WO2012133418A1 - 半導体ウエハ等加工用粘着テープ - Google Patents
半導体ウエハ等加工用粘着テープ Download PDFInfo
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- WO2012133418A1 WO2012133418A1 PCT/JP2012/057952 JP2012057952W WO2012133418A1 WO 2012133418 A1 WO2012133418 A1 WO 2012133418A1 JP 2012057952 W JP2012057952 W JP 2012057952W WO 2012133418 A1 WO2012133418 A1 WO 2012133418A1
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- Prior art keywords
- adhesive
- weight
- carboxyl group
- adhesive tape
- tape
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 82
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 58
- 238000012545 processing Methods 0.000 title claims abstract description 38
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 84
- 239000012790 adhesive layer Substances 0.000 claims abstract description 77
- 235000012431 wafers Nutrition 0.000 claims abstract description 76
- 229920000642 polymer Polymers 0.000 claims abstract description 64
- 239000010410 layer Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 40
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims abstract description 35
- 230000005855 radiation Effects 0.000 claims abstract description 32
- 239000003431 cross linking reagent Substances 0.000 claims description 58
- 125000000524 functional group Chemical group 0.000 claims description 42
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 32
- 238000006116 polymerization reaction Methods 0.000 claims description 20
- 125000004185 ester group Chemical group 0.000 claims description 16
- -1 acrylic ester Chemical class 0.000 claims description 14
- 229920001577 copolymer Polymers 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 112
- 230000001070 adhesive effect Effects 0.000 abstract description 112
- 238000011156 evaluation Methods 0.000 description 105
- 230000000052 comparative effect Effects 0.000 description 28
- 239000005056 polyisocyanate Substances 0.000 description 23
- 229920001228 polyisocyanate Polymers 0.000 description 23
- 238000000034 method Methods 0.000 description 20
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 14
- 239000003292 glue Substances 0.000 description 10
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 229920000058 polyacrylate Polymers 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000012948 isocyanate Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 150000002513 isocyanates Chemical class 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002216 antistatic agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 230000009191 jumping Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920001195 polyisoprene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 239000013500 performance material Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003643 water by type Substances 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-M 2-ethylacrylate Chemical compound CCC(=C)C([O-])=O WROUWQQRXUBECT-UHFFFAOYSA-M 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 208000033999 Device damage Diseases 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- GWGWXYUPRTXVSY-UHFFFAOYSA-N N=C=O.N=C=O.CC1=CC=C(C)C=C1 Chemical compound N=C=O.N=C=O.CC1=CC=C(C)C=C1 GWGWXYUPRTXVSY-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 1
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical group N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- MLMVPBFKPWONNM-UHFFFAOYSA-N prop-2-enoic acid;urea Chemical compound NC(N)=O.OC(=O)C=C MLMVPBFKPWONNM-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C09J201/08—Carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/40—Compositions for pressure-sensitive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
Definitions
- the present invention relates to an adhesive tape for processing a semiconductor wafer or the like.
- This application claims priority based on Japanese Patent Application No. 2011-075003 filed in Japan on March 30, 2011 and Japanese Patent Application No. 2012-003125 filed in Japan on January 11, 2012. Is hereby incorporated by reference.
- dicing tapes Various adhesive tapes for processing semiconductor wafers (hereinafter referred to as “dicing tapes”) used for dicing processing of semiconductor wafers and packaged products have been proposed.
- an adhesive layer is formed on a base material layer (base layer), and a semiconductor wafer or the like is fixed by the adhesive layer.
- a radiation polymerization compound photocurable resin
- a radiation polymerization initiator photopolymerization initiator
- a crosslinking are usually used for the adhesive layer.
- Agents are added. That is, when the adhesive layer is irradiated with radiation (light) such as ultraviolet rays after the dicing process, these components are cured and the adhesiveness of the adhesive layer is lowered, so that the semiconductor chip can be easily picked up.
- Patent Documents 1 and 2 disclose dicing tapes in which the material of the adhesive layer is appropriately selected in order to solve the above problems. These dicing tapes can stably hold an uneven adherend.
- An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer or the like that can reduce the amount of the adhesive remaining on the surface of the adherend after tape peeling.
- the polymer compound has a weight average molecular weight of 500 or more and 20000 or less, and the number of functional groups is 5 or more, and the content of the crosslinking agent is 3 parts by weight with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the pressure-sensitive adhesive tape for processing a semiconductor wafer or the like which is 14 parts by weight or less.
- the carboxyl group-containing polymer further contains an ester group, and the ratio (ester group / carboxyl group) of the number of ester groups to the number of carboxyl groups in the carboxyl group-containing polymer is 80/20 or more.
- the adhesive tape for processing a semiconductor wafer or the like according to (1) or (2) which is 95/5 or less.
- the adhesive tape for processing a semiconductor wafer or the like according to the present invention can more stably hold an uneven adherend.
- the dicing tape according to the present invention is intended to improve the adhesive strength and pick-up property with respect to the adherend, and has a structure in which a die attach film or the like is not provided on the adhesive layer. Because of such a structure, it is not necessary to consider the following problems (I) to (IV) that occur when a die attach film or the like is laminated on the adhesive layer.
- the die attach film melts at the time of dicing, so that the cut quality is lowered, and the pickup property is lowered due to the adhesion between the adhesive layer and the die attach film.
- a manufacturing process increases in order to laminate
- the die attach film and the adhesive layer may react, it cannot be transported at room temperature.
- the pressure-sensitive adhesive tape for processing a semiconductor wafer or the like according to the present invention can reduce the amount of pressure-sensitive adhesive remaining on the surface of the adherend after peeling off the tape.
- the pressure-sensitive adhesive tape for processing a semiconductor wafer or the like of the present invention comprises a base material layer and an adhesive layer formed on at least one surface of the base material layer, and the adhesive layer comprises a carboxyl group-containing polymer and a radiation polymerization compound.
- the radiation-polymerized compound is a pressure-sensitive adhesive tape for processing a semiconductor wafer or the like, wherein the weight average molecular weight is 500 or more and 3000 or less, and the number of functional groups is 5 or more and 15 or less. is there.
- FIG. 1 is a view for explaining an embodiment of an adhesive tape for processing semiconductor wafers (hereinafter referred to as “adhesive tape” or “dicing tape”) 100 of the present invention.
- the pressure-sensitive adhesive tape 100 according to an embodiment of the present invention includes a base material layer 200 and a pressure-sensitive adhesive layer 300.
- the base material layer 200 and the adhesive layer 300 in the case where the adhesive tape is used as a dicing tape will be described in detail.
- the base material layer 200 mainly includes a material resin and plays a role of supporting the adhesive layer 300.
- the base material layer 200 has a strength that can withstand stretching in the expanding process performed after the dicing process.
- the expanding process is a process of stretching the adhesive tape 100 and extending the chip interval. The purpose of this expanding process is to increase chip recognition during pick-up and to prevent device damage due to contact between adjacent chips.
- the material resin is formed into a film by a normal film forming method.
- the material resin is not particularly limited as long as it transmits radiation (visible light, near infrared light, ultraviolet light, X-ray, electron beam, etc.).
- radiation visible light, near infrared light, ultraviolet light, X-ray, electron beam, etc.
- polyvinyl chloride polyethylene, polypropylene, polybutene, polybutadiene, polymethyl, etc.
- Polyolefin resins such as pentene, ethylene / vinyl acetate copolymers, ionomers, olefin copolymers such as ethylene / (meth) acrylic acid copolymers, ethylene / (meth) acrylic acid ester copolymers, polyethylene terephthalate, Polyalkylene terephthalate resins such as polybutylene terephthalate, styrene thermoplastic elastomers, olefin thermoplastic elastomers, thermoplastic resins such as polyvinyl isoprene and polycarbonate, and mixtures of these thermoplastic resins are used.
- the material resin it is preferable to use a mixture of polypropylene and elastomer or a mixture of polyethylene and elastomer as the material resin.
- the block copolymer containing the polystyrene segment shown by General formula (1) and the vinyl polyisoprene segment shown by General formula (2) is preferable.
- the polyisoprene segment is preferably hydrogenated from the viewpoint of weather resistance.
- n is an integer of 2 or more
- n is an integer of 2 or more
- the thickness of the base material layer 200 is not particularly limited, but is preferably 50 ⁇ m or more and 300 ⁇ m or less, and more preferably 80 ⁇ m or more and 200 ⁇ m or less. When the thickness of the base material layer 200 is within the above range, it may be excellent from the viewpoint of cost and workability in the dicing process or the expanding process.
- the production method of the base material layer 200 is not particularly limited, and general molding methods such as a calendar method and an extrusion molding method are used. It is preferable that a functional group that reacts with a material constituting the adhesive layer 300, for example, a hydroxyl group or an amino group, is exposed on the surface of the base material layer 200. In order to improve the adhesion between the base material layer 200 and the adhesive layer 300, the surface of the base material layer 200 is preferably surface-treated with a corona treatment or an anchor coat.
- the adhesive layer 300 plays a role of adhering and holding a semiconductor wafer or the like as an adherend in the dicing process.
- the adhesive layer 300 can easily peel off a cut piece such as a semiconductor wafer.
- the pressure-sensitive adhesive layer 300 is usually protected with a release film.
- the adhesive layer 300 is formed on at least one surface of the base material layer 200 (see FIG. 1).
- the resin solution which is a material of the adhesion layer 300 is normally apply
- coating methods such as die coating, curtain die coating, gravure coating, comma coating, bar coating, or lip coating.
- coating methods such as die coating, curtain die coating, gravure coating, comma coating, bar coating, or lip coating.
- coating methods such as die coating, curtain die coating, gravure coating, comma coating, bar coating, or lip coating.
- coating methods such as die coating, curtain die coating, gravure coating, comma coating, bar coating, or lip coating.
- coating methods such as die coating, curtain die coating, gravure coating, comma coating, bar coating, or lip coating.
- coating methods such as die coating, curtain die coating, gravure coating, comma
- the adhesive layer 300 includes a carboxyl group-containing polymer.
- the adhesive layer 300 includes a radiation polymerization compound (a curing component that cures the adhesive layer 300).
- the adhesive layer 300 may contain an antistatic agent and a tackifier as optional components. Hereinafter, each component will be described in detail.
- Carboxyl group-containing polymer The carboxyl group-containing polymer is, for example, a copolymer of an addition monomer having a carboxyl group and an acrylate ester, vinyl acetate, acrylonitrile, styrene, etc.
- a copolymer of an addition-type monomer having a group and an acrylate ester, that is, a carboxyl group-containing acrylic polymer containing an ester group is preferable.
- the ratio of the number of ester groups to the number of carboxyl groups (ester group / carboxyl group) of the carboxyl group-containing polymer containing this ester group is preferably 80/20 or more and 95/5 or less, 85/15 As mentioned above, it is more preferable that it is 95/5 or less, and it is still more preferable that they are 85/15 or more and 90/10 or less.
- the ratio of the number of ester groups to the number of carboxyl groups (ester group / carboxyl group) of the carboxyl group-containing polymer containing an ester group is within the above range, the adhesive tape for processing a semiconductor wafer or the like has irregularities. It becomes easier to follow the surface of the adherend and can be stably held.
- the carboxyl group-containing acrylic polymer may be copolymerized with at least one of a vinyl acetate monomer and an addition monomer having a functional group other than a carboxyl group within a range not impairing the gist of the present invention. .
- Examples of the addition monomer having a carboxyl group include methacrylic acid, acrylic acid, itaconic acid, maleic anhydride and the like.
- acrylic acid esters include ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, glycidyl acrylate, 2-hydroxyethyl acrylate, ethyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, glycidyl methacrylate, methacrylic acid.
- Examples include 2-hydroxyethyl acid, dimethylaminoethyl methacrylate, and the like.
- At least one acrylate selected from the group comprising ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, and dimethylaminoethyl methacrylate is preferable.
- an acrylate ester having a carboxyl group the adhesion to the adherend is improved, and therefore it is particularly suitable for mounting a semiconductor member, jumping off an end material, and suppressing chipping.
- addition type monomer having a functional group other than a carboxyl group is not particularly limited.
- an acrylic resin represented by the following chemical structural formula (3) that is, acrylic acid that is an addition monomer having a carboxyl group and 2-ethyl acrylate that is an acrylic ester.
- a copolymer with xylyl is used.
- n is a mole number corresponding to 85 to 95 parts by weight and m is a mole number corresponding to 5 to 15 parts by weight.
- n 90 parts by weight equivalent mole
- m 10 parts by weight equivalent mole
- the radiation polymerization compound is used as a curing component for curing the adhesive layer 300.
- the radiation polymerization compound includes a monofunctional acrylate, a polyfunctional acrylate, a monofunctional methacrylate, a polyfunctional methacrylate, a urethane acrylate, a urethane methacrylate, an epoxy acrylate, and an epoxy.
- methacrylate, polyester acrylate, urea acrylate, etc. are mentioned, Among them, urethane acrylate is preferable. This is because the skeleton of urethane acrylate is strong and flexible, so that it is possible to reduce glue cracking by the needle during pick-up.
- Urethane acrylate hardens when irradiated with ultraviolet rays.
- the base resin is incorporated into the urethane acrylate cross-linked structure, and as a result, the adhesive strength of the adhesive layer 300 decreases.
- the curing component for example, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipenta, as long as the gist of the present invention is not impaired.
- Erythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, and the like may be used together with urethane acrylate.
- the weight-average molecular weight of the radiation polymerization compound is 500 or more, preferably 700 or more, more preferably 1000 or more, and further preferably 1200 or more. Moreover, it is 20000 or less, it is preferable that it is 3000 or less, More preferably, it is 2500 or less, Most preferably, it is 2000 or less. If the weight average molecular weight of the radiation-polymerized compound is less than 500, the glue is likely to be scattered during dicing, and the chip surface may be contaminated, and the glue may be easily transferred to the adherend. It is not preferable.
- the weight average molecular weight of the polymerized compound exceeds 20000, the amount of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 300 remaining on the surface of the adherend after peeling off the radiation tape cannot be sufficiently reduced, and the adherend There is a possibility that good adhesive strength cannot be obtained.
- the weight-average molecular weight of the radiation-polymerized compound is 3000 or less, considering that the unevenness of the surface of the adherend becomes worse and the possibility of chip jumping and cutting water intrusion into the back surface of the chip decreases during dicing. It is preferable.
- Examples of a method for measuring the weight average molecular weight of the radiation polymerization compound (particularly urethane acrylate) include a gel chromatography method (GPC method for short).
- GPC method for short.
- the measurement of GPC is not particularly limited, but using Waters Alliance (2695 Separations Module, 2414 Refractive Index Detector, TSK Gel GMHHR-Lx2 + TSK Guard Column HHR-Lx1, Mobile Phase: THF, 1.0 ml / min) Column temperature 40.0 ° C., differential refractometer internal temperature 40.0 ° C., and sample injection volume 100 ⁇ l.
- the radiation polymerization compound (particularly urethane acrylate) preferably has 5 or more functional groups, 7 or more functional groups, more preferably 8 or more functional groups, and still more preferably 10 or more functional groups. .
- the number of functional groups is 15 or less, preferably 13 or less, and more preferably 12 or less.
- the number of functional groups of the radiation-polymerized compound is less than the five functional groups, curing after radiation irradiation becomes insufficient, which may cause a pickup failure.
- the number of functional groups of the radiation-polymerized compound exceeds 15 functional groups, the tape shrinks due to curing shrinkage, which may cause chipping problems and pickup problems.
- the paste becomes brittle due to excessive curing, and there is a risk that paste waste adheres to the back surface of the chip during pick-up.
- the radiation-polymerized compound (particularly urethane acrylate) has a weight average molecular weight of 500 or more and 3000 or less, and the number of functional groups is 5 or more and 15 or less.
- the pressure-sensitive adhesive tape can sufficiently reduce the amount of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 300 remaining on the surface of the adherend after peeling off the tape, and has a good adhesive force to the adherend. It becomes. Furthermore, it has good mountability and pick-up properties, and can hold an uneven adherend stably.
- the said functional group of the said radiation polymerization compound is a vinyl group.
- the content of the radiation polymerization compound (particularly urethane acrylate) is 30 parts by weight or more and 70 parts by weight or less, and 40 parts by weight or more and 60 parts by weight or less with respect to 100 parts by weight of the carboxyl group-containing polymer. It is preferably 45 parts by weight or more and 55 parts by weight or less.
- the pick-up property of the adhesive tape 100 becomes suitable because content of a radiation polymerization compound exists in the said range.
- the curing component it is preferable to use a radiation polymerization initiator and a crosslinking agent together as long as the gist of the present invention is not impaired.
- the radiation (photo) polymerization initiator is added to facilitate the initiation of polymerization of the curing component.
- radiation polymerization initiators include 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram
- Examples thereof include monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone and the like.
- crosslinking agent examples include an epoxy crosslinking agent, an isocyanate crosslinking agent, a methylol crosslinking agent, a chelate crosslinking agent, an aziridine crosslinking agent, a melamine crosslinking agent, and a polyvalent metal chelating crosslinking agent.
- an isocyanate-based crosslinking agent because of high productivity (pot life) and few impurities.
- the trimer of the terminal isocyanate compound obtained by making the polyisocyanate compound of polyhydric isocyanate, the trimer of a polyisocyanate compound, and a polyisocyanate compound and a polyol compound react.
- the blocked polyisocyanate compound which blocked the terminal isocyanate urethane prepolymer with phenol, oximes, etc. are mentioned.
- polyvalent isocyanate examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′-diisocyanate, diphenylmethane— 2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate and the like are used.
- at least one polyisocyanate selected from the group comprising 2,4-tolylene diisocyanate, diphenylmethane-4,4'-diisocyanate and hexamethylene diisocyanate can be mentioned.
- the adhesive layer 300 preferably contains 3 parts by weight or more and 14 parts by weight or less of a crosslinking agent, preferably 4 parts by weight or more and 10 parts by weight or less of the crosslinking agent with respect to 100 parts by weight of the carboxyl group-containing polymer. More preferably, it contains 5 to 7 parts by weight of a crosslinking agent.
- the pressure-sensitive adhesive tape for processing a semiconductor wafer or the like according to the present invention can sufficiently reduce the amount of the pressure-sensitive adhesive remaining on the surface of the adherend after peeling off the tape. And it will have a better adhesive force with respect to a to-be-adhered body.
- the adhesive tape for processing a semiconductor wafer or the like according to the present invention has better pickup properties.
- Antistatic agent Although it does not specifically limit as an antistatic agent, Surfactants, such as anionic surfactant, a cationic surfactant, a nonionic surfactant, an amphoteric surfactant, are used, for example. It is done. In addition, as an antistatic agent that does not exhibit temperature dependence, for example, powders such as carbon black, silver, nickel, antimony-doped tin oxide, and tin-doped indium oxide are used.
- the tackifier is not particularly limited.
- rosin resin, terpene resin, coumarone resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, aliphatic aromatic copolymer Polymerized petroleum resin or the like is used.
- the application of adhesive tape for processing semiconductor wafers of the present invention includes electronics applications such as back grind tape and printed circuit board protection tape, window glass protection film, decorative marking film, medical and sanitary medicine. Examples include base materials.
- ⁇ Usage of adhesive tape (dicing tape)> As a method of using the adhesive tape 100, a known method can be used. For example, after the adhesive tape 100 is attached and fixed to a semiconductor wafer or the like as an adherend, the semiconductor device is cut into element pieces with a rotating round blade. After cutting, ultraviolet rays are irradiated from the base material layer 200 side of the adhesive tape 100. After irradiation, the pressure-sensitive adhesive tape 100 is radially expanded using a dedicated jig to widen the space between chips, and then the semiconductor device is pushed up with a needle or the like. The semiconductor device thus pushed up is picked up by suction by a vacuum collet or air tweezers, and then mounted or stored in a tray.
- Example 1 ⁇ Production of dicing tape> As a material constituting the substrate layer 200, 60 parts by weight of polypropylene and 40 parts by weight of a block copolymer comprising a polystyrene segment represented by the general formula (1) and a vinyl polyisoprene segment represented by the general formula (2) are prepared. did.
- n is an integer of 2 or more
- n is an integer of 2 or more
- the kneaded material was extruded with an extruder to produce a base material layer 200 having a thickness of 150 ⁇ m.
- a carboxyl group-containing acrylic polymer As the carboxyl group-containing polymer of the adhesive layer 300, a carboxyl group-containing acrylic polymer was prepared.
- the carboxyl group-containing acrylic polymer is obtained by solution polymerization of 90% by weight of butyl acrylate and 10% by weight of acrylic acid in a toluene solvent by a conventional method.
- This carboxyl group-containing acrylic polymer is a resin having a weight average molecular weight of 600,000, and the ratio of the number of ester groups to the number of carboxyl groups (ester group / carboxyl group) is 90/10.
- urethane acrylate having a weight average molecular weight of 1400 and a functional group number of 9 (Shin Nakamura Chemical Co., Ltd., product name: UA-33H) 50 parts by weight based on 100 parts by weight of a carboxyl group-containing polymer Prepared the department.
- the weight average molecular weight was measured by dissolving 20 mg of urethane acrylate in 6 ml of tetrahydrofuran (hereinafter THF) and measuring GPC.
- THF tetrahydrofuran
- GPC measurement was performed using Waters Alliance (2695 Separations Module, 2414 Refractive Index Detector, TSK Gel GMHHR-Lx2 + TSK Guard Column HHR-Lx1, mobile phase: THF, 1.0 ml / min), column temperature 40.0 ° C.
- the measurement was performed under the conditions of a differential refractometer internal temperature of 40.0 ° C. and a sample injection amount of 100 ⁇ l.
- 3 parts by weight of 2,2-dimethoxy-2-phenylacetophenone, which is a radiation polymerization initiator was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- 5 parts by weight of a polyisocyanate-based crosslinking agent as a crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- a resin solution in which the carboxyl group-containing polymer, urethane acrylate, radiation polymerization initiator, and crosslinking agent of the adhesive layer 300 were blended was prepared.
- the resin solution was bar-coated on the base material layer 200 so that the thickness of the pressure-sensitive adhesive layer 300 after drying was 15 ⁇ m, and then dried at 80 ° C. for 5 minutes to obtain a desired pressure-sensitive adhesive tape 100.
- the measured adhesive strength was 1000 cN / 25 mm or more, ⁇ , 500 cN / 25 mm or more and less than 1000 cN / 25 mm were evaluated as ⁇ , and less than 500 cN / 25 mm were evaluated as ⁇ .
- the adhesive strength was 1600 cN / 25 mm
- the evaluation regarding the adhesion of the adhesive tape 100 to the adherend was ⁇ (see Table 1 below).
- the semiconductor wafer was pressure-bonded to the adhesive tape 100 under the condition of 23 ° C. and left for 20 minutes, and then diced to a size of 10 mm ⁇ 10 mm. After dicing, the adhesive tape 100 is irradiated with ultraviolet rays, and the surface of the diced semiconductor wafer is adsorbed using a collet that is vacuum-adsorbed, and four needles spaced at 4 mm are pushed up from the bottom of the adhesive tape 100 by 500 ⁇ m. The wafer was picked up from the adhesive tape 100. Of the diced semiconductor wafers, those that were picked up by 99% or more were evaluated as “ ⁇ ”, those that were picked up from 90% to less than 99% were evaluated as “ ⁇ ”, and those other than that were evaluated as “X”.
- Example 2 The adhesive tape 100 was obtained in the same manner as in Example 1 except for the following.
- a curing component of the adhesive layer 300 50 parts by weight of urethane acrylate having a weight average molecular weight of 1800 and a functional group number of 6 (made by Miwon Specialty Chemical, product name: Miramer PU610) is added to 100 parts by weight of the carboxyl group-containing polymer.
- a functional group number of 6 made by Miwon Specialty Chemical, product name: Miramer PU610
- 5 weight part of polyisocyanate type crosslinking agents which are crosslinking agents were prepared with respect to 100 weight part of carboxyl group-containing polymers.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this example was 1400 cN / 25 mm, and the evaluation regarding the adhesion of the adhesive tape 100 to the adherend was ⁇ . 100% of the diced chips could be picked up, and the evaluation of pick-up property was ⁇ . No residue or adhesion of glue occurred on the diced semiconductor wafer, and the evaluation regarding the residue was ⁇ (see Table 1 below).
- Example 3 A dicing tape was obtained in the same manner as Example 1 except for the following.
- urethane acrylate manufactured by Shin-Nakamura Chemical Co., Ltd., product name: UA-33H
- UA-33H urethane acrylate having a weight average molecular weight of 1400 and a functional group number of 9 is 30 parts per 100 parts by weight of the carboxyl group-containing polymer.
- a weight part was prepared.
- 5 weight part of polyisocyanate type crosslinking agents which are crosslinking agents were prepared with respect to 100 weight part of carboxyl group-containing polymers.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive force according to this comparative example was 2000 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was ⁇ . Of the diced chips, 96% could be picked up, and the pickup property was evaluated as “good”. No residue or adhesion of glue occurred on the diced semiconductor wafer, and the evaluation regarding the residue was ⁇ (see Table 1 below).
- Example 4 A dicing tape was obtained in the same manner as Example 1 except for the following.
- urethane acrylate having a weight average molecular weight of 1400 and a functional group number of 9 (Shin Nakamura Chemical Co., Ltd., product name: UA-33H) is 70 parts by weight with respect to 100 parts by weight of the carboxyl group-containing polymer.
- a weight part was prepared.
- 5 weight part of polyisocyanate type crosslinking agents which are crosslinking agents were prepared with respect to 100 weight part of carboxyl group-containing polymers.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this comparative example was 1200 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was ⁇ . 100% of the diced chips could be picked up, and the evaluation of pick-up property was ⁇ . The entire 2% adhesive residue and adhesive adhesion occurred on the diced semiconductor wafer, and the evaluation regarding the adhesive residue was ⁇ (see Table 1 below).
- Example 5 A dicing tape was obtained in the same manner as Example 1 except for the following.
- urethane acrylate having a weight average molecular weight of 1400 and a functional group number of 9 (made by Shin-Nakamura Chemical Co., Ltd., product name: UA-33H) is used with respect to 100 parts by weight of the carboxyl group-containing polymer.
- a weight part was prepared.
- 5 weight part of polyisocyanate type crosslinking agents which are crosslinking agents were prepared with respect to 100 weight part of carboxyl group-containing polymers.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this comparative example was 2200 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was ⁇ . Of the diced chips, 92% could be picked up, and the pickup property was evaluated as “good”. No residue or adhesion of glue occurred on the diced semiconductor wafer, and the evaluation regarding the residue was ⁇ (see Table 1 below).
- Example 6 A dicing tape was obtained in the same manner as Example 1 except for the following.
- urethane acrylate having a weight average molecular weight of 1400 and a functional group number of 9 (made by Shin-Nakamura Chemical Co., Ltd., product name: UA-33H) is used with respect to 100 parts by weight of the carboxyl group-containing polymer.
- a weight part was prepared.
- 5 weight part of polyisocyanate type crosslinking agents which are crosslinking agents were prepared with respect to 100 weight part of carboxyl group-containing polymers.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this comparative example was 900 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was “good”. 100% of the diced chips could be picked up, and the evaluation of pick-up property was ⁇ . As a result, 5% adhesive residue and adhesive adhesion occurred on the diced semiconductor wafer, and the evaluation regarding the adhesive residue was ⁇ (see Table 1 below).
- Example 7 A dicing tape was obtained in the same manner as Example 1 except for the following.
- a carboxyl-containing polymer of the adhesive layer 300 a carboxyl-containing polymer (ratio 98/2 of the number of ester groups and the number of carboxyl groups) prepared by the same method as in Example 1 was prepared.
- urethane acrylate having a weight average molecular weight of 1400 and 9 functional groups (made by Shin-Nakamura Chemical Co., Ltd., product name: UA-33H) is 50 per 100 parts by weight of the carboxyl group-containing polymer.
- a weight part was prepared.
- As a crosslinking agent for the adhesive layer 300 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this comparative example was 800 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was “good”. Of the diced chips, 95% could be picked up, and the pickup property was evaluated as “good”. The entire 3% adhesive residue and adhesive adhesion occurred on the diced semiconductor wafer, and the evaluation regarding the adhesive residue was ⁇ (see Table 1 below).
- Example 1 A dicing tape was obtained in the same manner as Example 1 except for the following.
- urethane acrylate having a weight average molecular weight of 467 and a functional group number of 4 (manufactured by Nippon Kayaku Co., Ltd., product name: Kayrad T-1420 (T)) is added to 100 parts by weight of the carboxyl group-containing polymer. 50 parts by weight were prepared.
- As a crosslinking agent for the adhesive layer 300 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive force according to this comparative example was 1900 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was ⁇ . Of the diced chips, 67% could be picked up, and the evaluation of pick-up property was x. The entire 16% adhesive residue and adhesive adhesion occurred on the diced semiconductor wafer, and the evaluation regarding the adhesive residue was x (see Table 1 below).
- Example 2 A dicing tape was obtained in the same manner as Example 1 except for the following. 50 parts by weight of urethane acrylate having a weight average molecular weight of 20000 and a functional group number of 15 (manufactured by Miwon Specialty Chemical, product name: Miramer SC2152) as a curing component of the adhesive layer 300 is prepared with respect to 100 parts by weight of the carboxyl group-containing polymer. did. As a crosslinking agent for the adhesive layer 300, 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this comparative example was 400 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was x. Of the diced chips, 92% could be picked up, and the pickup property was evaluated as “good”. No residue or adhesion of glue occurred on the diced semiconductor wafer, and the evaluation regarding the residue was ⁇ (see Table 1 below).
- Example 3 A dicing tape was obtained in the same manner as Example 1 except for the following. 50 parts by weight of urethane acrylate having a weight average molecular weight of 11,000 and a functional group number of 3 (manufactured by Miwon Specialty Chemical, product name: Miramer PU320) as a curing component of the adhesive layer 300 is prepared with respect to 100 parts by weight of the carboxyl group-containing polymer. did. As a crosslinking agent for the adhesive layer 300, 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this comparative example was 870 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was ⁇ . Of the diced chips, 73% could be picked up, and the evaluation of pick-up property was x. No residue or adhesion of glue occurred on the diced semiconductor wafer, and the evaluation regarding the residue was ⁇ (see Table 1 below).
- Example 4 A dicing tape was obtained in the same manner as Example 1 except for the following.
- an acrylic polymer manufactured by Soken Chemical Co., Ltd., product name: SK Dyne 1491H
- a curing component of the adhesive layer 300 urethane acrylate having a weight average molecular weight of 1400 and 9 functional groups (made by Shin-Nakamura Chemical Co., Ltd., product name: UA-33H) is 50 per 100 parts by weight of the carboxyl group-containing polymer.
- a weight part was prepared.
- As a crosslinking agent for the adhesive layer 300 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this comparative example was 400 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was x. 100% of the diced chips could be picked up, and the evaluation of pick-up property was ⁇ . 10% adhesive residue and adhesive adhesion occurred on the diced semiconductor wafer, and the evaluation regarding the adhesive residue was x (see Table 1 below).
- Example 5 A dicing tape was obtained in the same manner as Example 1 except for the following.
- a silicon polymer product name: TSE3221S, manufactured by Momentive Performance Materials
- urethane acrylate having a weight average molecular weight of 1400 and 9 functional groups (made by Shin-Nakamura Chemical Co., Ltd., product name: UA-33H) is 50 per 100 parts by weight of the carboxyl group-containing polymer.
- a weight part was prepared.
- As a crosslinking agent for the adhesive layer 300 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the adhesive tape 100 was evaluated in the same manner as in Example 1 with respect to adhesion to the adherend, evaluation of pickup properties, and evaluation of adhesive residue.
- the adhesive strength according to this comparative example was 340 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was x. Of the diced chips, 95% could be picked up, and the pickup property was evaluated as “good”. The entire 25% adhesive residue and adhesive adhesion occurred on the diced semiconductor wafer, and the evaluation regarding the adhesive residue was x (see Table 1 below).
- the evaluation regarding the adhesion to the adherend, the evaluation regarding the adhesive residue, and the evaluation of the pickup property were all ⁇ . Further, in the adhesive tape 100 according to Examples 3 and 4, there are two ⁇ and one ⁇ , and in the adhesive tape 100 according to Examples 5 and 6, ⁇ is one and ⁇ is two. In the pressure-sensitive adhesive tape 100 according to 7, all were “good”. On the other hand, in the dicing tapes according to Comparative Examples 1 to 5, at least one of the evaluation regarding the adhesion to the adherend, the evaluation regarding the adhesive residue, and the evaluation of the pickup property was x.
- Example A1 ⁇ Production of dicing tape> A dicing (adhesive) tape 100 was obtained in the same manner as Example 1 except for the following.
- urethane acrylate product name: Miramer MU9500, manufactured by Miwon Specialty Chemical Co., Ltd.
- a weight average molecular weight of 3200 g / mol and a functional group number of 10 was prepared.
- the adhesive strength was 1300 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape 100 to the adherend was “good”. No adhesive residue was generated on the semiconductor wafer peeled from the dicing tape 100, and the evaluation regarding the adhesive residue was ⁇ (see Table 2 below).
- Example A2 A dicing tape 100 was obtained in the same manner as in Example A1 except for the following.
- urethane acrylate product name: Miramer MU9510, manufactured by Miwon Specialty Chemical Co., Ltd.
- a weight average molecular weight of 14000 g / mol and a functional group number of 15 was prepared.
- 7 weight part of polyisocyanate type crosslinking agents which are crosslinking agents were prepared with respect to 100 weight part of carboxyl group-containing polymers.
- the dicing tape 100 was evaluated in terms of adhesion to the adherend, evaluation of adhesive residue, and pickup property in the same manner as in Example A1.
- the adhesive strength according to this example was 900 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape 100 to the adherend was “good”. No adhesive residue was generated on the semiconductor wafer peeled off from the dicing tape 100, and the evaluation regarding the adhesive residue was good. Of the diced chips, 100% could be picked up, and the evaluation of pick-up property was good (see Table 2 below).
- Example A1 A dicing tape was obtained in the same manner as in Example A1 except for the following.
- urethane acrylate having a weight average molecular weight of 467 g / mol and a functional group number of 4 functional (manufactured by Nippon Kayaku Co., Ltd., product name: Kayarad T-1420 (T)) was prepared.
- T Kayarad T-1420
- a crosslinking agent for the adhesive layer 300 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the dicing tape was evaluated in terms of adhesion to the adherend, evaluation of adhesive residue, and pickup property in the same manner as in Example A1.
- the adhesive strength according to this comparative example was 1900 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was good.
- Adhesive residue was generated on the semiconductor wafer peeled from the dicing tape, and the evaluation regarding the adhesive residue was x. Of the diced chips, 67% could be picked up, and the pickup property was evaluated as x (see Table 2 below).
- Example A2 A dicing tape was obtained in the same manner as in Example A1 except for the following.
- urethane acrylate product name: Miramer SC2152 manufactured by Miwon Specialty Chemical Co., Ltd.
- a crosslinking agent for the adhesive layer 300 7 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the dicing tape was evaluated in terms of adhesion to the adherend, evaluation of adhesive residue, and pickup property in the same manner as in Example A1.
- the adhesive strength according to this comparative example was 400 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was x. No adhesive residue was generated on the semiconductor wafer peeled from the dicing tape, and the evaluation regarding the adhesive residue was good. Of the diced chips, 100% could be picked up, and the evaluation of pick-up property was good (see Table 2 below).
- Example A3 A dicing tape was obtained in the same manner as in Example A1 except for the following.
- urethane acrylate having a weight average molecular weight of 11000 g / mol and a functional group number of trifunctional (product name: Miramer PU320, manufactured by Miwon Specialty Chemical) was prepared.
- a crosslinking agent for the adhesive layer 300 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the dicing tape was evaluated in terms of adhesion to the adherend, evaluation of adhesive residue, and pickup property in the same manner as in Example A1.
- the adhesive strength according to this comparative example was 870 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was “good”. No adhesive residue was generated on the semiconductor wafer peeled from the dicing tape, and the evaluation regarding the adhesive residue was good. 73% of the diced chips could be picked up, and the pickup property was evaluated as x (see Table 2 below).
- Example A4 A dicing tape was obtained in the same manner as in Example A1 except for the following.
- a carboxyl group-containing polymer of the adhesive layer 300 an acrylic polymer (manufactured by Soken Chemical Co., Ltd., product name: SK Dyne 1491H) was prepared.
- a curing component of the adhesive layer 300 urethane acrylate having a weight average molecular weight of 8000 g / mol and a functional group number of 10 (manufactured by Miwon Specialty Chemical, product name: Miramer MU9500) was prepared.
- a crosslinking agent for the adhesive layer 300 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the dicing tape was evaluated in terms of adhesion to the adherend, evaluation of adhesive residue, and pickup property in the same manner as in Example A1.
- the adhesive strength according to this comparative example was 300 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was x.
- Adhesive residue was generated on the semiconductor wafer peeled from the dicing tape, and the evaluation regarding the adhesive residue was x. Of the diced chips, 100% could be picked up, and the evaluation of pick-up property was good (see Table 2 below).
- Example A5 A dicing tape was obtained in the same manner as in Example A1 except for the following.
- a carboxyl group-containing polymer of the adhesive layer 300 a silicon-based polymer (manufactured by Momentive Performance Materials, product name: TSE3221S) was prepared.
- a curing component of the adhesive layer 300 urethane acrylate having a weight average molecular weight of 8000 g / mol and a functional group number of 10 (manufactured by Miwon Specialty Chemical, product name: Miramer MU9500) was prepared.
- a crosslinking agent for the adhesive layer 300 5 parts by weight of a polyisocyanate-based crosslinking agent was prepared with respect to 100 parts by weight of the carboxyl group-containing polymer.
- the dicing tape was evaluated in terms of adhesion to the adherend, evaluation of adhesive residue, and pickup property in the same manner as in Example A1.
- the adhesive strength according to this comparative example was 340 cN / 25 mm, and the evaluation regarding the adhesion of the dicing tape to the adherend was x.
- Adhesive residue was generated on the semiconductor wafer peeled from the dicing tape, and the evaluation regarding the adhesive residue was x. Of the diced chips, 100% could be picked up, and the evaluation of pick-up property was good (see Table 2 below).
- the evaluation regarding the adhesion to the adherend, the evaluation regarding the adhesive residue, and the evaluation of the pickup property were all “good”.
- the evaluation regarding the adhesion to the adherend, the evaluation regarding the adhesive residue, and the evaluation of the pickup property was x.
- the adhesive tape for processing a semiconductor wafer or the like according to the present invention is an adhesive tape for processing a semiconductor wafer or the like that can reduce the amount of the adhesive remaining on the surface of the adherend after peeling off the tape.
- Adhesive layer 100 Dicing tape (adhesive tape for processing semiconductor wafers, etc.) 200 Base material layer (base layer) 300 Adhesive layer
Abstract
Description
本願は、2011年3月30日に日本に出願された特願2011-075003号及び2012年1月11日に日本に出願された特願2012-003125号に基づき優先権を主張し、その内容をここに援用する。
(1) 基材層と、前記基材層の少なくとも一方の面に形成される粘着層とを備え、前記粘着層は、カルボキシル基含有ポリマーと、放射線重合化合物と、架橋剤を含み、前記放射線重合化合物は、重量平均分子量が500以上、20000以下であり、かつ官能基数が5官能基以上であって、前記架橋剤の含有量は、カルボキシル基含有ポリマー100重量部に対して、3重量部以上、14重量部以下であることを特徴とする半導体ウエハ等加工用粘着テープ。
(2) 前記放射線重合化合物の重量平均分子量が1000以上、20000以下であり、かつ官能基数が10官能基以上である前記(1)に記載の半導体ウエハ等加工用粘着テープ。
(3) 前記カルボキシル基含有ポリマーは、エステル基をさらに含有し、前記カルボキシル基含有ポリマーの前記エステル基の個数と前記カルボキシル基の個数との比(エステル基/カルボキシル基)は、80/20以上95/5以下である前記(1)または(2)に記載の半導体ウエハ等加工用粘着テープ。
(4)前記放射線重合化合物の重量平均分子量が500以上、3000以下であり、かつ官能基数が15官能基以下である前記(1)~(3)のいずれか1つに記載の半導体ウエハ等加工用粘着テープ。
(5) 前記官能基が、ビニル基である前記(1)~(4)のいずれか1つに記載の半導体ウエハ等加工用粘着テープ。
(6) 前記放射線重合化合物の含有量は、前記カルボキシル基含有ポリマー100重量部に対して、30重量部以上、70重量部以下である前記(1)~(5)のいずれか1つに記載の半導体ウエハ等加工用粘着テープ。
(7) 前記放射線重合化合物は、ウレタンアクリレートである前記(1)~(6)のいずれか1つに記載の半導体ウエハ等加工用粘着テープ。
(8) 前記架橋剤は、イソシアネート基を含有する前記(1)~(7)のいずれか1つに記載の半導体ウエハ等加工用粘着テープ。
(9) 前記カルボキシル基含有ポリマーは、アクリル酸エステルとアクリル酸との共重合体である前記(1)~(8)のいずれか1つに記載の半導体ウエハ等加工用粘着テープ。
このような構造のため、ダイアタッチフィルム等が粘着層の上に積層されている場合に起こる下記不具合(I)~(IV)等を考慮する必要がない。
(I)ダイシング時にダイアタッチフィルムが溶融することで、カット品質が低下し、粘着層とダイアタッチフィルムの接着によりピックアップ性が低下する。(II)ダイアタッチフィルムと粘着層の密着により、長期間保管した際にピックアップ性が低下する。(III)ダイアタッチフィルムを積層するために製造工程が増加する。(IV)ダイアタッチフィルムと粘着層が反応する可能性があるために常温輸送が出来ない。
基材層200は、主に、材料樹脂を含み、粘着層300を支持する役目を担っている。また、この基材層200は、ダイシング工程後に実施されるエキスパンド工程において、引延しに耐え得るだけの強度を有する。エキスパンド工程とは、粘着テープ100を引き伸ばし、チップ間隔を拡張する工程である。このエキスパンド工程の目的は、ピックアップの際にチップの認識性を高めること、および隣接するチップ同士の接触によるデバイスの破損を防止することである。
粘着層300は、ダイシング工程において被着体である半導体ウエハ等を粘着して保持する役目を担っている。この粘着層300は、ダイシング工程後に放射線(光)が照射されると、半導体ウエハ等の切断片を容易に剥離させることができる状態となる。なお、使用前粘着テープ100では、通常、粘着層300が離型フィルムで保護されている。
カルボキシル基含有ポリマーは、例えば、カルボキシル基を有する付加型モノマーと、アクリル酸エステル、酢酸ビニル、アクリルニトリル、スチレン等との共重合体が挙げられるが、その中でも特にカルボキシル基を有する付加型モノマーとアクリル酸エステルとの共重合体、すなわちエステル基を含有するカルボキシル基含有アクリル系ポリマーであることが好ましい。このエステル基を含有するカルボキシル基含有ポリマーのエステル基の個数とカルボキシル基の個数との比(エステル基/カルボキシル基)は、80/20以上、95/5以下であることが好ましく、85/15以上、95/5以下であることがより好ましく、85/15以上、90/10以下であることがさらに好ましい。エステル基を含有するカルボキシル基含有ポリマーのエステル基の個数とカルボキシル基の個数との比(エステル基/カルボキシル基)が前記範囲内であることにより、半導体ウエハ等加工用粘着テープは、凹凸のある被着体表面に、より追従し易くなり、安定して保持することができる。なお、このカルボキシル基含有アクリル系ポリマーには、本発明の趣旨を損なわない範囲で、酢酸ビニルモノマー、およびカルボキシル基以外の官能基を有する付加型モノマーの少なくとも一方が共重合されていてもかまわない。
放射線重合化合物は、粘着層300を硬化させる硬化成分として用いられ、前記放射線重合化合物としては、単官能アクリレート、多官能アクリレート、単官能メタクリレート、多官能メタクリレート、ウレタンアクリレート、ウレタンメタクリレート、エポキシアクリレート、エポキシメタクリレート、ポリエステルアクリレート、または尿素アクリレート等が挙げられるが、それらの中でもウレタンアクリレートであることが好ましい。これは、ウレタンアクリレートの骨格が強靭かつ柔軟であるため、ピックアップ時のニードルによる糊割れを低減させることができるからである。また、ウレタンアクリレートは、紫外線が照射されると硬化する。この硬化によってベース樹脂がウレタンアクリレートの架橋構造に取り込まれた結果、粘着層300の粘着力が低下する。なお、硬化成分として、本発明の趣旨を損なわない範囲で、例えば、トリメチロールプロパントリアクリレート、テトラメチロールメタンテトラアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールモノヒドロキシペンタアクリレート、ジペンタエリスリトールヘキサアクリレート、1,4-ブチレングリコールジアクリレート、1,6-ヘキサンジオールジアクリレート、ポリエチレングリコールジアクリレート、市販のオリゴエステルアクリレート等をウレタンアクリレートと一緒に用いてもよい。
なお、前記放射線重合化合物の前記官能基は、ビニル基であることが好ましい。
帯電防止剤として、特に限定されないが、例えば、アニオン性界面活性剤、カチオン性界面活性剤、非イオン性界面活性剤、両イオン性界面活性剤などの界面活性剤が用いられる。また、温度依存性を示さない帯電防止剤として、例えば、カーボンブラック、銀、ニッケル、アンチモンドープスズ酸化物、スズドープインジウム酸化物などの粉体が用いられる。
粘着付与剤として、特に限定されないが、例えば、ロジン樹脂、テルペン樹脂、クマロン樹脂、フェノール樹脂、スチレン樹脂、脂肪族系石油樹脂、芳香族系石油樹脂、脂肪族芳香族共重合系石油樹脂などが用いられる。
粘着テープ100の使用方法は、公知の方法を用いることができる。例えば、粘着テープ100を被着体である半導体ウエハ等に貼り付けて固定した後、回転丸刃で半導体デバイスを素子小片ごとに切断する。切断後、粘着テープ100の基材層200側から紫外線を照射する。照射後、専用治具を用いて粘着テープ100を放射状に拡張してチップ間を一定間隔に広げた後、半導体デバイスをニードル等で突き上げる。突き上げられた半導体デバイスは、真空コレットまたはエアピンセットによる吸着などでピックアップされた後、マウンティングされるか、またはトレイに収納される。
<ダイシングテープの作製>
基材層200を構成する材料として、ポリプロピレン60重量部、一般式(1)で示されるポリスチレンセグメントと一般式(2)で示されるビニルポリイソプレンセグメントとから成るブロック共重合体40重量部を準備した。
作製後23℃で7日間以上が経過した粘着テープ100を、被着体である半導体ウエハに貼着した。貼着後20分が経過した粘着テープ100の半導体ウエハ鏡面に対する粘着力を180°剥離試験により測定した。180°剥離試験は、万能試験機(株式会社エー・アンド・デイ製、品名:テンシロン)を用いて、環境温度:23℃、環境圧力:常圧、引張速度:300mm/minの条件下で行われた。そして、得られた粘着力チャートの平均値を粘着層300の粘着力(cN/25mm)とした。測定した粘着力が、1000cN/25mm以上のものを◎、500cN/25mm以上1000cN/25mm未満のものを○、500cN/25mm未満のものを×で評価した。
粘着テープ100に半導体ウエハを、23℃の条件下で圧着して20分間放置後、10mm×10mmのサイズにダイシングした。ダイシング後、粘着テープ100に紫外線を照射し、真空吸着するコレットを用いてダイシングされた半導体ウエハの表面を吸着し、4mm間隔の4本のニードルを粘着テープ100の下から500μm突上げて、半導体ウエハを粘着テープ100からピックアップした。ダイシングされた半導体ウエハのうち、99%以上ピックアップできたものを◎、90%以上99%未満ピックアップできたものを○、それ以外のものを×で評価した。
下記以外については実施例1と同様にして、粘着テープ100を得た。粘着層300の硬化成分として、重量平均分子量が1800で、官能基数が6官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer PU610)をカルボキシル基含有ポリマー100重量部に対して50重量部を準備した。また、架橋剤であるポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が1400で、官能基数が9官能のウレタンアクリレート(新中村化学工業株式会社製、品名:UA-33H)をカルボキシル基含有ポリマー100重量部に対して30重量部準備した。また、架橋剤であるポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が1400で、官能基数が9官能のウレタンアクリレート(新中村化学工業株式会社製、品名:UA-33H)をカルボキシル基含有ポリマー100重量部に対して70重量部準備した。また、架橋剤であるポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が1400で、官能基数が9官能のウレタンアクリレート(新中村化学工業株式会社製、品名:UA-33H)をカルボキシル基含有ポリマー100重量部に対して20重量部準備した。また、架橋剤であるポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が1400で、官能基数が9官能のウレタンアクリレート(新中村化学工業株式会社製、品名:UA-33H)をカルボキシル基含有ポリマー100重量部に対して20重量部を準備した。また、架橋剤であるポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300のカルボキシル基含有ポリマーの代わりに、実施例1と同様の方法で作成したカルボキシル含有ポリマー(エステル基の個数とカルボキシル基の個数との比98/2)を準備した。粘着層300の硬化成分として、重量平均分子量が1400で、官能基数が9官能のウレタンアクリレート(新中村化学工業株式会社製、品名:UA-33H)をカルボキシル基含有ポリマー100重量部に対して50重量部準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が467で、官能基数が4官能のウレタンアクリレート(日本化薬株式会社製、品名:Kayarad T-1420(T))をカルボキシル基含有ポリマー100重量部に対して50重量部準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が20000で、官能基数が15官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer SC2152)をカルボキシル基含有ポリマー100重量部に対して50重量部準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が11000で、官能基数が3官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer PU320)をカルボキシル基含有ポリマー100重量部に対して50重量部準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300のカルボキシル基含有ポリマーの代わりに、アクリル系ポリマー(綜研化学株式会社製、品名:SKダイン 1491H)を準備した。粘着層300の硬化成分として、重量平均分子量が1400で、官能基数が9官能のウレタンアクリレート(新中村化学工業株式会社製、品名:UA-33H)をカルボキシル基含有ポリマー100重量部に対して50重量部準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例1と同様にして、ダイシングテープを得た。粘着層300のカルボキシル基含有ポリマーの代わりに、シリコン系ポリマー(モメンティブ・パフォーマンス・マテリアルズ社製、品名:TSE3221S)を準備した。粘着層300の硬化成分として、重量平均分子量が1400で、官能基数が9官能のウレタンアクリレート(新中村化学工業株式会社製、品名:UA-33H)をカルボキシル基含有ポリマー100重量部に対して50重量部準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
<ダイシングテープの作製>
下記以外については実施例1と同様にして、ダイシング(粘着)テープ100を得た。
粘着層300の硬化成分として、重量平均分子量が3200g/molで、官能基数が10官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer MU9500)を準備した。
以下の評価以外は、実施例1における被着体への粘着に関する評価と同様である。
測定した粘着力が、500cN/25mm以上のものを○、500cN/25mm未満のものを×で評価した。
ダイシングテープ100を剥離した後の半導体ウエハの表面に粘着層300を構成する粘着剤の一部が残る、いわゆる糊残りが発生しているか否かについて評価を行った。具体的に、ダイシングテープ100を剥離した後の半導体ウエハのダイシングテープ100が貼着されていた面に残る糊残り、ダイシングテープ100が貼着されていた面の逆の面、または側面に対してダイシング時に飛散した糊の付着を目視で観察した。半導体ウエハに糊残りおよび糊の付着が発生していないものを○、半導体ウエハに糊残りまたは糊の付着が発生しているものを×で評価した。
以下の評価以外は、実施例1におけるピックアップ性の評価と同様である。
ダイシングされた半導体ウエハのうちの95%以上がピックアップできたものを○、それ以外のものを×で評価した。
下記以外については実施例A1と同様にして、ダイシングテープ100を得た。粘着層300の硬化成分として、重量平均分子量が14000g/molで、官能基数が15官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer MU9510)を準備した。また、架橋剤であるポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して7重量部準備した。
下記以外については実施例A1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が467g/molで、官能基数が4官能のウレタンアクリレート(日本化薬株式会社製、品名:Kayarad T-1420(T))を準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例A1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が20787g/molで、官能基数が15官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer SC2152)を準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して7重量部準備した。
下記以外については実施例A1と同様にして、ダイシングテープを得た。粘着層300の硬化成分として、重量平均分子量が11000g/molで、官能基数が3官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer PU320)を準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例A1と同様にして、ダイシングテープを得た。粘着層300のカルボキシル基含有ポリマーとして、アクリル系ポリマー(綜研化学株式会社製、品名:SKダイン 1491H)を準備した。粘着層300の硬化成分として、重量平均分子量が8000g/molで、官能基数が10官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer MU9500)を準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
下記以外については実施例A1と同様にして、ダイシングテープを得た。粘着層300のカルボキシル基含有ポリマーとして、シリコン系ポリマー(モメンティブ・パフォーマンス・マテリアルズ社製、品名:TSE3221S)を準備した。粘着層300の硬化成分として、重量平均分子量が8000g/molで、官能基数が10官能のウレタンアクリレート(Miwon Specialty Chemical社製、品名:Miramer MU9500)を準備した。粘着層300の架橋剤として、ポリイソシアネート系架橋剤を、カルボキシル基含有ポリマー100重量部に対して5重量部準備した。
200 基材層(基層)
300 粘着層
Claims (9)
- 基材層と、前記基材層の少なくとも一方の面に形成される粘着層とを備え、
前記粘着層は、カルボキシル基含有ポリマーと、放射線重合化合物と、架橋剤を含み、
前記放射線重合化合物は、重量平均分子量が500以上、20000以下であり、かつ官能基数が5官能基以上であって、
前記架橋剤の含有量は、カルボキシル基含有ポリマー100重量部に対して、3重量部以上、14重量部以下であることを特徴とする半導体ウエハ等加工用粘着テープ。 - 前記放射線重合化合物の重量平均分子量が1000以上、20000以下であり、かつ官能基数が10官能基以上である請求項1に記載の半導体ウエハ等加工用粘着テープ。
- 前記カルボキシル基含有ポリマーは、エステル基をさらに含有し、
前記カルボキシル基含有ポリマーの前記エステル基の個数と前記カルボキシル基の個数との比(エステル基/カルボキシル基)は、80/20以上95/5以下である請求項1に記載の半導体ウエハ等加工用粘着テープ。 - 前記放射線重合化合物の重量平均分子量が500以上、3000以下であり、かつ官能基数が15官能基以下である請求項1に記載の半導体ウエハ等加工用粘着テープ。
- 前記官能基は、ビニル基である請求項1に記載の半導体ウエハ等加工用粘着テープ。
- 前記放射線重合化合物の含有量は、前記カルボキシル基含有ポリマー100重量部に対して、30重量部以上、70重量部以下である請求項1に記載の半導体ウエハ等加工用粘着テープ。
- 前記放射線重合化合物は、ウレタンアクリレートである請求項1に記載の半導体ウエハ等加工用粘着テープ。
- 前記架橋剤は、イソシアネート基を含有する請求項1に記載の半導体ウエハ等加工用粘着テープ。
- 前記カルボキシル基含有ポリマーは、アクリル酸エステルとアクリル酸との共重合体である請求項1に記載の半導体ウエハ等加工用粘着テープ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG2013069216A SG193464A1 (en) | 2011-03-30 | 2012-03-27 | Adhesive tape for processing semiconductor wafer etc. |
KR1020137022288A KR101882539B1 (ko) | 2011-03-30 | 2012-03-27 | 반도체 웨이퍼 등 가공용 점착 테이프 |
US14/006,186 US20140011025A1 (en) | 2011-03-30 | 2012-03-27 | Adhesive tape for processing semiconductor wafer etc |
CN201280015419.3A CN103443229B (zh) | 2011-03-30 | 2012-03-27 | 半导体晶片等加工用粘附带 |
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JP2011-075003 | 2011-03-30 | ||
JP2011075003A JP5761596B2 (ja) | 2011-03-30 | 2011-03-30 | 半導体ウエハ加工用粘着テープ |
JP2012-003125 | 2012-01-11 | ||
JP2012003125A JP5990910B2 (ja) | 2012-01-11 | 2012-01-11 | 半導体ウエハ等加工用粘着テープ |
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WO2012133418A1 true WO2012133418A1 (ja) | 2012-10-04 |
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PCT/JP2012/057952 WO2012133418A1 (ja) | 2011-03-30 | 2012-03-27 | 半導体ウエハ等加工用粘着テープ |
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US (1) | US20140011025A1 (ja) |
KR (1) | KR101882539B1 (ja) |
CN (1) | CN103443229B (ja) |
MY (1) | MY162761A (ja) |
SG (1) | SG193464A1 (ja) |
TW (1) | TWI671799B (ja) |
WO (1) | WO2012133418A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014127609A (ja) * | 2012-12-27 | 2014-07-07 | Sumitomo Bakelite Co Ltd | ダイシングフィルム |
JP2016536663A (ja) * | 2013-09-29 | 2016-11-24 | ティーピーケイ タッチ ソリューションズ(シアメン)インコーポレーテッド | タッチパネルの製造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012094834A (ja) * | 2010-09-13 | 2012-05-17 | Sumitomo Bakelite Co Ltd | ダイシングフィルム |
SG193560A1 (en) * | 2011-03-24 | 2013-11-29 | Sumitomo Bakelite Co | Adhesive tape for processing semiconductor wafer and the like |
JP5603453B1 (ja) * | 2013-04-26 | 2014-10-08 | 古河電気工業株式会社 | 半導体ウェハ保護用粘着テープ |
CN106488963B (zh) | 2014-07-14 | 2020-02-28 | 电化株式会社 | 粘合片、电子部件的制造方法 |
TWI678409B (zh) * | 2015-01-09 | 2019-12-01 | 日商電化股份有限公司 | 切割膠帶 |
WO2016151911A1 (ja) * | 2015-03-23 | 2016-09-29 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
WO2017018270A1 (ja) * | 2015-07-24 | 2017-02-02 | デンカ株式会社 | 半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法 |
CN111115563A (zh) * | 2019-12-23 | 2020-05-08 | 湖南大学 | 一种全干法功能材料剥离的方法 |
US20210212406A1 (en) * | 2020-01-13 | 2021-07-15 | Msa Technology, Llc | Safety helmet |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007291147A (ja) * | 2005-04-19 | 2007-11-08 | Denki Kagaku Kogyo Kk | 粘着剤、それを用いた粘着シート、粘着シートを用いた電子部品製造方法。 |
JP2008013692A (ja) * | 2006-07-07 | 2008-01-24 | Denki Kagaku Kogyo Kk | 電子部品固定用粘着シート及びそれを用いた電子部品の製造方法。 |
JP2009246302A (ja) * | 2008-03-31 | 2009-10-22 | Lintec Corp | ダイソートテープ |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3883405B2 (ja) | 2001-09-28 | 2007-02-21 | 電気化学工業株式会社 | 電子部材用粘着テープ |
AU2003277605A1 (en) * | 2002-11-08 | 2004-06-07 | Mitsubishi Chemical Corporation | Radiation curing resin composition and cured product thereof |
EP1591504B1 (en) * | 2003-02-05 | 2012-05-23 | The Furukawa Electric Co., Ltd. | Pressure-sensitive adhesive tape for pasting wafer thereto |
JP4565609B2 (ja) | 2003-10-31 | 2010-10-20 | ニットウ ヨーロッパ エヌ. ブイ. | 粘着テープ |
JP2006165004A (ja) * | 2004-12-02 | 2006-06-22 | Sumitomo Bakelite Co Ltd | 半導体ウエハ加工用粘着テープ |
TWI333672B (en) * | 2005-03-29 | 2010-11-21 | Furukawa Electric Co Ltd | Wafer-dicing adhesive tape and method of producing chips using the same |
JP2009164556A (ja) * | 2007-12-11 | 2009-07-23 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
WO2010018767A1 (ja) * | 2008-08-11 | 2010-02-18 | 電気化学工業株式会社 | 半導体加工方法及び粘着テープ |
-
2012
- 2012-03-23 TW TW101110076A patent/TWI671799B/zh active
- 2012-03-27 CN CN201280015419.3A patent/CN103443229B/zh active Active
- 2012-03-27 WO PCT/JP2012/057952 patent/WO2012133418A1/ja active Application Filing
- 2012-03-27 KR KR1020137022288A patent/KR101882539B1/ko active IP Right Grant
- 2012-03-27 MY MYPI2013003425A patent/MY162761A/en unknown
- 2012-03-27 US US14/006,186 patent/US20140011025A1/en not_active Abandoned
- 2012-03-27 SG SG2013069216A patent/SG193464A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007291147A (ja) * | 2005-04-19 | 2007-11-08 | Denki Kagaku Kogyo Kk | 粘着剤、それを用いた粘着シート、粘着シートを用いた電子部品製造方法。 |
JP2008013692A (ja) * | 2006-07-07 | 2008-01-24 | Denki Kagaku Kogyo Kk | 電子部品固定用粘着シート及びそれを用いた電子部品の製造方法。 |
JP2009246302A (ja) * | 2008-03-31 | 2009-10-22 | Lintec Corp | ダイソートテープ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014127609A (ja) * | 2012-12-27 | 2014-07-07 | Sumitomo Bakelite Co Ltd | ダイシングフィルム |
JP2016536663A (ja) * | 2013-09-29 | 2016-11-24 | ティーピーケイ タッチ ソリューションズ(シアメン)インコーポレーテッド | タッチパネルの製造方法 |
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US20140011025A1 (en) | 2014-01-09 |
KR20140019330A (ko) | 2014-02-14 |
CN103443229B (zh) | 2015-09-02 |
TW201246285A (en) | 2012-11-16 |
KR101882539B1 (ko) | 2018-07-26 |
SG193464A1 (en) | 2013-10-30 |
MY162761A (en) | 2017-07-14 |
CN103443229A (zh) | 2013-12-11 |
TWI671799B (zh) | 2019-09-11 |
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