一具体实施中，该两个区域也可以沿x2方向排布，本申请实施例不做限定。在一具体实施中，激光器中发光芯片的列数范围可以为3～5，如此可以避免激光器的尺寸过大，有利于激光器的小型化。
在一具体实施中，该第一区域与第二区域的边界形状可以为全等图形，也即是第一区域与第二区域的尺寸相同。示例地，可以将底面M均分为两个区域，该两个区域即为第一区域和第二区域。如此可以保证在该两个区域中任一区域中也可以采用另一区域中的发光芯片的设置方式设置发光芯片，故该管壳还可以用于仅设置一类发光芯片，提高了管壳的通用性。
在发光组件的第二种排布方式中，激光器中的排布成多行多列的发光组件可以包括：沿列方向一一交替排布的多行第一发光组件和多行第二发光组件。示例地，图9是本申请另一实施例提供的一种激光器的结构示意图。如图9所示，该激光器20中的发光组件排布成四行四列，其中包括两行第一发光组件和两行第二发光组件，第一发光组件与第二发光组件沿列方向(也即是y2方向)交替排布。如从上到下的顺序(也即是沿y2方向的反方向)第一行中的发光组件均为第一发光组件，第二行中的发光组件均为第二发光组件，第三行中的发光组件均为第一发光组件，第四行中的发光组件均为第二发光组件。在一具体实施中，也可以奇数行的发光组件均为第二发光组件，偶数行中的发光组件均为第一发光组件，本申请实施例不做限定。
在发光组件的第三种排布方式中，激光器中的排布成多行多列的发光组件中，每行发光组件包括一一交替排布或两两交替排布的第一发光组件和第二发光组件，每列发光组件包括一一交替排布或两两交替排布的第一发光组件和第二发光组件。需要说明的是，该种排布方式中又可以包括四种具体排布方式，第一种为每行发光组件与每列发光组件均包括一一交替排布的第一发光组件和第二发光组件；第二种为每行发光组件与每列发光组件均包括两两交替排布的第一发光组件和第二发光组件；第三种为每行发光组件包括两两交替排布的第一发光组件和第二发光组件，每列发光组件包括一一交替排布的第一发光组件和第二发光组件；第四种为每行发光组件包括一一交替排布的第一发光组件和第二发光组件， 每列发光组件包括两两交替排布的第一发光组件和第二发光组件。本申请实施例中所述的两物体(如A和B)沿某一方向两两交替排布指的是，沿该方向排布两个A之后再排布两个B接着再排布两个A，以此类推。
下面仅对该四种具体排布方式中的第一种和第三种进行示意。示例地，图10是本申请另一实施例提供的另一种激光器的结构示意图，图11是本申请另一实施例提供的再一种激光器的结构示意图，图10对上述四种具体排布方式中的第一种进行示意，图11对上述四种具体排布方式中的第三种进行示意，且图10和11均以激光器20中的发光组件排布成四行六列为例。如图10所示，每行发光组件中第(2i-1)个发光组件为第一发光组件，第2i个发光组件为第二发光组件，每列发光组件中第(2i-1)个发光组件为第一发光组件，第2i个发光组件为第二发光组件，其中i≥1，也是2i-1为奇数，2i为偶数。如图10中每行发光组件第一个、第三个和第五个发光组件为第一发光组件，第二个、第四个和第六个发光组件为第二发光组件；每列发光组件中第一个和第三个发光组件为第一发光组件，第二个和第四个发光组件为第二发光组件。如图11所示，每行发光组件中第(4i-3)个发光组件和第(4i-2)个发光组件为第一发光组件，第(4i-1)个发光组件和第4i个发光组件为第二发光组件；每列发光组件中第(2i-1)个发光组件为第一发光组件，第2i个发光组件为第二发光组件。如图11中每行发光组件第一个、第二个、第五个和第六个发光组件为第一发光组件，第三个和第四个为第二发光组件；每列发光组件中第一个和第三个发光组件为第一发光组件，第二个和第四个发光组件为第二发光组件。
需要说明的是，对于上述发光组件的第二种排布方式与第三种排布方式的激光器，第一发光组件在管壳中的排布较为均匀分散，第二发光组件在管壳中的排布也较为均匀分散。如此可以保证即使仅有第一发光组件发光或者仅有第二发光组件发光，发出的激光形成的光斑的整体尺寸与所有发光组件均发光时的光斑尺寸相差较小，保证激光器的出射光斑的尺寸稳定；且第一发光组件与第二发光组件发出的激光的混光效果较好，激光器发出的激光的均匀性较高。
本申请实施例中，可以基于管壳的结构对激光器中的发光芯片进行排布。示例地，请继续参考图5，管壳201的容置空间的底面M可以具有目标边，第一类发光芯片202a的出光方向平行于该目标边，第二类发光芯片202b的出光方向垂直于该目标边。示例地，该底面呈矩形，该目标边为该矩形的长边。该目标边也可以为该矩形的短边，本申请实施例不做限定。本申请实施例的附图中均以发光芯片的出光方向与底面的目标边相关为例，在一具体实施中，发光芯片的出光方向也可以与底面的形状及目标边无关，仅需保证第一类发光芯片的出光方向垂直第二类发光芯片的出光方向即可。
示例地，在发光组件的上述第一种排布方式中，发光芯片的行方向垂直于该目标边，第一区域Q1与第二区域Q2的排布方向平行于底面的目标边，本申请实施例中第一区域Q1与第二区域Q2的排布方向也可以垂直于底面的目标边，本申请实施例不做限定。请继续参考图5与图6，本申请实施例中第一类发光芯片202a和第二类发光芯片202b也可以均排布成多行多列，发光芯片的行方向与列方向即为发光组件的行方向相同与列方向。第一类发光芯片202a的列数可以与第二类发光芯片202b的列数相等，该多列第一类发光芯片 202a可以与该多列第二类发光芯片202b一一对应。每列第一类发光芯片202a与对应的一列第二类发光芯片202b在行方向上的距离小于距离阈值，也即是每列第一类发光芯片202a与对应的一列第二类发光芯片202b在行方向上距离较近。每列第一类发光芯片202a发出的激光与对应的一列第二类发光芯片202b发出的激光在经过反射棱镜203反射后，形成的光斑的中心可以共线。
本申请实施例中，激光器中的多个发光组件发出的激光形成的光斑可以排布成多行多列，每行光斑的中心可以共线，每列光斑的中心也可以共线。其中每行光斑由一行发光组件发出的激光形成，每列光斑由一列发光组件发出的激光形成。也即是，每行发光组件中发光芯片发出的激光在经过反射棱镜反射后形成的光斑的中心共线，每列发光组件中发光芯片发出的激光在经过反射棱镜反射后形成的光斑的中心共线。
示例地，图12是本申请实施例提供的一种激光器发出的激光形成的光斑示意图，且图12以该激光器中的发光组件基于上述第一种排布方式排布为例。如图12所示，激光器发出的激光形成的多个光斑排布成多行多列，每个光斑为一个发光芯片发出的激光在反射棱镜上反射后形成的光斑。图12中前两行光斑可以为第一类发光芯片发出的激光在反射棱镜上反射后形成的光斑，后两行光斑可以为第二类发光芯片发出的激光在反射棱镜上反射后形成的光斑，每列光斑可以为一列第一类发光芯片发出的激光与对应的一列第二类发光芯片发出的激光形成的光斑。如图12所示，每列光斑中多个光斑的中心可以共线，每行光斑中的多个光斑的中心也可以共线；如第一列光斑的中心可以均位于直线g1上，第一行光斑的中心可以均位于直线g2上。如此可以保证激光器发出的激光较为聚集，便于激光器发出的激光的混光，保证了激光器发出的激光的均匀性较高。
需要说明的是，每个光斑的中心与反射棱镜上激光射入的区域的中心位于同一垂线上，故每行发光组件中的反射棱镜上激光射入的区域的中心共线，便可以保证该行发光组件发出的激光形成的光斑的中心共线；每列发光组件中的反射棱镜上激光射入的区域的中心共线，便可以保证该列发光组件发出的激光形成的光斑的中心共线。本申请实施例中，在贴装反射棱镜时可以通过调整每个发光芯片对应的反射棱镜的位置，进而保证每行发光组件中的反射棱镜上激光射入的区域的中心共线，以及每列发光组件中的反射棱镜上激光射入的区域的中心共线。
本申请实施例中第一类发光芯片发出的激光形成的光斑的尺寸，可以大于第二类发光芯片发出的激光形成的光斑的尺寸。如请继续参考图12，发光芯片发出的激光形成的光斑呈椭圆形，且该椭圆的长轴平行于发光芯片的出光方向，短轴垂直于发光芯片的出光方向；第一类发光芯片发出的红色激光形成的光斑的尺寸较大，第二类发光芯片发出的绿色激光和蓝色激光形成的光斑的尺寸较小。本申请实施例中，第一区域Q1与第二区域Q2的排布方向平行于底面的目标边，且第一类发光芯片202a的出光方向平行于该目标边，第二类发光芯片202b的出光方向垂直于该目标边，故第一区域Q1与第二区域Q2的排布方向平行于第一类发光芯片的出光方向。因此，第一类发光芯片202a发出的激光形成的光斑的长轴平行于该目标边，短轴垂直于该目标边，第二类发光芯片202b发出的激光形成的光斑的长轴垂直于该目标边，短轴平行于该目标边。在垂直于目标边的方向(也即x2方向) 上，第一类发光芯片202a发出的激光形成的光斑的尺寸(也即该光斑的短轴宽度)与第二类发光芯片202b发出的激光形成的光斑的尺寸(也即该光斑的长轴宽度)差异较小。如此可以保证激光器发出的激光的光斑较为均匀地分布，保证激光器发出的激光的均匀性较高。
在一具体实施中，激光器中的第一类发光芯片202a的数量可以等于第二类发光芯片202b的数量，第一类发光芯片202a的行数可以等于第二类发光芯片202b的行数。示例地，本申请实施例中如图5和6所示，激光器可以包括6个第一类发光芯片202a和6个第二类发光芯片202b，且该6个第一类发光芯片202a排布成两行，该6个第二类发光芯片202b也排布成两行。该两行第一类发光芯片2020a可以均为用于发出红色激光的发光芯片，该两行第二类发光芯片202a可以包括：一行用于发出蓝色激光的发光芯片，以及一行用于发出绿色激光的发光芯片。由于激光器发出激光需要进行混光以得到白光，红色激光、绿色激光和蓝色激光以2:1:1的配比混合可以得到白光，故可以设置两行发光芯片用于发出红色激光，一行发光芯片用于发出蓝色激光，以及一行发光芯片用于发出绿色激光。在一具体实施中，在需要激光器发出的激光满足其他颜色的要求时，也可以相应地调整不同发光芯片的数量，如也可以设置两行用于发出绿色激光的发光芯片；或者也可以设置用于发出其他颜色的激光的发光芯片，如也可以设置用于发出黄色激光的发光芯片，本申请实施例不做限定。
本申请实施例中，发光芯片呈条状，发光芯片的出光方向与该发光芯片的延伸方向(也即条状的长度方向)相同，且发光组件中发光芯片与反射棱镜的排布方向也相同于发光芯片的出光方向。对于发光组件的上述第一种排布方式中均排成多行多列的第一类发光芯片和第二类发光芯片，由于第一类发光芯片202b的出光方向与其行方向垂直，第二类发光芯片202b的出光方向与其行方向平行，故在行方向上，每一列第二发光芯片202b占用的区域宽于每一列第一发光芯片202a占用的区域，所以第一类发光芯片202a的列间距可以大于第二类发光芯片202b的列间距。激光器中的发光芯片的行间距可以相等，如相邻的两行第一类发光芯片202a的间距可以相等，相邻的两行第二类发光芯片202b的间距可以相等，相邻的一行第一类发光芯片202a与第二类发光芯片202b的间距也可以相等；在一具体实施中，第一类发光芯片的行间距与第二类发光芯片的行间距也可以不相等，如第一类发光芯片的行间距可以小于第二类发光芯片的行间距。
在一具体实施中，由于每个发光芯片贴装在对应的热沉上后再与底板固定，如发光芯片可以贴装在对应的热沉的中间位置，故本申请实施例中第一类发光芯片对应的热沉以及第二类发光芯片对应的热沉可以分别排布成多行多列，本申请实施例中可以通过热沉之间的距离表征发光芯片的距离。示例地，热沉呈矩形，热沉的长度方向与其上贴装的发光芯片的长度方向相同，热沉的宽度方向与其上贴装的发光芯片的宽度方向相同。热沉的长度范围可以为1.7毫米～2.7毫米，宽度范围可以为1.4毫米～2.4毫米。第一类发光芯片对应的热沉的列间距范围可以为3.6毫米～6.6毫米，第二类发光芯片对应的热沉的列间距范围可以为3.3毫米～6.3毫米；第一类发光芯片对应的热沉的行间距范围可以为3.3毫米～6.3毫米，第二类发光芯片对应的热沉的行间距范围可以为1.6毫米～6.6毫米。
需要说明的是，前述内容以第一类发光芯片和第二类发光芯片的行间距与列间距满足一定的条件为例对发光芯片的位置进行介绍，在一具体实施中，发光芯片的发光中心的间距也可以满足一定的条件，进而根据该条件可以确定各个发光芯片的位置。发光芯片具有出光口，发光芯片发出的激光从该出光口射出，该出光口的中心点即为发光芯片的发光中心。示例地，在行方向上，相邻的两个第一类发光芯片的发光中心的距离与相邻的两个第一类发光芯片的发光中心的距离相等，如该距离所在的范围均可以为6毫米～8毫米。如此可以保证每列第一类发光芯片发出的激光与对应的一列第二类发光芯片发出的激光，在经过反射棱镜反射后形成的光斑的中心共线。示例地，在列方向上，相邻的两个第一类发光芯片的发光中心的距离与相邻的两个第一类发光芯片的发光中心的距离可以相等也可以不相等，如在列方向上相邻的两个第一类发光芯片的发光中心的距离范围可以为6毫米～8毫米，在列方向上相邻的两个第二类发光芯片的发光中心的距离范围也可以为3毫米～8毫米。本申请实施例中，相邻的发光芯片之间的距离较大，可以保证发光芯片在发光时的散热效果较好，避免热量积聚导致对发光芯片的损伤。
在一具体实施中，本申请实施例中对于上述发光芯片的第一种排布方式，每行第一发光组件中发光芯片的出光方向均相同且均垂直于行方向，每行第一发光组件中的反射棱镜一体成型；每列第二发光组件中发光芯片的出光方向均相同且均平行于行方向，每列第二发光组件中的反射棱镜一体成型。示例地，反射棱镜可以呈条状，每个反射棱镜可以与多个发光芯片对应，该多个发光芯片的出光方向均相同，且该出光方向平行于该反射棱镜的延伸方向(也即长度方向)。如此对于多个发光芯片对应的反射棱镜仅需进行一次粘贴工序即可，无需分别粘贴每个发光芯片对应的反射棱镜，减少了激光器的制备工序，降低了激光器的制备复杂度。图13是本申请另一实施例提供的又一种激光器的结构示意图，如图13所示，每行第一发光组件中发光芯片的出光方向均为y2方向，每行第一发光组件中的反射棱镜一体成型为一个条状的反射棱镜。每列第二发光组件中发光芯片的出光方向均为x2方向，每列第二发光组件中的反射棱镜一体成型为一个条状的反射棱镜。也即每行第一类发光芯片202a与一个反射棱镜203对应，每行第一类发光芯片202a的出光方向(也即y2方向)垂直于对应的反射棱镜203的延伸方向(也即x2方向)。每列第二类发光芯片202b与一个反射棱镜203对应，每列第二类发光芯片202b的出光方向(也即x2方向)垂直于对应的反射棱镜203的延伸方向(也即y2方向)。在一具体实施中，一行第一类发光芯片中也可以仅相邻的两个发光芯片对应同一反射棱镜，或者相邻的三个发光芯片对应同一反射棱镜，本申请实施例不作限定。
图14是本申请再一实施例提供的一种激光器的结构示意图。如图14所示，激光器20还可以包括密封盖板205、密封透光层206和准直镜组207。密封盖板205呈环状，密封盖板205的外边缘与壳壁2012远离底板2011的表面固定。密封透光层206位于密封盖板205远离底板2011的一侧，且密封透光层206的边缘与密封盖板205的内边缘固定。管壳201、密封盖板205和透光密封层206可以形成密封空间，激光器20中的发光芯片和反射棱镜可以位于该密封空间内。在一具体实施中，该密封空间内可以填充有惰性气体，如氮气，以对发光芯片进行保护，防止发光芯片被氧化。准直镜组207位于透光密封层206远 离底板2011的一侧，准直镜组207的边缘与密封盖板205的外边缘远离底板2011的表面固定。在一具体实施中，准直镜组207可以通过粘贴的方式固定，或者也可以进行机械固定。该准直镜组207包括与激光器中的各个发光芯片一一对应的多个准直透镜T。每个发光芯片发出的激光在经过对应的反射棱镜203反射后可以射向对应的准直透镜T，进而准直透镜T可以对该激光进行准直后射出。需要说明的是，对光线进行准直也即是对光线进行一定程度的会聚，使得光线的发散角度变小，更加接近平行光。
本申请实施例中，如图14所示，准直镜组207中第一类发光芯片202a对应的各个准直透镜可以一体成型，第二类发光芯片202b对应的各个准直透镜可以一体成型。如准直镜组207可以包括相互独立的第一镜组2071和第二镜组2072，第一镜组包括第一类发光芯片202a对应的各个准直透镜，第二镜组2072包括第二类发光芯片202b对应的各个准直透镜。如此可以对第一类发光芯片发出的激光与第二类发光芯片发出的激光分别进行耦合，以保证第一类发光芯片发出的激光可以较为精准地射入第一镜组中对应的准直透镜，且保证第二类发光芯片发出的激光可以较为精准地射入第二镜组中对应的准直透镜。
另外，第一镜组和第二镜组的结构形状也可以分别进行设计，提高了准直镜组的制备灵活性。示例地，可以根据射向每个准直透镜的光斑的形状设计准直透镜的形状，如图12所示，光斑的形状可以呈椭圆形，则可以使准直透镜在底板上的正投影呈矩形，以保证准直透镜在尺寸较小的基础上实现对射入的全部激光进行收光。如每个准直透镜包括相对的第一面和第二面，该第一面为相对第二面靠近底板的矩形平面，该第二面为相对第一面远离底板的凸弧面。图12所示的光斑相匹配的准直镜组中，第一镜组中的准直透镜的第一面的长边平行于y2方向，短边平行于x2方向；第二镜组中的准直透镜的第一面的长边平行于x2方向，短边平行于y2方向。该种设计方式也可以称为第一镜组中的准直透镜竖排设计，第二镜组中的准直透镜横排设计。
本申请实施例中密封盖板205的外边缘的厚度可以小于预设的厚度阈值，该外边缘的厚度较薄，该外边缘可以通过平行封焊技术固定于壳壁2012远离底板的表面上。该密封盖板205可以为钣金件，该密封盖板205的各个位置的厚度相同或大致相同。需要说明的是，在通过平行封焊技术固定密封盖板205的外边缘与壳壁2012时，会先将密封盖板205放置壳壁2012远离底板2011的一侧，且使密封盖板205的外边缘搭接在管壳201的壳壁2012远离底板2011的表面上。接着需要采用封焊设备对该外边缘进行加热，使该外边缘与壳壁2012的连接位置熔融，进而将该外边缘与管壳201的壳壁2012焊接在一起。在一具体实施中，在将密封盖板205与管壳201固定之前，可以先将透光密封层206与密封盖板205固定，如可以通过密封胶将透光密封层206的边缘与密封盖板205的内边缘进行固定。
本申请实施例中管壳的材质可以为铜，如无氧铜，该透光密封层的材质可以为玻璃，该密封盖板的材质可以为不锈钢。需要说明的是，铜的导热系数较大，本申请实施例中管壳的材质为铜，如此可以保证管壳的底板上设置的发光芯片在工作时产生的热量可以快速地通过管壳进行传导，进而较快的散发，避免热量聚集对发光芯片的损伤。在一具体实施中，管壳的材质也可以为铝、氮化铝和碳化硅中的一种或多种。本申请实施例中密封盖板 的材质也可以为其他可伐材料，如铁镍钴合金或其他合金。透光密封层的材质也可以为其他透光且可靠性较强的材质，如树脂材料等。
请继续参考图5、6、8-11和13，壳壁2012的相对两侧可以具有多个开孔，激光器20还可以包括：多个导电引脚208，该多个导电引脚208可以分别穿过壳壁2012中的开孔伸向管壳201的容置空间内，进而与壳壁2012固定。导电引脚208可以与发光芯片的电极电连接，以将外部电源传输至发光芯片，进而激发发光芯片射出激光。在一具体实施中，该开孔的孔径可以为1.2毫米，导电引脚208的直径可以为0.55毫米。
在一具体实施中，本申请实施例中在组装激光器时，可以先在管壳的壳壁上的开孔中放置环状的焊料结构(如环状玻璃珠)，将导电引脚穿过该焊料结构及该焊料结构所在的开孔。然后，将壳壁放置在底板的四周边缘，且在底板与管壳之间放置环形银铜焊料，接着将该底板、壳壁和导电引脚的结构放入高温炉中进行密封烧结，待密封烧结并固化后底板、壳壁、导电引脚以及焊料即可为一个整体，进而实现壳壁开孔处的气密。还可以将透光密封层与密封盖板进行固定，如透光密封层的边缘粘贴于密封盖板的内边缘，得到上盖组件。接着可以将发光芯片与热沉的组合件，以及反射棱镜焊接在管壳的底板上，继而采用平行封焊技术将上盖组件焊接在管壳的壳壁远离底板的表面上，最后将准直镜组进行光路耦合后通过环氧胶固定在上盖组件远离底板的一侧，至此完成激光器的组装。需要说明的是，上述组装过程仅为本申请实施例提供的一种示例性的过程，其中的各个步骤中采用的焊接工艺也可以采用其他工艺代替，各个步骤的先后顺序也可以适应调整，本申请实施例对此不做限定。
需要说明的是，本申请以上实施例均以管壳的底板与壳壁为需要组装的两个单独的结构为例进行说明。在一具体实施中，底板与壳壁也可以一体成型。如此可以避免底板与壳壁在高温焊接时由于底板与壳壁的热膨胀系数不同导致的底板产生褶皱，进而可以保证底板的平坦度，保证发光芯片在底板上的设置可靠性，且保证发光芯片发出的光线按照预定的发光角度出射，提高激光器的发光效果。
综上所述，本申请实施例提供的激光器中，第一类发光芯片与第二类发光芯片的出光方向垂直，第一类发光芯片和第二类发光芯片发出的激光通过反射棱镜反射后的偏振方向相同，也即是激光器发出仅具有一种偏振方向的激光。如此一来，采用该激光器作为投影设备的光源时，便可以直接采用仅具有一种偏振方向的光线形成投影画面，避免投影画面出现的偏色现象，提高了投影画面的显示效果。
图15是本申请实施例提供的一种投影设备的结构示意图。如图15所示，该投影设备可以包括：激光器20、光机30和镜头40。该激光器20用于向光机30发出光线，该光机30用于将射入的光线调制后射向镜头40，镜头40用于将射入的光线进行投射。该激光器可以为上述任一激光器20。由于上述激光器20发出的激光的偏振方向一致，因此采用该激光器作为光源的投影设备可以根据该偏振方向一致的激光可以形成显示效果较好的投影画面。
在一具体实施中，光机可以包括透镜组、全内反射(total internal reflection prism， TIR)棱镜组和光调制部件。光源组件出射的光线依次经过透镜组、全内反射(total internal reflection prism，TIR)棱镜组和光调制部件后射出至镜头。光导管的出光面与光调制器件的入光面互为共轭的物像关系。光调制部件可以为硅基液晶(Liquid Crystal on Silicon，LCOS)，液晶显示器(Liquid Crystal Display，LCD)或者数字微镜器件(Digital Micromirror Device，DMD)。
需要指出的是，在本申请实施例中，本申请中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。术语“第一”和“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。术语“多个”指两个或两个以上，除非另有明确的限定。“大致”是指在可接受的误差范围内，本领域技术人员能够在一定误差范围内解决所述技术问题，基本达到所述技术效果。在附图中，为了图示的清晰可能夸大了层和区域的尺寸。而且可以理解，当元件或层被称为在另一元件或层“上”时，它可以直接在其他元件上，或者可以存在中间的层。通篇相似的参考标记指示相似的元件。
以上所述仅为本申请的示例实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (10)

  1. 一种激光器，其特征在于，所述激光器包括：一面具有开口的管壳，以及位于所述管壳的容置空间中且排布成多行多列的多个发光组件；
    所述发光组件包括发光芯片和反射棱镜，所述发光芯片用于向所述反射棱镜发出激光，所述反射棱镜用于将所述激光反射至所述开口；
    所述多个发光组件包括：第一发光组件和第二发光组件，所述第一发光组件中的发光芯片与所述第二发光组件中的发光芯片的出光方向垂直，且所述第一发光组件中的发光芯片与所述第二发光组件中的发光芯片发出的激光通过所述反射棱镜反射后的偏振方向相同。
  2. 根据权利要求1所述的激光器，其特征在于，排布成多行多列的所述多个发光组件包括：沿列方向一一交替排布的多行所述第一发光组件和多行所述第二发光组件。
  3. 根据权利要求1所述的激光器，其特征在于，排布成多行多列的所述多个发光组件中，每行所述发光组件包括一一交替排布或两两交替排布的所述第一发光组件和所述第二发光组件，每列所述发光组件包括一一交替排布或两两交替排布的所述第一发光组件和所述第二发光组件。
  4. 根据权利要求1所述的激光器，其特征在于，排布成多行多列的所述多个发光组件包括：多行所述第一发光组件和多行所述第二发光组件，所述第一发光组件与所述第二发光组件分别位于所述容置空间中错开的两个不同区域。
  5. 根据权利要求4所述的激光器，其特征在于，每行所述第一发光组件中，所述发光芯片的出光方向均相同且均垂直于行方向，所述反射棱镜一体成型；
    每列所述第二发光组件中，所述发光芯片的出光方向均相同且均平行于行方向，所述反射棱镜一体成型。
  6. 根据权利要求4或5所述的激光器，其特征在于，所述两个不同区域的边界形状为全等图形。
  7. 根据权利要求1至5任一所述的激光器，其特征在于，排布成多行多列的所述多个发光组件中，每行所述发光组件中所述发光芯片发出的激光在经过所述反射棱镜反射后形成的光斑的中心共线，每列所述发光组件中所述发光芯片发出的激光在经过所述反射棱镜反射后形成的光斑的中心共线。
  8. 根据权利要求1至5任一所述的激光器，其特征在于，所述第一发光组件中所述发光芯片的出光方向平行于所述容置空间的底面的目标边，所述第二发光组件中所述发光芯片的出光方向垂直于所述目标边，所述容置空间的底面与所述开口相对。
  9. 根据权利要求1至5任一所述的激光器，其特征在于，所述第一发光组件中的所述发光芯片均用于发出红色激光，所述第二发光组件中的发光芯片包括：用于发出绿色激光的发光芯片和用于发出蓝色激光的发光芯片。
  10. 一种投影设备，其特征在于，所述投影设备包括：权利要求1至9任一所述的激光器，以及光机和镜头。
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