WO2022054153A1 - インクジェットヘッド、インクジェットヘッドの製造方法及びインクジェット記録装置 - Google Patents

インクジェットヘッド、インクジェットヘッドの製造方法及びインクジェット記録装置 Download PDF

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Publication number
WO2022054153A1
WO2022054153A1 PCT/JP2020/034053 JP2020034053W WO2022054153A1 WO 2022054153 A1 WO2022054153 A1 WO 2022054153A1 JP 2020034053 W JP2020034053 W JP 2020034053W WO 2022054153 A1 WO2022054153 A1 WO 2022054153A1
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WO
WIPO (PCT)
Prior art keywords
flow path
substrate
nozzle
silicon
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/034053
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English (en)
French (fr)
Japanese (ja)
Inventor
洋平 佐藤
明久 下村
仁紀 吉田
洋明 香西
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Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to EP20953219.1A priority Critical patent/EP4212343B1/en
Priority to JP2022548283A priority patent/JPWO2022054153A1/ja
Priority to PCT/JP2020/034053 priority patent/WO2022054153A1/ja
Priority to US18/043,709 priority patent/US12172443B2/en
Priority to CN202080103807.1A priority patent/CN116096579B/zh
Publication of WO2022054153A1 publication Critical patent/WO2022054153A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1606—Coating the nozzle area or the ink chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/18—Ink recirculation systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14467—Multiple feed channels per ink chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/11—Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/12—Embodiments of or processes related to ink-jet heads with ink circulating through the whole print head

Definitions

  • the present invention relates to an inkjet head, a method for manufacturing an inkjet head, and an inkjet recording device.
  • a silicon processing process is applied to the nozzle substrate and flow path substrate of the inkjet head to ensure processing accuracy.
  • a process of processing and joining a silicon nozzle substrate and a flow path substrate having a circulation flow path is performed, but the silicon nozzle substrate has a substrate thickness of 100 ⁇ m or less from the viewpoint of flow path design. This may make it difficult to handle during manufacturing. Therefore, when a method is adopted in which a nozzle is formed on a silicon substrate having a support layer, the support layer is removed after joining with the flow path substrate, and a head chip in which the silicon nozzle substrate and the flow path substrate are integrated is manufactured. There is.
  • a liquid-repellent film is formed on the ejection surface of the silicon nozzle substrate in order to stabilize the ejection direction of the ink droplets and improve the ejection performance.
  • Patent Document 1 a manufacturing method for forming a liquid-repellent film after joining a nozzle substrate and a flow path substrate is shown.
  • the liquid-repellent film is also formed in the flow path, it is assumed that the wettability is lowered and injection failure occurs.
  • the process of removing the liquid-repellent film by oxygen plasma treatment or the like is common, but in a flow path structure as shown in Patent Document 1, particularly in a structure having a circulation flow path in the upper stage of the nozzle, oxygen ions or In many cases, oxygen radicals do not reach the flow path and cannot be removed.
  • Patent Document 2 describes a method of forming a liquid-repellent film on the nozzle substrate after nozzle processing and joining the liquid-repellent film to the flow path substrate. There is a concern that it will wrap around. In particular, when an adhesive is used to bond the nozzle substrate and the flow path substrate, if the removal treatment of the liquid-repellent film by oxygen plasma treatment is insufficient, the reliability of the bonded portion is lowered, so that the liquid-repellent film formation is performed by the nozzle. It is desirable to perform this after joining the substrate and the flow path substrate.
  • the present invention has been made in view of the above problems and situations, and a solution thereof is to provide an inkjet head, an inkjet head manufacturing method, and an inkjet recording device having excellent ink ejection properties.
  • the present inventor sets the positional relationship between the nozzles of the silicon nozzle substrate and the circulation flow path of the flow path substrate to satisfy specific conditions in the process of examining the cause of the problem.
  • the present invention has found that an inkjet head including a silicon nozzle substrate in which the formation of a liquid-repellent film in the flow path substrate is suppressed and a flow path substrate having a circulation flow path can be obtained, and the present invention has been made. That is, the above-mentioned problem according to the present invention is solved by the following means.
  • a silicon nozzle substrate having an ink flow path surface and an ink ejection surface facing the flow path surface and having a nozzle penetrating from the flow path surface to the ejection surface.
  • a flow path substrate provided with an ink flow path and a substrate body forming the flow path, which is joined to the flow path surface of the silicon nozzle substrate.
  • a liquid-repellent film provided on the injection surface of the silicon nozzle substrate, and Inkjet head with The flow path substrate extends as a flow path of the ink in a penetrating flow path that penetrates the substrate body so as to face the nozzle and that communicates with the penetrating flow path and extends in a direction away from the nozzle.
  • ⁇ The angle formed by the straight line connecting the end of the first nozzle on the injection surface far from the individual circulation flow path and the end of the second nozzle on the flow path surface on the side close to the individual circulation flow path.
  • Angle L From the straight line orthogonal to the injection surface including the end of the first nozzle, the farthest from the flow path surface among the intersections of the formation surface of the through flow path and the formation surface of the individual circulation flow path in the substrate main body.
  • Distance to the intersection H1 Distance from the injection surface to the intersection farthest from the flow path surface among the intersections of the formation surface of the through flow path and the formation surface of the individual circulation flow path in the substrate main body.
  • the diameter of the nozzle gradually decreases from the flow path surface toward the injection surface, and the ⁇ of the formula 1 is the end of the first nozzle, the flow path surface side of each stage, and the individual.
  • At least two of the individual circulation channels are located on a straight line passing through the center of the nozzle on the channel surface. Cut at a plane orthogonal to the flow path surface of the silicon nozzle substrate so that the center of the nozzle and the through flow path coincide with each other and include the center of the nozzle and the through flow path and the two of the individual circulation flow paths. In the cross section, the two individual circulation channels have a symmetrical relationship.
  • the inkjet head according to item 1 or 2 wherein the positional relationship between the individual circulation flow path, the through flow path, and the nozzle satisfies the following formula 2.
  • liquid-repellent film is composed of a base layer containing a silicon compound and a fluoropolymer layer provided in order from the silicon nozzle substrate side.
  • An inkjet recording apparatus comprising the inkjet head according to any one of items 1 to 7.
  • an inkjet head provided with a silicon nozzle substrate having a liquid repellent film on the injection surface side and a flow path substrate having a circulation flow path, the formation of the liquid repellent film in the flow path substrate is suppressed. Therefore, it is possible to provide an inkjet head having excellent ink ejection properties and a method for manufacturing an inkjet head in which a liquid-repellent film is suppressed from being formed in a flow path substrate during manufacturing. Further, it is possible to provide an inkjet recording apparatus provided with an inkjet head having excellent ink ejection properties.
  • FIG. 6 Schematic diagram showing an example of an embodiment of the inkjet recording apparatus of the present invention.
  • Bottom view of an example of the head unit of the inkjet recording apparatus shown in FIG. Perspective view showing an example of an embodiment of the inkjet head of the present invention.
  • Left-right cross-sectional view of the lower part of the inkjet head shown in FIG. An exploded perspective view of the inkjet head shown in FIG.
  • Sectional drawing of an example of embodiment of a bend mode type head tip Cross-sectional view of a modified example of a laminated body of a liquid-repellent film, a silicon nozzle substrate, and a flow path substrate.
  • Cross-sectional view of a modified example of a laminated body of a liquid-repellent film, a silicon nozzle substrate, and a flow path substrate Enlarged plan view around the nozzle as seen from the flow path substrate side as an example of deformation of the liquid repellent film and the laminate of the silicon nozzle substrate and the flow path substrate.
  • Cross-sectional view of the laminate shown in FIG. 10 cut by XI-XI.
  • FIG. 13 Bottom view of another example of the head unit of the inkjet recording apparatus shown in FIG.
  • FIG. 13 Top view of the silicon nozzle substrate of the head chip shown in FIG.
  • FIG. 13 cut by XVIIIA-XVIIIA.
  • Schematic diagram showing the ink circulation system Cross-sectional view after the first step in an example of the method for manufacturing an inkjet head of the present invention.
  • the scope of the invention is not limited to the illustrated examples.
  • the following direction in which the recording medium M is conveyed is set as the front-rear direction, and the direction orthogonal to the direction in which the recording medium M is conveyed on the printing surface of the recording medium M, that is,
  • the printing width direction of the inkjet head 100 is defined as the left-right direction
  • the thickness direction of the recording medium M is defined as the vertical direction.
  • the arrows in the flow path in the drawing indicate the direction in which the ink flows.
  • FIG. 3 is a perspective view showing an example of an embodiment of the inkjet head of the present invention
  • FIGS. 4 and 5 are a left-right cross-sectional view of the lower portion of the inkjet head 100 shown in FIG. 3 and an exploded perspective view of the inkjet head 100.
  • FIG. 1 is a schematic view of an inkjet recording device 200 equipped with the inkjet head 100 of the present invention shown in FIG. 3, and
  • FIG. 2 is a bottom view of the head unit of the inkjet recording device 200 shown in FIG.
  • the inkjet recording device 200 shown in FIG. 1 includes a paper feeding unit 210, an image recording unit 220, a paper ejection unit 230, an ink circulation system as an ink supply means (see FIG. 19), and the like.
  • the inkjet recording apparatus 200 conveys the recording medium M stored in the paper feeding unit 210 to the image recording unit 220, forms an image on the recording medium M by the image recording unit 220, and discharges the recording medium M on which the image is formed. It is conveyed to the paper unit 230.
  • the paper feed unit 210 has a paper feed tray 211 for storing the recording medium M, and a medium supply unit 212 for transporting and supplying the recording medium M from the paper feed tray 211 to the image recording unit 220.
  • the medium supply unit 212 includes a ring-shaped belt whose inside is supported by two rollers, and the recording medium M is transferred from the paper feed tray 211 by rotating the rollers with the recording medium M placed on the belt. It is conveyed to the image recording unit 220.
  • the image recording unit 220 includes a transfer drum 221, a delivery unit 222, a heating unit 223, a head unit 224, a fixing unit 225, a delivery unit 226, and the like.
  • the transport drum 221 has a cylindrical surface, and the outer peripheral surface thereof is a transport surface on which the recording medium M is placed.
  • the transport drum 221 transports the recording medium M along the transport surface by rotating in the direction of the arrow in FIG. 1 while holding the recording medium M on the transport surface.
  • the transport drum 221 is provided with a claw portion and an intake portion (not shown), the end portion of the recording medium M is pressed by the claw portion, and the recording medium M is attracted to the transport surface by the intake portion on the transport surface. Holds the recording medium M in.
  • the transfer unit 222 is provided at a position between the medium supply unit 212 and the transfer drum 221 of the paper feed unit 210, and one end of the recording medium M transferred from the medium supply unit 212 is held by the swing arm unit 222a and picked up. , Delivery to the transfer drum 221 via the delivery drum 222b.
  • the heating unit 223 is provided between the arrangement position of the transfer drum 222b and the arrangement position of the head unit 224, and the recording medium M conveyed by the transfer drum 221 has a temperature within a predetermined temperature range. Heat M.
  • the heating unit 223 has, for example, an infrared heater or the like, and energizes the infrared heater based on a control signal supplied from the control unit (not shown) to generate heat.
  • the head unit 224 has a rectangular ink ejection surface whose longitudinal direction is orthogonal to the carrying-out direction of the recording medium M (left-right direction), and the ink ejection surface faces the transport drum 221 and is predetermined. They are placed at a distance. The length of the ink ejection surface of the head unit 224 in the longitudinal direction corresponds to the print width on the recording medium M.
  • the head unit 224 ejects ink to the recording medium M at an appropriate timing according to the rotation of the transport drum 221 holding the recording medium M to form an image.
  • the head unit 224 ejects ink to the recording medium M at an appropriate timing according to the rotation of the transport drum 221 holding the recording medium M to form an image.
  • four head units 224 corresponding to four colors of ink of yellow (Y), magenta (M), cyan (C), and black (K) are used as a recording medium M.
  • the colors of Y, M, C, and K are arranged so as to be arranged at predetermined intervals from the upstream side in the transport direction.
  • a pair of inkjet heads 100 adjacent to each other in the front-rear direction are arranged in a staggered manner at different positions in the front-rear direction.
  • the inkjet head 100 has a rectangular ink ejection surface whose left-right direction is the longitudinal direction, and a plurality of nozzles 111 are arranged at substantially equal intervals along the left-right direction on the ink ejection surface.
  • a liquid-repellent film 14 is formed on the ink ejection surface.
  • the head unit 224 is used with the position of the transport drum 221 fixed with respect to the rotation axis when recording an image. That is, the inkjet recording device 200 is an inkjet recording device 200 that records an image in a one-pass drawing method using a line head.
  • the fixing portion 225 has a light emitting portion arranged over the width of the transport drum 221 in the X direction, and irradiates the recording medium M mounted on the transport drum 221 with energy rays such as ultraviolet rays from the light emitting portion. Then, the ink ejected onto the recording medium M is cured and fixed.
  • the light emitting portion of the fixing portion 225 is arranged in the transport direction on the downstream side of the arrangement position of the head unit 224 and on the upstream side of the arrangement position of the delivery drum 226a of the delivery portion 226 so as to face the transfer surface.
  • the delivery unit 226 has a belt loop 226b having a ring-shaped belt whose inside is supported by two rollers, and a cylindrical transfer drum 226a that transfers the recording medium M from the transfer drum 221 to the belt loop 226b.
  • the recording medium M delivered from the transfer drum 221 to the belt loop 226b by the transfer drum 226a is conveyed by the belt loop 226b and sent to the paper ejection unit 230.
  • the paper ejection unit 230 has a plate-shaped paper ejection tray 231 on which the printed recording medium PM sent out from the image recording unit 220 by the delivery unit 226 is placed.
  • the inkjet head 100 of the present embodiment has a head chip 1, a wiring board 2 on which the head chip 1 is arranged, a wiring board 2, and a flexible substrate 3.
  • the drive circuit board 4 connected to the head chip 1, the manifold 5 for storing the ink supplied to the head chip 1, the housing 6 in which the manifold 5 is housed inside, and the housing 6 attached so as to close the bottom opening of the housing 6. It includes a cap receiving plate 7, a cover member 9 attached to the housing 6, and the like.
  • the illustration of the manifold 5 is omitted
  • FIGS. 4 and 5 the illustration of the cover member 9 is omitted.
  • the head chip 1 is a substantially square columnar member that is long in the left-right direction, and the pressure chamber substrate 13, the flow path substrate 12, the silicon nozzle substrate 11, and the liquid-repellent film 14 are laminated in this order from the manifold 5 side. It is configured.
  • the head chip 1 will be described in detail later with reference to FIGS. 6 to 18B.
  • a schematic configuration of the inkjet head 100 will be described below.
  • the silicon nozzle substrate 11 is a plate-shaped body mainly composed of silicon (Si), and has a nozzle 111 penetrating between both main surfaces.
  • the main surface of the silicon nozzle substrate 11 opposite to the flow path substrate 12 constitutes an ink ejection surface.
  • a liquid-repellent film 14 is formed on the ink ejection surface of the silicon nozzle substrate 11.
  • the flow path substrate 12 has a substrate main body that forms an ink flow path and an ink flow path formed by the substrate main body.
  • the flow path substrate 12 has, as an ink flow path, at least a through flow path that penetrates the substrate body and is located facing the nozzle 111, and an individual circulation flow path provided for circulating ink in the inkjet recording apparatus 200. Have.
  • the pressure chamber substrate 13 is a mechanism for applying pressure to the ink in order to eject the ink supplied from the manifold 5 to the head chip 1 from the nozzle 111 of the silicon nozzle substrate toward the recording medium M via the flow path substrate 12. To prepare for.
  • the mechanism for applying the pressure may be a share mode type or a bend mode type.
  • the pressure chamber substrate 13 has, for example, a supply flow path for supplying ink from the manifold 5 to the flow path substrate 12 and a common circulation flow path communicating with the individual circulation flow path of the flow path substrate 12.
  • a part of the ink supplied to the head chip 1 is ejected from the nozzle 111 by pressurization, and the rest is discharged from the head chip 1 via the individual circulation flow path and the common circulation flow path.
  • the ink discharged from the head chip 1 is supplied to the head chip 1 again by the ink circulation system (see FIG. 19).
  • a wiring board 2 is arranged on the upper surface of the head chip 1, and two flexible boards 3 connected to the drive circuit board 4 are provided at both edges of the wiring board 2 along the front-rear direction. Are arranged.
  • the wiring board 2 is formed in a substantially rectangular plate shape that is long in the left-right direction, and has an opening 22 at a substantially central portion thereof.
  • the widths of the wiring board 2 in the left-right direction and the front-back direction are formed to be larger than those of the head chip 1.
  • the opening 22 is formed in a substantially rectangular shape that is long in the left-right direction, and when the head chip 1 is attached to the wiring board 2, the ink supply flow path of the pressure chamber board 13 in the head chip 1 is provided. And the outlet of the common circulation flow path, for example, the inlet of each supply flow path 131 in the head tip 1 shown in FIG. 13 to be described later, and the outlet of the second common circulation flow path 135 are exposed upward. ing.
  • the "inlet" of the ink flow path means the end on the upstream side
  • the "outlet” means the end on the downstream side.
  • the flexible substrate 3 electrically connects the drive circuit board 4 and the electrode portion of the wiring board 2, and the signal from the drive circuit board 4 is provided on the partition wall 136 in the head chip 1 via the flexible substrate 3. It can be applied to the drive electrode.
  • the lower end portion of the manifold 5 is attached and fixed to the outer edge portion of the wiring board 2 by adhesive. That is, the manifold 5 is arranged on the upper side of the pressure chamber substrate 13 of the head chip 1 and is connected to the head chip 1 via the wiring board 2.
  • the manifold 5 is a member formed of resin, is provided on the upper portion of the pressure chamber substrate 13 of the head chip 1, and stores ink supplied to the head chip 1. Specifically, as shown in FIG. 4 and the like, the manifold 5 is formed to be long in the left-right direction, and has a hollow main body portion 52 constituting an ink storage portion 51 and a second ink flow path. It has 1st to 4th ink ports 53 to 56. Further, the ink storage unit 51 is divided into two sections, an upper first liquid chamber 51a and a lower second liquid chamber 51b, by a filter F for removing dust in the ink.
  • the first ink port 53 communicates with the upper right upper end portion of the first liquid chamber 51a and is used for introducing ink into the ink storage portion 51. Further, a first joint 81a is extrapolated to the tip of the first ink port 53.
  • the second ink port 54 communicates with the upper left upper portion of the first liquid chamber 51a and is used to remove air bubbles in the first liquid chamber 51a.
  • a second joint 81b is extrapolated to the tip of the second ink port 54.
  • the third ink port 55 communicates with the upper left upper portion of the second liquid chamber 51b and is used to remove air bubbles in the second liquid chamber 51b.
  • a third joint 82a is extrapolated to the tip of the third ink port 55.
  • the fourth ink port 56 communicates with the discharge liquid chamber 57 communicating with the outlet of the common circulation flow path of the head chip 1, and the ink discharged from the head chip 1 passes through the fourth ink port 56 to the inkjet head. It is discharged to the outside of 100.
  • the housing 6 is, for example, a member formed by a die-casting method using aluminum as a material, and is formed long in the left-right direction. Further, the housing 6 is formed so that the manifold 5 to which the head chip 1, the wiring board 2 and the flexible board 3 are attached can be housed inside, and the bottom surface of the housing 6 is open. Further, mounting holes 68 for mounting the housing 6 on the printer main body side are formed at both ends of the housing 6 in the left-right direction.
  • the cap receiving plate 7 has a nozzle opening 71 formed in a substantially central portion thereof in the left-right direction so that the nozzle substrate 11 is exposed through the nozzle opening 71, so that the housing 6 is exposed. It is attached so as to close the bottom opening.
  • the head chip 1 is characteristic.
  • the laminated structure of the flow path substrate 12, the silicon nozzle substrate 11, and the liquid repellent film 14 is particularly characteristic.
  • the laminated body of the flow path substrate 12, the silicon nozzle substrate 11, and the liquid repellent film 14 in the head chip 1 will be described with reference to FIGS. 6 to 11.
  • FIG. 6 shows the periphery of the nozzle 111 when the laminated body 10A, which is an example of the laminated body of the flow path substrate 12, the silicon nozzle substrate 11, and the liquid repellent film 14 in the inkjet head 100 shown in FIG. 2, is viewed from the flow path substrate 12 side.
  • 7 is an enlarged plan view of the above, and FIG. 7 is a cross-sectional view of the laminated body 10A shown in FIG. 6 cut by VII-VII.
  • FIG. 8A is a cross-sectional view of an example of a share mode type head chip using the laminated body 10A shown in FIGS. 6 and 7.
  • FIG. 8B shows a bend mode type head chip using a laminated body of the flow path substrate 12, the silicon nozzle substrate 11, and the liquid repellent film 14, which has a different configuration from the laminated body 10A, particularly a configuration in which the flow path substrate 12 is different.
  • a cross-sectional view of an example of the embodiment is shown.
  • the laminate shown in FIG. 8B is also the laminate used for the inkjet head 100 shown in FIG. 2, similarly to the laminate 10A.
  • the laminate 10A has a silicon nozzle substrate 11 having an ink flow path surface S1 and an ink ejection surface S2 facing the flow path surface S1 and having a nozzle 111 penetrating from the flow path surface S1 to the ejection surface S2, and a silicon nozzle substrate 11.
  • a flow path substrate 12 having a substrate main body 12a having an ink flow path and a surface for forming the flow path, which is joined to the flow path surface S1 of the above, and a liquid repellent film 14 provided on the injection surface S2 of the silicon nozzle substrate 11.
  • a plurality of nozzles 111 are provided on the silicon nozzle substrate 11 having a substantially rectangular plan view.
  • the nozzles 111 are arranged in a row along the long side direction (left-right direction) of the silicon nozzle substrate 11 and are formed so as to be located substantially at the center in the short side direction (front-back direction).
  • the nozzle 111 has a shape in which the truncated cone is inverted, and the diameter on the flow path surface S1 side is formed larger than the diameter on the injection surface S2 side in a plan view.
  • the diameter of the nozzle 111 is appropriately adjusted according to the specifications of the inkjet head 100.
  • the diameter of the nozzle 111 can be about 20 to 200 ⁇ m on the flow path surface S1 side and about 10 to 100 ⁇ m on the injection surface S2 side in a plan view.
  • the angle ⁇ used in Equation 1 is determined by the height of the nozzle 111 (thickness of the silicon nozzle substrate 11) and the diameters of the nozzles 111 on the flow path surface S1 side and the injection surface S2 side.
  • the shape such as the height and diameter of the nozzle 111 is adjusted so that Equation 1 holds.
  • the number, formation position, and shape of the nozzles 111 on the silicon nozzle substrate 11 are not limited to this. Depending on the design of the inkjet head 100, it is appropriately adjusted so that at least Equation 1 holds.
  • the number and formation positions of the nozzles 111 may be such that a plurality of nozzles 111 are arranged in four rows per row so as to be parallel to the long side direction as in the example shown in FIG. 16 described later.
  • the shape of the nozzle 111 may be such that the cross section gradually decreases from the flow path surface S1 toward the injection surface S2.
  • the silicon nozzle substrate 11 may be a plate-like body composed mainly of silicon (Si), and examples thereof include a substrate made of single crystal silicon whose surface is the (100) plane. Further, the silicon nozzle substrate 11 has an active layer and a support layer of Si forming the nozzle 111, and SOI (Silicon On) in which an oxide film layer (also referred to as a BOX layer) is sandwiched between the active layer and the support layer. An Insulator) substrate can also be used.
  • a material mainly composed of silicon it is possible to process the nozzle with high accuracy, and it is possible to form a nozzle substrate with little error in the position of the nozzle and variation in shape.
  • the thickness of the silicon nozzle substrate 11 is not particularly limited, but it is preferable that the thickness is within the range of 10 to 100 ⁇ m because the effect of the present invention is more remarkable.
  • the thickness of the silicon nozzle substrate 11 is more preferably in the range of 30 to 60 ⁇ m.
  • the flow path substrate 12 extends as an ink flow path in a penetrating flow path 125 penetrating the substrate main body 12a so as to face the nozzle 111, and communicating with the penetrating flow path 125 in a direction away from the nozzle 111. It also has three individual circulation channels 121a, 121b, 121c having a portion overlapping the substrate body 12a in a plan view from the side opposite to the surface S3 joined to the silicon nozzle substrate 11 of the flow path substrate 12.
  • the surface S3 to which the flow path substrate 12 is joined to the silicon nozzle substrate 11 is the lower surface S3 of the substrate main body 12a.
  • the upper surface S4 of the substrate body 12a is joined to the lower surface of the pressure chamber substrate 13 as shown in FIGS. 8A and 8B, for example.
  • the substrate body 12a of the flow path substrate 12 keeps the ink temperature uniform because the through flow path 125 and the individual circulation flow paths 121a, 121b, 121c are easy to process (high accuracy) and have high thermal conductivity. It is preferably made of silicon (Si), stainless steel (SUS) or 42 alloy from the viewpoint of facilitation. Further, the same material can be used for the pressure chamber substrate 13. It is preferable that the material constituting the substrate main body 12a of the flow path substrate 12 and the material constituting the pressure chamber substrate 13 are materials having similar coefficients of thermal expansion to each other.
  • the joining of the pressure chamber substrate 13 and the flow path substrate 12 and the joining of the flow path substrate 12 and the silicon nozzle substrate 11 can be performed with, for example, a known adhesive.
  • the adhesive is appropriately selected from known adhesives according to the constituent materials of each substrate and used.
  • FIG. 8A is a cross-sectional view showing an outline of a case where, for example, the head chip 1 in which the pressure chamber substrate 13 is laminated on the laminated body 10A has a share mode type pressure mechanism.
  • the pressure chamber substrate 13 has an ink supply flow path 131 having substantially the same diameter as the through flow path 125 communicating with the through flow path 125, and a common circulation flow path 134 communicating with the individual circulation flow path 121a.
  • the through flow path 125 and the supply flow path 131 function as a pressure chamber.
  • the partition wall partitioning each supply flow path 131 in the left-right direction repeats the share mode type displacement by the drive electrode, so that pressure is applied to the ink in the pressure chamber and the ink is discharged. It is ejected from the nozzle 111.
  • the common circulation flow path 134 is a flow path that extends in the left-right direction so as to communicate with each individual circulation flow path 121a corresponding to each nozzle 111, and collectively collects ink discharged from each individual circulation flow path 121a. It is a flow path for discharging to the outside of the head chip 1.
  • the individual circulation flow paths 121b and 121c are also communicated with another common circulation flow path 134 of the pressure chamber substrate 13, and the ink collected in the common circulation flow path 134 is discharged to the outside of the head chip 1. Ru.
  • FIG. 8B shows a cross section of an example of an embodiment of a head tip having a bend mode type pressure mechanism.
  • the head chip 1 shown in FIG. 8B is joined to a silicon nozzle substrate 11 having a flow path surface S1 and an ejection surface S2 of ink, a nozzle 111 penetrating from the flow path surface S1 to the ejection surface S2, and a flow path surface S1 of the silicon nozzle substrate 11.
  • the flow path substrate 12 is provided on the pressure chamber substrate 13 bonded to the surface S4 opposite to the surface S3 bonded to the silicon nozzle substrate 11 of the flow path substrate 12, and the injection surface S2 of the silicon nozzle substrate 11. It has a liquid-repellent film 14.
  • the flow path substrate 12 is a through-flow path 125 that penetrates the substrate main body 12a so as to face the nozzle 111 and communicates with the through-flow path 125 from the nozzle 111 as an ink flow path.
  • Individual circulation flow path 121 and individual circulation flow path extending in the direction away from each other and having a portion overlapping the substrate body 12a in a plan view from the side opposite to the surface S3 joined to the silicon nozzle substrate 11 of the flow path substrate 12. It has a common circulation flow path 126 communicating with the road 121.
  • the flow path substrate 12 has a plurality of individual circulation flow paths 121 communicating with the through flow path 125 located facing the nozzle 111, similarly to the laminated body 10A. May be good.
  • the cross section of the head tip 1 cut along the plane orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so as to include the center 111C of the nozzle 111 and the individual circulation flow path 121 is the same in each individual circulation flow path 121. It is composed of shapes.
  • the common circulation flow path 126 has the same function as the common circulation flow path 134 provided on the pressure chamber substrate 13 in the head tip 1 shown in FIG. 8A.
  • the common circulation flow path is provided in the flow path substrate 12 as the common circulation flow path 126.
  • the common circulation flow path 126 is a flow path that extends in the left-right direction so as to communicate with each corresponding individual circulation flow path 121, and collectively heads ink discharged from each individual circulation flow path 121. It is a flow path for discharging to the outside of the chip 1.
  • the individual circulation flow path 121 included in the head chip 1 shown in FIG. 8A has a connecting portion 122 and an extension portion 123 as described later. Whereas it has, it is composed of only the connecting portion 122.
  • the pressure chamber substrate 13 included in the head chip 1 shown in FIG. 8B has a space 13S in contact with the pressure chamber layer 13a, the diaphragm 13V, and the diaphragm 13V in order from the flow path substrate 12, and is placed on the diaphragm 13V inside the space 13S. It has a spacer layer 13b including a piezoelectric element 13P.
  • the pressure chamber substrate 13 has an ink supply flow path 131 that penetrates the spacer layer 13b, the diaphragm 13V, and the pressure chamber layer 13a and communicates with the through flow path 125 of the flow path substrate 12.
  • the supply flow path 131 exists as a supply flow path 131a having a large diameter and functioning as a main pressure chamber.
  • the supply flow path 131 exists as a supply flow path 131b having a diameter smaller than that of the supply flow path 131a in the spacer layer 13b and the diaphragm 13V, and the inlet of the supply flow path 131b is the ink supplied from the manifold 5 to the head chip 1. Ink is supplied to the pressure chamber including the supply flow path 131a and the through flow path 125.
  • the piezoelectric element 13P is displaced by the drive electrode in the pressure chamber substrate 13 due to the bend mode type pressure mechanism, and the diaphragm 13V is displaced thereby, thereby causing the pressure chamber (supply). Pressure is applied to the ink in the flow path 131a and the through flow path 125), and the ink is ejected from the nozzle 111.
  • the positional relationship between the individual circulation flow path 121 and the nozzle 111 satisfies Equation 1.
  • the silicon nozzle substrate 11 and the flow path substrate 12 of the head chip 1 shown in FIG. 8B the positional relationship between the individual circulation flow paths 121 and the nozzle 111 is the equation 1. It meets the requirements. Similar to what will be described later, in FIG. 8B, the position of the height of L ⁇ tan ⁇ on the forming surface F1 of the through flow path 125 is indicated by Y. Also in the cross-sectional view of FIG.
  • Equation 1 the positional relationship between the individual circulation flow path 121 and the nozzle 111 satisfies Equation 1, that is, the position Y at the height of L ⁇ tan ⁇ is above the inlet of the individual circulation flow path 121. You can see that.
  • the ink existing in the through flow path 125 is pressurized and ejected from the nozzle 111.
  • the penetrating flow path 125 is formed so as to penetrate the substrate main body 12a, and the size and position in a plan view are not particularly limited as long as they are positioned so as to face the nozzle 111.
  • the through flow path 125 has a diameter larger than the diameter of the nozzle 111 in a plan view.
  • the flow path substrate 12 forms an ink flow path by the inner wall surface of the substrate main body 12a.
  • the inner wall surface is referred to as an ink flow path forming surface.
  • the formation surface of the through flow path 125 in the substrate main body 12a is indicated by F1.
  • the number of through-passage paths 125 corresponding to one of the nozzles 111 is usually one.
  • the through flow path 125 communicates with the three individual circulation flow paths 121a, 121b, 121c.
  • the number n of the individual circulation channels corresponding to one of the through channels 125 is not particularly limited as long as it is 1 or more.
  • the number is preferably 1 to 4, and 1 or 2 is more preferable from the viewpoint of ease of manufacture.
  • the individual circulation flow paths 121a, 121b, 121c each have a portion (hereinafter, also referred to as a “connecting portion”) 122a, 122b, 122c that communicates with the through flow path 125 and extends in a direction away from the nozzle 111.
  • the connecting portions 122a, 122b, and 122c are the substrate main body 12a in a plan view seen from the side opposite to the surface S3 joined to the silicon nozzle substrate 11 of the flow path substrate 12, that is, in a plan view seen from the upper surface S4 side of the substrate main body 12a. It is the part that overlaps with.
  • the individual circulation flow paths 121a, 121b, 121c further extend upward from the end of the connecting portion 122a, 122b, 122c farthest from the nozzle 111, respectively. It has extension portions 123a, 123b, 123c that reach the position of the upper surface S4 of the main body 12a.
  • the forming surface of the connecting portions 122a, 122b, 122c of the individual circulation flow paths 121a, 121b, 121c is indicated by F2.
  • the forming surfaces of the extension portions 123a, 123b and 123c are indicated by F3.
  • the connecting portion and the extension portion regardless of the number, the connecting portion 122 and the extension portion 123 are used.
  • the flow path cross sections of the connecting portions 122a, 122b, 122c of the individual circulation flow paths 121a, 121b, 121c have a rectangular cross section, and the flow path surface S1 of the silicon nozzle substrate 11 is formed.
  • the lower surface is provided so as to be parallel to the flow path surface S1.
  • the upper surfaces of the connecting portions 122a, 122b, and 122c are the forming surfaces F2 of the substrate main body 12a provided so as to face the flow path surface S1.
  • the shape and formation position of the cross section of the flow path of the connecting portions 122a, 122b, and 122c are not limited to this as long as the conditions of the following formula 1 are satisfied.
  • the cross section of the flow path of the connecting portions 122a, 122b, 122c may have a circular shape including an ellipse, a polygonal shape, or the like.
  • the upper surface and the lower surface of the connecting portions 122a, 122b, and 122c are formed on the substrate main body 12a so as to be parallel to the flow path surface S1 of the silicon nozzle substrate 11 and to face each other at a predetermined distance. It may consist of a pair of forming surfaces F2.
  • the upper surface and the lower surface of the connecting portions 122a, 122b, 122c may be provided at a predetermined angle with respect to the flow path surface S1 of the silicon nozzle substrate 11.
  • the liquid-repellent film 14 is formed so as to cover the entire injection surface S2 of the silicon nozzle substrate 11.
  • the liquid-repellent film 14 is not formed on the surface of a member other than the injection surface S2, specifically, the formation surface of the flow path surface S1 and the nozzle 111 of the silicon nozzle substrate 11, and the inner wall surface of the flow path substrate 12. .
  • the inner wall surface of the flow path substrate 12 is, for example, the formation surface F1 of the through flow path 125, the formation surface F2 of the connecting portions 122a, 122b, 122c of the individual circulation flow paths 121a, 121b, 121c, and the extension portions 123a, 123b, 123c. It is a forming surface F3 of.
  • the positional relationship between the individual circulation flow paths 121a, 121b, 121c and the nozzle 111 satisfies the following formula 1.
  • L x tan ⁇ > H1 formula 1 Each symbol in the formula 1 is a surface orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so that the silicon nozzle substrate 11 and the flow path substrate 12 include the center 111C of the nozzle 111 and the individual circulation flow paths 121a, 121b or 121c. In the cross section cut by, the following meanings are shown.
  • Equation 1 is a cross-sectional view of the laminated body 10A cut along a plane orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so as to include the center 111C of the nozzle 111 and the individual circulation flow path 121a. ..
  • Equation 1 will be described with reference to the cross-sectional view shown in FIG. 7.
  • ⁇ is the first nozzle end portion (the nozzle end portion indicated by “A” in FIG. 7) on the side far from the individual circulation flow path 121a located on the injection surface S2, and is also hereinafter referred to as “nozzle end portion A”.
  • the second nozzle end on the side close to the individual circulation flow path 121a located on the flow path surface S1 (the nozzle end indicated by "B” in FIG. 7, hereinafter also referred to as "nozzle end B"). It is the angle between the straight line connecting the two and the angle formed by the injection surface S2.
  • the individual circulation flow path 121a includes a connecting portion 122a communicating with the penetrating flow path 125 and an extension portion 123a extending from the connecting portion 122a.
  • the intersection of the forming surface F1 of the penetrating flow path 125 and the forming surface of the individual circulation flow path 121a in the substrate main body 12a is the intersection of the forming surface F1 of the penetrating flow path 125 and the forming surface F2 of the connecting portion 122a in the substrate main body 12a. Is.
  • the connecting portion 122a of the individual circulation flow path 121a uses the flow path surface S1 of the silicon nozzle substrate 11 as the lower surface. Therefore, in the cross section shown in FIG. 7, the intersection of the forming surface F1 and the forming surface F2 is one point, and that point is the intersection point X farthest from the flow path surface S1.
  • the intersection point X indicates the point farthest from the flow path surface S1 at the boundary between the through flow path 125 and the connecting portion 122a. In other words, the intersection X indicates the point farthest from the flow path surface S1 at the entrance of the connecting portion 122a.
  • FIGS. 9A and 9B there are two intersections of the forming surface F1 and the forming surface F2, and in the present invention, the point farthest from the flow path surface S1 is used as an index as the intersection point X.
  • H1 is the distance from the injection surface S2 to the intersection X farthest from the flow path surface S1 among the intersections of the formation surface F1 of the through flow path 125 and the formation surface of the individual circulation flow path 121a in the substrate main body 12a.
  • the length of L ⁇ tan ⁇ and the length of H1 are shown side by side with double arrows with broken lines.
  • the position separated from the injection surface S2 by L ⁇ tan ⁇ upward is referred to as the height of L ⁇ tan ⁇
  • the position of the height of L ⁇ tan ⁇ on the forming surface F1 of the through-flow path 125 is indicated by Y. ..
  • the positional relationship between the inlet of the connecting portion 122a of the individual circulation flow path 121a, specifically, the individual circulation flow path 121a and the nozzle 111 satisfies Equation 1.
  • the position Y of the height of L ⁇ tan ⁇ on the forming surface F1 of the through-flow path 125 is the intersection of the forming surface F1 of the through-flow path 125 and the forming surface of the individual circulation flow path 121a in the substrate main body 12a. Of these, it is located above the intersection X farthest from the flow path surface S1.
  • liquid-repellent film 14 examples include a liquid-repellent film made of a fluoropolymer layer. It is preferable that the liquid-repellent film 14 is further composed of a base layer containing a silicon compound and a fluoropolymer layer provided in order from the injection surface S2 side of the silicon nozzle substrate 11.
  • the formation of the liquid-repellent film 14 may be performed on the injection surface S2 of the silicon nozzle substrate 11 alone before joining the silicon nozzle substrate 11 and the flow path substrate 12, for example, with the silicon nozzle substrate 11. This may be performed on the injection surface S2 of the silicon nozzle substrate 11 in the laminated body after the flow path substrate 12 is joined.
  • the formation of the liquid-repellent film 14 is usually performed on the laminated body after joining the silicon nozzle substrate 11 and the flow path substrate 12.
  • the fluorine polymer layer a layer formed by using a raw material fluorine polymer having a hydrolyzable silyl group and a long-chain hydrocarbon group substituted with a fluorine atom or a polyoxyalkylene group substituted with a fluorine atom is preferable.
  • a perfluoropolyether compound having a hydrolyzable silyl group is preferable. It is more preferable that the perfluoropolyether compound has a fluoroalkyl group, preferably a perfluoroalkyl group, at a terminal different from that having a hydrolyzable silyl group.
  • a commercially available product for example, Optool (registered trademark, manufactured by Daikin Industries, Ltd.) or the like may be used.
  • a silanol group Si—OH group
  • the silanol group and the hydrolyzable silyl group are hydrolyzed and condensed.
  • a strong siloxane bond Si—O—Si
  • the liquid-repellent film 14 thus formed has a fluoropolymer chain, for example, a perfluoropolyether chain extending from the bonding end with the silicon nozzle substrate 11 and is present on the surface thereof, whereby, for example, the outermost surface thereof. It has liquid repellency by being configured to have a perfluoroalkyl group.
  • a siloxane bond (Si-) is formed between the base layer and the fluoropolymer layer. O—Si) may be formed.
  • the underlayer preferably has at least a silicon oxide (SiO 2 ) layer on the fluoropolymer layer side.
  • the base layer can be formed by a known method such as vapor deposition, sputtering, or CVD. The thickness of the base layer can be approximately 10 to 100 nm.
  • liquid repellent film 14 for example, a fluoropolymer layer is formed on the injection surface S2 of the silicon nozzle substrate 11, for example, a composition containing a raw material fluoropolymer (hereinafter, “liquid repellent”) is applied to the injection surface S2 and cured.
  • the method of causing is used. Curing includes drying and reaction, for example, the hydrolysis condensation reaction described above.
  • the liquid repellent may consist only of the raw material fluoropolymer or may contain a solvent. Further, any solid component may be contained if necessary. Examples of the method for applying the liquid repellent agent include vapor deposition and the like.
  • a fluoropolymer layer is formed by vapor deposition from the injection surface S2 side of the silicon nozzle substrate 11 on a laminate in which the flow path substrate 12 and the silicon nozzle substrate 11 are joined.
  • the liquid repellent which is the vapor deposition source is arranged on the injection surface S2 side to perform the vapor deposition.
  • the liquid repellent adheres to the injection surface S2 of the silicon nozzle substrate 11 and the inner wall surface (forming surface) of the nozzle 111, and also enters the inside of the flow path substrate 12 from the nozzle 111 and adheres to the inner wall surface of the substrate main body 12a. ..
  • the liquid repellent does not adhere to the inner wall surface from the injection surface S2 to the position Y at the height of L ⁇ tan ⁇ , but adheres to the inner wall surface above it. ..
  • the positional relationship between the inlet of the connecting portion 122a of the individual circulation flow path 121a and the nozzle 111 satisfies Equation 1. That is, the inlet of the connecting portion 122a of the individual circulation flow path 121a is entirely below the position Y at the height of L ⁇ tan ⁇ . As a result, the liquid repellent does not adhere to the formed surface F2 of the connecting portion 122a of the individual circulation flow path 121a and the portion of the flow path surface S1 corresponding to the lower surface of the connecting portion 122a in the substrate main body 12a.
  • the liquid repellent adhering to the above position of the laminate of the flow path substrate 12 and the silicon nozzle substrate 11 is cured to form a liquid repellent film. Since the curing is usually performed by heating, it enters the inside of the flow path substrate 12 during heating and adheres to the inner wall surface, specifically, the inner wall surface existing above the position Y at the height of L ⁇ tan ⁇ .
  • the liquid repellent also cures to form a liquid repellent film.
  • the liquid-repellent film formed on the inner wall surface of the flow path substrate 12 is treated from the side opposite to the silicon nozzle substrate 11 of the flow path substrate 12, that is, from the upper side, for example, UV ozone irradiation, oxygen plasma irradiation, etc. It can be selectively removed by processing.
  • the liquid repellent film is not formed on the formed surface F2 of the connecting portion 122a of the individual circulation flow path 121a and the portion of the flow path surface S1 corresponding to the lower surface of the connecting portion 122a. Therefore, substantially all of the liquid-repellent film formed on the inner wall surface of the flow path substrate 12 can be removed by UV ozone irradiation or oxygen plasma irradiation from the upper side of the flow path substrate 12. In addition, this method also makes it possible to remove the liquid-repellent film formed on the forming surface of the nozzle 111.
  • the laminated body 10A in which the liquid repellent film 14 is formed only on the injection surface S2 of the silicon nozzle substrate 11 can be obtained.
  • the liquid-repellent film 14 does not necessarily have to be formed on the entire surface of the injection surface S2 as long as it is formed at least around the nozzle 111, but it is preferably formed on the entire surface.
  • the cross section of the laminated body 10A shown in FIG. 7 cut by a plane orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so as to include the center 111C of the nozzle 111 and the individual circulation flow path 121a satisfies the formula 1.
  • a cross section cut along a plane orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so as to include the center 111C of the nozzle 111 and the individual circulation flow path 121b that is, the laminated body 10A shown in FIG. Equation 1 is also satisfied in the cross section cut in B.
  • a cross section cut along a plane orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so as to include the center 111C of the nozzle 111 and the individual circulation flow path 121c, that is, the laminate 10A shown in FIG. 6 is cut by CC. Equation 1 is also satisfied in the cross section.
  • the positional relationship with the nozzle 111 in all of the three individual circulation flow paths 121a, 121b, and 121c of the laminated body 10A satisfies the equation 1, and thus, in the laminated body 10A, the injection surface S2 is liquid-repellent.
  • the film 14 is formed, the liquid-repellent film is not formed on the inner wall surface of the flow path substrate 12 at a portion that is difficult to remove, and the liquid-repellent film formed on the inner wall surface of the flow path substrate 12 in the subsequent treatment. Can be removed efficiently.
  • Equation 1 the application of Equation 1 will be described in the case where the cross section of the nozzle 111 in the silicon nozzle substrate 11 gradually decreases from the flow path surface S1 toward the injection surface S2.
  • the laminated body 10B whose cross section is shown in FIG. 9A and the laminated body 10C whose cross section is shown in FIG. 9B are the same laminated bodies as the laminated body 10A in which the enlarged plan view around the nozzle 111 seen from the flow path substrate 12 side is substantially the same.
  • the laminated body 10A, the laminated body 10B, and the laminated body 10C are laminated bodies having the same plan view except that the diameters of the flow path surfaces S1 of the nozzles 111 are different.
  • the laminated body 10B and the laminated body 10C have a configuration in which the diameter of the nozzle 111 of the silicon nozzle substrate 11 in a plan view gradually decreases from the flow path surface S1 to the injection surface S2.
  • the number of stages constituting the nozzle 111 is two, respectively, but the number of stages can be appropriately selected.
  • the cross-sectional shape of the nozzle 111 in each stage is not particularly limited as long as it is formed so as to satisfy Equation 1.
  • the cross-sectional view of the laminated body 10B shown in FIG. 9A is a cross-sectional view cut along a plane orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so as to include the center 111C of the nozzle 111 and the individual circulation flow path 121a.
  • the laminated body 10B shown in FIG. 9A is different from the laminated body 10A in that the cross section of the nozzle 111 of the silicon nozzle substrate 11 decreases in two steps from the flow path surface S1 toward the injection surface S2.
  • the nozzle 111 in the laminated body 10B has a diameter of an opening in the flow path surface S1 larger than that of the nozzle 111 of the laminated body 10A, and the diameter is greatly reduced in the first step from the flow path surface S1 toward the injection surface S2 in two steps. There is no reduction in diameter in the eyes.
  • the nozzle end A (injection surface S2) is set as ⁇ in the equation 1.
  • the angle between the straight line connecting the nozzle end on the side far from the individual circulation flow path 121a located in, the end on the flow path surface S1 side of each stage and the side close to the individual circulation flow path 121a, and the angle formed by the injection surface S2. Use the largest angle.
  • the nozzle end Since the angle formed by the straight line connecting the portion A and the nozzle end portion B1 and the injection surface S2 is larger, the angle is defined as ⁇ in the equation 1.
  • the laminated body 10B shown in FIG. 9A with respect to the flow path substrate 12, the point that the upper surface and the lower surface of the connecting portion 122a of the individual circulation flow path 121a are both formed by the forming surface F2 on the substrate main body 12a is the laminated body. Different from 10A. Therefore, the laminated body 10B has two intersections of the forming surface F1 of the through flow path 125 and the forming surface F2 of the connecting portion 122a.
  • the intersection X according to L used in the equation 1 is the intersection farthest from the flow path surface S1 among these intersections, that is, the point farthest from the flow path surface S1 at the entrance of the connecting portion 122a.
  • FIG. 9A the length of L ⁇ tan ⁇ and the length of H1 are shown side by side with double arrows with broken lines.
  • the position of the height of L ⁇ tan ⁇ on the forming surface F1 of the through flow path 125 is indicated by Y.
  • the positional relationship between the inlet of the individual circulation flow path 121a, specifically, the connecting portion 122a of the individual circulation flow path 121a and the nozzle 111 is the equation 1 as in the laminated body 10A. You can see that it meets. That is, in FIG.
  • the position Y at the height of L ⁇ tan ⁇ on the formation surface F1 of the through flow path 125 is the intersection of the formation surface F1 of the through flow path 125 and the formation surface of the individual circulation flow path 121a in the substrate main body 12a. Of these, it is located above the intersection X farthest from the flow path surface S1.
  • the positional relationship with the nozzle 111 in all of the three individual circulation flow paths 121a, 121b, 121c of the laminated body 10B satisfies the equation 1, and thus, in the laminated body 10B, the injection surface S2 is liquid-repellent.
  • the film 14 is formed, the liquid-repellent film is not formed on the inner wall surface of the flow path substrate 12 at a portion that is difficult to remove, and the liquid-repellent film formed on the inner wall surface of the flow path substrate 12 in the subsequent treatment. Can be removed efficiently.
  • the cross-sectional view of the laminated body 10C shown in FIG. 9B is a cross-sectional view cut along a plane orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so as to include the center 111C of the nozzle 111 and the individual circulation flow path 121a.
  • the laminated body 10C shown in FIG. 9B is different from the laminated body 10A in that the cross section of the nozzle 111 of the silicon nozzle substrate 11 decreases in two steps from the flow path surface S1 toward the injection surface S2.
  • the nozzle 111 in the laminated body 10C has a diameter of an opening in the flow path surface S1 larger than that of the nozzle 111 of the laminated body 10A, and the diameter is reduced in the first step from the flow path surface S1 toward the injection surface S2 in the second step. Then there is no decrease in diameter.
  • the diameter of the opening provided in the flow path surface S1 is smaller than that of the nozzle 111 of the laminated body 10B, and the reduction rate of the diameter in the first stage is small.
  • the nozzle end Since the angle formed by the straight line connecting the portion A and the nozzle end portion B2 and the injection surface S2 is larger, the angle is defined as ⁇ in Equation 1.
  • the connecting portion 122a of the individual circulation flow path 121a is formed on the forming surface F2 on the substrate main body 12a on both the upper surface and the lower surface, and further with the flow path surface S1.
  • the laminated body 10C has two intersections of the forming surface F1 of the through flow path 125 and the forming surface F2 of the connecting portion 122a.
  • the intersection X according to L used in the equation 1 is the intersection farthest from the flow path surface S1 among these intersections, that is, the point farthest from the flow path surface S1 at the entrance of the connecting portion 122a.
  • FIG. 9B the length of L ⁇ tan ⁇ and the length of H1 are shown side by side with a double arrow of a broken line.
  • the position of the height of L ⁇ tan ⁇ on the forming surface F1 of the through flow path 125 is indicated by Y.
  • the positional relationship between the inlet of the individual circulation flow path 121a, specifically, the connecting portion 122a of the individual circulation flow path 121a and the nozzle 111 is the equation 1 as in the laminated body 10A. You can see that it meets. That is, in FIG.
  • the position Y at the height of L ⁇ tan ⁇ on the formation surface F1 of the through flow path 125 is the intersection of the formation surface F1 of the through flow path 125 and the formation surface of the individual circulation flow path 121a in the substrate main body 12a. Of these, it is located above the intersection X farthest from the flow path surface S1.
  • the positional relationship with the nozzle 111 in all of the three individual circulation flow paths 121a, 121b, and 121c of the laminated body 10C satisfies the equation 1, and thus, in the laminated body 10C, the injection surface S2 is liquid-repellent.
  • the film 14 is formed, the liquid-repellent film is not formed on the inner wall surface of the flow path substrate 12 at a portion that is difficult to remove, and the liquid-repellent film formed on the inner wall surface of the flow path substrate 12 in the subsequent treatment. Can be removed efficiently.
  • the centers of the nozzle 111 and the through flow path 125 coincide with each other in a plan view seen from the upper surface S4 side of the flow path substrate 12, and the centers of the nozzle 111 and the through flow path 125 are separated from each other.
  • the cross section cut along the plane orthogonal to the flow path surface S1 of the silicon nozzle substrate 11 so as to include two of the circulation flow paths 121 the laminated body in the case where the two individual circulation flow paths 121 have a symmetrical relationship is described in Equation 2.
  • Equation 2 explain the application.
  • FIG. 10 shows the periphery of the nozzle 111 when the laminated body 10D, which is an example of the laminated body of the flow path substrate 12, the silicon nozzle substrate 11, and the liquid repellent film 14 in the inkjet head 100 shown in FIG. 2, is viewed from the flow path substrate 12 side.
  • 11 is an enlarged plan view of the above, and FIG. 11 is a cross-sectional view of the laminated body 10D shown in FIG. 10 cut by XI-XI.
  • the laminated body 10D has two individual circulation flow paths 121a and 121b, and these individual circulation flow paths 121a and 121b are located on a straight line passing through the center of the nozzle 111 on the flow path surface S1.
  • the center 111C of the nozzle 111 and the center 125C of the through flow path 125 coincide with each other in a plan view seen from the upper surface S4 side of the flow path substrate 12.
  • the silicon nozzle substrate 11 and the liquid-repellent film 14 in the laminated body 10D have the same configuration as the laminated body 10A.
  • the flow path substrate 12 of the laminated body 10D has two individual circulation flow paths 121a and 121b having connecting portions 122a and 122b extending in the front-rear direction about the through flow path 125, respectively.
  • the cross section of the laminated body 10D shown in FIG. 11 cut by XI-XI is formed on the flow path surface S1 of the silicon nozzle substrate 11 so as to include the center of the nozzle 111 and the through flow path 125 and the two individual circulation flow paths 121a and 121b. It is a cross section cut by orthogonal planes. In the cross section shown in FIG. 11, the two individual circulation flow paths 121a and 121b are symmetrical with respect to the through flow path 125.
  • the individual circulation flow path 121a in the flow path substrate 12 of the laminated body 10D has the same configuration as the individual circulation flow path 121a in the flow path substrate 12 of the laminated body 10A, and communicates with the through flow path 125 toward the direction away from the nozzle 111. It is composed of an extending connecting portion 122a and an extending portion 123a extending upward from the end of the connecting portion 122a on the farthest side from the nozzle 111 and reaching the position of the upper surface S4 of the substrate main body 12a.
  • the individual circulation flow path 121b which has a symmetrical relationship with the individual circulation flow path 121a, extends upward from the connecting portion 122b and the connecting portion 122b that communicate with the through flow path 125 and extend in the direction away from the nozzle 111. It is composed of an extension portion 123b that reaches the position of the upper surface S4 of the substrate main body 12a.
  • the positional relationship between the individual circulation flow paths 121a and 121b and the nozzle 111 satisfies Equation 1.
  • the nozzle end on the side far from the individual circulation flow path 121a located on the injection surface S2 is Ai
  • Bi is the nozzle end on the side closer to 121a.
  • the angle between the straight line connecting the nozzle end Ai and the nozzle end Bi and the angle formed by the injection surface S2 is ⁇ , and L ⁇ tan ⁇ can be obtained in the same manner as in the case of the laminated body 10A.
  • the nozzle end on the side far from the individual circulation flow path 121b located on the injection surface S2 is designated as Aii, and the individual circulation is located on the flow path surface S1.
  • the nozzle end on the side close to the flow path 121a is referred to as Bii.
  • the angle between the straight line connecting the nozzle end Aii and the nozzle end Bii and the angle formed by the injection surface S2 is ⁇ , and L ⁇ tan ⁇ can be obtained in the same manner as in the case of the laminated body 10A.
  • the individual circulation flow path 121a and the individual circulation flow path 121b have the above-mentioned symmetrical positional relationship, and the angles ⁇ and L ⁇ tan ⁇ show the same values.
  • the position of the height of L ⁇ tan ⁇ on the forming surface F1 of the through flow path 125 is indicated by Y.
  • the description of L is omitted.
  • the distance from the flow path surface S1 of the silicon nozzle substrate 11 to the position Y at the height of L ⁇ tan ⁇ is indicated by H3.
  • the inlets of the individual circulation flow paths 121a and 121b, specifically, the connecting portions 122a and 122b of the individual circulation flow paths 121a and 121b and the nozzle 111 As shown in FIG. 11, also in the laminated body 10D, similarly to the laminated body 10A, the inlets of the individual circulation flow paths 121a and 121b, specifically, the connecting portions 122a and 122b of the individual circulation flow paths 121a and 121b and the nozzle 111. It can be seen that the positional relationships satisfy Equation 1. That is, in FIG. 11, the position Y at the height of L ⁇ tan ⁇ on the forming surface F1 on the individual circulation flow path 121a side of the through flow path 125 is the formation surface F1 of the through flow path 125 in the substrate main body 12a and the individual circulation flow path. It is located above the intersection X of the forming surface F2 of 121a.
  • the position Y at the height of L ⁇ tan ⁇ on the formation surface F1 on the individual circulation flow path 121b side of the through flow path 125 is the formation of the formation surface F1 of the through flow path 125 and the individual circulation flow path 121b in the substrate main body 12a. It is located above the intersection X of the surface F2.
  • the positional relationship between the individual circulation flow paths 121a and 121b, the through flow path 125, and the nozzle 111 satisfies the following formula 2.
  • Equation 2 (W-D2) / (D1 + D2) ⁇ t> H2 equation 2
  • Equation 2 will be described with reference to the cross-sectional view shown in FIG.
  • D1 is the diameter of the nozzle 111 on the injection surface S2 of the silicon nozzle substrate 11.
  • D2 is the diameter of the nozzle 111 on the flow path surface S1 of the silicon nozzle substrate 11.
  • t is the thickness of the silicon nozzle substrate 11. It is preferable that D1, D2 and t in the silicon nozzle substrate 11 are in the same range as described in the laminated body 10A.
  • W is the width of the through flow path 125, and in FIG. 11, the formation surface F1 of the through flow path 125 on the side communicating with the individual circulation flow path 121a and the through flow path 125 on the side communicating with the individual circulation flow path 121b are formed. The distance from the surface F1.
  • H2 is from the flow path surface S1 of the silicon nozzle substrate 11 to the intersection point X farthest from the flow path surface S1 among the intersections of the formation surface F1 of the through flow path 125 in the substrate main body 12a and the formation surfaces F2 of the individual circulation flow paths 121a and 121b. Is the distance.
  • H3 and H2 are arranged side by side near the entrance of the individual circulation flow path 121b and are indicated by double-headed arrows.
  • H3> H2 with respect to the positional relationship between the individual circulation flow paths 121a and 121b, the through flow path 125, and the nozzle 111, and it can be seen that the equation 2 is satisfied.
  • satisfying the formula 1 and satisfying the formula 2 have the same meaning.
  • the laminated body 10D has a flow when the liquid repellent film 14 is formed on the injection surface S2 by satisfying the positional relationship between the individual circulation flow paths 121a and 121b and the through flow path 125 and the nozzle 111 in the formulas 1 and 2.
  • the liquid-repellent film is not formed on the inner wall surface of the road substrate 12 where it is difficult to remove, and the liquid-repellent film formed on the inner wall surface of the flow path substrate 12 can be efficiently removed by the subsequent treatment.
  • the number of rows of the nozzles 111 is four will be described with reference to FIGS. 12 to 18B.
  • the number and arrangement of the nozzles 111 can be appropriately changed.
  • the number of rows may be one, the number of rows may be one from two to three, and the number of rows may be five or more. You may.
  • FIG. 12 is a bottom view of another example of the head unit 224 of the inkjet recording apparatus 200 shown in FIG. 1, which is different from that shown in FIG.
  • the number of rows of the nozzles 111 in the inkjet head 100 shown in FIG. 2 is one row, whereas the number of rows of the nozzles 111 in the inkjet head 100 is four rows.
  • the perspective view of the inkjet head 100 having four rows of nozzles 111 and the cross-sectional view of the lower portion of the inkjet head 100 in the left-right direction are the same as those shown in FIGS. 3 and 4.
  • FIG. 13 shows an exploded perspective view of the head chip 1 constituting the inkjet head 100 of the head unit 224 shown in FIG. 14A and 14B show a plan view and a bottom view of the pressure chamber substrate 13 of the head tip 1 shown in FIG. 13, respectively.
  • 15A and 15B show a plan view and a bottom view of the flow path substrate 12 of the head chip 1 shown in FIG. 13, respectively.
  • FIG. 16 shows a plan view of the silicon nozzle substrate 11 of the head chip 1 shown in FIG. 17A to 18B are cross-sectional views taken by cutting the head chip 1 shown in FIG. 13 with XVIIA-XVIIA, XVIIB-XVIIB, XVIIIA-XVIIIA and XVIIIB-XVIIIB, respectively.
  • the head chip 1 is a substantially square columnar member that is long in the left-right direction, and is configured by sequentially laminating a pressure chamber substrate 13, a flow path substrate 12, a silicon nozzle substrate 11, and a liquid-repellent film 14. (FIGS. 13-18B). In FIG. 13, the silicon nozzle substrate 11 and the liquid repellent film 14 are shown without being decomposed.
  • the head chip 1 shown in FIG. 13 is a head chip having a share mode type pressure mechanism.
  • the pressure chamber substrate 13 is provided with a supply flow path 131, an air chamber 132, a common circulation flow path 133, and the like (see FIGS. 13, 14A, 14B, etc.).
  • a large number of supply flow paths 131 and air chambers 132 are provided so as to be alternately arranged in the left-right direction, and are provided in four rows in the front-rear direction.
  • the supply flow path 131 has a substantially rectangular cross section and is formed along the vertical direction, has an inlet on the upper surface of the pressure chamber substrate 13, and has an outlet on the lower surface.
  • the supply flow path 131 communicates with the ink storage section 51 of the manifold 5 at the upward end, and ink is supplied to the supply flow path 131 from the ink storage section 51 and enters the inside of the supply flow path 131. Stores ink for ejection from the nozzle 111.
  • the supply flow path 131 of the pressure chamber substrate 13 together with the through flow path 125 of the flow path substrate 12 constitutes a pressure chamber in the share mode type pressure mechanism.
  • the pressure chamber is vertically extended so as to have a substantially rectangular cross section of the same area across the supply flow path 131 of the pressure chamber substrate 13 and the through flow path 125 of the flow path substrate 12. It is configured along the direction and communicates with the nozzle 111 at the lower end (see FIGS. 17A, 17B, etc.).
  • the air chamber 132 has a substantially rectangular cross section slightly larger than the supply flow path 131, and is formed so as to be parallel to the supply flow path 131 along the vertical direction. Further, unlike the supply flow path 131, the air chamber 132 is not communicated with the ink storage unit 51, so that ink does not flow into the air chamber 132. Further, the air chamber 132 is not communicated with the nozzle 111 (see FIGS. 17A, 17B, etc.).
  • the supply flow path 131 and the air chamber 132 are separated by a partition wall 136 as a pressure generating means formed of a piezoelectric material (see FIG. 18A).
  • a drive electrode (not shown) is provided on the partition wall 136, and when a voltage is applied to the drive electrode, the partition wall 136 portion between the adjacent supply flow paths 131 repeats the displacement of the share mode type, thereby supplying the supply flow path. Pressure is applied to the ink in 131.
  • the supply flow path 131 located at the end in the left-right direction having the partition wall 136 on only one side is not used, and the partition walls 136 are provided on both sides of the other side.
  • the supply flow path 131 having is used.
  • the supply flow path 131 may be formed only by the supply flow path 131 without providing the air chamber 132, it is preferable to provide the supply flow path 131 and the air chamber 132 alternately as described above. As a result, the supply flow paths 131 can be prevented from being adjacent to each other, so that when the partition wall 136 adjacent to one supply flow path 131 is deformed, it can be prevented from affecting the other supply flow paths 131.
  • the common circulation flow path 133 is configured by connecting the first common circulation flow path 134 and the second common circulation flow path 135 (see FIGS. 13 and 14B, etc.).
  • the first common circulation flow path 134 is located on the front side, the rear side, and the center of the head tip 1 so as to avoid the portion where the supply flow path 131 and the air chamber 132 are provided on the lower surface side of the pressure chamber substrate 13.
  • Three rows are arranged side by side in the portion along the left-right direction.
  • the individual circulation flow path 121 includes a connecting portion 122 communicating with the penetrating flow path 125 and an extension portion 123 extending from the connecting portion 122. Ink is discharged from the through flow path 125 of the flow path substrate 12 through the connecting portion 122 and from the extension portion 123 so that the ink can be merged in the first common circulation flow path 134 (FIGS. 14B, 15A and 17A, 17B). ). Further, the first common circulation flow path 134 is connected to the second common circulation flow path 135 capable of discharging ink to the outside of the head chip 1 near the right end portion. Therefore, the first common circulation flow path 134 is a flow path in which the ink flowing from the extension portion 123 of the individual circulation flow path 121 flows toward the second common circulation flow path 135.
  • the second common circulation flow path 135 is formed along the vertical direction like the supply flow path 131. Further, in the second common circulation flow path 135, the lower surface side of the pressure chamber substrate 13 communicates with the first common circulation flow path 134, and the upper surface side communicates with the discharge liquid chamber 57 of the manifold 5. It is a flow path for discharging the ink flowing from the circulation flow path 134 toward the upper side (the side opposite to the silicon nozzle substrate 11 side) to the outside of the head chip 1. Further, the second common circulation flow path 135 is provided near the right end portion of the head chip 1 and communicates with the first common circulation flow path 134. Further, the second common circulation flow path 135 is provided so as to have a larger volume than the individual supply flow paths 131, so that the ink discharge efficiency can be improved.
  • the flow path substrate 12 includes a through flow path 125 that communicates with the supply flow path 131 of the pressure chamber substrate 13 and is formed along the vertical direction so as to have a substantially rectangular cross section having the same area as the supply flow path 131. , An individual circulation flow path 121 that is branched from the through flow path 125 is formed (see FIGS. 17A and 17B, etc.).
  • the through flow path 125 of the flow path substrate 12 and the supply flow path 131 of the pressure chamber substrate 13 are combined to function as a pressure chamber.
  • the individual circulation flow path 121 includes a connecting portion 122 communicating with the penetrating flow path 125 and an extension portion 123 extending from the connecting portion 122.
  • the inlet of the connecting portion 122 is connected to the through flow path 125
  • the outlet of the extension portion 123 is connected to the first common circulation flow path 134
  • the ink of the through flow path 125 is first common. It is a flow path for discharging to the circulation flow path 134.
  • two individual circulation flow paths 121 may be provided, one in the front direction and one in the rear direction of the supply flow path 131, so that bubbles, foreign substances, etc. can be ink. At the same time, it is preferable because the effect of facilitating discharge can be obtained and the production efficiency is high.
  • the silicon nozzle substrate 11 has an ink flow path surface S1 and an ink ejection surface S2 facing the flow path surface S1, and has a nozzle 111 penetrating from the flow path surface S1 to the ejection surface S2.
  • the flow path substrate 12 is bonded to the flow path surface S1 of the silicon nozzle substrate 11, and the liquid repellent film 14 is provided on the injection surface S2 of the silicon nozzle substrate 11.
  • the nozzle 111 formed by the silicon nozzle substrate 11 is provided so as to correspond to each through channel 125 of the channel substrate 12.
  • the structure of the silicon nozzle substrate 11 and the liquid-repellent film 14 can be, for example, the same as those in the laminated bodies 10A to 10D.
  • the XVIIA-XVIIA cross section (FIG. 17A) and the XVIIB-XVIIB cross section (FIG. 17B) of the head tip 1 shown in FIG. 13 are a pressure chamber substrate 13, a flow path substrate 12, a silicon nozzle substrate 11, and a liquid repellent film 14.
  • the positional relationship between each of the individual circulation flow paths 121 and the nozzle 111 in the cross section satisfies the above equation 1.
  • the ink circulation system 8 is for generating an ink circulation flow from a pressure chamber including a supply flow path 131 and a through flow path 125 in the inkjet head 100 to the common circulation flow path 131 via the individual circulation flow paths 121. It is a means of supply.
  • the ink circulation system 8 is composed of a supply sub-tank 81, a circulation sub-tank 82, a main tank 83, and the like (FIG. 19).
  • the supply sub-tank 81 is filled with ink for supplying to the ink storage portion 51 of the manifold 5, and is connected to the first ink port 53 by the ink flow path 84.
  • the circulation sub-tank 82 is filled with ink discharged from the discharge liquid chamber 57 of the manifold 5, and is connected to the fourth ink port 56 by the ink flow path 85. Further, the supply sub-tank 81 and the circulation sub-tank 82 are provided at different positions in the vertical direction (gravity direction) with respect to the nozzle surface (hereinafter, also referred to as “position reference surface”) of the head tip 1.
  • the pressure P1 due to the head difference between the position reference surface and the supply sub-tank 81 and the pressure P2 due to the head difference between the position reference surface and the circulation sub-tank 82 are generated. Further, the supply sub-tank 81 and the circulation sub-tank 82 are connected by an ink flow path 86. Then, the ink is returned from the circulation sub-tank 82 to the supply sub-tank 81 by the pressure applied by the pump 88.
  • the main tank 83 is filled with ink for supplying to the supply sub-tank 81, and is connected to the supply sub-tank 81 by an ink flow path 87. Then, ink can be supplied from the main tank 83 to the supply sub-tank 81 by the pressure applied by the pump 89.
  • the pressure P1 and the pressure P2 can be adjusted by appropriately changing the ink filling amount in each sub tank and the position in the vertical direction (gravity direction) of each sub tank. Then, the ink in the inkjet head 100 can be circulated at an appropriate circulation flow velocity by the pressure difference between the pressure P1 and the pressure P2. As a result, it is possible to remove air bubbles, foreign substances, etc. generated in the head chip 1 and suppress clogging of the nozzle 111, injection defects, and the like.
  • ink circulation system 8 As an example of the ink circulation system 8, a method of controlling ink circulation by a head difference has been described, but it can be changed as appropriate as long as it is configured to generate an ink circulation flow.
  • the inkjet head of the present invention can be manufactured, for example, by a manufacturing method including the following first to third steps. First step; step of joining the flow path substrate to the flow path surface of the silicon nozzle substrate Second step; after the first step, the silicon nozzle substrate bonded to the flow path substrate on the injection surface side. Step 3 of arranging the vapor deposition source of the liquid-repellent film and forming the liquid-repellent film by vapor deposition; Step to remove the liquid-repellent film
  • the pressure chamber substrate is joined to the flow path substrate side of the obtained laminated body. This gives a head tip.
  • the first step to the third step will be taken as an example in the case of manufacturing the laminated body 10D according to the present invention as the laminated body in which the flow path substrate, the silicon nozzle substrate and the liquid repellent film are laminated.
  • the process will be described.
  • the same codes as those used in the laminated body 10D shown in FIG. 7 have the same meanings as in the case of the laminated body 10D. In the following, only the reference numerals necessary for explaining the manufacturing method are used in the description.
  • FIG. 20 is a cross-sectional view showing a laminate of the flow path substrate 12 and the silicon nozzle substrate 11 obtained in the first step.
  • the first step is a step of joining the through flow path 125 and the flow path substrate 12 on which the two individual circulation flow paths 121a and 121b are formed to the flow path surface S1 of the silicon nozzle substrate 11 on which the nozzle 111 is formed. ..
  • the silicon nozzle substrate 11 is prepared, for example, by the following method.
  • a silicon base substrate to be a base member is prepared.
  • the base substrate is composed of a first support layer having a thickness of 200 ⁇ m or more, a BOX layer, and a silicon nozzle substrate layer.
  • the silicon nozzle substrate layer is a layer that becomes the silicon nozzle substrate 11.
  • a resist pattern is provided on the surface of the base substrate on the silicon nozzle substrate layer side (the surface that becomes the injection surface S2 of the silicon nozzle substrate 11) using a mask corresponding to the position where the nozzle 111 is formed, and the nozzle holes are formed by etching. It is processed to form the nozzle 111.
  • the etching method for example, reactive ion etching (RIE) by the Bosch method, which is easy to dig deep, is used. Laser perforation, blasting, or the like may be used (combined) for forming the nozzle.
  • RIE reactive ion etching
  • the first support layer and the BOX layer are removed to obtain a silicon nozzle substrate 11 with a second support layer in which the flow path surface S1 side of the silicon nozzle substrate 11 is exposed.
  • the flow path substrate 12 is obtained by forming a through flow path 125 and two individual circulation flow paths 121a and 121b at positions shown in FIGS. 10 and 11 with respect to the base substrate to be a base member by a known method. Be done. As a result, a flow path substrate 12 including a through flow path 125 which is an ink flow path, two individual circulation flow paths 121a and 121b, and a substrate body 12a having a forming surface (F1 to F3) of these flow paths is obtained.
  • the first step is performed, for example, by joining the flow path surface S2 of the silicon nozzle substrate 11 with the second support layer and the lower surface S3 of the substrate main body 12a of the flow path substrate 12, and then removing the second support layer. ..
  • the use of the second support layer is particularly useful in protecting the silicon nozzle substrate 11 when the thickness of the silicon nozzle substrate 11 is about 10 to 100 ⁇ m. If necessary, the silicon nozzle substrate 11 and the flow path substrate 12 may be joined without using the second support layer.
  • the flow path substrate 12 and the silicon nozzle substrate 11 can be joined, for example, with a known adhesive.
  • the adhesive is appropriately selected from known adhesives according to the constituent materials of each substrate and used.
  • a known epoxy-based adhesive or the like can be used as the adhesive.
  • Examples of commercially available products of epoxy adhesives include Epoxy353ND (manufactured by Epoxy Technology).
  • Epoxy353ND manufactured by Epoxy Technology
  • FIG. 21 is a cross section showing a laminated body La with a liquid-repellent film obtained by forming a liquid-repellent film on the laminated body La composed of the flow path substrate 12 and the silicon nozzle substrate 11 obtained in the first step. It is a figure.
  • the second step is a step of arranging a vapor deposition source of the liquid repellent film 14 on the injection surface S2 side of the silicon nozzle substrate 11 in the laminated body La and forming the liquid repellent film 14 by vapor deposition.
  • the liquid-repellent film shows the liquid-repellent film removed in the third step as the liquid-repellent film 14x, and is formed on the injection surface S2 side of the silicon nozzle substrate 11 which is not removed after the third step.
  • the liquid film is shown as a liquid repellent film 14. That is, in the second step, the liquid repellent film 14x is formed together with the liquid repellent film 14.
  • liquid-repellent film 14 examples include a liquid-repellent film made of a fluoropolymer layer.
  • a liquid repellent film made of a fluoropolymer layer is formed will be described as an example, but the liquid repellent film is not limited to this, and a known liquid repellent film can be used.
  • the liquid-repellent agent described above can be used as the vapor deposition source of the liquid-repellent film.
  • the vapor deposition of the liquid repellent agent in the second step is performed from the injection surface S2 side of the silicon nozzle substrate 11.
  • the liquid repellent adheres to the injection surface S2 of the silicon nozzle substrate 11 and the inner wall surface (forming surface) of the nozzle 111, and also enters the inside of the flow path substrate 12 from the nozzle 111 and adheres to the inner wall surface of the substrate main body 12a. ..
  • FIG. 21 schematically shows a vapor deposition source.
  • the vapor deposition source is, for example, a heatable container containing a liquid repellent, and the heated container containing the liquid repellent moves in the front-rear direction, or the laminated body La moves in the front-rear direction on the container. Then, the vapor deposition is performed on the entire injection surface S2 of the silicon nozzle substrate 11 of the laminated body La. In the positional relationship between the laminated body La and the container in FIG.
  • the liquid repellent does not adhere to the inner wall surface below the position Y at the height of L ⁇ tan ⁇ from the injection surface S2, but adheres to the inner wall surface above it. do. Specifically, it adheres to the inner wall surface above the position Y of the forming surface F1 of the through-flow path 125 in the substrate main body 12a.
  • a liquid repellent film 14x is formed at the portion where the liquid repellent is adhered as shown in FIG. 21.
  • the liquid repellent film 14x and the liquid repellent film 14 are formed from the liquid repellent agent adhering to the injection surface S2 of the silicon nozzle substrate 11 and the inner wall surface (forming surface) of the nozzle 111.
  • the inlets of the connecting portions 122a and 122b of the individual circulation flow paths 121a and 121b are entirely below the position Y at the height of L ⁇ tan ⁇ , the individual circulation flow paths 121a and 121b in the substrate main body 12a
  • the liquid repellent agent does not adhere to the formed surface F2 of the connecting portions 122a and 122b and the flow path surface S1 corresponding to the lower surface of the connecting portions 122a and 122b, and the liquid repellent film is not formed.
  • the vapor of the liquid repellent does not reach the extension portions 123a and 123b of the individual circulation flow paths 121a and 121b, and the liquid repellent film is not formed on the forming surface F3 of the extension portions 123a and 123b.
  • Drying and curing are usually performed by heating. Appropriate conditions are determined according to the type of the liquid repellent, and the heat treatment is performed at room temperature or, if necessary, in a high temperature state (for example, 300 to 400 ° C.). After that, for the purpose of removing the unreacted raw material, for example, the raw material fluorine polymer, it is preferable to perform washing (rinsing) with a fluorine-based solvent (hydrofluoroether or the like), and it is more preferable to perform the washing by ultrasonic cleaning.
  • a fluorine-based solvent hydrofluoroether or the like
  • the liquid-repellent film 14 preferably has a base layer containing a silicon compound between the surface to be formed and the fluoropolymer layer.
  • the formation of the base layer is performed between the first step and the second step.
  • the base layer is formed by a known method such as thin film deposition or sputtering depending on the type of the constituent material.
  • the formation range of the base layer is at least the range in which the liquid repellent film 14 is formed. If necessary, the base layer is formed on a surface other than the range where the liquid-repellent film 14 is formed, for example, a part or the entire inner wall surface of the nozzle 111 of the silicon nozzle substrate 11 or the flow path substrate 12. May be.
  • FIG. 22 is a cross-sectional view showing a laminated body 10D obtained by removing the liquid repellent film 14x from the laminated body La with a liquid repellent film obtained in the second step.
  • the third step is a step of removing the liquid-repellent film 14x formed on the forming surface F1 of the penetrating flow path 125 in the substrate main body 12a from the upper surface S4 side of the flow path substrate 12 after the second step.
  • the liquid-repellent film 14x is removed by irradiating oxygen plasma from the upper surface S4 side of the flow path substrate 12.
  • the liquid-repellent film 14x formed on the forming surface of the nozzle 111 of the silicon nozzle substrate 11 is also removed.
  • the liquid-repellent film 14 formed on the injection surface S2 of the silicon nozzle substrate 11 is not removed.
  • Examples of the method of removing only the liquid-repellent film 14x while leaving the liquid-repellent film 14 include UV ozone irradiation and the like in addition to oxygen plasma irradiation. Since these methods are performed by irradiating an active ray having straightness, the above-mentioned selective removal of the liquid-repellent film becomes possible.
  • the liquid repellent film is formed on the forming surface F2 of the connecting portions 122a and 122b of the individual circulation flow paths 121a and 121b and the flow path surface S1 corresponding to the lower surface of the connecting portions 122a and 122b. Not formed. Therefore, substantially all of the liquid-repellent film formed on the inner wall surface of the flow path substrate 12 can be removed by the method of irradiating the active line having straightness from the upper side of the flow path substrate 12. In addition, this method also makes it possible to remove the liquid-repellent film formed on the forming surface of the nozzle 111.
  • the laminated body 10D in which the liquid repellent film 14 is formed only on the injection surface S2 of the silicon nozzle substrate 11 can be obtained.
  • an inkjet head provided with a silicon nozzle substrate having a liquid repellent film on the injection surface side and a flow path substrate having a circulation flow path, the formation of the liquid repellent film in the flow path substrate is suppressed, thereby suppressing the formation of the liquid repellent film in the flow path substrate. It is possible to provide an inkjet head having excellent ink ejection properties and a method for manufacturing an inkjet head in which a liquid-repellent film is suppressed from being formed in a flow path substrate during manufacturing. Further, it is possible to provide an inkjet recording apparatus provided with an inkjet head having excellent ink ejection properties.

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