Classifications

• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
  • C11D7/22—Organic compounds
  • C11D7/34—Organic compounds containing sulfur
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
  • B08B3/04—Cleaning involving contact with liquid
  • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
  • C11D3/0005—Other compounding ingredients characterised by their effect
  • C11D3/0042—Reducing agents
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
  • C11D3/02—Inorganic compounds ; Elemental compounds
  • C11D3/04—Water-soluble compounds
  • C11D3/044—Hydroxides or bases
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
  • C11D3/16—Organic compounds
  • C11D3/26—Organic compounds containing nitrogen
  • C11D3/30—Amines; Substituted amines ; Quaternized amines
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
  • C11D3/16—Organic compounds
  • C11D3/34—Organic compounds containing sulfur
  • C11D3/3427—Organic compounds containing sulfur containing thiol, mercapto or sulfide groups, e.g. thioethers or mercaptales
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
  • C11D3/16—Organic compounds
  • C11D3/34—Organic compounds containing sulfur
  • C11D3/3472—Organic compounds containing sulfur additionally containing -COOH groups or derivatives thereof
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
  • C11D3/43—Solvents
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
  • C11D7/02—Inorganic compounds
  • C11D7/04—Water-soluble compounds
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
  • C11D7/22—Organic compounds
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
  • C11D7/50—Solvents
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
  • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
  • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
  • C23G1/16—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions using inhibitors
  • C23G1/18—Organic inhibitors
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
  • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
  • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
  • C23G1/20—Other heavy metals
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
  • C11D2111/10—Objects to be cleaned
  • C11D2111/14—Hard surfaces
  • C11D2111/16—Metals
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Definitions

• the present disclosure relates to a cleaning agent composition for flux and a cleaning method using the cleaning agent composition.
• Metals such as copper and copper alloys are used for the electrodes that form the circuits of electronic substrates such as semiconductor packages in order to reduce manufacturing costs.
• Patent Document 1 contains a specific silver fine particle, a specific silver powder, and a silicon-containing triazine compound, and further comprises a carboxylic acid compound having a boiling point of 100 to 300 ° C., which is an acid anhydride.
• a semiconductor device that is bonded and fixed on a substrate via a die attach material comprising a paste composition containing an anhydride as a sintering aid. It is disclosed that if the boiling point of the carboxylic acid compound exceeds 300 ° C., it does not volatilize during sintering and a flux component (organic substance such as an organic acid) remains in the membrane, which is not preferable.
• a flux component organic substance such as an organic acid
• Patent Document 2 when the content of the glycol compound is less than 1% by weight based on the total amount, the content of benzyl alcohol is 70 to 99.9% by weight. % And the amino alcohol content are in the range of 0.1 to 30% by weight, and when the glycol compound content is 1 to 40% by weight, the benzyl alcohol content is in the range of 15 to 99% by weight. And a cleaning agent for removing solder flux, which comprises an amino alcohol content in the range of 0.1 to 30% by weight is disclosed. Japanese Patent Application Laid-Open No.
• Patent Document 3 describes a cleaning of a circuit board flux residue obtained in a step of solidifying solder on an electrode, which contains glycol ether, alkanolamine, and a specific imidazole compound.
• a method for manufacturing a circuit board in which solder is solidified, including a step of cleaning with an agent, is disclosed.
• the present disclosure in one embodiment, comprises an alkaline agent (component A), a reducing compound having a mercapto group (component B), an organic solvent (component C) and water (component D), and has a pH of 6 or more and 10 or less. , Concerning a cleaning agent composition for flux.
• the present disclosure comprises, in one aspect, a cleaning step of cleaning the object to be cleaned with flux with the cleaning agent composition for flux of the present disclosure, wherein the object to be cleaned having flux is between a substrate and a metal member or a substrate.
• the present invention relates to a cleaning method for a substrate which has undergone a step of applying a slurry containing flux between the above two metal members and then heating the substrate to 200 ° C. or higher.
• the present disclosure relates, in one aspect, to the use of the presently disclosed detergent composition for flux for discoloration of metals and removal of flux.
• the present disclosure relates to an aspect of cleaning a substrate which has undergone a step of applying a flux-containing slurry between a substrate and a metal member or between two metal members on the substrate and then heating the substrate to 200 ° C. or higher.
• a flux-containing slurry between a substrate and a metal member or between two metal members on the substrate and then heating the substrate to 200 ° C. or higher.
• the surface may be oxidized and discolored by holding at a high temperature of 200 ° C. or higher. Therefore, there is a need for a detergent composition capable of removing a portion discolored by heat treatment at 200 ° C. or higher, that is, an oxidized metal (metal oxide).
• the present disclosure provides a cleaning agent composition for flux and a cleaning method, which are excellent in both discoloration of metal and removal of flux after heat treatment at 200 ° C. or higher.
• the present inventors are based on the finding that by using a reducing compound having a mercapto group, both discoloration of the metal and removability of flux after heat treatment at 200 ° C. or higher can be improved.
• the present disclosure comprises an alkaline agent (component A), a reducing compound having a mercapto group (component B), an organic solvent (component C) and water (component D), and has a pH of 6 or more and 10 or less.
• component A alkaline agent
• component B reducing compound having a mercapto group
• component C organic solvent
• component D water
• the present invention relates to a detergent composition for flux (hereinafter, also referred to as “detergent composition of the present disclosure”).
• the reducing compound is adsorbed on the metal surface (substrate surface and / or metal member) at a specific pH and causes a reduction reaction, the state of the discolored metal surface is changed and the discoloration of the metal surface is removed. Conceivable. Since the organic solvent enhances the permeability to the flux and the interface peeling between the metal and the flux occurs, it is presumed that it exhibits high detergency in addition to the conventional easy dissolution with an alkaline agent and dissolution with a solvent. Will be done. However, the present disclosure may not be construed as being limited to this mechanism.
• the "flux” in the present disclosure is a flux used for joining two members by a sintering step (for example, a step of holding at a high temperature of 200 ° C. or higher) in one or a plurality of forms, for example. It is used for joining a heat sink and a semiconductor element, and for joining a heat sink and a substrate. Flux is, in one or more embodiments, an acid-based bonding aid.
• the "flux cleaning agent composition” in the present disclosure refers to a cleaning agent composition for removing the flux remaining after joining two members by a sintering step in one or a plurality of embodiments.
• the detergent composition of the present disclosure contains an alkaline agent (hereinafter, also simply referred to as "component A").
• the component A includes at least one selected from inorganic alkalis and organic alkalis in one or more embodiments.
• the component A may be one kind or a combination of two or more kinds.
• Examples of the inorganic alkali include ammonia, alkali metal hydroxide and the like.
• Examples of the alkali metal hydroxide include sodium hydroxide, potassium hydroxide and the like. Among these, at least one selected from ammonia and sodium hydroxide is preferable from the viewpoint of improving the discoloration of the metal and the removability of both fluxes.
• organic alkali examples include quaternary ammonium hydroxide represented by the following formula (I), amine represented by the following formula (II), alkylimidazole and the like in one or more embodiments.
• R 1 , R 2 , R 3 and R 4 are each independently selected from at least one of a methyl group, an ethyl group, a propyl group, a hydroxymethyl group, a hydroxyethyl group and a hydroxypropyl group. Is.
• Examples of the quaternary ammonium hydroxide represented by the formula (I) include a salt composed of a quaternary ammonium cation and a hydroxide.
• Examples of the quaternary ammonium hydroxide include tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide, tetrapropylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide (choline), and 2-hydroxyethyltriethylammonium hydroxide.
• 2-Hydroxyethyl Tripropylammonium Hydroxide, 2-Hydroxypropyltrimethylammonium Hydroxide, 2-Hydroxypropyltriethylammonium Hydroxide, 2-Hydroxypropyltripropylammonium Hydroxide, Dimethylbis (2-Hydroxyethyl) Ammonium Hydroxide , Diethylbis (2-Hydroxyethyl) Ammonium Hydroxide, Dipropylbis (2-Hydroxyethyl) Ammonium Hydroxide, Tris (2-Hydroxyethyl) Methylammonium Hydroxide, Tris (2-Hydroxyethyl) Ethylammonium Hydroxide, Tris (2) At least one selected from -hydroxyethyl) propylammonium hydroxide, tetrakis (2-hydroxyethyl) ammonium hydroxide, and tetra
• tetramethylammonium hydroxide and tetraethylammonium hydroxide are preferable, and tetramethylammonium hydroxide (TMAH) is more preferable, from the viewpoint of improving the discoloration of the metal and the removability of both fluxes.
• R 5 is a hydrogen atom, a hydroxyl group, a hydrocarbon group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, or an aminoalkyl group having 1 to 6 carbon atoms
• R 6 And R 7 are the same or different, respectively, and are a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, or an aminoalkyl group having 1 to 6 carbon atoms, and are R 5 and R. 6 and R 7 do not become hydrogen atoms at the same time.
• Examples of the amine represented by the formula (II) include monoethanolamine, monoisopropanolamine, N-methylethanolamine, N-methylisopropanolamine, N-ethylethanolamine, N-ethylisopropanolamine, and N-butylethanolamine.
• alkylimidazole examples include at least one selected from butylimidazole, propylimidazole, isopropylimidazole, ethylimidazole, methylimidazole, and 1,2 dimethylimidazole.
• at least one selected from methylimidazole, isopropylimidazole, and 1,2, dimethylimidazole is preferable from the viewpoint of improving the discoloration of the metal and the removability of both fluxes.
• the component A includes sodium hydroxide, ammonia, monoethanolamine, methylethanolamine, butylethanolamine, dibutylethanolamine, tetramethylammonium hydroxide, and methyl from the viewpoint of improving the discoloration of the metal and the removal of the flux. At least one selected from imidazole is mentioned.
• the content of component A at the time of use of the detergent composition of the present disclosure can be set so that the pH of the detergent composition is within a specific range.
• Component B reducing compound having a mercapto group
• the detergent composition of the present disclosure contains a reducing compound having a mercapto group (hereinafter, also simply referred to as "component B").
• the component B may be one kind or a combination of two or more kinds. Examples of the component B include a reducing compound having a mercapto group and a carboxyl group, a reducing compound having a mercapto group and a hydroxyl group, and the like in one or a plurality of embodiments.
• Examples of the reducing compound having a mercapto group and a carboxyl group include thioglycolic acid or a salt thereof, 3-mercaptopropionic acid, L-cysteine, N-acetylcysteine and the like.
• Examples of the reducing compound having a mercapto group and a hydroxyl group include thioglycerol and the like.
• the molecular weight of the component B is preferably 40 or more, more preferably 60 or more, further preferably 70 or more, and further preferably 150 or less, further preferably 130 or less, from the viewpoint of the penetration rate into the flux. It is preferably 110 or less, and more preferably 110 or less.
• the component B includes thioglycolic acid or a salt thereof, 3-mercaptopropionic acid, thioglycerol, L-cysteine, and N from the viewpoint of improving the discoloration of the metal and the removal of both fluxes. -At least one selected from acetylcysteine is mentioned.
• thioglycerol is preferable from the viewpoint of suppressing corrosion of iron or an alloy thereof (for example, steel, stainless steel, etc.) in one or a plurality of embodiments.
• the content of component B at the time of use of the cleaning agent composition of the present disclosure is preferably 0.5% by mass or more, more preferably 0.8% by mass or more, and 5% by mass or more, from the viewpoint of oxide removability. Further, from the viewpoint of suppressing reoxidation, 25% by mass or less is preferable, 20% by mass or less is more preferable, 15% by mass or less is further preferable, and 12% by mass or less is further preferable.
• the content of component B in use of the cleaning agent composition of the present disclosure is preferably 0.5% by mass or more and 25% by mass or less, more preferably 0.8% by mass or more and 20% by mass or less, and 5% by mass or more 12 More preferably, it is by mass or less.
• the content of the component B means the total content thereof.
• the detergent composition of the present disclosure contains an organic solvent (hereinafter, also referred to as "component C”).
• the component C includes a compound represented by the following formula (III) and a compound represented by the following formula (IV) from the viewpoint of improving the discoloration of the metal and the removability of both fluxes in one or more embodiments. It is preferably at least one solvent selected from the compound represented by the following formula (V), an alkyl sulfoxide, and an ⁇ -olefin.
• the component C may be one kind or a combination of two or more kinds.
• R 8 is preferably a phenyl group or an alkyl group having 1 or more and 8 or less carbon atoms, and an alkyl group having 1 or more and 8 or less carbon atoms, from the viewpoint of improving the discoloration of the metal and the removability of both fluxes. Is more preferable, and an alkyl group having 4 or more and 6 or less carbon atoms is further preferable.
• R 9 is preferably a hydrogen atom or an alkyl group having 1 or more and 4 or less carbon atoms, and more preferably a hydrogen atom or an alkyl group having 2 or more and 4 or less carbon atoms.
• the AO is an ethylene oxide group (EO) or a propylene oxide group (PO), and an ethylene oxide group is preferable from the same viewpoint.
• n is the number of added moles of AO, and from the same viewpoint, an integer of 1 or more and 3 or less is preferable, 2 or 3 is more preferable, and 2 is further preferable.
• Examples of the compound represented by the above formula (III) include monophenyl ethers such as ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, and triethylene glycol monophenyl ether; ethylene having an alkyl group having 1 or more and 8 or less carbon atoms.
• Monoalkyl ethers such as glycol monoalkyl ethers, diethylene glycol monoalkyl ethers, triethylene glycol monoalkyl ethers, and tripropylene glycol monoalkyl ethers; having an alkyl group having 1 to 8 carbon atoms and an alkyl group having 1 to 4 carbon atoms.
• Dialkyl ethers such as ethylene glycol dialkyl ether, diethylene glycol dialkyl ether, and triethylene glycol dialkyl ether; ethylene glycol phenylalkyl ether, diethylene glycol phenylalkyl ether, and triethylene glycol phenylalkyl ether having a phenyl group and an alkyl group having 1 or more and 4 or less carbon atoms.
• Etc. such as phenylalkyl ether; and the like.
• the compound represented by the above formula (III) is selected from diethylene glycol monoalkyl ether, tripropylene glycol monoalkyl ether, and diethylene glycol dialkyl ether from the viewpoint of improving the discoloration of the metal and the removability of both fluxes.
• At least one selected is preferable, and specifically, at least one selected from diethylene glycol monobutyl ether (butyl diglycol), tripropylene glycol methyl ether, diethylene glycol 2-ethylhexyl ether (2-ethylhexyl diglycol) and diethylene glycol diethyl ether.
• diethylene glycol monobutyl ether butyl diglycol
• tripropylene glycol methyl ether diethylene glycol 2-ethylhexyl ether (2-ethylhexyl diglycol)
• diethylene glycol diethyl ether diethylene glycol diethyl ether.
• R 10 is a phenyl group, a benzyl group, a cyclohexyl group, a frill group, a tetrahydrofuryl group, a fulfuryl group or a tetrahydrofurfuryl group from the viewpoint of improving the discoloration of the metal and the removability of both fluxes. It is preferably present, more preferably a phenyl group, a cyclohexyl group or a tetrahydrofuryl group, and even more preferably a phenyl group.
• Examples of the compound represented by the above formula (IV) include benzyl alcohol, phenethyl alcohol, cyclohexanemethanol, furfuryl alcohol and tetrahydrofurfuryl alcohol.
• benzyl alcohol is preferable from the viewpoint of improving the discoloration of the metal and the removability of both fluxes.
• R11, R12 , R13, and R14 are independently hydrogen atoms and hydrocarbons having 1 or more and 8 or less carbon atoms.
• the group is preferably a hydroxyalkyl group or a hydroxyl group having 1 or more and 3 or less carbon atoms, and any one of R 11 , R 12 , R 13 and R 14 is a hydrocarbon group having 1 or more and 8 or less carbon atoms. It is more preferably a hydrocarbon group having 1 or more and 6 or less carbon atoms, and further preferably any one of a methyl group, an ethyl group and a vinyl group.
• Examples of the compound represented by the above formula (V) include 2-pyrrolidone, 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone, 1-vinyl-2-pyrrolidone and 1-phenyl-2-pyrrolidone. , 1-Cyclohexyl-2-pyrrolidone, 1-octyl-2-pyrrolidone, 3-hydroxypropyl-2-pyrrolidone, 4-hydroxy-2-pyrrolidone, 4-phenyl-2-pyrrolidone, 5-methyl-2-pyrrolidone, etc. Can be mentioned.
• 2-pyrrolidone 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone, 1- At least one selected from vinyl-2-pyrrolidone, 1-phenyl-2-pyrrolidone, 1-cyclohexyl-2-pyrrolidone, 1-octyl-2-pyrrolidone and 5-methyl-2-pyrrolidone is preferable, and 1-methyl-. At least one selected from 2-pyrrolidone, 1-ethyl-2-pyrrolidone and 1-vinyl-2-pyrrolidone is more preferable, and N-methyl-2-pyrrolidone is even more preferable.
• alkyl sulfoxide examples include dimethyl sulfoxide (DMSO) and the like.
• Examples of the ⁇ -olefin include ⁇ -olefins having 8 to 20 carbon atoms.
• Examples of the ⁇ -olefin include 1-dodecene and the like.
• the component C includes butyl diglycol, tripropylene glycol methyl ether, 2-ethylhexyl diglycol, benzyl alcohol, diethylene glycol diethyl ether, and N-methyl-2-pyrrolidone from the viewpoint of improving the discoloration of the metal and the removability of both fluxes.
• NMP dimethyl sulfoxide
• DMSO dimethyl sulfoxide
• the content of component C at the time of use of the cleaning agent composition of the present disclosure is preferably 15% by mass or more, more preferably 20% by mass or more, and more preferably 25% by mass from the viewpoint of improving the discoloration of the metal and the removability of both fluxes. % Or more is further preferable, 45% by mass or more is further preferable, and from the same viewpoint, 85% by mass or less is more preferable, 80% by mass or less is more preferable, and 70% by mass or less is further preferable.
• the content of component C in use of the detergent composition of the present disclosure is preferably 15% by mass or more and 80% by mass or less, more preferably 20% by mass or more and 80% by mass or less, and 45% by mass or more and 80% by mass or less. More preferred.
• the content of the component C means the total content thereof.
• the mass ratio (B / C) of the component B to the component C is preferably 0.001 or more, more preferably 0.01 or more, and 0.1 or more from the viewpoint of reducing power. Is more preferable, 0.3 or more is further preferable, and from the viewpoint of suppressing reoxidation, 2 or less is preferable, 1.5 or less is more preferable, 1 or less is further preferable, 0.8 or less is further preferable, and 0. 5 or less is more preferable.
• the mass ratio (B / C) is preferably 0.001 or more and 2 or less, more preferably 0.01 or more and 1.5 or less, further preferably 0.1 or more and 1 or less, and further preferably 0.3 or more and 0.8 or less. preferable.
• the detergent composition of the present disclosure contains water (hereinafter, also referred to as "component D").
• component D include ion-exchanged water, RO water (reverse osmosis membrane treated water), distilled water, pure water, ultrapure water and the like.
• the content of component D at the time of use of the cleaning agent composition of the present disclosure is preferably 3% by mass or more, more preferably 4% by mass or more, and 8% by mass or more from the viewpoint of lowering the flash point and improving handleability.
• the content of component D in the detergent composition of the present disclosure is preferably 3% by mass or more and 40% by mass or less, more preferably 3% by mass or more and 30% by mass or less, and 3% by mass or more in one or a plurality of embodiments. 20% by mass or less is more preferable.
• the content of component D in the detergent composition of the present disclosure is preferably 4% by mass or more and 50% by mass or less in the other one or more embodiments.
• the detergent composition of the present disclosure is a chelating agent, a rust preventive such as benzotriazole (BTA), a thickener, and a dispersion, which are usually used as a detergent, as needed, as long as the effects of the present disclosure are not impaired. It appropriately contains an agent, a basic substance other than component A, a polymer compound, a surfactant such as an alkyl glucoside, a solubilizer such as capricyl acid, a preservative, a bactericide, an antibacterial agent, an antifoaming agent, and an antioxidant. be able to.
• the content of other components in use of the detergent composition of the present disclosure is preferably 0% by mass or more and 25% by mass or less, more preferably 0% by mass or more and 20% by mass or less, and 0% by mass or more and 15% by mass or less. Is more preferable.
• the detergent composition of the present disclosure can be produced, for example, by blending component A, component B, component C, component D, and, if necessary, other components described above by a known method.
• the detergent composition of the present disclosure may be composed of at least component A, component B, component C and component D. Therefore, the present disclosure relates to a method for producing a detergent composition, which comprises, in one embodiment, at least a step of blending component A, component B, component C and component D.
• "blending" includes mixing component A, component B, component C, component D and, if necessary, other components simultaneously or in any order.
• the blending amount of each component can be the same as the content of each component at the time of using the above-mentioned cleaning agent composition of the present disclosure.
• the "content of each component at the time of use of the detergent composition” means the content of each component at the time of cleaning, that is, at the time when the use of the detergent composition for cleaning is started.
• the pH of the detergent composition of the present disclosure is 6 or more and 10 or less, preferably pH 7 or more and 10 or less, and more preferably pH 7 or more and 9 or less, from the viewpoint of improving the discoloration of the metal and the removability of both fluxes.
• the pH is, if necessary, an inorganic acid such as nitrate and sulfuric acid, an organic acid such as oxycarboxylic acid, polyvalent carboxylic acid, aminopolycarboxylic acid and amino acid, and metal salts and ammonium salts thereof, an alkaline agent (component A) and the like. Can be adjusted using.
• the pH of the detergent composition is the pH at 25 ° C. when the detergent composition is used.
• the cleaning composition of the present disclosure is used in one or more embodiments for cleaning a flux-bearing object to be cleaned.
• the object to be cleaned having flux is a step of applying a slurry containing flux between a substrate and a metal member or between two metal members on a substrate, and then heating the object to be heated to 200 ° C. or higher.
• Examples thereof include substrates that have undergone (heating step). Therefore, in one embodiment, the present disclosure has undergone a step (heating step) of applying a slurry containing a flux between a substrate and a metal member or between two metal members on a substrate and then heating to 200 ° C. or higher.
• the present invention relates to the use of the flux cleaning agent composition of the present disclosure in the cleaning of a substrate.
• the heating temperature may be, for example, 200 ° C to 350 ° C.
• the heating time may be, for example, 3 minutes to 5 hours.
• an object to be cleaned that has been heated for 1 hour or more is preferable.
• the substrate surface and / or metal member of the object to be cleaned includes, in one or more embodiments, a portion of the metal that has been discolored by heating, i.e., an oxidized portion (metal oxide).
• the flux contains an acid as a main component in one or more embodiments. Examples of the acid include organic acids such as abietic acid.
• the flux-containing slurry may further contain metal particles in one or more embodiments.
• the metal particles are preferably metal particles having a sintering temperature (curing temperature) of 300 ° C. or lower, and examples thereof include tin, copper, silver, or a mixed metal thereof, and copper, silver, or a mixed metal thereof is preferable. , Silver is more preferred.
• the metal particles are a bonding material that can be bonded between the substrate and the metal member or between the two metal members on the substrate.
• the flux-containing slurry can be used as a die attach paste in one or more embodiments. When the flux-containing slurry further comprises metal particles, the slurry can be used as a conductive die attach paste in one or more embodiments.
• the metal member is fixed on the substrate in one or more embodiments.
• the metal of the metal member includes a metal such as copper and iron in one or more embodiments.
• Examples of the metal member include a heat sink, an electric circuit, and the like.
• Examples of the substrate include a substrate having a metal surface in one or a plurality of embodiments, and examples thereof include a copper plate, a steel plate, and a stainless steel plate.
• the present disclosure relates to a cleaning method (hereinafter, also referred to as "the cleaning method of the present disclosure"), which comprises a cleaning step of cleaning an object to be cleaned having a flux with the cleaning agent composition of the present disclosure in one embodiment.
• the object to be cleaned having the flux include the above-mentioned object to be cleaned.
• the cleaning step in one or more embodiments, comprises contacting the object to be cleaned with the flux with the cleaning composition of the present disclosure. According to the cleaning method of the present disclosure, both discoloration of the metal and flux after high temperature treatment at 200 ° C. or higher can be efficiently removed.
• the cleaning step comprises, in one or more embodiments, removing discoloration of the metal using the detergent composition for flux of the present disclosure.
• the present disclosure relates, in one aspect, to the use of the present disclosure detergent composition for flux for discoloration of metals and removal of flux.
• Discoloration of a metal comprises, in one or more embodiments, a portion of the metal that has been oxidized by heating (metal oxide).
• a method of cleaning the object to be cleaned with the cleaning agent composition of the present disclosure or a method of contacting the cleaning agent composition of the present disclosure with the object to be cleaned, for example, a method of contacting the object to be cleaned in a bathtub of an ultrasonic cleaning device, a method of contacting the object to be cleaned with the cleaning agent composition of the present disclosure. Examples thereof include a method (shower method) in which the cleaning agent composition is sprayed into contact with each other.
• the detergent composition of the present disclosure can be used as it is for cleaning without being diluted.
• the cleaning step is, in one or more embodiments, a step of immersing the object to be cleaned in the detergent composition of the present disclosure.
• the immersion temperature is preferably 80 ° C. or lower, more preferably 70 ° C. or lower, further preferably 60 ° C. or lower, and preferably 20 ° C. or higher, preferably 30 ° C. or higher, from the viewpoint of improving the discoloration of the metal and the removability of both fluxes. Is more preferable, and 40 ° C. or higher is even more preferable.
• the soaking time is preferably 5 minutes or more, more preferably 10 minutes or more, further preferably 30 minutes or more, preferably 3 hours or less, more preferably 2 hours or less, still more preferably 1 hour or less. ..
• the cleaning method of the present disclosure preferably includes a step of bringing the object to be cleaned into contact with the detergent composition, rinsing with water and / or an alcohol such as methanol, and drying.
• the ultrasonic wave is relatively strong.
• the frequency of the ultrasonic wave is preferably 26 to 72 Hz and 80 to 1500 W, and more preferably 36 to 72 Hz and 80 to 1500 W.
• kits The present disclosure relates, in one aspect, to a kit for use in the cleaning method of the present disclosure (hereinafter, also referred to as "the kit of the present disclosure").
• the kit of the present disclosure is a kit for producing the detergent composition of the present disclosure in one or more embodiments.
• the solution containing component A (liquid 1) and the solution containing component B and component C (liquid 2) are not mixed with each other.
• examples thereof include a kit (two-component detergent composition) that is contained in a state and the first solution and the second solution are mixed at the time of use.
• the first liquid and the second liquid may each contain the above-mentioned other components as necessary.
• At least one of the first liquid and the second liquid can contain a part or all of the component D used for preparing the detergent composition of the present disclosure in one or more embodiments.
• the first liquid and the second liquid may be mixed and then diluted with water (component D), if necessary.
• Example 1 Preparation of Detergent Composition (Examples 1-34, Comparative Examples 1-7)
• the detergent compositions of Examples 1 to 34 and Comparative Examples 1 to 7 are prepared by blending each component into a 100 mL glass beaker so as to have the composition shown in Tables 1 to 5 below and mixing them under the following conditions. did.
• the numerical values of each component in Tables 1 to 5 indicate the content (% by mass) in the prepared detergent composition unless otherwise specified.
• the pH of Examples 1 to 32 and Comparative Examples 1 to 5 was in the range of 7 to 9.
• the pH of Examples 33 to 34 was 7.2 to 7.6.
• the pH of Comparative Example 6 was 11.8, and the pH of Comparative Example 7 was 13.6.
• the pH was the pH of the detergent composition at 25 ° C., and the value was measured 3 minutes after the electrode of a pH meter (Toa Denpa Kogyo Co., Ltd., HM-30G) was immersed in the detergent composition.
• a pH meter Toa Denpa Kogyo Co., Ltd., HM-30G
• a test substrate was prepared by applying 0.05 g of abietic acid (flux) on a tough pitch copper plate of 50 mm ⁇ 20 mm and heating at 300 ° C. for 3 hours on a hot plate.
• Abietic acid is on a part of the surface of the copper plate.
• the substrate produced here is a model that imitates joining metals on a substrate from the heating temperature and holding time. For example, in the example of Patent Document 1, it is held at 200 ° C. for 60 minutes.
• the nanoparticle bonding material is a bonding material that can be bonded at a low temperature of about 300 ° C. or lower. It is described that when the nanoparticle bonding material is sintered silver, that is, sintered silver, the sintering temperature, that is, the curing temperature is about 210 ° C.
• the detergent compositions of Examples 1 to 34 were excellent in both discoloration of metal and removal of flux.
• Example 19 using thioglycerol as the reducing agent (component B) corrodes the steel plate and the stainless steel plate as compared with Example 12 using thioglycolic acid as the reducing agent (component B). was found to be suppressed.
• both discoloration of the metal and the flux can be efficiently removed. Therefore, for example, the flux cleaning process in the manufacturing process of the semiconductor device can be shortened and the performance of the manufactured semiconductor device can be shortened. Reliability can be improved, and the productivity of semiconductor devices can be improved.

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• 2021
  • 2021-09-03 TW TW110132941A patent/TW202223074A/zh unknown
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