WO2022102573A1 - Film adhésif pour connexion de circuit et son procédé de production, et structure de connexion de circuit et son procédé de production - Google Patents

Film adhésif pour connexion de circuit et son procédé de production, et structure de connexion de circuit et son procédé de production Download PDF

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Publication number
WO2022102573A1
WO2022102573A1 PCT/JP2021/040989 JP2021040989W WO2022102573A1 WO 2022102573 A1 WO2022102573 A1 WO 2022102573A1 JP 2021040989 W JP2021040989 W JP 2021040989W WO 2022102573 A1 WO2022102573 A1 WO 2022102573A1
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WIPO (PCT)
Prior art keywords
component
adhesive layer
adhesive film
circuit connection
circuit
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PCT/JP2021/040989
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English (en)
Japanese (ja)
Inventor
智陽 山崎
剛幸 市村
亮太 小林
華世 稗島
Original Assignee
昭和電工マテリアルズ株式会社
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Priority to JP2022561905A priority Critical patent/JPWO2022102573A1/ja
Publication of WO2022102573A1 publication Critical patent/WO2022102573A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the present disclosure relates to an adhesive film for circuit connection, a circuit connection structure, and a method for manufacturing the same.
  • conductive particles are used in an adhesive film.
  • a dispersed anisotropic conductive film is used.
  • the circuit members are bonded to each other by the circuit connection portion formed of the circuit connection adhesive film, and the electrodes on the circuit members are electrically connected to each other via the conductive particles in the circuit connection portion.
  • COG chip on glass
  • the density of circuits is increasing, and the electrode spacing is extremely narrow, for example, 15 ⁇ m or less. Further, the bump electrode of the connecting member is also becoming smaller in area. In such a small-area electrode, in order to obtain a stable electrical connection, it is necessary that a sufficient number of conductive particles are interposed between the bump electrode and the circuit electrode on the substrate side.
  • Patent Document 1 proposes a method in which conductive particles are unevenly distributed on one side of an anisotropic conductive adhesive sheet to separate the conductive particles from each other.
  • the conductive particles may flow out from between the opposing electrode circuits due to the flow of the conductive particles at the time of circuit connection, and there is still room for improvement in terms of the capture rate of the conductive particles.
  • the adhesive of the adhesive film for circuit connection by heat or light to suppress the fluidity of the conductive particles and improve the capture rate of the conductive particles.
  • the connection resistance is increased.
  • the main object of the present disclosure is to provide an adhesive film for circuit connection capable of improving the capture rate of conductive particles between facing electrodes of a circuit connection structure and reducing the connection resistance. do.
  • the circuit connection adhesive film is provided on a first adhesive layer containing conductive particles, a cured product of a curable resin component, and a first thermosetting resin component, and a first adhesive layer. Further, it includes a second adhesive layer containing a second thermosetting resin component.
  • the circuit connection adhesive film is formed by placing a first adhesive layer of the circuit connection adhesive film on a glass substrate having indium tin oxide (ITO) wiring at a temperature of 60 ° C. and an area of the first adhesive layer.
  • ITO indium tin oxide
  • the peel strength is 60 N / m or less
  • the hardness of the resin is sufficient from the viewpoint of the fluidity of the resin, so that the fluidity of the resin at the time of mounting becomes small, and as a result, the capture rate of conductive particles is reduced. Can be improved.
  • the peel strength exceeds 60 N / m
  • the hardness of the resin is too soft from the viewpoint of the fluidity of the resin, so that the fluidity of the resin at the time of mounting is large and the capture rate of conductive particles tends to be insufficient. be.
  • the peel strength is 20 N / m or more
  • the hardness of the resin is sufficient from the viewpoint of the fluidity of the resin, so that the resin in the adhesive at the time of mounting is sufficiently eliminated, and as a result, the connection is made. It is possible to reduce the resistance.
  • the peel strength is less than 20 N / m
  • the hardness of the resin is too hard from the viewpoint of the fluidity of the resin, so that the resin in the adhesive at the time of mounting is not sufficiently eliminated and the connection resistance is increased. It tends to rise.
  • the peel strength is 20 N / m or more, preferably 20 to 60 N / m, the transferability to the glass substrate is excellent, and it is possible to obtain sufficient indentation strength in the circuit connection structure.
  • the curable resin component has photocurability. In another aspect of the circuit connection adhesive film, the curable resin component has thermosetting property.
  • the thickness of the first adhesive layer may be 5 ⁇ m or less. When the thickness of the first adhesive layer is 5 ⁇ m or less, conductive particles at the time of circuit connection can be captured more efficiently.
  • the method for producing an adhesive film for circuit connection is to cure a curable resin component on a layer composed of a composition containing conductive particles, a curable resin component, and a first thermosetting resin component.
  • the process of forming the first adhesive layer and the second adhesive layer containing the second thermosetting resin component are provided on the first adhesive layer to form an adhesive film for circuit connection.
  • the circuit connection adhesive film is formed by placing a first adhesive layer of the circuit connection adhesive film on a glass substrate having indium tin oxide (ITO) wiring at a temperature of 60 ° C. and an area of the first adhesive layer.
  • ITO indium tin oxide
  • the peel strength at 40 ° C. is 20 to 60 N / m.
  • a circuit connection adhesive capable of improving the capture rate of conductive particles between the facing electrodes of the circuit connection structure and reducing the connection resistance. Films can be manufactured.
  • Another aspect of this disclosure relates to a method of manufacturing a circuit connection structure.
  • the above-mentioned circuit connection adhesive film is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode.
  • the circuit connection structure is arranged between a first circuit member having a first electrode, a second circuit member having a second electrode, and a first circuit member and a second circuit member.
  • a circuit connection portion for electrically connecting the first electrode and the second electrode to each other is provided.
  • the circuit connection portion includes a cured product of the above-mentioned circuit connection adhesive film.
  • a circuit connection adhesive film capable of improving the capture rate of conductive particles between facing electrodes of a circuit connection structure and reducing the connection resistance.
  • the circuit-connecting adhesive film according to some forms has excellent transferability to a glass substrate, and it is possible to obtain sufficient indentation strength in the circuit connection structure. Further, the present disclosure discloses a method for producing such an adhesive film for circuit connection. Further, the present disclosure discloses a circuit connection structure using such a circuit connection adhesive film and a method for manufacturing the same.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection.
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit connection structure.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure. 3 (a) and 3 (b) are schematic cross-sectional views showing each process.
  • FIG. 4 is a schematic top view showing the laminated body in the peel strength measurement of the embodiment.
  • the (meth) acryloyl group means an acryloyl group or a methacryloyl group, as well as other similar expressions such as (meth) acrylate.
  • the numerical range indicated by using "-" indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively.
  • the lower and upper limits of the numerical range described herein are optionally combined with the lower and upper limits of the other numerical ranges, respectively.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
  • the upper limit value and the lower limit value described individually can be arbitrarily combined.
  • the numerical values A and B at both ends are included in the numerical range as the lower limit value and the upper limit value, respectively.
  • the description of "10 or more” means “10” and “a numerical value exceeding 10", and the same applies when the numerical values are different.
  • the description “10 or less” means “10” and “a numerical value less than 10", and the same applies when the numerical values are different.
  • each component and material exemplified in the present specification may be used alone or in combination of two or more.
  • the content of each component in the composition means the total amount of the plurality of substances present in the composition when a plurality of substances corresponding to each component are present in the composition, unless otherwise specified.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection.
  • the circuit connection adhesive film 10 (hereinafter, may be simply referred to as “adhesive film 10”) shown in FIG. 1 includes the conductive particles 4, the cured product of the curable resin component, and the first thermosetting property.
  • the adhesive film 10 the conductive particles 4 are dispersed in the first adhesive layer 1. Therefore, the adhesive film 10 can be a circuit-connecting adhesive film (anisotropic adhesive film) having anisotropic conductivity.
  • the adhesive film 10 is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and heats the first circuit member and the second circuit member. It may be crimped and used to electrically connect the first electrode and the second electrode to each other.
  • the first adhesive layer 1 is a cured product of conductive particles 4 (hereinafter, may be referred to as "(A) component”) and a curable resin component (hereinafter, may be referred to as “(B) component”).
  • a (first) thermosetting resin component hereinafter, may be referred to as “(C) component”.
  • the first adhesive layer 1 is formed by, for example, light, heat, moisture, or the like with respect to a composition layer composed of a composition containing the component (A), the component (B), and the component (C). It can be obtained by polymerizing the component contained in the component and curing the component (B).
  • the first adhesive layer 1 contains the component (A), the cured product of the component (B), and the adhesive component 5 containing the component (C).
  • the cured product of the component (B) may be a cured product obtained by completely curing the component (B), or may be a cured product obtained by curing a part of the component (B).
  • the component (C) is a component that can flow when connected to a circuit, and is, for example, an uncured curable resin component.
  • Component (A) Conductive particles
  • the component (A) is not particularly limited as long as it is a particle having conductivity, and is a metal particle composed of a metal such as Au, Ag, Pd, Ni, Cu, or solder, or conductive carbon. It may be conductive carbon particles composed of.
  • the component (A) may be a coated conductive particle containing a nucleus containing non-conductive glass, ceramic, plastic (polystyrene, etc.) and the like, and a coating layer containing the metal or conductive carbon and covering the nucleus. good.
  • the component (A) preferably contains metal particles formed of a heat-meltable metal or a core containing plastic, and contains a metal or conductive carbon and has a coating layer covering the core.
  • Such coated conductive particles can easily deform the cured product of the thermosetting resin component by heating or pressurizing, when the electrodes are electrically connected to each other, the electrode and the component (A) are connected to each other.
  • the contact area can be increased and the conductivity between the electrodes can be further improved.
  • the component (A) may be an insulating coated conductive particle containing the above-mentioned metal particles, conductive carbon particles, or coated conductive particles and an insulating material such as a resin and having an insulating layer covering the surface of the particles. good.
  • the component (A) is an insulating coated conductive particle, even when the content of the component (A) is large, the insulating layer is provided on the surface of the particle, so that the component (A) is short-circuited due to contact with each other. The generation can be suppressed, and the insulation between adjacent electrode circuits can be improved.
  • one of the above-mentioned various conductive particles may be used alone or in combination of two or more.
  • the maximum particle size of the component (A) needs to be smaller than the minimum distance between the electrodes (the shortest distance between adjacent electrodes).
  • the maximum particle size of the component (A) may be 1.0 ⁇ m or more, 2.0 ⁇ m or more, or 2.5 ⁇ m or more from the viewpoint of excellent dispersibility and conductivity.
  • the maximum particle size of the component (A) may be 20 ⁇ m or less, 10 ⁇ m or less, or 5 ⁇ m or less from the viewpoint of excellent dispersibility and conductivity.
  • the particle size of any 300 conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the largest value obtained is the maximum particle size of the component (A).
  • SEM scanning electron microscope
  • the particle size of the component (A) is the diameter of a circle circumscribing the conductive particles in the SEM image.
  • the average particle size of the component (A) may be 1.0 ⁇ m or more, 2.0 ⁇ m or more, or 2.5 ⁇ m or more from the viewpoint of excellent dispersibility and conductivity.
  • the average particle size of the component (A) may be 20 ⁇ m or less, 10 ⁇ m or less, or 5 ⁇ m or less from the viewpoint of excellent dispersibility and conductivity.
  • the particle size of any 300 conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the average value of the obtained particle sizes is taken as the average particle size.
  • the component (A) is preferably uniformly dispersed.
  • the particle density of the component (A) in the adhesive film 10 is 100 pieces / mm 2 or more, 1000 pieces / mm 2 or more, 3000 pieces / mm 2 or more, or 5000 pieces / mm from the viewpoint of obtaining stable connection resistance. It may be 2 or more.
  • the particle density of the component (A) in the adhesive film 10 is 100,000 pieces / mm 2 or less, 70,000 pieces / mm 2 or less, 50,000 pieces / mm 2 or less, or 30,000 from the viewpoint of improving the insulating property between adjacent electrodes. Pieces / mm 2 or less may be used.
  • the content of the component (A) is 1% by mass or more, 10% by mass or more, or 20% by mass or more based on the total mass of the first adhesive layer from the viewpoint of further improving the conductivity. It may be there.
  • the content of the component (A) may be 80% by mass or less, 60% by mass or less, or 50% by mass or less based on the total mass of the first adhesive layer from the viewpoint of easily suppressing a short circuit.
  • the content of the component (A) is in the above range, the effect of the present disclosure tends to be remarkably exhibited.
  • the content of the component (A) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • a photocurable resin component photocurable resin component
  • a thermosetting resin component thermosetting resin component
  • examples thereof include a curable resin component having a moisture-curable property (moisture-curable resin component).
  • the thermosetting resin component may be different from the component (C) described later in, for example, a curing system (for example, a radical curing system, a cationic curing system, etc.), a polymerization start temperature, and the like.
  • the polymerization start temperature can be adjusted depending on the type of the polymerization initiator and the like.
  • the thermosetting resin component of the component (B) may have a lower polymerization initiation temperature than the thermosetting resin component of the component (C).
  • the component (B) may be a photocurable resin component or a thermosetting resin component, and more preferably a photocurable resin component.
  • the component (B) may be referred to as a polymerizable compound (hereinafter, “MA component”). )
  • MA component polymerizable compound
  • MB component the polymerization initiator
  • the photocurable resin component may be a resin component having radical curability or a resin component having cation curability.
  • the resin component having radical curability in the photocurable resin component is, for example, a radically polymerizable compound (hereinafter, may be referred to as “(MA-R) component”) and a photoradical polymerization initiator (hereinafter, “(MB)”. -RL) component "may be combined with.).
  • the cationically curable resin component in the photocurable resin component is, for example, a cationically polymerizable compound (hereinafter, may be referred to as “(MA-C) component”) and a photocationic polymerization initiator (hereinafter, “(MB)”. -C-L) component "may be combined with.).
  • the thermosetting resin component may be a resin component having radical curability or a resin component having cation curability.
  • the resin component having radical curability in the thermosetting resin component is, for example, a (MA-R) component and a thermo-radical polymerization initiator (hereinafter, may be referred to as “(MB-RH) component”). It can be a combination.
  • the cationically curable resin component in the thermosetting resin component is, for example, a (MA-C) component and a thermocationic polymerization initiator (hereinafter, may be referred to as "(MB-CH) component"). It can be a combination.
  • the component (B) and the component (C) described later have different curing systems (for example, radical curing system, cationic curing system, etc.). Since the curing system of the component (B) and the curing system of the component (C) are different, it is possible to selectively and efficiently cure only the component (B). More specifically, when a thermosetting resin component having cation curability (for example, a combination of (MA-C) component and (MB-CH) component) is used as the component (C), (B)
  • the component is a photocurable resin component having radical curability (for example, a combination of (MA-R) component and (MB-RL) component) or a thermosetting resin component having radical curability (for example, (for example,).
  • thermosetting resin component having radical curability for example, a combination of (MA-R) component and (MB-RH) component
  • the component (B) is cationically curable.
  • a photocurable resin component having for example, a combination of (MA-C) component and (MB-C-L) component
  • a thermosetting resin component having cationic curability for example, (MA-C) component
  • It may be (combination with (MB—CH) component), and more preferably a photocurable resin component having cation curability.
  • the radically polymerizable compound (MA-R) component is polymerized by radicals generated from a radical polymerization initiator ((MB-RL) component, (MB-RH) component, etc.). It is a compound.
  • the (MA-R) component may be either a monomer or a polymer (or oligomer) obtained by polymerizing one or more kinds of monomers.
  • the (MA-R) component may be used alone or in combination of two or more.
  • the (MA-R) component is a compound having a radically polymerizable group that reacts with a radical.
  • the radically polymerizable group include (meth) acryloyl group, vinyl group, allyl group, styryl group, alkenyl group, alkenylene group, maleimide group and the like.
  • the number of radically polymerizable groups (number of functional groups) contained in the (MA-R) component is such that the desired melt viscosity can be easily obtained after polymerization, the effect of reducing the connection resistance is further improved, and the connection reliability is improved. It may be 2 or more, and may be 10 or less from the viewpoint of suppressing curing shrinkage during polymerization. Further, in order to balance the crosslink density and the curing shrinkage, in addition to the compound having the number of radically polymerizable groups within the above range, a compound having the number of radically polymerizable groups outside the above range may be used. good.
  • the (MA-R) component may contain, for example, a polyfunctional (bifunctional or higher) (meth) acrylate from the viewpoint of suppressing the flow of conductive particles.
  • the polyfunctional (bifunctional or higher) (meth) acrylate may be a bifunctional (meth) acrylate, and the bifunctional (meth) acrylate may be a bifunctional aromatic (meth) acrylate.
  • polyfunctional (meth) acrylate examples include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and polyethylene glycol di (meth) acrylate.
  • the content of the polyfunctional (bifunctional or higher) (meth) acrylate is, for example, 40, based on the total mass of the (MA-R) component, from the viewpoint of achieving both the effect of reducing the connection resistance and the suppression of particle flow. It may be up to 100% by mass, 50 to 100% by mass, or 60 to 100% by mass.
  • the (MA-R) component may further contain a monofunctional (meth) acrylate in addition to the polyfunctional (bifunctional or higher) (meth) acrylate.
  • a monofunctional (meth) acrylate examples include (meth) acrylic acid; methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, and tert-butyl (meth) acrylate.
  • (Meta) acrylates having an alicyclic epoxy group such as, ( Examples thereof include (meth) acrylate having an oxetanyl group such as 3-ethyloxetane-3-yl) methyl (meth) acrylate.
  • the content of the monofunctional (meth) acrylate may be, for example, 0 to 60% by mass, 0 to 50% by mass, or 0 to 40% by mass based on the total mass of the (MA-R) component.
  • the cured product of the component (B) may have, for example, a polymerizable group that reacts with a substance other than a radical.
  • the polymerizable group that reacts with a non-radical substance may be, for example, a cationically polymerizable group that reacts with a cation.
  • the cationically polymerizable group include an epoxy group such as a glycidyl group, an alicyclic epoxy group such as an epoxycyclohexylmethyl group, and an oxetanyl group such as an ethyloxetanylmethyl group.
  • the cured product of the component (B) having a polymerizable group that reacts by other than radicals is, for example, a (meth) acrylate having an epoxy group, a (meth) acrylate having an alicyclic epoxy group, and a (meth) acrylate having an oxetanyl group. It can be introduced by using a (meth) acrylate having a polymerizable group that reacts with a non-radical substance such as (B) as a component (B).
  • Mass ratio of (meth) acrylate having a polymerizable group that reacts with other than radicals to the total mass of the (MA-R) component (mass ratio of (meth) acrylate having a polymerizable group that reacts with other than radicals (charged amount) / ( The total mass (charged amount) of the MA-R) component may be, for example, 0 to 0.7, 0 to 0.5, or 0 to 0.3 from the viewpoint of improving reliability.
  • the (MA-R) component may contain other radically polymerizable compounds in addition to polyfunctional (bifunctional or higher) and monofunctional (meth) acrylates.
  • examples of other radically polymerizable compounds include maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, nadiimide derivatives and the like.
  • the content of the other radically polymerizable compound may be, for example, 0 to 40% by mass based on the total mass of the (MA-R) component.
  • Photoradical polymerization initiator (MB-RL) component is light containing a wavelength in the range of 150 to 750 nm, preferably light containing a wavelength in the range of 254 to 405 nm. More preferably, it is a polymerization initiator that generates radicals by irradiation with light having a wavelength of 365 nm (for example, ultraviolet light).
  • the (MB-RL) component may be used alone or in combination of two or more.
  • the (MB-RL) component is decomposed by light to generate free radicals. That is, the (MB-RL) component is a compound that generates radicals by applying light energy from the outside.
  • the (MB-RL) component includes an oxime ester structure, a bisimidazole structure, an acrydin structure, an ⁇ -aminoalkylphenone structure, an aminobenzophenone structure, an N-phenylglycine structure, an acylphosphine oxide structure, a benzyldimethylketal structure, and ⁇ -. It may be a compound having a structure such as a hydroxyalkylphenone structure.
  • the (MB-RL) component may be used alone or in combination of two or more.
  • the (MB-RL) component is composed of an oxime ester structure, an ⁇ -aminoalkylphenone structure, and an acylphosphine oxide structure from the viewpoint that the desired melt viscosity can be easily obtained and the effect of reducing the connection resistance is superior. It may be a compound having at least one structure selected from the group.
  • the compound having an oxime ester structure examples include 1-phenyl-1,2-butandion-2- (o-methoxycarbonyl) oxime and 1-phenyl-1,2-propanedione-2- (o-methoxycarbonyl).
  • the compound having an ⁇ -aminoalkylphenone structure include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one and 2-benzyl-2-dimethylamino-1. -Morphorinophenyl) -butanone-1 and the like.
  • the compound having an acylphosphine oxide structure include bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide and bis (2,4,6, -trimethylbenzoyl) -phenylphosphine.
  • Examples thereof include oxide, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide and the like.
  • the content of the (MB-RL) component is, for example, 0.1 to 10 parts by mass and 0.3 to 0.3 to 100 parts by mass with respect to 100 parts by mass of the (MA-R) component from the viewpoint of suppressing the flow of conductive particles. It may be 7 parts by mass or 0.5 to 5 parts by mass.
  • (MB-RH) component Thermal radical polymerization initiator (MB-RH) component is a polymerization initiator that generates radicals by heat.
  • the 1-hour half-life temperature of the (MB-RH) component may be, for example, 50-100 ° C.
  • the (MB-RH) component may be used alone or in combination of two or more.
  • Examples of the (MB-RH) component include diacyl peroxides such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, and benzoyl peroxide; t-butylperoxypivalate and t-hexylperoxypivalate.
  • the content of the (MB-RH) component is, for example, 0.1 to 15 parts by mass and 0.3 to 0.3 to 100 parts by mass with respect to 100 parts by mass of the (MA-R) component from the viewpoint of suppressing the flow of conductive particles. It may be 12 parts by mass or 0.5 to 10 parts by mass.
  • (MA-C) component Cationic polymerizable compound (MA-C) component is crosslinked by reacting with a cationic polymerization initiator ((MB-C-L) component, (MB-C-H) component, etc.). It is a compound.
  • the (MA-C) component means a compound having no radically polymerizable group that reacts with a radical, and the (MA-C) component is not included in the (MA-R) component.
  • Examples of the (MA-C) component include an epoxy compound, an oxetane compound, an alicyclic epoxy compound and the like.
  • the (MA-C) component may contain at least one selected from the group consisting of, for example, an oxetane compound and an alicyclic epoxy compound from the viewpoint of further improving the effect of reducing the connection resistance and improving the connection reliability. It may contain an alicyclic epoxy compound.
  • the (MA-C) component may be used alone or in combination of two or more.
  • the epoxy compound examples include a bisphenol type epoxy resin derived from epichlorohydrin and a bisphenol compound such as bisphenol A, bisphenol F or bisphenol AD; an epoxy derived from epichlorohydrin and a novolak resin such as phenol novolac or cresol novolak.
  • Novolak resin various epoxy compounds having two or more glycidyl groups in one molecule such as glycidylamine, glycidyl ether, biphenyl, and alicyclic type can be mentioned. These may use one kind of compound alone or may use a plurality of compounds in combination.
  • the oxetane compound can be used without particular limitation as long as it has an oxetaneyl group and does not have a radically polymerizable group.
  • Commercially available oxetane compounds include, for example, ETERNCOLL OXBP (trade name, manufactured by Ube Kosan Co., Ltd.), OXSQ, OXT-121, OXT-221, OXT-101, OXT-212 (trade name, manufactured by Toagosei Corporation). And so on. These may use one kind of compound alone or may use a plurality of compounds in combination.
  • the alicyclic epoxy compound can be used without particular limitation as long as it is a compound having an alicyclic epoxy group (for example, an epoxycyclohexyl group) and no radical polymerizable group.
  • Examples of commercially available alicyclic epoxy compounds include CEL8010, CEL2021P, and CEL2081 (trade name, manufactured by Daicel Corporation). These may use one kind of compound alone or may use a plurality of compounds in combination.
  • Photocationic polymerization initiator (MB-CL) component is light containing a wavelength in the range of 150 to 750 nm, preferably light containing a wavelength in the range of 254 to 405 nm. More preferably, it is a polymerization initiator that generates a substance that initiates cationic polymerization by irradiation with light having a wavelength of 365 nm (for example, ultraviolet light).
  • the (MB-C-L) component may act as the (MB-C-H) component described later.
  • (MB-C-L) is, for example, BF 4- , BR 4- ( R indicates a phenyl group substituted with two or more fluorine atoms or two or more trifluoromethyl groups ) , PF 6- ,.
  • onium salts such as sulfonium salts, phosphonium salts, ammonium salts, diazonium salts, iodonium salts and anilinium salts having anions such as SbF 6 ⁇ and AsF 6 ⁇ . These may be used individually by 1 type, and may be used in combination of a plurality of types.
  • (MB-C-L) component Commercially available products of the (MB-C-L) component include, for example, CPI-100P, CPI-110P, CPI-101A, CPI-200K, CPI-210S (all manufactured by Sun Appro Co., Ltd.), UVI-6990, UVI-. 6992, UVI-6976 (all manufactured by Dow Chemical Japan Co., Ltd.), SP-150, SP-152, SP-170, SP-172, SP-300 (all manufactured by ADEKA Corporation) and the like can be mentioned.
  • the content of the (MB-C-L) component is 100 parts by mass of the (MA-C) component from the viewpoint of ensuring the formability and curability of the adhesive film for forming the first adhesive layer.
  • it may be, for example, 0.1 to 15 parts by mass, 0.3 to 12 parts by mass, 0.5 to 10 parts by mass, or 1 to 5 parts by mass.
  • (MB-CH) component Thermal cationic polymerization initiator (MB-CH) component is a polymerization initiator that generates a substance that initiates cationic polymerization by heat (for example, 40 to 150 ° C.).
  • the (MB-C-H) component may act as the above-mentioned (MB-C-L) component.
  • the (MB-C—H) component is similarly substituted with, for example, BF 4- , BR 4- ( R is replaced with 2 or more fluorine atoms or 2 or more trifluoromethyl groups) in the same manner as the (MB-C—L) component. ), PF 6- , SbF 6- , AsF 6- , and other onium salts such as sulfonium salt, phosphonium salt, ammonium salt, diazonium salt, iodonium salt, anilinium salt, etc. Be done. These may be used individually by 1 type, and may be used in combination of a plurality of types.
  • the content of the (MB-C-H) component is 100 parts by mass of the (MA-C) component from the viewpoint of ensuring the formability and curability of the adhesive film for forming the first adhesive layer.
  • it may be, for example, 0.1 to 50 parts by mass, 1 to 45 parts by mass, 10 to 40 parts by mass, or 20 to 35 parts by mass.
  • the content of the cured product (component (B)) of the component (B) is 1% by mass or more and 5% by mass or more based on the total mass of the first adhesive layer from the viewpoint of suppressing the flow of conductive particles. , Or 10% by mass or more.
  • the content of the cured product of the component (B) is 50% by mass or less, 40% by mass or less, or 30% by mass based on the total mass of the first adhesive layer from the viewpoint of developing low resistance in low-pressure mounting. It may be as follows. When the content of the cured product of the component (B) is in the above range, the effect of the present disclosure tends to be remarkably exhibited.
  • the content of the component (B) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • Component (C) Thermosetting resin component
  • the component (C) is not particularly limited as long as it is a thermosetting resin component, but is the same as the above-mentioned resin component having radical curability ((MA-R) component). (Combination with (MB-RH) component), and the above-mentioned resin component having cation curability (combination of (MA-C) component and (MB-CH) component). May be good.
  • the component (C) may be a resin component having cationic curability (combination of (MA-C) component and (MB-C-H) component).
  • the (MA-R) component, the (MB-RH) component, the (MA-C) component, and the (MB-CH) component used in the (C) component are used in the (B) component. Since it is the same as the (MA-R) component, the (MB-RH) component, the (MA-C) component, and the (MB-CH) component, detailed description thereof will be omitted here. Further, the content of the (MB-RH) component with respect to the (MA-R) component in the component (C) and the content of the (MB-CH) component with respect to the (MA-C) component are the components (B). It may be the same as the range in the case of.
  • the first thermosetting resin component and the second thermosetting resin component mean the thermosetting resin components contained in the first adhesive layer and the second adhesive layer, respectively.
  • the components contained in the first thermosetting resin component and the second thermosetting resin component for example, (MA-R) component, (MB-RH) component, (MA-C) component, (MB-).
  • the types, combinations, and contents of CH) components, etc. may be the same or different from each other.
  • the content of the component (C) is 3% by mass or more based on the total mass of the first adhesive layer from the viewpoint of ensuring the curability of the adhesive film for forming the first adhesive layer. It may be 5% by mass or more, 10% by mass or more, or 15% by mass or more.
  • the content of the component (C) is 70% by mass or less based on the total mass of the first adhesive layer from the viewpoint of ensuring the formability of the adhesive film for forming the first adhesive layer. It may be 60% by mass or less, 50% by mass or less, or 40% by mass or less.
  • the content of the component (C) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the first adhesive layer 1 may further contain other components in addition to the component (A), the cured product of the component (B), and the component (C).
  • other components include a thermoplastic resin (hereinafter, may be referred to as “(D) component”), a filler (hereinafter, may be referred to as “(E) component”), and a coupling agent (hereinafter, may be referred to as “component”).
  • component a thermoplastic resin
  • component hereinafter, may be referred to as “(E) component”
  • component a coupling agent
  • component may be mentioned.
  • the component (D) examples include phenoxy resin, polyester resin, polyamide resin, polyurethane resin, polyester urethane resin, acrylic rubber, epoxy resin (solid at 25 ° C.) and the like. These may be used individually by 1 type, and may be used in combination of a plurality of types.
  • the composition layer further, the first adhesive layer 1 from the composition. Can be easily formed.
  • the component (D) may be, for example, a phenoxy resin.
  • the content of the component (D) may be 1% by mass or more, 5% by mass or more, 10% by mass or more, or 15% by mass or more, 60% by mass, based on the total mass of the first adhesive layer. Hereinafter, it may be 50% by mass or less, 40% by mass or less, or 30% by mass or less.
  • the content of the component (D) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • Examples of the component (E) include non-conductive fillers (for example, non-conductive particles).
  • the component (E) may be either an inorganic filler or an organic filler.
  • Examples of the inorganic filler include metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; and inorganic fine particles such as metal nitride fine particles.
  • Examples of the organic filler include organic fine particles such as silicone fine particles, methacrylate / butadiene / styrene fine particles, acrylic / silicone fine particles, polyamide fine particles, and polyimide fine particles. These may be used individually by 1 type, and may be used in combination of a plurality of types.
  • the component (E) may be, for example, silica fine particles.
  • the content of the component (E) may be 0.1 to 10% by mass based on the total mass of the first adhesive layer.
  • the content of the component (E) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the component (F) examples include a silane coupling agent having an organic functional group such as a (meth) acryloyl group, a mercapto group, an amino group, an imidazole group and an epoxy group, a silane compound such as tetraalkoxysilane, and a tetraalkoxy titanate derivative. , Polydialkyl titanate derivatives and the like. These may be used individually by 1 type, and may be used in combination of a plurality of types. When the first adhesive layer 1 contains the component (F), the adhesiveness can be further improved.
  • the component (F) may be, for example, a silane coupling agent.
  • the content of the component (F) may be 0.1 to 10% by mass based on the total mass of the first adhesive layer.
  • the content of the component (F) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the first adhesive layer 1 may further contain other additives such as a softening agent, an accelerator, a deterioration inhibitor, a coloring agent, a flame retardant, and a thixotropic agent.
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the first adhesive layer.
  • the content of other additives in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the thickness d1 of the first adhesive layer 1 may be, for example, 5 ⁇ m or less.
  • the thickness d1 of the first adhesive layer 1 may be 4.5 ⁇ m or less or 4.0 ⁇ m or less.
  • the thickness d1 of the first adhesive layer 1 may be, for example, 0.1 ⁇ m or more, 0.5 ⁇ m or more, or 0.7 ⁇ m or more.
  • the thickness d1 of the first adhesive layer 1 is determined by, for example, sandwiching an adhesive film between two sheets of glass (thickness: about 1 mm) and bisphenol A type epoxy resin (trade name: JER811, Mitsubishi Chemical Co., Ltd.).
  • the distance to the boundary S with and (the distance indicated by d1 in FIG. 1) is the thickness of the first adhesive layer 1, and the exposed portion of the conductive particles 4 is included in the thickness of the first adhesive layer 1. I can't.
  • the length of the exposed portion of the conductive particles 4 may be, for example, 0.1 ⁇ m or more, and may be 5 ⁇ m or less.
  • the second adhesive layer 2 contains the component (C).
  • the (MB-CH) component are the (MA-R) components, (MB-R) used in the (C) component in the first adhesive layer 1 (that is, the first thermosetting resin component). Since it is the same as the RH) component, the (MA-C) component, and the (MB-CH) component, detailed description thereof will be omitted here.
  • the second thermosetting resin component may be the same as or different from the first thermosetting resin component.
  • the second thermosetting resin component may be a combination of the (MA-C) component and the (MB-CH) component.
  • the content of the component (C) is 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more based on the total mass of the second adhesive layer from the viewpoint of maintaining reliability. May be.
  • the content of the component (C) is 70% by mass or less and 60% by mass or less based on the total mass of the second adhesive layer from the viewpoint of preventing the resin seepage problem in the reel, which is one aspect of the supply form. , 50% by mass or less, or 40% by mass or less.
  • the second adhesive layer 2 may further contain other components and other additives in the first adhesive layer 1. Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the first adhesive layer 1.
  • the content of the component (D) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, and is 80% by mass or less and 60% by mass, based on the total mass of the second adhesive layer. It may be less than or equal to 40% by mass or less.
  • the content of the component (E) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, and 70% by mass or less, 60% by mass, based on the total mass of the second adhesive layer. It may be less than or equal to 50% by mass or less.
  • the content of the component (F) may be 0.1 to 10% by mass based on the total mass of the second adhesive layer.
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the second adhesive layer.
  • the thickness d2 of the second adhesive layer 2 may be appropriately set according to the height of the electrodes of the circuit member to be adhered.
  • the thickness d2 of the second adhesive layer 2 is 5 ⁇ m or more or 7 ⁇ m or more from the viewpoint that the space between the electrodes can be sufficiently filled to seal the electrodes and better connection reliability can be obtained. It may be 20 ⁇ m or less or 15 ⁇ m or less.
  • the thickness d2 of the second adhesive layer 2 can be obtained, for example, by the same method as the method for measuring the thickness d1 of the first adhesive layer 1.
  • the first in the second adhesive layer 2 The distance from the surface 3a on the side opposite to the adhesive layer 1 side to the boundary S between the first adhesive layer 1 and the second adhesive layer 2 located at the separated portions of the adjacent conductive particles 4 and 4 ( The distance (d2) in FIG. 1 is the thickness of the second adhesive layer 2.
  • the thickness of the adhesive film 10 (the total thickness of all the layers constituting the adhesive film 10, in FIG. 1, the thickness d1 of the first adhesive layer 1 and the thickness of the second adhesive layer 2).
  • the total of d2) may be, for example, 5 ⁇ m or more or 8 ⁇ m or more, and may be 30 ⁇ m or less or 20 ⁇ m or less.
  • the first adhesive layer 1 of the adhesive film 10 is placed on a glass substrate having indium tin oxide (ITO) wiring at a temperature of 60 ° C., an area-converted pressure of the first adhesive layer 1 of 1 MPa, and a time of 1 second.
  • ITO indium tin oxide
  • the peel strength between the glass substrate and the first adhesive layer 1 at 40 ° C. after the glass substrate and the first adhesive layer 1 after being pasted is 20 to 60 N / m.
  • the peel strength is a peel strength measured at a peel angle of 90 ° and a peel speed of 50 mm / min.
  • the peel strength is 60 N / m or less
  • the hardness of the resin is sufficient from the viewpoint of the fluidity of the resin, so that the fluidity of the resin at the time of mounting becomes small, and as a result, the capture rate of conductive particles is reduced. Can be improved.
  • the peel strength exceeds 60 N / m
  • the hardness of the resin is too soft from the viewpoint of the fluidity of the resin, so that the fluidity of the resin at the time of mounting is large and the capture rate of conductive particles tends to be insufficient. be.
  • the peel strength is 20 N / m or more
  • the hardness of the resin is sufficient from the viewpoint of the fluidity of the resin, so that the resin in the adhesive at the time of mounting is sufficiently eliminated, and as a result, the connection is made. It is possible to reduce the resistance.
  • the peel strength is less than 20 N / m
  • the hardness of the resin is too hard from the viewpoint of the fluidity of the resin, so that the resin in the adhesive at the time of mounting is not sufficiently eliminated and the connection resistance is increased. It tends to rise.
  • the fluidity of the resin at the time of mounting is large, the conductive particles are easily connected and the insulating property tends to be deteriorated.
  • the peel strength is 20 to 60 N / m
  • the fluidity of the resin at the time of mounting tends to be appropriate, and the insulating property tends to be good.
  • the peel strength is 20 N / m or more, preferably 20 to 60 N / m
  • the transferability to the glass substrate is excellent, and it is possible to obtain sufficient indentation strength in the circuit connection structure.
  • the peel strength may be 25 N / m or more, 30 N / m or more, 35 N / m or more, or 40 N / m or more, and may be 55 N / m or less or 50 N / m or less.
  • the peel strength can be obtained by, for example, the following method. First, a glass substrate having ITO wiring (glass substrate size: 2.5 mm ⁇ 28 mm, glass substrate thickness: 300 ⁇ m, ITO wiring size: 2500 ⁇ m (2.5 mm) ⁇ 300 ⁇ m, ITO wiring thickness: Prepare 0.2 ⁇ m, the number of ITO wirings: 28, and the space between ITO wirings: 300 ⁇ m). Next, the adhesive film is cut out to a size of 2 mm ⁇ 23 mm, and the first adhesive layer of the cut out adhesive film is arranged on the glass substrate having the ITO wiring so as to be perpendicular to the ITO wiring.
  • the adhesive film is attached by a thermocompression bonding machine under the conditions of a temperature of 60 ° C., an area conversion pressure of the first adhesive layer of 1 MPa, and a time of 1 second to obtain a laminate (see FIG. 4).
  • the PET film of the second adhesive film (second adhesive layer) is peeled off, and a polyimide tape cut out to a size of 1.8 mm ⁇ 35 mm is attached onto the second adhesive layer to prepare a sample for measurement. obtain.
  • the glass substrate side of the measurement sample is placed on a hot plate set at 40 ° C., the tip of the polyimide tape is set in a tensile strength measuring device (Tensilon), and the glass substrate is fixed horizontally.
  • the peel strength of the adhesive film 10 tends to fluctuate depending on the first adhesive layer 1.
  • the peel strength of the adhesive film 10 can be adjusted, for example, by adjusting the type, content, and the like of the constituent components contained in the first adhesive layer 1. More specifically, by changing the content of the liquid component as the component (B) and the component (C), changing the glass transition point (Tg) of the component (D), changing the content of the component (E), and the like. It can be carried out.
  • the flow rate of the conductive particles in the adhesive film 10 may be, for example, 160% or more, 170% or more, or 180% or more, and may be 250% or less, 230% or less, 220% or less, or 200% or less. May be good.
  • the flow rate of the conductive particles can be obtained by the following method.
  • the adhesive film 10 is punched to a diameter of 1 mm using a trepanning device to prepare a sample.
  • the surface of the punched sample on the first adhesive film (first adhesive layer) side was heated and pressed for 1 second under the conditions of a maximum ultimate temperature of 90 ° C. and a film area conversion pressure of 1 MPa, and attached to the cover glass. This is used as a test body (test body before crimping) for measuring the area of the first adhesive layer before crimping.
  • the PET film on the second adhesive film (second adhesive layer) side is peeled off, and then the cover glass is placed.
  • the film is heated and pressurized for 5 seconds under the conditions of a maximum ultimate temperature of 170 ° C. and a film area conversion pressure of 80 MPa to attach a second adhesive film (second adhesive layer) and a cover glass, and the pressure is applied.
  • a test piece (test piece after crimping) for measuring the area of the first adhesive layer.
  • the area of the first adhesive layer of the test piece before crimping and the area of the first adhesive layer of the test piece after crimping can be measured with a microscope, and the flow rate of the conductive particles can be calculated from the following formula. can.
  • Flow rate of conductive particles (%) (Area of first adhesive layer of test piece after crimping / Area of first adhesive layer of test piece before crimping) ⁇ 100
  • the flow rate of the conductive particles can be adjusted by adjusting the type, content, etc. of the constituent components contained in the first adhesive layer 1. More specifically, by adjusting the curing rate of the first adhesive layer 1, the first adhesive layer having the flow rate of the conductive particles in the above range can be obtained.
  • the adhesive film 10 is an anisotropically conductive adhesive film having an anisotropic conductivity.
  • the adhesive film 10 is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and heats the first circuit member and the second circuit member. It is crimped and used to electrically connect the first electrode and the second electrode to each other.
  • the adhesive film 10 it is possible to improve the capture rate of conductive particles between the facing electrodes of the circuit connection structure and reduce the connection resistance.
  • the adhesive film may be composed of, for example, two layers of a first adhesive layer and a second adhesive layer, and the two layers of the first adhesive layer and the second adhesive layer may be formed. It may be composed of three or more layers including.
  • the adhesive film may be configured to further include, for example, a third adhesive layer provided on the opposite side of the first adhesive layer from the second adhesive layer.
  • the third adhesive layer contains the component (C).
  • the (MB-C-H) component are the (MA-R) component, (MB-R) used in the (C) component (that is, the first thermosetting resin component) in the first adhesive layer 1. Since it is the same as the —H) component, the (MA—C) component, and the (MB—C—H) component, detailed description thereof will be omitted here.
  • the third thermosetting resin component may be the same as or different from the first thermosetting resin component.
  • the third thermosetting resin component may be the same as or different from the second thermosetting resin component.
  • the content of the component (C) is 5% by mass or more, 10% by mass or more, and 15% by mass or more based on the total mass of the third adhesive layer from the viewpoint of imparting good transferability and peeling resistance. , Or 20% by mass or more.
  • the content of the component (C) is 70% by mass or less based on the total mass of the third adhesive layer from the viewpoint of imparting good half-cut property and blocking resistance (suppression of resin seepage of the reel). It may be 60% by mass or less, 50% by mass or less, or 40% by mass or less.
  • the third adhesive layer may further contain other components and other additives in the first adhesive layer 1. Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the first adhesive layer 1.
  • the content of the component (D) may be 10% by mass or more, 20% by mass or more, or 30% by mass or more, and is 80% by mass or less and 70% by mass, based on the total mass of the third adhesive layer. It may be less than or equal to 60% by mass or less.
  • the content of the component (E) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and is 50% by mass or less and 40% by mass, based on the total mass of the third adhesive layer. It may be less than or equal to 30% by mass or less.
  • the content of the component (F) may be 0.1 to 10% by mass based on the total mass of the third adhesive layer.
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the third adhesive layer.
  • the thickness of the third adhesive layer may be appropriately set according to the minimum melt viscosity of the adhesive film, the height of the electrodes of the circuit members to be adhered, and the like.
  • the thickness of the third adhesive layer is preferably smaller than the thickness d2 of the second adhesive layer 2.
  • the thickness of the third adhesive layer may be 0.2 ⁇ m or more from the viewpoint that the space between the electrodes can be sufficiently filled to seal the electrodes and better connection reliability can be obtained. , 3.0 ⁇ m or less.
  • the thickness of the third adhesive layer can be obtained, for example, by the same method as the method for measuring the thickness d1 of the first adhesive layer 1.
  • circuit connection adhesive film of the above embodiment is an anisotropic conductive adhesive film having anisotropic conductivity, but the circuit connection adhesive film is a conductive adhesive having no anisotropic conductivity. It may be a film.
  • the method for producing an adhesive film for circuit connection is, for example, a composition comprising a composition containing (A) component, (B) component, and (C) component (first thermosetting resin component).
  • a step (second step) of laminating a second adhesive layer containing a curable resin component) is provided.
  • a third adhesive layer containing a component (C) (third thermosetting resin component) is placed on a layer of the first adhesive layer opposite to the second adhesive layer. May be further provided with a step of laminating (third step).
  • a composition containing (A) component, (B) component, and (C) component, and other components and other additives added as needed are organically prepared.
  • a varnish composition is prepared by dissolving or dispersing by stirring and mixing in a solvent, kneading and the like. Then, the varnish composition is applied onto the demolding-treated substrate using a knife coater, roll coater, applicator, comma coater, die coater, etc., and then the organic solvent is volatilized by heating to form the substrate. Form a composition layer composed of the composition. At this time, the thickness of the finally obtained first adhesive layer (first adhesive film) can be adjusted by adjusting the coating amount of the varnish composition.
  • the component (B) in the composition layer is cured by light, heat, humidity, etc. (preferably light or heat, more preferably light) with respect to the composition layer made of the composition, and the component (B) in the composition layer is cured on the substrate.
  • a first adhesive layer is formed on the surface.
  • the first adhesive layer can be said to be the first adhesive film.
  • the organic solvent used in the preparation of the varnish composition is not particularly limited as long as it has the property of uniformly dissolving or dispersing each component.
  • examples of such an organic solvent include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate, butyl acetate and the like. These organic solvents can be used alone or in combination of two or more.
  • Stirring and mixing or kneading in the preparation of the varnish composition can be carried out by using, for example, a stirrer, a raider, a three-roll, a ball mill, a bead mill, a homodisper or the like.
  • the base material is not particularly limited as long as it has heat resistance that can withstand the heating conditions when volatilizing the organic solvent.
  • a substrate examples include stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate, polyvinylidene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, polyimide, cellulose, and the like.
  • a substrate (for example, a film) made of an ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, a synthetic rubber system, a liquid crystal polymer or the like can be used.
  • the heating conditions for volatilizing the organic solvent from the varnish composition applied to the base material can be appropriately set according to the organic solvent to be used and the like.
  • the heating conditions may be, for example, 40 to 120 ° C. for 0.1 to 10 minutes.
  • irradiation light for example, ultraviolet light
  • Light irradiation can be performed using, for example, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, an LED light source, or the like.
  • the integrated light amount of light irradiation can be appropriately set, but may be, for example, 500 to 3000 mJ / cm 2 .
  • the second step is a step of laminating the second adhesive layer on the first adhesive layer.
  • the second step is the same as the first step except that, for example, the component (C) and other components and other additives added as needed are used and no light irradiation is performed.
  • a second adhesive layer is formed on the substrate to obtain a second adhesive film.
  • the second adhesive layer can be laminated on the first adhesive layer by adhering the first adhesive film and the second adhesive film.
  • a varnish composition obtained by using the component (C) and other components and other additives added as needed is applied onto the first adhesive layer.
  • the second adhesive layer can also be laminated on the first adhesive layer by volatilizing the organic solvent.
  • Examples of the method of adhering the first adhesive film and the second adhesive film include a method of heat pressing, roll laminating, vacuum laminating and the like. Lamination can be performed, for example, under temperature conditions of 0 to 80 ° C.
  • the third step is a step of laminating the third adhesive layer on the layer of the first adhesive layer opposite to the second adhesive layer.
  • a third adhesive layer is formed on the substrate to obtain a third adhesive film.
  • the varnish composition is applied onto the layer of the first adhesive layer opposite to the second adhesive layer, and an organic solvent is applied.
  • the second adhesive layer can be laminated on the first adhesive layer by volatilizing the above. The method of bonding and the conditions thereof are the same as in the second step.
  • Circuit connection structure and its manufacturing method> a circuit connection structure using the above-mentioned circuit connection adhesive film 10 as a circuit connection material and a method for manufacturing the same will be described.
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit connection structure.
  • the circuit connection structure 20 includes a first circuit member 13 having a first electrode 12 formed on a main surface 11a of the first circuit board 11 and the first circuit board 11.
  • a second circuit member 16 having a second electrode 15 formed on the main surface 14a of the second circuit board 14 and the second circuit board 14, and the first circuit member 13 and the second circuit member. It is arranged between 16 and includes a circuit connection portion 17 that electrically connects the first electrode 12 and the second electrode 15 to each other.
  • the first circuit member 13 and the second circuit member 16 may be the same or different from each other.
  • the first circuit member 13 and the second circuit member 16 are a glass substrate or a plastic substrate on which a circuit electrode is formed; a printed wiring board; a ceramic wiring board; a flexible wiring board; an IC chip such as a drive IC, or the like. It's okay.
  • the first circuit board 11 and the second circuit board 14 may be formed of an inorganic substance such as semiconductor, glass, or ceramic, an organic substance such as polyimide or polycarbonate, or a composite such as glass / epoxy.
  • the first circuit board 11 may be a glass substrate.
  • the first circuit member 13 may be, for example, a glass substrate on which a circuit electrode is formed
  • the second circuit member 16 may be, for example, an IC chip such as a drive IC.
  • the first electrode 12 and the second electrode 15 are gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, titanium and other metals, indium tin oxide (ITO), and the like. It may be an electrode containing an oxide such as indium zinc oxide (IZO) or indium gallium zinc oxide (IGZO).
  • the first electrode 12 and the second electrode 15 may be electrodes formed by laminating two or more of these metals, oxides, and the like.
  • the electrode formed by stacking two or more types may have two or more layers, and may have three or more layers.
  • the first electrode 12 When the first circuit member 13 is a plastic substrate, the first electrode 12 may be an electrode having a titanium layer on the outermost surface.
  • the first electrode 12 and the second electrode 15 may be circuit electrodes or bump electrodes. At least one of the first electrode 12 and the second electrode 15 may be a bump electrode.
  • the first electrode 12 is a circuit electrode and the second electrode 15 is a bump electrode.
  • the circuit connection portion 17 contains a cured product of the above-mentioned adhesive film 10.
  • the circuit connection portion 17 may be made of a cured product of the adhesive film 10 described above.
  • the circuit connection portion 17 is located, for example, on the side of the first circuit member 13 in the direction in which the first circuit member 13 and the second circuit member 16 face each other (hereinafter referred to as “opposite direction”), and the above-mentioned first circuit member 17 is located. It is located on the side of the first region 18 composed of the cured product of the component (B) and the cured product of the component (C) other than the conductive particles 4 in the adhesive layer of No. 1 and the second circuit member 16 in the opposite direction.
  • the first electrode 12 and the first electrode 12 are interposed between the second region 19 made of a cured product such as the component (C) in the second adhesive layer and at least the first electrode 12 and the second electrode 15. It has conductive particles 4 that electrically connect the second electrodes 15 to each other. As shown in FIG. 2, the circuit connection portion 17 does not have to have two distinct regions between the first region 18 and the second region 19, and the first adhesive layer The cured product derived from the above and the cured product derived from the second adhesive layer may be mixed to form one region.
  • the circuit connection structure is, for example, a flexible organic electric field light emitting color display (organic EL display) in which a plastic substrate on which organic EL elements are regularly arranged and a drive circuit element which is a driver for displaying an image are connected.
  • organic EL display organic electric field light emitting color display
  • Examples thereof include a touch panel in which a plastic substrate on which organic EL elements are regularly arranged and a position input element such as a touch pad are connected.
  • the circuit connection structure can be applied to various monitors such as smart phones, tablets, televisions, vehicle navigation systems, wearable terminals, furniture; home appliances; daily necessities and the like.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure.
  • 3 (a) and 3 (b) are schematic cross-sectional views showing each process.
  • a method of manufacturing the circuit connection structure 20 is performed between a first circuit member 13 having a first electrode 12 and a second circuit member 16 having a second electrode 15.
  • the above-mentioned adhesive film 10 is interposed, the first circuit member 13 and the second circuit member 16 are thermocompression bonded, and the first electrode 12 and the second electrode 15 are electrically connected to each other. ..
  • a first circuit including a first electrode 12 formed on a main surface 11a of a first circuit board 11 and a first circuit board 11.
  • a member 13 and a second circuit member 16 provided with a second electrode 15 formed on the main surface 14a of the second circuit board 14 and the second circuit board 14 are prepared.
  • the first circuit member 13 and the second circuit member 16 are arranged so that the first electrode 12 and the second electrode 15 face each other, and the first circuit member 13 and the second circuit member 12 are arranged.
  • the adhesive film 10 is placed between the 16 and 16.
  • the adhesive film 10 is laminated on the first circuit member 13 so that the first adhesive layer 1 side faces the main surface 11a of the first circuit board 11. do.
  • the adhesive film 10 is laminated so that the first electrode 12 on the first circuit board 11 and the second electrode 15 on the second circuit board 14 face each other.
  • the second circuit member 16 is arranged on the circuit member 13.
  • the first circuit member 13 and the second circuit member 16 are thermocompression bonded to each other.
  • the second adhesive layer 2 has a flowable uncured thermosetting component, the second electrodes 15 are connected to each other. It flows so as to fill the voids and is cured by the above heating. As a result, the first electrode 12 and the second electrode 15 are electrically connected to each other via the conductive particles 4, and the first circuit member 13 and the second circuit member 16 are adhered to each other.
  • the circuit connection structure 20 shown in 2 can be obtained.
  • the method for manufacturing the circuit connection structure 20 of the present embodiment it can be said that a part of the first adhesive layer 1 is cured by light, heat, moisture, or the like, so that the first adhesive layer 1 is the heat. Since it hardly flows during crimping and the conductive particles are efficiently captured between the facing electrodes, the connection resistance between the facing first electrode 12 and the second electrode 15 is reduced. Further, when the thickness of the first adhesive layer is 5 ⁇ m or less, the conductive particles at the time of circuit connection tend to be captured more efficiently.
  • the heating temperature for thermocompression bonding can be set as appropriate, but may be, for example, 50 to 190 ° C.
  • the pressurization is not particularly limited as long as it does not damage the adherend, but in the case of COG mounting, the area conversion pressure at the bump electrode may be, for example, 10 to 100 MPa. These heating and pressurizing times may be in the range of 0.5 to 120 seconds. Further, in the case of COP (chip on plastic) mounting, for example, the area conversion pressure at the bump electrode may be 0.1 to 50 MPa.
  • Conductive particles A-1 Insulation-coated conductive particles having an average particle size of 3.2 ⁇ m, in which the surface of a plastic core is Ni-plated and the outermost surface is insulated and coated, are used.
  • thermosetting resin component (B) component: curable resin component and (C) component: thermosetting resin component
  • (B) component and (C) component are the following (MA) polymerizable compound and (MB) polymerization initiation as shown in Table 1. The agent was selected and used. By combining the (MA-R) radically polymerizable compound and the (MB-RL) photoradical polymerization initiator, it can act as a photocurable resin component. On the other hand, by combining the (MA-R) radically polymerizable compound and the (MB-RH) thermal radical polymerization initiator, it can act as a thermosetting component.
  • thermosetting component by combining the (MA-C) cationically polymerizable compound and the (MB-C-L) photocationic polymerization initiator, it can act as a photocurable component.
  • thermosetting component by combining the (MA-C) cationically polymerizable compound and the (MB-C-H) thermally cationic polymerization initiator, it can act as a thermosetting component.
  • Thermoplastic resin D-1 PKHC (phenoxy resin, manufactured by Union Carbide)
  • ⁇ Preparation of the first adhesive film (first adhesive layer)> A composition was obtained by mixing the materials shown in Table 1 with the composition ratio shown in Table 1 (the numerical value in Table 1 means the amount of solid content). Then, on a PET (polyethylene terephthalate) film (manufactured by Mitsui Chemicals Tohcello Co., Ltd.) with a thickness of 38 ⁇ m, the film was applied so that the thickness after drying was 3 ⁇ m and the number of conductive particles was 22,000 / mm 2 . The composition layers 1a to 1e composed of the composition containing each component were obtained by drying at 60 ° C./1 minute.
  • composition layers 1a, 1b, and 1e were irradiated with ultraviolet rays (irradiation amount: 1500 mJ / cm 2 ) using an ultraviolet irradiation device to obtain first adhesive films 1A, 1B, and 1E.
  • the composition layer 1c was further dried in an oven at 70 ° C./4 min to obtain a first adhesive film 1C.
  • the composition layer 1d was used as it was as the first adhesive film 1D.
  • Second adhesive film (second adhesive layer)> After mixing the materials shown in Table 2 at the composition ratio shown in Table 2 (the numerical value in Table 2 means the amount of solid content), on a PET (polyethylene terephthalate) film (manufactured by Toyobo Film Solution Co., Ltd.) having a thickness of 38 ⁇ m.
  • the second adhesive film 2A was obtained by coating the film so that the thickness after drying was 12 ⁇ m and drying in an oven at 60 ° C./3 minutes.
  • Examples 1 to 3 and Comparative Examples 1 and 2 [Preparation of adhesive film] Using the first adhesive film and the second adhesive film prepared above, an adhesive film having the constitution shown in Table 3 was prepared. Regarding the adhesive films of Examples 1 to 3 and Comparative Examples 1 and 2, the first adhesive film is bonded to the second adhesive film while applying a temperature of 50 to 60 ° C., and the configurations shown in Table 3 are attached. Adhesive film was prepared.
  • a glass substrate having ITO wiring (glass substrate size: 2.5 mm ⁇ 28 mm, glass substrate thickness: 300 ⁇ m, ITO wiring size: 2500 ⁇ m (2.5 mm) ⁇ 300 ⁇ m, ITO wiring thickness: 0.2 ⁇ m, number of ITO wirings: 28, space between ITO wirings: 300 ⁇ m) were prepared.
  • the adhesive films of Examples 1 to 3 and Comparative Examples 1 and 2 are cut out to a size of 2 mm ⁇ 23 mm, and the first adhesive film (first adhesive layer) of the cut out adhesive film is a glass substrate having ITO wiring. It was arranged on the top so as to be perpendicular to the ITO wiring.
  • FIG. 4 is a schematic top view showing the laminated body in the peel strength measurement of the embodiment.
  • the laminate 30 shown in FIG. 4 is arranged on a glass substrate 33 having ITO wiring (a substrate including the glass substrate 31 and the ITO wiring 32 provided on the glass substrate 31) and a glass substrate 33 having ITO wiring. It is provided with an adhesive film 10A.
  • the PET film of the second adhesive film (second adhesive layer) is peeled off, and a polyimide tape cut out to a size of 1.8 mm ⁇ 35 mm is attached onto the second adhesive layer to prepare a sample for measurement. Obtained.
  • the glass substrate side of the measurement sample was placed on a hot plate set at 40 ° C., and the tip of the polyimide tape was set in a tensile strength measuring device (Tensilon). By fixing the glass substrate horizontally and pulling the polyimide tape in the vertical direction at a peeling speed of 50 mm / min, the peeling angle is 90 °. The peel strength in was measured. The results are shown in Table 3.
  • an IC chip having a gold bump electrode (IC chip size: 0.9 mm ⁇ 20.3 mm, IC chip thickness: 0.3 mm, gold bump electrode size: 12 ⁇ m ⁇ 100 ⁇ m, The thickness of the gold bump electrode: 12 ⁇ m, the space between the gold bump electrodes: 24 ⁇ m) was prepared.
  • the circuit connection structure was carried out using the adhesive films of Examples 1 to 3 and Comparative Examples 1 and 2.
  • the adhesive film was cut out to a size of 2 mm ⁇ 23 mm, and the first adhesive layer of the cut out adhesive film was placed on the first circuit member so as to be in contact with the circuit electrode of the first circuit member.
  • a thermocompression bonding device (BS-17U, manufactured by Ohashi Seisakusho Co., Ltd.) consisting of a stage consisting of a ceramic heater and a tool (8 mm x 50 mm), heat and pressurize for 5 seconds at 130 ° C. and 40 MPa.
  • An adhesive film was attached to the first circuit member.
  • the PET film on the side opposite to the first circuit member of the adhesive film is peeled off, the circuit electrode of the first circuit member and the bump electrode of the second circuit member are aligned, and then the adhesive is applied.
  • the second adhesive layer of the adhesive film is attached to the second circuit member by heating and pressurizing for 5 seconds under the conditions of the maximum measured maximum temperature of the film of 130 ° C. and the area conversion pressure of 40 MPa at the bump electrode.
  • a connection structure was prepared.
  • connection resistance of the obtained circuit connection structure was evaluated.
  • the evaluation of the connection resistance was carried out by the four-terminal measurement method, and the evaluation was made using the average value of the connection resistance values measured at 14 points.
  • a multimeter (MLR21, manufactured by Kusumoto Kasei Co., Ltd.) was used for the measurement. The results are shown in Table 3.
  • the indentation strength of the obtained circuit connection structure was evaluated. Electrodes were observed from the glass substrate of the obtained circuit connection structure using a differential interference microscope, and indentations were observed at the portions where the ends and the center of the IC chip were connected. The observed indentations were photographed and used as image data, and the intensities were evaluated in five stages of 1, 2, 3, 4, and 5 using indentation analysis software. The larger the evaluation value, the higher the indentation strength. When the indentation strength is high, the connection stability tends to be excellent. The results are shown in Table 3.
  • the film is heated and pressurized for 5 seconds under the conditions of a maximum ultimate temperature of 170 ° C. and a film area conversion pressure of 80 MPa to attach a second adhesive film (second adhesive layer) and a cover glass, and the pressure is applied.
  • a test body test body after pressure bonding
  • the adhesive films of Examples 1 to 3 were excellent in all items.
  • the adhesive film of Comparative Example 1 having a predetermined peel strength of more than 60 N / m did not have a sufficient capture rate of conductive particles. It is considered that this is because the hardness of the resin is too soft in terms of the fluidity of the resin.
  • the adhesive film of Comparative Example 2 having a predetermined peel strength of less than 20 N / m did not have sufficient connection resistance, and was not sufficient in terms of transferability and indentation strength. It is considered that this is because the hardness of the resin is too hard in terms of the fluidity of the resin. From these results, it was confirmed that the adhesive film of the present disclosure can improve the capture rate of conductive particles between the facing electrodes of the circuit connection structure and reduce the connection resistance.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Est divulgué un film adhésif pour connexion de circuit. Ce film adhésif pour connexion de circuit comprend : une première couche adhésive qui contient des particules électroconductrices, un produit durci à base d'un composant de résine durcissable, et un premier composant de résine thermodurcissable ; et une seconde couche adhésive qui est disposée sur la première couche adhésive et qui contient un second composant de résine thermodurcissable. Lorsque la première couche adhésive du film adhésif pour connexion de circuit est liée par traitement dans les conditions suivantes : une température de 60 °C, une pression de surface pour la première couche adhésive de 1 MPa et une durée de 1 seconde, à un substrat en verre doté d'un câblage en oxyde d'indium-étain (ITO), la résistance au décollement après collage à 40 °C entre le substrat en verre et la première couche adhésive est égale à 20 à 60 N/m.
PCT/JP2021/040989 2020-11-10 2021-11-08 Film adhésif pour connexion de circuit et son procédé de production, et structure de connexion de circuit et son procédé de production WO2022102573A1 (fr)

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Publication number Priority date Publication date Assignee Title
WO2023106400A1 (fr) * 2021-12-10 2023-06-15 株式会社レゾナック Film adhésif pour connexion de circuit et structure de connexion de circuit et procédé de fabrication associé
WO2024042720A1 (fr) * 2022-08-26 2024-02-29 株式会社レゾナック Film adhésif pour connexion de circuit, structure de connexion et leurs procédés de production

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WO2019050012A1 (fr) * 2017-09-11 2019-03-14 日立化成株式会社 Film adhésif pour connexion de circuits et procédé de fabrication associé, procédé de fabrication d'une structure de connexion de circuits et ensemble contenant pour film adhésif
JP2019214714A (ja) * 2018-06-06 2019-12-19 デクセリアルズ株式会社 フィラー含有フィルム
WO2020184583A1 (fr) * 2019-03-13 2020-09-17 日立化成株式会社 Film adhésif pour connexion de circuit, son procédé de fabrication, procédé de fabrication de structure de connexion de circuit et ensemble de réception de film adhésif

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WO2009013968A1 (fr) * 2007-07-26 2009-01-29 Sony Chemical & Information Device Corporation Film adhésif, procédé de liaison et corps lié
JP2013110110A (ja) * 2011-11-18 2013-06-06 Cheil Industries Inc 仮圧着工程性を改善した異方性導電フィルム及び半導体装置（Ａｎｉｓｏｔｒｏｐｉｃｃｏｎｄｕｃｔｉｖｅｆｉｌｍｗｉｔｈｅａｓｙｐｒｅ−ｂｏｎｄｉｎｇｐｒｏｃｅｓｓａｎｄｔｈｅｓｅｍｉｃｏｎｄｕｃｔｏｒｄｅｖｉｃｅ）
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WO2019050012A1 (fr) * 2017-09-11 2019-03-14 日立化成株式会社 Film adhésif pour connexion de circuits et procédé de fabrication associé, procédé de fabrication d'une structure de connexion de circuits et ensemble contenant pour film adhésif
JP2019214714A (ja) * 2018-06-06 2019-12-19 デクセリアルズ株式会社 フィラー含有フィルム
WO2020184583A1 (fr) * 2019-03-13 2020-09-17 日立化成株式会社 Film adhésif pour connexion de circuit, son procédé de fabrication, procédé de fabrication de structure de connexion de circuit et ensemble de réception de film adhésif

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023106400A1 (fr) * 2021-12-10 2023-06-15 株式会社レゾナック Film adhésif pour connexion de circuit et structure de connexion de circuit et procédé de fabrication associé
WO2024042720A1 (fr) * 2022-08-26 2024-02-29 株式会社レゾナック Film adhésif pour connexion de circuit, structure de connexion et leurs procédés de production

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