JP7749829B2 - 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法 - Google Patents

導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法

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Publication number
JP7749829B2
JP7749829B2 JP2024521956A JP2024521956A JP7749829B2 JP 7749829 B2 JP7749829 B2 JP 7749829B2 JP 2024521956 A JP2024521956 A JP 2024521956A JP 2024521956 A JP2024521956 A JP 2024521956A JP 7749829 B2 JP7749829 B2 JP 7749829B2
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JP
Japan
Prior art keywords
piezoelectric film
conductive
film
less
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024521956A
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English (en)
Japanese (ja)
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JPWO2023224056A1 (https=
Inventor
誠 今治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kureha Corp
Original Assignee
Kureha Corp
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Publication date
Application filed by Kureha Corp filed Critical Kureha Corp
Publication of JPWO2023224056A1 publication Critical patent/JPWO2023224056A1/ja
Application granted granted Critical
Publication of JP7749829B2 publication Critical patent/JP7749829B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
JP2024521956A 2022-05-18 2023-05-17 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法 Active JP7749829B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022081448 2022-05-18
JP2022081448 2022-05-18
PCT/JP2023/018367 WO2023224056A1 (ja) 2022-05-18 2023-05-17 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法

Publications (2)

Publication Number Publication Date
JPWO2023224056A1 JPWO2023224056A1 (https=) 2023-11-23
JP7749829B2 true JP7749829B2 (ja) 2025-10-06

Family

ID=88835562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024521956A Active JP7749829B2 (ja) 2022-05-18 2023-05-17 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法

Country Status (7)

Country Link
US (1) US20250318433A1 (https=)
EP (1) EP4503902A4 (https=)
JP (1) JP7749829B2 (https=)
KR (1) KR20250002465A (https=)
CN (1) CN119138128A (https=)
TW (1) TWI866217B (https=)
WO (1) WO2023224056A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI903935B (zh) * 2023-12-21 2025-11-01 日商吳羽股份有限公司 積層壓電體及其製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013146972A (ja) 2012-01-23 2013-08-01 Toray Ind Inc 積層フィルム、導電性基板、及び導電性基板の製造方法
WO2016076071A1 (ja) 2014-11-14 2016-05-19 三井化学株式会社 高分子圧電フィルム
WO2017155006A1 (ja) 2016-03-09 2017-09-14 三井化学株式会社 積層体
JP2017216451A (ja) 2016-05-30 2017-12-07 日東電工株式会社 透明電極付き圧電フィルムおよび圧力センサ
WO2021200790A1 (ja) 2020-04-02 2021-10-07 株式会社クレハ 積層フィルム、その製造方法および利用
JP2021174834A (ja) 2020-04-22 2021-11-01 ダイキン工業株式会社 含フッ素重合体フィルム
WO2022091829A1 (ja) 2020-10-30 2022-05-05 株式会社クレハ 透明導電圧電フィルムおよびタッチパネル

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05324203A (ja) 1992-05-22 1993-12-07 Fujitsu Ltd 静電容量型タッチパネル

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013146972A (ja) 2012-01-23 2013-08-01 Toray Ind Inc 積層フィルム、導電性基板、及び導電性基板の製造方法
WO2016076071A1 (ja) 2014-11-14 2016-05-19 三井化学株式会社 高分子圧電フィルム
WO2017155006A1 (ja) 2016-03-09 2017-09-14 三井化学株式会社 積層体
JP2017216451A (ja) 2016-05-30 2017-12-07 日東電工株式会社 透明電極付き圧電フィルムおよび圧力センサ
WO2021200790A1 (ja) 2020-04-02 2021-10-07 株式会社クレハ 積層フィルム、その製造方法および利用
JP2021174834A (ja) 2020-04-22 2021-11-01 ダイキン工業株式会社 含フッ素重合体フィルム
WO2022091829A1 (ja) 2020-10-30 2022-05-05 株式会社クレハ 透明導電圧電フィルムおよびタッチパネル

Also Published As

Publication number Publication date
KR20250002465A (ko) 2025-01-07
EP4503902A4 (en) 2025-08-06
JPWO2023224056A1 (https=) 2023-11-23
TWI866217B (zh) 2024-12-11
US20250318433A1 (en) 2025-10-09
WO2023224056A1 (ja) 2023-11-23
TW202348429A (zh) 2023-12-16
CN119138128A (zh) 2024-12-13
EP4503902A1 (en) 2025-02-05

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