JP7434598B2 - 透明導電圧電フィルムおよびタッチパネル - Google Patents
透明導電圧電フィルムおよびタッチパネル Download PDFInfo
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- JP7434598B2 JP7434598B2 JP2022559019A JP2022559019A JP7434598B2 JP 7434598 B2 JP7434598 B2 JP 7434598B2 JP 2022559019 A JP2022559019 A JP 2022559019A JP 2022559019 A JP2022559019 A JP 2022559019A JP 7434598 B2 JP7434598 B2 JP 7434598B2
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- transparent
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- coating layer
- transparent conductive
- transparent electrode
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Description
本発明の一実施形態に係る透明導電圧電フィルム(透明圧電積層フィルム)は、透明圧電フィルム、透明コーティング層および透明電極がこの順で重ねられて構成されている。本実施形態において、「この順で重ねられている」とは、上記のフィルム、層および電極(以下、「層など」とも言う)を含む積層物において、当該フィルムおよび層が列挙された順番で配置されている状態を意味する。上記のフィルムおよび層は、本実施形態の効果を奏する範囲において、互いに接して重ねられていてもよいし、他のフィルムまたは層を介して重ねられていてもよい。
本実施形態における透明圧電フィルムは、フッ素樹脂製である。本実施形態において「フッ素樹脂製」とは、透明圧電フィルムを構成する組成物においてフッ素樹脂が主成分であることを意味し、「フッ素樹脂が主成分である」とは、当該組成物においてフッ素樹脂が樹脂成分中で最多の成分であることを意味する。当該組成物におけるフッ素樹脂の含有量は、51質量%以上であってよく、80質量%以上であってよく、100質量%であってよい。
本実施形態における透明コーティング層は、透明圧電フィルムと透明電極との間に位置する。透明コーティング層は、透明であり、また透明圧電フィルムに対して面方向の変形を抑制するのに十分な寸法安定性を有する層であればよい。また、透明コーティング層は、透明圧電フィルムの光学的な特性に実質的な影響を及ぼさない不活性さを有する層であることが、透明圧電フィルムの変色を抑制する観点から好ましい。
本実施形態における透明電極は、平面状の広がりを有し導電性を有する構造であり、透明導電層とも言える。透明電極は、当該平面状の広がりを一つの層と仮定した時に、当該層が十分な透明性を発現すればよく、そのような構造であれば透明電極そのものが透明性を有さなくてもよい。たとえば、透明電極は、高い透明性を有する導電性の部材または組成で構成されてもよいし、透明性を有さない材料で構成されるが十分な透明性を発現可能な極薄または極細の微細な構造であってもよい。
本実施形態の透明導電圧電フィルムは、本実施形態における効果が発現される範囲において、前述以外の他の構成をさらに有していてもよい。このような他の構成は、一種でもそれ以上でもよく、その例には、透明粘着剤層、および、当該透明粘着剤層に当接し剥離可能な離型層が含まれる。
本実施形態の透明導電圧電フィルムは、85℃の環境に250時間放置したときの放置前の表面抵抗値の比に対する、放置後の表面抵抗値の比が1.30以下である。透明圧電フィルムを構成するフッ素樹脂は、PETなどの本技術分野で従来汎用されている、二軸延伸による樹脂製フィルムに比べて、一般に熱収縮性が強い。このため、高温環境下では透明圧電フィルムが膨張、収縮しやすい。透明導電圧電フィルムの上記の表面抵抗値の比が1.30以下であることは、高温環境に一時的でも置かれることがある場合に、透明導電圧電フィルムにおける透明圧電フィルムの変形が十分に抑制される。このため、当該透明圧電フィルムの変形による透明電極の剥離が防止され、透明導電圧電フィルムにおける抵抗値の変化が十分に抑制される。
本実施形態の透明導電圧電フィルムは、フッ素樹脂製の透明圧電フィルムの少なくとも一方の面上に0.6~4.5μmの総厚みを有する透明コーティング層を形成する工程と、透明コーティング層の表面に透明電極を形成する工程と、を含む方法によって製造することが可能である。
本発明の一実施形態のタッチパネルは、前述した本実施形態の透明導電圧電フィルムを有する。当該タッチパネルにおける透明導電圧電フィルムの位置および数は、タッチパネルの用途または所期の機能に応じて、適宜に決めることができる。図3は、本発明の実施形態のタッチパネルにおける層構成の一例を模式的に示す図である。
本実施形態の透明導電圧電フィルムは、前述したように、透明圧電フィルム、透明コーティング層および透明電極がこの順で重ねられて構成されており、透明コーティング層は特定の厚みを有する。このため、特定の高温高湿環境下での表面抵抗値の変化を十分に抑制することが可能である。
透明コーティング層は、平面状に形成されていなくてもよく、たとえば格子状のようなパターンを有するように形成されていてもよい。透明コーティング層が複数の層で構成される場合では、複数の層の一部が上記パターンを有していてもよいし、全部が上記パターンを有していてもよい。パターンは、同一であっても異なっていてもよい。
以上の説明から明らかなように、本発明の実施形態の透明導電圧電フィルムは、フッ素樹脂製の透明圧電フィルム、透明コーティング層および透明電極がこの順で重ねられて構成されており、コーティング層の総厚みは、0.6~4.5μmであり、85℃の環境に250時間放置したときの放置前の表面抵抗値の比に対する、放置後の表面抵抗値の比が1.30以下である。また、本発明の実施形態のタッチパネルは、当該透明導電圧電フィルムを有する。したがって、当該透明導電圧電フィルムおよびタッチパネルは、いずれも、フッ素樹脂製の透明圧電フィルムを有する透明導電圧電フィルムにおいて、高温環境下による表面抵抗値の変化の抑制を実現することができる。
インヘレント粘度が1.3dl/gであるポリフッ化ビニリデン(株式会社クレハ製)から成形された樹脂フィルム(厚さ、120μm)を、表面温度110℃に加熱されている予熱ロールに通した。続いて、予熱ロールに通したフィルムを表面温度120℃に加熱されている延伸ロールに通し、延伸倍率が4.2倍になるように延伸した。延伸後、フィルムを分極ロールに通して分極処理を行い、圧電フィルムを得た。その際、直流電圧は0kVから13.5kVへと増加させながら印加することで分極処理を行った。分極処理後のフィルムをさらに130℃で1分間熱処理することで、厚みが40μmの透明圧電フィルムを得た。
<条件>
初期圧力:到達真空度が7.0×10-4Pa以下
供給ガスの種類:Ar、O2
供給ガスの圧力:Ar:O2=100:1
透明コーティング層の厚みを1.5μmに変更したこと以外は実施例1と同様にして、透明導電圧電フィルムを得た。
透明コーティング層の厚みを1.0μmに変更したこと以外は実施例1と同様にして、透明導電圧電フィルムを得た。
実施例1におけるポリフッ化ビニリデン樹脂フィルムの分極処理における直流電圧を11.8kVに変更した。ハードコート剤に、「TYAB-M101」(トーヨーケム株式会社製)に代えて「BS CH271」(荒川化学工業株式会社製)を使用した。そして、透明圧電フィルムの第一主面に厚み0.4μmの透明コーティング層を形成し、さらに透明圧電フィルムのもう一方の片面(第二主面)に厚み0.4μmの透明コーティング層を形成した。そして第一主面側の透明コーティング層の表面に、実施例1と同様にしてITO膜を形成して透明導電圧電フィルムを得た。
第一主面上および第二主面上のそれぞれの透明コーティング層の厚みを0.7μmにする以外は実施例4と同様にして、透明導電圧電フィルムを得た。
第一主面上に厚み1.0μmの透明コーティング層を形成し、第二主面上に厚み0.9μmの透明コーティング層を形成する以外は実施例4と同様にして、透明導電圧電フィルムを得た。
第一主面上に厚み1.9μmの透明コーティング層を形成し、第二主面上に厚み2.1μmの透明コーティング層を形成する以外は実施例4と同様にして、透明導電圧電フィルムを得た。
透明コーティング層の厚みを0.4μmに変更したこと以外は実施例1と同様にして、透明導電圧電フィルムを得た。
透明コーティング層を形成せず、透明圧電フィルムにITO膜を形成したこと以外は実施例1にして、透明導電圧電フィルムを得た。
[透明コーティング層の厚み]
実施例1~7および比較例1の透明導電圧電フィルムのそれぞれをエポキシ樹脂に包埋し、透明導電圧電フィルムの断面が露出するようにエポキシ樹脂隗を切断した。露出した透明導電圧電フィルムの断面を、走査型電子顕微鏡(「SU3800」、株式会社日立ハイテク製)を用いて加速電圧3.0kV、倍率50,000倍の条件で観察し、透明導電圧電フィルム中の透明コーティング層の厚みを測定した。
実施例1~7、比較例1および比較例2の透明導電圧電フィルムのそれぞれの断面を、上記走査型電子顕微鏡を用いて、加速電圧3.0kV、倍率50,000倍の条件で観察し、各ITO膜の二か所で厚みを測定した。得られた測定値の平均値を算出し、透明導電層の厚みとした。
実施例1~7、比較例1および比較例2の透明導電圧電フィルムにおける、透明導電層であるITO膜の付着性を、ASTM試験法 D3359に準拠して測定した。
実施例1~7、比較例1および比較例2の透明導電圧電フィルムのそれぞれについて、JIS K7197-1991に準拠して、透明圧電フィルムの垂直方向(TD方向)における、常温(25℃)から85℃の線膨張係数を測定した。当該線膨張係数の測定には、熱機械分析装置(「TMA8311」、リガク社製)を用い、下記式を用いて平均線膨張係数(CTE)を算出し、透明導電圧電フィルムの線膨張係数とした。下記式中、「lr」は常温における試料の長さを表し、「l1」は温度T1(℃)における試料の長さを表し、「l2」は温度T2(℃)における試料の長さを表す。「t1」は25℃であり、「t2」は85℃である。
実施例1~7、比較例1および比較例2の透明導電圧電フィルムのそれぞれを、85℃の雰囲気に制御された恒温槽(「エコナスLH34-14M」、ナガノサイエンス株式会社製)内に500時間置いた。
実施例1~7、比較例1および比較例2の透明導電圧電フィルムのそれぞれの圧電定数d33を、圧電定数測定装置(「ピエゾメーターシステムPM300」、PIEZOTEST社製)を用いて、0.2Nでサンプルをクリップし、0.15N、110Hzの力を加えた際の発生電荷を読み取った。圧電定数d33の実測値は、測定されるフィルムの表裏によって、プラスの値、またはマイナスの値となるが、本明細書中においては絶対値を記載した。いずれの透明導電圧電フィルムのd33も、6.0~30の範囲内であり、タッチパネルの用途において実用上十分な圧電特性を有することを確認した。
実施例1~7、比較例1および比較例2の透明導電圧電フィルムのそれぞれについて、ITO膜のX線回折におけるITO由来の回折ピークの有無を測定した。当該回折ピークの有無は、X線回折装置(XRD)を用いるITO膜の表面のインプレーン(In-Plane)法によって測定した。当該測定において、回折角(2θ)=15.0~70.0°の範囲を走査速度1°/分で走査した。測定条件の詳細を以下に示す。ITO由来の回折ピークが測定される場合を「d.」とし、測定されない場合を「n.d.」とする。
<測定条件>
装置:株式会社リガク製SmartLab
X線源:Cu-Kα(λ=1.5418Å) 40kV 30mA
検出器:SC-70
ステップ幅:0.04°
スキャン範囲:15.0~70.0°
スリット:入射スリット=0.2mm
長手制御スリット=10mm
受光スリット=20mm
表1および図4から明らかなように、実施例1~7の透明導電圧電フィルムは、いずれも、R250/R0が十分に低く、また十分な透明性を有している。これは、透明導電圧電フィルムが十分な厚みの透明コーティング層を有することにより、高温高湿環境下における当該フィルムの熱収縮が抑制され、熱収縮に伴うITOのクラック発生または剥がれの発生を十分に抑制することができたためと考えられる。
2、2a、2b 透明コーティング層
3、3a、3b、3c、3d 透明電極
4a、4b、4c 透明粘着剤層
5 カバーガラス
6a、6b、6c 透明基板
10、20 透明導電圧電フィルム
30 ディスプレイ
100 タッチパネル
Claims (9)
- フッ素樹脂製の透明圧電フィルム、透明コーティング層および透明電極がこの順で重ねられて構成されており、
前記透明圧電フィルムの厚みが20μm以上200μm以下であり、
前記透明コーティング層の総厚みは、0.6~4.5μmであり、
85℃の環境に250時間放置したときの放置前の表面抵抗値に対する、放置後の表面抵抗値の比が1.30以下である、透明導電圧電フィルム。 - 熱機械分析で求められる線膨張係数は、310×10-6K-1以下である、請求項1に記載の透明導電圧電フィルム。
- 前記透明電極は、インジウム-スズ複合酸化物で構成されており、かつ、X線回折における前記インジウム-スズ複合酸化物のピークが検出されない、請求項1または2に記載の透明導電圧電フィルム。
- 前記透明コーティング層が(メタ)アクリル酸エステル樹脂製である、請求項1~3のいずれか一項に記載の透明導電圧電フィルム。
- フッ素樹脂製の透明圧電フィルムの少なくとも一方の面上に0.6~4.5μmの総厚みを有する透明コーティング層を形成する工程と、
前記透明コーティング層の表面に、85℃の環境に250時間放置したときの放置前の表面抵抗値に対する、放置後の表面抵抗値の比が1.30以下である透明電極を形成する工程と、
を含む、透明導電圧電フィルムの製造方法。 - 前記透明電極を形成する工程では、酸化インジウムおよび酸化スズを含有する焼結体を原料とする反応性スパッタリング法によって、前記透明コーティング層上に前記透明電極としてインジウム-スズ複合酸化物の薄膜を形成する、請求項5に記載の透明導電圧電フィルムの製造方法。
- 前記透明電極を形成する工程において、反応性スパッタリングを80℃以下の温度で実施する、請求項6に記載の透明導電圧電フィルムの製造方法。
- 前記透明電極を形成する工程で形成した透明電極のアニーリング処理を実施しない、請求項5~7のいずれか一項に記載の透明圧電積層フィルムの製造方法。
- 請求項1~4のいずれか一項に記載の透明導電圧電フィルムを有するタッチパネル。
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