JP7256927B2 - Ｐｃｂ段差溝底部に無電解ニッケル置換金メッキを行う加工方法 - Google Patents

Ｐｃｂ段差溝底部に無電解ニッケル置換金メッキを行う加工方法 Download PDF

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JP7256927B2
JP7256927B2 JP2022510819A JP2022510819A JP7256927B2 JP 7256927 B2 JP7256927 B2 JP 7256927B2 JP 2022510819 A JP2022510819 A JP 2022510819A JP 2022510819 A JP2022510819 A JP 2022510819A JP 7256927 B2 JP7256927 B2 JP 7256927B2
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Japan
Prior art keywords
core board
electric milling
board
pcb
groove
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Japanese (ja)
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JP2022547264A (ja
Inventor
▲呉▼▲発▼夫
▲陳▼世金
梁▲鴻▼▲飛▼
郭茂桂
▲韓▼志▲偉▼
叶新▲錦▼
徐▲緩▼
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博敏▲電▼子股▲分▼有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP2022510819A 2020-08-14 2021-07-12 Ｐｃｂ段差溝底部に無電解ニッケル置換金メッキを行う加工方法 Active JP7256927B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202010815413.0A CN111741618B (zh) 2020-08-14 2020-08-14 一种pcb台阶槽底部做沉镍金的加工方法
CN202010815413.0 2020-08-14
PCT/CN2021/105724 WO2022033256A1 (zh) 2020-08-14 2021-07-12 一种pcb台阶槽底部做沉镍金的加工方法

Publications (2)

Publication Number Publication Date
JP2022547264A JP2022547264A (ja) 2022-11-11
JP7256927B2 true JP7256927B2 (ja) 2023-04-12

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JP2022510819A Active JP7256927B2 (ja) 2020-08-14 2021-07-12 Ｐｃｂ段差溝底部に無電解ニッケル置換金メッキを行う加工方法

Country Status (4)

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JP (1) JP7256927B2 (zh)
KR (1) KR20220035453A (zh)
CN (1) CN111741618B (zh)
WO (1) WO2022033256A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111741618B (zh) * 2020-08-14 2020-11-24 博敏电子股份有限公司 一种pcb台阶槽底部做沉镍金的加工方法
CN112770540B (zh) * 2020-12-05 2022-10-04 深圳市辉煌线路板有限公司 一种台阶位置含邦定结构的厚铜pcb板的加工方法
CN112752443A (zh) * 2020-12-05 2021-05-04 深圳市强达电路有限公司 一种台阶位置含邦定结构的印制电路板的加工方法
CN114375092B (zh) * 2021-12-27 2023-04-07 珠海杰赛科技有限公司 一种具有盐雾测试要求的盲槽板及其制作方法
CN114585152A (zh) * 2022-03-30 2022-06-03 生益电子股份有限公司 一种印制电路板及其制备方法

Citations (4)

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JP4188697B2 (ja) 2001-03-31 2008-11-26 ハイダック テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング ハイドロニューマチック圧力貯蔵器
JP2009158815A (ja) 2007-12-27 2009-07-16 Fujitsu Ltd 多層配線基板の製造方法および多層配線基板構造
CN103929884A (zh) 2013-01-16 2014-07-16 深圳市牧泰莱电路技术有限公司 一种具有台阶槽孔的印刷电路板的制作方法
CN109413893A (zh) 2018-10-30 2019-03-01 珠海杰赛科技有限公司 一种盲槽印制电路板的层压阻胶方法及印制电路板

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JPS60200968A (ja) * 1984-03-27 1985-10-11 Toshiba Corp 無電解めつき方法
JPH04188697A (ja) * 1990-11-19 1992-07-07 Mitsubishi Electric Corp 多層プリント配線板の製造方法
JPH0794628A (ja) * 1993-09-20 1995-04-07 Eastern:Kk 半導体搭載用の多層プリント配線板の製造方法
JPH08130373A (ja) * 1994-10-31 1996-05-21 Elna Co Ltd 電子部品搭載用基板の製造方法
CN101662888B (zh) * 2009-09-28 2011-02-16 深南电路有限公司 带有阶梯槽的pcb板的制备方法
CN101845622B (zh) * 2010-06-01 2012-11-14 深南电路有限公司 盲孔板化学沉镍金方法
CN102469689B (zh) * 2010-11-15 2013-05-08 深南电路有限公司 Pcb台阶板制造工艺
US9161461B2 (en) * 2012-06-14 2015-10-13 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structure with stepped holes
CN103517560B (zh) * 2012-06-27 2017-02-15 深南电路有限公司 一种pcb板台阶槽的加工方法
CN104363720B (zh) * 2014-10-21 2017-08-11 深圳崇达多层线路板有限公司 一种在pcb中制作深盲槽的方法
CN104507261B (zh) * 2014-12-18 2017-10-27 安徽四创电子股份有限公司 一种含有台阶槽的微波印制板的制作方法
CN105657976A (zh) * 2016-01-19 2016-06-08 深圳崇达多层线路板有限公司 一种整板沉镍金阶梯板的制作方法
CN105813393B (zh) * 2016-03-21 2019-05-21 东莞美维电路有限公司 选择性沉金板制作方法
KR101822849B1 (ko) * 2016-06-01 2018-01-30 주식회사 디에이피 어큐뮬레이터
CN111741618B (zh) * 2020-08-14 2020-11-24 博敏电子股份有限公司 一种pcb台阶槽底部做沉镍金的加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4188697B2 (ja) 2001-03-31 2008-11-26 ハイダック テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング ハイドロニューマチック圧力貯蔵器
JP2009158815A (ja) 2007-12-27 2009-07-16 Fujitsu Ltd 多層配線基板の製造方法および多層配線基板構造
CN103929884A (zh) 2013-01-16 2014-07-16 深圳市牧泰莱电路技术有限公司 一种具有台阶槽孔的印刷电路板的制作方法
CN109413893A (zh) 2018-10-30 2019-03-01 珠海杰赛科技有限公司 一种盲槽印制电路板的层压阻胶方法及印制电路板

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KR20220035453A (ko) 2022-03-22
WO2022033256A1 (zh) 2022-02-17
CN111741618A (zh) 2020-10-02
JP2022547264A (ja) 2022-11-11
CN111741618B (zh) 2020-11-24

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