WO2022039157A1 - 離型フィルム及び電子部品装置の製造方法 - Google Patents
離型フィルム及び電子部品装置の製造方法 Download PDFInfo
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- WO2022039157A1 WO2022039157A1 PCT/JP2021/030026 JP2021030026W WO2022039157A1 WO 2022039157 A1 WO2022039157 A1 WO 2022039157A1 JP 2021030026 W JP2021030026 W JP 2021030026W WO 2022039157 A1 WO2022039157 A1 WO 2022039157A1
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- WO
- WIPO (PCT)
- Prior art keywords
- release film
- release
- layer
- electronic component
- base material
- Prior art date
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- This disclosure relates to a method for manufacturing a release film and an electronic component device.
- Japanese Patent Application Laid-Open No. 2006-49850 describes a laminated film in which a film made of a fluororesin is laminated on at least one side of a base film made of a stretched polyester resin film.
- one aspect of the present disclosure is to provide a release film having excellent followability to the adherend surface.
- Another aspect of the present disclosure is to provide a method for manufacturing an electronic component device using this release film.
- the means for solving the above problems include the following embodiments.
- ⁇ 1> A release film having an elongation rate of 500% or more at 170 ° C.
- ⁇ 2> The release film according to ⁇ 1>, which has an elastic modulus of 65 MPa or more at 170 ° C.
- ⁇ 3> The release film according to ⁇ 1> or ⁇ 2>, wherein the tack force of the surface on the adherend side at 23 ° C. is 0.1 gf or more.
- ⁇ 4> The release film according to any one of ⁇ 1> to ⁇ 3>, comprising a base material layer and a release layer.
- ⁇ 5> The release film according to ⁇ 4>, wherein the base material layer contains polybutylene terephthalate.
- ⁇ 6> The release film according to ⁇ 4> or ⁇ 5>, wherein the release layer contains an adhesive.
- ⁇ 7> The release film according to any one of ⁇ 4> to ⁇ 6>, wherein the release layer has a thickness of 1 ⁇ m or more.
- ⁇ 8> The release film according to any one of ⁇ 1> to ⁇ 7>, for temporarily protecting at least a part of the surface of the object.
- ⁇ 9> The release film according to any one of ⁇ 1> to ⁇ 8>, which is for exposure molding.
- ⁇ 10> The step of sealing the periphery of the electronic component in a state where the release film according to any one of ⁇ 1> to ⁇ 9> is in contact with at least a part of the surface of the electronic component, and the release film.
- a method for manufacturing an electronic component device comprising a step of peeling the electronic component from the electronic component.
- a release film having excellent followability to an adherend surface is provided.
- a method for manufacturing an electronic component device using this release film is provided.
- the term "process” includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other processes. Is done.
- the numerical values before and after "-" are included as the minimum value and the maximum value, respectively.
- the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. good.
- the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
- each component in the composition is the same as that in the case where a plurality of substances corresponding to each component are present in the composition, unless otherwise specified. It means the total content or content of substances.
- the particle size of each component in the composition is a mixture of the plurality of particles present in the composition when a plurality of particles corresponding to each component are present in the composition, unless otherwise specified. Means a value for.
- the term "layer” refers to the case where the layer is formed in the entire region when the region is observed, and the case where the layer is formed only in a part of the region. Is also included.
- the thickness of the release film or each layer constituting the release film can be measured by a known method. For example, it may be measured using a dial gauge or the like, or it may be measured from a cross-sectional image of a release film. Alternatively, the material constituting the layer may be removed using a solvent or the like, and calculated from the mass before and after the removal, the density of the material, the area of the layer, and the like. If the layer thickness is not constant, the arithmetic mean value of the values measured at any five points is used as the layer thickness.
- (meth) acrylic means one or both of acrylic and methacrylic
- (meth) acrylate” means one or both of acrylate and methacrylate.
- the release film of the present disclosure is a release film having an elongation rate of 500% or more at 170 ° C.
- the release film has an elongation rate of 500% or more at 170 ° C. Therefore, it has excellent extensibility under general temperature conditions for carrying out the step of attaching the release film to the adherend surface, and exhibits excellent followability to the adherend surface. Therefore, even when the shape of the adherend surface is complicated, for example, it is possible to effectively suppress the invasion of the sealing material into the portion to which the release film is attached.
- the elongation rate of the release film at 170 ° C. is 500% or more, preferably 550% or more, more preferably 600% or more, still more preferably 700% or more. From the viewpoint of ease of peeling, the elongation rate of the release film at 170 ° C. may be 1300% or less, 1200% or less, 1000% or less, or 800%. It may be as follows.
- the release film preferably has an elastic modulus at 170 ° C. of 65 MPa or more, more preferably 70 MPa or more, and even more preferably 75 MPa or more.
- the elastic modulus of the release film at 170 ° C. is 65 MPa or more, the release film is moderately hard and the workability at the time of sticking to the adherend surface is good.
- the elastic modulus of the release film at 170 ° C. may be 150 MPa or less, 120 MPa or less, or 100 MPa or less.
- the release film may have an elongation rate of 500% or more at 150 ° C., 550% or more, or 700% or more.
- the elongation rate of the release film at 150 ° C. is 500% or more, excellent adhesion is exhibited even when the release film is attached to the adherend surface at a low temperature.
- the elongation rate of the release film at 150 ° C. may be 1300% or less, 1200% or less, 1000% or less, or 800%. It may be as follows.
- the release film may have an elastic modulus at 150 ° C. of 65 MPa or more, 70 MPa or more, or 75 MPa or more.
- the elastic modulus of the release film at 150 ° C. is 65 MPa or more, the workability is good even when the release film is attached to the adherend surface at a low temperature.
- the elastic modulus of the release film at 150 ° C. may be 150 MPa or less, 120 MPa or less, or 100 MPa or less.
- the elongation rate (%) of the release film is measured as follows. First, a test piece (unit of length: mm) having a shape as shown in FIG. 1 is prepared using a release film. The shape of the test piece is not limited to the shape shown in FIG. 1 as long as the width is 10 mm and the distance between the chucks can be secured. A tensile test is carried out by grasping both ends of the test piece with a grip (chuck) of a tensile tester. The position where the test piece is gripped is the portion where the width of the test piece is 10 mm, and the distance between the chucks is 15 mm. The measurement is carried out under predetermined temperature conditions, and the tensile speed is 500 mm / min. The elongation ratio is calculated by the following formula from the chuck-to-chuck distance A (15 mm) of the test piece before the tensile test and the chuck-to-chuck distance B when the test piece is cut.
- the elastic modulus (MPa) of the release film is calculated from the slope of the tangent line in the stress-strain diagram by pulling the test piece in the same manner as in the measurement of the elongation rate. Specifically, it is calculated by the following formula from the stress (kgf) per cross-sectional area (cm 2 ) applied to the test piece.
- the tack force of the surface of the release film on the adherend surface side at 23 ° C. is preferably 0.1 gf or more, more preferably 0.2 gf or more. It is more preferably 0.5 gf or more.
- the tack force of the surface of the release film on the adherend surface side at 23 ° C. is preferably 40 gf or less, more preferably 35 gf or less, and 30 gf or less. It is more preferable to have.
- the tack force (gf) of the release film is 23 ° C., pre-measurement load 10 gf, pre-measurement load time 1 second, ascending speed during measurement using a tack tester (for example, manufactured by Reska) and a probe having a diameter of 5 mm. It is measured under the condition of 120 mm / min.
- the release film may have a base material layer and a release layer, or may further have a conductive layer.
- FIG. 2 schematically shows an example of the configuration of a release film having a base material layer, a release layer, and a conductive layer.
- the release film 40 shown in FIG. 2 includes a base material layer 10, a release layer 20, and a conductive layer 30 arranged between the base material layer 10 and the release layer 20.
- the release film Since the release film has a base material layer, the required strength is imparted to the release film, and physical properties such as elongation and elastic modulus can be adjusted by appropriately selecting the material. .. Since the release film has a release layer, the release film can be easily peeled off from the adherend surface. Since the release film has a conductive layer, electric discharge when the release film is peeled off is suppressed, and the occurrence of electrostatic destruction of electronic components is effectively suppressed.
- the overall thickness of the release film is not particularly limited and can be set according to desired physical properties (elongation rate, elastic modulus, etc.). For example, it may be 30 ⁇ m to 300 ⁇ m, 35 ⁇ m to 250 ⁇ m, or 40 ⁇ m to 200 ⁇ m.
- the material of the base material layer is not particularly limited as long as the elongation rate of the release film using the same at 170 ° C. is 500% or more.
- Examples thereof include polyesters such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and resins such as polyimides, polyamides, polyester ethers, polyamideimides, fluorine-containing resins and thermoplastic elastomers.
- the base material layer preferably contains polybutylene terephthalate.
- the base material layer may contain only polybutylene terephthalate as the resin, or may contain polybutylene terephthalate and a resin other than polybutylene terephthalate.
- the substrate layer may contain polybutylene terephthalate and polyethylene terephthalate.
- the proportion of polybutylene terephthalate may be 50% by mass or more, 60% by mass or more, or 70% by mass of the whole resin. % Or more, and may be 80% by mass or more. Further, it may be 99% by mass or less of the whole resin, or 95% by mass or less.
- the base material layer is non-stretched (not stretched).
- the thickness of the base material layer is not particularly limited, and is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, and further preferably 30 ⁇ m or more. When the thickness of the base material layer is 10 ⁇ m or more, the release sheet is less likely to be torn and tends to be excellent in handleability.
- the thickness of the base material layer is preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less, and even more preferably 100 ⁇ m. When the thickness of the base material layer is 300 ⁇ m or less, the followability to the adherend surface tends to be sufficiently obtained.
- the base material layer may be composed of only one layer or may be composed of two or more layers.
- Examples of a method for obtaining a base material layer composed of two or more layers include a method of extruding the material of each layer by a coextrusion method and a method of laminating two or more films.
- the surface of the base material layer on the side where the conductive layer is provided may be treated to improve the adhesion to the conductive layer.
- the treatment method include corona treatment, surface treatment such as plasma treatment, and application of an undercoating agent (primer).
- a back treatment agent for adjusting the unwindability of the release film from the roll may be applied to the back surface of the base material layer (the surface opposite to the side to be attached to the adherend surface).
- the back treatment agent include silicone resin, fluorine-containing resin, polyvinyl alcohol, and resin having an alkyl group. If necessary, these back treatment agents may be modified.
- the back treatment agent may be used alone or in combination of two or more.
- the material of the release layer is not particularly limited and can be selected according to the desired characteristics of the release film (adhesion to the adherend surface, peelability, etc.). From the viewpoint of adhesion to the adherend surface, the release layer preferably has adhesiveness. Examples of the method of imparting adhesiveness to the release layer include a method of incorporating an adhesive in the release layer.
- the type of adhesive is not particularly limited and can be selected in consideration of adhesiveness, mold release property, heat resistance, etc. Specifically, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and a urethane-based pressure-sensitive adhesive are preferable, and an acrylic-based pressure-sensitive adhesive is more preferable.
- the pressure-sensitive adhesive contained in the release layer may be only one type or two or more types.
- Acrylic pressure-sensitive adhesives include monomers having a low glass transition temperature (Tg) (for example, -20 ° C. or lower) such as butyl acrylate, ethyl acrylate, and 2-ethylhexyl acrylate as main monomers, and (meth) acrylic acid and hydroxy.
- Tg glass transition temperature
- the above-mentioned "glass transition temperature” is the glass transition temperature of a homopolymer obtained by using the corresponding monomer.
- the acrylic copolymer may be a crosslinked acrylic copolymer.
- the cross-linked acrylic copolymer can be synthesized by cross-linking a monomer, which is a raw material of the acrylic copolymer, with a cross-linking agent.
- the cross-linking agent used for synthesizing the cross-linked acrylic copolymer include known cross-linking agents such as isocyanate compounds, melamine compounds, and epoxy compounds.
- the cross-linking agent is more preferably a polyfunctional cross-linking agent such as trifunctional or tetrafunctional. It was
- the release layer may contain an anchoring improver, a cross-linking accelerator, a filler, a colorant and the like, if necessary.
- an anchoring improver for example, when the release layer contains a filler, the outer surface of the release layer (the surface opposite to the conductive layer) is roughened, and the peelability from the electronic component is improved.
- the material of the filler is not particularly limited, and may be an organic substance such as a resin, an inorganic substance such as a metal or a metal oxide, or a combination of an organic substance and an inorganic substance. Further, the filler contained in the release layer may be only one type or two or more types.
- the volume average particle size of the filler is not particularly limited. For example, it can be selected from the range of 1 ⁇ m to 20 ⁇ m. In the present specification, the volume average particle size of the filler is the particle size (D50) when the accumulation from the small diameter side is 50% in the volume-based particle size distribution measured by the laser diffraction method.
- the filler is preferably resin particles.
- the resin constituting the resin particles include acrylic resin, olefin resin, styrene resin, acrylonitrile resin, silicone resin and the like.
- Acrylic resin is preferable from the viewpoint of suppressing the residue on the surface of the semiconductor package after molding.
- the thickness of the release layer is not particularly limited, and is preferably 0.1 ⁇ m or more, and more preferably 1 ⁇ m or more. When the thickness of the release layer is 0.1 ⁇ m or more, sufficient adhesive force to the electronic component is obtained, and the intrusion of the encapsulant is effectively suppressed.
- the thickness of the release layer may be 100 ⁇ m or less, 50 ⁇ m or less, or 10 ⁇ m or less. When the thickness of the release layer is 100 ⁇ m or less, heat shrinkage stress during heat curing of the release layer is unlikely to occur, and the flatness of the release film is likely to be maintained.
- the release film has a conductive layer
- the surface resistivity of the release layer is maintained low without being too far from the conductive layer, and the electrostatic breakdown of electronic components is effective. It is suppressed.
- the thickness of the release layer is more preferably 3 ⁇ m to 50 ⁇ m, considering the ease of forming the release layer (applicability, etc.), the securing of the adhesive strength, the securing of the antistatic function, and the like.
- the structure of the conductive layer is not particularly limited as long as it can increase the conductivity of the release film and suppress charging.
- it may be a layer containing a conductive material such as an antistatic agent, a conductive polymer material, and a metal.
- Examples of the antistatic agent contained in the conductive layer include a cationic antistatic agent having a cationic group such as a quaternary ammonium salt, a pyridium salt, and a primary to tertiary amino group, a sulfonic acid base, a sulfate ester base, and a phosphoric acid.
- Anionic antistatic agents having anionic groups such as ester bases, amphoteric antistatic agents such as amino acid-based and amino acid sulfate esters, and nonionic antistatic agents having nonionic groups such as aminoalcohol-based, glycerin-based, and polyethylene glycol-based antistatic agents.
- the antistatic agent may be a combination of a main agent and an auxiliary agent (curing agent, etc.).
- the conductive polymer material contained in the conductive layer include polymer compounds having polythiophene, polyaniline, polypyrrole, polyacetylene and the like in the skeleton.
- the metal include aluminum, copper, gold, chromium, tin and the like, and aluminum is preferable from the viewpoint of availability.
- the method of forming the conductive layer is not particularly limited.
- a method of laminating a metal foil or the like on one side of a film to be a base material layer a method of applying a material of a conductive layer to one side of a film to be a base material layer, a method of applying by vapor deposition, or the like can be mentioned.
- the thickness of the conductive layer is not particularly limited as long as the antistatic effect of the release film can be sufficiently obtained.
- it may be in the range of 0.01 ⁇ m to 1 ⁇ m.
- the release film of the present disclosure can be used for various purposes. For example, it can be used to temporarily protect at least a portion of the surface of an object. Since the release film of the present disclosure has excellent followability to the adherend surface, when the periphery of the area to which the release film is attached is processed, the area is effectively protected from the influence. Can be done. In the present disclosure, “temporarily protecting” means protecting the portion to which the release film is attached from the time when the release film is attached to at least a part of the surface of the object until the release is peeled off.
- the type of processing performed on the periphery of the area where the release film is attached is not particularly limited.
- sealing with a sealing material, roughening treatment, coating treatment, water repellent treatment, antistatic treatment and the like can be mentioned.
- the release film may be one used for exposure molding.
- the method for manufacturing the electronic component device of the present disclosure includes a step of sealing the periphery of the electronic component in a state where the above-mentioned release film is in contact with at least a part of the surface of the electronic component, and a step of peeling the release film from the electronic component. It is a manufacturing method of an electronic component device including a process.
- the release film of the present disclosure has excellent followability to the adherend surface. Therefore, the invasion of the sealing material into the exposed portion that appears by peeling the release film from the surface of the electronic component is effectively suppressed.
- the type of electronic component used in the above method is not particularly limited.
- semiconductor elements, capacitors, terminals and the like can be mentioned.
- the type of material (sealing material) that seals the periphery of the electronic component is not particularly limited.
- a resin composition containing an epoxy resin, an acrylic resin and the like can be mentioned.
- the release film of the present disclosure will be described below based on examples. However, the present disclosure is not limited to the following examples.
- the antistatic agent used to prepare the release film is a mixture of the following component A (100 parts by mass) and component B (25 parts by mass).
- Ingredient A Cationic antistatic agent which is an acrylic copolymer having a quaternary ammonium salt, trade name "Bondip PA-100 main agent", Konishi Co., Ltd.
- Ingredient B Epoxy-based curing agent, trade name "Bondip PA” -100 Hardener ", Konishi Co., Ltd.
- Adhesive Acrylic adhesive, trade name "FS-1208", solid content: 45% by mass, Lion Specialty Chemicals Co., Ltd., mixture of multiple types of methacrylate ester monomers
- Crosslinker Trade name "Duranate E405-80T” , Solid content: 80% by mass, Asahi Kasei Chemicals Co., Ltd., Polyisocyanate-based cross-linking agent (hexamethylene diisocyanate cross-linking agent (HMDI)), Number of isocyanate groups in one molecule: 2
- Filler Crosslinked particles in cross-linked acrylic, trade name " MX-500 ”, volume average particle size: 5 ⁇ m, Soken Kagaku Co., Ltd.
- Example 2 As a base material layer, an unstretched polybutylene terephthalate / polyethylene terephthalate film having a thickness of 50 ⁇ m and having a corona treatment on one side was prepared.
- the unstretched polybutylene terephthalate / polyethylene terephthalate film used contains 90% by mass of polybutylene terephthalate and 10% by mass of polyethylene terephthalate.
- a release film was produced in the same manner as in Example 1 except that the above base material layer was used.
- Example 1 A release film was produced in the same manner as in Example 1 except that a stretched polybutylene terephthalate film having a thickness of 50 ⁇ m was used as a base material layer instead of the unstretched polybutylene terephthalate film having a thickness of 50 ⁇ m.
- Example 1 (Measurement of elongation and elastic modulus) A test piece as shown in FIG. 1 was prepared using a release film and placed in a chamber heated to 170 ° C. After 1 minute, the above-mentioned tensile test was carried out in the chamber, and the elongation and elastic modulus at 170 ° C. were measured.
- Example 2 and Comparative Example 2 "Tencilon tensile tester RTA-100 type” manufactured by Orientec Co., Ltd. was used as the tensile tester.
- Example 3 "Tencilon universal tester RTG-1210" manufactured by A & D Co., Ltd. was used as the tensile tester.
- the release film was attached to the upper mold of the transfer mold mold having a depth of 1 mm, fixed in vacuum, then the mold was fastened, and the encapsulant was transfer-molded.
- the mold temperature was 170 ° C.
- the molding pressure was 6.86 MPa (70 kgf / cm 2 )
- the molding time was 300 seconds. If vacuum suction is possible and the release sheet can follow, it is OK, and if vacuum suction leakage occurs, it is regarded as NG and the mold followability was evaluated.
- the release films of Examples 1 to 3 having an elongation rate of 500% or more at 170 ° C. are the release films of Comparative Example 1 having an elongation rate of less than 500% at 170 ° C. It is superior in followability to the adherend surface as compared with the film.
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Abstract
Description
このような離型フィルムとして、例えば、特開2006-49850号公報には延伸ポリエステル樹脂フィルムからなる基材フィルムの少なくとも片面にフッ素樹脂からなるフィルムが積層されてなる積層フィルムが記載されている。
<1>170℃での伸び率が500%以上である、離型フィルム。
<2>170℃での弾性率が65MPa以上である、<1>に記載の離型フィルム。
<3>被着面側の表面の23℃でのタック力が0.1gf以上である、<1>又は<2>に記載の離型フィルム。
<4>基材層と離型層とを備える、<1>~<3>のいずれか1項に記載の離型フィルム。
<5>前記基材層がポリブチレンテレフタレートを含む、<4>に記載の離型フィルム。
<6>前記離型層が粘着剤を含む、<4>又は<5>に記載の離型フィルム。
<7>前記離型層の厚みが1μm以上である、<4>~<6>のいずれか1項に記載の離型フィルム。
<8>物体の表面の少なくとも一部を一時的に保護するための、<1>~<7>のいずれか1項に記載の離型フィルム。
<9>露出成形用である、<1>~<8>のいずれか1項に記載の離型フィルム。
<10><1>~<9>のいずれか1項に記載の離型フィルムが電子部品の表面の少なくとも一部に接触した状態で電子部品の周囲を封止する工程と、前記離型フィルムを前記電子部品から剥離する工程と、を備える電子部品装置の製造方法。
本明細書において「~」を用いて示された数値範囲には、「~」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本明細書中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本明細書中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本明細書において組成物中の各成分の含有率又は含有量は、組成物中に各成分に該当する物質が複数種存在する場合、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本明細書において組成物中の各成分の粒子径は、組成物中に各成分に該当する粒子が複数種存在する場合、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。
本明細書において「層」との語には、当該層が存在する領域を観察したときに、当該領域の全体に形成されている場合に加え、当該領域の一部にのみ形成されている場合も含まれる。
本明細書において離型フィルム又は離型フィルムを構成する各層の厚みは、公知の手法で測定できる。例えば、ダイヤルゲージ等を用いて測定してもよく、離型フィルムの断面画像から測定してもよい。あるいは、層を構成する材料を溶剤等を用いて除去し、除去前後の質量、材料の密度、層の面積等から算出してもよい。層の厚みが一定でない場合は、任意の5点で測定した値の算術平均値を層の厚みとする。
本明細書において「(メタ)アクリル」はアクリル及びメタクリルのいずれか一方又は両方を意味し、「(メタ)アクリレート」はアクリレート及びメタクリレートのいずれか一方又は両方を意味する。
本開示において実施形態を図面を参照して説明する場合、当該実施形態の構成は図面に示された構成に限定されない。また、各図における部材の大きさは概念的なものであり、部材間の大きさの相対的な関係はこれに限定されない。
本開示の離型フィルムは、170℃での伸び率が500%以上である、離型フィルムである。
剥離しやすさの観点からは、離型フィルムの170℃での伸び率は、1300%以下であってもよく、1200%以下であってもよく、1000%以下であってもよく、800%以下であってもよい。
離型フィルムの170℃での弾性率が65MPa以上であると、離型フィルムが適度に硬く、被着面に貼り付ける際の作業性が良好である。
被着面に対する追従性の観点からは、離型フィルムの170℃での弾性率は150MPa以下であってもよく、120MPa以下であってもよく、100MPa以下であってもよい。
離型フィルムの150℃での伸び率が500%以上であると、離型フィルムの被着面への貼り付けを低温で実施する場合にも優れた密着性を示す。
剥離しやすさの観点からは、離型フィルムの150℃での伸び率は、1300%以下であってもよく、1200%以下であってもよく、1000%以下であってもよく、800%以下であってもよい。
離型フィルムの150℃での弾性率が65MPa以上であると、離型フィルムの被着面への貼り付けを低温で実施する場合にも作業性が良好である。
被着面に対する追従性の観点からは、離型フィルムの150℃での弾性率は150MPa以下であってもよく、120MPa以下であってもよく、100MPa以下であってもよい。
まず、離型フィルムを用いて図1に示すような形状の試験片(長さの単位:mm)を作製する。試験片の形状は、幅が10mmでチャック間距離が確保できる部分を有していれば、図1の形状に制限されない。
試験片の両端を、引張試験機の掴み具(チャック)でつかんで引張試験を実施する。試験片を掴む位置は試験片の幅が10mmである部分とし、チャック間距離は15mmとする。測定は所定の温度条件下で行い、引張速度は500mm/分とする。
引張試験前の試験片のチャック間距離A(15mm)と、試験片が切断したときのチャック間距離Bとから、下式により伸び率を算出する。
離型フィルムが離型層を有していることで、離型フィルムを被着面から容易に剥離することができる。
離型フィルムが導電層を有していることで、離型フィルムを剥離する際の放電が抑制され、電子部品の静電破壊等の発生が効果的に抑制される。
基材層の材質は、これを用いた離型フィルムの170℃での伸び率が500%以上になるのであれば、特に制限されない。
例えば、ポリエチレンテレフタラート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル、ポリイミド、ポリアミド、ポリエステルエーテル、ポリアミドイミド、フッ素含有樹脂、熱可塑性エラストマーなどの樹脂が挙げられる。
基材層は樹脂としてポリブチレンテレフタレートのみを含んでも、ポリブチレンテレフタレートとポリブチレンテレフタレート以外の樹脂とを含んでもよい。例えば、基材層はポリブチレンテレフタレートとポリエチレンテレフタラートとを含んでもよい。
基材層がポリブチレンテレフタレートとポリエチレンテレフタラートとを含むことで、例えば、高い伸び率を維持した状態で弾性率を高める等の効果が期待できる。
基材層の厚みは300μm以下であることが好ましく、200μm以下であることがより好ましく、100μmであることがさらに好ましい。基材層の厚みが300μm以下であると、被着面に対する追従性が充分に得られる傾向にある。
離型層の材質は特に制限されず、離型フィルムの所望の特性(被着面に対する密着性、剥離性等)に応じて選択できる。
被着面に対する密着性の観点からは、離型層は粘着性を有することが好ましい。離型層に粘着性を付与する方法としては、離型層に粘着剤を含有させる方法が挙げられる。
離型層の厚みは100μm以下であってもよく、50μm以下であってもよく、10μm以下であってもよい。離型層の厚みが100μm以下であると、離型層の熱硬化時の熱収縮応力が生じにくく、離型フィルムの平坦性が保持されやすい。また、離型フィルムが導電層を有している場合には、離型層表面の導電層からの距離が遠すぎずに表面抵抗率が低く維持され、電子部品の静電破壊が効果的に抑制される。
離型層の形成しやすさ(塗布性等)、粘着力の確保、帯電防止機能の確保等を総合的に考慮すると、離型層の厚みは3μm~50μmであることがさらに好ましい。
導電層は、離型フィルムの導電性を高めて帯電を抑制できるものであれば、その構成は特に制限されない。例えば、帯電防止剤、導電性高分子材料、金属等の導電性材料を含む層であってもよい。
導電層に含まれる導電性高分子材料としては、ポリチオフェン、ポリアニリン、ポリピロール、ポリアセチレン等を骨格に有する高分子化合物が挙げられる。
金属としてはアルミニウム、銅、金、クロム、スズ等が挙げられ、入手性の観点からはアルミニウムが好ましい。
本開示において「一時的に保護する」とは、物体の表面の少なくとも一部に離型フィルムを貼り付けてから剥離するまで間、離型フィルムが貼り付けられた部分を保護することをいう。
離型フィルムは、露出成形に用いられるものであってもよい。
本開示の電子部品装置の製造方法は、上述した離型フィルムが電子部品の表面の少なくとも一部に接触した状態で電子部品の周囲を封止する工程と、離型フィルムを電子部品から剥離する工程と、を備える電子部品装置の製造方法である。
上記方法において電子部品の周囲を封止する材料(封止材)の種類は特に制限されない。例えば、エポキシ樹脂、アクリル樹脂等を含む樹脂組成物が挙げられる。
基材層として、片面にコロナ処理が施された厚さ50μmの無延伸ポリブチレンテレフタレートフィルムを準備した。
基材層のコロナ処理面に、後述する帯電防止剤を混合溶剤(水/イソプロピルアルコール=1/1(質量比))で2.5質量%に希釈したものを塗布し、100℃で1分間加熱して導電層を形成した。
形成した導電層の上に、後述する離型層形成用組成物を離型層の厚みが5μmとなるように塗布し、100℃で1分間加熱して離型層を形成し、離型フィルムを作製した。
成分A:第4級アンモニウム塩を有するアクリル共重合体であるカチオン性帯電防止剤、商品名「ボンディップPA-100主剤」、コニシ株式会社
成分B:エポキシ系硬化剤、商品名「ボンディップPA-100硬化剤」、コニシ株式会社
粘着剤:アクリル系粘着剤、商品名「FS-1208」、固形分:45質量%、ライオン・スペシャリティ・ケミカルズ株式会社、複数種のメタクリル酸エステルモノマーの混合物
架橋剤:商品名「デュラネートE405-80T」、固形分:80質量%、旭化成ケミカルズ株式会社、ポリイソシアネート系架橋剤(ヘキサメチレンジイソシアネート架橋剤(HMDI))、1分子中のイソシアネート基数:2個
フィラー:架橋アクリル中分散粒子、商品名「MX-500」、体積平均粒子径:5μm、綜研化学株式会社
基材層として、片面にコロナ処理が施された厚さ50μmの無延伸ポリブチレンテレフタレート/ポリエチレンテレフタレートフィルムを準備した。
使用した無延伸ポリブチレンテレフタレート/ポリエチレンテレフタレートフィルムは、ポリブチレンテレフタレート90質量%と、ポリエチレンテレフタレート10質量%とを含む。
上記の基材層を用いたこと以外は実施例1と同様にして、離型フィルムを作製した。
基材層として、片面にコロナ処理が施された厚さ100μmの無延伸ポリブチレンテレフタレートフィルムを準備した。
基材層のコロナ処理面に、実施例1で使用したものと同じ帯電防止剤を混合溶剤(水/イソプロピルアルコール=1/1(質量比))で2.5質量%に希釈したものを塗布し、100℃で1分間加熱して導電層を形成した。
形成した導電層の上に、実施例1で使用したものと同じ離型層形成用組成物を離型層の厚みが10μmとなるように塗布し、100℃で1分間加熱して離型層を形成し、離型フィルムを作製した。
厚さ50μmの無延伸ポリブチレンテレフタレートフィルムの代わりに厚さ50μmの延伸ポリブチレンテレフタレートフィルムを基材層として用いたこと以外は実施例1と同様にして、離型フィルムを作製した。
作製した離型フィルムを用いて、以下の評価試験を行った。
図1に示すような試験片を、離型フィルムを用いて作製し、170℃に加熱したチャンバの中に入れた。1分経過後に、チャンバの中で上述した引張試験を実施し、170℃における伸び率及び弾性率を測定した。
実施例1、実施例2及び比較例2では引張試験機として株式会社オリエンテック製「テンシロン引張試験機 RTA-100型」を使用した。
実施例3では引張試験機として株式会社エー・アンド・デイ製「テンシロン万能試験機RTG-1210」を使用した。
離型フィルムの離型層の表面の23℃でのタック力を上述した方法で測定した。
深さ1mmのトランスファーモールド金型の上型に離型フィルムを装着し、真空で固定した後、型締めし、封止材をトランスファーモールドした。金型温度は170℃、成形圧力6.86MPa(70kgf/cm2)、成形時間300秒とした。
真空吸着が可能であり離型シートが追従できていればOK、追従性が不足し、真空吸着漏れが発生した場合はNGとして、金型追従性を評価した。
170℃に加熱したSUS(ステンレス鋼)製ホットプレートの上で、任意のサイズに切り出した基材層用の樹脂フィルムを5分間加熱処理し、ホットプレートの貼りつき性を評価した。貼りつかない場合はOK、貼りつく場合はNGとした。結果を表1に示す。
本明細書に記載された全ての文献、特許出願、および技術規格は、個々の文献、特許出願、および技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に援用されて取り込まれる。
Claims (10)
- 170℃での伸び率が500%以上である、離型フィルム。
- 170℃での弾性率が65MPa以上である、請求項1に記載の離型フィルム。
- 被着面側の表面の23℃でのタック力が0.1gf以上である、請求項1又は請求項2に記載の離型フィルム。
- 基材層と離型層とを備える、請求項1~請求項3のいずれか1項に記載の離型フィルム。
- 前記基材層がポリブチレンテレフタレートを含む、請求項4に記載の離型フィルム。
- 前記離型層が粘着剤を含む、請求項4又は請求項5に記載の離型フィルム。
- 前記離型層の厚みが1μm以上である、請求項4~請求項6のいずれか1項に記載の離型フィルム。
- 物体の表面の少なくとも一部を一時的に保護するための、請求項1~請求項7のいずれか1項に記載の離型フィルム。
- 露出成形用である、請求項1~請求項8のいずれか1項に記載の離型フィルム。
- 請求項1~請求項9のいずれか1項に記載の離型フィルムが電子部品の表面の少なくとも一部に接触した状態で電子部品の周囲を封止する工程と、前記離型フィルムを前記電子部品から剥離する工程と、を備える電子部品装置の製造方法。
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JP2000294579A (ja) * | 1999-04-06 | 2000-10-20 | Nitto Denko Corp | 半導体チップの樹脂封止方法及びその方法に使用する離型フィルム |
JP2006049850A (ja) * | 2004-06-29 | 2006-02-16 | Asahi Glass Co Ltd | 半導体チップ封止用離型フィルム |
WO2017200102A1 (ja) * | 2016-05-20 | 2017-11-23 | 日立化成株式会社 | 離型フィルム |
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JP2000294579A (ja) * | 1999-04-06 | 2000-10-20 | Nitto Denko Corp | 半導体チップの樹脂封止方法及びその方法に使用する離型フィルム |
JP2006049850A (ja) * | 2004-06-29 | 2006-02-16 | Asahi Glass Co Ltd | 半導体チップ封止用離型フィルム |
WO2017200102A1 (ja) * | 2016-05-20 | 2017-11-23 | 日立化成株式会社 | 離型フィルム |
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