JPWO2023224056A1 - - Google Patents
Info
- Publication number
- JPWO2023224056A1 JPWO2023224056A1 JP2024521956A JP2024521956A JPWO2023224056A1 JP WO2023224056 A1 JPWO2023224056 A1 JP WO2023224056A1 JP 2024521956 A JP2024521956 A JP 2024521956A JP 2024521956 A JP2024521956 A JP 2024521956A JP WO2023224056 A1 JPWO2023224056 A1 JP WO2023224056A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/098—Forming organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022081448 | 2022-05-18 | ||
| JP2022081448 | 2022-05-18 | ||
| PCT/JP2023/018367 WO2023224056A1 (ja) | 2022-05-18 | 2023-05-17 | 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023224056A1 true JPWO2023224056A1 (https=) | 2023-11-23 |
| JP7749829B2 JP7749829B2 (ja) | 2025-10-06 |
Family
ID=88835562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024521956A Active JP7749829B2 (ja) | 2022-05-18 | 2023-05-17 | 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250318433A1 (https=) |
| EP (1) | EP4503902A4 (https=) |
| JP (1) | JP7749829B2 (https=) |
| KR (1) | KR20250002465A (https=) |
| CN (1) | CN119138128A (https=) |
| TW (1) | TWI866217B (https=) |
| WO (1) | WO2023224056A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI903935B (zh) * | 2023-12-21 | 2025-11-01 | 日商吳羽股份有限公司 | 積層壓電體及其製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013146972A (ja) * | 2012-01-23 | 2013-08-01 | Toray Ind Inc | 積層フィルム、導電性基板、及び導電性基板の製造方法 |
| WO2016076071A1 (ja) * | 2014-11-14 | 2016-05-19 | 三井化学株式会社 | 高分子圧電フィルム |
| WO2017155006A1 (ja) * | 2016-03-09 | 2017-09-14 | 三井化学株式会社 | 積層体 |
| JP2017216451A (ja) * | 2016-05-30 | 2017-12-07 | 日東電工株式会社 | 透明電極付き圧電フィルムおよび圧力センサ |
| WO2021200790A1 (ja) * | 2020-04-02 | 2021-10-07 | 株式会社クレハ | 積層フィルム、その製造方法および利用 |
| JP2021174834A (ja) * | 2020-04-22 | 2021-11-01 | ダイキン工業株式会社 | 含フッ素重合体フィルム |
| WO2022091829A1 (ja) * | 2020-10-30 | 2022-05-05 | 株式会社クレハ | 透明導電圧電フィルムおよびタッチパネル |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05324203A (ja) | 1992-05-22 | 1993-12-07 | Fujitsu Ltd | 静電容量型タッチパネル |
-
2023
- 2023-05-17 EP EP23807657.4A patent/EP4503902A4/en active Pending
- 2023-05-17 US US18/865,542 patent/US20250318433A1/en active Pending
- 2023-05-17 CN CN202380037206.9A patent/CN119138128A/zh active Pending
- 2023-05-17 TW TW112118308A patent/TWI866217B/zh active
- 2023-05-17 WO PCT/JP2023/018367 patent/WO2023224056A1/ja not_active Ceased
- 2023-05-17 JP JP2024521956A patent/JP7749829B2/ja active Active
- 2023-05-17 KR KR1020247037626A patent/KR20250002465A/ko active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013146972A (ja) * | 2012-01-23 | 2013-08-01 | Toray Ind Inc | 積層フィルム、導電性基板、及び導電性基板の製造方法 |
| WO2016076071A1 (ja) * | 2014-11-14 | 2016-05-19 | 三井化学株式会社 | 高分子圧電フィルム |
| WO2017155006A1 (ja) * | 2016-03-09 | 2017-09-14 | 三井化学株式会社 | 積層体 |
| JP2017216451A (ja) * | 2016-05-30 | 2017-12-07 | 日東電工株式会社 | 透明電極付き圧電フィルムおよび圧力センサ |
| WO2021200790A1 (ja) * | 2020-04-02 | 2021-10-07 | 株式会社クレハ | 積層フィルム、その製造方法および利用 |
| JP2021174834A (ja) * | 2020-04-22 | 2021-11-01 | ダイキン工業株式会社 | 含フッ素重合体フィルム |
| WO2022091829A1 (ja) * | 2020-10-30 | 2022-05-05 | 株式会社クレハ | 透明導電圧電フィルムおよびタッチパネル |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250002465A (ko) | 2025-01-07 |
| EP4503902A4 (en) | 2025-08-06 |
| JP7749829B2 (ja) | 2025-10-06 |
| TWI866217B (zh) | 2024-12-11 |
| US20250318433A1 (en) | 2025-10-09 |
| WO2023224056A1 (ja) | 2023-11-23 |
| TW202348429A (zh) | 2023-12-16 |
| CN119138128A (zh) | 2024-12-13 |
| EP4503902A1 (en) | 2025-02-05 |
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