WO2022065710A1 - 매니폴드가 개선된 다중 슬롯 다이 코터 - Google Patents

매니폴드가 개선된 다중 슬롯 다이 코터 Download PDF

Info

Publication number
WO2022065710A1
WO2022065710A1 PCT/KR2021/011399 KR2021011399W WO2022065710A1 WO 2022065710 A1 WO2022065710 A1 WO 2022065710A1 KR 2021011399 W KR2021011399 W KR 2021011399W WO 2022065710 A1 WO2022065710 A1 WO 2022065710A1
Authority
WO
WIPO (PCT)
Prior art keywords
slot
manifold
die block
die coater
angle
Prior art date
Application number
PCT/KR2021/011399
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
이택수
전신욱
최상훈
Original Assignee
주식회사 엘지에너지솔루션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지에너지솔루션 filed Critical 주식회사 엘지에너지솔루션
Priority to US17/918,433 priority Critical patent/US11772119B2/en
Priority to EP21872740.2A priority patent/EP4154991A4/en
Priority to CN202180027388.2A priority patent/CN115427158B/zh
Publication of WO2022065710A1 publication Critical patent/WO2022065710A1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/06—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying two different liquids or other fluent materials, or the same liquid or other fluent material twice, to the same side of the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0404—Methods of deposition of the material by coating on electrode collectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0409—Methods of deposition of the material by a doctor blade method, slip-casting or roller coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a multi-slot die coater capable of simultaneously forming two or more layers by wet, and to a multi-slot die coater with improved productivity.
  • This application is an application for priority claiming Korean Patent Application No. 10-2020-0125181 filed on September 25, 2020, and all contents disclosed in the specification and drawings of the application are incorporated herein by reference.
  • the electrode active material slurry discharged from the slot die coater is applied on the current collector transferred by the coating roll.
  • a conventional slot die coater includes two dies and forms a slot between the two dies, and one type of electrode active material slurry can be discharged through one slot to form one electrode active material layer.
  • the thickness of the electrode active material layer which was about 130 ⁇ m, gradually increased to reach 300 ⁇ m.
  • the thick electrode active material layer is formed with a conventional slot die coater, migration of the binder and the conductive material in the active material slurry intensifies during drying, so that the final electrode is non-uniformly manufactured.
  • the electrode active material layer is applied thinly and then dried, then coated over it again and then coated twice, it takes a long time.
  • the inventors of the present application have proposed a dual slot die coater capable of simultaneously coating two types of electrode active material slurries.
  • FIG. 1 is a schematic cross-sectional view of a dual slot die coater according to the prior art
  • FIG. 2 is a perspective view of a lower die block in the dual slot die coater of FIG. 1
  • FIG. 3 is an enlarged view of area A of FIG. 1 .
  • two types of electrode active material slurries are discharged from the dual slot die coater 20 while the current collector 15 is driven by rotating the coating roll 10 , and the two-layer electrode is placed on the current collector 15 .
  • the active material layer can be formed at the same time.
  • the electrode active material slurry discharged from the dual slot die coater 20 is widely applied to one surface of the current collector 15 to form an electrode active material layer.
  • the dual slot die coater 20 is configured by assembling three plate members, that is, three die blocks 21 , 22 , and 23 . Since slots are formed between adjacent die blocks, two slots are formed, and the electrode active material slurry applied first by simultaneously discharging two types of electrode active material slurries through the outlets 24 and 25 connected to each slot. By continuously applying an additional electrode active material slurry on the electrode active material layer formed by the two-layer electrode active material layer can be formed at the same time.
  • Reference numerals 26 and 27 denote manifolds in which the coating solution is contained.
  • the electrode active material slurry is filled in the manifolds 26 and 27 inside the die blocks 21, 22, 23, and through the discharge ports 24 and 25, coated
  • the flow of the electrode active material slurry in the manifolds 26 and 27 is uniform without stagnation, it is easy to coat for a long time and can have excellent productivity.
  • the shape of the manifold 26 formed on the die block 21 in the currently used dual slot die coater 20 is the same as the perspective view of FIG. 2 .
  • the manifold 26 has a large chamber shape. 2 and 3 together, in the cross section along the direction in which the current collector 15 travels from the manifold 26, the surface 26a close to the outlet 24 is in a straight shape, and up to the front end of the die block 21
  • the angle formed with the land portion 21a, which is a region of , is constant at ⁇ .
  • the electrode active material slurry must have a uniform flow in the manifold 26 to have excellent coating quality. If there is a region in which the electrode active material slurry is stagnant or moves at a slow speed in the manifold 26, the electrode active material slurry is agglomerated inside the manifold 26 when used for a long time, causing deformation in the flow, causing a loading deviation in the width direction, or agglomeration
  • the coating surface may become non-uniform due to a phenomenon such as a lump of the electrode active material slurry clogging the discharge port, resulting in surface defects.
  • this problem often occurs in the manifold 26 provided in the conventional dual slot die coater 20, improvement is required.
  • the present invention was devised in consideration of the above problems, and an object of the present invention is to provide a multi-slot die coater including a manifold in which electrode active material slurry flow is uniform without stagnation.
  • the multi-slot die coater of the present invention for solving the above technical problem is provided with a lower slot and an upper slot, and a multi-slot for applying a coating solution by extruding and applying a coating solution through at least one of the lower slot and the upper slot on the surface of the substrate continuously traveling
  • a die coater comprising: a lower die block; an intermediate die block disposed on the lower die block to form the lower slot therebetween; and a lower die block disposed on the intermediate die block to communicate with the intermediate die block an upper die block defining the upper slot therebetween; a first manifold provided in the lower die block or the intermediate die block to receive a first coating solution and communicate with the lower slot; and a second manifold provided in the upper die block or the intermediate die block to receive a second coating solution and communicate with the upper slot, wherein the first manifold is a recessed chamber, wherein the lower part is toward the lower slot.
  • It includes a first surface and a second surface as two surfaces having different angles with respect to the slot, and among the two surfaces, the first surface closest to the lower slot has an angle of 30 to 70% compared to the second surface following it. It is characterized in that it is formed at a level.
  • the length of the first surface may be 15 mm or less.
  • An angle between the first surface and the lower slot may be between 20° and 60°.
  • an angle between the first surface and the lower slot is 30°, and an angle between the second surface and the lower slot is 60°.
  • the second manifold is a chamber of a recessed shape, and includes a third surface and a fourth surface as two surfaces having different angles with respect to the upper slot on the upper slot side, Among the two surfaces, the third surface closest to the upper slot may have an angle of 30 to 70% compared to the fourth surface following it.
  • An angle between the third surface and the upper slot may be between 20° and 60°.
  • An angle between the third surface and the upper slot may be 30°, and an angle between the fourth surface and the upper slot may be 60°.
  • the lower slot and the upper slot may form an angle of 30 ° to 60 °.
  • the intermediate die block may have a right-angled triangular shape in a cross-section along a direction in which the substrate travels, the first manifold may be provided in the lower die block, and the second manifold may be provided in the upper die block.
  • the lower die block, the intermediate die block and the upper die block each have a lower die lip, an intermediate die lip and an upper die lip forming a tip portion thereof.
  • a lower discharge port communicating with the lower slot is formed between the lower die lip and the middle die lip
  • an upper discharge port communicating with the upper slot is formed between the middle die lip and the upper die lip.
  • a first spacer interposed between the lower die block and the middle die block to adjust a width of the lower slot, and a second spacer interposed between the middle die block and the upper die block to adjust a width of the upper slot may further include.
  • the flow of the electrode active material slurry in the manifold is homogenized. Since the time for which the electrode active material slurry is stagnant in any part in the manifold is minimized, agglomeration of the electrode active material slurry is prevented. As a result, there is no problem in that the flow is deformed to cause a loading deviation in the width direction or the agglomerated electrode active material slurry lump blocks the discharge port.
  • the electrode active material slurry flow is uniform without stagnation, so it is easy to coat for a long time, and thus excellent productivity can be obtained. Since there is no agglomeration of the electrode active material slurry, it is possible to prevent the occurrence of defects on the coating surface. Therefore, it is possible to improve the coating quality of the product.
  • the discharge of the electrode active material slurry is facilitated by making the inclination angle of the end of the manifold more gentle.
  • the multi-slot die coater having such a manifold can uniformly form an electrode active material layer to a desired thickness, and preferably, since it is possible to simultaneously coat two or more kinds of electrode active material slurries, both performance and productivity are excellent.
  • the multi-slot die coater of the present invention When the multi-slot die coater of the present invention is used to manufacture an electrode of a secondary battery by coating an electrode active material slurry on the current collector while driving the current collector, uniform coating is possible even under high-speed running or long-width application conditions. there is.
  • FIG. 1 is a schematic cross-sectional view of a dual slot die coater according to the prior art.
  • FIG. 2 is a perspective view of a lower die block in the dual slot die coater of FIG. 1 ;
  • FIG. 3 is an enlarged view of area A of FIG. 1 .
  • FIG. 4 is a schematic cross-sectional view of a multi-slot die coater according to an embodiment of the present invention.
  • FIG. 5 is a schematic exploded perspective view of a multi-slot die coater according to an embodiment of the present invention.
  • FIG. 6 is an enlarged view of area B of FIG. 4 .
  • FIG. 7 is an enlarged view of region C of FIG. 4 .
  • the multi-slot die coater of the present invention may have two or more slots. Basically, it is an apparatus having a lower slot and an upper slot and coating a coating solution in a double layer on a substrate.
  • the 'substrate' described below is the current collector and the coating solution is the 'electrode active material slurry'.
  • Both the first coating solution and the second coating solution are electrode active material slurries, and the composition (type of active material, conductive material, binder), content (amount of active material, conductive material, binder), or physical properties are the same or different electrode active material slurries.
  • FIG. 4 is a schematic cross-sectional view of a multi-slot die coater according to an embodiment of the present invention.
  • 5 is a schematic exploded perspective view of a multi-slot die coater according to an embodiment of the present invention.
  • FIG. 6 is an enlarged view of area B of FIG. 4 .
  • the multi-slot die coater 100 is a dual-slot die coater having a lower slot 101 and an upper slot 102 , and two types of the same or different from each other through the lower slot 101 and the upper slot 102 . It is a device that can coat the coating solution of the substrate 300 simultaneously or alternately. 4 and 5 , the multi-slot die coater 100 includes a lower die block 110 , an intermediate die block 120 disposed on the lower die block 110 , and the intermediate die block 120 . and an upper die block 130 disposed on top of the .
  • the die blocks 110 , 120 , and 130 are assembled to each other through fastening members (not shown) such as bolts.
  • the lower die block 110 is a block located at the bottom of the blocks constituting the multi-slot die coater 100, and the side facing the middle die block 120 is approximately 30° with respect to the bottom surface (XZ plane). It has an inclined shape to form an angle of 60°.
  • the first coating solution 50 does not leak through the gap between the lower die block 110 and the middle die block 120 except for the area where the lower discharge port 101a is formed. It is preferable to be made of a material having sealing properties as it functions as a gasket to prevent it from happening.
  • the lower die block 110 has a predetermined depth on a surface facing the intermediate die block 120 and includes a first manifold 112 communicating with the lower slot 101 .
  • the first manifold 112 is connected to a first coating solution supply chamber (not shown) installed outside through a supply pipe to receive the first coating solution 50 .
  • the flow of the first coating solution 50 is induced along the lower slot 101 and discharged to the outside through the lower outlet 101a. do.
  • the middle die block 120 is a block located in the middle among blocks constituting the multi-slot die coater 100, and is disposed between the lower die block 110 and the upper die block 130 to form a double slot.
  • the intermediate die block 120 of this embodiment is a right triangle in cross section. According to another embodiment, for example, the cross-section may be provided as an isosceles triangle.
  • the upper die block 130 is disposed to face the upper surface of the intermediate die block 120 that is horizontal with respect to the bottom surface.
  • the upper slot 102 is thus formed between the middle die block 120 and the upper die block 130 where they face.
  • the second spacer 133 may be interposed between the middle die block 120 and the upper die block 130 to provide a gap therebetween. Accordingly, an upper slot 102 corresponding to a passage through which the second coating liquid 60 can flow is formed. In this case, the vertical width (Y-axis direction, slot gap) of the upper slot 102 is determined by the second spacer 133 .
  • the second spacer 133 has a structure similar to that of the above-described first spacer 113 , and has a second opening 133a in which one region is cut, and the middle die block 120 and the upper die block 130 . It is interposed only in the remaining portion except for one side of the edge area of each of the opposing surfaces.
  • the circumferential direction except for the front of the upper slot 102 is blocked, and the upper discharge port 102a is formed only between the front end of the intermediate die block 120 and the front end of the upper die block 130 .
  • the front end of the upper die block 130 is defined as an upper die lip 131 , in other words, the upper discharge port 102a is a place formed by being spaced apart between the middle die lip 121 and the upper die lip 131 .
  • the upper die block 130 has a predetermined depth on a surface facing the middle die block 120 and includes a second manifold 132 communicating with the upper slot 102 .
  • the second manifold 132 is connected to a second coating solution supply chamber and a supply pipe installed outside to receive the second coating solution 60 .
  • the second coating solution 60 is supplied from the outside along the pipe-shaped supply pipe and is filled in the second manifold 132 , the second coating solution 60 is in communication with the second manifold 132 , the upper slot The flow is guided along (102) and discharged to the outside through the upper discharge port (102a).
  • first and second manifolds 112 and 132 are respectively formed in the lower die block 110 and the upper die block 130 . In this way, the deformation of the structurally weakest intermediate die block 120 may be less affected.
  • the first manifold 112 may be formed on the lower die block 110
  • the second manifold 132 may be formed on the middle die block 120 .
  • both the first manifold 112 and the second manifold 132 may be formed in the intermediate die block 120 .
  • a rotatably provided coating roll 200 is disposed in front of the multi-slot die coater 100, and the substrate to be coated by rotating the coating roll 200 While driving 300, the first coating liquid 50 and the second coating liquid 60 may be continuously contacted with the surface of the substrate 300 to coat the substrate 300 in a double layer. Alternatively, supply and interruption of the first coating liquid 50 and supply and interruption of the second coating liquid 60 may be alternately performed to form a pattern coating intermittently on the substrate 300 .
  • the multi-slot die coater 100 is to extrude and apply a coating solution through at least one of the lower slot 101 and the upper slot 102 on the surface of the continuously running substrate 300 .
  • the first manifold 112 is a chamber of a recessed shape, and is a first face as two faces having different angles with respect to the lower slot 101 on the side closer to the lower slot 101 . and a second surface 112a and a second surface 112b.
  • the first surface 112a closest to the lower slot 101 has an angle of 30 to 70% compared to the second surface 112b following it. That is, if the angle between the first surface 112a and the lower slot 101 is ⁇ and the angle between the second surface 112b and the lower slot 101 is ⁇ , ⁇ is 30 to 70% of ⁇ . , ⁇ is less than ⁇ . That is, the inclination of the first surface 112a close to the lower discharge port 101a is gentler than that of the second surface 112b. If ⁇ is at a level of 30% or less or 70% or more compared to ⁇ , it is not very helpful in resolving the stagnation of the first coating solution 50 .
  • the length d of the first surface 112a may be 15 mm or less.
  • the length d of the first surface 112a may not exceed 15 mm. If the first surface 112a, which has a gentle slope, is longer than 15 mm, stagnation of the electrode active material slurry may occur.
  • the angle ⁇ between the first surface 112a and the lower slot 101 may be 30°, and the angle ⁇ between the second surface 112b and the lower slot 101 may be 60°. In this case, ⁇ is at a level of 50% compared to ⁇ .
  • the first manifold 112 has an inner surface in the region where the first coating liquid 50 is supplied to the lower outlet 101a is the first By including the surface 112a and the second surface 112b, the surface close to the discharge port 24 in the cross section along the direction in which the current collector 15 travels in the conventional manifold 26 as seen in FIG. 26a) is characterized in that it is a polygonal shape rather than a straight line compared to the straight shape.
  • the manifold ends have different inclinations. If it is considered that the inclination angle of the end in the existing manifold 26 is ⁇ and it is kept constant (see FIG. 3), in the present invention, a portion of the first manifold 112 has an inclination angle ⁇ and an end portion has an inclination angle. ⁇ is less than ⁇ . That is, the discharging of the first coating liquid 50 such as the electrode active material slurry is facilitated by designing the inclination angle of the end portion more gently. According to the present invention, the flow of the first coating liquid 50 in the first manifold 112 is uniformed and the stagnation time is minimized.
  • FIG. 7 is an enlarged view of region C of FIG. 4 .
  • the second manifold 132 may include a third surface 132a and a fourth surface 132b as two surfaces having different angles.
  • the third surface 132a closest to the upper slot 102 has an angle of 30 to 70% with respect to the upper slot 102 compared to the fourth surface 132b following it. That is, if the angle between the third surface 132a and the upper slot 102 is ⁇ ' and the angle between the fourth surface 132b and the upper slot 102 is ⁇ ', ⁇ ' is 30 ⁇ 70% level. That is, the third surface 132a close to the upper discharge port 102a has a gentle slope compared to the fourth surface 132b.
  • the length d' of the third surface 132a may be 15 mm or less.
  • An angle ⁇ ′ between the third surface 132a and the upper slot 102 may be between 20° and 60°. In a preferred example, the angle ⁇ ′ between the third surface 132a and the upper slot 102 may be 30°, and the angle ⁇ ′ between the fourth surface 132b and the upper slot 102 may be 60°.
  • the flow of the second coating liquid 60 in the second manifold 132 is also uniformed and the stagnation time is minimized.
  • the average residence time and the ratio of regions having a residence time of 1000 seconds or more change.
  • the residence time is about 10 to 100 seconds, and in the part surrounding that part, the residence time is longer than that, close to 1000 seconds. Outside that, the residence time is over 1000 seconds. That is, it can be seen that the residence time of the electrode active material slurry on the bottom of the manifold is usually longer than on the inside. And it can be seen that the narrower the manifold bottom surface, the longer the average residence time. As such, it can be seen that the cross-sectional shape of the manifold is very important in determining the residence time of the electrode active material.
  • Samples 1 to 3 and 6 are examples, and satisfy the angular relationship and length suggested by the present invention.
  • Samples 4 and 5 are comparative examples, and do not satisfy the angular relationship proposed in the present invention.
  • Samples 7 and 8 are also comparative examples, exceeding the length range of the first surface 112a proposed in the present invention.
  • Sample 9 is also a comparative example, in the case of having only one surface having a constant cross-sectional angle toward the land portion, like the conventional manifold described with reference to FIG. 3 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Coating Apparatus (AREA)
  • Battery Electrode And Active Subsutance (AREA)
PCT/KR2021/011399 2020-09-25 2021-08-25 매니폴드가 개선된 다중 슬롯 다이 코터 WO2022065710A1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US17/918,433 US11772119B2 (en) 2020-09-25 2021-08-25 Multi-slot die coater with improved manifold
EP21872740.2A EP4154991A4 (en) 2020-09-25 2021-08-25 MULTI-SLOT NOZZLE COATOR WITH IMPROVED DISTRIBUTORS
CN202180027388.2A CN115427158B (zh) 2020-09-25 2021-08-25 具有改进的歧管的多狭缝模具涂布机

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200125181A KR20220041647A (ko) 2020-09-25 2020-09-25 매니폴드가 개선된 듀얼 슬롯 다이 코터
KR10-2020-0125181 2020-09-25

Publications (1)

Publication Number Publication Date
WO2022065710A1 true WO2022065710A1 (ko) 2022-03-31

Family

ID=80845988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2021/011399 WO2022065710A1 (ko) 2020-09-25 2021-08-25 매니폴드가 개선된 다중 슬롯 다이 코터

Country Status (5)

Country Link
US (1) US11772119B2 (zh)
EP (1) EP4154991A4 (zh)
KR (1) KR20220041647A (zh)
CN (1) CN115427158B (zh)
WO (1) WO2022065710A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN216323035U (zh) * 2021-11-02 2022-04-19 江苏时代新能源科技有限公司 一种涂布装置及涂布系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5234500A (en) * 1991-09-27 1993-08-10 Eastman Kodak Company Liquid distribution system for photographic coating device
JP2892476B2 (ja) * 1990-09-14 1999-05-17 東京エレクトロン株式会社 帯状液体ノズル及び液処理装置及び液処理方法
JP2001224998A (ja) * 2000-02-17 2001-08-21 Konica Corp コーティングヘッドおよび塗布方法
JP2002086045A (ja) * 2000-09-20 2002-03-26 Tatsumo Kk 液状物塗布装置
JP2020131082A (ja) * 2019-02-15 2020-08-31 株式会社ヒラノテクシード 塗工装置
KR20200125181A (ko) 2019-04-26 2020-11-04 주식회사 다솜소프트 이사날짜 예측을 통한 부동산 정보 제공 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09276771A (ja) 1996-04-17 1997-10-28 Teijin Ltd 塗布装置および塗布方法
JP2000334357A (ja) 1999-05-27 2000-12-05 Chugai Ro Co Ltd 補助リップ式ダイコータ
TWI396593B (zh) 2006-03-31 2013-05-21 Toray Industries 塗布方法與塗布裝置以及顯示用構件之製造方法與製造裝置
JP5266722B2 (ja) 2007-11-06 2013-08-21 凸版印刷株式会社 ダイヘッド、塗布装置、光学フィルムの製造方法
JP5157486B2 (ja) 2008-01-30 2013-03-06 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
JP5494788B2 (ja) 2012-12-06 2014-05-21 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
JP6201861B2 (ja) 2014-03-28 2017-09-27 株式会社豊田自動織機 ダイヘッドおよび塗工装置
KR102362174B1 (ko) * 2018-10-01 2022-02-10 주식회사 엘지에너지솔루션 슬롯 다이 코터의 상부 토출구와 하부 토출구 간의 거리를 조절하는 슬롯 다이 코터 조정 장치 및 이를 포함하는 전극 활물질 코팅 시스템
CN210079946U (zh) 2019-03-18 2020-02-18 合肥国轩高科动力能源有限公司 一种双腔挤压式涂布模头
KR102143345B1 (ko) 2019-12-10 2020-08-11 디에이치 주식회사 듀얼 다이 코터

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2892476B2 (ja) * 1990-09-14 1999-05-17 東京エレクトロン株式会社 帯状液体ノズル及び液処理装置及び液処理方法
US5234500A (en) * 1991-09-27 1993-08-10 Eastman Kodak Company Liquid distribution system for photographic coating device
JP2001224998A (ja) * 2000-02-17 2001-08-21 Konica Corp コーティングヘッドおよび塗布方法
JP2002086045A (ja) * 2000-09-20 2002-03-26 Tatsumo Kk 液状物塗布装置
JP2020131082A (ja) * 2019-02-15 2020-08-31 株式会社ヒラノテクシード 塗工装置
KR20200125181A (ko) 2019-04-26 2020-11-04 주식회사 다솜소프트 이사날짜 예측을 통한 부동산 정보 제공 방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4154991A4

Also Published As

Publication number Publication date
CN115427158B (zh) 2024-02-23
US11772119B2 (en) 2023-10-03
EP4154991A1 (en) 2023-03-29
US20230136243A1 (en) 2023-05-04
EP4154991A4 (en) 2023-11-08
CN115427158A (zh) 2022-12-02
KR20220041647A (ko) 2022-04-01

Similar Documents

Publication Publication Date Title
WO2022065710A1 (ko) 매니폴드가 개선된 다중 슬롯 다이 코터
KR20220043030A (ko) 다중 슬롯 다이 코터
US20230140800A1 (en) Slot Die Coater
KR20220043029A (ko) 다중 슬롯 다이 코터
US20230219112A1 (en) Dual Slot Die Coater Including Air Vent
KR102646382B1 (ko) 에어 벤트를 포함하는 듀얼 슬롯 다이 코터
KR102666576B1 (ko) 슬롯 다이 코터
WO2022030902A1 (ko) 다중 슬롯 다이 코터
KR102646381B1 (ko) 듀얼 슬롯 다이 코터
KR102643728B1 (ko) 다중 슬롯 다이 코터
KR20220061010A (ko) 슬롯 다이 코터
KR102638268B1 (ko) 코팅액 유동을 개선한 슬롯 다이 코터
KR20220016782A (ko) 다중 슬롯 다이 코터
KR20220071721A (ko) 코팅액 유동을 개선한 슬롯 다이 코터
KR20220052719A (ko) 듀얼 슬롯 다이 코터
KR102666574B1 (ko) 에어 벤트를 포함하는 듀얼 슬롯 다이 코터
CN219702493U (zh) 一种涂布垫片及挤压涂布机
CN217043263U (zh) 一种涂布垫片及涂布装置
KR20220094459A (ko) 듀얼 슬롯 다이 코터

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21872740

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021872740

Country of ref document: EP

Effective date: 20221219

NENP Non-entry into the national phase

Ref country code: DE