WO2022064931A1 - 湿気硬化性樹脂組成物および硬化物 - Google Patents

湿気硬化性樹脂組成物および硬化物 Download PDF

Info

Publication number
WO2022064931A1
WO2022064931A1 PCT/JP2021/030929 JP2021030929W WO2022064931A1 WO 2022064931 A1 WO2022064931 A1 WO 2022064931A1 JP 2021030929 W JP2021030929 W JP 2021030929W WO 2022064931 A1 WO2022064931 A1 WO 2022064931A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
moisture
resin composition
curable resin
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/030929
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
卓宏 橋本
理之 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ThreeBond Co Ltd
Original Assignee
ThreeBond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ThreeBond Co Ltd filed Critical ThreeBond Co Ltd
Priority to JP2022551210A priority Critical patent/JPWO2022064931A1/ja
Priority to US18/245,363 priority patent/US20230332028A1/en
Priority to CN202180063011.2A priority patent/CN116194524A/zh
Priority to EP21872063.9A priority patent/EP4219629A4/en
Publication of WO2022064931A1 publication Critical patent/WO2022064931A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C09J183/12—Block or graft copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/46—Block-or graft-polymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2003/1034—Materials or components characterised by specific properties
    • C09K2003/1056—Moisture-curable materials

Definitions

  • X to Y is used in the sense that the numerical values (X and Y) described before and after it are included as the lower limit value and the upper limit value, and means "X or more and Y or less”.
  • R, R 1 and R 2 are alkyl groups, they are preferably alkyl groups having 1 to 6 carbon atoms, and more preferably alkyl groups having 1 to 4 carbon atoms. Of these hydrolyzable groups, an alkoxy group is particularly preferable from the viewpoint of excellent thick film curability due to moisture and adhesiveness to aluminum.
  • an alkyl group having 1 to 10 carbon atoms is preferable, an alkyl group having 1 to 6 carbon atoms is more preferable, and an alkyl group having 1 to 4 carbon atoms is further preferable.
  • the alkyl group may be linear, branched or cyclic, but a linear alkyl group is preferable.
  • the hydrolyzable silyl group in (e1) the same hydrolyzable silyl group as in the component (A) can be applied.
  • Example 1 7 parts by mass of methyltrimethoxysilane (KBM-13 manufactured by Shin-Etsu Chemical Industry Co., Ltd.) and 40 parts by mass of alkyl sulfonic acid phenyl ester (Mezamol manufactured by Rankses Co., Ltd.) as the component (F) were added at room temperature. Mixing at (25 ° C.) with a planetary mixer for 60 minutes gave Example 1 as a moisture-curable resin composition.
  • KBM-13 methyltrimethoxysilane
  • alkyl sulfonic acid phenyl ester Melamol manufactured by Rankses Co., Ltd.
  • the spacing between the marked lines is measured with a caliper until the test piece is cut.
  • the rate of growth is defined as the "growth rate (%)" based on the initial mark line interval. Evaluation is based on the following criteria, and the results are shown in Table 2. Further, the elongation rate is preferably 300% or more, more preferably 350% or more, from the viewpoint of high extensibility.
  • "not measurable" in the table means that the test could not be performed because it was not cured to a thickness of 2 mm even after the lapse of the predetermined curing time.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
PCT/JP2021/030929 2020-09-25 2021-08-24 湿気硬化性樹脂組成物および硬化物 Ceased WO2022064931A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022551210A JPWO2022064931A1 (https=) 2020-09-25 2021-08-24
US18/245,363 US20230332028A1 (en) 2020-09-25 2021-08-24 Moisture curable resin composition and cured product
CN202180063011.2A CN116194524A (zh) 2020-09-25 2021-08-24 湿气固化性树脂组合物以及固化物
EP21872063.9A EP4219629A4 (en) 2020-09-25 2021-08-24 MOISTURE-CURING RESIN COMPOSITION AND CURED PRODUCT

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020161322 2020-09-25
JP2020-161322 2020-09-25

Publications (1)

Publication Number Publication Date
WO2022064931A1 true WO2022064931A1 (ja) 2022-03-31

Family

ID=80845084

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/030929 Ceased WO2022064931A1 (ja) 2020-09-25 2021-08-24 湿気硬化性樹脂組成物および硬化物

Country Status (5)

Country Link
US (1) US20230332028A1 (https=)
EP (1) EP4219629A4 (https=)
JP (1) JPWO2022064931A1 (https=)
CN (1) CN116194524A (https=)
WO (1) WO2022064931A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025069707A1 (ja) * 2023-09-29 2025-04-03 積水化学工業株式会社 バッテリ用硬化性接着剤
WO2025105237A1 (ja) * 2023-11-13 2025-05-22 株式会社スリーボンド 硬化性樹脂組成物
WO2025135036A1 (ja) * 2023-12-20 2025-06-26 株式会社スリーボンド 湿気硬化型樹脂組成物、接着剤、シール剤および硬化物
WO2026029118A1 (ja) * 2024-07-31 2026-02-05 積水化学工業株式会社 ２液硬化型熱伝導性組成物、その製造方法、熱伝導性部材、及びバッテリアセンブリ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240401699A1 (en) * 2021-01-29 2024-12-05 Hitachi Astemo, Ltd. Seal part forming method and device assembling method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054174A (ja) 2003-07-18 2005-03-03 Konishi Co Ltd 硬化性樹脂組成物及びそれを含有する湿気硬化型接着剤組成物
JP2009508985A (ja) * 2005-09-15 2009-03-05 モーメンティブ・パフォーマンス・マテリアルズ・インク 有機ビスマス触媒を用いたアミノシラン末端含有ポリマーの調製方法、及びスズ触媒を用いずにそれにより得られる硬化ポリマー
JP2010280880A (ja) * 2009-05-08 2010-12-16 Konishi Co Ltd 硬化性樹脂組成物
JP2013147575A (ja) 2012-01-19 2013-08-01 Kaneka Corp 室温硬化性組成物
JP2014043519A (ja) * 2012-08-27 2014-03-13 Cemedine Co Ltd 硬化性組成物
JP2016521787A (ja) * 2013-06-11 2016-07-25 シーカ・テクノロジー・アーゲー シラン基含有ポリマーと亜鉛触媒とに基づく硬化性組成物
US20160244606A1 (en) * 2015-02-23 2016-08-25 King Industries Curable coating compositions of silane functional polymers
JP2020161322A (ja) 2019-03-26 2020-10-01 矢崎総業株式会社 コネクタ
WO2021119971A1 (en) * 2019-12-17 2021-06-24 Dow Silicones Corporation Sealant composition

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054174A (ja) 2003-07-18 2005-03-03 Konishi Co Ltd 硬化性樹脂組成物及びそれを含有する湿気硬化型接着剤組成物
JP2009508985A (ja) * 2005-09-15 2009-03-05 モーメンティブ・パフォーマンス・マテリアルズ・インク 有機ビスマス触媒を用いたアミノシラン末端含有ポリマーの調製方法、及びスズ触媒を用いずにそれにより得られる硬化ポリマー
JP2010280880A (ja) * 2009-05-08 2010-12-16 Konishi Co Ltd 硬化性樹脂組成物
JP2013147575A (ja) 2012-01-19 2013-08-01 Kaneka Corp 室温硬化性組成物
JP2014043519A (ja) * 2012-08-27 2014-03-13 Cemedine Co Ltd 硬化性組成物
JP2016521787A (ja) * 2013-06-11 2016-07-25 シーカ・テクノロジー・アーゲー シラン基含有ポリマーと亜鉛触媒とに基づく硬化性組成物
US20160244606A1 (en) * 2015-02-23 2016-08-25 King Industries Curable coating compositions of silane functional polymers
JP2020161322A (ja) 2019-03-26 2020-10-01 矢崎総業株式会社 コネクタ
WO2021119971A1 (en) * 2019-12-17 2021-06-24 Dow Silicones Corporation Sealant composition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4219629A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025069707A1 (ja) * 2023-09-29 2025-04-03 積水化学工業株式会社 バッテリ用硬化性接着剤
WO2025105237A1 (ja) * 2023-11-13 2025-05-22 株式会社スリーボンド 硬化性樹脂組成物
WO2025135036A1 (ja) * 2023-12-20 2025-06-26 株式会社スリーボンド 湿気硬化型樹脂組成物、接着剤、シール剤および硬化物
WO2026029118A1 (ja) * 2024-07-31 2026-02-05 積水化学工業株式会社 ２液硬化型熱伝導性組成物、その製造方法、熱伝導性部材、及びバッテリアセンブリ

Also Published As

Publication number Publication date
US20230332028A1 (en) 2023-10-19
EP4219629A4 (en) 2024-10-30
EP4219629A1 (en) 2023-08-02
CN116194524A (zh) 2023-05-30
JPWO2022064931A1 (https=) 2022-03-31

Similar Documents

Publication Publication Date Title
WO2022064931A1 (ja) 湿気硬化性樹脂組成物および硬化物
CN102165016B (zh) 固化性组合物及其固化物
CN103998528B (zh) 导热性湿气固化性树脂组合物
JP5887786B2 (ja) 硬化性組成物
JP5971522B2 (ja) 硬化性組成物
WO2011089987A1 (ja) 難燃性湿気硬化型樹脂組成物、この組成物を含む難燃性湿気硬化型接着剤及びこの接着剤を用いた接着方法
JP2012017427A (ja) 多成分型室温硬化性シリコーンゴム組成物
WO2019088102A1 (ja) 樹脂組成物
US20170029622A1 (en) Room-temperature-curable silicone rubber composition, and the use thereof
WO2015098118A1 (en) Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device
KR101917338B1 (ko) 저아웃가스용 열전도성 조성물
WO2012057281A1 (ja) 硬化性組成物
JP2014070079A (ja) オルガノポリシロキサン組成物
US12516189B2 (en) Curable resin composition, production method thereof and cured product
JP6826581B2 (ja) 硬化性樹脂組成物、その硬化物、及び半導体装置
JP2021008600A (ja) 湿気硬化性樹脂組成物および硬化物
WO2022270196A1 (ja) 湿気硬化型樹脂組成物
JP5644800B2 (ja) ２液混合型オルガノポリシロキサン組成物
US20220396650A1 (en) Resin composition
KR102955756B1 (ko) 경화성 수지 조성물, 그 제조방법 및 경화물
WO2025105394A1 (ja) 湿気硬化性組成物および硬化物
KR20060051555A (ko) 실온 경화성 오르가노폴리실록산 조성물
WO2021085230A1 (ja) ポリフェニレンスルフィド樹脂接着用ポリオルガノシロキサン組成物
TW202532607A (zh) 濕氣硬化型樹脂組成物、接著劑、密封劑及硬化物
JP2010285462A (ja) 難燃性湿気硬化型接着剤組成物

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21872063

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022551210

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2021872063

Country of ref document: EP

Effective date: 20230425