TWI866217B - 導電壓電膜、壓電面板、壓力感測器、觸覺感知裝置用致動器、壓電振動發電裝置、平面揚聲器及導電壓電膜之製造方法 - Google Patents

導電壓電膜、壓電面板、壓力感測器、觸覺感知裝置用致動器、壓電振動發電裝置、平面揚聲器及導電壓電膜之製造方法 Download PDF

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Publication number
TWI866217B
TWI866217B TW112118308A TW112118308A TWI866217B TW I866217 B TWI866217 B TW I866217B TW 112118308 A TW112118308 A TW 112118308A TW 112118308 A TW112118308 A TW 112118308A TW I866217 B TWI866217 B TW I866217B
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TW
Taiwan
Prior art keywords
piezoelectric film
conductive
film
piezoelectric
less
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TW112118308A
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English (en)
Chinese (zh)
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TW202348429A (zh
Inventor
今治誠
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日商吳羽股份有限公司
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Publication of TW202348429A publication Critical patent/TW202348429A/zh
Application granted granted Critical
Publication of TWI866217B publication Critical patent/TWI866217B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
TW112118308A 2022-05-18 2023-05-17 導電壓電膜、壓電面板、壓力感測器、觸覺感知裝置用致動器、壓電振動發電裝置、平面揚聲器及導電壓電膜之製造方法 TWI866217B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022081448 2022-05-18
JP2022-081448 2022-05-18

Publications (2)

Publication Number Publication Date
TW202348429A TW202348429A (zh) 2023-12-16
TWI866217B true TWI866217B (zh) 2024-12-11

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Family Applications (1)

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TW112118308A TWI866217B (zh) 2022-05-18 2023-05-17 導電壓電膜、壓電面板、壓力感測器、觸覺感知裝置用致動器、壓電振動發電裝置、平面揚聲器及導電壓電膜之製造方法

Country Status (7)

Country Link
US (1) US20250318433A1 (https=)
EP (1) EP4503902A4 (https=)
JP (1) JP7749829B2 (https=)
KR (1) KR20250002465A (https=)
CN (1) CN119138128A (https=)
TW (1) TWI866217B (https=)
WO (1) WO2023224056A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI903935B (zh) * 2023-12-21 2025-11-01 日商吳羽股份有限公司 積層壓電體及其製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107078208A (zh) * 2014-11-14 2017-08-18 三井化学株式会社 高分子压电膜
WO2022091829A1 (ja) * 2020-10-30 2022-05-05 株式会社クレハ 透明導電圧電フィルムおよびタッチパネル

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05324203A (ja) 1992-05-22 1993-12-07 Fujitsu Ltd 静電容量型タッチパネル
JP2013146972A (ja) * 2012-01-23 2013-08-01 Toray Ind Inc 積層フィルム、導電性基板、及び導電性基板の製造方法
EP3418049B1 (en) * 2016-03-09 2021-02-17 Mitsui Chemicals, Inc. Laminated article
JP6907026B2 (ja) * 2016-05-30 2021-07-21 日東電工株式会社 透明電極付き圧電フィルムおよび圧力センサ
KR20220140840A (ko) * 2020-04-02 2022-10-18 가부시끼가이샤 구레하 적층 필름, 그의 제조 방법 및 이용
JP7071664B2 (ja) * 2020-04-22 2022-05-19 ダイキン工業株式会社 含フッ素重合体フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107078208A (zh) * 2014-11-14 2017-08-18 三井化学株式会社 高分子压电膜
WO2022091829A1 (ja) * 2020-10-30 2022-05-05 株式会社クレハ 透明導電圧電フィルムおよびタッチパネル

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Publication number Publication date
KR20250002465A (ko) 2025-01-07
EP4503902A4 (en) 2025-08-06
JP7749829B2 (ja) 2025-10-06
JPWO2023224056A1 (https=) 2023-11-23
US20250318433A1 (en) 2025-10-09
WO2023224056A1 (ja) 2023-11-23
TW202348429A (zh) 2023-12-16
CN119138128A (zh) 2024-12-13
EP4503902A1 (en) 2025-02-05

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