WO2022091829A1 - 透明導電圧電フィルムおよびタッチパネル - Google Patents

透明導電圧電フィルムおよびタッチパネル Download PDF

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Publication number
WO2022091829A1
WO2022091829A1 PCT/JP2021/038368 JP2021038368W WO2022091829A1 WO 2022091829 A1 WO2022091829 A1 WO 2022091829A1 JP 2021038368 W JP2021038368 W JP 2021038368W WO 2022091829 A1 WO2022091829 A1 WO 2022091829A1
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Prior art keywords
transparent
piezoelectric film
coating layer
transparent conductive
transparent electrode
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Ceased
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PCT/JP2021/038368
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English (en)
French (fr)
Japanese (ja)
Inventor
誠 今治
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Kureha Corp
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Kureha Corp
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Publication date
Application filed by Kureha Corp filed Critical Kureha Corp
Priority to KR1020237013772A priority Critical patent/KR102786672B1/ko
Priority to JP2022559019A priority patent/JP7434598B2/ja
Priority to US18/250,483 priority patent/US20230422628A1/en
Priority to EP21885948.6A priority patent/EP4238756A4/en
Priority to CN202180069517.4A priority patent/CN116348285A/zh
Publication of WO2022091829A1 publication Critical patent/WO2022091829A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors

Definitions

  • the present invention relates to a transparent conductive piezoelectric film and a touch panel.
  • the transparent conductive piezoelectric film can be used as a pressure-sensitive sensor for a touch panel because it generates electricity according to the pressure and can specify the position where the pressure is applied.
  • various touch panels have been devised that simultaneously detect a touch position and a press.
  • a touch panel having a structure in which a pressing sensor unit for detecting pressure is superimposed on an electrostatic touch panel unit for detecting a touch position (see, for example, Patent Document 1).
  • the touch panel is composed of a combination of a capacitive touch sensor and the pressure sensor.
  • a polyethylene terephthalate (PET) film is usually used for the capacitive touch sensor.
  • PET polyethylene terephthalate
  • a transparent conductive film containing a transparent plastic substrate is known as a capacitive touch panel sensor (see, for example, Patent Documents 2 and 3).
  • a touch panel using a fluororesin as a transparent piezoelectric sheet is known (see, for example, Patent Document 4).
  • the resistance value of the transparent electrode tends to increase as the temperature rises. Therefore, in a touch panel using a transparent conductive piezoelectric film, the resistance value of the transparent conductive piezoelectric film may change when exposed to a high temperature environment, and accurate input information may not be obtained.
  • One aspect of the present invention is to realize suppression of changes in surface resistance value due to a high temperature environment in a transparent conductive piezoelectric film having a transparent piezoelectric film made of fluororesin.
  • the transparent conductive piezoelectric film according to one aspect of the present invention is configured by laminating a transparent piezoelectric film made of fluororesin, a transparent coating layer and a transparent electrode layer in this order.
  • the total thickness of the coating layer is 0.6 to 4.5 ⁇ m, and the ratio of the resistance value after standing to the ratio of the resistance value before leaving when left in an environment of 85 ° C. for 250 hours is 1.30 or less. ..
  • the method for producing a transparent conductive piezoelectric film according to one aspect of the present invention has a total thickness of 0.6 to 4.5 ⁇ m on at least one surface of the transparent piezoelectric film made of fluororesin.
  • the present invention includes a step of forming a transparent coating layer having a transparent coating layer and a step of forming a transparent electrode on the surface of the transparent coating layer.
  • the touch panel according to one aspect of the present invention has the above-mentioned transparent conductive piezoelectric film.
  • a transparent conductive piezoelectric film having a transparent piezoelectric film made of fluororesin it is possible to suppress a change in surface resistance value under a high temperature environment.
  • the transparent conductive piezoelectric film (transparent piezoelectric laminated film) is configured by laminating a transparent piezoelectric film, a transparent coating layer, and a transparent electrode in this order.
  • "stacked in this order” means that the films and layers are listed in the order in which the films, layers and electrodes (hereinafter, also referred to as "layers") are included in the laminate. It means the state of being placed.
  • the above-mentioned films and layers may be overlapped with each other in contact with each other or may be overlapped with each other as long as the effects of the present embodiment are exhibited.
  • the transparent piezoelectric film in this embodiment is made of fluororesin.
  • "made of fluororesin” means that fluororesin is the main component in the composition constituting the transparent piezoelectric film, and "fluororesin is the main component” means fluorine in the composition. It means that the resin is the most abundant component among the resin components.
  • the content of the fluororesin in the composition may be 51% by mass or more, 80% by mass or more, or 100% by mass.
  • piezoelectric film means a film having piezoelectricity.
  • transparent means an optical property that transmits visible light in a desired ratio or more according to the use of the transparent conductive piezoelectric film. For example, in the case of a touch panel application, “transparent” means that the total light transmittance is 80% or more.
  • the fluororesin in the present embodiment may be any fluororesin that can be used for the piezoelectric film, and may be one kind or more.
  • Examples of the fluororesin include vinylidene fluoride resin, tetrafluoroethylene resin and mixtures thereof.
  • vinylidene fluoride resin examples include homopolymers of vinylidene fluoride and copolymers thereof.
  • the content of the structural unit derived from the monomer other than vinylidene fluoride in the copolymer of vinylidene fluoride may be appropriately determined within the range in which the characteristics according to the use of the transparent piezoelectric film can be exhibited.
  • Examples of monomers other than vinylidene fluoride in the copolymer of vinylidene fluoride include hydrocarbon-based monomers and fluorine compounds.
  • Examples of the hydrocarbon-based monomers include ethylene and propylene.
  • the fluorine compound is a fluorine compound other than vinylidene fluoride and has a polymerizable structure. Examples of such fluorine compounds include vinyl fluoride, trifluoroethylene, trifluorochloroethylene, tetrafluoroethylene, hexafluhexafluoropropylene and fluoroalkyl vinyl ethers.
  • tetrafluoroethylene resin examples include a homopolymer of tetrafluoroethylene and a copolymer thereof.
  • monomers other than tetrafluoroethylene constituting the structural unit of the copolymer include ethylene, fluoropropylene, fluoroalkyl vinyl ether, perfluoroalkyl vinyl ether and perfluorodioxysole.
  • the content of the structural unit derived from vinylidene fluoride in the fluororesin can be appropriately determined within the range in which the effect of the present embodiment can be obtained, and from this viewpoint. , 20% by mass or more, more preferably 40% by mass or more, still more preferably 60% by mass or more.
  • the transparent piezoelectric film in the present embodiment may contain various additives as long as the effects of the present embodiment can be obtained.
  • the additives may be one or more, examples of which include plasticizers, lubricants, cross-linking agents, UV absorbers, pH regulators, stabilizers, antioxidants, surfactants and pigments.
  • the thickness of the transparent piezoelectric film in the present embodiment can be appropriately determined from the range in which the effect of the present embodiment can be obtained, depending on the use of the transparent conductive piezoelectric film. If the thickness of the transparent piezoelectric film is too thin, the mechanical strength may be insufficient, and if it is too thick, the effect may reach a plateau or the transparency may be insufficient, making it difficult to use in optical applications. There is.
  • the thickness of the transparent piezoelectric film can be appropriately determined from the range of, for example, 10 to 200 ⁇ m.
  • the thickness of the transparent piezoelectric film is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, and further preferably 30 ⁇ m or more from the viewpoint of mechanical strength. Further, the thickness of the transparent piezoelectric film is preferably 200 ⁇ m or less, more preferably 150 ⁇ m or less, still more preferably 100 ⁇ m or less, from the viewpoint of achieving both mechanical strength and economy. A transparent conductive piezoelectric film having a thickness within the above range can be suitably used for a touch panel.
  • the piezoelectric characteristics of the transparent piezoelectric film in the present embodiment can be appropriately determined from the range in which the effects of the present embodiment can be obtained, depending on the use of the transparent conductive piezoelectric film. If the piezoelectric characteristics are too low, the function as a piezoelectric material may be insufficient. From the viewpoint of exhibiting sufficient piezoelectric characteristics, for example, when the transparent conductive piezoelectric film is a touch panel, the piezoelectric characteristics of the transparent piezoelectric film are preferably 6 pC / N or more with a piezoelectric constant d 33 , and are preferably 10 pC / N or more. It is more preferable to have it, and it is further preferable to have 12 pC / N or more. The upper limit of the piezoelectric property is not limited, but in the above case, the piezoelectric constant d 33 may be 30 pC / N or less from the viewpoint of sufficiently obtaining the desired effect.
  • the transparent piezoelectric film in the present embodiment can be produced, for example, by stretching a fluororesin sheet and performing a polarization treatment, as described in Examples.
  • the transparent coating layer in the present embodiment is located between the transparent piezoelectric film and the transparent electrode.
  • the transparent coating layer may be a layer that is transparent and has sufficient dimensional stability to suppress deformation in the plane direction with respect to the transparent piezoelectric film. Further, the transparent coating layer is preferably a layer having an inertness that does not substantially affect the optical properties of the transparent piezoelectric film, from the viewpoint of suppressing discoloration of the transparent piezoelectric film.
  • the transparent coating layer may be arranged only on one surface side of the transparent piezoelectric film, or may be arranged on both sides from the viewpoint of sufficiently suppressing deformation of the transparent piezoelectric film due to the environment.
  • the transparent coating layer is arranged adjacent to the transparent piezoelectric film in the thickness direction of the transparent conductive piezoelectric film from the viewpoint of enhancing the transparency of the transparent conductive piezoelectric film and preventing the color development of the transparent piezoelectric film due to the environment. Is preferable.
  • the transparent coating layer may be a single layer or may be composed of two or more laminated layers.
  • the transparent coating layer may be used as long as it is a layer arranged between the transparent piezoelectric film and the transparent electrode and contributes to the dimensional stability of the transparent piezoelectric film.
  • the transparent coating layer is composed of two or more layers, a part or all of them other than the property of imparting dimensional stability of the transparent piezoelectric film such as adjustment of optical characteristics within the range where the effect in the present embodiment can be obtained. It may also have other properties.
  • the total thickness of the transparent coating layer in this embodiment is 0.6 to 4.5 ⁇ m.
  • the "total thickness" of the transparent coating layer is the total thickness of the individual transparent coating layers of the transparent conductive piezoelectric film.
  • the transparent coating layer is provided only on one main surface side of the transparent piezoelectric film, it is the thickness of the transparent coating layer on one main surface side.
  • the transparent coating layer is provided on both sides of one main surface and the other main surface of the transparent piezoelectric film, the sum of the thickness of the transparent coating layer on one main surface side and the thickness of the transparent coating layer on the other main surface side. Is. If the transparent coating layer is too thin, the suppression of environmental deformation of the transparent piezoelectric film may be insufficient. If the transparent coating layer is too thick, the piezoelectricity of the transparent conductive piezoelectric film may be insufficient.
  • the total thickness of the transparent coating layer is preferably 0.6 ⁇ m or more, more preferably 0.8 ⁇ m or more, and more preferably 1.0 ⁇ m or more, from the viewpoint of sufficiently suppressing deformation of the transparent piezoelectric film due to the environment. Is even more preferable. Further, the total thickness of the transparent coating layer is preferably 4.0 ⁇ m or less, more preferably 3.6 ⁇ m or less, and 3.2 ⁇ m or less, from the viewpoint of sufficiently reflecting the piezoelectric characteristics of the transparent piezoelectric film. It is more preferable to have.
  • the thickness of each transparent coating layer is preferably 0.3 ⁇ m or more from the viewpoint of sufficiently suppressing the heat shrinkage of the transparent piezoelectric film.
  • the transparent coating layer may be a transparent surface protective layer for preventing scratches, which is also called a so-called hard coat layer.
  • the material of the transparent coating layer can be selected from any material that can be used for the piezoelectric film, as long as it has the above-mentioned transparency and the above-mentioned inertness to the transparent piezoelectric film.
  • the material may be an inorganic material or an organic material, and may be one kind or more.
  • the material of the coating layer may be the material of the hard coat layer. Examples of such materials include melamine resins, urethane resins, (meth) acrylic acid ester resins, silane compounds and metal oxides.
  • (meth) acrylic acid is a general term for acrylic acid and methacrylic acid, and means one or both of them.
  • the fact that the material of the transparent coating layer is a (meth) acrylic acid ester resin, that is, that the transparent coating layer is made of a (meth) acrylic acid ester resin, is sufficient transparency, abundant material types, and. It is preferable from the viewpoint of low raw material price.
  • the material of the transparent coating layer may include other materials necessary to form the transparent coating layer.
  • a composition composed of a mixture of an initiator, an oligomer, a monomer and other components can be generally used.
  • the physical characteristics of the transparent coating layer are mainly determined by the oligomer and the monomer. Examples of such oligomers include monofunctional or polyfunctional (meth) acrylic rates. Examples of the above-mentioned monomers include urethane (meth) acrylate, epoxy (meth) acrylate, and polyester (meth) acrylate.
  • the transparent coating layer may have various functions as long as the effects in the present embodiment are exhibited.
  • the material of the transparent coating layer may further contain, as other components, a material for exhibiting any function.
  • examples of such materials include optical modifiers for controlling the refractive index of the transparent coating layer and antistatic agents.
  • optical modifiers include hollow silica-based fine particles, silane coupling agents, silicon oxide, aluminum oxide, titanium oxide, zirconium oxide, zinc oxide and tin oxide.
  • antistatic agents include surfactants, antimony pentoxide, indium-tin composite oxide (ITO) and conductive polymers.
  • the transparent coating layer may not contain other components from the viewpoint of enhancing its transparency.
  • the transparent electrode in the present embodiment has a structure having a planar spread and conductivity, and can be said to be a transparent conductive layer.
  • the transparent electrode need only exhibit sufficient transparency when the planar spread is assumed to be one layer, and if the structure is such, the transparent electrode itself does not have transparency. good.
  • the transparent electrode may be made of a highly transparent conductive member or composition, or may be made of a non-transparent material but may be ultra-thin or ultra-fine capable of exhibiting sufficient transparency. It may have a fine structure.
  • the transparent electrode may be formed on a transparent substrate and adhered to the transparent coating layer together with the substrate, or may be the surface of the transparent coating layer or another layer adjacent to the transparent coating layer in the layer structure of the touch panel described later. It may be formed directly on.
  • the transparent electrode may be arranged on at least one side of the transparent piezoelectric film. When the transparent coating layer is formed on both sides of the transparent piezoelectric film, the transparent electrode may be arranged on at least one of the transparent coating layers.
  • the form of the transparent electrode is not limited, and may be a nanowire, a mesh, or a thin film.
  • the thin film may be a single layer or a laminated structure having a plurality of layers.
  • the material constituting the transparent electrode is not limited, and at least one selected from the group consisting of In, Sn, Zn, Ga, Sb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, and W.
  • Metal oxides of metals are preferably used.
  • the metal oxide may further contain the metal atoms shown in the above group, if necessary.
  • ITO, antimony-tin composite oxide (ATO) and the like are preferably used, and ITO is particularly preferably used.
  • Examples of other representative materials for the transparent electrode 4 include silver nanowires, silver mesh, copper mesh, graphene and carbon nanotubes.
  • the thickness of the transparent electrode is not limited, but is preferably 10 nm or more from the viewpoint of forming a continuous coating having a surface resistance value of 1 ⁇ 10 3 ⁇ / ⁇ or less and having good conductivity. If the thickness is too thick, the transparency may be lowered, if it is too thin, the electric resistance may be high, and discontinuous portions may be formed in the film structure.
  • the thickness is preferably 15 nm or more, more preferably 20 nm or more, from the viewpoint of further enhancing the conductivity. On the other hand, from the viewpoint of further enhancing the transparency of the transparent electrode, the thickness of the transparent electrode is preferably less than 55 nm, more preferably less than 45 nm.
  • the thickness of the transparent electrode can be determined by a known method obtained by observing the cross section of such a laminate.
  • the method for forming the transparent electrode is not limited, and it is possible to form the transparent electrode by adopting a conventionally known method. Examples of such methods include, specifically, vacuum deposition, sputtering and ion plating methods. Further, an appropriate method can be adopted depending on the required film thickness.
  • the transparent electrode does not have to be heat-annealed after its formation to crystallize the amorphous transparent electrode material.
  • the material of the transparent electrode in the present embodiment is preferably amorphous from the viewpoint of facilitating etching for patterning the transparent electrode. It can be confirmed that the transparent electrode is made of an amorphous material, for example, by not detecting the crystal peak of the material of the transparent electrode by the X-ray diffraction method.
  • the amorphous property in the transparent electrode can be obtained by using the X-ray diffraction method as described above, and the amorphous property can be obtained by producing a transparent electrode such as annealing after forming the transparent electrode. It is possible to make adjustments depending on whether or not the step of promoting crystallization in the above is carried out and the degree of carrying out.
  • the transparent conductive piezoelectric film of the present embodiment may further have other configurations other than those described above as long as the effects of the present embodiment are exhibited.
  • Such other configurations may be one or more, and examples thereof include a transparent pressure-sensitive adhesive layer and a release layer that abuts and can be peeled off from the transparent pressure-sensitive adhesive layer.
  • the transparent pressure-sensitive adhesive layer is a transparent layer having adhesiveness that allows an arbitrary layer constituting a transparent conductive piezoelectric film or a touch panel described later to be adhered to another layer.
  • the transparent pressure-sensitive adhesive layer may be a transparent pressure-sensitive adhesive.
  • Such a transparent pressure-sensitive adhesive may contain a base polymer that exhibits transparency and tackiness.
  • base polymers include acrylic polymers, silicone polymers, polyesters, polyurethanes, polyamides, polyvinyl ethers, vinyl acetate / vinyl chloride copolymers, modified polyolefins, epoxy polymers, fluoropolymers, and rubber polymers.
  • rubber-based polymers include natural rubber and synthetic rubber.
  • the base polymer can be appropriately selected from the above examples and used.
  • an acrylic pressure-sensitive adhesive is particularly preferable from the viewpoint of excellent optical transparency, exhibiting adhesive properties such as appropriate wettability, cohesiveness and adhesiveness, and excellent weather resistance and heat resistance. Used.
  • the transparent conductive piezoelectric film is embedded in an epoxy resin, the epoxy resin beam is cut so that the cross section of the transparent conductive piezoelectric film is exposed, and the cross section is scanned. It can be measured by observing with an electron microscope.
  • the thickness of the layer may be a representative value of the thickness of the layer, may be an average value of any plurality of measured values, may be the maximum value of the measured values, or may be the maximum value of the measured values. It may be the minimum value of.
  • the transparent conductive piezoelectric film of the present embodiment has a ratio of the surface resistance value after standing to 1.30 or less with respect to the ratio of the surface resistance value before leaving when left in an environment of 85 ° C. for 250 hours.
  • the fluororesin constituting the transparent piezoelectric film is generally more heat-shrinkable than the biaxially stretched resin film which has been widely used in the present technical field such as PET. Therefore, the transparent piezoelectric film tends to expand and contract in a high temperature environment.
  • the ratio of the above surface resistance values of the transparent conductive piezoelectric film is 1.30 or less, which sufficiently suppresses the deformation of the transparent piezoelectric film in the transparent conductive piezoelectric film when it is temporarily placed in a high temperature environment. Will be done. Therefore, the peeling of the transparent electrode due to the deformation of the transparent piezoelectric film is prevented, and the change in the resistance value in the transparent conductive piezoelectric film is sufficiently suppressed.
  • the ratio of the above surface resistance values is preferably 1.25 or less. Further, the ratio of the above surface resistance values is preferably 0.75 or more, and more preferably 0.85 or more from the same viewpoint.
  • the surface resistance value can be measured by a known method capable of measuring the surface resistance value of the conductive resin film. Further, the surface resistance value can be adjusted according to the conductivity on the surface of the transparent conductive piezoelectric film.
  • the transparent conductive piezoelectric film of the present embodiment more directly has dimensional stability in a high temperature environment from the viewpoint of suppressing the change in the resistance value of the transparent conductive piezoelectric film due to the above-mentioned environmental change.
  • Dimensional stability in such a high temperature environment can be measured by thermomechanical analysis (TMA).
  • TMA thermomechanical analysis
  • the coefficient of linear expansion of the transparent conductive piezoelectric film in the use of the pressure-sensitive sensor of the touch panel is preferably 310 ⁇ 10 -6 K -1 or less in the vertical direction (TD direction) of the transparent piezoelectric film, and is preferably 300. It is more preferable that it is ⁇ 10 -6 K -1 or less.
  • the coefficient of linear expansion can be measured based on the known method described in JIS K7197-1991, for example, using a thermomechanical analyzer. Further, the coefficient of linear expansion can be adjusted by using a material that does not easily expand thermally in the transparent conductive piezoelectric film, or by adopting a material or structure that can relieve stress due to thermal expansion. ..
  • the transparent conductive piezoelectric film of the present embodiment has a step of forming a transparent coating layer having a total thickness of 0.6 to 4.5 ⁇ m on at least one surface of the transparent piezoelectric film made of fluororesin, and a surface of the transparent coating layer. It can be manufactured by a method including the step of forming a transparent electrode.
  • the transparent conductive piezoelectric film of the present embodiment can be manufactured in the same manner as a known transparent conductive piezoelectric film except that the above-mentioned transparent piezoelectric film is used and the above-mentioned layer is formed.
  • the transparent conductive piezoelectric film may be manufactured by stacking each of a transparent piezoelectric film, a transparent coating layer, and a layer having a transparent electrode in this order.
  • the transparent conductive piezoelectric film may be manufactured by forming a transparent coating layer on the surface of the transparent piezoelectric film and forming a transparent electrode on the surface of the transparent coating layer.
  • the transparent coating layer can be produced by a step of applying a paint for forming a transparent coating layer to a transparent piezoelectric film and a step of solidifying the coating film formed in the coating step.
  • the step of applying the paint can be carried out by a known coating method. Examples of coating methods include spray coating, roll coating, die coating, air knife coating, blade coating, spin coating, reverse coating, gravure coating and vapor deposition.
  • the thickness of the coating film can be appropriately adjusted depending on the number of coatings or the viscosity of the coating film.
  • the step of solidifying can be carried out by a known method of solidifying the coating film of the above paint.
  • solidification methods include drying, heating or curing by polymerization by light irradiation.
  • the paint for the transparent coating layer may contain a polymer, a monomer, or both of them.
  • the above-mentioned coating material may contain a crosslinked structure in which the polymer causes curing, or may further contain a small molecule compound having a plurality of crosslinked structures.
  • the paint may appropriately contain an additive for solidification, such as a polymerization initiator for causing the polymerization reaction, if necessary.
  • the transparent coating layer may be manufactured at the same time as the transparent piezoelectric film by coextruding the transparent piezoelectric film and the transparent coating layer.
  • the transparent electrode can be manufactured by applying it to the transparent coating layer using the paint of the electrode material. Such coating can be carried out by a known coating method as described above. Alternatively, the transparent electrode can be made on the transparent coating layer by sputtering. Further, the transparent electrode can be manufactured by a known method depending on the material and a suitable form thereof.
  • the step of forming the transparent electrode is as a transparent electrode on a transparent coating layer by a reactive sputtering method using a sintered body containing indium oxide and tin oxide as a raw material. It is possible to form a thin film of ITO. According to this step, an amorphous ITO film can be formed at a low temperature, from the viewpoint of facilitating etching for patterning of a transparent electrode, from the viewpoint of energy saving in manufacturing, and from the viewpoint of saving energy in manufacturing, and a transparent conductive piezoelectric film. It is suitable from the viewpoint of suppressing the occurrence of heat shrinkage of the transparent piezoelectric film in production.
  • the above-mentioned step of forming the transparent electrode is preferably performed in a lower temperature environment from the viewpoint of facilitating the etching normally performed thereafter. From this point of view, it is preferable to carry out reactive sputtering at, for example, 80 ° C. or lower.
  • the above temperature in reactive sputtering can be included in the range of increase in the temperature in the system due to the heat of reaction. Therefore, it is not necessary to actively perform cooling to control the temperature to the above temperature, but the temperature in the system is positively controlled by using the cooling device for removing the heat of reaction described above. May be good.
  • the method for producing the transparent conductive piezoelectric film may further include steps other than the above-mentioned steps as long as the effects of the present embodiment can be obtained. Further, the method for producing the transparent conductive piezoelectric film may not include a specific step from the viewpoint of obtaining or further enhancing the effect of the present embodiment. For example, it is preferable that the manufacturing method does not carry out the annealing step of the transparent electrode on which the transparent electrode is formed, from the viewpoint of facilitating the patterning of the transparent electrode. Generally, when the transparent electrode layer of ITO is formed on a PET film, an annealing treatment is performed at about 150 ° C. for about 60 to 90 minutes after sputtering ITO on PET. In the present embodiment, it is possible to more easily pattern the transparent electrode by not performing the heat treatment that causes the crystallization of ITO as described above.
  • the transparent conductive piezoelectric film 10 As shown in FIG. 1, the transparent conductive piezoelectric film 10 according to the embodiment of the present invention is configured by directly stacking the transparent piezoelectric film 1, the transparent coating layer 2, and the transparent electrode 3 in this order. There is.
  • the transparent piezoelectric film 1 is made of fluororesin as described above.
  • the transparent coating layer 2 is made of, for example, the above-mentioned (meth) acrylic acid ester resin, and is laminated on one surface of the transparent piezoelectric film 1.
  • the transparent electrode 3 is, for example, an ITO layer, and is formed on the surface of the transparent coating layer 2 opposite to the transparent piezoelectric film 1.
  • the transparent conductive piezoelectric film 10 is provided to a pressure-sensitive sensor such as a touch panel by being adhered to other constituent members by the above-mentioned transparent adhesive layer.
  • the transparent piezoelectric film 1 the transparent coating layer 2, and the transparent electrode 3 are directly laminated in this order. It is configured.
  • the transparent coating layer 2 and the transparent electrode 3 are arranged on both sides of the transparent piezoelectric film 1.
  • the transparent coating layer 2a is superposed on one surface of the transparent piezoelectric film 1, and the transparent coating layer 2b is superposed on the other surface of the transparent piezoelectric film 1. Further, a transparent electrode 3a is formed on the surface of the transparent coating layer 2a, and a transparent electrode 3b is formed on the surface of the transparent coating layer 2b. Similar to the transparent conductive piezoelectric film 10, the transparent conductive piezoelectric film 20 is also provided as a part of the laminated structure in a pressure sensitive sensor such as a touch panel by adhering each of the transparent electrodes 3a and 3b to another layer. ..
  • the touch panel of one embodiment of the present invention has the transparent conductive piezoelectric film of the present embodiment described above.
  • the position and number of the transparent conductive piezoelectric films on the touch panel can be appropriately determined according to the application of the touch panel or the desired function.
  • FIG. 3 is a diagram schematically showing an example of a layer structure in the touch panel according to the embodiment of the present invention.
  • the touch panel 100 has a configuration in which the transparent piezoelectric laminated film 20 shown in FIG. 2 is sandwiched between the transparent electrode 4b and the cover glass 5. Further, between the transparent piezoelectric laminated film 20 and the cover glass 5, the transparent substrate 6a, the transparent electrode 4a, the transparent adhesive layer 3c, the transparent substrate 6c, and the transparent electrode are directed from the transparent piezoelectric laminated film 20 toward the cover glass 5. 4c and the transparent pressure-sensitive adhesive layer 3d are stacked and arranged in this order. Further, a transparent substrate 6b is arranged between the transparent piezoelectric laminated film 20 and the transparent electrode 4b.
  • the touch panel 100 is configured by stacking the transparent electrode 4b, the transparent piezoelectric laminated film 20, and the cover glass 5 in this order.
  • the surface of the touch panel 100 on the transparent electrode 4b side can be arranged on the surface of the display 30, but the present invention is not limited to this.
  • the transparent piezoelectric laminated film 20 and the cover glass 5 are adhered to each other by the transparent adhesive layer 3a via the transparent adhesive layers 3c and 3d, the transparent electrodes 4a and 4c, and the transparent substrates 6a and 6c.
  • the film 20 and the transparent electrode 4b are adhered to each other by the transparent adhesive layer 3b via the transparent substrate 6b.
  • a display panel such as an organic EL display panel or a liquid crystal display panel, that is, a display 30, may be arranged on the opposite side of the transparent piezoelectric laminated film 20 in the stacking direction of the transparent electrode 4b. Since a conventionally known display panel can be adopted as the display 30, a detailed description of the configuration thereof will be omitted in the present specification.
  • the transparent electrodes 4a, 4b, and 4c may be formed on the transparent substrates 6a, 6b, and 6c, respectively, and may be adhered to a desired layer in the touch panel 100 together with the transparent substrates 6a, 6b, and 6c, or are transparent in the stacking direction.
  • the electrodes 4a, 4b, 4c may be formed directly on the surface of another adjacent layer and adhered by the transparent pressure-sensitive adhesive layers 3a, 3b, 3c or 3d.
  • the transparent electrodes 4a, 4b, and 4c known transparent electrodes that can be used for a touch panel can be adopted. More specifically, the transparent electrodes 4a, 4b, and 4c may be substantially transparent planar electrodes, may be a conductive thin film having a pattern, or may be a planar surface made of an ultrafine conductive wire rod. Structure may be used.
  • the materials constituting the transparent electrodes 4a, 4b, and 4c are not limited, and are selected from the group consisting of In, Sn, Zn, Ga, Sb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, and W. Metal oxides of at least one kind of metal are preferably used.
  • the metal oxide may further contain the metal atoms shown in the above group, if necessary.
  • ITO indium-tin composite oxide
  • ATO antimony-tin composite oxide
  • Examples of other representative materials of transparent electrodes 4a, 4b, 4c include silver nanowires, silver mesh, copper mesh, graphene and carbon nanotubes.
  • a known transparent film that can be used as a base for supporting the above-mentioned transparent electrodes 4a, 4b, 4c can be adopted.
  • the materials constituting the transparent substrates 6a, 6b, and 6c are not limited, and polyethylene terephthalate (PET), polycarbonate (PC), and cycloolefin polymer (COP) are preferably used.
  • the cover glass 5 is a touch panel cover glass. Any sheet-like light transmitting member for a touch panel may be used, and a glass plate such as the cover glass 5 or a transparent resin sheet may be used.
  • the touch panel in the embodiment of the present invention may further include other configurations as long as the effect of the present embodiment can be obtained.
  • the touch panel in the embodiment of the present invention may include the transparent conductive piezoelectric film of the above-mentioned embodiment of the present invention in the laminated structure.
  • the position of the transparent conductive piezoelectric film in the touch panel in the stacking direction may be appropriately determined as long as the effect of the embodiment of the present invention can be obtained.
  • the touch panel of the embodiment of the present invention may have a configuration in which the transparent conductive piezoelectric film of the present embodiment is appropriately added to the laminated structure of a conventional touch panel such as a GFF type or a GF2 type.
  • the transparent conductive piezoelectric film of the present embodiment may be directly laminated with a transparent electrode layer for detecting pressure and a position sensor for detecting the position, or may be adhered via an adhesive layer. You may.
  • a touch panel having such a configuration can further exhibit the functions derived from the transparent conductive piezoelectric film in addition to the functions of the conventional touch panel, for example, including both the position sensor and the pressure sensor in the transparent laminated structure. It is possible to configure a touch panel.
  • the transparent conductive piezoelectric film of the present embodiment is configured by laminating a transparent piezoelectric film, a transparent coating layer, and a transparent electrode in this order, and the transparent coating layer has a specific thickness. Therefore, it is possible to sufficiently suppress changes in the surface resistance value under a specific high temperature and high humidity environment.
  • PVDF Polyvinylidene fluoride
  • the PVDF piezoelectric film has higher heat shrinkage than the PET film which has been generally used as a transparent piezoelectric film. Therefore, it easily shrinks in a high temperature environment, which may change the electrical characteristics such as the resistance value.
  • the piezoelectric film made of PVDF may have a more remarkable tendency of change in electrical characteristics due to the above-mentioned heat shrinkage as compared with the conventional capacitive touch sensor including the film made of PET.
  • the resistance of the transparent conductive piezoelectric film is increased when the film is stored in a high temperature or high humidity environment. Is suppressed.
  • the above-mentioned increase in resistance is due to the fact that the transparent piezoelectric film is thermally shrunk and the transparent electrode such as ITO is cracked, or the transparent piezoelectric film and the transparent electrode are peeled off. Abnormalities in the layer structure due to such cracking or peeling can be observed with a scanning electron microscope (SEM).
  • SEM scanning electron microscope
  • the transparent electrode is substantially amorphous from the viewpoint of facilitating etching of the transparent electrode.
  • the touch panel can be arranged adjacent to the capacitive touch panel in the stacking direction. Therefore, it is possible to detect the position and the pressure on the touch panel with a layer structure close to each other. Therefore, it is possible to realize a touch panel with a simpler configuration than before.
  • the transparent conductive piezoelectric film of the present embodiment can be arranged as a transparent piezoelectric layer in the laminated structure.
  • the transparent coating layer may not be formed in a planar shape, and may be formed so as to have a pattern such as a grid pattern.
  • a pattern such as a grid pattern.
  • the transparent coating layer is composed of a plurality of layers, a part of the plurality of layers may have the above pattern, or all of them may have the above pattern.
  • the patterns may be the same or different.
  • the transparent conductive piezoelectric film of the embodiment of the present invention is composed of a transparent piezoelectric film made of fluororesin, a transparent coating layer and a transparent electrode stacked in this order, and is composed of a coating layer.
  • the total thickness is 0.6 to 4.5 ⁇ m, and the ratio of the surface resistance value after standing to the ratio of the surface resistance value before leaving when left in an environment of 85 ° C. for 250 hours is 1.30 or less. ..
  • the touch panel according to the embodiment of the present invention has the transparent conductive piezoelectric film. Therefore, both the transparent conductive piezoelectric film and the touch panel can realize the suppression of the change in the surface resistance value under a high temperature environment in the transparent conductive piezoelectric film having the transparent piezoelectric film made of fluororesin.
  • the coefficient of linear expansion obtained by thermomechanical analysis of the transparent conductive piezoelectric film according to the embodiment of the present invention is 310 ⁇ 10 -6 K -1 or less, which means that dimensional stability and change in surface resistance value are suppressed in a high temperature environment. It is even more effective from the viewpoint of enhancing.
  • the transparent electrode is composed of an indium-tin composite oxide, and the fact that the peak of the indium-tin composite oxide is not detected in the X-ray diffraction facilitates the etching of the transparent electrode. It is even more effective from the point of view.
  • the transparent coating layer is made of a (meth) acrylic acid ester resin is more effective from the viewpoint of enhancing transparency, discoloration resistance, and dimensional stability against deformation due to the environment. be.
  • the method for producing a transparent conductive piezoelectric film according to the embodiment of the present invention is a step of forming a transparent coating layer having a total thickness of 0.6 to 4.5 ⁇ m on at least one surface of the transparent piezoelectric film made of fluororesin.
  • a transparent electrode is formed on the surface of the transparent coating layer in which the ratio of the surface resistance value after standing to the ratio of the surface resistance value before leaving when left in an environment of 85 ° C. for 250 hours is 1.30 or less. Including the process. Therefore, the embodiment of the present invention can provide the transparent conductive piezoelectric film of the embodiment of the present invention capable of suppressing the change in the surface resistance value under a high temperature environment.
  • an indium-tin oxide composite oxide is used as a transparent electrode on a transparent coating layer by a reactive sputtering method using a sintered body containing indium oxide and tin oxide as raw materials.
  • Forming a thin film of is more effective from the viewpoint of forming a transparent electrode having high conductivity and less likely to be cracked or peeled off.
  • the transparent electrode in the embodiment of the present invention it is more effective to carry out reactive sputtering at a temperature of 80 ° C. or lower from the viewpoint of easily performing etching of the transparent electrode in the above-mentioned manufacturing method. Is.
  • the present invention it is more effective not to perform the annealing treatment of the transparent electrode formed in the step of forming the transparent electrode from the viewpoint of easily performing the etching of the transparent electrode in the above manufacturing method. be.
  • Example 1 A resin film (thickness, 120 ⁇ m) formed from polyvinylidene fluoride (manufactured by Kureha Corporation) having an integral viscosity of 1.3 dl / g was passed through a preheating roll heated to a surface temperature of 110 ° C. Subsequently, the film passed through the preheating roll was passed through a stretching roll heated to a surface temperature of 120 ° C. and stretched so that the stretching ratio was 4.2 times. After stretching, the film was passed through a polarization roll to perform a polarization treatment to obtain a piezoelectric film. At that time, the polarization treatment was performed by applying the DC voltage while increasing it from 0 kV to 13.5 kV. The film after the polarization treatment was further heat-treated at 130 ° C. for 1 minute to obtain a transparent piezoelectric film having a thickness of 40 ⁇ m.
  • a hard coat agent (“TYAB-M101”, manufactured by Toyochem Co., Ltd.) was applied to one side (first main side) of the transparent piezoelectric film with a bar coater, and dried at 80 ° C. for 2 minutes.
  • the dried coating film of the hard coat agent was irradiated with UV with an integrated light amount of 400 mJ / cm 2 using a UV irradiation device CSOT-40 (manufactured by GS Yuasa Co., Ltd.). In this way, a film having a transparent coating layer having a thickness of 2.0 ⁇ m on one side was obtained.
  • a transparent conductive layer having a thickness of 40 nm is subjected to a reactive sputtering method under the following conditions using a sintered body material containing 90% by mass of indium oxide and 10% by mass of tin oxide as a target on the transparent coating layer. ITO film was formed. In this way, a transparent conductive piezoelectric film was obtained without performing an annealing treatment for the transparent electrode.
  • Example 2 A transparent conductive piezoelectric film was obtained in the same manner as in Example 1 except that the thickness of the transparent coating layer was changed to 1.5 ⁇ m.
  • Example 3 A transparent conductive piezoelectric film was obtained in the same manner as in Example 1 except that the thickness of the transparent coating layer was changed to 1.0 ⁇ m.
  • Example 4 The DC voltage in the polarization treatment of the polyvinylidene fluoride resin film in Example 1 was changed to 11.8 kV.
  • the hard coat agent "BS CH271" (manufactured by Arakawa Chemical Industry Co., Ltd.) was used instead of "TYAB-M101" (manufactured by Toyochem Co., Ltd.).
  • a transparent coating layer having a thickness of 0.4 ⁇ m was formed on the first main surface of the transparent piezoelectric film, and a transparent coating layer having a thickness of 0.4 ⁇ m was further formed on the other side (second main surface) of the transparent piezoelectric film. ..
  • an ITO film was formed on the surface of the transparent coating layer on the first main surface side in the same manner as in Example 1 to obtain a transparent conductive piezoelectric film.
  • Example 5 A transparent conductive piezoelectric film was obtained in the same manner as in Example 4 except that the thickness of each of the transparent coating layers on the first main surface and the second main surface was 0.7 ⁇ m.
  • Example 6 A transparent conductive piezoelectric film is formed in the same manner as in Example 4 except that a transparent coating layer having a thickness of 1.0 ⁇ m is formed on the first main surface and a transparent coating layer having a thickness of 0.9 ⁇ m is formed on the second main surface. Obtained.
  • Example 7 A transparent conductive piezoelectric film is formed in the same manner as in Example 4 except that a transparent coating layer having a thickness of 1.9 ⁇ m is formed on the first main surface and a transparent coating layer having a thickness of 2.1 ⁇ m is formed on the second main surface. Obtained.
  • Example 1 A transparent conductive piezoelectric film was obtained in the same manner as in Example 1 except that the thickness of the transparent coating layer was changed to 0.4 ⁇ m.
  • Example 2 A transparent conductive piezoelectric film was obtained in Example 1 except that an ITO film was formed on the transparent piezoelectric film without forming the transparent coating layer.
  • the thicknesses of two of the transparent coating layers were measured, and the average value was taken as the thickness of the transparent coating layer.
  • the interface of the transparent coating layer was observed as a substantially smooth line, and in the measurement of the thickness of the transparent coating layer, the distance between the lines was measured.
  • the coefficient of linear expansion is 310 ⁇ 10 -6 K -1 or less, it can be determined that there is no practical problem in the application of the touch panel.
  • the surface resistance value of the transparent conductive piezoelectric film was measured before placing it in the above atmosphere (0 hours) and after placing it in the above environment for t hours.
  • a resistivity meter (“LorestaGP MCP-T700”, manufactured by Nittoseiko Analytech Co., Ltd.) was used to measure the surface resistance value, and the surface resistance value was measured according to JIS K7194. The measurement was performed three times in total, and the average value of the three times was used as the representative value. Then, the ratio R t / R 0 of the surface resistance value (R t ) at t time in the above atmosphere to the surface resistance value (R 0 ) before being placed in the above atmosphere was obtained. If the above ratio (R 250 / R 0 ) in 250 hours is 1.30 or less, it can be judged that there is no practical problem in the use of the touch panel.
  • the piezoelectric constant d 33 of each of the transparent conductive piezoelectric films of Examples 1 to 7, Comparative Example 1 and Comparative Example 2 was 0.2N using a piezoelectric constant measuring device (“Piezometer System PM300”, manufactured by PIEZOTEST). The sample was clipped with, and the generated charge when a force of 0.15 N and 110 Hz was applied was read.
  • the measured value of the piezoelectric constant d 33 may be a positive value or a negative value depending on the front and back of the film to be measured, but the absolute value is described in the present specification. It was confirmed that d 33 of all the transparent conductive piezoelectric films was in the range of 6.0 to 30, and had practically sufficient piezoelectric characteristics in the application of the touch panel.
  • Table 1 shows the results of the above evaluation.
  • FIG. 4 shows the effect over time on the surface resistance value of the high temperature and high humidity environment in Examples and Comparative Examples.
  • the transparent conductive piezoelectric films of Examples 1 to 7 have a sufficiently low R 250 / R 0 and have sufficient transparency. This is because the transparent conductive piezoelectric film has a transparent coating layer having a sufficient thickness, so that the heat shrinkage of the film is suppressed in a high temperature and high humidity environment, and the occurrence of cracks or peeling of ITO due to the heat shrinkage is sufficient. It is probable that it was possible to suppress it.
  • the transparent conductive piezoelectric films of Comparative Examples 1 and 2 have a relatively high R 250 / R 0 . It is considered that this is because the transparent piezoelectric film shrinks due to heat, causing cracking of ITO or peeling of the film and ITO.
  • the present invention can be used for a touch panel.

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023219090A1 (ja) * 2022-05-11 2023-11-16 株式会社クレハ 積層圧電フィルム、デバイス、及び積層圧電フィルムの製造方法
JPWO2023224056A1 (https=) * 2022-05-18 2023-11-23

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025192641A1 (ja) * 2024-03-14 2025-09-18 株式会社クレハ 積層圧電体及びタッチパネル

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059360A (ja) 2005-07-29 2007-03-08 Toyobo Co Ltd 透明導電性フィルム、透明導電性シートおよびタッチパネル
JP2007134293A (ja) * 2005-11-07 2007-05-31 Hs Planning:Kk 透明導電性フィルム及び透明導電性フィルム製造方法
JP2008152767A (ja) 2006-11-24 2008-07-03 Gunze Ltd タッチパネル用透明導電膜付フィルムとこれを用いたタッチパネル
JP2010108490A (ja) 2008-10-03 2010-05-13 Daikin Ind Ltd タッチパネルおよび透明圧電シート
JP2012079257A (ja) * 2010-10-06 2012-04-19 Dic Corp 両面粘着シートを用いた透明導電膜積層体およびタッチパネル装置
WO2013021835A1 (ja) 2011-08-11 2013-02-14 株式会社村田製作所 タッチパネル
JP2019096680A (ja) * 2017-11-21 2019-06-20 日東電工株式会社 圧電フィルムおよび圧電センサ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021835A (ja) 2011-07-12 2013-01-31 Nippon Telegr & Teleph Corp <Ntt> 充電システム及び充電方法
JP6106756B2 (ja) * 2013-09-10 2017-04-05 ロック技研工業株式会社 透明導電性基材及び透明導電性基材の製造方法
WO2015053089A1 (ja) * 2013-10-07 2015-04-16 三井化学株式会社 押圧検出装置及び押圧検出タッチパネル
CN106575699A (zh) * 2014-08-22 2017-04-19 三井化学株式会社 高分子压电膜
JP6487178B2 (ja) * 2014-10-20 2019-03-20 三井化学株式会社 積層体
WO2017209081A1 (ja) * 2016-05-30 2017-12-07 日東電工株式会社 透明電極付き圧電フィルムおよび圧力センサ
CN109642307B (zh) * 2016-09-12 2020-04-10 株式会社爱发科 带透明导电膜的基板的制造方法、带透明导电膜的基板的制造装置及带透明导电膜的基板
JP6953204B2 (ja) * 2017-07-04 2021-10-27 日東電工株式会社 透明導電性フィルム及びタッチパネル

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059360A (ja) 2005-07-29 2007-03-08 Toyobo Co Ltd 透明導電性フィルム、透明導電性シートおよびタッチパネル
JP2007134293A (ja) * 2005-11-07 2007-05-31 Hs Planning:Kk 透明導電性フィルム及び透明導電性フィルム製造方法
JP2008152767A (ja) 2006-11-24 2008-07-03 Gunze Ltd タッチパネル用透明導電膜付フィルムとこれを用いたタッチパネル
JP2010108490A (ja) 2008-10-03 2010-05-13 Daikin Ind Ltd タッチパネルおよび透明圧電シート
JP2012079257A (ja) * 2010-10-06 2012-04-19 Dic Corp 両面粘着シートを用いた透明導電膜積層体およびタッチパネル装置
WO2013021835A1 (ja) 2011-08-11 2013-02-14 株式会社村田製作所 タッチパネル
JP2019096680A (ja) * 2017-11-21 2019-06-20 日東電工株式会社 圧電フィルムおよび圧電センサ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4238756A4

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023219090A1 (ja) * 2022-05-11 2023-11-16 株式会社クレハ 積層圧電フィルム、デバイス、及び積層圧電フィルムの製造方法
JPWO2023219090A1 (https=) * 2022-05-11 2023-11-16
JP7742489B2 (ja) 2022-05-11 2025-09-19 株式会社クレハ 積層圧電フィルム、デバイス、及び積層圧電フィルムの製造方法
EP4506068A4 (en) * 2022-05-11 2025-10-22 Kureha Corp MULTILAYER PIEZOELECTRIC FILM, DEVICE AND METHOD FOR PRODUCING MULTILAYER PIEZOELECTRIC FILM
JPWO2023224056A1 (https=) * 2022-05-18 2023-11-23
WO2023224056A1 (ja) * 2022-05-18 2023-11-23 株式会社クレハ 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法
TWI866217B (zh) * 2022-05-18 2024-12-11 日商吳羽股份有限公司 導電壓電膜、壓電面板、壓力感測器、觸覺感知裝置用致動器、壓電振動發電裝置、平面揚聲器及導電壓電膜之製造方法
JP7749829B2 (ja) 2022-05-18 2025-10-06 株式会社クレハ 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法

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