KR20250002465A - 도전 압전 필름, 디바이스 및 도전 압전 필름의 제조방법 - Google Patents
도전 압전 필름, 디바이스 및 도전 압전 필름의 제조방법 Download PDFInfo
- Publication number
- KR20250002465A KR20250002465A KR1020247037626A KR20247037626A KR20250002465A KR 20250002465 A KR20250002465 A KR 20250002465A KR 1020247037626 A KR1020247037626 A KR 1020247037626A KR 20247037626 A KR20247037626 A KR 20247037626A KR 20250002465 A KR20250002465 A KR 20250002465A
- Authority
- KR
- South Korea
- Prior art keywords
- piezoelectric film
- conductive
- film
- less
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/098—Forming organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022081448 | 2022-05-18 | ||
| JPJP-P-2022-081448 | 2022-05-18 | ||
| PCT/JP2023/018367 WO2023224056A1 (ja) | 2022-05-18 | 2023-05-17 | 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250002465A true KR20250002465A (ko) | 2025-01-07 |
Family
ID=88835562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247037626A Pending KR20250002465A (ko) | 2022-05-18 | 2023-05-17 | 도전 압전 필름, 디바이스 및 도전 압전 필름의 제조방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250318433A1 (https=) |
| EP (1) | EP4503902A4 (https=) |
| JP (1) | JP7749829B2 (https=) |
| KR (1) | KR20250002465A (https=) |
| CN (1) | CN119138128A (https=) |
| TW (1) | TWI866217B (https=) |
| WO (1) | WO2023224056A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI903935B (zh) * | 2023-12-21 | 2025-11-01 | 日商吳羽股份有限公司 | 積層壓電體及其製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05324203A (ja) | 1992-05-22 | 1993-12-07 | Fujitsu Ltd | 静電容量型タッチパネル |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013146972A (ja) * | 2012-01-23 | 2013-08-01 | Toray Ind Inc | 積層フィルム、導電性基板、及び導電性基板の製造方法 |
| KR101972242B1 (ko) * | 2014-11-14 | 2019-04-24 | 미쯔이가가꾸가부시끼가이샤 | 고분자 압전 필름 |
| EP3418049B1 (en) * | 2016-03-09 | 2021-02-17 | Mitsui Chemicals, Inc. | Laminated article |
| JP6907026B2 (ja) * | 2016-05-30 | 2021-07-21 | 日東電工株式会社 | 透明電極付き圧電フィルムおよび圧力センサ |
| KR20220140840A (ko) * | 2020-04-02 | 2022-10-18 | 가부시끼가이샤 구레하 | 적층 필름, 그의 제조 방법 및 이용 |
| JP7071664B2 (ja) * | 2020-04-22 | 2022-05-19 | ダイキン工業株式会社 | 含フッ素重合体フィルム |
| CN116348285A (zh) * | 2020-10-30 | 2023-06-27 | 株式会社吴羽 | 透明导电压电膜及触摸面板 |
-
2023
- 2023-05-17 EP EP23807657.4A patent/EP4503902A4/en active Pending
- 2023-05-17 US US18/865,542 patent/US20250318433A1/en active Pending
- 2023-05-17 CN CN202380037206.9A patent/CN119138128A/zh active Pending
- 2023-05-17 TW TW112118308A patent/TWI866217B/zh active
- 2023-05-17 WO PCT/JP2023/018367 patent/WO2023224056A1/ja not_active Ceased
- 2023-05-17 JP JP2024521956A patent/JP7749829B2/ja active Active
- 2023-05-17 KR KR1020247037626A patent/KR20250002465A/ko active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05324203A (ja) | 1992-05-22 | 1993-12-07 | Fujitsu Ltd | 静電容量型タッチパネル |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4503902A4 (en) | 2025-08-06 |
| JP7749829B2 (ja) | 2025-10-06 |
| JPWO2023224056A1 (https=) | 2023-11-23 |
| TWI866217B (zh) | 2024-12-11 |
| US20250318433A1 (en) | 2025-10-09 |
| WO2023224056A1 (ja) | 2023-11-23 |
| TW202348429A (zh) | 2023-12-16 |
| CN119138128A (zh) | 2024-12-13 |
| EP4503902A1 (en) | 2025-02-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| D22 | Grant of ip right intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |