WO2022075370A1 - Film adhésif pour connexion de circuit, matériau pour connexion de circuit, structure de connexion de circuit et procédé de fabrication de structure de connexion de circuit - Google Patents

Film adhésif pour connexion de circuit, matériau pour connexion de circuit, structure de connexion de circuit et procédé de fabrication de structure de connexion de circuit Download PDF

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Publication number
WO2022075370A1
WO2022075370A1 PCT/JP2021/037013 JP2021037013W WO2022075370A1 WO 2022075370 A1 WO2022075370 A1 WO 2022075370A1 JP 2021037013 W JP2021037013 W JP 2021037013W WO 2022075370 A1 WO2022075370 A1 WO 2022075370A1
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WIPO (PCT)
Prior art keywords
component
adhesive
circuit connection
mass
adhesive film
Prior art date
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PCT/JP2021/037013
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English (en)
Japanese (ja)
Inventor
将人 福井
孝 中澤
裕行 酒井
和也 成冨
Original Assignee
昭和電工マテリアルズ株式会社
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Priority to JP2022555537A priority Critical patent/JPWO2022075370A1/ja
Publication of WO2022075370A1 publication Critical patent/WO2022075370A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the present disclosure relates to an adhesive film for circuit connection, a material for circuit connection, a circuit connection structure, and a method for manufacturing the same.
  • a liquid crystal display panel, an organic EL panel, or the like has been used as various display means for televisions, PC monitors, mobile phones, smart phones, and the like.
  • a so-called COG (chip on glass) mounting in which a driving IC is directly mounted on a glass substrate of a display panel is adopted from the viewpoint of fine pitch, light weight and thinness.
  • a semiconductor element such as a liquid crystal driving IC is connected on a transparent substrate (glass substrate or the like) having a plurality of transparent electrodes (ITO (indium tin oxide) or the like).
  • ITO indium tin oxide
  • a circuit connection adhesive film in which conductive particles are dispersed in the adhesive is used.
  • the liquid crystal drive IC when a liquid crystal drive IC is mounted as a semiconductor element, the liquid crystal drive IC has a plurality of electrode terminals corresponding to transparent electrodes on the mounting surface thereof, and the liquid crystal drive is driven via an adhesive film for circuit connection. By thermocompression bonding the IC for use on a transparent substrate, the electrode terminals and the transparent electrodes are connected, and a circuit connection structure can be obtained.
  • connection resistance increases in the obtained circuit connection structure due to differences in electrode material, substrate material, drive method, etc., and reliability. May occur.
  • circuit connection adhesive film capable of forming a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting. ..
  • the circuit connection adhesive film contains a first region containing conductive particles and a first adhesive component, and a second adhesive component provided adjacent to the first region. With the area of. At least one of the first adhesive component and the second adhesive component contains a monofunctional oxetane compound. According to such a circuit connection adhesive film, it is possible to form a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting.
  • the melt viscosity of the monofunctional oxetane compound is considered to be lower than that of the polyfunctional epoxy compound (resin) and the polyfunctional oxetane compound (resin) usually used in the field of adhesive films for circuit connection.
  • the melt viscosity is low, the resin can be easily removed when the circuit is connected, so that the connection resistance between the facing electrodes of the circuit connection structure can be reduced, and as a result, good conduction characteristics can be ensured. It will be possible.
  • the curing shrinkage of the monofunctional oxetane compound is considered to be smaller than that of the polyfunctional epoxy compound (resin) and the polyfunctional oxetane compound (resin) usually used in the field of the adhesive film for circuit connection.
  • the curing shrinkage is small, for example, the stress released in the reliability test under high temperature and high humidity conditions is small, so that peeling between the circuit connection adhesive film and the substrate is suppressed and the connection reliability is improved. Can be done.
  • such a circuit connection adhesive film is also excellent in terms of ease of peeling when the base material (for example, PET film) is peeled from the circuit connection adhesive film when applied to COP mounting.
  • Such a circuit connection adhesive film can be suitably used for COP mounting, and more specifically, a plastic substrate (where a circuit electrode in an organic EL display is formed) and a plastic substrate (such as a drive IC). It can be suitably used for connection with an IC chip.
  • the second adhesive component contains a monofunctional oxetane compound.
  • the first adhesive component may contain a cured product of a photocurable resin component.
  • the first adhesive component may further contain a thermosetting resin component.
  • the conductive particles may contain at least one metal selected from the group consisting of gold, palladium, and nickel.
  • the circuit connection material contains an adhesive component containing a monofunctional oxetane compound. Such a circuit connection material can be suitably used when forming the circuit connection adhesive film.
  • the circuit connection material may further contain conductive particles.
  • Another aspect of this disclosure relates to a method of manufacturing a circuit connection structure.
  • the method for manufacturing the circuit connection structure is such that the above-mentioned circuit connection adhesive film or the above-mentioned circuit connection adhesive film is used between the first circuit member having the first electrode and the second circuit member having the second electrode.
  • a step of electrically connecting the first electrode and the second electrode to each other by heat-pressing the first circuit member and the second circuit member with the above-mentioned circuit connection material interposed therebetween is provided.
  • the circuit connection structure is arranged between a first circuit member having a first electrode, a second circuit member having a second electrode, and a first circuit member and a second circuit member.
  • a circuit connection portion for electrically connecting the first electrode and the second electrode to each other is provided.
  • the circuit connection portion includes a cured product of the above-mentioned adhesive film for circuit connection or a cured product of the above-mentioned material for circuit connection.
  • an adhesive film for circuit connection capable of forming a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting.
  • the circuit connection adhesive film according to some forms is also excellent in terms of ease of peeling when the base material (for example, PET film) is peeled from the circuit connection adhesive film when applied to COP mounting. ..
  • Such a circuit connection adhesive film can be suitably used for COP mounting.
  • a circuit connection material that can be suitably used when forming such a circuit connection adhesive film.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection.
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit connection structure.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure. 3 (a) and 3 (b) are schematic cross-sectional views showing each process.
  • the numerical range indicated by using "-" indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value of the numerical range of one step may be replaced with the upper limit value or the lower limit value of the numerical range of another step.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
  • the upper limit value and the lower limit value described individually can be arbitrarily combined.
  • the numerical values A and B at both ends are included in the numerical range as the lower limit value and the upper limit value, respectively.
  • the description of "10 or more” means “10” and “a numerical value exceeding 10", and the same applies when the numerical values are different.
  • the description “10 or less” means “10” and “a numerical value less than 10", and the same applies when the numerical values are different.
  • the term “(meth) acrylate” means at least one of acrylate and the corresponding methacrylate. The same applies to other similar expressions such as “(meth) acryloyl”.
  • “(poly)” means both with and without the prefix of "poly”.
  • a or B may include either A or B, and may include both.
  • each component in the composition means the total amount of the plurality of substances present in the composition when a plurality of substances corresponding to each component are present in the composition, unless otherwise specified.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection.
  • the circuit connection adhesive film 10 (hereinafter, may be simply referred to as “adhesive film 10”) shown in FIG. 1 includes a first region 1 containing the conductive particles 4 and the first adhesive component. It includes a second region 2 containing a second adhesive component, which is provided adjacent to the first region 1.
  • the adhesive component may be composed of a first adhesive component and a second adhesive component. At least one of the first adhesive component and the second adhesive component contains a monofunctional oxetane compound.
  • the first region 1 may be a region formed from the first adhesive film (first adhesive layer).
  • the second region 2 may be a region formed from the second adhesive film (second adhesive layer).
  • the adhesive film 10 contains a first adhesive layer containing the conductive particles 4 and the first adhesive component, and a second adhesive component provided on the first adhesive layer. It can also be said that it has an adhesive layer of.
  • the adhesive film 10 the conductive particles 4 are dispersed in the first region 1. Therefore, the adhesive film 10 can be an anisotropically conductive adhesive film.
  • the adhesive film 10 is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and heats the first circuit member and the second circuit member. It may be crimped and used to electrically connect the first electrode and the second electrode to each other.
  • the first region 1 (first adhesive layer) may be referred to as conductive particles 4 (hereinafter, may be referred to as “(A) component”) and an adhesive component (hereinafter, may be referred to as “(B) component”). ) (First adhesive component).
  • Component (A) Conductive particles
  • the component (A) is not particularly limited as long as it is a particle having conductivity, and is a metal particle composed of a metal such as Au, Ag, Pd, Ni, Cu, or solder, or conductive carbon. It may be conductive carbon particles composed of.
  • the component (A) may contain at least one metal selected from the group consisting of gold, palladium, and nickel.
  • the component (A) may be a coated conductive particle containing a nucleus containing non-conductive glass, ceramic, plastic (polystyrene, etc.) and the like, and a coating layer containing the metal or conductive carbon and covering the nucleus. good.
  • the component (A) preferably contains metal particles formed of a heat-meltable metal or a core containing plastic, and contains a metal or conductive carbon and has a coating layer covering the core. It is a particle. Since such coated conductive particles can easily deform the cured product of the thermosetting resin component by heating or pressurizing, when the electrodes are electrically connected to each other, the electrode and the component (A) are connected to each other. The contact area can be increased and the conductivity between the electrodes can be further improved.
  • the component (A) may be an insulating coated conductive particle containing the above-mentioned metal particles, conductive carbon particles, or coated conductive particles and an insulating material such as a resin and having an insulating layer covering the surface of the particles. good.
  • the component (A) is an insulating coated conductive particle, even when the content of the component (A) is large, the surface of the particle is coated with the resin, so that the component (A) is short-circuited due to contact with each other. The generation can be suppressed, and the insulation between adjacent electrode circuits can be improved.
  • one of the above-mentioned various conductive particles may be used alone or in combination of two or more.
  • the maximum particle size of the component (A) needs to be smaller than the minimum distance between the electrodes (the shortest distance between adjacent electrodes).
  • the maximum particle size of the component (A) may be 1.0 ⁇ m or more, 2.0 ⁇ m or more, or 2.5 ⁇ m or more from the viewpoint of excellent dispersibility and conductivity.
  • the maximum particle size of the component (A) may be 20 ⁇ m or less, 10 ⁇ m or less, or 5 ⁇ m or less from the viewpoint of excellent dispersibility and conductivity.
  • the particle size of any 300 conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the largest value obtained is the maximum particle size of the component (A).
  • SEM scanning electron microscope
  • the particle size of the component (A) is the diameter of a circle circumscribing the conductive particles in the SEM image.
  • the average particle size of the component (A) may be 1.0 ⁇ m or more, 2.0 ⁇ m or more, or 2.5 ⁇ m or more from the viewpoint of excellent dispersibility and conductivity.
  • the average particle size of the component (A) may be 20 ⁇ m or less, 10 ⁇ m or less, or 5 ⁇ m or less from the viewpoint of excellent dispersibility and conductivity.
  • the particle size of any 300 conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the average value of the obtained particle sizes is taken as the average particle size.
  • the component (A) is preferably uniformly dispersed.
  • the particle density of the component (A) in the adhesive film 10 is 100 pieces / mm 2 or more, 1000 pieces / mm 2 or more, 3000 pieces / mm 2 or more, or 5000 pieces / mm from the viewpoint of obtaining stable connection resistance. It may be 2 or more.
  • the particle density of the component (A) in the adhesive film 10 is 100,000 pieces / mm 2 or less, 70,000 pieces / mm 2 or less, 50,000 pieces / mm 2 or less, or 30,000 from the viewpoint of improving the insulating property between adjacent electrodes. Pieces / mm 2 or less may be used.
  • the content of the component (A) is 1% by mass or more and 5% by mass or more based on the total mass of the first region (first adhesive layer) from the viewpoint of further improving the conductivity. Alternatively, it may be 10% by mass or more.
  • the content of the component (A) is 60% by mass or less, 50% by mass or less, or 40% by mass based on the total mass of the first region (first adhesive layer) from the viewpoint of easily suppressing a short circuit. It may be as follows. When the content of the component (A) is in the above range, the effect of the present disclosure tends to be remarkably exhibited.
  • the content of the component (A) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • Component (B) Adhesive component
  • the component (B) is a monofunctional oxetane compound (hereinafter, may be referred to as "(B1) component”), a polymerizable compound other than the component (B1) (hereinafter, “(B2)). It may contain a “component”), a polymerization initiator (hereinafter, may be referred to as "(B3) component”) and the like.
  • the component (B) may contain a curable resin component composed of a combination of the component (B1), the component (B2), and the component (B3), and / or a cured product of the curable resin component.
  • the first adhesive component may contain a cured product of a photocurable resin component.
  • the first adhesive component may contain a photopolymerization initiator as the component (B3).
  • the first region 1 (first adhesive layer) containing the first adhesive component containing a cured product of the photocurable resin component is, for example, a first adhesive component containing a photocurable resin component. It can be obtained by irradiating the contained composition layer with light energy to cure the photocurable resin component.
  • the photocurable resin component may be a cationic curing system (combination of (B2C) component and (B3CL) component described later) or a radical curing system (combination of (B2R) component and (B3RL) component described later). May be.
  • the first adhesive component may further contain a thermosetting resin component (first thermosetting resin component) in addition to the cured product of the photocurable resin component.
  • the first adhesive component may further contain a thermal polymerization initiator as the component (B3).
  • the first region 1 (first adhesive layer) containing the cured product of the photocurable resin component and the first adhesive component containing the thermosetting resin component is, for example, the photocurable resin component and the thermosetting. It can be obtained by irradiating a composition layer containing a first adhesive component containing a sex resin component with light energy to cure the photocurable resin component.
  • the first thermosetting resin component may be a cationic curing system (combination of (B2C) component and (B3CH) component described later) or a radical curing system ((B2R) component and (B3RH) component described later). It may be a combination of), and a cationic curing system is preferable. It is preferable that the curing system of the photocurable resin component and the curing system of the thermosetting resin component are different, the photocurable resin component is a radical curing system, and the thermosetting resin component is a cationic curing system. Is more preferable.
  • the first adhesive component may contain a cured product of a radically curable photocurable resin component and a cationically curable thermosetting resin component.
  • Component (B1) Monofunctional oxetane compound
  • the component (B1) has one oxetanyl group in the molecule and is a radically polymerizable group that reacts with a radical (for example, (meth) acryloyl group, vinyl group, allyl group, styryl). It means a compound having no group, alkenyl group, alkenylene group, maleimide group, etc.).
  • the component (B1) is a cation-curing compound, and when at least one of the first adhesive component and the second adhesive component contains a monofunctional oxetane compound, the component (B1) is a cation-curing thermosetting compound. It can act as a component of the curable resin component.
  • the component (B1) is not particularly limited and can be appropriately selected depending on the target mounting temperature, mounting time, storage stability, and the like.
  • the boiling point of the component (B1) may be 100 ° C. or higher because it is difficult to volatilize by heating.
  • Examples of commercially available products of the component (B1) include OXT-101 (3-ethyl-3-hydroxymethyloxetane, manufactured by Toagosei Co., Ltd.), OXT-212 (2-ethylhexyloxetane, manufactured by Toagosei Co., Ltd.) and the like. Can be mentioned.
  • the content of the component (B1) is, for example, 0 to 40% by mass, 0 to 30% by mass, or 0 to 20% by mass based on the total mass of the component (B) (first adhesive component). It's okay.
  • the content of the component (B1) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • Component (B2) Polymerizable compound other than component (B1)
  • the component (B2) may be a cationically polymerizable compound (hereinafter, may be referred to as “(B2C) component”) or a radically polymerizable compound (hereinafter, may be referred to as “(B2C) component”).
  • (B2R) component may be used.
  • the (B2C) component is a compound that is crosslinked by reacting with a cationic polymerization initiator (photocationic polymerization initiator, thermal cationic polymerization initiator, etc.).
  • the (B2C) component means a compound having no radically polymerizable group that reacts with a radical, and the (B2C) component is not included in the (B2R) component described later.
  • Examples of the (B2C) component include a polyfunctional epoxy compound, a polyfunctional oxetane compound, and a polyfunctional alicyclic epoxy compound.
  • the component (B2C) contains at least one selected from the group consisting of, for example, a polyfunctional oxetane compound and a polyfunctional alicyclic epoxy compound from the viewpoint of further improving the effect of reducing the connection resistance and improving the connection reliability. It may contain a polyfunctional alicyclic epoxy compound. As the component (B2C), one type may be used alone, or a plurality of types may be used in combination.
  • the polyfunctional epoxy compound is, for example, a bisphenol type epoxy resin derived from epichlorohydrin and a bisphenol compound such as bisphenol A, bisphenol F or bisphenol AD; derived from epichlorohydrin and a novolak resin such as phenol novolac or cresol novolak.
  • Epoxy novolak resins examples include various epoxy compounds having two or more glycidyl groups in one molecule such as glycidylamine, glycidyl ether, biphenyl, and alicyclic type. These may use one kind of compound alone or may use a plurality of compounds in combination.
  • the polyfunctional oxetane compound can be used without particular limitation as long as it is a compound having two or more oxetanyl groups and no radically polymerizable group.
  • examples of commercially available oxetane compounds include ETERNALCOLL OXBP (trade name, manufactured by Ube Kosan Co., Ltd.), OXSQ, OXT-121, and OXT-221 (trade name, manufactured by Toagosei Corporation). These may use one kind of compound alone or may use a plurality of compounds in combination.
  • the polyfunctional alicyclic epoxy compound can be used without particular limitation as long as it is a compound having two or more alicyclic epoxy groups (for example, an epoxycyclohexyl group) and no radical polymerizable group.
  • alicyclic epoxy groups for example, an epoxycyclohexyl group
  • examples of commercially available alicyclic epoxy compounds include CEL8010, CEL2021P, and CEL2081 (trade name, manufactured by Daicel Corporation). These may use one kind of compound alone or may use a plurality of compounds in combination.
  • the (B2R) component Radical polymerizable compound
  • the (B2R) component is a compound polymerized by radicals generated from a radical polymerization initiator (photoradical polymerization initiator, thermal radical polymerization initiator component, etc.).
  • the component (B2R) may be either a monomer or a polymer (or oligomer) obtained by polymerizing one or more kinds of monomers.
  • the (B2R) component may be used alone or in combination of two or more.
  • the (B2R) component is a compound having a radically polymerizable group that reacts with radicals.
  • the radically polymerizable group include a (meth) acryloyl group, a vinyl group, an allyl group, a styryl group, an alkenyl group, an alkenylene group, a maleimide group and the like.
  • the number of radically polymerizable groups (number of functional groups) of the (B2R) component is 2 or more from the viewpoint that the desired melt viscosity can be easily obtained after polymerization, the effect of reducing the connection resistance is further improved, and the connection reliability is superior. It may be 10 or less from the viewpoint of suppressing curing shrinkage during polymerization. Further, in order to balance the crosslink density and the curing shrinkage, in addition to the compound having the number of radically polymerizable groups within the above range, a compound having the number of radically polymerizable groups outside the above range may be used. good.
  • the (B2R) component may contain, for example, a polyfunctional (bifunctional or higher) (meth) acrylate from the viewpoint of suppressing the flow of conductive particles.
  • the polyfunctional (bifunctional or higher) (meth) acrylate may be a bifunctional (meth) acrylate, and the bifunctional (meth) acrylate may be a bifunctional aromatic (meth) acrylate.
  • polyfunctional (meth) acrylate examples include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and polyethylene glycol di (meth) acrylate.
  • Acrylate T Acrylate, propoxylated bisphenol A type di (meth) acrylate, ethoxylated propoxylated bisphenol A type di (meth) acrylate, ethoxylated bisphenol F type di (meth) acrylate, propoxylated bisphenol F type di (meth) acrylate, Aromas (meth) such as ethoxylated propoxylated bisphenol F-type di (meth) acrylate, ethoxylated fluorene-type di (meth) acrylate, propoxylated fluorene-type di (meth) acrylate, and ethoxylated propoxylated fluorene-type di (meth) acrylate.
  • the content of the polyfunctional (bifunctional or higher) (meth) acrylate is, for example, 40 to 100, based on the total mass of the (B2R) component, from the viewpoint of achieving both the effect of reducing the connection resistance and the suppression of particle flow. It may be% by mass, 50 to 100% by mass, or 60 to 100% by mass.
  • the (B2R) component may further contain a monofunctional (meth) acrylate in addition to the polyfunctional (bifunctional or higher) (meth) acrylate.
  • a monofunctional (meth) acrylate examples include (meth) acrylic acid; methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, and tert-butyl (meth) acrylate.
  • (Meta) acrylates having an alicyclic epoxy group such as, ( Examples thereof include (meth) acrylate having an oxetanyl group such as 3-ethyloxetane-3-yl) methyl (meth) acrylate.
  • the content of the monofunctional (meth) acrylate may be, for example, 0 to 60% by mass, 0 to 50% by mass, or 0 to 40% by mass based on the total mass of the (B2R) component.
  • the (B2R) component may contain other radically polymerizable compounds in addition to the polyfunctional (bifunctional or higher) and monofunctional (meth) acrylates.
  • examples of other radically polymerizable compounds include maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, nadiimide derivatives and the like.
  • the content of the other radically polymerizable compound may be, for example, 0 to 40% by mass based on the total mass of the (B2R) component.
  • Component (B3) Polymerization Initiator
  • the component (B2) is the component (B2C)
  • the component (B3) is a photocationic polymerization initiator (hereinafter, may be referred to as "(B3CL) component”).
  • it may be a thermal cationic polymerization initiator (hereinafter, may be referred to as “(B3CH) component”).
  • a photocurable resin component By combining the (B2C) component and the (B3CL) component, a photocurable resin component can be obtained.
  • a thermosetting resin component can be obtained.
  • (B3CL) Component Photocationic Polymerization Initiator (B3CL) component comprises light containing a wavelength in the range of 150 to 750 nm, preferably light containing a wavelength in the range of 254 to 405 nm, and more preferably a wavelength in the range of 365 nm.
  • a polymerization initiator that generates a substance that initiates cationic polymerization by irradiation with light (for example, ultraviolet light).
  • the (B3CL) component may act as the (B3CH) component described later.
  • the (B3CL) component is, for example, BF 4- , BR 4- ( R indicates a phenyl group substituted with 2 or more fluorine atoms or 2 or more trifluoromethyl groups) , PF 6- , SbF 6- . , AsF 6 ⁇ and the like, sulfonium salt, phosphonium salt, ammonium salt, diazonium salt, iodonium salt, onium salt such as anilinium salt and the like. These may be used individually by 1 type, and may be used in combination of a plurality of types.
  • (B3CL) component Commercially available products of the (B3CL) component include, for example, CPI-100P, CPI-110P, CPI-101A, CPI-200K, CPI-210S (all manufactured by Sun Appro Co., Ltd.), UVI-6990, UVI-6992, UVI- 6976 (all manufactured by Dow Chemical Japan Co., Ltd.), SP-150, SP-152, SP-170, SP-172, SP-300 (all manufactured by ADEKA Corporation) and the like can be mentioned.
  • the content of the (B3CL) component is 100 parts by mass of the (B2C) component from the viewpoint of ensuring the formability and curability of the adhesive film for forming the first region (first adhesive layer). On the other hand, it may be, for example, 0.1 to 15 parts by mass, 0.3 to 12 parts by mass, 0.5 to 10 parts by mass, or 1 to 5 parts by mass.
  • (B3CH) Component Thermal Cationic Polymerization Initiator
  • the (B3CH) component is a polymerization initiator that generates a substance that initiates cationic polymerization by heat (for example, 40 to 150 ° C.).
  • the (B3CH) component may act as the above-mentioned (B3CL) component.
  • the (B3CH) component is the same as the (B3CL) component, for example, BF 4- , BR 4- ( R indicates a phenyl group substituted with 2 or more fluorine atoms or 2 or more trifluoromethyl groups).
  • R indicates a phenyl group substituted with 2 or more fluorine atoms or 2 or more trifluoromethyl groups.
  • (B3CH) component Commercially available products of the (B3CH) component include, for example, CP-66, CP-77 (all manufactured by ADEKA CORPORATION), SI-25, SI-45, SI-60, SI-60L, SI-60LA, SI- 60B, SI-80L, SI-100L, SI-110L, SI-180L (all manufactured by Sanshin Chemical Industry Co., Ltd.), CI-2855 (manufactured by Nippon Soda Corporation), PI-2074 (manufactured by Rhodia Japan Co., Ltd.) ) Etc. can be mentioned.
  • the content of the (B3CH) component is 100 parts by mass of the (B2C) component from the viewpoint of ensuring the formability and curability of the adhesive film for forming the first region (first adhesive layer). On the other hand, it may be, for example, 0.1 to 50 parts by mass, 0.5 to 40 parts by mass, 1 to 30 parts by mass, or 5 to 20 parts by mass.
  • the component (B2) is a component (B2R)
  • the component (B3) is a photoradical polymerization initiator (hereinafter, may be referred to as “(B3RL) component”)
  • a photocurable resin component By combining the (B2R) component and the (B3RL) component, a photocurable resin component can be obtained.
  • a thermosetting resin component can be obtained.
  • (B3RL) Component Photoradical Polymerization Initiator (B3RL) component comprises light containing a wavelength in the range of 150 to 750 nm, preferably light containing a wavelength in the range of 254 to 405 nm, and more preferably a wavelength in the range of 365 nm.
  • a polymerization initiator that generates radicals when irradiated with light for example, ultraviolet light.
  • the (B3RL) component may be used alone or in combination of two or more.
  • the (B3RL) component is decomposed by light to generate free radicals. That is, the (B3RL) component is a compound that generates radicals by applying light energy from the outside.
  • the (B3RL) component includes an oxime ester structure, a bisimidazole structure, an acridine structure, an ⁇ -aminoalkylphenone structure, an aminobenzophenone structure, an N-phenylglycine structure, an acylphosphine oxide structure, a benzyldimethylketal structure, and an ⁇ -hydroxyalkylphenone structure. It may be a compound having a structure such as.
  • the (B3RL) component may be used alone or in combination of two or more.
  • the (B3RL) component is selected from the group consisting of an oxime ester structure, an ⁇ -aminoalkylphenone structure, and an acylphosphine oxide structure from the viewpoint that the desired melt viscosity can be easily obtained and the effect of reducing the connection resistance is superior. It may be a compound having at least one structure.
  • the compound having an oxime ester structure examples include 1-phenyl-1,2-butandion-2- (o-methoxycarbonyl) oxime and 1-phenyl-1,2-propanedione-2- (o-methoxycarbonyl).
  • the compound having an ⁇ -aminoalkylphenone structure include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one and 2-benzyl-2-dimethylamino-1. -Morphorinophenyl) -butanone-1 and the like.
  • the compound having an acylphosphine oxide structure include bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide and bis (2,4,6, -trimethylbenzoyl) -phenylphosphine.
  • Examples thereof include oxide, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide and the like.
  • the content of the (B3RL) component is, for example, 0.1 to 10 parts by mass, 0.3 to 7 parts by mass, or 0 with respect to 100 parts by mass of the (B2R) component from the viewpoint of suppressing the flow of the conductive particles. It may be 5 to 5 parts by mass.
  • B3RH component Thermal radical polymerization initiator (B3RH) component is a polymerization initiator that generates radicals by heat.
  • the 1-hour half-life temperature of the (B3RH) component may be, for example, 50-100 ° C.
  • the (B3RH) component may be used alone or in combination of two or more.
  • Examples of the (B3RH) component include diacyl peroxides such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, and benzoyl peroxide; t-butylperoxypivalate, t-hexylperoxypivalate, 1,1.
  • the content of the (B3RH) component is, for example, 0.1 to 15 parts by mass, 0.3 to 12 parts by mass, or 0 with respect to 100 parts by mass of the (B2R) component from the viewpoint of suppressing the flow of the conductive particles. It may be 5 to 10 parts by mass.
  • the component (B) (first adhesive component) may contain a cured product of a photocurable resin component.
  • the content of the cured product of the photocurable resin component is 40 to 100% by mass, 50 to 100% by mass, or 60 to 100% by mass based on the total mass of the component (B) (first adhesive component). May be.
  • the content of the photocurable resin component in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the component (B) (first adhesive component) may further contain a thermosetting resin component in addition to the cured product of the photocurable resin component.
  • the content of the thermosetting resin component is 0 to 60% by mass, 0 to 50% by mass, or 0 to 40% by mass based on the total mass of the component (B) (first adhesive component). good.
  • the content of the thermosetting resin component in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the total content of the component (B2) and the component (B3) is 60 to 100% by mass, 70 to 100% by mass, or 80 to 80 to the total mass of the component (B) (first adhesive component). It may be 100% by mass.
  • the content of the total amount of the component (B2) and the component (B3) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the content of the component (B) component (first adhesive component) is the first region from the viewpoint of ensuring the curability of the adhesive film for forming the first region (first adhesive layer). Based on the total mass of the (first adhesive layer), it may be 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more.
  • the content of the component (B) component (first adhesive component) is the first region from the viewpoint of ensuring the formability of the adhesive film for forming the first region (first adhesive layer). Based on the total mass of the (first adhesive layer), it may be 80% by mass or less, 70% by mass or less, 60% by mass or less, or 50% by mass or less.
  • the effect of the present disclosure tends to be remarkably exhibited.
  • the content of the component (B) (first adhesive component) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the first region 1 may further contain other components in addition to the component (A) and the component (B).
  • other components include a thermoplastic resin (hereinafter, may be referred to as "(C) component”), a coupling agent (hereinafter, may be referred to as “(D) component”), and a filler (hereinafter, may be referred to as “component”).
  • component a thermoplastic resin
  • (D) component a coupling agent
  • component hereinafter, may be referred to as "component”
  • component a filler
  • (E) component” may be mentioned.) And the like.
  • Component (C) Thermoplastic resin
  • the component (C) include phenoxy resin, polyester resin, polyamide resin, polyurethane resin, polyester urethane resin, acrylic rubber, and epoxy resin (solid at 25 ° C.). These may be used individually by 1 type, and may be used in combination of a plurality of types.
  • the component (C) may be, for example, a phenoxy resin.
  • the content of the component (C) is 1% by mass or more, 5% by mass or more, 10% by mass or more, or 15% by mass or more, based on the total mass of the first region (first adhesive layer). It may be 70% by mass or less, 60% by mass or less, 50% by mass or less, or 40% by mass or less.
  • the content of the component (C) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • Component (D) Coupling agent
  • the component (D) include a silane coupling agent having an organic functional group such as a (meth) acryloyl group, a mercapto group, an amino group, an imidazole group, and an epoxy group, a tetraalkoxysilane, and the like.
  • examples thereof include a silane compound, a tetraalkoxy titanate derivative, and a polydialkyl titanate derivative. These may be used individually by 1 type, and may be used in combination of a plurality of types.
  • the adhesiveness can be further improved.
  • the component (D) may be, for example, a silane coupling agent.
  • the content of the component (D) may be 0.1 to 10% by mass based on the total mass of the first region (first adhesive layer).
  • the content of the component (D) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • Component (E) Filler
  • the component (E) may be either an inorganic filler or an organic filler.
  • the inorganic filler include metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; and inorganic fine particles such as metal nitride fine particles.
  • the organic filler include organic fine particles such as silicone fine particles, methacrylate / butadiene / styrene fine particles, acrylic / silicone fine particles, polyamide fine particles, and polyimide fine particles.
  • the component (E) may be, for example, silica fine particles.
  • the content of the component (E) may be 0.1 to 10% by mass based on the total mass of the first region (first adhesive layer).
  • the content of the component (E) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the first region 1 may further contain other additives such as softeners, accelerators, anti-deterioration agents, colorants, flame retardants, thixotropic agents and the like. ..
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the first region (first adhesive layer).
  • the content of other additives in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the thickness d1 of the first region 1 may be, for example, 5 ⁇ m or less.
  • the thickness d1 of the first region 1 may be 4.5 ⁇ m or less or 4.0 ⁇ m or less.
  • the thickness d1 of the first region 1 may be, for example, 0.1 ⁇ m or more, 0.5 ⁇ m or more, or 0.7 ⁇ m or more.
  • the thickness d1 of the first region 1 is, for example, 100 g of a bisphenol A type epoxy resin (trade name: JER811, manufactured by Mitsubishi Chemical Co., Ltd.) by sandwiching an adhesive film between two sheets of glass (thickness: about 1 mm). After casting with a resin composition consisting of 10 g of a curing agent (trade name: Epomount curing agent, manufactured by Refine Tech Co., Ltd.), cross-section polishing is performed using a polishing machine, and a scanning electron microscope (SEM, product name: It can be obtained by measuring using SE-8000 (manufactured by Hitachi High-Tech Science Co., Ltd.). Further, as shown in FIG.
  • the first region 1 when a part of the conductive particles 4 is exposed from the surface of the first region 1 (for example, protruding toward the second region 2), the first region 1 The distance from the main surface 1a on the side opposite to the region 2 side of 2 to the boundary S between the first region 1 and the second region 2 located at the separated portions of the adjacent conductive particles 4 and 4 (in FIG. 1). The distance indicated by d1) is the thickness of the first region 1, and the exposed portion of the conductive particles 4 is not included in the thickness of the first region 1.
  • the length of the exposed portion of the conductive particles 4 may be, for example, 0.1 ⁇ m or more, and may be 5 ⁇ m or less.
  • the thickness of the first adhesive film may be set to the thickness d1 of the first region 1.
  • the exposed portion of the conductive particles is not included in the thickness of the first adhesive film.
  • the second region 2 contains the component (B) (second adhesive component).
  • the second adhesive component may be the same as or different from the first adhesive component.
  • the component (B) (second adhesive component) may contain a component (B1), a component (B2), a component (B3), and the like.
  • the component (B) may contain a curable resin component composed of a combination of the component (B1), the component (B2), and the component (B3), and / or a cured product of the curable resin component.
  • the component (B1), the component (B2), and the component (B3) used in the second region 2 (second adhesive layer) are in the first region 1 (first adhesive layer). Since it is the same as the component (B1), the component (B2), and the component (B3) used, detailed description thereof will be omitted here.
  • the second adhesive component may be a thermosetting resin component (second thermosetting resin component).
  • the second adhesive component may contain a thermal polymerization initiator as the component (B3).
  • the thermosetting resin component may be a cationic curing system (combination of (B2C) component and (B3CH) component) or a radical curing system (combination of (B2R) component and (B3RH) component). It is often preferable to use a cationic curing system. Since the component (B1) can act as one component of the cationically curable thermosetting resin component, the second adhesive component is, in one embodiment, the component (B1), the component (B2C), and the component (B3CH). ) It may be a combination with an ingredient.
  • the second thermosetting resin component may be the same as or different from the first thermosetting resin component, but it is preferable that the curing system is common.
  • the second adhesive component contains the (B1) component.
  • the content of the component (B1) may be, for example, 1% by mass or more, 3% by mass or more, or 5% by mass or more, based on the total mass of the component (B) (second adhesive component). It may be 40% by mass or less, 30% by mass or less, or 20% by mass or less.
  • the content of the component (B1) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the total content of the component (B2) and the component (B3) is 60% by mass or more, 70% by mass or more, or 80% by mass or more based on the total mass of the component (B) (second adhesive component). It may be 99% by mass or less, 97% by mass or less, or 95% by mass or less.
  • the content of the total amount of the component (B2) and the component (B3) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the content of the component (B) component (second adhesive component) is the second region from the viewpoint of ensuring the curability of the adhesive film for forming the second region (second adhesive layer). Based on the total mass of the (second adhesive layer), it may be 10% by mass or more, 20% by mass or more, 30% by mass or more, or 40% by mass or more.
  • the content of the component (B) component (second adhesive component) is the second region from the viewpoint of ensuring the formability of the adhesive film for forming the second region (second adhesive layer). Based on the total mass of the (second adhesive layer), it may be 80% by mass or less, 70% by mass or less, 60% by mass or less, or 55% by mass or less.
  • the effect of the present disclosure tends to be remarkably exhibited.
  • the content of the component (B) (second adhesive component) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the second region 2 may further contain other components and other additives in the first region 1 (first adhesive layer). Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the first region 1 (first adhesive layer).
  • the content of the component (C) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and is 50% by mass, based on the total mass of the second region (second adhesive layer). % Or less, 40% by mass or less, or 30% by mass or less.
  • the content of the component (D) may be 0.1 to 10% by mass based on the total mass of the second region (second adhesive layer).
  • the content of the component (E) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, 70% by mass, based on the total mass of the second region (second adhesive layer). % Or less, 60% by mass or less, or 50% by mass or less.
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the second region (second adhesive layer).
  • the thickness d2 of the second region 2 may be appropriately set according to the height of the electrodes of the circuit member to be adhered.
  • the thickness d2 of the second region 2 is 5 ⁇ m or more or 7 ⁇ m or more from the viewpoint that the space between the electrodes can be sufficiently filled to seal the electrodes and better connection reliability can be obtained. It may be 20 ⁇ m or less or 15 ⁇ m or less.
  • the thickness d2 of the second region 2 can be obtained by the same method as the thickness d1 of the first region 1.
  • a part of the conductive particles 4 is exposed from the surface of the first region 1 (for example, protruding toward the second region 2), it is opposite to the first region 1 side in the second region 2.
  • the distance (distance shown by d2 in FIG. 1) from the main surface 2a on the side to the boundary S between the first region 1 and the second region 2 located at the separated portion of the adjacent conductive particles 4 and 4 is the second. Is the thickness of region 2.
  • the thickness of the second adhesive film may be set to the thickness d2 of the second region 2.
  • the adhesive film 10 the conductive particles 4 are dispersed in the first region 1. Therefore, the adhesive film 10 can be an anisotropically conductive adhesive film.
  • the adhesive film 10 is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and heats the first circuit member and the second circuit member. It is crimped and used to electrically connect the first electrode and the second electrode to each other.
  • the adhesive film 10 it is possible to form a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting.
  • the adhesive film may be composed of, for example, two regions of a first region and a second region (two layers of a first adhesive layer and a second adhesive layer), and the adhesive film may be composed of a first region. It may be composed of three or more regions including a region and a second region (three or more layers including two layers of a first adhesive layer and a second adhesive layer).
  • the adhesive film is provided, for example, in a third region (adjacent) provided on the opposite side (adjacent) to the second region (second adhesive layer) of the first region (first adhesive layer). It may be configured to further include (third adhesive layer).
  • the third region (third adhesive layer) contains the component (B) (third adhesive component).
  • the third adhesive component may be the same as or different from the first adhesive component, and may be the same as or different from the second adhesive component.
  • the component (B) (third adhesive component) may contain a component (B1), a component (B2), a component (B3), and the like.
  • the component (B) may contain a curable resin component composed of a combination of the component (B1), the component (B2), and the component (B3), and / or a cured product of the curable resin component.
  • the component (B1), the component (B2), and the component (B3) used in the third region (third adhesive layer) are used in the first region 1 (first adhesive layer). Since it is the same as the component (B1), the component (B2), and the component (B3), detailed description thereof will be omitted here.
  • the third adhesive component may be a thermosetting resin component (third thermosetting resin component).
  • the third adhesive component may contain a thermal polymerization initiator as the component (B3).
  • the thermosetting resin component may be a cationic curing system (combination of (B2C) component and (B3CH) component) or a radical curing system (combination of (B2R) component and (B3RH) component). It is often preferable to use a cationic curing system.
  • the third thermosetting resin component may be the same as or different from the first thermosetting resin component and the second thermosetting resin component, but it is preferable that the curing system is common. ..
  • the content of the component (B1) is, for example, 0 to 40% by mass, 0 to 30% by mass, or 0 to 20% by mass based on the total mass of the component (B) (third adhesive component). It's okay.
  • the content of the component (B1) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the total content of the component (B2) and the component (B3) is 60 to 100% by mass, 70 to 100% by mass, or 80 to 80 to the total mass of the component (B) (third adhesive component). It may be 100% by mass.
  • the content of the thermosetting resin component in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the content of the component (B) component (third adhesive component) is a third region from the viewpoint of ensuring the curability of the adhesive film for forming the third region (third adhesive layer). Based on the total mass of the (third adhesive layer), it may be 10% by mass or more, 20% by mass or more, or 30% by mass or more.
  • the content of the component (B) component (third adhesive component) is a third region from the viewpoint of ensuring the formability of the adhesive film for forming the third region (third adhesive layer). Based on the total mass of the (third adhesive layer), it may be 80% by mass or less, 70% by mass or less, 60% by mass or less, or 50% by mass or less.
  • the effect of the present disclosure tends to be remarkably exhibited.
  • the content of the component (B) (third adhesive component) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the third region may further contain other components and other additives in the first region 1 (first adhesive layer). Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the second region 2 (second adhesive layer).
  • the content of the component (C) may be 10% by mass or more, 20% by mass or more, or 30% by mass or more, and may be 80% by mass, based on the total mass of the third region (third adhesive layer). % Or less, 70% by mass or less, or 60% by mass or less.
  • the content of the component (D) may be 0.1 to 10% by mass based on the total mass of the third region (third adhesive layer).
  • the content of the component (E) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and is 50% by mass, based on the total mass of the third region (third adhesive layer). % Or less, 40% by mass or less, or 30% by mass or less.
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the third region (third adhesive layer).
  • the thickness of the third region may be appropriately set according to the minimum melt viscosity of the adhesive film, the height of the electrode of the circuit member to be adhered, and the like.
  • the thickness of the third region is preferably smaller than the thickness d2 of the second region 2.
  • the thickness of the third region may be 0.2 ⁇ m or more from the viewpoint that the space between the electrodes can be sufficiently filled to seal the electrodes and better connection reliability can be obtained. It may be 0.0 ⁇ m or less.
  • the third region can be obtained by the same method as the thickness d1 of the first region 1 and the thickness d2 of the second region 2.
  • the adhesive film is produced by, for example, laminating a third adhesive film
  • the thickness of the third adhesive film is easily maintained in the adhesive film, so that the third adhesive film is easily maintained.
  • the thickness of may be the thickness of the third region.
  • the thickness of the adhesive film (the total thickness of all the layers constituting the adhesive film 10) may be, for example, 5 ⁇ m or more or 8 ⁇ m or more, and may be 30 ⁇ m or less or 20 ⁇ m or less.
  • the circuit connection adhesive film of the above embodiment is an anisotropic conductive adhesive film, but the circuit connection adhesive film may be a conductive adhesive film that does not exhibit anisotropic conductivity.
  • the method for producing an adhesive film for circuit connection is a step of forming a first adhesive layer containing a component (A) and a component (B) (first adhesive component) (first step). ), And a step (second step) of laminating a second adhesive layer containing the component (B) (second adhesive component) on the first adhesive layer.
  • a third adhesive layer containing the component (B) (third adhesive component) is laminated on a layer of the first adhesive layer opposite to the second adhesive layer.
  • a step (third step) may be further provided.
  • a composition containing the components (A) and (B), and other components and other additives added as needed is stirred and mixed in an organic solvent.
  • a varnish composition is prepared by dissolving or dispersing by kneading or the like. Then, the varnish composition is applied onto the mold-released substrate using a knife coater, roll coater, applicator, comma coater, die coater, etc., and then the organic solvent is volatilized by heating to form the substrate.
  • a composition layer (first adhesive layer) composed of the composition is formed on the surface. At this time, the thickness of the finally obtained first adhesive layer (first adhesive film) can be adjusted by adjusting the coating amount of the varnish composition.
  • the first step is for a composition layer composed of a composition containing the component (A) and the component (B) containing the photocurable resin component. This may be a step of curing the photocurable resin component to form the first adhesive layer.
  • the composition may contain a thermosetting resin component.
  • the photocurable resin component in the composition layer is cured by irradiating the composition layer made of the composition with light to form the first adhesive layer on the substrate. do.
  • the first adhesive layer can be said to be the first adhesive film.
  • the organic solvent used in the preparation of the varnish composition is not particularly limited as long as it has the property of uniformly dissolving or dispersing each component.
  • examples of such an organic solvent include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate, butyl acetate and the like. These organic solvents can be used alone or in combination of two or more.
  • Stirring and mixing or kneading in the preparation of the varnish composition can be carried out by using, for example, a stirrer, a raider, a three-roll, a ball mill, a bead mill, a homodisper or the like.
  • the base material is not particularly limited as long as it has heat resistance that can withstand the heating conditions when volatilizing the organic solvent.
  • a substrate examples include stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate, polyvinylidene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, polyimide, cellulose, and the like.
  • a substrate (for example, a film) made of an ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, a synthetic rubber system, a liquid crystal polymer or the like can be used.
  • the heating conditions for volatilizing the organic solvent from the varnish composition applied to the base material can be appropriately set according to the organic solvent to be used and the like.
  • the heating conditions may be, for example, 40 to 120 ° C. for 0.1 to 10 minutes.
  • a part of the organic solvent may remain in the first adhesive layer without being removed.
  • the content of the organic solvent in the first adhesive layer may be, for example, 10% by mass or less based on the total mass of the first adhesive layer.
  • irradiation light for example, ultraviolet light
  • Light irradiation can be performed using, for example, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, an LED light source, or the like.
  • the integrated light amount of light irradiation can be appropriately set, but may be, for example, 500 to 3000 mJ / cm 2 .
  • the second step is a step of laminating the second adhesive layer on the first adhesive layer.
  • the first step is performed.
  • a second adhesive layer is formed on the substrate to obtain a second adhesive film.
  • the second adhesive layer can be laminated on the first adhesive layer by adhering the first adhesive film and the second adhesive film.
  • a varnish composition obtained by using the component (C) and other components and other additives added as needed is applied onto the first adhesive layer.
  • the second adhesive layer can also be laminated on the first adhesive layer by volatilizing the organic solvent.
  • a part of the organic solvent may remain in the second adhesive layer without being removed.
  • the content of the organic solvent in the second adhesive layer may be, for example, 10% by mass or less based on the total mass of the second adhesive layer.
  • Examples of the method of adhering the first adhesive film and the second adhesive film include a method of heat pressing, roll laminating, vacuum laminating and the like. Lamination can be performed, for example, under temperature conditions of 0 to 80 ° C.
  • the third step is a step of laminating the third adhesive layer on the layer of the first adhesive layer opposite to the second adhesive layer.
  • a third adhesive layer is formed on the substrate to obtain a third adhesive film.
  • the varnish composition is applied onto the layer of the first adhesive layer opposite to the second adhesive layer, and an organic solvent is applied.
  • the third adhesive layer can be laminated on the first adhesive layer by volatilizing the above. The method of bonding and the conditions thereof are the same as in the second step.
  • a part of the organic solvent may remain in the third adhesive layer without being removed.
  • the content of the organic solvent in the third adhesive layer may be, for example, 10% by mass or less based on the total mass of the third adhesive layer.
  • the circuit connection material of one embodiment contains an adhesive component ((B) component) containing a monofunctional oxetane compound ((B1) component).
  • the circuit connection material can be suitably used for the second adhesive layer (second adhesive film) in the above-mentioned method for manufacturing a circuit connection adhesive film.
  • the component (B1) is the same as the component (B1) in the first region 1 (first adhesive layer) of the above-mentioned adhesive film for circuit connection, and the component (B) is the above-mentioned adhesive for circuit connection. Since it is the same as the component (B) in the first region 1 (first adhesive layer) of the agent film, detailed description thereof will be omitted here.
  • the content of the component (B1) may be, for example, 1% by mass or more, 3% by mass or more, or 5% by mass or more, and 40% by mass or less, 30% by mass, based on the total mass of the component (B). It may be less than or equal to 20% by mass or less.
  • the component (B) may further contain the component (B2) and the component (B3).
  • the total content of the component (B2) and the component (B3) may be 60% by mass or more, 70% by mass or more, or 80% by mass or more, 99% by mass, based on the total mass of the component (B). Hereinafter, it may be 97% by mass or less, or 95% by mass or less.
  • the components (B2) and (B3) are the same as the components (B2) and (B3) in the first region 1 (first adhesive layer) of the above-mentioned circuit connection adhesive film. Therefore, a detailed description will be omitted here.
  • the content of the component (B) may be 10% by mass or more, 20% by mass or more, 30% by mass or more, or 40% by mass or more based on the total mass of the circuit connection material.
  • the content of the component (B) may be 80% by mass or less, 70% by mass or less, 60% by mass or less, or 55% by mass or less based on the total mass of the circuit connection material.
  • the circuit connection material may further contain other components and other additives in the first region 1 (first adhesive layer) of the circuit connection adhesive film. Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the first region 1 (first adhesive layer).
  • the content of the component (C) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, based on the total mass of the circuit connection material, and may be 50% by mass or less, 40% by mass or less, Alternatively, it may be 30% by mass or less.
  • the content of the component (D) may be 0.1 to 10% by mass based on the total mass of the circuit connection material.
  • the content of the component (E) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, and is 70% by mass or less, 60% by mass or less, based on the total mass of the circuit connection material. Alternatively, it may be 50% by mass or less.
  • the content of other additives may be, for example, 0.1 to 10% by mass based on the total mass of the circuit connection material.
  • the circuit connection material may further contain conductive particles (component (A)).
  • component (A) conductive particles
  • Such a circuit connection material can be suitably used for the first adhesive layer (first adhesive film) in the above-mentioned method for manufacturing a circuit connection adhesive film. Since the component (A) is the same as the component (B1) in the first region 1 (first adhesive layer) of the above-mentioned circuit connection adhesive film, detailed description thereof will be omitted here.
  • the content of the component (A) may be 40 parts by mass or more, 50 parts by mass or more, or 60 parts by mass or more, and 150 parts by mass or less and 140 parts by mass or less with respect to 100 parts by mass of the component (B). , Or 120 parts by mass or less.
  • Circuit connection structure and its manufacturing method> a circuit connection structure using the above-mentioned circuit connection adhesive film 10 as a circuit connection material and a method for manufacturing the same will be described.
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit connection structure.
  • the circuit connection structure 20 includes a first circuit member 13 having a first electrode 12 formed on a main surface 11a of the first circuit board 11 and the first circuit board 11.
  • a second circuit member 16 having a second electrode 15 formed on the main surface 14a of the second circuit board 14 and the second circuit board 14, and the first circuit member 13 and the second circuit member. It is arranged between 16 and includes a circuit connection portion 17 that electrically connects the first electrode 12 and the second electrode 15 to each other.
  • the first circuit member 13 and the second circuit member 16 may be the same as or different from each other.
  • the first circuit member 13 and the second circuit member 16 are a glass substrate or a plastic substrate on which a circuit electrode is formed; a printed wiring board; a ceramic wiring board; a flexible wiring board; an IC chip such as a drive IC, or the like. It's okay.
  • the first circuit board 11 and the second circuit board 14 may be formed of an inorganic substance such as semiconductor, glass, or ceramic, an organic substance (plastic) such as polyimide or polycarbonate, or a composite such as glass / epoxy.
  • the first circuit board 11 may be a plastic substrate or a polyimide substrate.
  • the first circuit member 13 may be, for example, a plastic substrate on which a circuit electrode is formed, or a polyimide substrate on which a circuit electrode is formed.
  • the second circuit member 16 may be, for example, an IC chip such as a drive IC.
  • the first electrode 12 and the second electrode 15 are gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, titanium and other metals, indium tin oxide (ITO), and the like.
  • the electrode may be an electrode containing an oxide such as indium tin oxide (IZO) or indium gallium zinc oxide (IGZO).
  • the first electrode 12 and the second electrode 15 may be electrodes formed by laminating two or more of these metals, oxides, and the like.
  • the electrode formed by stacking two or more types may have two or more layers, and may have three or more layers.
  • the first electrode 12 When the first circuit member 13 is a plastic substrate, the first electrode 12 may be an electrode having a titanium layer on the outermost surface.
  • the first electrode 12 and the second electrode 15 may be circuit electrodes or bump electrodes. At least one of the first electrode 12 and the second electrode 15 may be a bump electrode.
  • the first electrode 12 is a circuit electrode and the second electrode 15 is a bump electrode.
  • the circuit connection portion 17 includes a cured product of the adhesive film 10 or a cured product of the circuit connection material.
  • the circuit connection portion 17 may be made of a cured product of the adhesive film 10 described above.
  • the circuit connection portion 17 is located, for example, on the side of the first circuit member 13 in the direction in which the first circuit member 13 and the second circuit member 16 face each other (hereinafter referred to as “opposite direction”), and the first circuit member 17 is described above. It is located on the side of the first cured product region 18 made of the cured product of the component (B) (first adhesive component) other than the conductive particles 4 in the region and the second circuit member 16 in the opposite direction, and is described above.
  • the circuit connection portion 17 does not have to have two distinct regions between the first cured product region 18 and the second cured product region 19, and the first The cured product derived from the region of 1 and the cured product derived from the second region may be mixed to form one region.
  • the circuit connection structure is, for example, a flexible organic electric field light emitting color display (organic EL display) in which a plastic substrate in which organic EL elements are regularly arranged and a drive circuit element which is a driver for displaying an image are connected.
  • organic EL display organic electric field light emitting color display
  • Examples thereof include a touch panel in which a plastic substrate on which organic EL elements are regularly arranged and a position input element such as a touch pad are connected.
  • the circuit connection structure can be applied to various monitors such as smartphones, tablets, televisions, vehicle navigation systems, wearable terminals, furniture; home appliances; daily necessities and the like.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure.
  • 3 (a) and 3 (b) are schematic cross-sectional views showing each process.
  • a method of manufacturing the circuit connection structure 20 is performed between a first circuit member 13 having a first electrode 12 and a second circuit member 16 having a second electrode 15.
  • a step is provided in which the first circuit member 13 and the second circuit member 16 are thermocompression-bonded with the adhesive film 10 interposed therebetween, and the first electrode 12 and the second electrode 15 are electrically connected to each other. ..
  • a first circuit including a first electrode 12 formed on a main surface 11a of a first circuit board 11 and a first circuit board 11.
  • a member 13 and a second circuit member 16 provided with a second electrode 15 formed on the main surface 14a of the second circuit board 14 and the second circuit board 14 are prepared.
  • the first circuit member 13 and the second circuit member 16 are arranged so that the first electrode 12 and the second electrode 15 face each other, and the first circuit member 13 and the second circuit member 12 are arranged.
  • the adhesive film 10 is placed between the 16 and 16.
  • the adhesive film 10 is laminated on the first circuit member 13 so that the first adhesive layer side faces the main surface 11a of the first circuit board 11. .
  • the adhesive film 10 is laminated so that the first electrode 12 on the first circuit board 11 and the second electrode 15 on the second circuit board 14 face each other.
  • the second circuit member 16 is arranged on the circuit member 13.
  • the method for manufacturing the circuit connection structure 20 of the present embodiment it can be said that a part of the first adhesive layer is cured by light, heat, moisture, etc., so that the conductive particles 4 are contained in the first adhesive layer.
  • the facing first electrodes 12 and the second are used. The connection resistance between the electrodes 15 of the above is reduced. Further, when the thickness of the first adhesive layer is 5 ⁇ m or less, the conductive particles at the time of circuit connection tend to be captured more efficiently.
  • the heating temperature for thermocompression bonding can be set as appropriate, but may be, for example, 50 to 190 ° C.
  • the pressurization is not particularly limited as long as it does not damage the adherend, but in the case of COG mounting, the area conversion pressure at the bump electrode may be, for example, 10 to 100 MPa. These heating and pressurizing times may be in the range of 0.5 to 120 seconds. Further, in the case of COP (chip on plastic) mounting, for example, the area conversion pressure at the bump electrode may be 0.1 to 50 MPa.
  • first adhesive film first adhesive layer
  • second adhesive film second adhesive layer
  • third adhesive film third adhesive layer
  • Conductive particles A-1 Conductive particles in which a palladium / nickel layer having a thickness of 0.1 ⁇ m is provided on the surface of particles having polystyrene as a core (average particle size: 3.0 ⁇ m, specific gravity: 2.9).
  • Thermoplastic resin C-1 FX-310 (phenoxy resin, manufactured by Nittetsu Chemical & Materials Co., Ltd.), diluted with an organic solvent to a non-volatile content of 40% by mass
  • Coupling agent D-1 SH-6040 (3-glycidoxypropyltrimethoxysilane, manufactured by Toray Dow Corning Co., Ltd.)
  • Preparation of the first adhesive film (first adhesive layer)> A composition obtained by mixing the materials shown in Table 1 at the composition ratio shown in Table 1 (the numerical value in Table 1 means the amount of non-volatile content) is then subjected to a mold release treatment, and has a thickness of 50 ⁇ m.
  • the composition layers 1a and 1b containing each component were obtained by applying a coating on a release-treated PET (polyethylene terephthalate) film while applying a magnetic field and drying an organic solvent or the like. The thickness of the composition layers 1a and 1b after drying was 3.5 ⁇ m.
  • the composition layer 1a is irradiated with light (UV irradiation: metal halide lamp, integrated light amount: 1900 to 2300 mJ / cm 2 ), and the composition layer 1b is irradiated with light (UV irradiation: metal halide lamp, integrated light amount: 1000 to).
  • the composition layer 1b is irradiated with light (UV irradiation: metal halide lamp, integrated light amount: 1000 to).
  • UV irradiation metal halide lamp, integrated light amount: 1000 to
  • the first adhesive films 1A and 1B were obtained.
  • the first adhesive films 1A and 1B contain a cured product of a photocurable resin component, and the first adhesive film 1A further contains a thermosetting resin component.
  • Second adhesive film (second adhesive layer)> The materials shown in Table 2 were mixed at the composition ratio shown in Table 2 (the numerical value in Table 2 means the amount of non-volatile content), and then the base material was subjected to the mold release treatment, and was subjected to the mold release treatment having a thickness of 50 ⁇ m.
  • a second adhesive film (second adhesive layer) 2A to 2G was obtained by coating on a PET (polyethylene terephthalate) film and drying an organic solvent or the like. The thickness of the second adhesive films 2A to 2G after drying was 8 ⁇ m.
  • ⁇ Third adhesive film (third adhesive layer)> The materials shown in Table 3 were mixed at the composition ratio shown in Table 3 (the numerical values in Table 3 mean the amount of non-volatile content), and then the base material was subjected to the mold release treatment, which was a mold release treatment having a thickness of 50 ⁇ m.
  • a third adhesive film 3A was obtained by coating on a PET (polyethylene terephthalate) film and drying an organic solvent or the like. The thickness of the third adhesive film 3A after drying was 1 ⁇ m.
  • the adhesive force is less than 10 N / m
  • the adhesive film and the polyimide substrate have sufficient adhesion and the substrate can be easily peeled off.
  • the case where the adhesion is 10 N / m or more was evaluated as "B".
  • the adhesion is 10 N / m or more
  • the adhesive film may be peeled off from the polyimide substrate when the base material (release PET film) is peeled off. The results are shown in Table 4.
  • connection resistance and evaluation of connection reliability (Preparation of circuit members)
  • Ti (50 nm) / Al (400 nm) / Ti (50 nm) is formed on the surface of a polyimide substrate (200EN, manufactured by Toray DuPont Co., Ltd., outer shape: 38 mm ⁇ 28 mm, thickness: 0.05 mm).
  • a wiring pattern (pattern width: 19 ⁇ m, space between electrodes: 5 ⁇ m) was prepared.
  • an IC chip in which bump electrodes are arranged in a staggered pattern in two rows (outer shape: 0.9 mm ⁇ 20.3 mm, thickness: 0.3 mm, bump electrode size: 1200 ⁇ m 2 , between bump electrodes) Space: 12 ⁇ m, bump electrode thickness: 8 ⁇ m) was prepared.
  • Circuit connection structures were produced using the adhesive films of Examples 1 to 6 and Comparative Examples 1 and 2.
  • the adhesive film used was cut out to a size of 2.0 mm ⁇ 25 mm.
  • the adhesive film was placed on the first circuit member so that the third adhesive layer of the adhesive film and the first circuit member were in contact with each other.
  • a thermocompression bonding device (BS-17U, manufactured by Ohashi Seisakusho Co., Ltd.) consisting of a stage consisting of a ceramic heater and a tool (8 mm x 50 mm), under the conditions of 60 ° C. and 0.98 MPa (10 kgf / cm 2 ).
  • the adhesive film was attached to the first circuit member by heating and pressurizing for 1 second, and the release film on the opposite side of the adhesive film from the first circuit member was peeled off.
  • the measured maximum reached temperature of the adhesive film is 170 ° C.
  • the area conversion pressure of the bump electrode is 20 MPa or 40 MPa.
  • the second adhesive layer of the adhesive film was attached to the second circuit member by heating and pressurizing for 5 seconds under two kinds of conditions to prepare a circuit connection structure.
  • connection resistance evaluation of connection resistance
  • the evaluation of the connection resistance was carried out by the four-terminal measurement method, and the evaluation was made using the average value of the connection resistance values measured at 14 points.
  • a multimeter MLR21, manufactured by Kusumoto Kasei Co., Ltd.
  • MLR21 manufactured by Kusumoto Kasei Co., Ltd.
  • connection reliability A reliability test was conducted by placing the circuit connection structure mounted under the condition of an area conversion pressure of 40 MPa on the bump electrode in a constant temperature and humidity chamber of 85% RH at 85 ° C. and leaving it to stand for 100 hours. After 100 hours, the circuit connection structure was taken out and the peelability was evaluated. The peelability was evaluated from the surface opposite to the surface on which the second adhesive layer of the polyimide substrate (first circuit member) of the circuit connection structure was mounted, between the adhesive film and the polyimide substrate. It was observed whether or not the peeling and the peeling between the adhesive film and the IC chip (second circuit member) occurred. The case where no peeling was observed was evaluated as "A" as having excellent reliability, and the case where peeling was observed was evaluated as "B". The results are shown in Table 4.
  • the circuit connection adhesive films of Examples 1 to 6 have connection resistance and connection reliability even when applied to COP mounting, as compared with the circuit connection adhesive films of Comparative Examples 1 and 2. It was excellent in terms of sex. Further, the circuit connection adhesive films of Examples 1 to 6 are easy to peel off when the base material (for example, PET film) is peeled off from the circuit connection adhesive film when applied to COP mounting. Also turned out to be excellent. From these results, it was confirmed that the adhesive film for circuit connection of the present disclosure can form a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting. ..

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne un film adhésif pour connexion de circuit. Le film adhésif pour connexion de circuit est pourvu : d'une première région contenant des particules conductrices et un premier composant adhésif ; et d'une seconde région contenant un second composant adhésif disposée adjacente à la première région. Le premier composant adhésif et/ou le second composant adhésif comprennent un composé oxétane monofonctionnel.
PCT/JP2021/037013 2020-10-07 2021-10-06 Film adhésif pour connexion de circuit, matériau pour connexion de circuit, structure de connexion de circuit et procédé de fabrication de structure de connexion de circuit WO2022075370A1 (fr)

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
JP2002235065A (ja) * 2001-02-07 2002-08-23 Showa Denko Kk 導電性接着剤組成物
JP2003346943A (ja) * 2002-05-28 2003-12-05 Shin Etsu Polymer Co Ltd 異方導電接着剤およびヒートシールコネクタ
KR20060078793A (ko) * 2004-12-31 2006-07-05 제일모직주식회사 옥세탄 화합물을 함유하는 이방 도전성 접착재료
JP2014084400A (ja) * 2012-10-23 2014-05-12 Asahi Kasei E-Materials Corp 接着フィルム
JP2016171133A (ja) * 2015-03-11 2016-09-23 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
JP2017092230A (ja) * 2015-11-10 2017-05-25 日立化成株式会社 回路接続材料及び回路部材の接続構造体とその製造方法
WO2018047597A1 (fr) * 2016-09-06 2018-03-15 株式会社スリーボンド Adhésif électroconducteur thermodurcissable
CN108130029A (zh) * 2017-12-22 2018-06-08 烟台德邦科技有限公司 一种uv延迟固化的导电银胶及其制备方法
CN111909633A (zh) * 2020-07-14 2020-11-10 江苏矽时代材料科技有限公司 一种低温固化导电胶及其制备方法和应用

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
JP2002235065A (ja) * 2001-02-07 2002-08-23 Showa Denko Kk 導電性接着剤組成物
JP2003346943A (ja) * 2002-05-28 2003-12-05 Shin Etsu Polymer Co Ltd 異方導電接着剤およびヒートシールコネクタ
KR20060078793A (ko) * 2004-12-31 2006-07-05 제일모직주식회사 옥세탄 화합물을 함유하는 이방 도전성 접착재료
JP2014084400A (ja) * 2012-10-23 2014-05-12 Asahi Kasei E-Materials Corp 接着フィルム
JP2016171133A (ja) * 2015-03-11 2016-09-23 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
JP2017092230A (ja) * 2015-11-10 2017-05-25 日立化成株式会社 回路接続材料及び回路部材の接続構造体とその製造方法
WO2018047597A1 (fr) * 2016-09-06 2018-03-15 株式会社スリーボンド Adhésif électroconducteur thermodurcissable
CN108130029A (zh) * 2017-12-22 2018-06-08 烟台德邦科技有限公司 一种uv延迟固化的导电银胶及其制备方法
CN111909633A (zh) * 2020-07-14 2020-11-10 江苏矽时代材料科技有限公司 一种低温固化导电胶及其制备方法和应用

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