WO2022000704A1 - 印刷电路板匀液处理装置 - Google Patents
印刷电路板匀液处理装置 Download PDFInfo
- Publication number
- WO2022000704A1 WO2022000704A1 PCT/CN2020/107622 CN2020107622W WO2022000704A1 WO 2022000704 A1 WO2022000704 A1 WO 2022000704A1 CN 2020107622 W CN2020107622 W CN 2020107622W WO 2022000704 A1 WO2022000704 A1 WO 2022000704A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- positioning
- positioning wheel
- printed circuit
- circuit board
- wheel
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 57
- 230000007246 mechanism Effects 0.000 claims abstract description 260
- 238000000265 homogenisation Methods 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 15
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 12
- 238000011176 pooling Methods 0.000 abstract 1
- 239000003814 drug Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 9
- 230000005484 gravity Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 238000005507 spraying Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Definitions
- the application belongs to the technical field of printed circuit board processing equipment, and in particular relates to a device for uniform liquid treatment of printed circuit boards.
- the printed circuit board of the horizontal unit is placed horizontally on the conveying roller, and the surface of the printed circuit board directly contacts the conveying roller.
- the conveying The roller will form a roller mark on the board surface, or cause serious scratches to the board surface, or reverse the coating on the board surface, which will affect the processing effect of the printed circuit board. Therefore, the printed circuit board is placed horizontally for spraying or liquid treatment.
- the method requires relatively high equipment, which increases the production cost.
- the liquid medicine is easy to form a pool effect on the board surface (that is, water on the board area), which affects the processing of the printed circuit board and is prone to quality problems.
- the printed circuit board of the vertical unit is vertically clamped by the fixture and transported forward.
- the liquid medicine will flow downward with the action of gravity after being sprayed on the board surface, causing the upper part of the panel to flow downward.
- the purpose of the present application is to provide a printed circuit board homogenization treatment device, which aims to solve the technical problem of uneven surface treatment of the printed circuit board in the prior art with both horizontal and vertical units.
- a printed circuit board homogenization treatment device for processing printed circuit boards
- the printed circuit board homogenization treatment device includes a loading mechanism, a positioning mechanism and a driving mechanism, wherein,
- the loading mechanism is disc-shaped and is used for fixing the printed circuit board, and the rotation axis of the loading mechanism extends in the horizontal direction, so that the printed circuit board is vertically arranged;
- the positioning mechanism includes at least a first positioning wheel and a second positioning wheel.
- the rotation axis of the first positioning wheel and the rotation axis of the second positioning wheel both extend in the horizontal direction and are parallel to each other.
- the first positioning wheel and the second positioning wheel can jointly support the loading mechanism, the positioning mechanism can be switched between a first state and a second state, when the positioning mechanism is in the first state and the loading mechanism When the mechanism is placed on the first positioning wheel and the second positioning wheel, the loading mechanism is spaced from the driving mechanism.
- the driving mechanism can drive the loading mechanism to rotate around its central axis, and both the first positioning wheel and the second positioning wheel can follow It rotates with the rotation of the loading mechanism.
- the first positioning wheel and the second positioning wheel are on the same plane, and the rotation axis of the first positioning wheel is parallel to the central axis of the loading mechanism.
- the first positioning wheel can be switched between the first pending position and the first working position, the second positioning wheel can be switched between the second pending position and the second working position, when When the positioning mechanism is in the second state, the first positioning wheel is at the first working position and the second positioning wheel is at the second working position.
- the positioning mechanism when the positioning mechanism is in the first state, the first positioning wheel is in the first pending position and the second positioning wheel is in the second working position.
- the first working position is located above the first undetermined position
- the second working position is located above the second undetermined position
- the driving mechanism is located above the positioning mechanism
- the height of the first positioning wheel when it is in the first pending position is the same as the height of the second positioning wheel when it is in the second pending position, and the first positioning wheel The height when in the first working position is the same as the height when the second positioning wheel is in the second working position.
- the driving mechanism includes an active driving wheel, when the positioning mechanism is in the first state and the loading mechanism is placed on the first positioning wheel and the second positioning wheel , the loading mechanism is spaced from the driving wheel, when the positioning mechanism is in the second state and the loading mechanism is placed on the first positioning wheel and the second positioning wheel,
- the active driving wheel can interfere with the loading mechanism, and drive the loading mechanism to rotate through rotation.
- the driving mechanism further includes a driving motor and a conveyor belt, the conveyor belt is connected to the driving motor and the driving wheel, and the driving motor can drive the driving motor by driving the conveyor belt to move.
- the drive wheel turns.
- the printed circuit board homogenization treatment device further includes a limit wheel, the limit wheel can interfere with the loading mechanism when the positioning mechanism is in the second state, and can The loading plate rotates with the rotation, and the limiting wheel, the driving wheel, the first positioning wheel and the second positioning wheel can jointly limit the displacement of the loading mechanism.
- the printed circuit board homogenization treatment device further includes a first support slideway, and the first positioning wheel and the second positioning wheel are sequentially located in the extending direction of the first support slideway , the first support slideway is used to support the loading tray, the loading mechanism can roll along the extending direction of the first support slideway, when the positioning mechanism is in the first state, all the The loading mechanism can roll onto the first positioning wheel and the second positioning wheel from the first support slideway.
- the height of the first positioning wheel when in the first pending position is equal to or lower than the height of the end of the first support slideway close to the first positioning wheel.
- the first support slideway has a first inclined surface arranged at an angle with the horizontal plane, the loading mechanism is in conflict with the first inclined surface, and the first inclined surface is far away from the horizontal plane.
- the height of one end of the first positioning wheel is higher than the height of one end of the first inclined surface close to the first positioning wheel.
- the positioning mechanism further has a third state, when the positioning mechanism is in the third state, the first positioning wheel is in the first working position and the second positioning wheel in the second pending position.
- the printed circuit board homogenization treatment device further comprises a second support slideway, the second positioning wheel is located between the first positioning wheel and the second support slideway, the The second support slideway is used to support the loading tray, and the height of the second positioning wheel when in the second pending position is equal to or higher than that of the second support slideway near the second positioning wheel
- the positioning mechanism can be rolled from the positioning mechanism to the second support slideway, and along the second support slideway Scroll in extension direction.
- the second support slideway has a second inclined surface disposed at an angle with the horizontal plane, the loading mechanism is in conflict with the second inclined surface, and the second inclined surface is close to the second inclined surface.
- the height of one end of the second positioning wheel is higher than the height of one end of the second inclined surface away from the second positioning wheel.
- the loading mechanism includes a loading tray and a fixing member disposed on the loading tray and used for fixing the printed circuit board, and the driving mechanism is used for driving the loading tray to revolve around its center The axis rotates, and the central axis of the loading tray is perpendicular to the printed circuit board.
- the loading tray has a first side surface, a second side surface and an edge surface, the first side surface and the second side surface are arranged opposite to each other, and the edge surface circumferentially surrounds the first side surface and the second side surface And facing away from the central axis of the loading tray, when the loading mechanism is placed on the first positioning wheel and the second positioning wheel, the first positioning wheel and the second positioning wheel are against the edge surface.
- the loading tray is provided with a through hole disposed through the center axis thereof, and the fixing member is used for fixing the loading tray to the through hole, and the through hole avoids the place of the through hole. the printed circuit board.
- the printed circuit board homogenization treatment device further includes a liquid treatment mechanism for soaking the printed circuit board with liquid.
- the printed circuit board homogenization treatment device further includes an air jet mechanism for jetting the printed circuit board to dry the printed circuit board.
- the technical effect of the present application relative to the prior art is that the printed circuit board is vertically arranged through the fixing of the loading mechanism, and when the positioning mechanism is in the second state, the driving mechanism can drive the loading mechanism to rotate, and the first positioning wheel is connected to the second The positioning wheel can rotate with the rotation of the loading mechanism, realizing the rotation of the loading mechanism. At this time, the printed circuit board rotates with the rotation of the loading mechanism.
- the liquid medicine After the surface of the printed circuit board is soaked with the liquid medicine, the liquid medicine It will flow under the action of gravity or centrifugal force, the rotation of the printed circuit board can make the liquid medicine evenly distributed on the board surface, and the excess liquid medicine will drip or be thrown out, avoid the pool effect, and prevent the residual liquid medicine from causing the board surface
- the local area of the printed circuit board is excessively treated, and at the same time, the uneven treatment effect of the liquid medicine on the upper and lower parts of the board surface when the printed circuit board is vertical is avoided.
- FIG. 1 is a three-dimensional structural diagram of a printed circuit board homogenization treatment device provided by an embodiment of the present application, wherein an independent casing and a spray mechanism are not shown;
- FIG. 2 is a three-dimensional structural diagram of a printed circuit board homogenization treatment device provided by an embodiment of the present application, wherein an independent casing is not shown;
- FIG. 3 is a three-dimensional structural diagram of a device for homogenizing liquid treatment of a printed circuit board provided by an embodiment of the present application.
- the side located in the positive direction of the X axis is defined as the front, and the side located in the negative direction of the X axis is defined as the rear; the side located in the positive direction of the Y axis is defined as the rear;
- the side of y is defined as the left, the side in the negative direction of the Y-axis is defined as the right; the side in the positive direction of the Z-axis is defined as up, and the side in the negative direction of the Z-axis is defined as down.
- first”, “second” and “third” are used for descriptive purposes only, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second”, “third” may expressly or implicitly include one or more of that feature.
- “plurality” means two or more, unless otherwise expressly and specifically defined.
- the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of the two elements or the interaction relationship between the two elements.
- installed may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of the two elements or the interaction relationship between the two elements.
- the present application provides a printed circuit board homogenization treatment device for processing printed circuit boards.
- the printed circuit board is in a sheet shape and has a surface to be treated, wherein the printed circuit board may have a surface to be treated, or There are two opposing surfaces to be treated. It should be noted that this printed circuit board homogenization treatment device is especially used to treat the printed circuit board whose surface to be treated is to be soaked with the medicinal liquid or the printed circuit board that has been soaked with the medicinal liquid.
- the printed circuit board homogenization treatment device includes a loading mechanism 10 , a driving mechanism 30 and a positioning mechanism 20 .
- the loading mechanism 10 is used for fixing the printed circuit board, and the central axis of the loading mechanism 10 extends along the horizontal direction, so that the printed circuit board is arranged vertically. Perpendicular or approximately perpendicular to the horizontal plane.
- the surface to be processed of the printed circuit board may be flat or substantially flat.
- the loading mechanism 10 is in the shape of a disk, and it should be noted that the disk shape may refer to a regular disk shape or an elliptical disk shape.
- the central axis of the loading mechanism 10 is perpendicular to the surface to be processed of the printed circuit board.
- the loading mechanism 10 includes a loading tray 11 and a fixing member 12 disposed on the loading tray 11 and used for fixing the printed circuit board.
- the loading tray 11 is disc-shaped.
- the loading tray 11 has a first side surface, a second side surface and an edge surface.
- the first side surface and the second side surface are arranged opposite to each other, and can be arranged in parallel or approximately parallel.
- the center axis of the loading tray 11 is the center axis of the loading mechanism 10 , and the edge surface circumferentially surrounds the first side surface and the second side surface and faces away from the center axis.
- both the first side surface and the second side surface are perpendicular to the horizontal plane, so that the edge surfaces have the same width.
- the fixing member 12 can tension the printed circuit board and make it flat, so as to avoid grooves on the surface to be treated, which will affect the flow of the liquid medicine on the printed circuit board.
- the fixing member 12 includes a plurality of fixing fixtures connected to the material carrier tray 11 , and the plurality of fixing fixtures are arranged along the circumferential direction of the printed circuit board to uniformly fix the printed circuit board.
- the fixing member 12 can hang the printed circuit board in the air, or the printed circuit board can be attached to the first side or the second side of the loading tray 11 with the surface to be processed facing outwards, so as to facilitate the processing of the liquid medicine.
- the loading tray 11 is provided with a through hole 101 extending through the rotation axis.
- the fixing member 12 is used to fix the printed circuit board to the through hole 101 , and the through hole 101 avoids the surface to be processed. In this way, the two to-be-processed surfaces of the printed circuit board are not shielded and touched by the loading tray 11 , which facilitates other processing procedures on the printed circuit board in the later stage.
- the loading tray 11 is also provided with an escape hole 102 , so as to facilitate the taking and hanging of the loading tray 11 by external equipment. It should be noted that, in this embodiment, the rotation of the loading tray 11 refers to the rotation of the loading tray 11 around its central axis.
- the positioning mechanism 20 includes at least a first positioning wheel 21 and a second positioning wheel 22.
- the positioning mechanism 20 only includes a first positioning wheel 21 and a second positioning wheel 22.
- the positioning mechanism 20 may also include other positioning wheels capable of positioning the loading tray 11 .
- the rotation axis of the first positioning wheel 21 and the rotation axis of the second positioning wheel 22 both extend in the horizontal direction and are parallel to each other.
- the first positioning wheel 21 and the second positioning wheel 22 can jointly support the material loading mechanism 10 .
- the loading tray 11 can be placed on the first positioning wheel 21 and the second positioning wheel 22, that is, the edge surface of the loading tray 11 can be in contact with the first positioning wheel 21 and the second positioning wheel 22.
- the first positioning wheel 21 and the second positioning wheel 22 are located on the same plane
- the rotation axis of the first positioning wheel 21 is parallel to the central axis of the loading mechanism 10 to facilitate the alignment and rotation of the loading tray 11 .
- the first positioning wheel 21 and the second positioning wheel 22 may not be located on the same plane.
- the positioning mechanism 20 can be switched between the first state and the second state.
- the loading mechanism 10 When the loading mechanism 10 is placed on the first positioning wheel 21 and the second positioning wheel 22, when the positioning mechanism 20 is in the first state, the loading mechanism 10 is spaced from the driving mechanism, that is, the loading mechanism 10 is not affected by the Driving or control of the driving mechanism 30; when the positioning mechanism 20 is in the second state, the driving mechanism 30 can drive the loading mechanism 10 to rotate around its central axis, that is, the first positioning wheel 21 when the positioning mechanism 20 is in the second state Together with the second positioning wheel 22 , the loading tray 11 can be brought into contact with the driving mechanism 30 , so that the driving mechanism 30 can drive the loading tray 11 to rotate.
- both the first positioning wheel 21 and the second positioning wheel 22 can rotate with the rotation of the loading mechanism 10, that is, the first positioning wheel 21 and the second positioning wheel 22 are both loading materials The driven wheel of the disc 11.
- the positioning mechanism 20 when the positioning mechanism 20 is in the second state, the first positioning wheel 21 and the second positioning wheel 22 can position the loading tray 11 to limit its radial movement, or, the first positioning wheel 21 and the second positioning wheel 22
- the two positioning wheels 22 and the driving mechanism 30 jointly position the loading tray 11 to limit its radial movement.
- the position of the driving mechanism 30 may be fixed, or the position may be moved to contact or separate from the loading tray 11 .
- the printed circuit board is vertically arranged by the fixing of the loading mechanism 10.
- the driving mechanism 30 can drive the loading mechanism 10 to rotate, and the first positioning wheel 21 and the second positioning wheel 22 can follow the loading mechanism.
- the rotation of the feeding mechanism 10 realizes the rotation of the feeding mechanism 10.
- the printed circuit board rotates with the rotation of the feeding mechanism 10. After the surface of the printed circuit board is soaked with the liquid medicine, the liquid medicine will be in the gravity.
- the rotation of the printed circuit board can make the liquid medicine evenly distributed on the board surface, and the excess liquid medicine will drip or be thrown out, avoid the pool effect, and prevent the residual liquid medicine from causing the local area of the board surface Excessive treatment, while avoiding the uneven treatment effect of the liquid medicine on the upper and lower parts of the board surface when the printed circuit board is vertical.
- the first positioning wheel 21 can be switched between the first pending position and the first working position, and the second positioning wheel 22 can be switched between the second pending position and the second working position.
- the positioning mechanism 20 is in the second state
- the first positioning wheel 21 is at the first working position and the second positioning wheel 22 is at the second working position. That is to say, when the positioning mechanism 20 is switched between the first state and the second state, the first positioning wheel 21 is switched between the first pending position and the first working position, and/or the second positioning wheel 22 is in the first position. Switch between the second pending position and the second working position.
- the loading tray 11 also changes its position to achieve contact with or separation from the driving mechanism 30 .
- the first positioning wheel 21 when the positioning mechanism 20 is in the first state, the first positioning wheel 21 is at the first pending position and the second positioning wheel 22 is at the second pending position. That is to say, when the positioning mechanism 20 is switched from the first state to the second state, the first positioning wheel 21 is switched from the first pending position to the first working position, and the second positioning wheel 22 is switched from the second pending position to the second The working position is to change the position of the loading tray 11 so that it is in contact with the driving mechanism 30 .
- the positioning mechanism 20 when the positioning mechanism 20 is in the first state, the first positioning wheel 21 is at the first pending position and the second positioning wheel 22 is at the second working position. That is, when the positioning mechanism 20 is switched from the first state to the second state, the first positioning wheel 21 is switched from the first pending position to the first working position, and the second positioning wheel 22 remains in the second working position. In this way, the loading tray 11 can be moved to a position in contact with the driving mechanism 30 by the position switching of the first positioning wheel 21 , and the second positioning wheel 22 plays a limiting role.
- the first working position is located above the first undetermined position
- the second working position is located above the second undetermined position
- the driving mechanism 30 is located above the positioning mechanism 20 .
- the positioning mechanism 20 can lift up the loading tray 11 to contact the driving mechanism 30.
- the positioning mechanism 20 can lower the carrier tray 11 to disengage the drive mechanism 30 .
- the height of the first positioning wheel 21 when it is in the first pending position is the same as the height of the second positioning wheel 22 when it is in the second pending position, and the first positioning wheel 21 is in the first working position.
- the height is the same as the height of the second positioning wheel 22 when it is in the second working position.
- the first positioning wheel 21 and the second positioning wheel 22 will follow the load. It rotates according to the rotation of the tray 11 .
- the positioning mechanism 20 is in the second state, the first positioning wheel 21 lifts the loading tray 11 until the first positioning wheel 21 is flush with the second positioning wheel 22, and the lowest point of the loading tray 11 is vertical It is located between the first positioning wheel 21 and the second positioning wheel 22 in the direction, and the highest points of the first positioning wheel 21 and the second positioning wheel 22 are higher than the lowest point of the loading tray 11, so that the first positioning wheel 21 and Both the second positioning wheels 22 play a limiting role on the loading tray 11 , restricting the radial rolling of the loading tray 11 , so as to realize the rotation of the loading tray 11 when the driving mechanism 30 drives the loading tray 11 to rotate.
- the height of the first positioning wheel 21 and the height of the second positioning wheel 22 may also be different when the positioning mechanism 20 is in the second state.
- the driving mechanism 30 includes an active drive wheel 31 , a drive motor 32 and a conveyor belt 33 .
- the conveyor belt 33 is connected to the drive motor 32 and the active drive wheel 31 , and the drive motor 32 can drive the active drive wheel 31 to rotate by driving the conveyor belt 33 to move. .
- the positioning mechanism 20 is in the first state and the loading mechanism 10 is placed on the first positioning wheel 21 and the second positioning wheel 22, the loading mechanism 10 is spaced from the driving wheel 31, and when the positioning mechanism 20 is in the second state and When the loading mechanism 10 is placed on the first positioning wheel 21 and the second positioning wheel 22 , the active driving wheel 31 can abut against the loading mechanism 10 and drive the loading mechanism 10 to rotate through rotation.
- the active driving wheel 31 drives the loading tray 11 to rotate through rotation, thereby realizing the self-rotation of the loading tray 11 .
- the active driving wheel 31 can be in contact with the highest point of the loading tray 11, and can also be in contact with the side of the loading tray 11.
- the active driving wheel 31, the first positioning wheel 21 and the The second positioning wheels 22 can jointly limit the radial movement of the loading tray 11 to prevent the loading tray 11 from being separated from the positioning mechanism 20 .
- the driving drive wheel 31 is connected with the driving motor 32 through the conveyor belt 33 , and the speed ratio can be changed to form a reducer to reduce the speed at which the driving motor 32 transmits to the driving driving wheel 31 .
- the printed circuit board homogenizing treatment device further includes a limiting wheel 40 , and the limiting wheel 40 can abut against the loading mechanism 10 when the positioning mechanism 20 is in the second state , and can rotate with the rotation of the loading tray 11 , and the limiting wheel 40 , the driving wheel 31 , the first positioning wheel 21 and the second positioning wheel 22 can jointly limit the displacement of the loading mechanism 10 .
- the loading tray 11 is lifted up and interferes with the driving drive wheel 31 and the limiting wheel 40 , wherein the highest point of the loading tray 11 is located at Between the active drive wheel 31 and the limit wheel 40, the active drive wheel 31 and the limit wheel 40 from above, the first positioning wheel 21 and the second positioning wheel 22 from below, jointly clamp the loading tray 11, so as to further The radial movement of the loading mechanism 10 is restricted.
- the positioning mechanism 20 After the processing of the printed circuit board is completed, the positioning mechanism 20 also has a third state, so that the loading tray 11 can be separated from the driving wheel 31 again and removed from the positioning mechanism 20 .
- the positioning mechanism 20 when the positioning mechanism 20 is in the third state, the first positioning wheel 21 is at the first working position and the second positioning wheel 22 is at the second pending position.
- the positioning mechanism 20 can be switched from the second state to the third state, that is, the first positioning wheel 21 is kept at the first working position, the second positioning wheel 22 is switched from the second working position to the first pending position, the loading tray 11 is lowered, and at the same time Due to the height difference between the first positioning wheel 21 and the second positioning wheel 22, the first positioning wheel 21 generates a horizontal support force for the loading tray 11, so that the loading tray 11 is oriented from the first positioning wheel 21 to the second positioning wheel. 22, so that the loading tray 11 rolls down from the positioning mechanism 20 and enters the next process. In this way, the positioning mechanism 20 realizes the limit processing and automatic conveying of the loading tray 11 through the change of the positions of the first positioning wheel 21 and the second positioning wheel 22 .
- the loading tray 11 can be placed statically on the positioning mechanism 20 in the first state, and only starts to rotate after being driven by the driving mechanism 30, or it can be in a rotating state, and the driving mechanism 30 drives it to continue to rotate in the same direction.
- the printed circuit board homogenization treatment device further includes a first support slide 50 , and the first positioning wheel 21 and the second positioning wheel 22 are located in the first position in sequence.
- the first positioning wheel 21 is located between the first support slideway 50 and the second positioning wheel 22
- the first support slideway 50 is used to support the loading tray 11, and the loading mechanism 10 can It is placed on the first support slideway 50 and rolls along the extension direction of the first support slideway 50.
- the positioning mechanism 20 is in the first state, the loading mechanism 10 can roll from the first support slideway 50 to the first positioning wheel 21 and the second positioning wheel 22.
- the first support slideway 50 plays a guiding role, and the loading tray 11 can roll on the first support slideway 50 through inertial force and roll to the positioning mechanism 20 in the first state under the action of inertial force.
- the second positioning wheel 22 is in the second working position, which can restrict the loading tray 11 to continue to roll.
- the positioning mechanism 20 is switched to the second state, the first positioning wheel 21 is switched to the first working position, and the driving mechanism 30 drives the loading tray. 11 Continue to rotate in the same direction.
- the first positioning wheel 21 when the first positioning wheel 21 is on the left side and the second positioning wheel 22 is on the right side, the first support slideway 50 is on the left side of the first positioning wheel 21, and the loading tray 11 is on the first
- the supporting slideway 50 rolls clockwise, and the driving mechanism 30 can drive the loading tray 11 to continue to rotate clockwise.
- the height of the first positioning wheel 21 when in the first pending position is equal to or lower than the height of the first support slideway 50 close to the first positioning wheel 21.
- a height of one end of the positioning wheel 21 is equal to or lower than the height of the first support slideway 50 close to the first positioning wheel 21.
- the loading tray 11 can be rolled on the first support slideway 50 by external force.
- the first support slideway 50 has a first inclined surface arranged at an angle with the horizontal plane, and the loading mechanism 10 is in conflict with the first support slideway 50 .
- the height of the end of the first inclined surface away from the first positioning wheel 21 is higher than the height of the end of the first inclined surface close to the first positioning wheel 21 .
- the first inclined surface is an inclined surface extending obliquely downward toward the first positioning wheel 21, and the loading tray 11 can automatically accelerate and roll toward the first positioning wheel 21 on the first supporting slideway 50 due to the action of gravity, reducing the The energy consumption of the required external force is reduced.
- a check valve 51 is provided at one end of the first support slideway 50 close to the first positioning wheel 21 .
- the check valve 51 can supply the loading tray 11 to slide from the first support slideway 50 toward the first positioning wheel 21 and restrict the loading tray 11 from being returned to the first support slideway 50 by the first positioning wheel 21 .
- the printed circuit board homogenization treatment device further includes a second support slideway 60 , and the support mechanism is located in the first support slideway 50 and the second support slideway 60, the second positioning wheel 22 is located between the first positioning wheel 21 and the second supporting slideway 60, the second supporting slideway 60 is used to support the loading tray 11, and the second positioning wheel 22 is in the second pending position
- the loading mechanism 10 can be rolled from the positioning mechanism 20 to the second support.
- the loading tray 11 rolls to the second support slideway 60 under the pushing action of the first positioning wheel 21 , and runs along the second support slideway 60 on the second support slideway 60 .
- the extension direction of 60 continues to roll.
- the second support slideway 60 has a second inclined surface disposed at an angle with the horizontal plane, the loading mechanism 10 is in contact with the second inclined surface, and the height of one end of the second inclined surface close to the second positioning wheel 22 is higher than that of the second inclined surface The height of one end of the surface away from the second positioning wheel 22 . That is to say, the second inclined surface is an inclined surface that extends obliquely downward away from the second positioning wheel 22 .
- the loading tray 11 moves to the second inclined surface, it will automatically accelerate towards the position away from the positioning mechanism 20 under the action of gravity. Scroll in the direction to go to the next process, saving energy.
- the loading tray 11 rolls on the first support slideway 50, the positioning mechanism 20 is in the first state at this time, and the loading tray 11 rolls to the first positioning wheel under the action of gravity 21, the second positioning wheel 22 restricts the loading tray 11 to continue to roll.
- an induction mechanism can be provided. After the induction mechanism senses that the loading tray 11 is located at the preset position, the positioning mechanism 20 is switched from the first state to In the second state, the loading tray 11 is lifted and placed on the active driving wheel 31, the driving motor 32 drives the driving driving wheel 31 to rotate, thereby driving the loading tray 11 to rotate, and the first positioning wheel 21 and the second positioning wheel 22 follow the load.
- the rotation of the material tray 11 rotates, and the loading tray 11 is rotated to perform homogenization treatment on the printed circuit board.
- the positioning mechanism 20 is switched from the second state to the third state.
- the second positioning wheel 22 Descending to the second undetermined position, the loading tray 11 rolls down from the positioning mechanism 20 and rolls onto the second support slideway 60 under the support force of the first positioning wheel 21, and acts on the second support slideway by gravity Continue to scroll on 60 and have reached the next station.
- At least one of the first positioning wheel 21 , the second positioning wheel 22 , the driving wheel 31 and the limit wheel 40 is provided with a ring groove 201 in the side ring wall.
- the loading tray 11 is limited in the ring groove 201, and the groove wall of the ring groove 201 can play a limiting role.
- the first support slideway 50 is provided with a first slideway 501
- the second support slideway 60 is provided with a second slideway 601
- the groove wall of the first chute 501 and the groove wall of the second chute 601 can play a limiting role.
- the printed circuit board homogenization treatment device may further include other independently provided limiting mechanisms 80 , and the limiting mechanisms 80 can limit the axial skew or displacement of the loading tray 11 .
- the limiting mechanism 80 may include two limiting members 81 , and the two limiting members 81 are located on two axial sides of the loading tray 11 respectively.
- the printed circuit board homogenization treatment device further includes a liquid treatment mechanism for soaking the surface to be treated with liquid.
- the liquid treatment mechanism makes the surface to be treated soaked with liquid again, so that the loading tray 11 can perform homogenization treatment with the printed circuit board again. It can be understood that in the process of further infiltrating the liquid, the loading tray 11 is rotated again to make the liquid evenly distributed on the surface to be treated, so that the treatment effect of the surface to be treated is uniform.
- the method of infiltration may be soaking or spraying.
- the liquid can be a liquid medicine to process the printed circuit board, or it can be clean water to clean the printed circuit board.
- the liquid processing mechanism includes a flow pipe and a nozzle 71 connected to the flow pipe and facing the material carrier plate 11 .
- the flow pipe provides a flow channel for the liquid, and the nozzle 71 can spray the liquid in the flow pipe to the material carrier plate 11 .
- the flow pipe extends laterally, and a plurality of nozzles 71 are provided and arranged in an array along the extending direction of the flow pipe.
- the printed circuit board homogenization treatment device further includes an air jet mechanism for spraying the surface to be treated with air to dry the surface to be treated.
- the air jet mechanism is used to evenly blow the surface to be treated, so as to make the drying effect even.
- the printed circuit board homogenization treatment device may further include an independent casing 90 , the independent casing 90 has a accommodating cavity 901 and is provided with a conveying hole 902 communicating with the accommodating cavity 901 , and the accommodating cavity 901 is used for accommodating The positioning mechanism 20, the driving mechanism 30, the first support slideway 50, the second support slideway 60, the limiting wheel 40, the spraying mechanism 70 or the air jet mechanism, and the limiting mechanism 80, the conveying hole 902 is used for feeding the loading tray 11 is transported into the accommodating cavity 901 from the outside and rolls on the first support chute 50 , or/and, the feeding tray 11 is rolled out of the accommodating cavity 901 along the second support chute 60 from the accommodating cavity 901 .
- the printed circuit board homogenization treatment device may be provided with a plurality of stations.
- a printed circuit board homogenization treatment device is provided with one station.
- a printed circuit board production line has at least three stations, namely three printed circuit board homogenization treatment devices.
- a liquid treatment mechanism is provided at the first station, and the liquid treatment mechanism is used for spraying liquid medicine to the surface to be treated, so that the surface to be treated is treated.
- the liquid medicine on the surface to be treated is evenly distributed, so that the treatment effect of the surface to be treated is uniform.
- the second station is provided with another liquid treatment mechanism, when the loading tray 11 is transported to the second station, the liquid treatment mechanism is used to spray cleaning liquid on the surface to be treated to clean the surface to be treated.
- the cleaning liquid may be clean water, so as to clean the surface to be treated that has been further processed.
- the third station is provided with an air blowing mechanism.
- the air injection mechanism blows air to the surface to be treated, and the driving mechanism 30 drives the material receiving plate 11 to rotate so that the surface to be treated is evenly dried.
- both the liquid processing mechanism and the air jet mechanism can be fixed on a certain station, so that the loading tray 11 can be further homogenized or dried when it moves to this station.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (20)
- 一种印刷电路板匀液处理装置,用于处理印刷电路板,其特征在于,所述印刷电路板匀液处理装置包括载料机构、定位机构及驱动机构,其中,所述载料机构呈圆盘状并用于固定所述印刷电路板,所述载料机构的中心轴线沿水平方向延伸,以使得所述印刷电路板竖直设置;所述定位机构至少包括第一定位轮及第二定位轮,所述第一定位轮的转动轴线与所述第二定位轮的转动轴线均沿水平方向延伸并相互平行,所述第一定位轮与所述第二定位轮能够共同承托所述载料机构,所述定位机构能够在第一状态及第二状态之间切换,当所述定位机构处于所述第一状态且所述载料机构放置于所述第一定位轮及所述第二定位轮上时,所述载料机构与所述驱动机构相间隔,当所述定位机构处于所述第二状态且所述载料机构放置于所述第一定位轮及所述第二定位轮上时,所述驱动机构能够驱动所述载料机构绕其中心轴线转动,所述第一定位轮与所述第二定位轮均能够随着所述载料机构的转动而转动。
- 如权利要求1所述的印刷电路板匀液处理装置,其特征在于,所述第一定位轮与所述第二定位轮均处于同一平面上,所述第一定位轮的转动轴线与所述载料机构的中心轴线平行。
- 如权利要求1所述的印刷电路板匀液处理装置,其特征在于,所述第一定位轮能够在第一待定位置与第一作业位置之间切换,所述第二定位轮能够在第二待定位置与第二作业位置之间切换,当所述定位机构处于所述第二状态时,所述第一定位轮处于所述第一作业位置且所述第二定位轮处于所述第二作业位置。
- 如权利要求3所述的印刷电路板匀液处理装置,其特征在于,当所述定位机构处于所述第一状态时,所述第一定位轮处于所述第一待定位置且所述第二定位轮处于所述第二作业位置。
- 如权利要求3所述的印刷电路板匀液处理装置,其特征在于,所述第一作业位置位于所述第一待定位置的上方,所述第二作业位置位于所述第二待定位置的上方,所述驱动机构位于所述定位机构上方。
- 如权利要求5所述的印刷电路板匀液处理装置,其特征在于,所述第一定位轮在处于所述第一待定位置时的高度与所述第二定位轮在处于所述第二待定位置时的高度相同,所述第一定位轮在处于所述第一作业位置时的高度与所述第二定位轮在处于所述第二作业位置时的高度相同。
- 如权利要求5所述的印刷电路板匀液处理装置,其特征在于,所述驱动机构包括主动驱动轮,当所述定位机构处于所述第一状态且所述载料机构放置于所述第一定位轮及所述第二定位轮上时,所述载料机构与所述主动驱动轮相间隔,当所述定位机构处于所述第二状态且所述载料机构放置于所述第一定位轮及所述第二定位轮上时,所述主动驱动轮能够抵触于所述载料机构,并通过转动带动所述载料机构转动。
- 如权利要求7所述的印刷电路板匀液处理装置,其特征在于,所述驱动机构还包括驱动电机及传送带,所述传送带连接于所述驱动电机及所述主动驱动轮,所述驱动电机能够通过驱动所述传送带运动来带动所述主动驱动轮转动。
- 如权利要求8所述的印刷电路板匀液处理装置,其特征在于,所述印刷电路板匀液处理装置还包括限位轮,所述限位轮能够在所述定位机构处于所述第二状态时抵触于所述载料机构,并能够随着所述载料盘的转动而转动,且所述限位轮、所述主动驱动轮、所述第一定位轮及所述第二定位轮能够共同限制所述载料机构的位移。
- 如权利要求3至9任一项所述的印刷电路板匀液处理装置,其特征在于,所述印刷电路板匀液处理装置还包括第一支撑滑道,所述第一定位轮与所述第二定位轮依次位于所述第一支撑滑道的延伸方向上,所述第一支撑滑道用于支撑所述载料盘,所述载料机构能够沿所述第一支撑滑道的延伸方向滚动,当所述定位机构处于所述第一状态时,所述载料机构能够由所述第一支撑滑道滚动至所述第一定位轮与所述第二定位轮上。
- 如权利要求10所述的印刷电路板匀液处理装置,其特征在于,所述第一定位轮在处于所述第一待定位置时的高度等于或低于所述第一支撑滑道的靠近所述第一定位轮的一端的高度。
- 如权利要求11所述的印刷电路板匀液处理装置,其特征在于,所述第一支撑滑道具有与水平面呈夹角设置的第一倾斜面,所述载料机构抵触于所述第一倾斜面,所述第一倾斜面的远离所述第一定位轮的一端的高度高于所述第一倾斜面的靠近所述第一定位轮的一端的高度。
- 如权利要求3至9任一项所述的印刷电路板匀液处理装置,其特征在于,所述定位机构还具有第三状态,当所述定位机构处于所述第三状态时,所述第一定位轮处于所述第一作业位置且所述第二定位轮处于所述第二待定位置。
- 如权利要求13所述的印刷电路板匀液处理装置,其特征在于,所述印刷电路板匀液处理装置还包括第二支撑滑道,所述第二定位轮位于所述第一定位轮及所述第二支撑滑道之间,所述第二支撑滑道用于支撑所述载料盘,所述第二定位轮在处于所述第二待定位置时的高度等于或高于所述第二支撑滑道的靠近所述第二定位轮的一端的高度,当所述定位机构处于所述第三状态时,所述载料机构能够由所述定位机构上滚动至所述第二支撑滑道上,并沿所述第二支撑滑道的延伸方向滚动。
- 如权利要求14所述的印刷电路板匀液处理装置,其特征在于,所述第二支撑滑道具有与水平面呈夹角设置的第二倾斜面,所述载料机构抵触于所述第二倾斜面,所述第二倾斜面的靠近所述第二定位轮的一端的高度高于所述第二倾斜面的远离所述第二定位轮的一端的高度。
- 如权利要求1所述的印刷电路板匀液处理装置,其特征在于,所述载料机构包括载料盘以及设于所述载料盘并用于固定所述印刷电路板的固定件,所述驱动机构用于驱动所述载料盘绕其中心轴线转动,所述载料盘的中心轴线垂直于所述印刷电路板。
- 如权利要求16所述的印刷电路板匀液处理装置,其特征在于,所述载料盘具有第一侧面、第二侧面以及边缘面,第一侧面及第二侧面相对设置,所述边缘面周向环绕所述第一侧面及第二侧面且背向所述载料盘的中心轴线,当所述载料机构放置于所述第一定位轮与所述第二定位轮上时,所述第一定位轮及所述第二定位轮均抵触于所述边缘面。
- 如权利要求16所述的印刷电路板匀液处理装置,其特征在于,所述载料盘开设有沿其中心轴线贯穿设置的通孔,所述固定件用于将所述载料盘固定至所述通孔处,所述通孔避让所述印刷电路板。
- 如权利要求1至9任一项所述的印刷电路板匀液处理装置,其特征在于,所述印刷电路板匀液处理装置还包括用于使得所述印刷电路板浸润液体的液体处理机构。
- 如权利要求1至9任一项所述的印刷电路板匀液处理装置,其特征在于,所述印刷电路板匀液处理装置还包括用于对所述印刷电路板喷气以烘干所述印刷电路板的喷气机构。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020558893A JP7258913B2 (ja) | 2020-07-02 | 2020-08-07 | プリント回路基板の液体均一化処理装置 |
GB2016188.1A GB2600092A (en) | 2020-07-02 | 2020-08-07 | Uniform liquid distribution processing apparatus for printed circuit board |
KR1020207029817A KR102390499B1 (ko) | 2020-07-02 | 2020-08-07 | 인쇄 회로 기판의 균일 액체 처리 장치 |
US17/032,256 US11889631B2 (en) | 2020-07-02 | 2020-09-25 | Printed circuit board homogenization treatment device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN202010627291.2A CN111867254A (zh) | 2020-07-02 | 2020-07-02 | 印刷电路板匀液处理装置 |
CN202010627291.2 | 2020-07-02 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US17/032,256 Continuation US11889631B2 (en) | 2020-07-02 | 2020-09-25 | Printed circuit board homogenization treatment device |
Publications (1)
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WO2022000704A1 true WO2022000704A1 (zh) | 2022-01-06 |
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PCT/CN2020/107622 WO2022000704A1 (zh) | 2020-07-02 | 2020-08-07 | 印刷电路板匀液处理装置 |
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JP (1) | JP3230030U (zh) |
CN (1) | CN111867254A (zh) |
TW (2) | TWI747445B (zh) |
WO (1) | WO2022000704A1 (zh) |
Cited By (1)
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CN114798251A (zh) * | 2022-02-28 | 2022-07-29 | 南京存阳电力发展有限公司 | 用于智能充电控制器生产的内部组件加工设备 |
Citations (3)
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JPH08150468A (ja) * | 1994-09-29 | 1996-06-11 | Nihon Dennetsu Kk | スイング装置 |
CN209089281U (zh) * | 2018-08-21 | 2019-07-09 | 扬博科技股份有限公司 | 喷射驱动型电路板旋转载具 |
CN111083875A (zh) * | 2019-12-31 | 2020-04-28 | 东莞宇宙电路板设备有限公司 | 印刷电路板匀液处理装置 |
Family Cites Families (3)
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KR20130080288A (ko) * | 2012-01-04 | 2013-07-12 | 삼성전기주식회사 | 수직 이송 지그 및 이를 이용한 습식 처리 장치 |
TWM461283U (zh) * | 2013-05-15 | 2013-09-01 | Kenmec Mechanical Engineering Co Ltd | 旋進式輸送機 |
CN111182736A (zh) * | 2020-03-16 | 2020-05-19 | 佛山市恒灏科技有限公司 | 一种蚀刻方法及装置 |
-
2020
- 2020-07-02 CN CN202010627291.2A patent/CN111867254A/zh active Pending
- 2020-08-07 WO PCT/CN2020/107622 patent/WO2022000704A1/zh active Application Filing
- 2020-08-17 TW TW109127866A patent/TWI747445B/zh active
- 2020-08-17 TW TW109210610U patent/TWM607869U/zh unknown
- 2020-10-19 JP JP2020004501U patent/JP3230030U/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08150468A (ja) * | 1994-09-29 | 1996-06-11 | Nihon Dennetsu Kk | スイング装置 |
CN209089281U (zh) * | 2018-08-21 | 2019-07-09 | 扬博科技股份有限公司 | 喷射驱动型电路板旋转载具 |
CN111083875A (zh) * | 2019-12-31 | 2020-04-28 | 东莞宇宙电路板设备有限公司 | 印刷电路板匀液处理装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114798251A (zh) * | 2022-02-28 | 2022-07-29 | 南京存阳电力发展有限公司 | 用于智能充电控制器生产的内部组件加工设备 |
CN114798251B (zh) * | 2022-02-28 | 2023-04-21 | 南京存阳电力发展有限公司 | 用于智能充电控制器生产的内部组件加工设备 |
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JP3230030U (ja) | 2021-01-07 |
TW202203723A (zh) | 2022-01-16 |
TWI747445B (zh) | 2021-11-21 |
CN111867254A (zh) | 2020-10-30 |
TWM607869U (zh) | 2021-02-21 |
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