WO2022074738A1 - 研磨システム - Google Patents

研磨システム Download PDF

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Publication number
WO2022074738A1
WO2022074738A1 PCT/JP2020/037882 JP2020037882W WO2022074738A1 WO 2022074738 A1 WO2022074738 A1 WO 2022074738A1 JP 2020037882 W JP2020037882 W JP 2020037882W WO 2022074738 A1 WO2022074738 A1 WO 2022074738A1
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WO
WIPO (PCT)
Prior art keywords
polishing
axis
axis direction
polished
holder
Prior art date
Application number
PCT/JP2020/037882
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
健司 湯浅
孝之 五十嵐
Original Assignee
ユアサ化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ユアサ化成株式会社 filed Critical ユアサ化成株式会社
Priority to JP2020555074A priority Critical patent/JPWO2022074738A1/ja
Priority to PCT/JP2020/037882 priority patent/WO2022074738A1/ja
Priority to JP2021101649A priority patent/JP6999205B1/ja
Priority to PCT/JP2021/036597 priority patent/WO2022075251A1/ja
Publication of WO2022074738A1 publication Critical patent/WO2022074738A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders

Definitions

  • the present invention relates to a technique for polishing the surface of an object.
  • the object As a device for polishing the surface of an object, the object is set in a recess provided on a disk-shaped plate, and a disk-shaped plate with a polishing cloth attached to the surface is placed so as to be sandwiched between them.
  • a device having a structure for rotating at least one of the plates hereinafter referred to as “disk rotary polishing device”.
  • Patent Document 1 a plurality of disk-shaped carriers, each of which rotates on its own surface plate, are provided on the lower surface plate of the upper and lower surface plates to which a polishing cloth is attached to each surface, and each carrier is provided with a plurality of disk-shaped carriers.
  • Carrier holes which are multiple thin columnar dents, were provided, and disk-shaped wafers attached to both sides of a disk-shaped thin plate were set in each carrier hole, and they were sandwiched from above by the upper surface plate.
  • a device for simultaneously polishing the surfaces of a large number of wafers by rotating each of the two surface plates and simultaneously rotating each carrier in the state is described.
  • the present invention presents a holding means for holding the object to be polished in the three-dimensional space of the Cartesian coordinate system, and a polishing means for polishing the object to be polished held by the holding means in the three-dimensional space.
  • a polishing system including the holding means and the x-axis direction moving means for moving at least one of the abrasive surfaces of the polishing means in the x-axis direction is proposed.
  • polishing system only a part of the surface of the object to be polished that forms a flat surface can be polished, and a small number of objects to be polished can be polished.
  • the second aspect of the polishing system according to the first aspect is to include the x-axis direction movement control means for controlling the moving distance of at least one of the holding means by the x-axis direction moving means and the abrasive surface of the polishing means. It may be adopted as an aspect of.
  • the depth of the dent generated in the object to be polished by polishing can be controlled.
  • a configuration including a y-axis direction moving means for moving at least one of the holding means and the abrasive surface of the polishing means in the y-axis direction is adopted as the third aspect. May be done.
  • polishing system it is possible to polish a region extending in the y-axis direction on the surface of the object to be polished.
  • the fourth aspect of the polishing system according to the third aspect is to include a y-axis direction movement control means for controlling the movement distance of at least one of the holding means by the y-axis direction movement means and the abrasive surface of the polishing means. It may be adopted as an aspect of.
  • the length of the area to be polished of the object to be polished can be controlled in the y-axis direction.
  • a configuration including a z-axis direction moving means for moving at least one of the holding means and the polishing surface of the polishing means in the z-axis direction is adopted as the fifth aspect. May be done.
  • a region extending in the z-axis direction on the surface of the object to be polished can be polished.
  • the sixth aspect of the polishing system according to the fifth aspect is to include a z-axis direction movement control means for controlling the moving distance of at least one of the holding means by the z-axis direction moving means and the abrasive surface of the polishing means. It may be adopted as an aspect of.
  • the length of the area to be polished of the object to be polished can be controlled in the z-axis direction.
  • the configuration of including the x-axis rotating means for rotating the holding means around the x-axis may be adopted as the seventh aspect.
  • polishing system it is possible to polish a region on an arc centered on the x-axis of a surface perpendicular to the x-axis of the object to be polished.
  • the configuration of including the x-axis rotation control means for controlling the rotation angle of the holding means by the x-axis rotation means may be adopted as the eighth aspect.
  • polishing system it is possible to control the range of the region on the arc to be polished of the object to be polished.
  • the configuration of including the y-axis rotating means for rotating the holding means around the y-axis may be adopted as the ninth aspect.
  • each of the plurality of surfaces can be polished.
  • the surface can be polished.
  • a configuration including a y-axis rotation control means for controlling the rotation angle of the holding means by the y-axis rotation means may be adopted as the tenth aspect.
  • the surface to be polished when the object to be polished has a plurality of surfaces parallel to the y-axis, the surface to be polished can be selected from the plurality of surfaces. Further, according to the polishing system according to the tenth aspect, when the object to be polished has a cylindrical surface centered on the y-axis, the region of the surface to be polished can be controlled.
  • the configuration of including the z-axis rotating means for rotating the holding means around the z-axis may be adopted as the eleventh aspect.
  • each of the plurality of surfaces can be polished.
  • the surface can be polished.
  • a configuration including a z-axis rotation control means for controlling the rotation angle of the holding means by the z-axis rotation means may be adopted as the twelfth aspect.
  • the surface to be polished when the object to be polished has a plurality of surfaces parallel to the z-axis, the surface to be polished can be selected from the plurality of surfaces. Further, according to the polishing system according to the twelfth aspect, when the object to be polished has a cylindrical surface centered on the z-axis, the region of the surface to be polished can be controlled.
  • the polishing means when used as the first polishing means, the polishing means is arranged at a position facing each other across the polishing object held by the holding means, and the polishing is performed.
  • a configuration in which a second polishing means for polishing an object is provided may be adopted as the thirteenth aspect.
  • two surfaces facing each other in the x-axis direction of the object to be polished can be polished at the same time.
  • the holding means has a holding member having a predetermined outer shape, and has an inner concave portion having play added to the outer shape of the holding member.
  • a configuration in which the object to be polished is held in a state where the holding member is housed in the recess may be adopted as the fourteenth aspect.
  • polishing system it is possible to polish an object to be polished having a hollow portion in a state of being easily and safely held.
  • the holding means holds a bottomed square cell having an open end surface for accommodating a test sample to be inspected by photometry by an analyzer as a polishing object, and the polishing means. May adopt the configuration of polishing the photometric region on the outer surface of the square cell held by the holding means as the fifteenth aspect.
  • the photometric region of the square cell can be polished.
  • the 16th configuration comprises a gas discharge mechanism for discharging gas from the holding member to the recess in a state where the holding member is housed in the recess of the object to be polished. It may be adopted as an aspect of.
  • polishing system According to the polishing system according to the sixteenth aspect, it is difficult for polishing debris generated by polishing to enter the recesses of the object to be polished.
  • the holding means simultaneously holds a plurality of polishing objects, and the outer surface including the area to be polished of the plurality of polishing objects is substantially one.
  • a configuration in which the surface is held so as to form a surface may be adopted as the seventeenth aspect.
  • the surfaces of a plurality of objects to be polished can be polished at the same time.
  • the polishing target when the polishing means is used as the first polishing means, the polishing target is arranged at a predetermined distance in the y-axis direction from the first polishing means and is held by the holding means.
  • the y-axis direction in which at least one of the second polishing means for polishing an object, the holding means, and the first polishing means and the second polishing means arranged at predetermined intervals is moved in the y-axis direction.
  • a configuration including a means of transportation may be adopted as the eighteenth aspect.
  • the surface of the same object to be polished perpendicular to the x-axis can be roughly polished by the first polishing means and then finely polished by the second polishing means.
  • the polishing means is a sheet transporting means for transporting a strip-shaped sheet constituting an abrasive surface and a sheet to be polished by the sheet transporting means.
  • the configuration of having a pressing means for pressing against the surface may be adopted as the nineteenth aspect.
  • the polishing system since the abrasive surface is constantly changing, spots are less likely to occur in the area to be polished.
  • only a part of the surface of the object to be polished that forms a flat surface can be polished, and a small number of objects to be polished can be polished.
  • the figure which showed the square cell after polishing by the polishing system which concerns on one Embodiment The figure which showed the whole structure of the polishing system which concerns on one Embodiment.
  • the figure which showed typically the state which the square cell was set in the holder which concerns on one Embodiment.
  • the figure which showed the z-axis moving rotation apparatus and a plurality of holders which concerns on one modification A schematic view of the polishing system according to a modified example from above.
  • the polishing system 1 is a device for polishing a square cell.
  • a square cell is a bottomed corner in which one end surface made of a light-transmitting material, which accommodates a test sample to be inspected by photometry by an analyzer, is opened and the end surface facing the one end surface is closed. It means a tubular container.
  • the material of the square cell is glass.
  • FIG. 1 is a diagram showing a square cell 9 which is an object (polishing object) after being polished by the polishing system 1.
  • the square cell 9 is a bottomed square tube-shaped container in which the upper surface of the two surfaces perpendicular to the z-axis is open and the lower surface is closed.
  • the lower region 91 and the region 92 in the z-axis direction of the two surfaces perpendicular to the x-axis are recessed by a predetermined depth in the x-axis direction.
  • This dent is a dent formed by polishing of the polishing system 1.
  • the area 91 and the area 92 are areas including a photometric area. Therefore, the surfaces of the region 91 and the region 92 are mirror-polished.
  • FIG. 2 is a diagram showing the overall configuration of the polishing system 1.
  • the components included in the polishing system 1 are managed in the three-dimensional space of the Cartesian coordinate system.
  • the polishing system 1 is a polishing device 11 (1), a polishing device 11 (2), a polishing device 11 (3), an x-axis direction moving device 12 (1), an x-axis direction moving device 12 (2), x-axis direction moving device 12 (3), holder 13 (1), holder 13 (2), ..., Holder 13 (n), z-axis moving rotating device 14 (1), z-axis moving rotating device 14 (2) ), ..., Z-axis movement rotation device 14 (n), y-axis direction movement device 15, x-axis direction movement control device (not shown), z-axis direction movement control device (not shown), z-axis rotation control A device (not shown), a y-axis direction movement control device (not shown), and a controller (not shown) are provided. Note that FIG. 2 shows only three of the n holders 13
  • FIG. 3 is a diagram schematically showing the main configuration of the polishing apparatus 11.
  • the polishing device 11 includes a sheet unwinding reel 111, a sheet winding reel 112, a pressing roller 113, and a sheet 114 as main components.
  • the sheet 114 is a strip-shaped sheet coated with abrasive powder on one surface.
  • the surface of the sheet 114 to which the abrasive powder is applied is the surface on the side that does not come into contact with the pressing roller 113.
  • the sheet unwinding reel 111 is a reel that unwinds an unused sheet 114 that has been prewound in advance while rotating it clockwise in FIG.
  • the sheet take-up reel 112 is a reel that winds up the used sheet 114 while rotating it clockwise in FIG.
  • the sheet unwinding reel 111 and the sheet winding reel 112 constitute a sheet transporting means for transporting the sheet 114.
  • the transport speed of the sheet 114 by the sheet unwinding reel 111 and the sheet winding reel 112 is controlled by a control device (not shown).
  • the pressing roller 113 is a pressing means for pressing the surface coated with the abrasive powder against the square cell 9 to be polished, with the sheet 114 conveyed by the rotation of the sheet unwinding reel 111 and the sheet winding reel 112. Play a role.
  • the polishing device 11 is moved in the x-axis direction by the x-axis direction moving device 12. As the polishing device 11 moves in the positive direction on the x-axis, the pressing roller 113 is pressed against the square cell 9 held in the holder 13 with the sheet 114 sandwiched between them. As a result, the sheet is pressed against the square cell 9 by the pressing roller 113.
  • the polishing device 11 provides an urging mechanism for urging the pressing roller 113 in the positive direction of the x-axis.
  • the control device may control the strength of the urging by the urging mechanism.
  • the urging mechanism include a mechanism for pushing out the pressing roller 113 by a hydraulic cylinder, a mechanism for pushing out the pressing roller 113 by the pressure of the air to be pumped, and the like.
  • the x-axis direction moving device 12 (1), the x-axis direction moving device 12 (2), and the x-axis direction moving device 12 (3) have a common configuration.
  • x-axis direction moving device 12 uses the grind surface of the corresponding polishing device 11 under the control of the x-axis direction moving control device by a specified distance in the specified direction of the x-axis. It is a device to move.
  • Holder 13 (1), holder 13 (2), ..., Holder 13 (n) has a common configuration.
  • holder 13 an example of a holding means and a holding member
  • the outer shape on the tip end side of the holder 13 is an outer shape in which the play required for attaching / detaching the square cell 9 is reduced from the shape of the concave portion of the square cell 9.
  • the inner shape of the concave portion of the square cell 9 is a shape in which play is added to the outer shape on the tip end side of the holder 13.
  • FIG. 4 is a diagram schematically showing a state in which the square cell 9 is set in the holder 13. As shown in FIG. 4, the holder 13 holds the square cell 9 in a state of being housed in the recess of the square cell 9.
  • the z-axis moving and rotating device 14 (1), the z-axis moving and rotating device 14 (2), ..., The z-axis moving and rotating device 14 (n) have a common configuration.
  • z-axis moving rotating device 14 when these z-axis rotating devices are not distinguished from each other, they are collectively referred to as "z-axis moving rotating device 14".
  • the z-axis moving rotation device 14 (an example of a z-axis rotating means and a z-axis rotating means) has two functions.
  • the z-axis movement rotation device 14 moves the corresponding holder 13 in the specified direction of the z-axis by a specified distance under the control of the z-axis direction movement control device.
  • the z-axis moving rotation device 14 rotates the corresponding holder 13 around the z-axis by a designated angle in a designated direction under the control of the z-axis rotation control device.
  • the y-axis direction movement device 15 is a device that moves the holder 13 and the z-axis movement rotation device 14 by a specified distance in a specified direction of the y-axis under the control of the y-axis direction movement control device.
  • the x-axis direction movement control device (an example of the x-axis direction movement control means) is built in, for example, the x-axis direction movement device 12, and is a distance specified by the user or the program in the direction of the x-axis specified by the user or the program. However, it is a device that controls the operation of the x-axis direction moving device 12 so that the x-axis direction moving device 12 moves the abrasive surface of the polishing device 11.
  • the z-axis direction movement control device (an example of the z-axis direction movement control means) is built in, for example, the z-axis movement rotation device 14, and is a distance specified by the user or the program in the z-axis direction specified by the user or the program. However, it is a device that controls the operation of the z-axis moving / rotating device 14 so that the z-axis moving / rotating device 14 moves the holder 13.
  • the z-axis rotation control device (an example of the z-axis rotation control means) is built in, for example, the z-axis movement rotation device 14, and is designated by the user or the program in the direction around the z-axis specified by the user or the program. It is a device that controls the operation of the z-axis moving rotation device 14 so that the z-axis moving rotation device 14 rotates the holder 13 by an angle.
  • the y-axis direction movement control device (an example of the y-axis direction movement control means) is built in, for example, the y-axis direction movement device 15, and is a distance specified by the user or the program in the direction of the y-axis specified by the user or the program. However, it is a device that controls the operation of the y-axis direction moving device 15 so that the y-axis direction moving device 15 moves the holder 13.
  • the controller is equipped with a man-machine interface such as a touch panel, and is a device that accepts various operations from the user to the polishing system 1 and displays various information from the polishing system 1 to the user.
  • the controller is communication-connected to the polishing device 11, the x-axis direction movement control device, the z-axis direction movement control device, the z-axis rotation control device, and the y-axis direction movement control device, and is connected to the state of the polishing system 1 (for example, polishing).
  • the user's instruction for example, the start and end of the operation of the polishing device 11 and the holder 13
  • the user's instruction for example, the start and end of the operation of the polishing device 11 and the holder 13
  • It accepts movement in the x-axis direction, y-axis direction or z-axis direction, rotation of the holder 13 around the z-axis, etc.) and transmits the accepted instruction to the device corresponding to the instruction.
  • a sheet 114 coated with fine abrasive powder is set in the polishing device 11 (1)
  • a sheet 114 coated with ultrafine abrasive powder is set in the polishing device 11 (2)
  • the polishing device 11 (3) is set.
  • the grain roughness of the sheet 114 set in the polishing devices 11 (1) to (3) is a roughness for polishing the polished surface of the object to be polished to a mirror surface.
  • the polishing device 11 is in the reference position in the x-axis direction.
  • This reference position is a position where the pressing roller 113 is separated from the surface of the square cell 9 set in the holder 13 by a predetermined distance.
  • the holder 13 is at a reference position in the z-axis direction and around the z-axis.
  • This reference position is an angle at which the region 91 of the square cell 9 set in the holder 13 faces the pressing roller 113, and the upper end of the region 91 is a position at a height where the front position of the pressing roller 113 is reached. ..
  • the holder 13 (1) is located in front of the pressing roller 113 of the polishing device 11 (1).
  • the user inputs m, which is the number of square cells 9 to be polished, to the controller, and then gives an instruction to start polishing. According to this instruction, first, the polishing device 11 (1) starts operation.
  • the polishing device 11 (1) moves from the reference position in the x-axis direction by a predetermined distance in the positive direction of the x-axis.
  • This predetermined distance is a distance for the pressing roller 113 to come into contact with the square cell 9 set in the holder 13 (1) and further polish the region 91 of the square cell 9 to a predetermined depth with fine abrasive powder.
  • the sheet 114 of the polishing device 11 (1) is pressed against the upper end of the region 91 of the square cell 9 set in the holder 13 (1), and polishing is started.
  • the holder 13 (1) slowly starts moving in the positive direction of the z-axis. Along with this movement, polishing proceeds downward from the upper end position of the region 91 of the square cell 9.
  • the polishing device 11 (1) moves in the negative direction of the x-axis, returns to the reference position, and stops the operation.
  • This predetermined distance is the length of the region 91 of the square cell 9 in the z-axis direction.
  • the holder 13 (1) moves in the negative direction of the z-axis and returns to the reference position. As a result, polishing of the region 91 of the square cell 9 set in the holder 13 (1) with the fine abrasive powder is completed.
  • the holder 13 and the z-axis moving rotation device 14 are placed so that the holder 13 (1) is in the front position of the polishing device 11 (2) and the holder 13 (2) is in the front position of the polishing device 11 (1). It moves in the positive direction of the y-axis.
  • the polishing device 11 (2) starts operation and polishes the region 91 of the square cell 9 to a predetermined depth with an ultra-fine abrasive powder in a predetermined distance in the positive direction of the x-axis from the reference position in the x-axis direction.
  • the sheet 114 of the polishing device 11 (2) is pressed against the square cell 9 set in the holder 13 (1) after moving by the distance
  • the holder 13 (1) slowly moves in the positive direction of the z-axis from the reference position. Start moving.
  • the polishing device 11 (1) starts operation, moves from the reference position in the x-axis direction by a predetermined distance in the positive direction of the x-axis, and polishes.
  • the sheet 114 of the device 11 (1) is pressed against the square cell 9 set in the holder 13 (2), the holder 13 (2) slowly starts moving in the positive direction of the z-axis from the reference position.
  • the polishing device 11 (2) moves in the negative direction of the x-axis, returns to the reference position, and stops the operation. Subsequently, the holder 13 (1) moves in the negative direction of the z-axis and returns to the reference position. As a result, polishing of the region 91 of the square cell 9 set in the holder 13 (1) with the ultrafine abrasive powder is completed.
  • the polishing device 11 (1) moves in the negative direction of the x-axis, returns to the reference position, and stops the operation. Subsequently, the holder 13 (2) moves in the negative direction of the z-axis and returns to the reference position. As a result, polishing of the region 91 of the square cell 9 set in the holder 13 (2) with the fine abrasive powder is completed.
  • the holder 13 (1) becomes the front position of the polishing device 11 (3)
  • the holder 13 (2) becomes the front position of the polishing device 11 (2)
  • the holder 13 (1) becomes the front position of the polishing device 11 (3).
  • the holder 13 and the z-axis moving rotary device 14 move in the positive direction of the y-axis so as to be in the front position.
  • the polishing device 11 (3) starts operation to polish the region 91 of the square cell 9 to a predetermined depth with an ultrafine abrasive powder at a predetermined distance in the positive direction of the x-axis from the reference position in the x-axis direction.
  • the sheet 114 of the polishing device 11 (3) is pressed against the square cell 9 set in the holder 13 (1) after moving by the distance
  • the holder 13 (1) slowly moves in the positive direction of the z-axis from the reference position. Start moving.
  • the polishing device 11 (2) starts operation, moves from the reference position in the x-axis direction by a predetermined distance in the positive direction of the x-axis, and polishes.
  • the sheet 114 of the device 11 (2) is pressed against the square cell 9 set in the holder 13 (2), the holder 13 (2) slowly starts moving in the positive direction of the z-axis from the reference position.
  • the polishing device 11 (1) starts operation and moves from the reference position in the x-axis direction by a predetermined distance in the positive direction of the x-axis.
  • the holder 13 (3) slowly starts moving in the positive direction of the z-axis from the reference position.
  • the polishing device 11 (3) moves in the negative direction of the x-axis, returns to the reference position, and stops the operation. Subsequently, the holder 13 (1) moves in the negative direction of the z-axis and returns to the reference position. This completes the polishing of the ultrafine particles of the region 91 of the square cell 9 set in the holder 13 (1) with the abrasive powder.
  • the polishing device 11 (2) moves in the negative direction of the x-axis, returns to the reference position, and stops the operation. Subsequently, the holder 13 (2) moves in the negative direction of the z-axis and returns to the reference position. As a result, polishing of the region 91 of the square cell 9 set in the holder 13 (2) with the ultrafine abrasive powder is completed.
  • the polishing device 11 (1) moves in the negative direction of the x-axis, returns to the reference position, and stops the operation. Subsequently, the holder 13 (3) moves in the negative direction of the z-axis and returns to the reference position. As a result, polishing of the region 91 of the square cell 9 set in the holder 13 (3) with the fine abrasive powder is completed.
  • the holder 13 (1) When the polishing with the fine abrasive powder is completed in the region 91 of the square cell 9 set in the holder 13 (m), the holder 13 (1) is in the front position of the pressing roller 113 of the polishing device 11 (1). 13 and the z-axis moving rotary device 14 move in the y-axis negative direction.
  • the holder 13 and the z-axis moving rotation device 14 are repeatedly moved in the positive y-axis direction, and the three polishing devices 11 are repeatedly polishing the region 92 of the square cell 9. This completes the polishing of the regions 91 and 92 for the m square cells 9.
  • polishing system 1 only a part (region 91 or region 92) of the surface of the square cell 9 forming a flat surface can be polished. Further, according to the polishing system 1, even a small number of square cells 9 such as one or two can be polished without degrading the accuracy.
  • FIG. 5 is a diagram showing the structure of the holder 13 according to this modified example.
  • 5 (A) is an external view of the holder 13
  • FIG. 5 (B) is a cross-sectional view of the holder 13
  • FIG. 5 (C) is a view showing a state in which the square cell 9 is set.
  • the holder 13 is provided with one or more discharge ports 131 in a portion covered with the square cell 9.
  • the discharge port 131 communicates with a ventilation path 132 extending in the longitudinal direction (z-axis direction) of the holder 13.
  • the ventilation path 132 is connected to a pump (not shown) for discharging air, and the air sent from the pump is discharged from the discharge port 131.
  • the pump, the ventilation path 132, and the discharge port 131 constitute a gas discharge mechanism.
  • the holder 13 has one or more ring-shaped sealing members 133 so as to go around the side surface.
  • the sealing member 133 is, for example, a rubber ring. Therefore, in a state where the square cell 9 is set in the holder 13, it is difficult for polishing debris to enter the inside of the square cell 9.
  • the sealing member 133 may not be provided. In that case, since air is discharged from the gap between the opening of the square cell 9 and the holder 13, it is difficult for the polishing debris to enter the inside of the square cell 9 in the same manner.
  • the sealing member 133 also plays a role in which the holder 13 firmly holds the square cell 9.
  • FIG. 6 is a diagram showing the positional relationship between the two polishing devices 11 and the holder 13 included in the polishing system 1 according to this modification. According to the polishing system 1 according to this modification, the region 91 and the region 92 of the square cell 9 can be polished at the same time.
  • FIG. 7 is a diagram showing a z-axis moving rotation device 14 and a plurality of holders 13 according to this modification.
  • the number of holders 13 arranged in one z-axis moving rotation device 14 is 9, but this number may be any as long as it is 2 or more.
  • one polishing device 11 can simultaneously polish a plurality of square cells 9.
  • the polishing target of the polishing system 1 is a square cell 9, but the polishing target of the polishing system according to the present invention is not limited to the square cell.
  • the holder 13 holds the object to be polished while being housed in the recess of the object to be polished.
  • the method in which the holder (holding means) provided in the polishing system according to the present invention holds the object to be polished is not limited to this.
  • a holder that holds the object to be polished by gripping may be adopted.
  • the polishing device 11 included in the polishing system 1 is a polishing device having a structure in which a sheet coated with abrasive powder on one surface is conveyed and the sheet is pressed against an object to be polished.
  • the structure of the polishing device (polishing means) provided in the polishing system according to the present invention is not limited to this.
  • a polishing device having a structure in which a rotating polishing bit is pressed against an object to be polished may be adopted.
  • the x-axis direction moving device 12 is assumed to move the entire polishing device 11 in the x-axis direction in order to move the abrasive surface of the polishing device 11 in the x-axis direction.
  • the x-axis direction moving device 12 may move the abrasive surface of the polishing device 11 in the x-axis direction, and does not necessarily have to move the entire polishing device 11.
  • the main body of the polishing device 11 may not move in the x-axis direction, and the x-axis direction moving device 12 may be configured to move the pressing roller 113 of the polishing device 11 in the x-axis direction.
  • the positional relationship between the holder 13 and the polishing surface of the polishing device 11 in the x-axis direction is changed by the movement of the polishing device 11.
  • the positional relationship between the holder 13 and the abrasive surface of the polishing device 11 in the x-axis direction may be changed.
  • the polishing system 1 according to this modification includes an x-axis direction moving means for moving the holder 13 in the x-axis direction, and an x-axis direction moving control means for controlling the moving direction and distance by the x-axis direction moving means. It is composed of.
  • the positional relationship between the holder 13 and the abrasive surface of the polishing device 11 in the y-axis direction is changed by the movement of the holder 13.
  • the positional relationship between the holder 13 and the abrasive surface of the polishing device 11 in the y-axis direction may be changed by moving the abrasive surface of the polishing device 11 in the y-axis direction.
  • the polishing system 1 according to this modification is, for example, a y-axis direction moving means for moving the entire polishing device 11 or the pressing roller 113 in the y-axis direction, and y for controlling the moving direction and distance by the y-axis direction moving means. It is configured to include axial movement control means.
  • the positional relationship between the holder 13 and the abrasive surface of the polishing device 11 in the z-axis direction is changed by the movement of the holder 13.
  • the positional relationship between the holder 13 and the polishing device 11 in the z-axis direction may be changed by moving the polishing surface of the polishing device 11 in the z-axis direction.
  • the polishing system 1 according to this modification is, for example, a z-axis direction moving means for moving the entire polishing device 11 or the pressing roller 113 in the z-axis direction, and z for controlling the moving direction and distance by the z-axis direction moving means. It is configured to include axial movement control means.
  • the holder 13 may be rotatable about the x-axis.
  • the polishing system 1 includes an x-axis rotation means for rotating the holder 13 around the x-axis and an x-axis rotation control means for controlling the rotation direction and angle of the holder 13 by the x-axis rotation means. It is configured as follows.
  • the holder 13 may be able to rotate around the y-axis.
  • the polishing system 1 includes a y-axis rotation means for rotating the holder 13 around the y-axis and a y-axis rotation control means for controlling the rotation direction and angle of the holder 13 by the y-axis rotation means. It is configured as follows.
  • FIG. 8 is a schematic view of the polishing system 1 according to this modified example as viewed from above.
  • the y-axis direction moving device 15 conveys the holder 13 and the z-axis moving rotating device 14 along the annular movement path.
  • the abrasive powder When the abrasive powder is applied to the sheet 114, it may be applied by dripping a liquid such as water or oil on the outer surface of the sheet 114 to be conveyed. As a result, heat generation due to polishing can be reduced and the polished surface can be smoothed.
  • the operation of the polishing system 1 described above is an example and may be changed in various ways.
  • the z-axis moving rotation device 14 moves the square cell 9 held by the holder 13 only once in the z-axis positive direction.
  • the moving rotation device 14 may reciprocate the square cell 9 once or a plurality of times in the z-axis positive direction and the z-axis negative direction.
  • the square cell 9 is moved in the z-axis direction by the z-axis moving rotation device 14, and at the same time, the square cell 9 is reciprocated in the y-axis direction by the y-axis direction moving device 15. May be good.
  • the abrasive surface moves in the y-axis direction by the y-axis direction moving device 15, so that all of the plurality of square cells 9 can be polished.
  • the polished surface of the object to be polished is polished by three abrasive surfaces having different grain roughness: fine, ultrafine, and ultrafine particles.
  • the surface roughness and the number of types of roughness are not limited to those described in the embodiments.
  • polishing system 1 in order to perform polishing by three polishing surfaces having different grain roughness, three polishing devices 11 are arranged side by side in the y-axis direction, and the three polishing devices 11 are arranged. Sheets 114 having different grain roughness were set in each, and the object to be polished was polished by these three polishing devices 11.
  • a fine sheet 114 is first set in one polishing device 11 to polish the object to be polished, and then the fine sheet 114 set in the polishing device 11 is set to the ultrafine sheet 114. After that, the ultrafine sheet 114 set in the polishing apparatus 11 may be replaced with an ultrafine sheet 114 to polish the object to be polished.
  • polishing system 9 ... square cell, 11 ... polishing device, 12 ... x-axis direction moving device, 13 ... holder, 14 ... z-axis moving rotating device, 15 ... y-axis direction moving device, 91 ... region, 92 ... region , 111 ... Sheet unwinding reel, 112 ... Sheet take-up reel, 113 ... Pressing roller, 114 ... Sheet, 131 ... Discharge port, 132 ... Ventilation path 133 ... Sealing member.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
PCT/JP2020/037882 2020-10-06 2020-10-06 研磨システム WO2022074738A1 (ja)

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JP2020555074A JPWO2022074738A1 (enrdf_load_stackoverflow) 2020-10-06 2020-10-06
PCT/JP2020/037882 WO2022074738A1 (ja) 2020-10-06 2020-10-06 研磨システム
JP2021101649A JP6999205B1 (ja) 2020-10-06 2021-06-18 研磨システム
PCT/JP2021/036597 WO2022075251A1 (ja) 2020-10-06 2021-10-04 研磨システム

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000308951A (ja) * 1999-04-23 2000-11-07 Wada Kikai:Kk 両頭研削盤
JP2001025951A (ja) * 1999-07-13 2001-01-30 Sanritsu Seiki Kk 多軸式横型研磨機
JP2002292567A (ja) * 2001-03-29 2002-10-08 Showa Denko Kk 筒形ワークの表面加工装置および表面加工方法
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP2010115756A (ja) * 2008-11-14 2010-05-27 Okamoto Machine Tool Works Ltd 精密研削装置
JP2018099739A (ja) * 2016-12-19 2018-06-28 株式会社松田製作所 研磨装置
JP2018196924A (ja) * 2017-05-24 2018-12-13 トーヨーエイテック株式会社 加工装置及びそれを用いた加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5915839A (ja) * 1982-07-16 1984-01-26 Toshiba Corp 測定セルの製造方法
JPS60200147A (ja) * 1984-03-24 1985-10-09 Toshiba Corp 反応セルの製造方法
JPH09124329A (ja) * 1995-10-30 1997-05-13 Olympus Optical Co Ltd ガラスセルの製造方法
JPH10249720A (ja) * 1997-03-13 1998-09-22 Kobe Steel Ltd 平板状工作物のポリッシング加工方法
JP2015123528A (ja) * 2013-12-26 2015-07-06 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法、及び、ガラス基板の製造装置
JP2019084624A (ja) * 2017-11-07 2019-06-06 日本電気硝子株式会社 ガラス板の製造方法及び砥石の位置決め固定装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000308951A (ja) * 1999-04-23 2000-11-07 Wada Kikai:Kk 両頭研削盤
JP2001025951A (ja) * 1999-07-13 2001-01-30 Sanritsu Seiki Kk 多軸式横型研磨機
JP2002292567A (ja) * 2001-03-29 2002-10-08 Showa Denko Kk 筒形ワークの表面加工装置および表面加工方法
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP2010115756A (ja) * 2008-11-14 2010-05-27 Okamoto Machine Tool Works Ltd 精密研削装置
JP2018099739A (ja) * 2016-12-19 2018-06-28 株式会社松田製作所 研磨装置
JP2018196924A (ja) * 2017-05-24 2018-12-13 トーヨーエイテック株式会社 加工装置及びそれを用いた加工方法

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