WO2022033256A1 - 一种pcb台阶槽底部做沉镍金的加工方法 - Google Patents

一种pcb台阶槽底部做沉镍金的加工方法 Download PDF

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WO2022033256A1
WO2022033256A1 PCT/CN2021/105724 CN2021105724W WO2022033256A1 WO 2022033256 A1 WO2022033256 A1 WO 2022033256A1 CN 2021105724 W CN2021105724 W CN 2021105724W WO 2022033256 A1 WO2022033256 A1 WO 2022033256A1
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core board
pcb
board
gold
immersion
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PCT/CN2021/105724
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English (en)
French (fr)
Inventor
吴发夫
陈世金
梁鸿飞
郭茂桂
韩志伟
叶新锦
徐缓
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博敏电子股份有限公司
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Priority to KR1020227005083A priority Critical patent/KR20220035453A/ko
Priority to JP2022510819A priority patent/JP7256927B2/ja
Publication of WO2022033256A1 publication Critical patent/WO2022033256A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Definitions

  • the invention relates to a PCB processing technology, in particular to a processing method for making immersion nickel gold at the bottom of a PCB stepped groove.
  • the processing technology of different manufacturers in the industry is different: one type is mechanically controlled depth milling.
  • the other category is the filled/embedded gasket platen.
  • the production of the stepped plate mainly depends on the control method of the amount of glue flowing, the reliability of the graphics and holes near the stepped groove, and the above two processing methods can be used.
  • the shape of the stepped groove can be realized, but it cannot meet the needs of the PAD at the bottom of the PCB stepped groove to be electroless nickel gold.
  • the purpose of the present invention is to provide a processing method for immersing nickel gold at the bottom of a PCB stepped groove, so as to solve the problems existing in the above-mentioned prior art.
  • the first core board and the second core board are respectively made of inner layer graphics, and then the following steps are performed: the first core board is used as a selective immersion immersion method. Gold treatment, pre-controlled deep electric milling blind slot treatment for the second core board; browning treatment for the first core board and second core board respectively; pp composite layer for electric milling through-slot treatment; The positions of the through grooves of the immersion gold PAD and the pp composite layer and the blind grooves of the second core board correspond to the positions; the first core board, the pp composite layer and the second core board are laminated and laminated in sequence to obtain the PCB inner board; The inner board is post-processed; the second core board is subjected to depth-controlling and electric milling processing, so that the immersion gold PAD of the first core board is exposed.
  • the steps of the first core board for selective immersion gold treatment are as follows: the first core board is successively screen-printed and chemically selected wet film, pre-baking, selective exposure, and development to obtain the PAD to be immersed gold; Parts are covered with selective ink; chemically immersed nickel-gold and de-filming are sequentially performed on the PAD to obtain a first core board with immersion gold PAD.
  • the steps of performing pre-controlled deep electric milling blind groove processing on the second core board are as follows: target the second core board and measure the expansion and shrinkage data; One side of the board is pre-placed with blind groove electro-milling data, and mirror-controlled deep electro-milling blind grooves are performed according to the blind groove electro-milling data.
  • the steps of performing electric milling through groove processing on the pp composite layer are: processing a plurality of pp sheets with FR4 light plates, positioning and stacking; Pre-amplify the size of the through slot according to the amount of pp overflowing glue; adjust the electric milling parameters to control the temperature of the electric milling process to be lower than the resin curing temperature of pp; perform electric milling according to the through slot electric milling data.
  • the first core board, the pp composite layer and the second core board are laminated and laminated in turn to obtain the inner board of the PCB, and the expansion and contraction data of the first core board are measured, and the Match the expansion and contraction data.
  • the steps of performing the electric milling process on the second core board by controlling the depth and uncovering the cover are: measuring the expansion and shrinkage data of the post-processed PCB inner board, and according to the expansion and contraction data of the PCB inner board, the second core board is far away from the first core board.
  • the electric milling data for uncovering the cover is issued, and the electric milling is carried out according to the electric milling data for uncovering the cover.
  • the method for processing the bottom of the PCB stepped groove as immersion nickel gold has the advantages of not only accurately controlling the depth of the stepped groove, but also avoiding the problem of residual glue at the bottom of the stepped groove, and at the same time meeting the requirements of the PCB stepped groove
  • the PAD at the bottom is required for electroless nickel gold. According to the detailed steps of the present invention, there is no particularly high standard requirement for equipment, it is suitable for the existing conditions of general factories, and mass production can be realized without adding other equipment.
  • Fig. 1 is the schematic flow chart of the processing method of the present invention
  • FIG. 2 is a schematic diagram of the structure of the PCB inner plate produced by the processing method of the present invention.
  • the first core board corresponding to the bottom of the step groove is first selected for immersion nickel gold, and the second core board corresponding to the step groove body is first selected.
  • the core board is mirrored and pre-controlled deep electric milling blind grooves, and at the same time, PP with low flow glue is prepared, and the electric milling through grooves are first positioned to obtain the PP composite layer.
  • lamination is carried out, and a PP composite layer is placed between the first core board and the second core board, and is produced according to the conventional process after pressing.
  • the final product forms a step groove, and realizes the PAD immersion nickel gold at the bottom of the PCB step groove.
  • the first core board and the second core board are both inner-layer core boards of the PCB board.
  • 3 sets of X-RAY targets are designed for the inner layer graphics for later processing and positioning. According to the design, the first core board 10 and the second core board 20 with the inner layer etched are fabricated.
  • the first core board is subjected to selective immersion gold treatment: the surface of the first core board after the inner layer etched by the screen printing wet film is pre-baked and selectively exposed. After development, the PAD that needs to be immersed in gold is exposed. The other positions of the board surface are covered with selective ink, chemically immersed in nickel and gold, and then dried on the leg film to obtain the first core board with the immersion gold PAD 11.
  • the second core board is pre-controlled deep electric milling blind groove treatment: the inner layer of the second core board is etched and then targeted, and the expansion and shrinkage data are measured. According to the expansion and contraction data of the second core board, the blind groove electric milling material 32 is pre-placed on the side of the second core board facing the first core board.
  • the board is mirror-controlled deep electric milling blind grooves to obtain a second core board with blind grooves.
  • the pp composite layer is processed by electric milling through grooves: use the cut PP to separate the FR4 light board, and then drill the positioning holes on the edge of the board.
  • the electric milling data 21 of the electric milling of the through grooves must be pre-amplified and enlarged according to the amount of the overflowing glue of the PP, so as to avoid the overflow of the glue on the PAD during pressing.
  • the electric milling parameters are lowered to avoid high temperature during electric milling to cure the resin on the edge of the PP groove.
  • the thicker FR4 light board is used as the bottom plate on the electric milling machine table, and the FR4 light board is also used for the electric milling cover plate.
  • auxiliary materials such as cardboard and aluminum sheets cannot be used to avoid paper and aluminum scraps generated during electric milling from sticking to PP.
  • the above electric milling of the through-slot is completed to obtain the to-be-stacked board of the PP composite layer 20 .
  • the first core board and the second core board are respectively browned to be stacked.
  • the first core board, the PP composite layer, and the second core board are stacked by means of hot melting and rivets. Before stacking the boards, the positions of the immersion gold PAD of the first core board, the through grooves of the pp composite layer and the blind grooves of the second core board are made corresponding.
  • the target is first shot, and the expansion and contraction data are measured.
  • the electric milling material 31 is issued on the side of the second core board away from the first core board and at a position corresponding to the immersion gold PAD.
  • the finished step PCB inner board is obtained, and the PAD immersion nickel-gold process at the bottom of the step groove is realized.
  • the method of the invention is to make immersion nickel gold on the PAD at the bottom of the step groove of the PCB board.
  • the invention not only accurately controls the depth of the step groove, but also avoids the problem of residual glue at the bottom of the step groove, and also meets the requirement of the PAD at the bottom of the PCB step groove being made of chemical nickel gold;
  • the requirements of particularly high standards are suitable for the existing conditions of general factories, and mass production can be realized without the need to purchase other equipment.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本发明公开一种PCB台阶槽底部做沉镍金的加工方法，对第一芯板做选化沉金处理、第二芯板做预控深电铣盲槽处理；第一芯板和第二芯板分别做棕化处理；pp复合层做电铣通槽处理；使第一芯板的沉金PAD、pp复合层的通槽以及第二芯板的盲槽位置对应；依次层叠压合第一芯板、pp复合层及第二芯板得PCB内板；对PCB内板进行后处理；对第二芯板进行控深揭盖电铣处理，使第一芯板的沉金PAD露出。优点在于，精准控制到台阶槽的深度，避免台阶槽底残胶的问题，满足PCB台阶槽底部的PAD做化学镍金的需求。按照本发明的详细步骤加工，对设备没有特别高标准的要求，适合一般工厂的已有条件，无需添置其他设备便可实现批量生产。

Description

一种PCB台阶槽底部做沉镍金的加工方法 技术领域
本发明涉及PCB加工工艺，尤其涉及一种PCB台阶槽底部做沉镍金的加工方法。
背景技术
针对PCB台阶槽底部做沉镍金，业内不同厂家加工技术有所不同：一大类是机械控深铣板，对于控深铣板方式制作阶梯板主要依赖阶梯槽深度控制要求和制作能力。另一大类是填充/埋入垫片压板，对于填充/埋入垫片压板方式制作阶梯板主要依赖流胶量的控制方法、阶梯槽附近图形和孔的可靠性，以上两种加工方式可以实现台阶槽的形状，但并不能满足PCB台阶槽底部的PAD做化学镍金的需求。
发明内容
本发明目的在于提供一种PCB台阶槽底部做沉镍金的加工方法，以解决上述现有技术存在的问题。
本发明所述的一种PCB台阶槽底部做沉镍金的加工方法，先对第一芯板和第二芯板分别进行内层图形制作，再进行以下步骤：第一芯板做选化沉金处理、第二芯板做预控深电铣盲槽处理；所述第一芯板和第二芯板分别做棕化处理；pp复合层做电铣通槽处理；使第一芯板的沉金PAD、pp复合层的通槽以及第二芯板的盲槽位置对应；依次层叠压合所述的第一芯板、pp复合层及第二芯板得到PCB内板；对所述PCB内板进行后处理；对第二芯板进行控深揭盖电铣处理，使第一芯板的沉金PAD露出。
所述第一芯板做选化沉金处理的步骤为：对第一芯板依次进行丝印选化湿膜、预烘烤、选化曝光、显影得到待沉金的PAD；所述PAD外的部位覆盖选化油墨；对所述PAD依次进行化学沉鎳金、退膜烘干；得到具有沉金PAD的第一芯板。
所述第二芯板做预控深电铣盲槽处理的步骤为：对第二芯板进行打靶并测量涨缩数据，根据第二芯板的涨缩数据对第二芯板面向第一芯板的一侧预放盲槽电铣资料，根据所述盲槽电铣资料进行镜像控深电铣盲槽。
所述pp复合层做电铣通槽处理的步骤为：将多张pp进行隔FR4光板处理、定位层叠；根据第二芯板的涨缩数据对pp复合层预放通槽电铣资料，并且根据pp的溢胶量对通槽尺寸进行预放加大；下调电铣参数控制电铣过程的温度低于pp的树脂固化温度；根据通槽电铣资料进行电铣。
依次层叠压合所述的第一芯板、pp复合层及第二芯板得到PCB内板之前先测量所述第一芯板的涨缩数据，并确认第一芯板与第二芯板的涨缩数据相匹配。
对第二芯板进行控深揭盖电铣处理的步骤为：对经过后处理的PCB内板测量涨缩数据，根据PCB内板的涨缩数据在第二芯板远离第一芯板的一侧且与沉金PAD对应的位置发放揭盖电铣资料，根据所述揭盖电铣资料进行电铣。
本发明所述的一种PCB台阶槽底部做沉镍金的加工方法，其优点在于，不但精准控制到台阶槽的深度，还避免了台阶槽底残胶的问题，同时还满足了PCB台阶槽底部的PAD做化学镍金的需求。按照本发明的详细步骤加工，对设备没有特别高标准的要求，适合一般工厂的已有条件，无需添置其他设备便可实现批量生产。
附图说明
图1是本发明所述加工方法的流程示意图；
图2是本发明所述加工方法生产得到的PCB内版结构示意图。
10-第一芯板、11-沉金PAD；20-pp复合层、21-通槽电铣资料；30-第二芯板、31-揭盖电铣资料、32-盲槽电铣资料；40-通孔。
具体实施方式
本发明所述的一种PCB台阶槽底部做沉镍金的加工方法在多层板压合前，台阶槽底部对应的第一芯板先进行选化沉镍金，台阶槽体对应的第二芯板做镜像预控深电铣盲槽，同时准备低流胶的PP并先定位电铣通槽得到PP复合层。然后进行叠板，第一芯板与第二芯板之间放置PP复合层，压合后按常规流程生产。做到表面处理之后进行控深揭盖电铣、电铣外形，最终成品形成台阶槽，实现PCB台阶槽底部的PAD沉镍金。其中第一芯板和第二芯板均为PCB板的内层芯板。
具体流程和产品结构如图1、图2所示。
首先进行内层图形制作：内层图形设计3组X-RAY靶标，供后面加工定位使用。按照设计制作出内层蚀刻后的第一芯板10及第二芯板20。
将第一芯板做选化沉金处理：丝印选化湿膜在内层蚀刻后的第一芯板表面，经过预烘烤，进行选化曝光，显影之后露出需要做沉金的PAD。板面其他位置覆盖选化油墨，进行化学沉镍金，再进行腿膜烘干，得到设有沉金PAD 11的第一芯板。
将第二芯板做预控深电铣盲槽处理：将第二芯板内层蚀刻后进行打靶，并测量涨缩数据。根据第二芯板的涨缩数据对第二芯板面向第一芯板的一侧预放盲槽电铣资料 32，电铣机台整平性和Z轴进度确认OK后，将第二芯板做镜像控深电铣盲槽，得到设有盲槽的第二芯板。
pp复合层做电铣通槽处理：利用裁切后的多张PP进行隔FR4光板处理，然后钻板边定位孔。根据第二芯板的涨缩数据预放通槽电铣资料21，电铣通槽尺寸必须根据PP的溢胶量进行预放加大，避免压合时溢胶上PAD。电铣参数下调，避免电铣时产生高温将PP槽边缘树脂固化。电铣机台上使用较厚的FR4光板做底板，电铣盖板也使用FR4光板。在这个过程中不能使用纸板、铝片之类的辅助材料，避免在电铣时产生的纸屑和铝屑粘在PP上。以上电铣通槽完成得到PP复合层20的待叠板。
然后分别将第一芯板和第二芯板做棕化待叠板。
测量第一芯板的涨缩数据，确认与第二芯板的涨缩数据相匹配后，将第一芯板、第二芯板进行配套。再将第一芯板、PP复合层、第二芯板进行热熔和铆钉的方式叠板。叠板前使第一芯板的沉金PAD、pp复合层的通槽以及第二芯板的盲槽位置相对应。
将叠好的板进行压合，压合后打靶，铣边后得到PCB内板。
最后将PCB内板依次进行钻通孔40、沉铜、电镀、外层线路、外层蚀刻、阻焊、文字、表面处理等常规的后处理操作。
PCB内板在经过表面处理后，先进行打靶，并测量涨缩数据。根据PCB内板的涨缩数据在第二芯板远离第一芯板的一侧且与沉金PAD对应的位置发放揭盖电铣资料31。控深揭盖电铣前需要确认电铣机台平整性以及Z轴精度，避免控深过度损伤台阶底部PAD，然后进行控深揭盖电铣以及电铣外形。最终得到成品台阶PCB内板，实现台阶槽底部PAD沉镍金工艺。
本发明方法为在PCB板的台阶槽底部的PAD上做沉镍金，其成品经过冷热冲击试验、高温测试、低温测试、高温高湿测试、机械振动测试等多种可靠性测试无异常。本发明不但精准控制到台阶槽的深度，还避免了台阶槽底残胶的问题，同时还满足了PCB台阶槽底部的PAD做化学镍金的需求；按照本发明的详细步骤加工，对设备没有特别高标准的要求，适合一般工厂的已有条件，无需添置其他设备便可实现批量生产。
对于本领域的技术人员来说，可根据以上描述的技术方案以及构思，做出其它各种相应的改变以及形变，而所有的这些改变以及形变都应该属于本发明权利要求的保护范围之内。

Claims (5)

  1. 一种PCB台阶槽底部做沉镍金的加工方法，先对第一芯板和第二芯板分别进行内层图形制作，其特征在于，再进行以下步骤：第一芯板做选化沉金处理、第二芯板做预控深电铣盲槽处理；所述第一芯板和第二芯板分别做棕化处理；pp复合层做电铣通槽处理；所述第一芯板做选化沉金处理的步骤为：对第一芯板依次进行丝印选化湿膜、预烘烤、选化曝光、显影得到待沉金的PAD；所述PAD外的部位覆盖选化油墨；对所述PAD依次进行化学沉鎳金、退膜烘干；得到具有沉金PAD的第一芯板；使第一芯板的沉金PAD、pp复合层的通槽以及第二芯板的盲槽位置对应；依次层叠压合所述的第一芯板、pp复合层及第二芯板得到PCB内板；对所述PCB内板进行后处理；对第二芯板进行控深揭盖电铣处理，使第一芯板的沉金PAD露出。
  2. 根据权利要求1所述PCB台阶槽底部做沉镍金的加工方法，其特征在于，所述第二芯板做预控深电铣盲槽处理的步骤为：对第二芯板进行打靶并测量涨缩数据，根据第二芯板的涨缩数据对第二芯板面向第一芯板的一侧预放盲槽电铣资料，根据所述盲槽电铣资料进行镜像控深电铣盲槽。
  3. 根据权利要求2所述PCB台阶槽底部做沉镍金的加工方法，其特征在于，所述pp复合层做电铣通槽处理的步骤为：将多张pp进行隔FR4光板处理、定位层叠；根据第二芯板的涨缩数据对pp复合层预放通槽电铣资料，并且根据pp的溢胶量对通槽尺寸进行预放加大；下调电铣参数控制电铣过程的温度低于pp的树脂固化温度；根据通槽电铣资料进行电铣。
  4. 根据权利要求3所述PCB台阶槽底部做沉镍金的加工方法，其特征在于，依次层叠压合所述的第一芯板、pp复合层及第二芯板得到PCB内板之前先测量所述第一芯板的涨缩数据，并确认第一芯板与第二芯板的涨缩数据相匹配。
  5. 根据权利要求1所述PCB台阶槽底部做沉镍金的加工方法，其特征在于，对第二芯板进行控深揭盖电铣处理的步骤为：对经过后处理的PCB内板测量涨缩数据，根据PCB内板的涨缩数据在第二芯板远离第一芯板的一侧且与沉金PAD对应的位置发放揭盖电铣资料，根据所述揭盖电铣资料进行电铣。
PCT/CN2021/105724 2020-08-14 2021-07-12 一种pcb台阶槽底部做沉镍金的加工方法 WO2022033256A1 (zh)

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