KR20230052946A - 이형 필름 및 전자 부품 장치의 제조 방법 - Google Patents

이형 필름 및 전자 부품 장치의 제조 방법 Download PDF

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Publication number
KR20230052946A
KR20230052946A KR1020237009324A KR20237009324A KR20230052946A KR 20230052946 A KR20230052946 A KR 20230052946A KR 1020237009324 A KR1020237009324 A KR 1020237009324A KR 20237009324 A KR20237009324 A KR 20237009324A KR 20230052946 A KR20230052946 A KR 20230052946A
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KR
South Korea
Prior art keywords
release film
layer
release
electronic component
film
Prior art date
Application number
KR1020237009324A
Other languages
English (en)
Korean (ko)
Inventor
야스히로 세리
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20230052946A publication Critical patent/KR20230052946A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
KR1020237009324A 2020-08-19 2021-08-17 이형 필름 및 전자 부품 장치의 제조 방법 KR20230052946A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2020/031272 2020-08-19
PCT/JP2020/031272 WO2022038712A1 (ja) 2020-08-19 2020-08-19 離型フィルム及び電子部品装置の製造方法
PCT/JP2021/030026 WO2022039157A1 (ja) 2020-08-19 2021-08-17 離型フィルム及び電子部品装置の製造方法

Publications (1)

Publication Number Publication Date
KR20230052946A true KR20230052946A (ko) 2023-04-20

Family

ID=80323569

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237009324A KR20230052946A (ko) 2020-08-19 2021-08-17 이형 필름 및 전자 부품 장치의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2022039157A1 (ja)
KR (1) KR20230052946A (ja)
CN (1) CN116097411A (ja)
TW (1) TW202209514A (ja)
WO (2) WO2022038712A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049850A (ja) 2004-06-29 2006-02-16 Asahi Glass Co Ltd 半導体チップ封止用離型フィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3578262B2 (ja) * 1999-04-06 2004-10-20 日東電工株式会社 半導体チップの樹脂封止方法及びその方法に使用する離型フィルム
TW202237368A (zh) * 2016-05-20 2022-10-01 日商日立化成股份有限公司 脫模膜

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049850A (ja) 2004-06-29 2006-02-16 Asahi Glass Co Ltd 半導体チップ封止用離型フィルム

Also Published As

Publication number Publication date
JPWO2022039157A1 (ja) 2022-02-24
WO2022039157A1 (ja) 2022-02-24
WO2022038712A1 (ja) 2022-02-24
TW202209514A (zh) 2022-03-01
CN116097411A (zh) 2023-05-09

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