WO2022075370A1

WO2022075370A1 - Adhesive film for circuit connection, material for circuit connection, circuit connection structure, and method for manufacturing circuit connection structure

Info

Publication number: WO2022075370A1
Application number: PCT/JP2021/037013
Authority: WO
Inventors: 将人福井; 孝中澤; 裕行酒井; 和也成冨
Original assignee: 昭和電工マテリアルズ株式会社
Priority date: 2020-10-07
Filing date: 2021-10-06
Publication date: 2022-04-14
Also published as: JPWO2022075370A1

Abstract

The present invention discloses an adhesive film for circuit connection. The adhesive film for circuit connection is provided with: a first region containing conductive particles and a first adhesive component; and a second region containing a second adhesive component provided adjacent to the first region. At least one of the first adhesive component and the second adhesive agent component includes a monofunctional oxetane compound.

Description

Adhesive film for circuit connection, material for circuit connection, circuit connection structure and its manufacturing method

The present disclosure relates to an adhesive film for circuit connection, a material for circuit connection, a circuit connection structure, and a method for manufacturing the same.

Conventionally, a liquid crystal display panel, an organic EL panel, or the like has been used as various display means for televisions, PC monitors, mobile phones, smart phones, and the like. In such a display device, a so-called COG (chip on glass) mounting in which a driving IC is directly mounted on a glass substrate of a display panel is adopted from the viewpoint of fine pitch, light weight and thinness.

In a liquid crystal display panel in which a COG mounting method is adopted, for example, a semiconductor element such as a liquid crystal driving IC is connected on a transparent substrate (glass substrate or the like) having a plurality of transparent electrodes (ITO (indium tin oxide) or the like). Will be done. As an adhesive material for connecting the electrode terminal of the semiconductor element and the transparent electrode, a circuit connection adhesive film in which conductive particles are dispersed in the adhesive is used. For example, when a liquid crystal drive IC is mounted as a semiconductor element, the liquid crystal drive IC has a plurality of electrode terminals corresponding to transparent electrodes on the mounting surface thereof, and the liquid crystal drive is driven via an adhesive film for circuit connection. By thermocompression bonding the IC for use on a transparent substrate, the electrode terminals and the transparent electrodes are connected, and a circuit connection structure can be obtained.

In recent years, displays with curved surfaces (flexible displays) have been proposed. In such a flexible display, a flexible plastic substrate (polyimide substrate or the like) is used instead of the glass substrate as the substrate, so that various electronic components such as drive ICs are also mounted on the plastic substrate. As a method of such mounting, COP (chip on plastic) mounting using an adhesive film for circuit connection has been studied (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-0542888

By the way, when the circuit connection adhesive film used for COG mounting is applied to COP mounting, the connection resistance increases in the obtained circuit connection structure due to differences in electrode material, substrate material, drive method, etc., and reliability. May occur.

Therefore, it is a main object of the present disclosure to provide a circuit connection adhesive film capable of forming a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting. ..

One aspect of this disclosure relates to an adhesive film for circuit connection. The circuit connection adhesive film contains a first region containing conductive particles and a first adhesive component, and a second adhesive component provided adjacent to the first region. With the area of. At least one of the first adhesive component and the second adhesive component contains a monofunctional oxetane compound. According to such a circuit connection adhesive film, it is possible to form a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting.

The reason for such an effect is not always clear, but the present inventors think as follows. The melt viscosity of the monofunctional oxetane compound is considered to be lower than that of the polyfunctional epoxy compound (resin) and the polyfunctional oxetane compound (resin) usually used in the field of adhesive films for circuit connection. When the melt viscosity is low, the resin can be easily removed when the circuit is connected, so that the connection resistance between the facing electrodes of the circuit connection structure can be reduced, and as a result, good conduction characteristics can be ensured. It will be possible. Further, the curing shrinkage of the monofunctional oxetane compound is considered to be smaller than that of the polyfunctional epoxy compound (resin) and the polyfunctional oxetane compound (resin) usually used in the field of the adhesive film for circuit connection. When the curing shrinkage is small, for example, the stress released in the reliability test under high temperature and high humidity conditions is small, so that peeling between the circuit connection adhesive film and the substrate is suppressed and the connection reliability is improved. Can be done. Further, such a circuit connection adhesive film is also excellent in terms of ease of peeling when the base material (for example, PET film) is peeled from the circuit connection adhesive film when applied to COP mounting. Such a circuit connection adhesive film can be suitably used for COP mounting, and more specifically, a plastic substrate (where a circuit electrode in an organic EL display is formed) and a plastic substrate (such as a drive IC). It can be suitably used for connection with an IC chip.

Of the first adhesive component and the second adhesive component, it is preferable that the second adhesive component contains a monofunctional oxetane compound.

The first adhesive component may contain a cured product of a photocurable resin component. The first adhesive component may further contain a thermosetting resin component.

The conductive particles may contain at least one metal selected from the group consisting of gold, palladium, and nickel.

Another aspect of this disclosure relates to circuit connection materials. The circuit connection material contains an adhesive component containing a monofunctional oxetane compound. Such a circuit connection material can be suitably used when forming the circuit connection adhesive film. The circuit connection material may further contain conductive particles.

Another aspect of this disclosure relates to a method of manufacturing a circuit connection structure. The method for manufacturing the circuit connection structure is such that the above-mentioned circuit connection adhesive film or the above-mentioned circuit connection adhesive film is used between the first circuit member having the first electrode and the second circuit member having the second electrode. A step of electrically connecting the first electrode and the second electrode to each other by heat-pressing the first circuit member and the second circuit member with the above-mentioned circuit connection material interposed therebetween is provided.

Another aspect of this disclosure relates to circuit connection structures. The circuit connection structure is arranged between a first circuit member having a first electrode, a second circuit member having a second electrode, and a first circuit member and a second circuit member. A circuit connection portion for electrically connecting the first electrode and the second electrode to each other is provided. The circuit connection portion includes a cured product of the above-mentioned adhesive film for circuit connection or a cured product of the above-mentioned material for circuit connection.

According to the present disclosure, there is provided an adhesive film for circuit connection capable of forming a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting. The circuit connection adhesive film according to some forms is also excellent in terms of ease of peeling when the base material (for example, PET film) is peeled from the circuit connection adhesive film when applied to COP mounting. .. Such a circuit connection adhesive film can be suitably used for COP mounting. Further, according to the present disclosure, there is provided a circuit connection material that can be suitably used when forming such a circuit connection adhesive film. Further, according to the present disclosure, there is provided a circuit connection structure using such a circuit connection adhesive film or a circuit connection material, and a method for manufacturing the same.

FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection. FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit connection structure. FIG. 3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure. 3 (a) and 3 (b) are schematic cross-sectional views showing each process.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. However, the present disclosure is not limited to the following embodiments.

In the present specification, the numerical range indicated by using "-" indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively. In the numerical range described stepwise in the present specification, the upper limit value or the lower limit value of the numerical range of one step may be replaced with the upper limit value or the lower limit value of the numerical range of another step. Further, in the numerical range described in the present specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples. In addition, the upper limit value and the lower limit value described individually can be arbitrarily combined. In the notation of the numerical range "A to B", the numerical values A and B at both ends are included in the numerical range as the lower limit value and the upper limit value, respectively. In the present specification, for example, the description of "10 or more" means "10" and "a numerical value exceeding 10", and the same applies when the numerical values are different. Further, for example, the description "10 or less" means "10" and "a numerical value less than 10", and the same applies when the numerical values are different. Further, as used herein, the term "(meth) acrylate" means at least one of acrylate and the corresponding methacrylate. The same applies to other similar expressions such as "(meth) acryloyl". Further, "(poly)" means both with and without the prefix of "poly". Further, "A or B" may include either A or B, and may include both. Further, unless otherwise specified, the materials exemplified below may be used alone or in combination of two or more. The content of each component in the composition means the total amount of the plurality of substances present in the composition when a plurality of substances corresponding to each component are present in the composition, unless otherwise specified.

[Adhesive film for circuit connection]
FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection. The circuit connection adhesive film 10 (hereinafter, may be simply referred to as “adhesive film 10”) shown in FIG. 1 includes a first region 1 containing the conductive particles 4 and the first adhesive component. It includes a second region 2 containing a second adhesive component, which is provided adjacent to the first region 1. The adhesive component may be composed of a first adhesive component and a second adhesive component. At least one of the first adhesive component and the second adhesive component contains a monofunctional oxetane compound. The first region 1 may be a region formed from the first adhesive film (first adhesive layer). The second region 2 may be a region formed from the second adhesive film (second adhesive layer). The adhesive film 10 contains a first adhesive layer containing the conductive particles 4 and the first adhesive component, and a second adhesive component provided on the first adhesive layer. It can also be said that it has an adhesive layer of.

In the adhesive film 10, the conductive particles 4 are dispersed in the first region 1. Therefore, the adhesive film 10 can be an anisotropically conductive adhesive film. The adhesive film 10 is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and heats the first circuit member and the second circuit member. It may be crimped and used to electrically connect the first electrode and the second electrode to each other.

<First region (first adhesive layer)>
The first region 1 (first adhesive layer) may be referred to as conductive particles 4 (hereinafter, may be referred to as “(A) component”) and an adhesive component (hereinafter, may be referred to as “(B) component”). ) (First adhesive component).

Component (A): Conductive particles The component (A) is not particularly limited as long as it is a particle having conductivity, and is a metal particle composed of a metal such as Au, Ag, Pd, Ni, Cu, or solder, or conductive carbon. It may be conductive carbon particles composed of. The component (A) may contain at least one metal selected from the group consisting of gold, palladium, and nickel. The component (A) may be a coated conductive particle containing a nucleus containing non-conductive glass, ceramic, plastic (polystyrene, etc.) and the like, and a coating layer containing the metal or conductive carbon and covering the nucleus. good. Among these, the component (A) preferably contains metal particles formed of a heat-meltable metal or a core containing plastic, and contains a metal or conductive carbon and has a coating layer covering the core. It is a particle. Since such coated conductive particles can easily deform the cured product of the thermosetting resin component by heating or pressurizing, when the electrodes are electrically connected to each other, the electrode and the component (A) are connected to each other. The contact area can be increased and the conductivity between the electrodes can be further improved.

The component (A) may be an insulating coated conductive particle containing the above-mentioned metal particles, conductive carbon particles, or coated conductive particles and an insulating material such as a resin and having an insulating layer covering the surface of the particles. good. When the component (A) is an insulating coated conductive particle, even when the content of the component (A) is large, the surface of the particle is coated with the resin, so that the component (A) is short-circuited due to contact with each other. The generation can be suppressed, and the insulation between adjacent electrode circuits can be improved. As the component (A), one of the above-mentioned various conductive particles may be used alone or in combination of two or more.

The maximum particle size of the component (A) needs to be smaller than the minimum distance between the electrodes (the shortest distance between adjacent electrodes). The maximum particle size of the component (A) may be 1.0 μm or more, 2.0 μm or more, or 2.5 μm or more from the viewpoint of excellent dispersibility and conductivity. The maximum particle size of the component (A) may be 20 μm or less, 10 μm or less, or 5 μm or less from the viewpoint of excellent dispersibility and conductivity. In the present specification, the particle size of any 300 conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the largest value obtained is the maximum particle size of the component (A). And. When the component (A) is not spherical, such as when the component (A) has protrusions, the particle size of the component (A) is the diameter of a circle circumscribing the conductive particles in the SEM image.

The average particle size of the component (A) may be 1.0 μm or more, 2.0 μm or more, or 2.5 μm or more from the viewpoint of excellent dispersibility and conductivity. The average particle size of the component (A) may be 20 μm or less, 10 μm or less, or 5 μm or less from the viewpoint of excellent dispersibility and conductivity. In the present specification, the particle size of any 300 conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the average value of the obtained particle sizes is taken as the average particle size.

In the first region 1 (first adhesive layer), the component (A) is preferably uniformly dispersed. The particle density of the component (A) in the adhesive film 10 is 100 pieces / mm ² or more, 1000 pieces / mm ² or more, 3000 pieces / mm ² or more, or 5000 pieces / mm from the viewpoint of obtaining stable connection resistance. It may be ² or more. The particle density of the component (A) in the adhesive film 10 is 100,000 pieces / mm ² or less, 70,000 pieces / mm ² or less, 50,000 pieces / mm ² or less, or 30,000 from the viewpoint of improving the insulating property between adjacent electrodes. Pieces / mm ² or less may be used.

The content of the component (A) is 1% by mass or more and 5% by mass or more based on the total mass of the first region (first adhesive layer) from the viewpoint of further improving the conductivity. Alternatively, it may be 10% by mass or more. The content of the component (A) is 60% by mass or less, 50% by mass or less, or 40% by mass based on the total mass of the first region (first adhesive layer) from the viewpoint of easily suppressing a short circuit. It may be as follows. When the content of the component (A) is in the above range, the effect of the present disclosure tends to be remarkably exhibited. The content of the component (A) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

Component (B): Adhesive component The component (B) is a monofunctional oxetane compound (hereinafter, may be referred to as "(B1) component"), a polymerizable compound other than the component (B1) (hereinafter, "(B2)). It may contain a "component"), a polymerization initiator (hereinafter, may be referred to as "(B3) component") and the like. The component (B) may contain a curable resin component composed of a combination of the component (B1), the component (B2), and the component (B3), and / or a cured product of the curable resin component.

The first adhesive component may contain a cured product of a photocurable resin component. In this case, the first adhesive component may contain a photopolymerization initiator as the component (B3). The first region 1 (first adhesive layer) containing the first adhesive component containing a cured product of the photocurable resin component is, for example, a first adhesive component containing a photocurable resin component. It can be obtained by irradiating the contained composition layer with light energy to cure the photocurable resin component. The photocurable resin component may be a cationic curing system (combination of (B2C) component and (B3CL) component described later) or a radical curing system (combination of (B2R) component and (B3RL) component described later). May be.

The first adhesive component may further contain a thermosetting resin component (first thermosetting resin component) in addition to the cured product of the photocurable resin component. In this case, the first adhesive component may further contain a thermal polymerization initiator as the component (B3). The first region 1 (first adhesive layer) containing the cured product of the photocurable resin component and the first adhesive component containing the thermosetting resin component is, for example, the photocurable resin component and the thermosetting. It can be obtained by irradiating a composition layer containing a first adhesive component containing a sex resin component with light energy to cure the photocurable resin component. The first thermosetting resin component may be a cationic curing system (combination of (B2C) component and (B3CH) component described later) or a radical curing system ((B2R) component and (B3RH) component described later). It may be a combination of), and a cationic curing system is preferable. It is preferable that the curing system of the photocurable resin component and the curing system of the thermosetting resin component are different, the photocurable resin component is a radical curing system, and the thermosetting resin component is a cationic curing system. Is more preferable. In one embodiment, the first adhesive component may contain a cured product of a radically curable photocurable resin component and a cationically curable thermosetting resin component.

Component (B1): Monofunctional oxetane compound The component (B1) has one oxetanyl group in the molecule and is a radically polymerizable group that reacts with a radical (for example, (meth) acryloyl group, vinyl group, allyl group, styryl). It means a compound having no group, alkenyl group, alkenylene group, maleimide group, etc.). The component (B1) is a cation-curing compound, and when at least one of the first adhesive component and the second adhesive component contains a monofunctional oxetane compound, the component (B1) is a cation-curing thermosetting compound. It can act as a component of the curable resin component.

The component (B1) is not particularly limited and can be appropriately selected depending on the target mounting temperature, mounting time, storage stability, and the like. The boiling point of the component (B1) may be 100 ° C. or higher because it is difficult to volatilize by heating.

Examples of commercially available products of the component (B1) include OXT-101 (3-ethyl-3-hydroxymethyloxetane, manufactured by Toagosei Co., Ltd.), OXT-212 (2-ethylhexyloxetane, manufactured by Toagosei Co., Ltd.) and the like. Can be mentioned.

The content of the component (B1) is, for example, 0 to 40% by mass, 0 to 30% by mass, or 0 to 20% by mass based on the total mass of the component (B) (first adhesive component). It's okay. The content of the component (B1) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

Component (B2): Polymerizable compound other than component (B1) The component (B2) may be a cationically polymerizable compound (hereinafter, may be referred to as “(B2C) component”) or a radically polymerizable compound (hereinafter, may be referred to as “(B2C) component”). , "(B2R) component" may be used.).

(B2C) component: Cationic polymerizable compound The (B2C) component is a compound that is crosslinked by reacting with a cationic polymerization initiator (photocationic polymerization initiator, thermal cationic polymerization initiator, etc.). The (B2C) component means a compound having no radically polymerizable group that reacts with a radical, and the (B2C) component is not included in the (B2R) component described later. Examples of the (B2C) component include a polyfunctional epoxy compound, a polyfunctional oxetane compound, and a polyfunctional alicyclic epoxy compound. The component (B2C) contains at least one selected from the group consisting of, for example, a polyfunctional oxetane compound and a polyfunctional alicyclic epoxy compound from the viewpoint of further improving the effect of reducing the connection resistance and improving the connection reliability. It may contain a polyfunctional alicyclic epoxy compound. As the component (B2C), one type may be used alone, or a plurality of types may be used in combination.

The polyfunctional epoxy compound is, for example, a bisphenol type epoxy resin derived from epichlorohydrin and a bisphenol compound such as bisphenol A, bisphenol F or bisphenol AD; derived from epichlorohydrin and a novolak resin such as phenol novolac or cresol novolak. Epoxy novolak resins; examples include various epoxy compounds having two or more glycidyl groups in one molecule such as glycidylamine, glycidyl ether, biphenyl, and alicyclic type. These may use one kind of compound alone or may use a plurality of compounds in combination.

The polyfunctional oxetane compound can be used without particular limitation as long as it is a compound having two or more oxetanyl groups and no radically polymerizable group. Examples of commercially available oxetane compounds include ETERNALCOLL OXBP (trade name, manufactured by Ube Kosan Co., Ltd.), OXSQ, OXT-121, and OXT-221 (trade name, manufactured by Toagosei Corporation). These may use one kind of compound alone or may use a plurality of compounds in combination.

The polyfunctional alicyclic epoxy compound can be used without particular limitation as long as it is a compound having two or more alicyclic epoxy groups (for example, an epoxycyclohexyl group) and no radical polymerizable group. Examples of commercially available alicyclic epoxy compounds include CEL8010, CEL2021P, and CEL2081 (trade name, manufactured by Daicel Corporation). These may use one kind of compound alone or may use a plurality of compounds in combination.

(B2R) component: Radical polymerizable compound The (B2R) component is a compound polymerized by radicals generated from a radical polymerization initiator (photoradical polymerization initiator, thermal radical polymerization initiator component, etc.). The component (B2R) may be either a monomer or a polymer (or oligomer) obtained by polymerizing one or more kinds of monomers. The (B2R) component may be used alone or in combination of two or more.

The (B2R) component is a compound having a radically polymerizable group that reacts with radicals. Examples of the radically polymerizable group include a (meth) acryloyl group, a vinyl group, an allyl group, a styryl group, an alkenyl group, an alkenylene group, a maleimide group and the like. The number of radically polymerizable groups (number of functional groups) of the (B2R) component is 2 or more from the viewpoint that the desired melt viscosity can be easily obtained after polymerization, the effect of reducing the connection resistance is further improved, and the connection reliability is superior. It may be 10 or less from the viewpoint of suppressing curing shrinkage during polymerization. Further, in order to balance the crosslink density and the curing shrinkage, in addition to the compound having the number of radically polymerizable groups within the above range, a compound having the number of radically polymerizable groups outside the above range may be used. good.

The (B2R) component may contain, for example, a polyfunctional (bifunctional or higher) (meth) acrylate from the viewpoint of suppressing the flow of conductive particles. The polyfunctional (bifunctional or higher) (meth) acrylate may be a bifunctional (meth) acrylate, and the bifunctional (meth) acrylate may be a bifunctional aromatic (meth) acrylate.

Examples of the polyfunctional (meth) acrylate include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and polyethylene glycol di (meth) acrylate. ) Acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, ethoxylated polypropylene glycol Di (meth) acrylate, 1,3-butanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, neopentylglycoldi (meth) acrylate, 3-methyl-1,5-pentanediol di (Meta) acrylate, 1,6-hexanediol di (meth) acrylate, 2-butyl-2-ethyl-1,3-propanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1 , 10-decanediol di (meth) acrylate, glycerindi (meth) acrylate, tricyclodecanedimethanol (meth) acrylate, 2-methyl-1,3-propanediol di (meth) acrylate ethoxylated, trimethylolpropane tri (Meta) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated Pentaerythritol tri (meth) acrylate, propoxylated pentaerythritol tri (meth) acrylate, ethoxylated propoxylated pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, propoxydated An aliphatic (meth) acrylate such as pentaerythritol tetra (meth) acrylate, ethoxylated propoxylated pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and dipentaerythritol hexa (meth) acrylate; ethoxylated bisphenol A. Acrylate T) Acrylate, propoxylated bisphenol A type di (meth) acrylate, ethoxylated propoxylated bisphenol A type di (meth) acrylate, ethoxylated bisphenol F type di (meth) acrylate, propoxylated bisphenol F type di (meth) acrylate, Aromas (meth) such as ethoxylated propoxylated bisphenol F-type di (meth) acrylate, ethoxylated fluorene-type di (meth) acrylate, propoxylated fluorene-type di (meth) acrylate, and ethoxylated propoxylated fluorene-type di (meth) acrylate. ) Acrylate; Examples thereof include aromatic epoxy (meth) acrylates such as bisphenol type epoxy (meth) acrylate, phenol novolac type epoxy (meth) acrylate, and cresol novolac type epoxy (meth) acrylate.

The content of the polyfunctional (bifunctional or higher) (meth) acrylate is, for example, 40 to 100, based on the total mass of the (B2R) component, from the viewpoint of achieving both the effect of reducing the connection resistance and the suppression of particle flow. It may be% by mass, 50 to 100% by mass, or 60 to 100% by mass.

The (B2R) component may further contain a monofunctional (meth) acrylate in addition to the polyfunctional (bifunctional or higher) (meth) acrylate. Examples of the monofunctional (meth) acrylate include (meth) acrylic acid; methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, and tert-butyl (meth) acrylate. Butoxyethyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octylheptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) Acrylate 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxy Acrylate (meth) acrylates such as polyethylene glycol (meth) acrylates, methoxypolypropylene glycol (meth) acrylates, ethoxypolypropylene glycol (meth) acrylates, and mono (2- (meth) acryloyloxyethyl) succinates; benzyl (meth) acrylates. , Phenyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, phenoxyethyl (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, o -Phenylphenoxyethyl (meth) acrylate, 1-naphthoxyethyl (meth) acrylate, 2-naphthoxyethyl (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, phenoxypolypropylene glycol (meth) acrylate, 2-Hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydroxy-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2- Aromatic (meth) acrylates such as hydroxy-3- (2-naphthoxy) propyl (meth) acrylates; (meth) acrylates having an epoxy group such as glycidyl (meth) acrylates, 3,4-epoxycyclohexylmethyl (meth) acrylates. (Meta) acrylates having an alicyclic epoxy group such as, ( Examples thereof include (meth) acrylate having an oxetanyl group such as 3-ethyloxetane-3-yl) methyl (meth) acrylate.

The content of the monofunctional (meth) acrylate may be, for example, 0 to 60% by mass, 0 to 50% by mass, or 0 to 40% by mass based on the total mass of the (B2R) component.

The (B2R) component may contain other radically polymerizable compounds in addition to the polyfunctional (bifunctional or higher) and monofunctional (meth) acrylates. Examples of other radically polymerizable compounds include maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, nadiimide derivatives and the like. The content of the other radically polymerizable compound may be, for example, 0 to 40% by mass based on the total mass of the (B2R) component.

Component (B3): Polymerization Initiator When the component (B2) is the component (B2C), the component (B3) is a photocationic polymerization initiator (hereinafter, may be referred to as "(B3CL) component"). Also, it may be a thermal cationic polymerization initiator (hereinafter, may be referred to as “(B3CH) component”). By combining the (B2C) component and the (B3CL) component, a photocurable resin component can be obtained. By combining the (B2C) component and the (B3CH) component, a thermosetting resin component can be obtained.

(B3CL) Component: Photocationic Polymerization Initiator (B3CL) component comprises light containing a wavelength in the range of 150 to 750 nm, preferably light containing a wavelength in the range of 254 to 405 nm, and more preferably a wavelength in the range of 365 nm. A polymerization initiator that generates a substance that initiates cationic polymerization by irradiation with light (for example, ultraviolet light). The (B3CL) component may act as the (B3CH) component described later.

The (B3CL) component is, for example, BF _4- ^, BR _4- ⁽ R indicates a phenyl group substituted with 2 or more fluorine atoms or 2 or more trifluoromethyl groups) ^, PF _6- ^, SbF _6- . , AsF ₆ ^{− and} the like, sulfonium salt, phosphonium salt, ammonium salt, diazonium salt, iodonium salt, onium salt such as anilinium salt and the like. These may be used individually by 1 type, and may be used in combination of a plurality of types.

Commercially available products of the (B3CL) component include, for example, CPI-100P, CPI-110P, CPI-101A, CPI-200K, CPI-210S (all manufactured by Sun Appro Co., Ltd.), UVI-6990, UVI-6992, UVI- 6976 (all manufactured by Dow Chemical Japan Co., Ltd.), SP-150, SP-152, SP-170, SP-172, SP-300 (all manufactured by ADEKA Corporation) and the like can be mentioned.

The content of the (B3CL) component is 100 parts by mass of the (B2C) component from the viewpoint of ensuring the formability and curability of the adhesive film for forming the first region (first adhesive layer). On the other hand, it may be, for example, 0.1 to 15 parts by mass, 0.3 to 12 parts by mass, 0.5 to 10 parts by mass, or 1 to 5 parts by mass.

(B3CH) Component: Thermal Cationic Polymerization Initiator The (B3CH) component is a polymerization initiator that generates a substance that initiates cationic polymerization by heat (for example, 40 to 150 ° C.). The (B3CH) component may act as the above-mentioned (B3CL) component.

The (B3CH) component is the same as the (B3CL) component, for example, BF _4- ^, BR _4- ⁽ R indicates a phenyl group substituted with 2 or more fluorine atoms or 2 or more trifluoromethyl groups). , PF ₆ ⁻ , SbF ₆ ⁻ , AsF ₆ ^{− and} the like, sulfonium salt, phosphonium salt, ammonium salt, diazonium salt, iodonium salt, onium salt such as anilinium salt and the like. These may be used individually by 1 type, and may be used in combination of a plurality of types.

Commercially available products of the (B3CH) component include, for example, CP-66, CP-77 (all manufactured by ADEKA CORPORATION), SI-25, SI-45, SI-60, SI-60L, SI-60LA, SI- 60B, SI-80L, SI-100L, SI-110L, SI-180L (all manufactured by Sanshin Chemical Industry Co., Ltd.), CI-2855 (manufactured by Nippon Soda Corporation), PI-2074 (manufactured by Rhodia Japan Co., Ltd.) ) Etc. can be mentioned.

The content of the (B3CH) component is 100 parts by mass of the (B2C) component from the viewpoint of ensuring the formability and curability of the adhesive film for forming the first region (first adhesive layer). On the other hand, it may be, for example, 0.1 to 50 parts by mass, 0.5 to 40 parts by mass, 1 to 30 parts by mass, or 5 to 20 parts by mass.

When the component (B2) is a component (B2R), even if the component (B3) is a photoradical polymerization initiator (hereinafter, may be referred to as “(B3RL) component”), the thermal radical polymerization initiator ( Hereinafter, it may be referred to as “(B3RH) component”). By combining the (B2R) component and the (B3RL) component, a photocurable resin component can be obtained. By combining the (B2R) component and the (B3RH) component, a thermosetting resin component can be obtained.

(B3RL) Component: Photoradical Polymerization Initiator (B3RL) component comprises light containing a wavelength in the range of 150 to 750 nm, preferably light containing a wavelength in the range of 254 to 405 nm, and more preferably a wavelength in the range of 365 nm. A polymerization initiator that generates radicals when irradiated with light (for example, ultraviolet light). The (B3RL) component may be used alone or in combination of two or more.

The (B3RL) component is decomposed by light to generate free radicals. That is, the (B3RL) component is a compound that generates radicals by applying light energy from the outside. The (B3RL) component includes an oxime ester structure, a bisimidazole structure, an acridine structure, an α-aminoalkylphenone structure, an aminobenzophenone structure, an N-phenylglycine structure, an acylphosphine oxide structure, a benzyldimethylketal structure, and an α-hydroxyalkylphenone structure. It may be a compound having a structure such as. The (B3RL) component may be used alone or in combination of two or more. The (B3RL) component is selected from the group consisting of an oxime ester structure, an α-aminoalkylphenone structure, and an acylphosphine oxide structure from the viewpoint that the desired melt viscosity can be easily obtained and the effect of reducing the connection resistance is superior. It may be a compound having at least one structure.

Specific examples of the compound having an oxime ester structure include 1-phenyl-1,2-butandion-2- (o-methoxycarbonyl) oxime and 1-phenyl-1,2-propanedione-2- (o-methoxycarbonyl). ) Oxime, 1-phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-1,2-propanedione-2-o-benzoyloxime, 1,3-diphenylpropantrione- 2- (o-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxypropanetrione-2- (o-benzoyl) oxime, 1,2-octanedione, 1- [4- (phenylthio) phenyl-, 2-( o-benzoyloxime)], etanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl]-, 1- (o-acetyloxime) and the like.

Specific examples of the compound having an α-aminoalkylphenone structure include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one and 2-benzyl-2-dimethylamino-1. -Morphorinophenyl) -butanone-1 and the like.

Specific examples of the compound having an acylphosphine oxide structure include bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide and bis (2,4,6, -trimethylbenzoyl) -phenylphosphine. Examples thereof include oxide, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide and the like.

The content of the (B3RL) component is, for example, 0.1 to 10 parts by mass, 0.3 to 7 parts by mass, or 0 with respect to 100 parts by mass of the (B2R) component from the viewpoint of suppressing the flow of the conductive particles. It may be 5 to 5 parts by mass.

(B3RH) component: Thermal radical polymerization initiator (B3RH) component is a polymerization initiator that generates radicals by heat. The 1-hour half-life temperature of the (B3RH) component may be, for example, 50-100 ° C. The (B3RH) component may be used alone or in combination of two or more.

Examples of the (B3RH) component include diacyl peroxides such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, and benzoyl peroxide; t-butylperoxypivalate, t-hexylperoxypivalate, 1,1. , 3,3-Tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate Noate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, t-hexylperoxyisopropylmonocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate , T-Butyl Peroxy Laurilate, t-Butyl Peroxyisopropyl Monocarbonate, t-Butyl Peroxy-2-ethylhexyl Monocarbonate, t-Butyl Peroxybenzoate, t-Hexyl Peroxybenzoate, 2,5-dimethyl- Peroxy esters such as 2,5-bis (benzoylperoxy) hexane, t-butylperoxyacetate; and 2,2'-azobisisobutyronitrile, 2,2'-azobis (2,4-dimethyl). Valeronitrile), azo compounds such as 2,2'-azobis (4-methoxy-2'-dimethylvaleronitrile) and the like can be mentioned.

The content of the (B3RH) component is, for example, 0.1 to 15 parts by mass, 0.3 to 12 parts by mass, or 0 with respect to 100 parts by mass of the (B2R) component from the viewpoint of suppressing the flow of the conductive particles. It may be 5 to 10 parts by mass.

The component (B) (first adhesive component) may contain a cured product of a photocurable resin component. The content of the cured product of the photocurable resin component is 40 to 100% by mass, 50 to 100% by mass, or 60 to 100% by mass based on the total mass of the component (B) (first adhesive component). May be. The content of the photocurable resin component in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The component (B) (first adhesive component) may further contain a thermosetting resin component in addition to the cured product of the photocurable resin component. The content of the thermosetting resin component is 0 to 60% by mass, 0 to 50% by mass, or 0 to 40% by mass based on the total mass of the component (B) (first adhesive component). good. The content of the thermosetting resin component in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The total content of the component (B2) and the component (B3) is 60 to 100% by mass, 70 to 100% by mass, or 80 to 80 to the total mass of the component (B) (first adhesive component). It may be 100% by mass. The content of the total amount of the component (B2) and the component (B3) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The content of the component (B) component (first adhesive component) is the first region from the viewpoint of ensuring the curability of the adhesive film for forming the first region (first adhesive layer). Based on the total mass of the (first adhesive layer), it may be 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more. The content of the component (B) component (first adhesive component) is the first region from the viewpoint of ensuring the formability of the adhesive film for forming the first region (first adhesive layer). Based on the total mass of the (first adhesive layer), it may be 80% by mass or less, 70% by mass or less, 60% by mass or less, or 50% by mass or less. When the content of the component (B) (first adhesive component) is in the above range, the effect of the present disclosure tends to be remarkably exhibited. The content of the component (B) (first adhesive component) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

[Other ingredients]
The first region 1 (first adhesive layer) may further contain other components in addition to the component (A) and the component (B). Examples of other components include a thermoplastic resin (hereinafter, may be referred to as "(C) component"), a coupling agent (hereinafter, may be referred to as "(D) component"), and a filler (hereinafter, may be referred to as "component"). , "(E) component" may be mentioned.) And the like.

Component (C): Thermoplastic resin Examples of the component (C) include phenoxy resin, polyester resin, polyamide resin, polyurethane resin, polyester urethane resin, acrylic rubber, and epoxy resin (solid at 25 ° C.). These may be used individually by 1 type, and may be used in combination of a plurality of types. By further containing the component (C) in the composition containing the component (A) and the component (B), the composition layer (further, the first adhesive layer) can be easily formed from the composition. can. Among these, the component (C) may be, for example, a phenoxy resin.

The content of the component (C) is 1% by mass or more, 5% by mass or more, 10% by mass or more, or 15% by mass or more, based on the total mass of the first region (first adhesive layer). It may be 70% by mass or less, 60% by mass or less, 50% by mass or less, or 40% by mass or less. The content of the component (C) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

Component (D): Coupling agent Examples of the component (D) include a silane coupling agent having an organic functional group such as a (meth) acryloyl group, a mercapto group, an amino group, an imidazole group, and an epoxy group, a tetraalkoxysilane, and the like. Examples thereof include a silane compound, a tetraalkoxy titanate derivative, and a polydialkyl titanate derivative. These may be used individually by 1 type, and may be used in combination of a plurality of types. When the first adhesive layer contains the component (F), the adhesiveness can be further improved. The component (D) may be, for example, a silane coupling agent. The content of the component (D) may be 0.1 to 10% by mass based on the total mass of the first region (first adhesive layer). The content of the component (D) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

Component (E): Filler Examples of the component (E) include non-conductive fillers (for example, non-conductive particles). The component (E) may be either an inorganic filler or an organic filler. Examples of the inorganic filler include metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; and inorganic fine particles such as metal nitride fine particles. Examples of the organic filler include organic fine particles such as silicone fine particles, methacrylate / butadiene / styrene fine particles, acrylic / silicone fine particles, polyamide fine particles, and polyimide fine particles. These may be used individually by 1 type, and may be used in combination of a plurality of types. The component (E) may be, for example, silica fine particles. The content of the component (E) may be 0.1 to 10% by mass based on the total mass of the first region (first adhesive layer). The content of the component (E) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

[Other additives]
The first region 1 (first adhesive layer) may further contain other additives such as softeners, accelerators, anti-deterioration agents, colorants, flame retardants, thixotropic agents and the like. .. The content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the first region (first adhesive layer). The content of other additives in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The thickness d1 of the first region 1 may be, for example, 5 μm or less. The thickness d1 of the first region 1 may be 4.5 μm or less or 4.0 μm or less. When the thickness d1 of the first region 1 is 5 μm or less, conductive particles at the time of circuit connection can be captured more efficiently. The thickness d1 of the first region 1 may be, for example, 0.1 μm or more, 0.5 μm or more, or 0.7 μm or more.

The thickness d1 of the first region 1 is, for example, 100 g of a bisphenol A type epoxy resin (trade name: JER811, manufactured by Mitsubishi Chemical Co., Ltd.) by sandwiching an adhesive film between two sheets of glass (thickness: about 1 mm). After casting with a resin composition consisting of 10 g of a curing agent (trade name: Epomount curing agent, manufactured by Refine Tech Co., Ltd.), cross-section polishing is performed using a polishing machine, and a scanning electron microscope (SEM, product name: It can be obtained by measuring using SE-8000 (manufactured by Hitachi High-Tech Science Co., Ltd.). Further, as shown in FIG. 1, when a part of the conductive particles 4 is exposed from the surface of the first region 1 (for example, protruding toward the second region 2), the first region 1 The distance from the main surface 1a on the side opposite to the region 2 side of 2 to the boundary S between the first region 1 and the second region 2 located at the separated portions of the adjacent conductive particles 4 and 4 (in FIG. 1). The distance indicated by d1) is the thickness of the first region 1, and the exposed portion of the conductive particles 4 is not included in the thickness of the first region 1. The length of the exposed portion of the conductive particles 4 may be, for example, 0.1 μm or more, and may be 5 μm or less.

On the other hand, when the adhesive film is produced by, for example, laminating the first adhesive film and the second adhesive film, the thickness of the first adhesive film is easily maintained in the adhesive film. Therefore, the thickness of the first adhesive film may be set to the thickness d1 of the first region 1. When a part of the conductive particles is exposed from the surface of the first adhesive film, the exposed portion of the conductive particles is not included in the thickness of the first adhesive film.

<Second region (second adhesive layer)>
The second region 2 (second adhesive layer) contains the component (B) (second adhesive component). The second adhesive component may be the same as or different from the first adhesive component.

The component (B) (second adhesive component) may contain a component (B1), a component (B2), a component (B3), and the like. The component (B) may contain a curable resin component composed of a combination of the component (B1), the component (B2), and the component (B3), and / or a cured product of the curable resin component. The component (B1), the component (B2), and the component (B3) used in the second region 2 (second adhesive layer) are in the first region 1 (first adhesive layer). Since it is the same as the component (B1), the component (B2), and the component (B3) used, detailed description thereof will be omitted here.

The second adhesive component may be a thermosetting resin component (second thermosetting resin component). In this case, the second adhesive component may contain a thermal polymerization initiator as the component (B3). The thermosetting resin component may be a cationic curing system (combination of (B2C) component and (B3CH) component) or a radical curing system (combination of (B2R) component and (B3RH) component). It is often preferable to use a cationic curing system. Since the component (B1) can act as one component of the cationically curable thermosetting resin component, the second adhesive component is, in one embodiment, the component (B1), the component (B2C), and the component (B3CH). ) It may be a combination with an ingredient. The second thermosetting resin component may be the same as or different from the first thermosetting resin component, but it is preferable that the curing system is common.

Of the first adhesive component and the second adhesive component, it is preferable that the second adhesive component contains the (B1) component. The content of the component (B1) may be, for example, 1% by mass or more, 3% by mass or more, or 5% by mass or more, based on the total mass of the component (B) (second adhesive component). It may be 40% by mass or less, 30% by mass or less, or 20% by mass or less. When the content of the component (B1) is in the above range, the effect of the present disclosure tends to be remarkably exhibited. The content of the component (B1) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The total content of the component (B2) and the component (B3) is 60% by mass or more, 70% by mass or more, or 80% by mass or more based on the total mass of the component (B) (second adhesive component). It may be 99% by mass or less, 97% by mass or less, or 95% by mass or less. The content of the total amount of the component (B2) and the component (B3) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The content of the component (B) component (second adhesive component) is the second region from the viewpoint of ensuring the curability of the adhesive film for forming the second region (second adhesive layer). Based on the total mass of the (second adhesive layer), it may be 10% by mass or more, 20% by mass or more, 30% by mass or more, or 40% by mass or more. The content of the component (B) component (second adhesive component) is the second region from the viewpoint of ensuring the formability of the adhesive film for forming the second region (second adhesive layer). Based on the total mass of the (second adhesive layer), it may be 80% by mass or less, 70% by mass or less, 60% by mass or less, or 55% by mass or less. When the content of the component (B) (second adhesive component) is in the above range, the effect of the present disclosure tends to be remarkably exhibited. The content of the component (B) (second adhesive component) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The second region 2 (second adhesive layer) may further contain other components and other additives in the first region 1 (first adhesive layer). Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the first region 1 (first adhesive layer).

The content of the component (C) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and is 50% by mass, based on the total mass of the second region (second adhesive layer). % Or less, 40% by mass or less, or 30% by mass or less.

The content of the component (D) may be 0.1 to 10% by mass based on the total mass of the second region (second adhesive layer).

The content of the component (E) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, 70% by mass, based on the total mass of the second region (second adhesive layer). % Or less, 60% by mass or less, or 50% by mass or less.

The content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the second region (second adhesive layer).

The thickness d2 of the second region 2 may be appropriately set according to the height of the electrodes of the circuit member to be adhered. The thickness d2 of the second region 2 is 5 μm or more or 7 μm or more from the viewpoint that the space between the electrodes can be sufficiently filled to seal the electrodes and better connection reliability can be obtained. It may be 20 μm or less or 15 μm or less.

The thickness d2 of the second region 2 can be obtained by the same method as the thickness d1 of the first region 1. When a part of the conductive particles 4 is exposed from the surface of the first region 1 (for example, protruding toward the second region 2), it is opposite to the first region 1 side in the second region 2. The distance (distance shown by d2 in FIG. 1) from the main surface 2a on the side to the boundary S between the first region 1 and the second region 2 located at the separated portion of the adjacent

conductive particles

4 and 4 is the second. Is the thickness of region 2.

On the other hand, when the adhesive film is produced by, for example, laminating the first adhesive film and the second adhesive film, the thickness of the second adhesive film is easily maintained in the adhesive film. Therefore, the thickness of the second adhesive film may be set to the thickness d2 of the second region 2.

In the adhesive film 10, the conductive particles 4 are dispersed in the first region 1. Therefore, the adhesive film 10 can be an anisotropically conductive adhesive film. The adhesive film 10 is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and heats the first circuit member and the second circuit member. It is crimped and used to electrically connect the first electrode and the second electrode to each other.

According to the adhesive film 10, it is possible to form a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting.

Although the adhesive film of the present embodiment has been described above, the present disclosure is not limited to the above embodiment.

The adhesive film may be composed of, for example, two regions of a first region and a second region (two layers of a first adhesive layer and a second adhesive layer), and the adhesive film may be composed of a first region. It may be composed of three or more regions including a region and a second region (three or more layers including two layers of a first adhesive layer and a second adhesive layer). The adhesive film is provided, for example, in a third region (adjacent) provided on the opposite side (adjacent) to the second region (second adhesive layer) of the first region (first adhesive layer). It may be configured to further include (third adhesive layer).

The third region (third adhesive layer) contains the component (B) (third adhesive component). The third adhesive component may be the same as or different from the first adhesive component, and may be the same as or different from the second adhesive component.

The component (B) (third adhesive component) may contain a component (B1), a component (B2), a component (B3), and the like. The component (B) may contain a curable resin component composed of a combination of the component (B1), the component (B2), and the component (B3), and / or a cured product of the curable resin component. The component (B1), the component (B2), and the component (B3) used in the third region (third adhesive layer) are used in the first region 1 (first adhesive layer). Since it is the same as the component (B1), the component (B2), and the component (B3), detailed description thereof will be omitted here.

The third adhesive component may be a thermosetting resin component (third thermosetting resin component). In this case, the third adhesive component may contain a thermal polymerization initiator as the component (B3). The thermosetting resin component may be a cationic curing system (combination of (B2C) component and (B3CH) component) or a radical curing system (combination of (B2R) component and (B3RH) component). It is often preferable to use a cationic curing system. The third thermosetting resin component may be the same as or different from the first thermosetting resin component and the second thermosetting resin component, but it is preferable that the curing system is common. ..

The content of the component (B1) is, for example, 0 to 40% by mass, 0 to 30% by mass, or 0 to 20% by mass based on the total mass of the component (B) (third adhesive component). It's okay. The content of the component (B1) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The total content of the component (B2) and the component (B3) is 60 to 100% by mass, 70 to 100% by mass, or 80 to 80 to the total mass of the component (B) (third adhesive component). It may be 100% by mass. The content of the thermosetting resin component in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The content of the component (B) component (third adhesive component) is a third region from the viewpoint of ensuring the curability of the adhesive film for forming the third region (third adhesive layer). Based on the total mass of the (third adhesive layer), it may be 10% by mass or more, 20% by mass or more, or 30% by mass or more. The content of the component (B) component (third adhesive component) is a third region from the viewpoint of ensuring the formability of the adhesive film for forming the third region (third adhesive layer). Based on the total mass of the (third adhesive layer), it may be 80% by mass or less, 70% by mass or less, 60% by mass or less, or 50% by mass or less. When the content of the component (B) (third adhesive component) is in the above range, the effect of the present disclosure tends to be remarkably exhibited. The content of the component (B) (third adhesive component) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.

The third region (third adhesive layer) may further contain other components and other additives in the first region 1 (first adhesive layer). Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the second region 2 (second adhesive layer).

The content of the component (C) may be 10% by mass or more, 20% by mass or more, or 30% by mass or more, and may be 80% by mass, based on the total mass of the third region (third adhesive layer). % Or less, 70% by mass or less, or 60% by mass or less.

The content of the component (D) may be 0.1 to 10% by mass based on the total mass of the third region (third adhesive layer).

The content of the component (E) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and is 50% by mass, based on the total mass of the third region (third adhesive layer). % Or less, 40% by mass or less, or 30% by mass or less.

The content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the third region (third adhesive layer).

The thickness of the third region may be appropriately set according to the minimum melt viscosity of the adhesive film, the height of the electrode of the circuit member to be adhered, and the like. The thickness of the third region is preferably smaller than the thickness d2 of the second region 2. The thickness of the third region may be 0.2 μm or more from the viewpoint that the space between the electrodes can be sufficiently filled to seal the electrodes and better connection reliability can be obtained. It may be 0.0 μm or less.

The third region can be obtained by the same method as the thickness d1 of the first region 1 and the thickness d2 of the second region 2. On the other hand, when the adhesive film is produced by, for example, laminating a third adhesive film, the thickness of the third adhesive film is easily maintained in the adhesive film, so that the third adhesive film is easily maintained. The thickness of may be the thickness of the third region.

The thickness of the adhesive film (the total thickness of all the layers constituting the adhesive film 10) may be, for example, 5 μm or more or 8 μm or more, and may be 30 μm or less or 20 μm or less.

The circuit connection adhesive film of the above embodiment is an anisotropic conductive adhesive film, but the circuit connection adhesive film may be a conductive adhesive film that does not exhibit anisotropic conductivity.

<Manufacturing method of adhesive film for circuit connection>
The method for producing an adhesive film for circuit connection according to one embodiment is a step of forming a first adhesive layer containing a component (A) and a component (B) (first adhesive component) (first step). ), And a step (second step) of laminating a second adhesive layer containing the component (B) (second adhesive component) on the first adhesive layer. In the manufacturing method, a third adhesive layer containing the component (B) (third adhesive component) is laminated on a layer of the first adhesive layer opposite to the second adhesive layer. A step (third step) may be further provided.

In the first step, for example, a composition containing the components (A) and (B), and other components and other additives added as needed is stirred and mixed in an organic solvent. A varnish composition is prepared by dissolving or dispersing by kneading or the like. Then, the varnish composition is applied onto the mold-released substrate using a knife coater, roll coater, applicator, comma coater, die coater, etc., and then the organic solvent is volatilized by heating to form the substrate. A composition layer (first adhesive layer) composed of the composition is formed on the surface. At this time, the thickness of the finally obtained first adhesive layer (first adhesive film) can be adjusted by adjusting the coating amount of the varnish composition.

When the first adhesive component contains a photocurable resin component, the first step is for a composition layer composed of a composition containing the component (A) and the component (B) containing the photocurable resin component. This may be a step of curing the photocurable resin component to form the first adhesive layer. At this time, the composition may contain a thermosetting resin component. In this case, in the first step, the photocurable resin component in the composition layer is cured by irradiating the composition layer made of the composition with light to form the first adhesive layer on the substrate. do. The first adhesive layer can be said to be the first adhesive film.

The organic solvent used in the preparation of the varnish composition is not particularly limited as long as it has the property of uniformly dissolving or dispersing each component. Examples of such an organic solvent include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate, butyl acetate and the like. These organic solvents can be used alone or in combination of two or more. Stirring and mixing or kneading in the preparation of the varnish composition can be carried out by using, for example, a stirrer, a raider, a three-roll, a ball mill, a bead mill, a homodisper or the like.

The base material is not particularly limited as long as it has heat resistance that can withstand the heating conditions when volatilizing the organic solvent. Examples of such a substrate include stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate, polyvinylidene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, polyimide, cellulose, and the like. A substrate (for example, a film) made of an ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, a synthetic rubber system, a liquid crystal polymer or the like can be used.

The heating conditions for volatilizing the organic solvent from the varnish composition applied to the base material can be appropriately set according to the organic solvent to be used and the like. The heating conditions may be, for example, 40 to 120 ° C. for 0.1 to 10 minutes.

A part of the organic solvent may remain in the first adhesive layer without being removed. The content of the organic solvent in the first adhesive layer may be, for example, 10% by mass or less based on the total mass of the first adhesive layer.

When light is used in the curing step, it is preferable to use irradiation light (for example, ultraviolet light) having a wavelength in the range of 150 to 750 nm for light irradiation. Light irradiation can be performed using, for example, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, an LED light source, or the like. The integrated light amount of light irradiation can be appropriately set, but may be, for example, 500 to 3000 mJ / cm ² .

The second step is a step of laminating the second adhesive layer on the first adhesive layer. In the second step, for example, except that the component (B) and other components and other additives added as needed are used (and no light irradiation is performed), the first step is performed. In the same manner as above, a second adhesive layer is formed on the substrate to obtain a second adhesive film. Next, the second adhesive layer can be laminated on the first adhesive layer by adhering the first adhesive film and the second adhesive film. Further, in the second step, for example, a varnish composition obtained by using the component (C) and other components and other additives added as needed is applied onto the first adhesive layer. The second adhesive layer can also be laminated on the first adhesive layer by volatilizing the organic solvent.

A part of the organic solvent may remain in the second adhesive layer without being removed. The content of the organic solvent in the second adhesive layer may be, for example, 10% by mass or less based on the total mass of the second adhesive layer.

Examples of the method of adhering the first adhesive film and the second adhesive film include a method of heat pressing, roll laminating, vacuum laminating and the like. Lamination can be performed, for example, under temperature conditions of 0 to 80 ° C.

The third step is a step of laminating the third adhesive layer on the layer of the first adhesive layer opposite to the second adhesive layer. In the third step, for example, first, in the same manner as in the second step, a third adhesive layer is formed on the substrate to obtain a third adhesive film. Next, by adhering the third adhesive film to the side of the first adhesive film opposite to the second adhesive film, the side of the first adhesive layer opposite to the second adhesive layer A third adhesive layer can be laminated on the layer of. Further, in the third step, for example, in the same manner as in the second step, the varnish composition is applied onto the layer of the first adhesive layer opposite to the second adhesive layer, and an organic solvent is applied. The third adhesive layer can be laminated on the first adhesive layer by volatilizing the above. The method of bonding and the conditions thereof are the same as in the second step.

A part of the organic solvent may remain in the third adhesive layer without being removed. The content of the organic solvent in the third adhesive layer may be, for example, 10% by mass or less based on the total mass of the third adhesive layer.

<Material for circuit connection>
The circuit connection material of one embodiment contains an adhesive component ((B) component) containing a monofunctional oxetane compound ((B1) component). The circuit connection material can be suitably used for the second adhesive layer (second adhesive film) in the above-mentioned method for manufacturing a circuit connection adhesive film. The component (B1) is the same as the component (B1) in the first region 1 (first adhesive layer) of the above-mentioned adhesive film for circuit connection, and the component (B) is the above-mentioned adhesive for circuit connection. Since it is the same as the component (B) in the first region 1 (first adhesive layer) of the agent film, detailed description thereof will be omitted here.

The content of the component (B1) may be, for example, 1% by mass or more, 3% by mass or more, or 5% by mass or more, and 40% by mass or less, 30% by mass, based on the total mass of the component (B). It may be less than or equal to 20% by mass or less.

The component (B) may further contain the component (B2) and the component (B3). The total content of the component (B2) and the component (B3) may be 60% by mass or more, 70% by mass or more, or 80% by mass or more, 99% by mass, based on the total mass of the component (B). Hereinafter, it may be 97% by mass or less, or 95% by mass or less. The components (B2) and (B3) are the same as the components (B2) and (B3) in the first region 1 (first adhesive layer) of the above-mentioned circuit connection adhesive film. Therefore, a detailed description will be omitted here.

The content of the component (B) may be 10% by mass or more, 20% by mass or more, 30% by mass or more, or 40% by mass or more based on the total mass of the circuit connection material. The content of the component (B) may be 80% by mass or less, 70% by mass or less, 60% by mass or less, or 55% by mass or less based on the total mass of the circuit connection material.

The circuit connection material may further contain other components and other additives in the first region 1 (first adhesive layer) of the circuit connection adhesive film. Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the first region 1 (first adhesive layer).

The content of the component (C) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, based on the total mass of the circuit connection material, and may be 50% by mass or less, 40% by mass or less, Alternatively, it may be 30% by mass or less.

The content of the component (D) may be 0.1 to 10% by mass based on the total mass of the circuit connection material.

The content of the component (E) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, and is 70% by mass or less, 60% by mass or less, based on the total mass of the circuit connection material. Alternatively, it may be 50% by mass or less.

The content of other additives may be, for example, 0.1 to 10% by mass based on the total mass of the circuit connection material.

The circuit connection material may further contain conductive particles (component (A)). Such a circuit connection material can be suitably used for the first adhesive layer (first adhesive film) in the above-mentioned method for manufacturing a circuit connection adhesive film. Since the component (A) is the same as the component (B1) in the first region 1 (first adhesive layer) of the above-mentioned circuit connection adhesive film, detailed description thereof will be omitted here.

The content of the component (A) may be 40 parts by mass or more, 50 parts by mass or more, or 60 parts by mass or more, and 150 parts by mass or less and 140 parts by mass or less with respect to 100 parts by mass of the component (B). , Or 120 parts by mass or less.

<Circuit connection structure and its manufacturing method>
Hereinafter, a circuit connection structure using the above-mentioned circuit connection adhesive film 10 as a circuit connection material and a method for manufacturing the same will be described.

FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit connection structure. As shown in FIG. 2, the circuit connection structure 20 includes a first circuit member 13 having a first electrode 12 formed on a main surface 11a of the first circuit board 11 and the first circuit board 11. , A second circuit member 16 having a second electrode 15 formed on the main surface 14a of the second circuit board 14 and the second circuit board 14, and the first circuit member 13 and the second circuit member. It is arranged between 16 and includes a circuit connection portion 17 that electrically connects the first electrode 12 and the second electrode 15 to each other.

The first circuit member 13 and the second circuit member 16 may be the same as or different from each other. The first circuit member 13 and the second circuit member 16 are a glass substrate or a plastic substrate on which a circuit electrode is formed; a printed wiring board; a ceramic wiring board; a flexible wiring board; an IC chip such as a drive IC, or the like. It's okay. The first circuit board 11 and the second circuit board 14 may be formed of an inorganic substance such as semiconductor, glass, or ceramic, an organic substance (plastic) such as polyimide or polycarbonate, or a composite such as glass / epoxy. The first circuit board 11 may be a plastic substrate or a polyimide substrate. The first circuit member 13 may be, for example, a plastic substrate on which a circuit electrode is formed, or a polyimide substrate on which a circuit electrode is formed. The second circuit member 16 may be, for example, an IC chip such as a drive IC.

The first electrode 12 and the second electrode 15 are gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, titanium and other metals, indium tin oxide (ITO), and the like. The electrode may be an electrode containing an oxide such as indium tin oxide (IZO) or indium gallium zinc oxide (IGZO). The first electrode 12 and the second electrode 15 may be electrodes formed by laminating two or more of these metals, oxides, and the like. The electrode formed by stacking two or more types may have two or more layers, and may have three or more layers. When the first circuit member 13 is a plastic substrate, the first electrode 12 may be an electrode having a titanium layer on the outermost surface. The first electrode 12 and the second electrode 15 may be circuit electrodes or bump electrodes. At least one of the first electrode 12 and the second electrode 15 may be a bump electrode. In FIG. 2, the first electrode 12 is a circuit electrode and the second electrode 15 is a bump electrode.

The circuit connection portion 17 includes a cured product of the adhesive film 10 or a cured product of the circuit connection material. The circuit connection portion 17 may be made of a cured product of the adhesive film 10 described above. The circuit connection portion 17 is located, for example, on the side of the first circuit member 13 in the direction in which the first circuit member 13 and the second circuit member 16 face each other (hereinafter referred to as “opposite direction”), and the first circuit member 17 is described above. It is located on the side of the first cured product region 18 made of the cured product of the component (B) (first adhesive component) other than the conductive particles 4 in the region and the second circuit member 16 in the opposite direction, and is described above. Intervened between the second cured product region 19 made of the cured product of the component (B) (second adhesive component) in the second region of the above, and at least the first electrode 12 and the second electrode 15. It has conductive particles 4 that electrically connect the first electrode 12 and the second electrode 15 to each other. As shown in FIG. 2, the circuit connection portion 17 does not have to have two distinct regions between the first cured product region 18 and the second cured product region 19, and the first The cured product derived from the region of 1 and the cured product derived from the second region may be mixed to form one region.

The circuit connection structure is, for example, a flexible organic electric field light emitting color display (organic EL display) in which a plastic substrate in which organic EL elements are regularly arranged and a drive circuit element which is a driver for displaying an image are connected. Examples thereof include a touch panel in which a plastic substrate on which organic EL elements are regularly arranged and a position input element such as a touch pad are connected. The circuit connection structure can be applied to various monitors such as smartphones, tablets, televisions, vehicle navigation systems, wearable terminals, furniture; home appliances; daily necessities and the like.

FIG. 3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure. 3 (a) and 3 (b) are schematic cross-sectional views showing each process. As shown in FIG. 3, a method of manufacturing the circuit connection structure 20 is performed between a first circuit member 13 having a first electrode 12 and a second circuit member 16 having a second electrode 15. A step is provided in which the first circuit member 13 and the second circuit member 16 are thermocompression-bonded with the adhesive film 10 interposed therebetween, and the first electrode 12 and the second electrode 15 are electrically connected to each other. ..

Specifically, as shown in FIG. 3A, first, a first circuit including a first electrode 12 formed on a main surface 11a of a first circuit board 11 and a first circuit board 11. A member 13 and a second circuit member 16 provided with a second electrode 15 formed on the main surface 14a of the second circuit board 14 and the second circuit board 14 are prepared.

Next, the first circuit member 13 and the second circuit member 16 are arranged so that the first electrode 12 and the second electrode 15 face each other, and the first circuit member 13 and the second circuit member 12 are arranged. The adhesive film 10 is placed between the 16 and 16. For example, as shown in FIG. 3A, the adhesive film 10 is laminated on the first circuit member 13 so that the first adhesive layer side faces the main surface 11a of the first circuit board 11. .. Next, the adhesive film 10 is laminated so that the first electrode 12 on the first circuit board 11 and the second electrode 15 on the second circuit board 14 face each other. The second circuit member 16 is arranged on the circuit member 13.

Then, as shown in FIG. 3B, while heating the first circuit member 13, the adhesive film 10, and the second circuit member 16, the first circuit member 13 and the second circuit member 16 By pressurizing in the thickness direction, the first circuit member 13 and the second circuit member 16 are thermocompression bonded to each other. At this time, as shown by an arrow in FIG. 3B, since the second adhesive layer has a flowable uncured thermosetting component, a gap between the second electrodes 15 is provided. While flowing so as to fill in, it is cured by the above heating. As a result, the first electrode 12 and the second electrode 15 are electrically connected to each other via the conductive particles 4, and the first circuit member 13 and the second circuit member 16 are adhered to each other. The circuit connection structure 20 shown in 2 can be obtained. In the method for manufacturing the circuit connection structure 20 of the present embodiment, it can be said that a part of the first adhesive layer is cured by light, heat, moisture, etc., so that the conductive particles 4 are contained in the first adhesive layer. In addition, since the first adhesive layer hardly flows during the thermocompression bonding and the conductive particles are efficiently captured between the facing electrodes, the facing first electrodes 12 and the second are used. The connection resistance between the electrodes 15 of the above is reduced. Further, when the thickness of the first adhesive layer is 5 μm or less, the conductive particles at the time of circuit connection tend to be captured more efficiently.

The heating temperature for thermocompression bonding can be set as appropriate, but may be, for example, 50 to 190 ° C. The pressurization is not particularly limited as long as it does not damage the adherend, but in the case of COG mounting, the area conversion pressure at the bump electrode may be, for example, 10 to 100 MPa. These heating and pressurizing times may be in the range of 0.5 to 120 seconds. Further, in the case of COP (chip on plastic) mounting, for example, the area conversion pressure at the bump electrode may be 0.1 to 50 MPa.

Hereinafter, this disclosure will be described more specifically with reference to examples. However, the present disclosure is not limited to these examples.

[Preparation of a first adhesive film (first adhesive layer), a second adhesive film (second adhesive layer), and a third adhesive film (third adhesive layer)]
In these preparations, the materials shown below were used.

(A) Conductive particles A-1: Conductive particles in which a palladium / nickel layer having a thickness of 0.1 μm is provided on the surface of particles having polystyrene as a core (average particle size: 3.0 μm, specific gravity: 2.9). particle)
(B) Adhesive component (B1) Monofunctional oxetane compound B1-1: OXT-101 (3-ethyl-3-hydroxymethyloxetane, manufactured by Toagosei Co., Ltd.)
B1-2: OXT-212 (2-ethylhexyl oxetane, manufactured by Toagosei Co., Ltd.)
(B2) Polymerizable compound (components other than (B1))
(B2C) Cationic Polymerizable Compound B2C-1: OXT-121 (xylylenebis oxetane, bifunctional oxetane compound, manufactured by Toagosei Co., Ltd.)
B2C-2: OXBP (4,4'-bis [(3-ethyl-3-oxetanyl) methoxymethyl] biphenyl, bifunctional oxetane compound, manufactured by Ube Kosan Co., Ltd.)
B2C-3: OXSQ (polyfunctional oxetane compound, manufactured by Toagosei Co., Ltd.)
B2C-4: EHPE3150 (1,2-epoxy-4- (2-oxylanyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol, manufactured by Daicel Corporation)
B2C-5: CEL2021P (3', 4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, manufactured by Daicel Corporation)
B2C-6: jER-1007 (epoxy resin (epoxy equivalent: 1750 to 2200 g / eq), Mitsubishi Chemical Corporation)
(B2R) Radical Polymerizable Compound B2R-1: A-BPEF (ethoxylated fluorene type di (meth) acrylate, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), diluted with an organic solvent to 70% by mass of non-volatile content (B3) ) Polymerization Initiator (B3CH) Thermal Cationic Polymerization Initiator B3CH-1: CXC-1821 (manufactured by King Industries)
(B3CL) Photocationic polymerization initiator B3CL-1: CPI-310B (manufactured by Sun Abro Co., Ltd.), diluted to 10% by mass of non-volatile content with an organic solvent (B3RL) Photoradical polymerization initiator B3RL-1: IrgacureOXE- 02 (Compound having an oxime ester structure, manufactured by BASF), diluted with an organic solvent to a non-volatile content of 10% by mass, is used.

(C) Thermoplastic resin C-1: FX-310 (phenoxy resin, manufactured by Nittetsu Chemical & Materials Co., Ltd.), diluted with an organic solvent to a non-volatile content of 40% by mass C-2: FX-293 (phenoxy) Resin, manufactured by Nittetsu Chemical & Materials Co., Ltd., diluted with an organic solvent to a non-volatile content of 40% by mass C-3: ZX1356-2 (bisphenol A type and bisphenol F type copolymer phenoxy resin, weight) Average molecular weight: 70000, glass transition temperature: 71 ° C, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), diluted to 50% by mass of non-volatile content with an organic solvent.

(D) Ingredient: Coupling agent D-1: SH-6040 (3-glycidoxypropyltrimethoxysilane, manufactured by Toray Dow Corning Co., Ltd.)

(E) Ingredients: Filler E-1: SE2050 (silica fine particles, manufactured by Admatex Co., Ltd.), diluted to 70% by mass of non-volatile content with an organic solvent E-2: R805 (silica fine particles, Evonik Industries AG) Made), using an organic solvent diluted to a non-volatile content of 10% by mass.

<Preparation of the first adhesive film (first adhesive layer)>
A composition obtained by mixing the materials shown in Table 1 at the composition ratio shown in Table 1 (the numerical value in Table 1 means the amount of non-volatile content) is then subjected to a mold release treatment, and has a thickness of 50 μm. The composition layers 1a and 1b containing each component were obtained by applying a coating on a release-treated PET (polyethylene terephthalate) film while applying a magnetic field and drying an organic solvent or the like. The thickness of the composition layers 1a and 1b after drying was 3.5 μm. Next, the composition layer 1a is irradiated with light (UV irradiation: metal halide lamp, integrated light amount: 1900 to 2300 mJ / cm ² ), and the composition layer 1b is irradiated with light (UV irradiation: metal halide lamp, integrated light amount: 1000 to). By 2000 mJ / cm ² ), the first adhesive films 1A and 1B were obtained. The first adhesive films 1A and 1B contain a cured product of a photocurable resin component, and the first adhesive film 1A further contains a thermosetting resin component.

<Preparation of second adhesive film (second adhesive layer)>
The materials shown in Table 2 were mixed at the composition ratio shown in Table 2 (the numerical value in Table 2 means the amount of non-volatile content), and then the base material was subjected to the mold release treatment, and was subjected to the mold release treatment having a thickness of 50 μm. A second adhesive film (second adhesive layer) 2A to 2G was obtained by coating on a PET (polyethylene terephthalate) film and drying an organic solvent or the like. The thickness of the second adhesive films 2A to 2G after drying was 8 μm.

<Third adhesive film (third adhesive layer)>
The materials shown in Table 3 were mixed at the composition ratio shown in Table 3 (the numerical values in Table 3 mean the amount of non-volatile content), and then the base material was subjected to the mold release treatment, which was a mold release treatment having a thickness of 50 μm. A third adhesive film 3A was obtained by coating on a PET (polyethylene terephthalate) film and drying an organic solvent or the like. The thickness of the third adhesive film 3A after drying was 1 μm.

(Examples 1 to 6 and Comparative Examples 1 and 2)
[Preparation of adhesive film]
Using the first adhesive film, the second adhesive film, and the third adhesive film prepared above, an adhesive film having the constitution shown in Table 4 was prepared. First, the first adhesive film and the second adhesive film were bonded together with a hot roll laminator heated to 50 ° C. Next, the base material (release PET film) of the first adhesive film was peeled off, and the first adhesive film and the third adhesive film were bonded together with a hot roll laminator heated to 50 ° C. in Examples. Adhesive films 1 to 6 and Comparative Examples 1 and 2 were obtained.

[Evaluation of ease of peeling of base material]
The adhesive films of Examples 1 to 6 and Comparative Examples 1 and 2 were cut out to a size of 2.0 mm × 25 mm. The base material (release PET film) of the third adhesive layer of the cut-out adhesive film is peeled off, and the third adhesive layer side is placed on a polyimide substrate at 60 ° C. and 0.98 MPa (10 kgf / cm ² ). A sample for measurement was prepared by heating and pressurizing for 1 second under the conditions and pasting. The adhesion between the second adhesive layer of the measurement sample and the substrate was determined by peeling the substrate with a Tensilon universal material tester at a speed of 50 mm / min. When the adhesive force is less than 10 N / m, when the adhesive film is attached to the polyimide substrate, the adhesive film and the polyimide substrate have sufficient adhesion and the substrate can be easily peeled off. , The case where the adhesion is 10 N / m or more was evaluated as "B". When the adhesion is 10 N / m or more, the adhesive film may be peeled off from the polyimide substrate when the base material (release PET film) is peeled off. The results are shown in Table 4.

[Evaluation of connection resistance and evaluation of connection reliability]
(Preparation of circuit members)
As the first circuit member, Ti (50 nm) / Al (400 nm) / Ti (50 nm) is formed on the surface of a polyimide substrate (200EN, manufactured by Toray DuPont Co., Ltd., outer shape: 38 mm × 28 mm, thickness: 0.05 mm). A wiring pattern (pattern width: 19 μm, space between electrodes: 5 μm) was prepared. As the second circuit member, an IC chip in which bump electrodes are arranged in a staggered pattern in two rows (outer shape: 0.9 mm × 20.3 mm, thickness: 0.3 mm, bump electrode size: 1200 μm ² , between bump electrodes) Space: 12 μm, bump electrode thickness: 8 μm) was prepared.

(Making a circuit connection structure)
Circuit connection structures were produced using the adhesive films of Examples 1 to 6 and Comparative Examples 1 and 2. The adhesive film used was cut out to a size of 2.0 mm × 25 mm. The adhesive film was placed on the first circuit member so that the third adhesive layer of the adhesive film and the first circuit member were in contact with each other. Using a thermocompression bonding device (BS-17U, manufactured by Ohashi Seisakusho Co., Ltd.) consisting of a stage consisting of a ceramic heater and a tool (8 mm x 50 mm), under the conditions of 60 ° C. and 0.98 MPa (10 kgf / cm ² ). The adhesive film was attached to the first circuit member by heating and pressurizing for 1 second, and the release film on the opposite side of the adhesive film from the first circuit member was peeled off. Next, after aligning the bump electrode of the first circuit member with the circuit electrode of the second circuit member, the measured maximum reached temperature of the adhesive film is 170 ° C., and the area conversion pressure of the bump electrode is 20 MPa or 40 MPa. The second adhesive layer of the adhesive film was attached to the second circuit member by heating and pressurizing for 5 seconds under two kinds of conditions to prepare a circuit connection structure.

(Evaluation of connection resistance)
The evaluation of the connection resistance was carried out by the four-terminal measurement method, and the evaluation was made using the average value of the connection resistance values measured at 14 points. A multimeter (MLR21, manufactured by Kusumoto Kasei Co., Ltd.) was used for the measurement. When the connection resistance value was less than 1.0Ω, it was evaluated as “A”, and when the connection resistance value was 1.0Ω or more, it was evaluated as “B”. The results are shown in Table 4.

(Evaluation of connection reliability)
A reliability test was conducted by placing the circuit connection structure mounted under the condition of an area conversion pressure of 40 MPa on the bump electrode in a constant temperature and humidity chamber of 85% RH at 85 ° C. and leaving it to stand for 100 hours. After 100 hours, the circuit connection structure was taken out and the peelability was evaluated. The peelability was evaluated from the surface opposite to the surface on which the second adhesive layer of the polyimide substrate (first circuit member) of the circuit connection structure was mounted, between the adhesive film and the polyimide substrate. It was observed whether or not the peeling and the peeling between the adhesive film and the IC chip (second circuit member) occurred. The case where no peeling was observed was evaluated as "A" as having excellent reliability, and the case where peeling was observed was evaluated as "B". The results are shown in Table 4.

As shown in Table 4, the circuit connection adhesive films of Examples 1 to 6 have connection resistance and connection reliability even when applied to COP mounting, as compared with the circuit connection adhesive films of Comparative Examples 1 and 2. It was excellent in terms of sex. Further, the circuit connection adhesive films of Examples 1 to 6 are easy to peel off when the base material (for example, PET film) is peeled off from the circuit connection adhesive film when applied to COP mounting. Also turned out to be excellent. From these results, it was confirmed that the adhesive film for circuit connection of the present disclosure can form a circuit connection structure having excellent connection resistance and connection reliability even when applied to COP mounting. ..

1 ... 1st region, 2 ... 2nd region, 4 ... Conductive particles, 10 ... Circuit connection adhesive film (adhesive film), 11 ... 1st circuit board, 12 ... 1st electrode (circuit electrode) ), 13 ... 1st circuit member, 14 ... 2nd circuit board, 15 ... 2nd electrode (bump electrode), 16 ... 2nd circuit member, 17 ... circuit connection part, 18 ... 1st cured product Region, 19 ... Second cured product region, 20 ... Circuit connection structure.

Claims

A first region containing conductive particles and a first adhesive component,
A second region containing a second adhesive component, which is provided adjacent to the first region, and a second region.
Equipped with
At least one of the first adhesive component and the second adhesive component contains a monofunctional oxetane compound.
Adhesive film for circuit connection.
The second adhesive component comprises a monofunctional oxetane compound.
The adhesive film for circuit connection according to claim 1.
The first adhesive component contains a cured product of a photocurable resin component.
The adhesive film for circuit connection according to claim 1 or 2.
The first adhesive component further contains a thermosetting resin component.
The adhesive film for circuit connection according to claim 3.
The conductive particles contain at least one metal selected from the group consisting of gold, palladium, and nickel.
The adhesive film for circuit connection according to any one of claims 1 to 4.
Contains an adhesive component containing a monofunctional oxetane compound,
Material for circuit connection.
Further containing conductive particles,
The circuit connection material according to claim 6.
The circuit connection adhesive film according to any one of claims 1 to 5, or the circuit connection adhesive film according to any one of claims 1 to 5, between a first circuit member having a first electrode and a second circuit member having a second electrode. The circuit connection material according to claim 6 or 7 is interposed, and the first circuit member and the second circuit member are thermally crimped so that the first electrode and the second electrode are electrically connected to each other. Equipped with a process of connecting
A method for manufacturing a circuit connection structure.
A first circuit member having a first electrode and
A second circuit member having a second electrode and
A circuit connection portion that is arranged between the first circuit member and the second circuit member and electrically connects the first electrode and the second electrode to each other.
Equipped with
The circuit connection portion includes a cured product of the circuit connection adhesive film according to any one of claims 1 to 5, or a cured product of the circuit connection material according to claim 6 or 7.
Circuit connection structure.