WO2022068166A1 - 高可靠性的激光器芯片测试系统 - Google Patents

高可靠性的激光器芯片测试系统 Download PDF

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Publication number
WO2022068166A1
WO2022068166A1 PCT/CN2021/085490 CN2021085490W WO2022068166A1 WO 2022068166 A1 WO2022068166 A1 WO 2022068166A1 CN 2021085490 W CN2021085490 W CN 2021085490W WO 2022068166 A1 WO2022068166 A1 WO 2022068166A1
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Prior art keywords
plate
test
pcb board
intervals
frame
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PCT/CN2021/085490
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English (en)
French (fr)
Inventor
张文刚
徐鹏嵩
郭孝明
许�鹏
胡海洋
黄建军
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苏州联讯仪器有限公司
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Publication of WO2022068166A1 publication Critical patent/WO2022068166A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

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  • the invention relates to a high-reliability laser chip testing system, which belongs to the technical field of optical communication.
  • the purpose of the present invention is to provide a highly reliable laser chip testing system, which not only improves the testing efficiency, but also improves the tested precision, accuracy and data consistency.
  • the technical scheme adopted in the present invention is: a high-reliability laser chip testing system, including several workbenches mounted on a rack, a cooling plate arranged on each workbench, a plurality of a TEC module arranged at intervals on the upper surface of the cooling plate, a temperature equalizing plate whose lower surface is in contact with the TEC module, and a clamping jig that is movably installed on the workbench and located just above the temperature equalizing plate;
  • the clamping fixture includes a support plate, a test PCB board with several test seats welded at intervals, and a heat-conducting cover plate.
  • the support plate, the test PCB board, and the heat-conducting cover plate are stacked from bottom to top.
  • the pin end of the test board is electrically connected to the test seat on the test PCB board through the thermal conductive cover;
  • a plurality of bumps are arranged on the lower surface of the heat-conducting cover plate at intervals, and through holes corresponding to the bumps are opened on the test PCB board and the support plate, and a plurality of the bumps are respectively self-testing the PCB board, the support board, and the support plate. Pass through the through holes on the board and emerge from the bottom surface of the support board;
  • a frame is set on the outer sides of the test PCB board and the heat-conducting cover plate, and the left and right ends of the support plate are located directly below the frame.
  • a first groove of a support rod, the upper surface of the frame is provided with two second grooves corresponding to the first grooves on the left and right ends of the support plate, and a second support rod is embedded in the second grooves , the first support rod and the second support rod are connected by several springs arranged at intervals;
  • the left and right end surfaces of the frame are respectively provided with a protruding strip portion extending outward, and two first mounting seats are arranged at intervals on the working table, and the opposite surfaces of the two first mounting seats have a A groove for embedding the rib portion of the frame;
  • a light splitting component is also arranged above the clamping fixture.
  • the light splitting component includes a carrier board, a plurality of mounting seats mounted on the upper surface of the carrier board at intervals, and a plurality of PCB boards connected to the mounting seats.
  • the bottom of the carrier board is provided Light-emitting devices to be tested;
  • Each of the mounting bases is spaced with a number of first through holes that penetrate through the upper and lower sides, the carrier plate has a second through hole that penetrates through the first through holes, and the light-emitting device is located at the side of the second through holes.
  • the side surface of the mounting seat is provided with a number of mounting holes that pass through the first through hole at intervals, the PCB board is welded and connected to the side surface of the mounting seat, and a photoelectric conversion device is embedded in the mounting hole , and welded to the PCB board;
  • a half mirror is installed at the intersection of the first through hole and the installation hole, and an optical fiber flange connected with an optical fiber is installed on the upper end of the first through hole;
  • Two ends of the upper surface of the carrier plate are respectively provided with a pressing block, the bottom of the pressing block is mounted on the carrier plate, the upper part of the pressing block is used to connect with the driving mechanism, and the middle part of the pressing block is staggered with Several bar slots.
  • a handle portion is connected to the front end surface of the frame.
  • the edges of the left and right ends of the frame have a baffle portion extending downward.
  • the bottom surface of the support plate is higher than the bottom surface of the baffle portion.
  • the bottom surface of the support plate is flush with the bottom surface of the baffle plate and is in contact with the temperature equalizing plate.
  • a cylinder is installed on each of the two first mounting seats, and the piston rod of the cylinder is connected to the upper surface of the pressing block.
  • the present invention has the following advantages compared with the prior art:
  • the high-reliability laser chip testing system of the present invention realizes the aging and testing of multiple chips without moving the chips, and can measure a number of parameters before and after aging of the chips and during the aging process, which not only improves the performance of The test efficiency is improved, and the test accuracy, accuracy and data consistency are also improved; in addition, the left and right end surfaces of the frame are respectively provided with an outwardly extending ridge portion, and the front end surfaces of the frame are connected to each other.
  • the pull-out loading and unloading of the pallet is realized, which not only facilitates the loading and unloading operation, improves the test efficiency, but also protects the state stability of the device during the loading and unloading process. Thereby improving the accuracy of the test and the consistency of the test results.
  • the high-reliability laser chip testing system of the present invention is provided with a frame around the test PCB board and the heat-conducting cover plate, and the left and right ends of the support plate are located directly below the frame.
  • the lower surface of the right two ends is provided with a first groove embedded with a first support rod
  • the upper surface of the frame is provided with two second grooves corresponding to the first grooves at the left and right ends of the support plate, so A second support rod is embedded in the second groove, and the first support rod and the second support rod are connected by a number of springs arranged at intervals, so as to realize the test of the support board and the upper test PCB board and the heat conduction cover board.
  • the floating design can not only protect the pallet from being worn during long-term use, but also ensure the surface contact between the fixture and its upper and lower components, so that the device is heated more evenly and the test efficiency and accuracy are improved.
  • the middle of the pressing block is provided with a number of strip-shaped grooves in a staggered interval.
  • the setting of the strip-shaped grooves can buffer and balance the force of the driving mechanism to drive the carrier plate to press down, which can not only ensure the bottom surface of the carrier plate and the device fixture The surface contact between them can avoid light leakage of the device, ensure the consistency of the test, and avoid damage to the device due to excessive force, and further ensure the test accuracy and efficiency of the device.
  • FIG. 1 is a schematic structural diagram of the high-reliability laser chip testing system of the present invention.
  • FIG. 2 is a schematic diagram of the partial structure of the high-reliability laser chip testing system of the present invention.
  • FIG. 3 is a partial structural cross-sectional view of the high-reliability laser chip testing system of the present invention.
  • FIG. 4 is a schematic structural diagram of a fixture in the high-reliability laser chip testing system of the present invention.
  • FIG. 5 is a schematic exploded view of the partial structure of the fixture in the laser chip testing system of the present invention.
  • FIG. 6 is a partial structural cross-sectional view of the fixture in the high-reliability laser chip testing system of the present invention.
  • FIG. 7 is a schematic structural diagram of a spectroscopic component in the high-reliability laser chip testing system of the present invention.
  • FIG. 8 is a partial structural cross-sectional view of the light splitting component in the laser chip testing system of the present invention.
  • Support plate 2. Test PCB board; 3. Thermal conductive cover plate; 4. Bump; 11. Frame; 12. First support rod; 13. Second support rod; 14. Spring; 15 , convex part; 16, handle part; 17, baffle part; 21, workbench; 22, cooling plate; 23, TEC module; 24, uniform temperature plate; 25, clamping fixture; 26, first mounting seat ;27, cylinder; 31, carrier board; 32, mounting seat; 33, PCB board; 34, first through hole; 35, second through hole; 36, mounting hole; 37, photoelectric conversion device; 38, half-reverse half lens; 39, fiber flange; 41, pressure block; 42, strip groove.
  • connection should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or a Electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal connection of two components.
  • installation should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or a Electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal connection of two components.
  • Embodiment 1 A high-reliability laser chip testing system, comprising a plurality of workbenches 21 stacked on a rack, a cooling plate 22 arranged on each workbench 21, and a plurality of cooling plates 22 arranged at intervals
  • the TEC module 23 on the upper surface, the temperature-spreading plate 24 whose lower surface is in contact with the TEC module 23, and the clamping fixture 25 that is movably mounted on the workbench 21 and located just above the temperature-spreading plate 24;
  • the clamping fixture 25 includes a support plate 1, a test PCB board 2 with several test sockets welded at intervals, and a thermal conductive cover plate 3.
  • the support plate 1, the test PCB board 2 and the thermal conductive cover plate 3 are stacked from bottom to top. Setting, the pin ends of several devices to be tested are electrically connected to the test seat on the test PCB board 2 through the thermal conductive cover plate 3;
  • a plurality of bumps 4 are arranged at intervals on the lower surface of the thermally conductive cover plate 3 , and through holes corresponding to the bumps 4 are opened on the test PCB board 2 and the support plate 1 , and several of the bumps 4 are respectively provided.
  • the self-testing PCB board 2 and the through holes on the support board 1 pass through and are exposed from the bottom surface of the support board 1;
  • a frame 11 is provided on the outer sides of the test PCB board 2 and the heat conduction cover plate 3, the left and right ends of the support plate 1 are located directly below the frame 11, and the lower surfaces of the left and right ends of the support plate 1 There is a first groove in which the first support rod 12 is embedded.
  • the upper surface of the frame 11 is provided with two second grooves corresponding to the first grooves on the left and right ends of the support plate 1.
  • a second support rod 13 is embedded in the groove, and the first support rod 12 and the second support rod 13 are connected by several springs 14 arranged at intervals;
  • the left and right end surfaces of the frame 11 are respectively provided with a protruding strip portion 15 extending outward.
  • the work table 21 is provided with two first mounting seats 26 at intervals, and the two first mounting seats 26 are opposite to each other. There is a groove on the surface for the ridge portion 15 of the frame 11 to be embedded;
  • a beam splitting assembly is also provided above the clamping fixture 25, and the beam splitting assembly includes a carrier board 31, a plurality of mounting seats 32 mounted on the upper surface of the carrier plate 31 at intervals, and a plurality of PCB boards 33 connected to the mounting seats 32, A light-emitting device to be tested is arranged below the carrier board 31;
  • Each of the mounting bases 32 is spaced with a plurality of first through holes 34 penetrating up and down.
  • the carrier plate 31 has a second through hole 35 penetrating through the first through holes 34 .
  • the light emitting device is located in the Right below the second through hole 35 , a plurality of mounting holes 36 are arranged on the side surface of the mounting seat 32 at intervals and pass through the first through hole 34 , and the PCB board 33 is connected to the side surface of the mounting seat 32 by welding.
  • a photoelectric conversion device 37 is embedded in the mounting hole 36 and connected to the PCB board 33 by welding;
  • a half mirror 38 is installed at the intersection of the first through hole 34 and the installation hole 36, and an optical fiber flange 39 connected with an optical fiber is installed on the upper end of the first through hole 34;
  • Two ends of the upper surface of the carrier plate 31 are respectively provided with a pressure block 41 , the bottom of the pressure block 41 is mounted on the carrier plate 31 , the upper part of the pressure block 41 is used for connecting with the driving mechanism, and the A number of strip-shaped grooves 42 are staggered in the middle.
  • the front end surface of the frame 11 is connected with a handle portion 16; the four mounting seats 32 are arranged in parallel with each other, and are mounted on the upper surface of the carrier plate 31 by bolts; the edges of the left and right ends of the frame 11 have a downwardly extending stopper
  • the plate portion 17 when the spring 14 is in a natural tension state, the bottom surface of the support plate 1 is higher than the bottom surface of the baffle portion 17.
  • the bottom surface of the support plate 1 and the baffle portion The bottom surface of 17 is flush and in contact with the vapor chamber 24 .
  • Embodiment 2 A high-reliability laser chip testing system, comprising a plurality of workbenches 21 stacked on a rack, a cooling plate 22 arranged on each workbench 21, and a plurality of cooling plates 22 arranged at intervals
  • the TEC module 23 on the upper surface, the temperature-spreading plate 24 whose lower surface is in contact with the TEC module 23, and the clamping fixture 25 that is movably mounted on the workbench 21 and located just above the temperature-spreading plate 24;
  • the clamping fixture 25 includes a support plate 1, a test PCB board 2 with several test sockets welded at intervals, and a thermal conductive cover plate 3.
  • the support plate 1, the test PCB board 2 and the thermal conductive cover plate 3 are stacked from bottom to top. Setting, the pin ends of several devices to be tested are electrically connected to the test seat on the test PCB board 2 through the thermal conductive cover plate 3;
  • a plurality of bumps 4 are arranged at intervals on the lower surface of the thermally conductive cover plate 3 , and through holes corresponding to the bumps 4 are opened on the test PCB board 2 and the support plate 1 , and several of the bumps 4 are respectively provided.
  • the self-testing PCB board 2 and the through holes on the support board 1 pass through and are exposed from the bottom surface of the support board 1;
  • a frame 11 is provided on the outer sides of the test PCB board 2 and the heat conduction cover plate 3, the left and right ends of the support plate 1 are located directly below the frame 11, and the lower surfaces of the left and right ends of the support plate 1 There is a first groove in which the first support rod 12 is embedded.
  • the upper surface of the frame 11 is provided with two second grooves corresponding to the first grooves on the left and right ends of the support plate 1.
  • a second support rod 13 is embedded in the groove, and the first support rod 12 and the second support rod 13 are connected by several springs 14 arranged at intervals;
  • the left and right end surfaces of the frame 11 are respectively provided with a protruding strip portion 15 extending outward.
  • the work table 21 is provided with two first mounting seats 26 at intervals, and the two first mounting seats 26 are opposite to each other. There is a groove on the surface for the ridge portion 15 of the frame 11 to be embedded;
  • a beam splitting assembly is also provided above the clamping fixture 25, and the beam splitting assembly includes a carrier board 31, a plurality of mounting seats 32 mounted on the upper surface of the carrier plate 31 at intervals, and a plurality of PCB boards 33 connected to the mounting seats 32, A light-emitting device to be tested is arranged below the carrier board 31;
  • Each of the mounting bases 32 is spaced with a plurality of first through holes 34 penetrating up and down.
  • the carrier plate 31 has a second through hole 35 penetrating through the first through holes 34 .
  • the light emitting device is located in the Right below the second through hole 35 , a plurality of mounting holes 36 are arranged on the side surface of the mounting seat 32 at intervals and pass through the first through hole 34 , and the PCB board 33 is connected to the side surface of the mounting seat 32 by welding.
  • a photoelectric conversion device 37 is embedded in the mounting hole 36 and connected to the PCB board 33 by welding;
  • a half mirror 38 is installed at the intersection of the first through hole 34 and the installation hole 36, and an optical fiber flange 39 connected with an optical fiber is installed on the upper end of the first through hole 34;
  • Two ends of the upper surface of the carrier plate 31 are respectively provided with a pressure block 41 , the bottom of the pressure block 41 is mounted on the carrier plate 31 , the upper part of the pressure block 41 is used for connecting with the driving mechanism, and the A number of strip-shaped grooves 42 are staggered in the middle.
  • the six above-mentioned mounting seats 32 are arranged in parallel to each other and are mounted on the upper surface of the carrier plate 31 by bolts; a cylinder 27 is installed on the two above-mentioned first mounting seats 26, and the piston rod of the above-mentioned cylinder 27 is connected with the upper surface of the pressing block 41. , the air cylinder 27 drives the carrier plate 31 to press down through the pressing block 41, so that the carrier plate 31 of the spectroscopic assembly is in surface contact with the heat conduction cover plate 3 of the fixture 25, and the carrier plate 1 of the fixture 25 and the work table 21.
  • the vaporizing plate 24 above is in surface contact.
  • the aging and testing of multiple chips can be realized without moving the chips, and multiple parameters can be measured before and after aging of the chips and during the aging process, which not only improves the test performance. efficiency, but also improve the precision, accuracy and data consistency of the test;
  • the pull-out loading and unloading of the pallet is realized through the arrangement of the handle part and the protruding part, which not only facilitates the loading and unloading operation, improves the testing efficiency, but also protects the state stability of the device during loading and unloading, thereby improving the The accuracy of the test and the consistency of the test results;
  • the floating design of the support plate and its upper test PCB board and thermal conductive cover plate is realized, which can not only protect the support plate from being worn during long-term use, but also ensure the surface contact between the fixture and its upper and lower components. Make the device more evenly heated, improve the efficiency and accuracy of the test;
  • the setting of the strip groove can buffer and balance the force of the driving mechanism to drive the carrier plate to press down, which can ensure the surface contact between the bottom surface of the carrier plate and the device fixture to avoid the leakage of device light and ensure the consistency of the test. It can also avoid damage to the device due to excessive force, and further ensure the testing accuracy and efficiency of the device.

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Abstract

一种高可靠性的激光器芯片测试系统，包括层叠安装于机架上的若干个作业台(21)、设置于每个作业台(21)上的冷却板(22)、若干个间隔设置于冷却板(22)上表面的TEC模块(23)、下表面与TEC模块(23)接触的均温板(24)和可活动地安装于作业台(21)上、并位于均温板(24)正上方的装夹治具(25)；装夹治具(25)包括托板(1)、间隔焊接有若干个测试座的测试PCB板(2)和导热盖板(3)，装夹治具(25)上方还设置有一分光组件，分光组件包括载板(31)、若干个间隔安装于载板(31)上表面的安装座(32)和若干个连接于安装座(32)上的PCB板(33)，载板(31)下方设置有待测试的发光器件；载板(31)上表面的两端分别设置有一压块(41)。测试系统不仅提高了测试的效率，还提高了测试的精度、准确性和数据的一致性。

Description

高可靠性的激光器芯片测试系统 技术领域
本发明涉及一种高可靠性的激光器芯片测试系统，属于光通讯技术领域。
背景技术
激光器芯片测试老化的夹具设计一直是难点，特别是高功率TO的老化测试，由于产品功率较大，温度更难控制，目前业内高功率TO的老化和测试是分开进行的，业内欠缺老化、测试一体的系统。目前现行方案多为常温测试系统，且老化、测试分开进行，测试效率低、精度差。
发明内容
本发明的目的是提供一种高可靠性的激光器芯片测试系统，其不仅提高了测试的效率，还提高测试了的精度、准确性和数据的一致性。
为达到上述目的，本发明采用的技术方案是：一种高可靠性的激光器芯片测试系统，包括层叠安装于机架上的若干个作业台、设置于每个作业台上的冷却板、若干个间隔设置于冷却板上表面的TEC模块、下表面与TEC模块接触的均温板和可活动地安装于作业台上、并位于均温板正上方的装夹治具；
所述装夹治具包括托板、间隔焊接有若干个测试座的测试PCB板和导热盖板，所述托板、测试PCB板和导热盖板自下而上层叠设置，若干个待测试器件的引脚端穿过导热盖板与测试PCB板上的测试座电连接；
所述导热盖板的下表面上间隔设置有若干个凸块，所述测试PCB板和托板上均开有与凸块对应的通孔，若干个所述凸块分别自测试PCB板、托板上通孔中穿过、并自托板的底面上露出；
所述测试PCB板和导热盖板的四周外侧设置有一边框，所述托板的左、右两端均位于边框的正下方，所述托板左、右两端的下表面上开设有一嵌入有第一支撑杆的第一凹槽，所述边框上表面开设有与托板左、右两端的第一凹槽对应的两个第二凹槽，所述第二凹槽内嵌入有第二支撑杆，所述第一支撑杆、第二支撑杆之间通过若干个间隔设置的弹簧连接；
所述边框的左、右两个端面上分别具有一向外延伸的凸条部，所述作业台上间隔设置有两个第一安装座，此两个第一安装座相对的表面上均开有一供边框的凸条部嵌入的凹槽；
所述装夹治具上方还设置有一分光组件，此分光组件包括载板、若干个间隔安装于载板上表面的安装座和若干个连接于安装座上的PCB板，所述载板下 方设置有待测试的发光器件；
每个所述安装座上均间隔开有若干个上下贯通的第一通孔，所述载板上开有与第一通孔贯通的第二通孔，所述发光器件位于第二通孔的正下方，所述安装座的侧表面上间隔设置有若干个与第一通孔贯通的安装孔，所述PCB板焊接连接于安装座的侧表面上，一光电转换器件嵌入所述安装孔内、并与PCB板焊接连接；
所述第一通孔与安装孔相交处安装有一半反半透镜，所述第一通孔的上端安装有一连接有光纤的光纤法兰；
所述载板上表面的两端分别设置有一压块，此压块的底部安装于载板上，所述压块的上部用于与驱动机构连接，所述压块的中部间隔交错地开设有若干个条形槽。
上述技术方案中进一步改进的方案如下：
1.上述方案中，所述边框的前端面上连接有一拉手部。
2.上述方案中，所述边框左、右两端的边缘处具有一向下延伸的挡板部，当弹簧处于自然拉伸状态时，所述托板的底面高于挡板部的底面，当弹簧受到外力处于伸长状态时，所述托板的底面与挡板部的底面齐平、并与均温板接触。
3.上述方案中，2～8个所述安装座相互平行设置，并通过螺栓安装于载板上表面。
4.上述方案中，两个所述第一安装座上均安装有一气缸，所述气缸的活塞杆与压块的上表面连接。
由于上述技术方案的运用，本发明与现有技术相比具有下列优点：
1.本发明高可靠性的激光器芯片测试系统，其实现了对多颗芯片的老化、测试，无需对芯片进行移动，即可以对芯片老化前后以及老化过程中的多项参数进行测量，不仅提高了测试的效率，还提高测试了的精度、准确性和数据的一致性；另外，其边框的左、右两个端面上分别具有一向外延伸的凸条部，所述边框的前端面上连接有一拉手部，通过拉手部与凸条部的设置，实现了对托板的抽拉式装卸，既便于对上下料操作、提高测试效率，又可以保护器件在上下料过程中状态的稳定性，从而提高测试的精度和测试结果的一致性。
2.本发明高可靠性的激光器芯片测试系统，其测试PCB板和导热盖板的四周外侧设置有一边框，所述托板的左、右两端均位于边框的正下方，所述托板左、右两端的下表面上开设有一嵌入有第一支撑杆的第一凹槽，所述边框上表 面开设有与托板左、右两端的第一凹槽对应的两个第二凹槽，所述第二凹槽内嵌入有第二支撑杆，所述第一支撑杆、第二支撑杆之间通过若干个间隔设置的弹簧连接，实现了对托板及其上方测试PCB板、导热盖板的浮动设计，既可以保护托板在长时间使用过程中不被磨损，又可以保证夹具与其上下组件之间的面接触，从而使得器件受热更加均匀，提高测试的效率和精度。
3.本发明高可靠性的激光器芯片测试系统，其载板上表面的两端分别设置有一压块，此压块的底部安装于载板上，所述压块的上部用于与驱动机构连接，所述压块的中部间隔交错地开设有若干个条形槽，通过条形槽的设置，可以对驱动机构带动载板下压的力量进行缓冲、均衡，既可以保证载板底面与器件夹具之间的面接触以避免器件光的泄露、保证测试的一致性，又可以避免力量过大而损伤器件，进一步保证对器件的测试精度和效率。
附图说明
附图1为本发明高可靠性的激光器芯片测试系统结构示意图；
附图2为本发明高可靠性的激光器芯片测试系统的局部结构示意图；
附图3为本发明高可靠性的激光器芯片测试系统的局部结构剖视图；
附图4为本发明高可靠性的激光器芯片测试系统中夹具的结构示意图；
附图5为本发明激光器芯片测试系统中夹具的局部结构分解示意图；
附图6为本发明高可靠性的激光器芯片测试系统中夹具的局部结构剖视图；
附图7为本发明高可靠性的激光器芯片测试系统中分光组件的结构示意图；
附图8为本发明激光器芯片测试系统中分光组件的局部结构剖视图。
以上附图中：1、托板；2、测试PCB板；3、导热盖板；4、凸块；11、边框；12、第一支撑杆；13、第二支撑杆；14、弹簧；15、凸条部；16、拉手部；17、挡板部；21、作业台；22、冷却板；23、TEC模块；24、均温板；25、装夹治具；26、第一安装座；27、气缸；31、载板；32、安装座；33、PCB板；34、第一通孔；35、第二通孔；36、安装孔；37、光电转换器件；38、半反半透镜；39、光纤法兰；41、压块；42、条形槽。
具体实施方式
在本专利的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作， 因此不能理解为对本发明的限制；术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性；此外，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本专利的具体含义。
实施例1：一种高可靠性的激光器芯片测试系统，包括层叠安装于机架上的若干个作业台21、设置于每个作业台21上的冷却板22、若干个间隔设置于冷却板22上表面的TEC模块23、下表面与TEC模块23接触的均温板24和可活动地安装于作业台21上、并位于均温板24正上方的装夹治具25；
所述装夹治具25包括托板1、间隔焊接有若干个测试座的测试PCB板2和导热盖板3，所述托板1、测试PCB板2和导热盖板3自下而上层叠设置，若干个待测试器件的引脚端穿过导热盖板3与测试PCB板2上的测试座电连接；
所述导热盖板3的下表面上间隔设置有若干个凸块4，所述测试PCB板2和托板1上均开有与凸块4对应的通孔，若干个所述凸块4分别自测试PCB板2、托板1上通孔中穿过、并自托板1的底面上露出；
所述测试PCB板2和导热盖板3的四周外侧设置有一边框11，所述托板1的左、右两端均位于边框11的正下方，所述托板1左、右两端的下表面上开设有一嵌入有第一支撑杆12的第一凹槽，所述边框11上表面开设有与托板1左、右两端的第一凹槽对应的两个第二凹槽，所述第二凹槽内嵌入有第二支撑杆13，所述第一支撑杆12、第二支撑杆13之间通过若干个间隔设置的弹簧14连接；
所述边框11的左、右两个端面上分别具有一向外延伸的凸条部15，所述作业台21上间隔设置有两个第一安装座26，此两个第一安装座26相对的表面上均开有一供边框11的凸条部15嵌入的凹槽；
所述装夹治具25上方还设置有一分光组件，此分光组件包括载板31、若干个间隔安装于载板31上表面的安装座32和若干个连接于安装座32上的PCB板33，所述载板31下方设置有待测试的发光器件；
每个所述安装座32上均间隔开有若干个上下贯通的第一通孔34，所述载板31上开有与第一通孔34贯通的第二通孔35，所述发光器件位于第二通孔35的正下方，所述安装座32的侧表面上间隔设置有若干个与第一通孔34贯通的安 装孔36，所述PCB板33焊接连接于安装座32的侧表面上，一光电转换器件37嵌入所述安装孔36内、并与PCB板33焊接连接；
所述第一通孔34与安装孔36相交处安装有一半反半透镜38，所述第一通孔34的上端安装有一连接有光纤的光纤法兰39；
所述载板31上表面的两端分别设置有一压块41，此压块41的底部安装于载板31上，所述压块41的上部用于与驱动机构连接，所述压块41的中部间隔交错地开设有若干个条形槽42。
上述边框11的前端面上连接有一拉手部16；4个上述安装座32相互平行设置，并通过螺栓安装于载板31上表面；上述边框11左、右两端的边缘处具有一向下延伸的挡板部17，当弹簧14处于自然拉伸状态时，上述托板1的底面高于挡板部17的底面，当弹簧14受到外力处于伸长状态时，上述托板1的底面与挡板部17的底面齐平、并与均温板24接触。
实施例2：一种高可靠性的激光器芯片测试系统，包括层叠安装于机架上的若干个作业台21、设置于每个作业台21上的冷却板22、若干个间隔设置于冷却板22上表面的TEC模块23、下表面与TEC模块23接触的均温板24和可活动地安装于作业台21上、并位于均温板24正上方的装夹治具25；
所述装夹治具25包括托板1、间隔焊接有若干个测试座的测试PCB板2和导热盖板3，所述托板1、测试PCB板2和导热盖板3自下而上层叠设置，若干个待测试器件的引脚端穿过导热盖板3与测试PCB板2上的测试座电连接；
所述导热盖板3的下表面上间隔设置有若干个凸块4，所述测试PCB板2和托板1上均开有与凸块4对应的通孔，若干个所述凸块4分别自测试PCB板2、托板1上通孔中穿过、并自托板1的底面上露出；
所述测试PCB板2和导热盖板3的四周外侧设置有一边框11，所述托板1的左、右两端均位于边框11的正下方，所述托板1左、右两端的下表面上开设有一嵌入有第一支撑杆12的第一凹槽，所述边框11上表面开设有与托板1左、右两端的第一凹槽对应的两个第二凹槽，所述第二凹槽内嵌入有第二支撑杆13，所述第一支撑杆12、第二支撑杆13之间通过若干个间隔设置的弹簧14连接；
所述边框11的左、右两个端面上分别具有一向外延伸的凸条部15，所述作业台21上间隔设置有两个第一安装座26，此两个第一安装座26相对的表面上均开有一供边框11的凸条部15嵌入的凹槽；
所述装夹治具25上方还设置有一分光组件，此分光组件包括载板31、若干 个间隔安装于载板31上表面的安装座32和若干个连接于安装座32上的PCB板33，所述载板31下方设置有待测试的发光器件；
每个所述安装座32上均间隔开有若干个上下贯通的第一通孔34，所述载板31上开有与第一通孔34贯通的第二通孔35，所述发光器件位于第二通孔35的正下方，所述安装座32的侧表面上间隔设置有若干个与第一通孔34贯通的安装孔36，所述PCB板33焊接连接于安装座32的侧表面上，一光电转换器件37嵌入所述安装孔36内、并与PCB板33焊接连接；
所述第一通孔34与安装孔36相交处安装有一半反半透镜38，所述第一通孔34的上端安装有一连接有光纤的光纤法兰39；
所述载板31上表面的两端分别设置有一压块41，此压块41的底部安装于载板31上，所述压块41的上部用于与驱动机构连接，所述压块41的中部间隔交错地开设有若干个条形槽42。
6个上述安装座32相互平行设置，并通过螺栓安装于载板31上表面；两个上述第一安装座26上均安装有一气缸27，上述气缸27的活塞杆与压块41的上表面连接，气缸27通过压块41驱动载板31下压，从而使得分光组件的载板31与述装夹治具25的导热盖板3面接触、装夹治具25的托板1与作业台21上的均温板24面接触。
采用上述高可靠性的激光器芯片测试系统时，实现了对多颗芯片的老化、测试，无需对芯片进行移动，即可以对芯片老化前后以及老化过程中的多项参数进行测量，不仅提高了测试的效率，还提高测试了的精度、准确性和数据的一致性；
另外，通过拉手部与凸条部的设置，实现了对托板的抽拉式装卸，既便于对上下料操作、提高测试效率，又可以保护器件在上下料过程中状态的稳定性，从而提高测试的精度和测试结果的一致性；
另外，实现了对托板及其上方测试PCB板、导热盖板的浮动设计，既可以保护托板在长时间使用过程中不被磨损，又可以保证夹具与其上下组件之间的面接触，从而使得器件受热更加均匀，提高测试的效率和精度；
另外，通过条形槽的设置，可以对驱动机构带动载板下压的力量进行缓冲、均衡，既可以保证载板底面与器件夹具之间的面接触以避免器件光的泄露、保证测试的一致性，又可以避免力量过大而损伤器件，进一步保证对器件的测试精度和效率。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (5)

  1. 一种高可靠性的激光器芯片测试系统，其特征在于：包括层叠安装于机架上的若干个作业台(21)、设置于每个作业台(21)上的冷却板(22)、若干个间隔设置于冷却板(22)上表面的TEC模块(23)、下表面与TEC模块(23)接触的均温板(24)和可活动地安装于作业台(21)上、并位于均温板(24)正上方的装夹治具(25)；
    所述装夹治具(25)包括托板(1)、间隔焊接有若干个测试座的测试PCB板(2)和导热盖板(3)，所述托板(1)、测试PCB板(2)和导热盖板(3)自下而上层叠设置，若干个待测试器件的引脚端穿过导热盖板(3)与测试PCB板(2)上的测试座电连接；
    所述导热盖板(3)的下表面上间隔设置有若干个凸块(4)，所述测试PCB板(2)和托板(1)上均开有与凸块(4)对应的通孔，若干个所述凸块(4)分别自测试PCB板(2)、托板(1)上通孔中穿过、并自托板(1)的底面上露出；
    所述测试PCB板(2)和导热盖板(3)的四周外侧设置有一边框(11)，所述托板(1)的左、右两端均位于边框(11)的正下方，所述托板(1)左、右两端的下表面上开设有一嵌入有第一支撑杆(12)的第一凹槽，所述边框(11)上表面开设有与托板(1)左、右两端的第一凹槽对应的两个第二凹槽，所述第二凹槽内嵌入有第二支撑杆(13)，所述第一支撑杆(12)、第二支撑杆(13)之间通过若干个间隔设置的弹簧(14)连接；
    所述边框(11)的左、右两个端面上分别具有一向外延伸的凸条部(15)，所述作业台(21)上间隔设置有两个第一安装座(26)，此两个第一安装座(26)相对的表面上均开有一供边框(11)的凸条部(15)嵌入的凹槽；
    所述装夹治具(25)上方还设置有一分光组件，此分光组件包括载板(31)、若干个间隔安装于载板(31)上表面的安装座(32)和若干个连接于安装座(32)上的PCB板(33)，所述载板(31)下方设置有待测试的发光器件；
    每个所述安装座(32)上均间隔开有若干个上下贯通的第一通孔(34)，所述载板(31)上开有与第一通孔(34)贯通的第二通孔(35)，所述发光器件位于第二通孔(35)的正下方，所述安装座(32)的侧表面上间隔设置有若干个与第一通孔(34)贯通的安装孔(36)，所述PCB板(33)焊接连接于安装座(32)的侧表面上，一光电转换器件(37)嵌入所述安装孔(36)内、并与PCB板(33)焊接连接；
    所述第一通孔(34)与安装孔(36)相交处安装有一半反半透镜(38)，所述第一通孔(34)的上端安装有一连接有光纤的光纤法兰(39)；
    所述载板(31)上表面的两端分别设置有一压块(41)，此压块(41)的底部安装于载板(31)上，所述压块(41)的上部用于与驱动机构连接，所述压块(41)的中部间隔交错地开设有若干个条形槽(42)。
  2. 根据权利要求1所述的高可靠性的激光器芯片测试系统，其特征在于：所述边框(11)的前端面上连接有一拉手部(16)。
  3. 根据权利要求1所述的高可靠性的激光器芯片测试系统，其特征在于：所述边框(11)左、右两端的边缘处具有一向下延伸的挡板部(17)，当弹簧(14)处于自然拉伸状态时，所述托板(1)的底面高于挡板部(17)的底面，当弹簧(14)受到外力处于伸长状态时，所述托板(1)的底面与挡板部(17)的底面齐平、并与均温板(24)接触。
  4. 根据权利要求1所述的高可靠性的激光器芯片测试系统，其特征在于：2～8个所述安装座(32)相互平行设置，并通过螺栓安装于载板(31)上表面。
  5. 根据权利要求1所述的高可靠性的激光器芯片测试系统，其特征在于：两个所述第一安装座(26)上均安装有一气缸(27)，所述气缸(27)的活塞杆与压块(41)的上表面连接。
PCT/CN2021/085490 2020-09-29 2021-04-03 高可靠性的激光器芯片测试系统 WO2022068166A1 (zh)

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