JPWO2022102573A1 - - Google Patents
Info
- Publication number
- JPWO2022102573A1 JPWO2022102573A1 JP2022561905A JP2022561905A JPWO2022102573A1 JP WO2022102573 A1 JPWO2022102573 A1 JP WO2022102573A1 JP 2022561905 A JP2022561905 A JP 2022561905A JP 2022561905 A JP2022561905 A JP 2022561905A JP WO2022102573 A1 JPWO2022102573 A1 JP WO2022102573A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020187267 | 2020-11-10 | ||
PCT/JP2021/040989 WO2022102573A1 (ja) | 2020-11-10 | 2021-11-08 | 回路接続用接着剤フィルム及びその製造方法、並びに回路接続構造体及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022102573A1 true JPWO2022102573A1 (ja) | 2022-05-19 |
Family
ID=81601320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022561905A Pending JPWO2022102573A1 (ja) | 2020-11-10 | 2021-11-08 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022102573A1 (ja) |
TW (1) | TW202224942A (ja) |
WO (1) | WO2022102573A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023106400A1 (ja) * | 2021-12-10 | 2023-06-15 | 株式会社レゾナック | 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法 |
WO2024042720A1 (ja) * | 2022-08-26 | 2024-02-29 | 株式会社レゾナック | 回路接続用接着剤フィルム及び接続構造体、並びに、それらの製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5192194B2 (ja) * | 2007-07-26 | 2013-05-08 | デクセリアルズ株式会社 | 接着フィルム |
KR101479658B1 (ko) * | 2011-11-18 | 2015-01-06 | 제일모직 주식회사 | 가압착 공정성이 개선된 이방성 도전 필름 |
JP6269114B2 (ja) * | 2014-02-04 | 2018-01-31 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP6409281B2 (ja) * | 2014-02-04 | 2018-10-24 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
KR20230126743A (ko) * | 2017-09-11 | 2023-08-30 | 가부시끼가이샤 레조낙 | 회로 접속용 접착제 필름 및 그의 제조 방법, 회로접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트 |
CN112292430A (zh) * | 2018-06-06 | 2021-01-29 | 迪睿合株式会社 | 含有填料的膜 |
KR20210141953A (ko) * | 2019-03-13 | 2021-11-23 | 쇼와덴코머티리얼즈가부시끼가이샤 | 회로 접속용 접착제 필름 및 그 제조 방법, 회로 접속 구조체의 제조 방법, 및, 접착제 필름 수용 세트 |
-
2021
- 2021-11-08 WO PCT/JP2021/040989 patent/WO2022102573A1/ja active Application Filing
- 2021-11-08 JP JP2022561905A patent/JPWO2022102573A1/ja active Pending
- 2021-11-09 TW TW110141611A patent/TW202224942A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2022102573A1 (ja) | 2022-05-19 |
TW202224942A (zh) | 2022-07-01 |