CN119138128A - 导电压电膜、器件以及导电压电膜的制造方法 - Google Patents

导电压电膜、器件以及导电压电膜的制造方法 Download PDF

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Publication number
CN119138128A
CN119138128A CN202380037206.9A CN202380037206A CN119138128A CN 119138128 A CN119138128 A CN 119138128A CN 202380037206 A CN202380037206 A CN 202380037206A CN 119138128 A CN119138128 A CN 119138128A
Authority
CN
China
Prior art keywords
conductive
piezoelectric film
film
less
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380037206.9A
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English (en)
Chinese (zh)
Inventor
今治诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kureha Corp
Original Assignee
Kureha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kureha Corp filed Critical Kureha Corp
Publication of CN119138128A publication Critical patent/CN119138128A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
CN202380037206.9A 2022-05-18 2023-05-17 导电压电膜、器件以及导电压电膜的制造方法 Pending CN119138128A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022081448 2022-05-18
JP2022-081448 2022-05-18
PCT/JP2023/018367 WO2023224056A1 (ja) 2022-05-18 2023-05-17 導電圧電フィルム、デバイス、及び導電圧電フィルムの製造方法

Publications (1)

Publication Number Publication Date
CN119138128A true CN119138128A (zh) 2024-12-13

Family

ID=88835562

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380037206.9A Pending CN119138128A (zh) 2022-05-18 2023-05-17 导电压电膜、器件以及导电压电膜的制造方法

Country Status (7)

Country Link
US (1) US20250318433A1 (https=)
EP (1) EP4503902A4 (https=)
JP (1) JP7749829B2 (https=)
KR (1) KR20250002465A (https=)
CN (1) CN119138128A (https=)
TW (1) TWI866217B (https=)
WO (1) WO2023224056A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI903935B (zh) * 2023-12-21 2025-11-01 日商吳羽股份有限公司 積層壓電體及其製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05324203A (ja) 1992-05-22 1993-12-07 Fujitsu Ltd 静電容量型タッチパネル
JP2013146972A (ja) * 2012-01-23 2013-08-01 Toray Ind Inc 積層フィルム、導電性基板、及び導電性基板の製造方法
KR101972242B1 (ko) * 2014-11-14 2019-04-24 미쯔이가가꾸가부시끼가이샤 고분자 압전 필름
EP3418049B1 (en) * 2016-03-09 2021-02-17 Mitsui Chemicals, Inc. Laminated article
JP6907026B2 (ja) * 2016-05-30 2021-07-21 日東電工株式会社 透明電極付き圧電フィルムおよび圧力センサ
KR20220140840A (ko) * 2020-04-02 2022-10-18 가부시끼가이샤 구레하 적층 필름, 그의 제조 방법 및 이용
JP7071664B2 (ja) * 2020-04-22 2022-05-19 ダイキン工業株式会社 含フッ素重合体フィルム
CN116348285A (zh) * 2020-10-30 2023-06-27 株式会社吴羽 透明导电压电膜及触摸面板

Also Published As

Publication number Publication date
KR20250002465A (ko) 2025-01-07
EP4503902A4 (en) 2025-08-06
JP7749829B2 (ja) 2025-10-06
JPWO2023224056A1 (https=) 2023-11-23
TWI866217B (zh) 2024-12-11
US20250318433A1 (en) 2025-10-09
WO2023224056A1 (ja) 2023-11-23
TW202348429A (zh) 2023-12-16
EP4503902A1 (en) 2025-02-05

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