WO2022037195A1 - 显示面板 - Google Patents

显示面板 Download PDF

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Publication number
WO2022037195A1
WO2022037195A1 PCT/CN2021/098919 CN2021098919W WO2022037195A1 WO 2022037195 A1 WO2022037195 A1 WO 2022037195A1 CN 2021098919 W CN2021098919 W CN 2021098919W WO 2022037195 A1 WO2022037195 A1 WO 2022037195A1
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WO
WIPO (PCT)
Prior art keywords
encapsulation
area
base substrate
barrier dam
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/098919
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
李春延
许晨
王景泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to BR112021016853A priority Critical patent/BR112021016853A2/pt
Priority to KR1020217027528A priority patent/KR102893566B1/ko
Priority to AU2021215098A priority patent/AU2021215098B2/en
Priority to EP21749523.3A priority patent/EP4006987B1/en
Priority to US17/436,078 priority patent/US11832501B2/en
Priority to JP2021547538A priority patent/JP7736564B2/ja
Publication of WO2022037195A1 publication Critical patent/WO2022037195A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • Embodiments of the present disclosure relate to a display panel.
  • AMOLED Active-matrix organic light emitting diode, active matrix organic light emitting diode
  • AMOLED Active-matrix organic light emitting diode, active matrix organic light emitting diode
  • At least one embodiment of the present disclosure provides a display panel, the display panel has a display area and a peripheral area surrounding the display area, the peripheral area includes a first peripheral area, a bending area and a second peripheral area, the first peripheral area A peripheral area is located on a side of the second peripheral area close to the display area, the bending area is disposed between the first peripheral area and the second peripheral area;
  • the display panel includes a substrate a substrate, a driving circuit layer, an organic structure and an encapsulation layer, the driving circuit layer is disposed on the base substrate;
  • the organic structure is on the side of the driving circuit layer away from the base substrate, including a space between the peripheral region
  • a first organic structure and a second organic structure are provided, wherein the first organic structure is located on a side of the second organic structure close to the display area, and the first organic structure is located in the first peripheral area , the second organic structure includes a continuous first part located in the first peripheral region and a second part located in the bending region; the encapsulation layer is on
  • the direction from the display area to the bending area is the first direction
  • the second encapsulation portion includes the A plurality of encapsulation regions, the average thickness of the plurality of encapsulation regions in the first direction gradually decreases.
  • the display panel provided by at least one embodiment of the present disclosure further includes a touch layer
  • the touch layer includes touch electrodes and touch wires electrically connected to the touch electrodes, and the touch wires are connected from all the touch wires.
  • the display area extends to the second peripheral area, and at least part of the touch traces are arranged on a side of the packaging layer away from the base substrate, and are in a direction perpendicular to the base substrate with the first The two organic structures overlap;
  • the touch trace includes a first touch trace part and a second touch trace part, and the first touch trace part is located on the first package part away from the substrate
  • the second touch trace portion is located on the side of the second package portion away from the base substrate, and the surface of the first touch trace portion away from the base substrate reaches the The average distance of the base substrate is greater than the average distance from the surface of the second touch trace portion away from the base substrate to the base substrate.
  • the first peripheral area includes a first sub-periphery area located on a side close to the bending area and a second sub-periphery area outside the first sub-periphery area area; the average thickness of the encapsulation layers located in the first sub-peripheral area is smaller than the average thickness of the encapsulation layers located in the second sub-peripheral area.
  • the first sub-peripheral area includes a main area and two corner areas, the two corner areas are located on two sides of the main area, respectively
  • the average thickness of the encapsulation layers in the corner area is smaller than the average thickness of the encapsulation layers in the second sub-peripheral area, and is greater than the average thickness of the encapsulation layers in the main area.
  • the encapsulation layer includes a first inorganic layer, a first organic layer, a second inorganic layer, and a third inorganic layer that are stacked in sequence; the first organic layer is the first inorganic layer and the second inorganic layer are covered, and the edge of the first organic layer is located on the side of the first organic structure close to the display area, the first encapsulation part and the Each of the second encapsulation parts includes the stacked first inorganic layer, the second inorganic layer, and the third inorganic layer.
  • both the first encapsulation part and the second encapsulation part have flat surfaces, and in a direction perpendicular to the base substrate, the first encapsulation part has a flat surface.
  • the thickness of the second encapsulation part is the first thickness
  • the thickness of the second encapsulation part is the second thickness
  • the first thickness is greater than the second thickness
  • the first encapsulation part and the second encapsulation part are in a stepped shape as a whole .
  • the first encapsulation part has a flat surface
  • the surface of the second encapsulation part has at least one first groove, the at least one first groove along the Extending in a direction parallel to the bending axis of the bending region, in a direction perpendicular to the base substrate, the thickness of the first encapsulation portion is the first thickness, and the average thickness of the second encapsulation portion is A second thickness, the first thickness is greater than the second thickness.
  • the direction from the display area to the bending area is the first direction
  • the second encapsulation portion includes the A plurality of packaging areas
  • the at least one first groove includes a plurality of first grooves respectively provided in the plurality of packaging areas
  • the plurality of grooves are arranged so that the plurality of packaging areas are located in the plurality of packaging areas.
  • the average thickness in the first direction gradually becomes smaller.
  • At least a part of the surface of the second packaging portion away from the base substrate is a curved surface.
  • the curved surface is a concave curved surface.
  • At least a part of the surface of the second encapsulation portion away from the base substrate has a changing slope in the direction away from the display area.
  • a slope of a portion of the at least part of the second encapsulation portion close to the display area is greater than that of a portion far from the display area.
  • the difference between the maximum value and the minimum value of the slope of the surface of the at least part of the second encapsulation portion that is far from the base substrate is greater than 0 and less than 0.2 .
  • the average slope of the sidewall of the second organic structure on the side close to the first organic structure is the slope of the second package portion away from the base substrate. more than twice the average slope of the surface.
  • the second touch trace portion of the touch trace is in direct contact with the at least one first groove.
  • the first organic structure includes a first barrier dam and a second barrier dam arranged at intervals, and the first barrier dam is located close to the second barrier dam One side of the display area; wherein, taking the direction from the display area to the bending area as the first direction, in the first direction, the first barrier dam has a first width W1, so The second barrier dam has a second width W2, and the shortest distance between the second organic structure and the second barrier dam is L2, where L2>0.5*(W1+W2).
  • the first barrier dam and the second barrier dam respectively include opposite first sidewalls and second sidewalls
  • the second organic structure is close to all the
  • One side of the first organic structure includes a third sidewall
  • the first encapsulation portion covers at least the third sidewall
  • the first sidewall, the second sidewall and the third sidewall are the same as the
  • the plane on which the base substrate is located forms a plurality of gradient angles
  • the plurality of gradient angles are all acute angles
  • the absolute value of the difference between any two gradient angles in the plurality of gradient angles is less than 20°.
  • the third sidewall is stepped as a whole, including a first step and a second step, and the second step is located at a distance from the first step away from the lining
  • the gradient angle formed by the first step and the plane where the base substrate is located is smaller than the gradient angle formed by the second step and the plane where the base substrate is located.
  • the second encapsulation portion ends at a side of the bending region close to the display region, and in a direction perpendicular to the base substrate, the The average thickness of the first encapsulation part is greater than twice the average thickness of the second encapsulation part.
  • the distance between the orthographic projection of the second encapsulation portion on the base substrate and the orthographic projection of the second barrier dam on the base substrate The shortest distance is the first distance, and the shortest distance between the orthographic projection of the first encapsulation portion on the base substrate and the orthographic projection of the second barrier dam on the base substrate is the second distance,
  • the first distance is greater than 1.5 times the second distance.
  • the first organic structure includes a first barrier dam and a second barrier dam arranged at intervals, and the first barrier dam is located close to the second barrier dam One side of the display area; the surface of at least one of the first barrier dam and the second barrier dam has at least one second groove, and the at least one second groove is along a bend parallel to the bending area The direction of the axis extends.
  • the at least one second groove includes n-1 second grooves, and at least one of the first barrier dam and the second barrier dam is covered by the n-1 second grooves are divided into n parts, n is a positive integer greater than or equal to 2, and the direction from the display area to the bending area is the first direction, and in the first direction,
  • the widths of the n parts are w1, w2, . at least one of , and
  • the n parts include an i-th part and a j-th part, the width of the i-th part is wi, the width of the j-th part is wj, and the i-th part has a width of wj.
  • the thickness of at least one of the first barrier dam and the second barrier dam is H, and the depth of the second groove is h, wherein,
  • the surface of the second barrier dam has the at least one second groove
  • the second barrier dam includes opposite first sidewalls and second sidewalls , the first sidewall is closer to the display area than the second sidewall, the slope angle formed by the first sidewall and the plane where the base substrate is located is b1
  • the second The groove includes an opposite third sidewall and a fourth sidewall, the third sidewall is closer to the display area than the fourth sidewall, and the third sidewall is located with the base substrate
  • the slope angle formed by the plane of is c1
  • the slope angle formed by the fourth side wall and the plane where the base substrate is located is c2
  • c represents at least one of c1 and c2
  • the plane shape of the at least one second groove is a rectangle, a trapezoid, or a hexagon.
  • the at least one second groove includes a plurality of second grooves, and the plurality of second grooves are along a bending axis parallel to the bending region The direction extends in the direction from the display area to the bending area as the first direction, in the first direction, the plurality of second grooves are arranged in sequence, and the extension length gradually decreases.
  • the display panel provided by at least one embodiment of the present disclosure further includes a plurality of sub-pixels arranged in an array, each of the plurality of sub-pixels includes a pixel driving circuit and a light-emitting device, the pixel driving circuit includes a thin film transistor, and the The thin film transistor includes a gate and a source and drain, the light emitting device includes a first electrode, a second electrode and a light emitting layer between the first electrode and the second electrode, the first electrode and the source and drain
  • the display panel further includes a first power supply line located in the peripheral area, the first power supply line includes a first part and a second part connected in parallel, and the first part is the same as the source and drain. layer arrangement, the second part is arranged in the same layer as the first electrode.
  • the display panel provided by at least one embodiment of the present disclosure further includes a plurality of sub-pixels arranged in an array, each of the plurality of sub-pixels includes a pixel driving circuit and a light-emitting device, the pixel driving circuit includes a thin film transistor, and the The thin film transistor includes a gate and a source and drain, the light emitting device includes a first electrode, a second electrode and a light emitting layer between the first electrode and the second electrode, the first electrode and the source and drain
  • the display panel further includes a first power supply line located in the peripheral area, the first power supply line includes a first part, a second part and a third part connected in parallel, the first part and the The source and drain are arranged in the same layer, the second part is arranged in the same layer as the first electrode, the first electrode is electrically connected to the source and drain through a connecting electrode, and the third part is the same as the connecting electrode Layer settings.
  • the second portion of the first power supply line is connected to the first barrier dam and the second barrier dam. At least one portion of the first power trace overlaps, and a portion of the second portion of the first power trace that overlaps with at least one of the first barrier dam and the second barrier dam has at least one opening.
  • the extending direction of the at least one opening is perpendicular to the extending direction of the at least one second groove.
  • the second portion of the first power supply trace in a direction perpendicular to the base substrate, further overlaps with the at least one second groove portion,
  • the depth of the at least one second groove is equal to the thickness of at least one of the first barrier dam and the second barrier dam, and the second portion of the first power trace overlaps the at least one second groove.
  • the portion does not have an opening, or the depth of the at least one second groove is less than the thickness of at least one of the first barrier dam and the second barrier dam, the at least one opening including the first partial opening and the second A part of the opening, the part of the second part of the first power trace that overlaps with the at least one second groove has the first part of the opening, and the second part of the opening is a part of the at least one opening.
  • the size or arrangement density of the first partial openings is smaller than the size or arrangement density of the second partial openings.
  • At least one of the first blocking dam and the second blocking dam includes an edge portion located at an end of the at least one second groove, and the edge portion has a gradual width
  • the edge portion includes a first portion and a second portion
  • the first portion of the edge portion is located on a side of the second portion of the edge portion away from the at least one second groove
  • the edge portion The average width of the first portion of the edge portion is smaller than the average width of the second portion of the edge portion
  • the extension length of the openings overlapping the first portion of the edge portion is greater than that of the openings overlapping the second portion of the edge portion.
  • the number of openings overlapping the first portion of the edge portion is less than the number of openings overlapping the second portion of the edge portion.
  • the display panel provided by at least one embodiment of the present disclosure further includes a fan-shaped wiring area located in the first peripheral area, and the fan-shaped wiring area includes a plurality of wirings in a direction perpendicular to the base substrate , the edge portion does not overlap with the fan-shaped routing area.
  • the display panel provided by at least one embodiment of the present disclosure further includes a touch layer on a side of the encapsulation layer away from the base substrate, and the touch layer includes a touch layer disposed in sequence on the encapsulation layer away from the base substrate.
  • the touch layer further includes touch traces electrically connected to the touch driving electrodes or the driving sensing electrodes, and the touch traces include The first wiring part of the first touch metal layer and the second wiring part located in the second touch metal layer, the touch insulating layer has at least one via hole, the first wiring The portion and the second trace portion are electrically connected through the at least one via.
  • the first organic structure includes a first barrier dam and a second barrier dam arranged at intervals, and the first barrier dam is located close to the second barrier dam
  • the extension direction of the at least one via hole is perpendicular to the extension direction of the first barrier dam and the second barrier dam, and in the direction perpendicular to the base substrate, the At least one via hole includes a first via hole overlapping with the first barrier dam and a second via hole overlapping with the second barrier dam, and the orthographic projection of the first via hole on the base substrate is located at
  • the first blocking dam is inside the orthographic projection of the base substrate, and does not overlap with the edge of the orthographic projection of the first blocking dam on the base substrate;
  • the orthographic projection on the base substrate is located inside the orthographic projection of the second barrier dam on the base substrate, and does not overlap with the edge of the orthographic projection of the second barrier dam on the base substrate .
  • the overlapping area of the touch traces and the first barrier dam is S, and the first pass through The overlapping area of the hole and the first blocking dam is S1, where 0.2 ⁇ S1/S ⁇ 0.4; the overlapping area of the touch trace and the second blocking dam is SS, and the second via and the The overlapping area of the second barrier dam is SS1, where 0.2 ⁇ SS1/SS ⁇ 0.4.
  • the slope angle formed by the side wall of the first barrier dam close to the display area and the plane where the base substrate is located is a1
  • the first barrier dam The width is W1
  • the height is H1
  • the extension length of the first via is D1
  • the slope angle formed by the side wall of the second barrier dam close to the display area and the plane where the base substrate is located is b1, the width of the second barrier dam is W2, the height is H2, and the second barrier dam is W2.
  • the extension length of the hole is D2, then:
  • the display panel provided by at least one embodiment of the present disclosure further includes a fan-shaped wiring area located in the first peripheral area, the fan-shaped wiring area includes a plurality of wirings, and the display panel further includes a shielding structure.
  • the shielding structure is located between a plurality of traces in the fan-shaped trace area and the touch traces, and between the touch traces and the shielding structure The distance is greater than the distance between the plurality of traces in the fan-shaped trace area and the shielding structure.
  • the shielding structure overlaps and directly contacts the first barrier dam and the second barrier dam.
  • the display panel provided by at least one embodiment of the present disclosure further includes a plurality of sub-pixels arranged in an array, each of the plurality of sub-pixels includes a pixel driving circuit and a light-emitting device, the pixel driving circuit includes a thin film transistor, and the The thin film transistor includes a gate and a source and drain, the light emitting device includes a first electrode, a second electrode and a light emitting layer between the first electrode and the second electrode, the first electrode and the source and drain
  • the shielding structure includes a first power supply wiring, the first power supply wiring and the source and drain are arranged in the same layer, or the first power supply wiring includes a first part and a second part connected in parallel, The first part is provided in the same layer as the source and drain electrodes, the second part is provided in the same layer as the first electrode, or the first power supply wiring includes a first part, a second part and a third part connected in parallel , the first part is arranged in the same layer as the source and drain, the second part is
  • the second portion of the first power supply line is connected to the first barrier dam and the second barrier dam.
  • At least one portion of the first power trace overlaps, and the portion of the second portion of the first power trace that overlaps with at least one of the first barrier dam and the second barrier dam has a plurality of openings; the at least one via hole A plurality of via holes are included, and the orthographic projections of the plurality of via holes on the base substrate do not overlap with the orthographic projections of the plurality of openings on the base substrate, and are alternately arranged.
  • the first organic structure includes a first barrier dam and a second barrier dam arranged at intervals, and the first barrier dam is located close to the second barrier dam one side of the display area; the first barrier dam and the second barrier dam include opposite first sidewalls and second sidewalls, respectively, the first sidewalls are compared to the second sidewalls Closer to the display area, the slope angle formed by the first sidewall of the first barrier dam and the plane where the base substrate is located is a1, and the second sidewall of the first barrier dam and the base substrate The slope angle formed by the plane on which the The slope angle formed by the second side wall and the plane where the base substrate is located is b2, and b1 is greater than b2; and
  • the second blocking dam overlaps with the second part of the first power supply wiring, and the first power supply wiring
  • a portion of the second portion of the line that overlaps the second barrier dam includes a flat portion and a ramp portion, a surface of the flat portion remote from the base substrate formed with the first sidewall of the second barrier dam The slope angle is b1.
  • At least one embodiment of the present disclosure provides a display panel, the display panel has a display area and a peripheral area surrounding the display area, the peripheral area includes a first peripheral area, a bending area and a second peripheral area, the first peripheral area A peripheral area is located on a side of the second peripheral area close to the display area, the bending area is disposed between the first peripheral area and the second peripheral area;
  • the display panel includes a substrate a substrate, a driving circuit layer and an encapsulation layer, the driving circuit layer is disposed on the base substrate;
  • the encapsulation layer is on the side of the driving circuit layer away from the base substrate, wherein the encapsulation layer covers the display area and at least part of the first peripheral area, the part of the encapsulation layer located in the first peripheral area includes a first encapsulation part and a second encapsulation part, the first encapsulation part is located close to the second encapsulation part One side of the display area; wherein, in a direction perpendicular to the base substrate,
  • FIG. 1 is a schematic plan view of a display panel provided by at least one embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional view of the display panel in FIG. 1 along line A-A;
  • FIG. 3 is another cross-sectional schematic diagram of the display panel in FIG. 1 along the line A-A;
  • FIG. 4 is another cross-sectional schematic diagram of the display panel in FIG. 1 along the line A-A;
  • FIG. 5 is another schematic cross-sectional view of the display panel in FIG. 1 along the line A-A;
  • FIG. 6 is another schematic cross-sectional view of the display panel in FIG. 1 along the line A-A;
  • FIG. 7 is another schematic cross-sectional view of the display panel in FIG. 1 along the line A-A;
  • FIG. 8 is another schematic cross-sectional view of the display panel in FIG. 1 along the line A-A;
  • FIG. 9 is another schematic cross-sectional view of the display panel in FIG. 1 along the line A-A;
  • FIG. 10 is another schematic cross-sectional view of the display panel in FIG. 1 along the line A-A;
  • FIG. 11 is another schematic cross-sectional view of the display panel in FIG. 1 along the line A-A;
  • FIG. 12 is a schematic cross-sectional view of a first barrier dam or a second barrier dam in a display panel according to at least one embodiment of the present disclosure
  • FIG. 13 is another schematic cross-sectional view of a first barrier dam or a second barrier dam in a display panel provided by at least one embodiment of the present disclosure
  • FIG. 14 is another schematic cross-sectional view of a first barrier dam or a second barrier dam in a display panel according to at least one embodiment of the present disclosure
  • 15 is a schematic diagram of the shape of a second groove in a first barrier dam or a second barrier dam in a display panel according to at least one embodiment of the present disclosure
  • 16 is a schematic diagram of the arrangement of the second grooves in the first barrier dam or the second barrier dam in the display panel according to at least one embodiment of the present disclosure
  • 17 is a partial cross-sectional schematic diagram of a display area of a display panel according to at least one embodiment of the present disclosure.
  • FIG. 18 is another partial cross-sectional schematic diagram of a display area of a display panel according to at least one embodiment of the present disclosure.
  • 19 is a schematic plan view of a second portion of a first power trace in a display panel that overlaps with a second barrier dam according to at least one embodiment of the present disclosure
  • 20 is another schematic plan view of the second portion of the first power trace in the display panel overlapping the second barrier dam according to at least one embodiment of the present disclosure
  • 21 is another schematic plan view of the second portion of the first power trace in the display panel overlapping the second barrier dam according to at least one embodiment of the present disclosure
  • 22 is a schematic plan view of a display panel provided by at least one embodiment of the present disclosure.
  • FIG. 23 is a schematic cross-sectional view of a second barrier dam in a display panel provided by at least one embodiment of the present disclosure
  • 24 is another schematic cross-sectional view of a second barrier dam in a display panel provided by at least one embodiment of the present disclosure
  • 25 is a schematic cross-sectional view of a touch layer in a display panel provided by at least one embodiment of the present disclosure
  • 26 is a schematic plan view of a touch trace in a display panel overlapping a first barrier dam and a second barrier dam according to at least one embodiment of the present disclosure
  • FIG. 27 is another schematic plan view of a touch trace in a display panel overlapping a first barrier dam and a second barrier dam according to at least one embodiment of the present disclosure
  • FIG. 28 is a schematic cross-sectional view of a first power supply trace in a display panel provided by at least one embodiment of the present disclosure
  • 29 is another schematic cross-sectional view of a first power supply trace in a display panel provided by at least one embodiment of the present disclosure.
  • FIG. 30 is a schematic cross-sectional view along the line E-E in the display panel of FIG. 1;
  • FIG. 31 is another schematic cross-sectional view of the display panel in FIG. 1 along the line E-E.
  • the FMLOC Flexible Metal Layer On Cell
  • the encapsulation layer is used to encapsulate a pixel array including organic materials, and the touch control structure may be disposed on the encapsulation layer. Since the bendable or foldable display panel has a bending area, when the bending area is subjected to the bending process, bending stress will be generated in the display panel, and the bending stress will easily lead to peeling of the packaging layer near the bending area. phenomenon, which in turn adversely affects the touch structure on the packaging layer. In addition, the bending region usually has a thicker organic material layer.
  • the touch traces of the touch structure are formed above the organic material layer, since the slope angle of the sidewall of the organic material layer is usually relatively large, the touch traces of the touch control structure are formed on the top of the organic material layer.
  • the touch metal used for forming the touch traces located at the sidewall position is not easily etched accurately, thus causing the touch metal residue (remains) and causing the short circuit between adjacent touch traces , resulting in a decrease in the accuracy of the touch function or failure of the touch function.
  • At least one embodiment of the present disclosure provides a display panel, the display panel has a display area and a peripheral area surrounding the display area, the peripheral area includes a first peripheral area, a bending area and a second peripheral area, the first peripheral area is located in the second peripheral area On the side of the peripheral area close to the display area, the bending area is arranged between the first peripheral area and the second peripheral area;
  • the display panel includes a substrate substrate, a driving circuit layer, an organic structure and an encapsulation layer, and the driving circuit layer is arranged on the backing On the bottom substrate;
  • the organic structure is on the side of the driving circuit layer away from the base substrate, including a first organic structure and a second organic structure spaced in the peripheral area, and the first organic structure is located on the second organic structure close to the display area.
  • the first organic structure is located in the first peripheral area
  • the second organic structure includes a continuous first part located in the first peripheral area and a second part located in the bending area; the encapsulation layer is located on a part of the organic structure away from the base substrate.
  • the encapsulation layer covers the display area and at least part of the first peripheral area, the encapsulation layer partially overlaps with the second organic structure in a direction perpendicular to the base substrate, and the part of the encapsulation layer overlapping with the second organic structure includes the first encapsulation portion and a second encapsulation part, the first encapsulation part is located on the side of the second encapsulation part close to the display area; in a direction perpendicular to the base substrate, the average thickness of the first encapsulation part is greater than that of the second encapsulation part.
  • the encapsulation layer of the display panel has a better encapsulation effect, and is not easily peeled off when the display panel is bent; and, when the touch traces are formed on the encapsulation layer, the touch traces It can be formed by precise etching, so as to avoid problems such as short circuit between adjacent touch traces among the formed multiple touch traces.
  • the display panel provided by the present disclosure will be exemplarily described below through several specific embodiments.
  • FIG. 1 shows a schematic plan view of the display substrate
  • FIG. 2 shows a partial cross-sectional schematic view of the display substrate.
  • the cross-sectional schematic diagram is taken along line AA in FIG. 1 . can be cut.
  • the display panel has a display area AA and a peripheral area NA surrounding the display area AA.
  • the peripheral area NA includes a first peripheral area NA1, a bending area B and a second peripheral area NA2, the first peripheral area NA1 is located on the side of the second peripheral area NA2 close to the display area AA, and the bending area B is arranged on the first peripheral area between the area NA1 and the second peripheral area NA2.
  • the bending area B can be bent along the bending axis BX, so that the second peripheral area NA2 can be bent to the non-display side of the display panel, thereby reducing the area of the non-display area on the display side of the display panel, thereby reducing the area of the non-display area on the display side of the display panel.
  • structures such as a driving chip (IC) and a flexible circuit board (FPC) for controlling the display of the display area AA may be arranged in the second peripheral area NA2 .
  • the display panel includes a base substrate 101 , a driving circuit layer 102 , an organic structure and an encapsulation layer 300 .
  • the driving circuit layer 102 is provided on the base substrate 101 .
  • the organic structure is on a side of the driving circuit layer 102 away from the base substrate 101 , and the organic structure includes a first organic structure 201 and a second organic structure 202 that are spaced apart in the peripheral area NA.
  • the first organic structure 201 is located on a side of the second organic structure 202 close to the display area AA, the first organic structure 201 is located in the first peripheral area NA1, and the second organic structure 202 includes a first portion 202A located in the first peripheral area NA1 and a first portion 202A located in the first peripheral area NA1.
  • the second portion 202B of the bending region B, the first portion 202A and the second portion 202B are continuous; or, in some embodiments, the second organic structure 202 includes the first portion 202A located in the first peripheral region NA1, located at the bending
  • the second portion 202B of the folded area B and the third portion 202C located in the second peripheral area NA2, the first portion 202A, the second portion 202B and the third portion 202C are continuous.
  • the encapsulation layer is disposed on a side of the organic structure away from the base substrate 101 .
  • the encapsulation layer covers the display area AA and at least part of the first peripheral area NA1 , and the encapsulation layer partially overlaps the second organic structure 202 in a direction perpendicular to the base substrate 101 .
  • the portion of the encapsulation layer overlapping the second organic structure 202 includes a first encapsulation part 301 and a second encapsulation part 302 , and the first encapsulation part 301 is located on a side of the second encapsulation part 302 close to the display area AA.
  • the average thickness of the first encapsulation part 301 is greater than the average thickness of the second encapsulation part 302 .
  • the thickness of a structure represents the dimension of the structure in a direction perpendicular to the base substrate 101 .
  • the surface of the first encapsulation part 301 away from the base substrate 101 is defined as the top surface s1
  • the surface of the first encapsulation part 301 close to the base substrate 101 is defined as the top surface s1 is the bottom surface s2
  • neither the top surface s1 nor the bottom surface s2 includes the side wall s3 between the top surface s1 and the bottom surface s2.
  • the average thickness of the first packaging part 301 is the distance from the top surface to the bottom surface; when the top surface of the first packaging part 301 is an uneven surface, but the bottom surface is a flat surface , the average thickness of the first encapsulation portion 301 is the average value of the distances from the top surface to the bottom surface of each position.
  • the first encapsulation part is divided into a plurality of regions with substantially the same size, the distance between the top surface and the bottom surface of a central position in each region is taken as the thickness of the region, and the average value of the thicknesses of the plurality of regions is taken as the thickness of the region. The average thickness of the first encapsulation portion.
  • the average thickness of the second encapsulation portion 302 is similar to the above, and other average thicknesses appearing herein are all similar to the above.
  • the driving circuit layer 102 may include one or more insulating layers and one or more conductive layers, the one or more conductive layers are used to form structures such as circuit elements, traces, etc., two conductive layers separated by the insulating layer The layers can be electrically connected, for example, by vias in the insulating layer. For clarity of illustration, in FIG. 2 , the driver circuit layer 102 is only shown as one layer in its entirety.
  • first encapsulation part 301 and the second encapsulation part 302 may be continuously arranged structures, and at least part of the bottom surface of the first encapsulation part 301 and the bottom surface of the second encapsulation part 302 are located on the same plane.
  • the second encapsulation part 302 For at least part of the first encapsulation part 301 and the second encapsulation part 302 located on the same plane, since the average thickness of the first encapsulation part 301 is greater than the average thickness of the second encapsulation part 302 , at this time, the second encapsulation part 302 The distance of at least part of the top surface of the first encapsulation part 301 from the base substrate 101 is smaller than the distance of the top surface of the first encapsulation part 301 from the base substrate 101 .
  • both the first encapsulation part 301 and the second encapsulation part 302 have flat surfaces, and in the direction perpendicular to the base substrate 101 , the thickness of the first encapsulation part 301 is The first thickness, the thickness of the second encapsulation portion 302 is the second thickness, and the first thickness is greater than the second thickness.
  • the distance between the top surface of the second encapsulation part 302 and the base substrate 101 is smaller than the distance between the top surface of the first encapsulation part 301 and the base substrate 101 , and the first encapsulation part 301 and the second encapsulation part 302 are stepped as a whole. .
  • the first package part 301 has a flat surface
  • the surface of the second package part 302 has a concave-convex design, so that the average thickness of the second package part 302 is smaller than that of the first package part 302 . thickness of the portion 301 .
  • the surface of the second encapsulation part 302 has at least one first groove 3021 , and the at least one first groove 3021 is along a direction parallel to the bending axis BX of the bending area B (ie, in FIG. 1 ). horizontal direction) extension.
  • the thickness of the first encapsulation portion 301 is the first thickness
  • the average thickness of the second encapsulation portion 302 is the second thickness
  • the first thickness is greater than the second thickness.
  • at least a part of the bottom surface of the first packaging part 301 and the bottom surface of the second packaging part 302 are located on the same plane.
  • the top surface of the first encapsulation part 301 and the top surface of the second encapsulation part 302 except for the at least one first groove 3021 The distance from the base substrate 101 is the same, and the distance from the top surface of the second encapsulation part 302 where at least one groove 3021 is located from the base substrate 101 is smaller than the distance from the top surface of the first encapsulation part 301 to the base substrate 101 .
  • the plurality of first grooves 3021 may be distributed in a matrix or in a strip shape.
  • one groove 3021 includes a plurality of rectangular portions arranged in an array along its extending direction, or, one groove 3021 is continuously arranged in a long strip in its extending direction.
  • the second packaging part 302 taking the direction from the display area AA to the bending area B as the first direction, the second packaging part 302 includes a plurality of packaging areas arranged in sequence along the first direction, and the plurality of packaging areas are in the first direction.
  • the average thickness in one direction gradually becomes smaller.
  • the second encapsulation portion 302 has a top surface inclined relative to the base substrate 101 , and the distance from the top surface to the base substrate 101 gradually decreases in the first direction.
  • the second encapsulation part 302 includes a plurality of encapsulation regions arranged in sequence along the first direction
  • the at least one first groove 3021 includes a plurality of first grooves respectively disposed in the plurality of encapsulation regions
  • the plurality of grooves are arranged so that the average thickness of the plurality of encapsulation regions in the first direction is gradually reduced.
  • the second encapsulation portion 302 includes a plurality of encapsulation regions arranged in sequence along the first direction, such as encapsulation regions 1, 2, 3, and 4, and a plurality of grooves 3021 are respectively provided in the encapsulation regions 1, 3, and 4.
  • the depths of the grooves 3021 respectively provided in the encapsulation areas 1, 2, 3, and 4 gradually increase, so that the encapsulation areas 1, 2, 3, and 4 are The average thickness in the first direction is gradually reduced, ie a design with a thickness gradient.
  • the second encapsulation part 302 includes a plurality of encapsulation regions arranged in sequence along the first direction, such as encapsulation regions 1, 2, 3, and 4, and a plurality of grooves 3021
  • the average thickness of the regions in the first direction is progressively smaller.
  • the embodiment of the present disclosure does not limit the specific manner of the thickness gradient of the multiple encapsulation regions of the second encapsulation part 302 .
  • the first encapsulation part 301 may also have a plurality of encapsulation areas, and the design is similar to the above-mentioned design of the second encapsulation part 302 , for example, a groove is provided in each encapsulation area of the first encapsulation structure 301 3021, in a design with a gradient in thickness.
  • the average thickness of each region gradually decreases.
  • At least a part of the surface of the second encapsulation part 302 away from the base substrate 101 is a curved surface.
  • At least a part of the surface of the second package portion 302 away from the base substrate 101 is configured as a curved surface. Compared with the surface of the second package portion with a uniform slope, the curved surface is more conducive to relieving bending stress.
  • the curved surface is a convex curved surface, or as shown in FIG. 10 , the curved surface is a concave curved surface.
  • At least a part of the surface of the second encapsulation part 302 away from the base substrate 101 has a changing slope in the direction away from the display area AA.
  • the slope of at least a part of the second encapsulation part 302 gradually decreases from the direction close to the display area AA to the direction away from the display area AA.
  • slope refers to the tangent value (tan value) of the acute angle formed between the tangent plane of a certain point in an inclined surface and the horizontal plane where the base substrate 101 is located.
  • the slope of a portion of the at least part of the second encapsulation portion 302 close to the display area AA is greater than the slope of a portion away from the display area AA. Since the part of the second encapsulation part 302 away from the display area AA is closer to the bending area B and is greatly affected by the stress of the bending area B, the slope of the part of the second encapsulation part 302 away from the display area AA is higher than that of the second encapsulation part 302 The slope of the portion of the encapsulation portion 302 close to the display area AA is smaller, and the stress relief effect is better for the second encapsulation portion close to the bending area B, so as to prevent cracks from propagating from the portion of the second encapsulation portion close to the bending area to the encapsulation inside the layer.
  • the surface of the second encapsulation part 302 away from the base substrate 101 includes two concave curved areas, and in each concave curved area, the slope of the part close to the display area AA is greater than the slope of the part away from the base substrate 101 .
  • the slope of the portion of the area AA is displayed.
  • the slope difference between the maximum value and the minimum value of the slope of at least part of the surface of the second package portion 302 away from the base substrate is greater than 0 and less than 0.2.
  • the maximum slope of the part of the surface of the second encapsulation part 302 away from the base substrate 101 close to the display area AA is the smallest The difference between the slopes is greater than 0 and less than 0.2.
  • the maximum slope of the portion of the surface of the second encapsulation portion 302 away from the base substrate 101 that is close to the display area AA is 0.1 ⁇ 0.2, and the surface of the second encapsulation portion 302 away from the base substrate 101 is far away from the display area AA.
  • the minimum slope of the part is 0 ⁇ 0.1. If the difference between the slopes is greater than 0.2, the disconnection of the second encapsulation part 302 at the position with the large slope will cause the touch traces formed on the second encapsulation part 302 to be disconnected.
  • the slope difference is kept in the range greater than 0 and less than 0.2, which is beneficial to ensure the continuity of the touch traces.
  • the surface of the second encapsulation part 302 away from the base substrate 101 includes two concave curved areas, and in each concave curved area, the difference between the maximum slope and the minimum slope Greater than 0 and less than 0.2.
  • the average slope of the sidewall (the sidewall corresponding to the inclination angle e) on the side of the second organic structure 202 close to the first organic structure 201 is greater than that of the second encapsulation portion
  • the average slope of the surface of 302 away from the base substrate 101 is twice or more.
  • the average slope of the sidewall of the second organic structure 202 on the side close to the first organic structure 201 is 0.2 ⁇ 0.6
  • the average slope of the surface of the second encapsulation portion 302 away from the base substrate 101 is 0.001 ⁇ 0.1, that is, the touch away
  • the line is formed on the second package portion 302 , and the portion of the touch line that is far from the surface of the base substrate 101 and close to the bending region B is compared with the touch line corresponding to the sidewall of the second package portion 302 .
  • the first peripheral area NA1 includes a first sub-peripheral area NA1-1 (shown as the first sub-peripheral area NA1-1 in the figure) located on a side close to the bending area B 1 is located on the lower side of the display area AA) and the second sub-peripheral area NA1-2 other than the first sub-peripheral area NA1-1 (shown in the figure as the second sub-peripheral area NA1-2 is located on the left and top of the display area AA) , right); the average thickness of the encapsulation layer located in the first sub-peripheral area NA1-1 is smaller than the average thickness of the encapsulation layer located in the second sub-peripheral area NA1-2.
  • the average thickness of the encapsulation layer of the second sub-peripheral area NA1 - 2 is greater than or equal to the average thickness of the first encapsulation portion 301 . Since the first sub-peripheral area NA1-1 is close to the bending area B, the thickness of the encapsulation layer located in the first sub-peripheral area NA1-1 is smaller than that of the packaging layer farther from the bending area B, which is helpful for bending The bending of the area B also helps to maintain the state of the encapsulation layer when the bending area B is bent to avoid warping, peeling and other phenomena.
  • the first sub-peripheral area NA1-1 includes a main area NA1-11 and two corner areas NA1-12, and the two corner areas NA1-12 are respectively located on two sides of the main area NA1-11. side, the corner area is located between the first sub-peripheral area NA1-1 and the second sub-peripheral area NA1-2, and the average thickness of the encapsulation layer in the corner area NA1-12 is smaller than that in the second sub-peripheral area NA1-2.
  • the average thickness of the encapsulation layer is greater than the average thickness of the encapsulation layers located in the main area NA1-11.
  • the corner area NA1-12 is equivalent to the transition area between the first sub-peripheral area NA1-1 and the second sub-peripheral area NA1-2, the transition area is not adjacent to the bending area B, so the thickness can be designed larger to ensure a certain encapsulation effect.
  • the second organic structure includes a first portion 202A located in the first peripheral region NA1, a second portion 202B located in the bending region B, and a third portion 202C located in the second peripheral region NA2, as shown in FIG. 1 .
  • the first part 202A has a first boundary B1 in the first peripheral area NA1
  • the third part 202C has a second boundary B2 in the second peripheral area NA2; the first part 202A and the third part 202C cover the upper and lower parts of the bending area B The range of 100um to 400um on both sides.
  • a part of the two corner areas NA1-12 close to the bending area is also covered with the second organic structure 202, and the part overlapping with the encapsulation layer and the second organic structure in the partial area also has a first encapsulation part and the second encapsulation part. Therefore, the area where the second organic structure 202 is arranged in the corner area NA1-12 has an encapsulation layer with a smaller thickness than other areas in the corner area. Similarly, the second organic structure 202 is arranged in the main area NA1-11 Regions of the organic structure 202 have a smaller thickness of the encapsulation layer than other regions of the main regions NA1-11.
  • the average thickness of the encapsulation layer in the corner area NA1-12 is smaller than the average thickness of the encapsulation layer in the second sub-peripheral area NA1-2, and greater than the average thickness of the encapsulation layer in the main area NA1-11.
  • the display panel may further include a touch layer, and the touch layer includes touch electrodes (for example, touch drive electrodes TX and TX for mutual capacitance touch) touch sensing electrodes RX) and touch traces 401 electrically connected to the touch electrodes.
  • the touch traces 401 extend from the display area AA to the second peripheral area NA2.
  • at least part of the touch traces 401 are disposed on a side of the packaging layer away from the base substrate 101 and overlap with the second organic structure 202 in a direction perpendicular to the base substrate 101 .
  • the touch trace 401 includes a first touch trace part 401A and a second touch trace part 401B, the first touch trace part 401A is located on the side of the first package part 301 away from the base substrate 101 , and the first touch trace part 401A
  • the two touch trace portions 401B are located on the side of the second package portion 302 away from the base substrate 101 .
  • the average thickness of the first encapsulation portion 301 is greater than the average thickness of the second encapsulation portion 302
  • the average distance from the surface of the first touch trace portion 401A away from the base substrate 101 to the base substrate 101 is greater than that of the second encapsulation portion 302 .
  • the average distance from the surface of the touch trace portion 401B away from the base substrate 101 to the base substrate 101 is greater than that of the second encapsulation portion 302 .
  • the second touch trace portion 401B of the touch trace 401 is in direct contact with the at least one first groove 302 .
  • the touch traces 401 are formed directly above the packaging layer, so that the second touch trace portions 401B of the touch traces 401 and the at least one first groove 302 are formed.
  • direct contact that is, the material of the second touch trace portion 401B is filled into the at least one first groove 302 .
  • the contact area between the touch traces 401 and the second package part 302 is increased, so that the extension path of the touch traces 401 on the packaging layer can be extended.
  • the stress of the wires 401 is released to avoid damage to the touch wires 401 .
  • the first organic structure 201 includes a first barrier dam 2011 and a second barrier dam 2012 arranged at intervals, and the first barrier dam 2011 and the second barrier dam 2012 are directed away from the liner
  • the direction of the base substrate 101 is convex, and the first barrier dam 2011 is located on a side of the second barrier dam 2012 close to the display area AA.
  • the first barrier dam 2011 has a first width W1
  • the second barrier dam 2012 has a second width W2
  • the shortest distance from the second barrier dam 2012 is L2, where L2>0.5*(W1+W2).
  • L2 is 120 ⁇ m-250 ⁇ m, further 130 ⁇ m-220 ⁇ m, such as 150 ⁇ m.
  • W1 and W2 are respectively 10-80 ⁇ m, further 25-70 ⁇ m, eg 40 ⁇ m. Therefore, the requirement of the encapsulation layer to block impurities such as water and oxygen can be fully satisfied.
  • the first barrier dam 2011 and the second barrier dam 2012 include opposite first sidewalls and second sidewalls, respectively, and the second organic structure 202 is adjacent to the first organic structure.
  • One side of the 2011 includes a third sidewall, and the first encapsulation portion 301 at least covers the third sidewall.
  • the first sidewall, the second sidewall and the third sidewall and the plane where the board surface of the base substrate 101 is located form a plurality of slope angles. For example, as shown in FIG.
  • the first sidewall of the first barrier dam 2011 The slope angle formed with the plane where the base substrate 101 is located is a1, the slope angle formed by the second sidewall of the first barrier dam 2011 and the plane where the substrate substrate 101 is located is a2, and the first sidewall of the second barrier dam 2012
  • the slope angle formed with the plane where the base substrate 101 is located is b1, the slope angle formed by the second sidewall of the second barrier dam 2012 and the plane where the base substrate 101 is located is b2, and the third sidewall of the second organic structure 202
  • the slope angle formed with the plane on which the base substrate 101 is located is e.
  • the above-mentioned multiple gradient angles a1, a2, b1, b2, and e are all acute angles, and the absolute value of the difference between any two gradient angles among the multiple gradient angles a1, a2, b1, b2, and e is less than 20 °.
  • the slope angles a1, a2, b1, and b2 formed by the first and second sidewalls of the first barrier dam 2011 and the second barrier dam 2012 and the board surface of the base substrate are 10 °-30°, further, in some examples, the angles of the slope angles a1, a2, b1, b2 are 15°-25°, such as 15°, 20°, or 25°.
  • the angle of the slope angle e formed by the third sidewall of the second organic structure 202 and the base substrate is also 10°-30°, and further, in some examples, the angles of the slope angles a1, a2, b1, b2 It is 15°-25°, such as 15°, 20° or 25°, etc.
  • the thickness of the second organic structure 202 is thick, and the angle difference between the slope angle formed by the third sidewall of the second organic structure 202 and the slope angle formed by the first organic structure is too large, when the touch trace 401 is formed Above the encapsulation layer, the touch metal located at a relatively large slope angle may be difficult to etch, thus resulting in residual touch metal, and further short circuit between adjacent touch traces formed. Through the above design, the problem of touch metal residues can be reduced.
  • the third sidewall of the second organic structure 202 is stepped as a whole, including a first step 2021 and a second step 2022 , and the second step 2022 is located on the side of the first step 2021 .
  • a side away from the base substrate 101 .
  • the gradient angle e1 formed by the first step 2021 and the plane where the base substrate 101 is located is smaller than the gradient angle e2 formed by the second step 2022 and the plane where the base substrate 101 is located.
  • the angle of the slope angle e1 formed by the first step 2021 and the plane on which the base substrate 101 is located is 10°-20°, for example, 15°
  • the slope angle formed by the second step 2022 and the plane on which the base substrate 101 is located is 10°-20°.
  • the angle range of e2 is 15°-30°, eg 20°. Since the slope angle of the step-shaped third sidewall is small, it is beneficial to the climbing of the packaging layer on the stepped third sidewall and the climbing of the touch traces on the packaging layer, which is beneficial to the packaging layer and the packaging layer.
  • the touch traces are formed on the steps.
  • the second encapsulation part 302 ends at a side of the bending area B close to the display area AA.
  • the average thickness of the first encapsulation part 301 is greater than twice the average thickness of the second encapsulation part 302 .
  • the average thickness of the first encapsulation part 301 is 0.6 ⁇ m-1.4 ⁇ m, further 0.8 ⁇ m-1.2 ⁇ m, such as 0.8 ⁇ m, 1.0 ⁇ m or 1.2 ⁇ m, etc.
  • the average thickness of the second packaging part 302 is 0.2 ⁇ m-0.5 ⁇ m, further 0.3 ⁇ m-0.4 ⁇ m, for example, 0.3 ⁇ m or 0.4 ⁇ m.
  • the shortest distance between the orthographic projection of the second encapsulation portion 302 on the base substrate 101 and the orthographic projection of the second barrier dam 2012 on the base substrate 101 is the first A distance L1
  • the shortest distance between the orthographic projection of the first encapsulation portion 301 on the base substrate 101 and the orthographic projection of the second barrier dam 2012 on the base substrate 101 is the second distance L2
  • the first distance L1 is greater than the second distance L2.
  • the second distance is 1.5 times of L2.
  • the first distance L1 is 180 ⁇ m-375 ⁇ m, further 200 ⁇ m-340 ⁇ m, such as 280 ⁇ m, and the second distance L2 is 120 ⁇ m-250 ⁇ m, further 130 ⁇ m-220 ⁇ m, such as 150 ⁇ m.
  • the thick first encapsulation portion 301 covers at least the sidewall of the second step 2022. Since the sidewall has a sloping structure, impurities such as water and oxygen can easily invade along the sidewall, thus ensuring the encapsulation on the step structure. The thickness of the layer can improve the encapsulation effect of the encapsulation layer.
  • the surface of at least one of the first barrier dam 2011 and the second barrier dam 2012 has at least one second groove 2013 , and the at least one second groove 2013 is parallel to the The bending area B extends in the direction of the bending axis BX.
  • the at least one second groove 2013 is continuously arranged in a strip shape in the extending direction thereof.
  • the at least one second groove includes n-1 second grooves, and at least one of the first barrier dam and the second barrier dam is divided into n by the n-1 second grooves part, n is a positive integer greater than or equal to 2, the direction from the display area AA to the bending area B is the first direction, and in the first direction, the widths of the n parts are w1, w2, ..., wn, n -1 second groove has a width of d1, d2, ... dn-1, d represents at least one of d1, d2, ... dn-1, and
  • w1, w2, w3 are 20 ⁇ m ⁇ 80 ⁇ m
  • d1, d2, ... dn-1 are 10 ⁇ m ⁇ 60 ⁇ m
  • n is 3, and w1, w2, and w3 are respectively 20 ⁇ m, 30 ⁇ m, and 40 ⁇ m.
  • d1 and d2 are respectively 25 ⁇ m and 35 ⁇ m.
  • the width of the second groove is less than twice the average value of the widths of the n portions. If the width of the second groove is too large, the blocking effect of the blocking dam may be reduced. Therefore, the above design can balance the contact area of the blocking dam and the encapsulation layer and the blocking effect of the blocking dam.
  • the n portions include an i-th portion and a j-th portion, the i-th portion has a width wi, the j-th portion has a width wj, and there is an i-th groove between the i-th portion and the j-th portion , the width of the i-th groove is di, where,
  • w1 , w2 , . . . , wn increase sequentially, and the amount of the sequential increase is w1 ⁇ (25% ⁇ 50%).
  • the widths w1, w2, and w3 of the parts are 20 ⁇ m, 30 ⁇ m, and 40 ⁇ m, respectively, that is, the increasing widths are 50% of w1.
  • the display panel has a greater demand for the blocking effect of the barrier dam on the side close to the display area AA. For example, if the inkjet printing material overflows onto the upper surface of the barrier dam, the overflowed part can be left inside the second groove to prevent further blocking effect. Therefore, the disposition density of the second grooves near the display area AA may be greater than the disposition density of the second grooves away from the display area AA.
  • the thickness of at least one of the first barrier dam 2011 and the second barrier dam 2012 is H, and the depth of the second groove 2013 is h, wherein,
  • FIGS. 12 and 13 show the case where k is less than 1, when k is equal to 1, the depth of the second groove 2013 is equal to the first barrier dam 2011 and/or the second barrier dam having the second groove 2013 2012 , at this time, the second groove 2013 separates parts of the first barrier dam 2011 and/or the second barrier dam 2012 on both sides of the second groove 2013 .
  • the width of the first barrier dam 2011 or the second barrier dam 2012 is equal to the sum of w1, w2, . . . , wn.
  • the barrier dam on which the second groove is provided is the barrier dam on the side close to the bending region B.
  • the surface of the second barrier dam 2012 has at least one second groove 2013.
  • the second barrier dam 2012 includes opposite first sidewalls and second sidewalls. The two sidewalls are closer to the display area AA.
  • the slope angle formed by the first sidewall and the plane where the base substrate 101 is located is b1.
  • the third sidewall of the groove 2013 is closer to the display area AA than the fourth sidewall, the slope angle formed by the third sidewall of the second groove 2013 and the plane where the base substrate 101 is located is c1, and the fourth sidewall
  • the slope angle formed with the plane where the base substrate 101 is located is c2, and c represents at least one of c1 and c2, then
  • w1 is 20 ⁇ m to 80 ⁇ m
  • b1 and b2 are 10° to 50°
  • H is 2 ⁇ m to 10 ⁇ m
  • h is 1 ⁇ m to 10 ⁇ m.
  • w1 is 20 ⁇ m
  • b1 is 45°
  • H is 5 ⁇ m
  • k is 1.
  • the above design can make the upper surface of the second groove have a certain width, and can balance the blocking effect of the second barrier dam 2012 and the contact area between the second barrier dam 2012 and the encapsulation layer.
  • the planar shape of the at least one second groove 2013 is a rectangle, a trapezoid or a hexagon, that is, when the at least one second groove 2013 is viewed from a direction perpendicular to the display panel, the at least one first The two grooves 2013 are rectangular, trapezoidal or hexagonal.
  • FIG. 15 shows schematic diagrams of seven shapes of the at least one second groove 2013 .
  • the at least one second groove 2013 may be continuously arranged in a long strip or in a matrix along its extending direction.
  • the barrier dams with the second grooves 2013 are arranged in a strip shape, and the plurality of second grooves 2013 are evenly arranged in the In the barrier dam, a plurality of second grooves 2013 are arranged in a matrix in the extending direction (horizontal direction in the figure), and the planar shape of each second groove 2013 is a rectangle.
  • the barrier dam with the second grooves 2013 includes a plurality of regions that are sequentially and continuously arranged in the extending direction thereof, and the plurality of second grooves 2013 are arranged in a matrix along the extending direction thereof and Disposed in the plurality of regions respectively, the planar shape of each second groove 2013 is a rectangle, and the blocking dam evenly surrounds each second groove 2013 .
  • the barrier dams with the second grooves 2013 are arranged in an elongated shape, the second grooves 2013 divide the barrier dams into two parts with the same width, and the second grooves 2013 are also elongated
  • the second groove 2013 is arranged in a rectangular shape, and the blocking dam evenly surrounds the second groove 2013 and extends from the lower side of the second groove 2013 to the direction away from the second groove 2013 .
  • the barrier dams with the second grooves 2013 are arranged in a strip shape, the second grooves 2013 divide the barrier dams into two parts with the same width, and the second grooves 2013 are also long strips
  • the second groove 2013 is arranged in a rectangular shape, and the blocking dam evenly surrounds the second groove 2013 and extends from the upper side of the second groove 2013 to the direction away from the second groove 2013 .
  • the barrier dams with the second grooves 2013 are arranged in an elongated shape, and the second grooves 2013 are also arranged in an elongated shape, and the barrier dams are divided into two parts with the same width,
  • the planar shapes of the blocking dam and the second groove 2013 are hexagonal, and the blocking dam evenly surrounds the second groove 2013 and extends from both ends of the second groove 2013 to a direction away from the second groove 2013 .
  • the barrier dams with the second grooves 2013 are arranged in a strip shape, the second grooves 2013 are also arranged in a strip shape, and the second grooves 2013 divide the barrier dams into different widths (shown as the second groove 2013 in the figure divides the blocking dam into two parts that are narrow at the top and wide at the bottom, in other embodiments, the second groove 2013 can also divide the blocking dam into two parts that are wide at the top and narrow at the bottom.
  • the second groove 2013 is rectangular in plan shape, and the barrier dam evenly surrounds the second groove 2013 and extends from the lower side of the second groove 2013 to the direction away from the second groove 2013 .
  • the barrier dam with the second grooves 2013 is arranged in a strip shape
  • the barrier dam has two second grooves 2013, and the two second grooves 2013 are in a strip shape and are juxtaposed Arranged and divided the barrier dam into three parts with the same width
  • the plane shape of each second groove 2013 is rectangular
  • the plane shape and size of the two second grooves 2013 are the same
  • the barrier dam evenly surrounds the second groove 2013.
  • the groove 2013 continues to extend from the lower side of the second groove 2013 to a direction away from the second groove 2013 .
  • the second grooves 2013 may also have other arrangements, which are not specifically limited in the embodiments of the present disclosure.
  • the at least one second groove 2013 includes a plurality of second grooves 2013, as shown in FIG. 16, the direction from the display area AA to the bending area B is the first direction, In the direction, a plurality of second grooves 2013 (two are shown in the figure) are arranged in sequence, and the extension length gradually decreases.
  • the display panel further includes a plurality of sub-pixels arranged in an array, each of the plurality of sub-pixels includes a pixel driving circuit and a light-emitting device, and the pixel driving circuit is disposed on the driving circuit layer 102
  • the pixel driving circuit includes structures such as thin film transistor T and storage capacitor C.
  • the thin film transistor T includes an active layer, a gate 1021, source and drain electrodes 1022 and 1023, etc.
  • the storage capacitor C includes a first capacitor electrode C1 and a second capacitor electrode C2
  • the light emitting device includes a first electrode 104, a second electrode 106 and a first capacitor electrode C2.
  • the light emitting layer 105 between the first electrode 104 and the second electrode 106, the first electrode 104 is electrically connected to the source and drain electrodes 1022 of the thin film transistor T.
  • the first electrode 104 is the anode of the light emitting device
  • the second electrode 106 is the cathode of the light emitting device.
  • the first capacitor plate C1 and the gate electrode 1021 are disposed in the same layer.
  • “same layer arrangement” means that two functional layers or structural layers are formed in the same layer and with the same material in the hierarchical structure of the display substrate, that is, in the preparation process, the two functional layers or structural layers are formed in the same layer and with the same material.
  • the layers or structural layers can be formed from the same material layer, and the desired patterns and structures can be formed by the same patterning process.
  • the “same layer setting" can simplify the manufacturing process of the display panel.
  • the active layer may be an amorphous silicon layer, a polysilicon layer, or a metal oxide semiconductor layer (eg, an IGZO layer).
  • the polysilicon may be high temperature polysilicon or low temperature polysilicon.
  • the gate electrode 1021, the source and drain electrodes 1022 and 1023 can be made of metal materials or alloy materials such as copper (Cu), aluminum (Al), and titanium (Ti), for example, formed into a single-layer structure or a multi-layer structure, such as titanium/aluminum/titanium Three-layer structure, etc.
  • the material of the first electrode 104 may be transparent metal oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), gallium zinc oxide (GZO), and the material of the second electrode 106 may be lithium (Li), aluminum (Al) ), magnesium (Mg), silver (Ag) and other metal materials.
  • the base substrate 101 may be a flexible substrate such as polyimide (PI), and structures such as a buffer layer and a barrier layer may also be formed on the base substrate 101.
  • the base substrate 101 may be formed with multiple Laminated structure of layers PI, etc.
  • the embodiments of the present disclosure do not limit the materials and specific forms of each functional structure.
  • the display panel further includes a first power supply line V1 located in the peripheral area NA, and the first power supply line V1 and the source and drain electrodes 1022 and 1023 are arranged in the same layer; There are two parts, the first part is provided in the same layer as the source and drain electrodes 1022 and 1023 , and the second part is provided in the same layer as the first electrode 104 .
  • the first electrode 104 of the light-emitting device may be electrically connected to the source and drain 1022 through the connection electrode 103 .
  • the first power supply trace V1 may include a parallel connection
  • the first part, the second part and the third part, the first part is provided in the same layer as the source and drain electrodes 1022 and 1023
  • the second part is provided in the same layer as the first electrode 104
  • the third part is provided in the same layer as the connection electrode 103 .
  • the connection electrode 103 is made of, for example, a metal material or an alloy material such as copper (Cu), aluminum (Al), and titanium (Ti).
  • the driving circuit layer 102 described above only includes the source and drain electrodes 1022 and the film layers between the source and drain electrodes 1022 and the base substrate 101.
  • the connection electrode 103 is used to connect the The source-drain 1022 and the first electrode 104 of the light-emitting device do not belong to the above-mentioned driving circuit layer.
  • the encapsulation layer includes a first inorganic layer 311 , a first organic layer 312 , a second inorganic layer 313 and a third inorganic layer 314 which are sequentially stacked.
  • the first organic layer 312 is covered (interposed) by the first inorganic layer 311 and the second inorganic layer 313, and the edge of the first organic layer 312 is located on the side of the first organic structure 201 close to the display area AA, that is, the first The organic layer 312 ends at a side of the first organic structure 201 close to the display area AA.
  • the first encapsulation part 301 and the second encapsulation part 302 each include a stacked first inorganic layer 311 , a second inorganic layer 313 and a third inorganic layer 314 .
  • the encapsulation layer includes a first inorganic layer 311 , a first organic layer 312 and a second inorganic layer 313 that are sequentially stacked.
  • the first organic layer 312 is covered (interposed) by the first inorganic layer 311 and the second inorganic layer 313, and the edge of the first organic layer 312 is located on the side of the first organic structure 201 close to the display area AA, that is, the first The organic layer 312 ends at a side of the first organic structure 201 close to the display area AA.
  • Both the first encapsulation part 301 and the second encapsulation part 302 include a stacked first inorganic layer 311 and a second inorganic layer 313 .
  • the material of each of the first inorganic layer 311 , the second inorganic layer 313 and the third inorganic layer 314 may include among inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON). at least one of.
  • the first organic layer 312 includes organic materials such as polyimide and resin.
  • the thickness of the first inorganic layer 311 is 0.5 ⁇ m-1.5 ⁇ m, such as 0.8 ⁇ m or 1.0 ⁇ m
  • the thickness of the first organic layer 312 is 7 ⁇ m-15 ⁇ m, such as 10 ⁇ m or 12 ⁇ m
  • the thickness of the second inorganic layer 313 is
  • the thickness of the third inorganic layer 314 is 0.3 ⁇ m-0.8 ⁇ m, such as 0.5 ⁇ m or 0.7 ⁇ m
  • the thickness of the third inorganic layer 314 is 0.3 ⁇ m-0.8 ⁇ m, such as 0.5 ⁇ m or 0.7 ⁇ m.
  • the encapsulation layer may also include a first inorganic layer 311 , a first organic layer 312 and a second inorganic layer 313 that are sequentially stacked, without the third inorganic layer 314 .
  • the embodiments of the present disclosure do not specifically limit the stacked structure of the encapsulation layer.
  • the display panel may further include structures such as a pixel defining layer 107 and spacers 108 for defining a plurality of sub-pixels.
  • a first planarization layer 109 between the light-emitting device and the thin film transistor T there may be a first planarization layer 109 between the light-emitting device and the thin film transistor T, the source and drain electrodes 1022 and 1023 are covered with a passivation layer 111 , and the first planarization layer 109 and the passivation layer 111 are covered with a passivation layer 111 .
  • a first planarization layer 109 and a second planarization layer 110 may also be provided between the light-emitting device and the thin film transistor T, the source and drain electrodes 1022 and 1023 are covered with a passivation layer 111, and the first planarization layer 109 and the passivation layer 111 have via holes exposing the source and drain electrodes 1022, and the connection electrodes 103 are electrically connected to the source and drain electrodes 1022 through the via holes.
  • the second planarization layer 110 has a via hole exposing the connection electrode 103 , and the first electrode 104 is electrically connected to the connection electrode through the via hole.
  • the passivation layer 111 may employ at least one of inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON).
  • inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON).
  • SiOx silicon oxide
  • SiNx silicon nitride
  • SiON silicon oxynitride
  • Each of the pixel defining layer 107 , the spacers 108 , the first planarization layer 109 and the second planarization layer 110 may include organic materials such as polyimide, resin, and the like.
  • the first organic layer 312 in the encapsulation layer can be formed by inkjet printing, and the first organic structure 201 can prevent the first organic layer 312 from overflowing into the first organic layer during the printing process.
  • Perimeter area outside of structure 201 Perimeter area outside of structure 201 .
  • the first organic structure 201 may be disposed around the peripheral area NA of the display area AA.
  • the first organic structure 201 may be disposed in the same layer as at least one of the first planarization layer 109 , the second planarization layer 110 , the pixel definition layer 107 and the spacer 108 .
  • the first organic structure 201 is disposed in the same layer as the first planarization layer 109 , the second planarization layer 110 and the pixel defining layer 107 , or the first organic structure 201 and the first planarization layer 109 and the second planarization layer 110 and the spacer 108 are arranged in the same layer.
  • the first organic structure 201 may be disposed in the same layer as at least one of the first planarization layer 109 , the pixel defining layer 107 and the spacer 108 .
  • the first organic structure 201 is disposed in the same layer as the first planarization layer 109 and the pixel defining layer 107 , or the first organic structure 201 is disposed in the same layer as the first planarization layer 109 and the spacer 108 , or the first The organic structure 201 is disposed in the same layer as the first planarization layer 109 , the pixel defining layer 107 and the spacer 108 .
  • the first barrier dam 2011 may be defined with the second planarization layer 110 and the pixels.
  • the layer 107 and the spacer 108 are disposed in the same layer, and the second barrier dam 2012 can be disposed in the same layer as the first planarization layer 109, the second planarization layer 110, the pixel definition layer 107 and the spacer 108; or, the first barrier The dam 2011 is disposed on the same layer as the pixel defining layer 107 and the spacer 108 , and the second barrier dam 2012 is disposed on the same layer as the first planarizing layer 109 , the second planarizing layer 110 , the pixel defining layer 107 and the spacer 108 .
  • the first barrier dam 2011 may be disposed in the same layer as the pixel definition layer 107 and the spacer 108 , and the second barrier dam 2012 may be arranged with the first planarization layer 109 , the pixel definition layer 107 and the spacer Object 108 is placed on the same floor.
  • the second organic structure 202 covers the wiring structure disposed in the bending region B, so as to protect and buffer the wiring structure.
  • the second organic structure 202 is disposed in the same layer as at least one of the first planarization layer 109 , the second planarization layer 110 , the pixel definition layer 107 and the spacer 108 .
  • the second organic structure 202 may be disposed in the same layer as at least one of the first planarization layer 109 , the pixel defining layer 107 and the spacer 108 .
  • the first step 2021 of the second organic structure 202 is connected to the first planarization layer 109, the The two planarization layers 110 and at least one of the pixel definition layers 107 are disposed in the same layer, and the second step 2022 is disposed in the same layer as at least one of the second planarization layer 110 , the pixel definition layers 107 and the spacers 108 .
  • the display panel shown in FIG. 8 For the display panel shown in FIG.
  • the first step 2021 is disposed in the same layer as at least one of the first planarization layer 109 and the pixel definition layer 107
  • the second step 2022 is arranged with the pixel definition layer 107 and the spacer 108 in the same layer.
  • At least one peer setting for example, in one example, the thickness of the first step 2021 of the second organic structure is greater than the thickness of the second step 2022 .
  • the first step 2021 is disposed on the same layer as the first planarization layer 109 or the second planarization layer 110
  • the second step 2022 is disposed on the same layer as the pixel defining layer 107 .
  • the first step 2021 is disposed on the same layer as the first planarization layer 109
  • the second step 2022 is disposed on the same layer as the pixel defining layer 107 .
  • the second portion V12 (light gray portion in the figure) of the first power trace V1 and the first blocking dam 2011 overlaps with at least one of the second barrier dams 2012, and the portion of the second portion V12 of the first power trace that overlaps with at least one of the first barrier dam 2011 and the second barrier dam 2012 has at least one opening VH .
  • the portion of the second portion V12 of the first power trace that overlaps with at least one of the first barrier dam 2011 and the second barrier dam 2012 has at least one opening VH .
  • the second portion V12 of the first power trace V1 surrounds the left and right upper sides of the display area AA, and is disconnected at the lower side of the display area AA, or, in some embodiments, the first The second portion V12 of the power trace V1 is also continuous at the lower side, thereby forming a ring around the display area AA.
  • the first barrier dam 2011 has a second groove 2013 , and the overlapping portion of the second portion V12 of the first power trace with the first barrier dam 2011 has a plurality of Opening VH. Since the organic layer of the display panel will release gas including water molecules during the heating process, and the organic layer has the property of conducting water and oxygen, if water and oxygen invade into the light-emitting device in the display area AA, the light-emitting device will be damaged. The light-emitting layer fails, resulting in defects such as dark spots in the display panel.
  • the barrier dam itself is also made of organic materials, so the second portion of the first power supply trace V1
  • the openings VH provided in the portion V12 can discharge gases including water molecules that may be generated during the formation of the organic layer.
  • the extension direction of at least one opening VH is perpendicular to the extension direction of the first barrier dam 2011.
  • the extension direction of the second groove 2013 is the horizontal direction in the figure
  • at least The extending direction of one opening VH is the vertical direction in the figure.
  • the second portion V12 of the first power supply trace also partially overlaps with at least one second groove 2013, as shown in FIG. 20, in the at least one second groove 2013
  • the depth of the first barrier dam 2011 is equal to the thickness of the first barrier dam 2011, there is no organic material at the position of the second groove 2013, so the portion of the second portion V12 of the first power trace that overlaps with the at least one second groove 2013 does not exist.
  • the opening VH does not overlap with the second groove 2013;
  • the at least one opening VH includes a first partial opening VH1 and a second partial opening VH2, and the portion of the second portion V12 of the first power trace that overlaps with the at least one second groove 2013 has a first partial opening VH1
  • the second partial opening VH2 is an opening other than the first partial opening VH1 in the at least one opening VH, and the size or arrangement density of the first partial opening VH1 is smaller than that of the second partial opening VH2. Since the barrier dam with the second groove 2013 has less or no organic material, corresponding positions may be provided with fewer/smaller openings VH or no openings VH.
  • the first blocking dam 2011 and the second blocking dam 2012 (the first blocking dam 2011 is shown in the figure as an example, in other embodiments, can also be The second barrier dam 2012) includes an edge portion 2011A at the end of the at least one second groove 2013, and the edge portion 2011A has a tapered width.
  • the edge part 2011A includes a first part 2011A1 (the left part of the edge part 2011A in the figure) and a second part 2011A2 (the right part of the edge part 2011A in the figure).
  • the average width of the first part 2011A1 of the edge part 2011A (the average size of the first part in the vertical direction in the figure) is smaller than the average width of the second part 2011A2 of the edge part 2011A
  • the width (the average dimension of the second part in the vertical direction in the figure), and the extension length (the dimension in the vertical direction in the figure) of the opening VH1 overlapping the first part 2011A1 of the edge part 2011A is greater than that of the first part 2011A1 of the edge part 2011A
  • the extension length of the openings VH2 overlapping the two parts 2011A2 the number of openings VH1 overlapping the first part 2011A1 of the edge part 2011A (shown as one in the figure) is smaller than the opening VH2 overlapping the second part 2011A2 of the edge part 2011A
  • the second portion V12 of the first power trace has two portions (two left and right portions in FIG. 21 ), and the two portions are axially symmetrically distributed, as shown in FIG. 21 .
  • the display panel further includes a fan-shaped wiring area F1 located in the first peripheral area NA1, and the fan-shaped wiring area F1 includes a plurality of wirings for connecting the pixels of the display area AA.
  • the driving circuit is electrically connected to a plurality of traces located in the bending region B.
  • the multiple traces in the fan-shaped trace area F1 are provided in the same layer as the gate 1021 , or in the same layer as the second capacitor electrode C2 , or in the same layer as the gate 1021 and the second capacitor electrode C2 .
  • the edge portion 2011A does not overlap with the fan-shaped wiring area F1 .
  • the first blocking dam 2011 overlaps with the fan-shaped routing area F1, that is, the first blocking dam 2011 covers the fan-shaped routing area F1, so as to protect many parts of the fan-shaped routing area F1. line.
  • FIG. 22 only shows a schematic diagram of a portion of the blocking dam close to the bending region B.
  • the blocking dams eg, the first blocking dam 2011 and the second blocking dam 2012
  • the blocking dams is around the display area AA, for example, it continues to extend from the edge 2011A in FIG. 22 to the left and right sides of the display area AA, so as to be continuously arranged around the display area AA to give full play to its blocking effect.
  • the extension length of the opening VH (the length in the numerical direction in FIG. 21 ) is 70%-80% of the width of each part of the first barrier dam 2011 (eg, w1, w2, . . . , wn above) %.
  • the width of each portion eg, w1, w2, .
  • the length of the opening VH under the part may be 30 ⁇ m, the width is 15 ⁇ m, and the interval between two adjacent openings VH is 12 ⁇ m.
  • FIG. 23 shows a schematic cross-sectional view along line C-C in FIG. 21 .
  • the thickness of the first barrier dam 2011 ranges from 1 ⁇ m to 6 ⁇ m; the depth of the second groove 2013 is equal to the thickness of the first barrier dam 2011 .
  • the first barrier dam 2011 includes a plurality of portions disposed on the same layer as the first planarization layer 109 , the pixel defining layer 107 and the spacer 108 , for example, the first portion 2011A of the first barrier dam 2011 is on the same layer as the first planarization layer 109
  • the second portion 2011B of the first barrier dam 2011 is arranged in the same layer as the pixel defining layer 107 and the spacer 108 , or the first portion 2011A of the first barrier dam 2011 is the same as the first planarization layer 109 and the pixel defining layer 107 Layer arrangement, the second portion 2011B of the first barrier dam 2011 and the spacer 108 are arranged in the same layer.
  • the second portion V12 of the first power trace is formed between the first portion 2011A and the second portion 2011B of the first barrier dam 2011 .
  • the portion of the second portion V12 of the first power trace that overlaps the first barrier dam 2011 includes a flat portion V121 and a slope portion V122 formed on the sidewall of the first portion 2011A of the first barrier dam 2011, but not may be formed on the upper surface of the first portion 2011A of the first barrier dam 2011, thereby forming the opening VH.
  • the slope portion V122 forms a sloped edge at the edge of the opening VH, for example, the sloped edge (ie, the upper end of the slope portion V122 ) reaches the bottom surface of the first barrier dam 2011 (the surface close to the base substrate 101 )
  • the distance L is less than 50% of the thickness of each part of the first barrier dam 2011 .
  • the second portion V12 of the first power trace may also not have a slope, that is, not have an inclined edge.
  • the first barrier dam 2011 includes a plurality of portions disposed in the same layer as the pixel defining layer 107 and the spacer 108 .
  • the second portion V12 of the first power trace is disposed below the first barrier dam 2011 .
  • the display panel further includes a touch layer located on a side of the encapsulation layer away from the substrate substrate 101 , and the touch layer includes a touch layer disposed in sequence on the encapsulation layer away from the substrate A first touch metal layer 402 , a touch insulating layer 403 and a second touch metal layer 404 on one side of the substrate 101 .
  • the second touch metal layer 403 includes touch driving electrodes TX extending along a first direction and driving sensing electrodes RX extending along a second direction, where the first direction intersects with the second direction, eg, is perpendicular.
  • the driving sensing electrode TX includes a plurality of separated portions 404A and 404B
  • the first touch metal layer 402 includes at least one bridge electrode 402 for electrically connecting the plurality of separated portions 404A and 404B.
  • the side of the second touch metal layer 404 away from the base substrate also has a protective cover plate 405, such as a glass cover plate, to protect the touch layer and form a touch surface.
  • a protective cover plate 405 such as a glass cover plate
  • the buffer layer 406 may not be provided, and the third inorganic layer 314 may be multiplexed as the buffer layer.
  • the touch layer further includes touch traces 401 electrically connected to the touch driving electrodes TX or the driving sensing electrodes RX.
  • FIG. 25 is taken along the line B-B in FIG. 1 .
  • the touch trace 401 includes a first trace portion 401A located in the first touch metal layer 402 and a second trace portion 401B located in the second touch metal layer 403 .
  • the extension direction (the vertical direction in the figure) of the at least one via hole 403A is perpendicular to the extension direction of the first barrier dam 2011 and the second barrier dam 2012 .
  • the at least one via hole 403A includes a first via hole 4031 overlapping with the first barrier dam 2011 and a second via hole 4032 overlapping with the second barrier dam 2012 , the first via hole 4031
  • the orthographic projection on the base substrate 101 is located inside the orthographic projection of the first barrier dam 2011 on the base substrate 101 and does not overlap the edge of the orthographic projection of the first barrier dam 201 on the base substrate 101 .
  • the orthographic projection of the second via hole 4032 on the base substrate 101 is located inside the orthographic projection of the second barrier dam 2012 on the base substrate 101 and is not the same as the orthographic projection of the second barrier dam 2012 on the base substrate 101 Edges overlap.
  • the overlapping area of the touch traces 401 and the first barrier dam 2011 (for example, the area of the area shown by the dotted box in the figure) is S, the first via 4031 and the The overlapping area of a blocking dam 2011 (for example, the area of the area shown by the solid line frame in the figure) is S1, then 0.2 ⁇ S1/S ⁇ 0.4.
  • the overlapping area of the touch traces 401 and the second barrier dam 2012 is (for example, the area shown by the dotted box in the figure) SS, and the overlapping area of the second via 4032 and the second barrier dam 2012 (for example, the solid line in the figure)
  • the area of the area shown by the box) is SS1, then 0.2 ⁇ SS1/SS ⁇ 0.4.
  • the slope angle formed by the side wall of the first barrier dam 2011 close to the display area AA and the plane where the base substrate 101 is located is a1
  • the first barrier The width of the dam 2011 is W1
  • the height is H1
  • the extension length of the first via hole 4031 is D1
  • the slope angle formed by the side wall of the second barrier dam 2012 close to the display area AA and the plane where the base substrate 101 is located is b1
  • the width of the second barrier dam 2012 is W2
  • the height is H2
  • the extension length of the second via hole 4032 is D2
  • the first barrier dam 2011 includes a first portion 2011-1 and a second portion 2011-2, and the widths of the first portion 2011-1 and the second portion 2011-2 are respectively w1, w2.
  • the first part 2011-1 and the second part 2011-2 respectively have first via holes 4031 under them, and w1 and w2 can satisfy the above relational expressions respectively. which is:
  • the line width of the touch trace 401 (the length in the horizontal direction in the figure) is 15 ⁇ m
  • the width w1 of the first part 2011-1 (the length in the vertical direction in the figure)
  • the width w2 of the second part 2011-2 are both 40 ⁇ m
  • the size of the first via hole 4031 may be 6 ⁇ m ⁇ 30 ⁇ m
  • the size of the second via hole 4032 may be 6 ⁇ m ⁇ 60 ⁇ m.
  • the slope of the slope gradually decreases from the edge of the slope to the middle. If the slope of the dam is steeper, the traces provided on the via hole 403A are easily broken. Therefore, the end of the via hole 403A should be as close to the area with the gentler slope as possible.
  • the display panel further includes a shielding structure, as shown in FIG. 30 (for example, FIG. 30 is obtained by cutting along the EE line in FIG. 1 ), in the direction perpendicular to the base substrate 101 , the shielding structure V is located on the fan-shaped wiring Between the multiple traces F1-1 in the area F1 and the touch traces 401, the shielding structure V is insulated from the multiple traces F1-1 in the fan-shaped trace area F1 through the insulating layer IN, and the touch traces 401 and the shielding structure The distance therebetween (the vertical distance in the figure) is greater than the distance (the vertical distance in the figure) between the plurality of traces F1-1 of the fan-shaped trace area F1 and the shielding structure V (the vertical distance in the figure).
  • the shielding structure V can shield the touch traces 401 and the plurality of traces F1-1 in the fan-shaped trace area F1, so as to prevent electrical signals transmitted by the plurality of traces F1-1 in the fan-shaped trace area F1 from affecting the touch traces 401. Transmitted electrical signals cause interference.
  • the touch trace 401 includes a first trace part located on the first touch metal layer 402 and a second trace part located on the second touch metal layer 403 , and the touch insulating layer 403 is located on the A via hole is formed above the blocking dam (shown as the first blocking dam 2011 in the figure), and the first wiring portion and the second wiring portion of the touch wiring 401 are electrically connected through the via hole.
  • the shielding structure may be the first power supply wiring V1 or the second power supply wiring V2 or the like.
  • the first power supply line V1 is a signal line VSS for transmitting a low level
  • the second power supply line V2 is a signal line VDD for transmitting a high level.
  • the multiple traces of the fan-shaped trace area F1 are arranged in the same layer as the gate electrode 1021 of the thin film transistor T and the second capacitor electrode C2 of the storage capacitor C. As shown in FIG. At least part of the first power supply trace V1 or the second power supply trace V2 is disposed in the same layer as the source and drain electrodes 1022 and 1023 of the thin film transistor.
  • the shielding structure is the first power trace V1.
  • the first power supply line V1 is, for example, a signal line VSS for transmitting a low potential
  • the first power supply line V1 can be arranged in the same layer as the source and drain electrodes 1022 and 1023 of the thin film transistor T; or, as shown in FIG. 28 ( As shown in FIG. 28, for example, the first power supply wiring V1 is obtained by cutting the first power supply wiring V1 along the DD line in FIG. 1).
  • 1022 and 1023 are arranged in the same layer, and the second portion V12 is arranged in the same layer as the first electrode 104; or, as shown in FIG. 29 (for example, FIG.
  • the first power supply trace V1 includes a first part V11, a second part V12 and a third part V13 connected in parallel, the first part V11 is arranged in the same layer as the source and drain electrodes 1022 and 1023, and the second part V12 is arranged in the same layer as the first electrode 104 , and the third portion V13 and the connection electrode 103 are arranged in the same layer.
  • the shielding structure overlaps and directly contacts the first barrier dam 2011 and the second barrier dam 2012, ie the first barrier dam 2011 and the second barrier dam 2012 Cover the shield structure directly to protect the shield structure.
  • the overlapping portion of the second portion V12 of the first power trace with the first barrier dam 2011 has a plurality of openings VH, and the plurality of openings VH are in The orthographic projections on the base substrate 101 and the orthographic projections of the plurality of openings 403A on the base substrate 101 do not overlap and are alternately arranged.
  • the first barrier dam 2011 and the second barrier dam 2012 respectively include opposite first sidewalls and second sidewalls, the first sidewall is closer to the display area AA than the second sidewall,
  • the slope angle formed between the first sidewall of the first barrier dam 2011 and the plane where the base substrate 101 is located is a1
  • the slope angle formed by the second sidewall of the first barrier dam 2011 and the plane where the substrate substrate 101 is located is a2, and a1 is greater than , less than or equal to a2.
  • the slope angle formed between the first sidewall of the second barrier dam 2012 and the plane where the base substrate 101 is located is b1, and the slope angle formed by the second sidewall of the second barrier dam 2012 and the plane where the base substrate 101 is located is b2, and b1 is greater than b2;
  • the above design can improve the slope angle of the barrier dam without increasing the complexity of the process. In the case of non-toxicity, the above-mentioned problems such as ink printing overflow and inorganic encapsulation layer peeling are improved.
  • the angle range of a1, a2 and b1 may be 10°-40°, and the angle range of b2 is 30°-50°.
  • a1, a2 and b1 are all 20°, b2 is 45°, 0 ⁇
  • the above-described design regarding the slope angle is applicable to barrier dams at various positions around the display area AA (eg, left and right on the display area AA).
  • the second barrier dam 2012 overlaps the second portion V12 of the first power trace, the second portion of the first power trace.
  • the portion of V12 overlapping the second barrier dam 2012 includes a flat portion V121 and a slope portion V122.
  • the slope angle formed by the surface of the flat portion V121 away from the base substrate 101 and the first sidewall of the second barrier dam 2012 is b1.
  • the first barrier dam 2011 is disposed in the same layer as the second planarization layer 110 , the pixel defining layer 107 and the spacer 108 .
  • the second barrier dam 2012 is disposed in the same layer as the first planarization layer 109 , the second planarization layer 110 , the pixel defining layer 107 and the spacer 108 .
  • a display panel has a display area AA and a peripheral area NA surrounding the display area AA, and the peripheral area NA includes a first peripheral area NA1 , a bending area B and a second peripheral area NA2, the first peripheral area NA is located on the side of the second peripheral area NA2 close to the display area AA, and the bending area B is arranged between the first peripheral area NA1 and the second peripheral area NA2;
  • the display panel includes a base substrate 101, The driving circuit layer 102 and the encapsulation layer 300, the driving circuit layer 102 is arranged on the base substrate 101; the encapsulation layer 300 is on the side of the driving circuit layer 102 away from the base plate 101, and the encapsulation layer 300 covers the display AA area and at least part of the In the first peripheral area NA1, the part of the encapsulation layer 300 located in the first peripheral area NA1 includes a first encapsulation part 301 and a second encapsulation part 302, the first
  • the encapsulation layer can have a better encapsulation effect, and the encapsulation layer is not easily peeled off when the display panel is bent; and, in this When the touch traces are formed on the package layer, the touch traces can be formed by precise etching, so as to avoid problems such as short circuits between adjacent touch traces.
  • the organic structure can have a better function of blocking the inkjet printing material, and cooperate with the encapsulation layer to have a better function of blocking impurities such as water, oxygen, etc., thus making the embodiment of the present disclosure possible.
  • the provided display panel has better reliability.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Optics & Photonics (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
PCT/CN2021/098919 2020-08-17 2021-06-08 显示面板 Ceased WO2022037195A1 (zh)

Priority Applications (6)

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BR112021016853A BR112021016853A2 (pt) 2020-08-17 2021-06-08 Painel de exibição
KR1020217027528A KR102893566B1 (ko) 2020-08-17 2021-06-08 디스플레이 패널
AU2021215098A AU2021215098B2 (en) 2020-08-17 2021-06-08 Display panel
EP21749523.3A EP4006987B1 (en) 2020-08-17 2021-06-08 Display panel
US17/436,078 US11832501B2 (en) 2020-08-17 2021-06-08 Display panel
JP2021547538A JP7736564B2 (ja) 2020-08-17 2021-06-08 ディスプレイパネル

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Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111710712B (zh) 2020-08-17 2021-01-22 京东方科技集团股份有限公司 显示面板
CN111834551A (zh) * 2020-09-02 2020-10-27 云谷（固安）科技有限公司 显示面板、显示装置以及显示面板的成型方法
CN112151692B (zh) * 2020-09-27 2022-09-13 昆山国显光电有限公司 显示面板及显示装置
CN114335070B (zh) * 2020-09-30 2025-06-27 京东方科技集团股份有限公司 一种显示基板及其制作方法和显示装置
CN112599693B (zh) * 2020-12-07 2022-09-06 合肥维信诺科技有限公司 一种显示面板及显示装置
WO2022133781A1 (zh) * 2020-12-23 2022-06-30 京东方科技集团股份有限公司 一种显示基板和显示装置
CN115152026B (zh) * 2021-01-28 2025-09-05 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置和掩膜版
US11907488B2 (en) 2021-02-26 2024-02-20 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch structure, touch display panel, and display device
CN115315810B (zh) * 2021-03-04 2025-04-01 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
CN113053990B (zh) * 2021-04-06 2023-04-07 京东方科技集团股份有限公司 显示面板和显示装置
CN115605832A (zh) * 2021-05-11 2023-01-13 京东方科技集团股份有限公司（Cn） 显示面板及其制备方法、显示触控装置
TWI769817B (zh) * 2021-05-17 2022-07-01 友達光電股份有限公司 顯示裝置及其製造方法
CN113299862B (zh) * 2021-06-30 2025-10-21 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN115777092A (zh) * 2021-07-06 2023-03-10 京东方科技集团股份有限公司 显示面板及显示装置
CN113517328B (zh) * 2021-07-12 2024-06-18 京东方科技集团股份有限公司 一种显示面板以及显示装置
CN113611729B (zh) * 2021-08-05 2024-05-28 京东方科技集团股份有限公司 显示面板及显示装置
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CN114220821B (zh) * 2021-12-13 2023-07-25 武汉华星光电半导体显示技术有限公司 显示面板
CN114361220B (zh) * 2021-12-30 2025-08-26 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
JP7783768B2 (ja) * 2022-03-25 2025-12-10 株式会社Magnolia White 表示装置
KR20230144699A (ko) * 2022-04-07 2023-10-17 삼성디스플레이 주식회사 표시 장치
CN114975477B (zh) * 2022-04-20 2025-03-04 京东方科技集团股份有限公司 显示面板、显示面板的制造方法以及显示装置
US20250024733A1 (en) * 2022-05-26 2025-01-16 Chengdu Boe Optoelectronics Technology Co., Ltd. Display panel and display device
CN115394821B (zh) * 2022-09-06 2024-08-02 厦门天马显示科技有限公司 一种显示面板及显示装置
KR20240056896A (ko) * 2022-10-21 2024-05-02 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조방법
CN116013937B (zh) * 2023-01-03 2026-01-02 京东方科技集团股份有限公司 显示面板及显示装置
CN119233708B (zh) * 2023-06-30 2026-03-03 合肥维信诺科技有限公司 显示面板及显示装置
CN117794289A (zh) * 2023-12-26 2024-03-29 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN119630192B (zh) * 2024-11-29 2026-04-24 昆山国显光电有限公司 显示模组和显示装置
CN119987591A (zh) * 2025-02-12 2025-05-13 京东方科技集团股份有限公司 触控显示基板及其制造方法、触控方法、装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160140080A (ko) * 2015-05-29 2016-12-07 엘지디스플레이 주식회사 유기 발광 표시 장치
CN107123667A (zh) * 2017-06-28 2017-09-01 京东方科技集团股份有限公司 柔性阵列基板及其制作方法、柔性显示器
CN107180852A (zh) * 2017-05-18 2017-09-19 上海天马有机发光显示技术有限公司 一种触控显示面板及显示装置
CN107706220A (zh) * 2017-09-28 2018-02-16 上海天马微电子有限公司 柔性显示面板及其制作方法和显示装置
CN108417608A (zh) * 2018-03-28 2018-08-17 上海天马微电子有限公司 一种柔性显示面板及显示装置
CN108711577A (zh) * 2018-05-24 2018-10-26 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
US20180315951A1 (en) * 2017-04-26 2018-11-01 Samsung Display Co., Ltd. Display apparatus and method of manufaturing the display apparatus
CN110197845A (zh) * 2019-06-20 2019-09-03 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法
CN111710712A (zh) * 2020-08-17 2020-09-25 京东方科技集团股份有限公司 显示面板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102176719B1 (ko) 2013-10-14 2020-11-10 삼성디스플레이 주식회사 플렉서블 표시판 및 그 제조 방법
KR102396296B1 (ko) * 2015-03-06 2022-05-11 삼성디스플레이 주식회사 유기발광 디스플레이 장치 및 그 제조방법
TWI740908B (zh) 2016-03-11 2021-10-01 南韓商三星顯示器有限公司 顯示設備
CN106252526B (zh) 2016-09-22 2018-03-16 上海天马微电子有限公司 一种有机发光显示面板以及制作方法
CN107591498B (zh) * 2017-08-31 2019-05-10 京东方科技集团股份有限公司 Oled显示面板及其制作方法、oled显示装置
CN109935615B (zh) 2017-12-15 2021-02-26 京东方科技集团股份有限公司 基板及其制备方法、显示面板
JP7032173B2 (ja) * 2018-02-27 2022-03-08 株式会社ジャパンディスプレイ 表示装置
JP2019168642A (ja) * 2018-03-26 2019-10-03 株式会社ジャパンディスプレイ 電気光学装置
CN208478340U (zh) 2018-06-30 2019-02-05 云谷（固安）科技有限公司 显示面板和显示器件
KR102661469B1 (ko) * 2018-09-11 2024-04-29 삼성디스플레이 주식회사 표시 패널
KR102626223B1 (ko) * 2018-10-26 2024-01-17 삼성디스플레이 주식회사 표시 장치
CN109841752B (zh) * 2019-01-29 2021-09-28 云谷（固安）科技有限公司 显示面板及显示装置
CN110007802B (zh) 2019-04-15 2022-09-16 武汉天马微电子有限公司 显示面板和显示装置
KR102800614B1 (ko) * 2019-08-26 2025-04-25 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN110416435B (zh) 2019-08-28 2022-01-14 武汉天马微电子有限公司 有机发光显示面板和显示装置
CN110556060A (zh) * 2019-09-12 2019-12-10 昆山国显光电有限公司 显示面板及其制备方法、显示装置
CN111490181A (zh) * 2020-04-24 2020-08-04 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160140080A (ko) * 2015-05-29 2016-12-07 엘지디스플레이 주식회사 유기 발광 표시 장치
US20180315951A1 (en) * 2017-04-26 2018-11-01 Samsung Display Co., Ltd. Display apparatus and method of manufaturing the display apparatus
CN107180852A (zh) * 2017-05-18 2017-09-19 上海天马有机发光显示技术有限公司 一种触控显示面板及显示装置
CN107123667A (zh) * 2017-06-28 2017-09-01 京东方科技集团股份有限公司 柔性阵列基板及其制作方法、柔性显示器
CN107706220A (zh) * 2017-09-28 2018-02-16 上海天马微电子有限公司 柔性显示面板及其制作方法和显示装置
CN108417608A (zh) * 2018-03-28 2018-08-17 上海天马微电子有限公司 一种柔性显示面板及显示装置
CN108711577A (zh) * 2018-05-24 2018-10-26 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN110197845A (zh) * 2019-06-20 2019-09-03 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法
CN111710712A (zh) * 2020-08-17 2020-09-25 京东方科技集团股份有限公司 显示面板

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CN112563309A (zh) 2021-03-26
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JP7736564B2 (ja) 2025-09-09
JP2023538977A (ja) 2023-09-13
EP4006987A1 (en) 2022-06-01
EP4006987A4 (en) 2022-11-30
CN111710712A (zh) 2020-09-25
CN112563309B (zh) 2024-06-28
BR112021016853A2 (pt) 2022-05-17
US20230180584A1 (en) 2023-06-08
US11832501B2 (en) 2023-11-28
EP4006987B1 (en) 2026-01-28
AU2021215098A1 (en) 2022-03-03
CN111710712B (zh) 2021-01-22

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