Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C3/00—Glass compositions
  • C03C3/04—Glass compositions containing silica
  • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
  • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
  • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
  • C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C3/00—Glass compositions
  • C03C3/04—Glass compositions containing silica
  • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
  • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
  • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/02—Details
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/844—Encapsulations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
  • H10K59/10—OLED displays
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
  • H10K59/80—Constructional details
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2201/00—Glass compositions
  • C03C2201/06—Doped silica-based glasses
  • C03C2201/30—Doped silica-based glasses containing metals
  • C03C2201/32—Doped silica-based glasses containing metals containing aluminium

Definitions

• the present invention relates to a non-alkali glass plate, and particularly to a non-alkali glass plate suitable for an organic EL display.
• Organic EL displays are thin and excellent in moving image display, and also have low power consumption, so they are used in applications such as flexible devices and mobile phone displays.
• a glass plate is widely used as a substrate for an organic EL display.
• the glass plate for this purpose is mainly required to have the following characteristics. (1) In order to prevent the diffusion of alkaline ions in the semiconductor material formed in the heat treatment step, it contains almost no alkali metal oxide, that is, it is non-alkali glass (alkali oxide in the glass composition). Content is 0.5 mol% or less), (2) In order to reduce the cost of the glass plate, it is molded by the overflow downdraw method, which easily improves the surface quality, and has excellent productivity, especially excellent meltability and devitrification resistance. (3) In the LTPS (low temperature contemporary silicon) process and the oxide TFT process, the strain point is high in order to reduce the thermal shrinkage of the glass plate.
• LTPS low temperature contemporary silicon
• organic EL devices are also widely deployed in organic EL TVs.
• organic EL TVs there is a strong demand for organic EL TVs to be larger and thinner, and there is an increasing demand for high-resolution displays such as 8K. Therefore, glass plates for these applications are required to have thermal dimensional stability that can withstand the demand for high resolution while being large and thin.
• the organic EL television is required to have a low cost in order to reduce the price difference from the liquid crystal display, and the glass plate is also required to be low in cost.
• the glass plate becomes larger and thinner, the glass plate tends to bend, and the manufacturing cost rises.
• a glass plate formed by a glass maker goes through processes such as cutting, slow cooling, inspection, and cleaning. During these processes, the glass plate is put into a cassette having multiple shelves and carried out. ..
• This cassette is usually designed so that the opposite sides of the glass plate can be placed horizontally on the shelves formed on the left and right inner surfaces, but the large and thin glass plate has a large amount of deflection. Therefore, when the glass plate is put into the cassette, a part of the glass plate comes into contact with the cassette and is damaged, or when the glass plate is carried out, it tends to swing greatly and become unstable. Since such a form of cassette is also used by an electronic device maker, the same problem will occur. In order to solve this problem, it is effective to increase the Young's modulus of the glass plate to reduce the amount of bending.
• the present invention was invented in view of the above circumstances, and its technical problem is to provide a non-alkali glass plate having excellent productivity and a sufficiently high strain point and Young's modulus.
• the non-alkali glass plate of the present invention has a glass composition of mol%, SiO 2 64 to 71%, Al 2 O 3 12.5 to 17%, B 2 O 30 to 4%, Li 2 O + Na 2. It contains O + K 2 O 0 to 0.5%, MgO 6 to 11%, CaO 3 to 11%, SrO 0 to 6%, BaO 0-1%, MgO + CaO + SrO + BaO 14 to 19%, and has a mol% ratio (Al 2 O).
• Li 2 O + Na 2 O + K 2 O refers to the total amount of Li 2 O, Na 2 O and K 2 O.
• MgO + CaO + SrO + BaO refers to the total amount of MgO, CaO, SrO and BaO.
• Mol% ratio (Al 2 O 3 / CaO) x ⁇ B 2 O 3 / (MgO + CaO + SrO + BaO) ⁇ is the value obtained by dividing the content of Al 2 O 3 by the content of Ca O and the content of B 2 O 3. It refers to a value obtained by multiplying the amount by the value obtained by dividing the total amount of MgO, CaO, SrO and BaO.
• MgO / (CaO + SrO) refers to a value obtained by dividing the content of MgO by the total amount of CaO and SrO.
• (MgO + CaO + SrO + BaO-Al 2 O 3 ) x B 2 O 3 is a value obtained by subtracting the mol% content of Al 2 O 3 from the mol% total amount of MgO, CaO, SrO and BaO, and mol of B 2 O 3 . It is a value multiplied by% content.
• SiO 2 ⁇ CaO / MgO is a value obtained by multiplying the mol% content of SiO 2 by the mol% content of CaO and dividing by the mol% content of MgO.
• the non-alkali glass plate of the present invention preferably has a Young's modulus of 80 GPa or more, a strain point of 700 ° C. or more, and a liquid phase temperature of 1350 ° C. or less.
• Young's modulus refers to a value measured by the bending resonance method.
• 1 GPa corresponds to about 101.9 Kgf / mm 2.
• Stress point refers to a value measured based on the method of ASTM C336.
• the “liquid phase temperature” is the temperature at which crystals precipitate after passing through a standard sieve of 30 mesh (500 ⁇ m) and placing the glass powder remaining in 50 mesh (300 ⁇ m) in a platinum boat and holding it in a temperature gradient furnace for 24 hours. Point to.
• the non-alkali glass plate of the present invention does not substantially contain As 2 O 3 and Sb 2 O 3.
• substantially free of As 2 O 3 refers to a case where the content of As 2 O 3 is 0.05 mol% or less.
• substantially free of Sb 2 O 3 refers to the case where the content of Sb 2 O 3 is 0.05 mol% or less.
• non-alkali glass plate of the present invention preferably further contains 0.001 to 1 mol% of SnO 2.
• non-alkali glass plate of the present invention preferably has a strain point of 710 ° C. or higher.
• the non-alkali glass plate of the present invention preferably has a Young's modulus higher than 81 GPa.
• the non-alkali glass plate of the present invention preferably has an average coefficient of thermal expansion of 30 ⁇ 10 -7 to 50 ⁇ 10 -7 / ° C. in the temperature range of 30 to 380 ° C.
• the "average coefficient of thermal expansion in the temperature range of 30 to 380 ° C.” can be measured with a dilatometer.
• liquidus viscosity 10 4.0 dPa ⁇ s or more.
• liquid phase viscosity refers to the viscosity of the glass at the liquid phase temperature and can be measured by the platinum ball pulling method.
• non-alkali glass plate of the present invention is preferably used for an organic EL device.
• the non-alkali glass plate of the present invention has a Li 2 O + Na 2 O + K 2 O content of 0 to 0.5 mol% in the glass composition, a Young's modulus of 80 GPa or more, a strain point of 700 ° C. or more, and a liquid phase temperature. Is 1350 ° C. or lower.
• the non-alkali glass plate of the present invention has a glass composition of mol%, SiO 2 64 to 71%, Al 2 O 3 12.5 to 17%, B 2 O 30 to 4%, Li 2 O + Na 2 O + K 2. It contains O 0 to 0.5%, MgO 6 to 11%, CaO 3 to 11%, SrO 0 to 6%, BaO 0 to 1%, MgO + CaO + SrO + BaO 14 to 19%, and has a mol% ratio (Al 2 O 3 /).
• SiO 2 is a component that forms the skeleton of glass. If the content of SiO 2 is too small, the coefficient of thermal expansion becomes high and the density increases. Therefore, the lower limit of SiO 2 is preferably 64%, more preferably 64.2%, still more preferably 64.5%, still more preferably 64.8%, still more preferably 65%, still more preferably 65.5. %, More preferably 65.8%, still more preferably 66%, still more preferably 66.3%, still more preferably 66.5%, most preferably 66.7%.
• the upper limit of SiO 2 is preferably 71%, more preferably 70.8%, still more preferably 70.6%, still more preferably 71.4%, still more preferably 70.2%, still more preferably 70. %, More preferably 69.8%, even more preferably 69%, most preferably 68%.
• Al 2 O 3 is a component that forms the skeleton of glass, a component that increases Young's modulus, and a component that further increases the strain point. If the content of Al 2 O 3 is too small, the Young's modulus tends to decrease and the strain point tends to decrease. Therefore, the lower limit of Al 2 O 3 is preferably 12.5%, more preferably 13%, more preferably more than 13%, more preferably 13.1%, still more preferably 13.2%, still more preferably. It is 13.3%, most preferably 13.4%. On the other hand, if the content of Al 2 O 3 is too large, devitrified crystals such as mullite are likely to precipitate, and the liquidus viscosity is likely to decrease.
• the upper limit of Al 2 O 3 is preferably 17%, more preferably 16.8%, more preferably 16.6%, still more preferably 16.4%, still more preferably 16.2%, still more preferable. Is 16%, more preferably 15.5%, still more preferably 15%, still more preferably 14.5%, and most preferably 14%.
• B 2 O 3 is a component that enhances meltability and devitrification resistance. If the content of B 2 O 3 is too small, the meltability and devitrification resistance tend to decrease. Therefore, the lower limit of B 2 O 3 is preferably 0%, more preferably more than 0%, more preferably 0.1%, still more preferably 0.2%, still more preferably 0.3%, still more preferably. It is 0.4%, more preferably 0.7%, still more preferably 1%, and particularly preferably more than 1%. On the other hand, if the content of B 2 O 3 is too large, Young's modulus and strain point tend to decrease.
• the upper limit of B 2 O 3 is preferably 4%, more preferably 3.9%, more preferably 3.8%, still more preferably 3.7%, still more preferably 3.6%, still more preferable. Is 3.5%, more preferably 3%, still more preferably 2.5%, still more preferably 2%, still more preferably 1.5%, most preferably less than 1%.
• Li 2 O, Na 2 O and K 2 O are components that are inevitably mixed from the glass raw material, and the total amount thereof is 0 to 0.5%, preferably 0 to 0.3%, more preferably 0 to 0.3%. It is 0 to 0.2%, more preferably 0 to 0.1, and most preferably 0 to 0.05%. If the total amount of Li 2 O, Na 2 O and K 2 O is too large, there is a risk that alkaline ions will diffuse into the semiconductor material formed in the heat treatment step.
• MgO is a component that significantly increases Young's modulus among alkaline earth metal oxides. If the content of MgO is too small, the meltability and Young's modulus tend to decrease. Therefore, the lower limit of MgO is preferably 6%, more preferably 6.1%, more preferably 6.3%, still more preferably 6.5%, still more preferably 6.6%, still more preferably 6. It is 7%, more preferably 6.8%, and most preferably 7%. On the other hand, if the content of MgO is too large, devitrified crystals such as mullite tend to precipitate, and the liquidus viscosity tends to decrease.
• the upper limit of MgO is preferably 11%, more preferably 10.5%, more preferably 10%, more preferably 9.5%, more preferably 9%, more preferably 8.9%, and more. It is preferably 8.8%, more preferably 8.7%, further preferably 8.6%, further preferably 8.5%, still more preferably less than 8.5%, still more preferably 8.4%, still more preferably. Is less than 8.4%, more preferably 8.2%, and most preferably less than 8.0%.
• CaO is a component that lowers the high-temperature viscosity and remarkably enhances the meltability without lowering the strain point. It is also a component that increases Young's modulus. If the CaO content is too low, the meltability tends to decrease. Therefore, the lower limit of CaO is preferably 3%, more preferably more than 3%, more preferably 3.1%, still more preferably 3.2%, still more preferably 3.3%, still more preferably 3.4. %, More preferably 3.5%, still more preferably 3.6%, still more preferably 4%, most preferably 4.5%. On the other hand, if the CaO content is too high, the liquidus temperature becomes high.
• the upper limit of CaO is preferably 11%, more preferably 10.5%, more preferably 10%, more preferably 9.9%, more preferably 9.8%, still more preferably 9.7%. , More preferably 9.6%, still more preferably 9.5%, still more preferably 9.4%, still more preferably 9.3%, most preferably 9.2%.
• the lower limit of SrO is preferably 0%, more preferably more than 0%, more preferably more than 0.1%, still more preferably more than 0.1%, still more preferably 0.2%, still more preferably 0. It is 3%, more preferably more than 0.3%, still more preferably 0.4%, still more preferably more than 0.4%, still more preferably 0.6%, and most preferably more than 1%.
• the upper limit of SrO is preferably 6%, more preferably less than 6%, more preferably 5.9%, still more preferably less than 5.9%, still more preferably 5.8%, still more preferably 5. It is less than 8%, more preferably 5.7%, still more preferably 5%, even more preferably less than 4%, most preferably 3.5%.
• the lower limit of BaO is preferably 0%, more preferably more than 0%, more preferably more than 0.1%, still more preferably more than 0.1%, still more preferably 0.2%, still more preferably 0. It is 3%, more preferably 0.4%, still more preferably more than 0.4%, and most preferably 0.5%.
• the upper limit of BaO is preferably 1%, more preferably less than 1%, more preferably 0.9%, still more preferably less than 0.9%, still more preferably 0.8%, still more preferably 0. It is less than 8%, most preferably 0.7%.
• the lower limit of the total amount of MgO, CaO, SrO and BaO is preferably 14%, more preferably 15%, more preferably 15.1%, more preferably 15.2%, still more preferably 15.3%. , More preferably 15.4%, still more preferably 15.7%, still more preferably 16%, and most preferably 16.5%.
• the sum of MgO, CaO, SrO and BaO is too large, the coefficient of thermal expansion and the density tend to increase.
• the upper limit of the total amount of MgO, CaO, SrO and BaO is preferably 19%, more preferably 18.8%, more preferably 18.6%, still more preferably 18.5%, still more preferably 18. It is less than 5%, more preferably 18.4%, and most preferably less than 18.4%.
• the mol% ratio (Al 2 O 3 / CaO) ⁇ ⁇ B 2 O 3 / (MgO + CaO + SrO + BaO) ⁇ has a high Young's modulus and thermal dimensional stability, productivity, and high meltability required for molding by the overflow downdraw method. It is an important component ratio that achieves both liquid phase viscosity and liquid phase viscosity. If the mol% ratio (Al 2 O 3 / CaO) ⁇ ⁇ B 2 O 3 / (MgO + CaO + SrO + BaO) ⁇ is too small, the meltability tends to decrease and the cost of glass tends to increase.
• the lower limit of the mol% ratio (Al 2 O 3 / CaO) ⁇ ⁇ B 2 O 3 / (MgO + CaO + SrO + BaO) ⁇ is preferably 0, more preferably more than 0, more preferably 0.02, still more preferably 0. 05, more preferably 0.08, most preferably 0.1.
• the mol% ratio (Al 2 O 3 / CaO) ⁇ ⁇ B 2 O 3 / (MgO + CaO + SrO + BaO) ⁇ is too large, the strain point tends to decrease and high thermal dimensional stability cannot be obtained. In addition, Young's modulus tends to decrease. Further, the liquidus viscosity tends to decrease, and the productivity tends to decrease.
• the upper limit of the mol% ratio (Al 2 O 3 / CaO) ⁇ ⁇ B 2 O 3 / (MgO + CaO + SrO + BaO) ⁇ is preferably 0.5, more preferably 0.45, more preferably less than 0.45, and further. It is preferably 0.4, more preferably 0.37, still more preferably 0.36, still more preferably 0.35, still more preferably 0.33, still more preferably 0.30, still more preferably 0.29, even more preferably. Is 0.25, more preferably 0.22, and most preferably 0.19.
• the lower limit of the mol% ratio MgO / (CaO + SrO) is preferably 0.5, more preferably 0.52, more preferably 0.55, still more preferably 0.56, still more preferably 0.58, most preferably. Is 0.6. If the mol% ratio MgO / (CaO + SrO) is too large, the liquidus viscosity tends to decrease. Therefore, the upper limit of the mol% ratio MgO / (CaO + SrO) is preferably 1.5, more preferably 1.4, more preferably 1.3, still more preferably 1.2, still more preferably 1.1, most preferably. Is 1.
• the mol% ratio (MgO + CaO + SrO + BaO-Al 2 O 3 ) ⁇ B 2 O 3 is an important component ratio for achieving both high thermal dimensional stability and high meltability. If the mol% ratio (MgO + CaO + SrO + BaO-Al 2 O 3 ) ⁇ B 2 O 3 is too small, the meltability tends to decrease and the cost of glass tends to increase. Therefore, the lower limit of the mol% ratio (MgO + CaO + SrO + BaO-Al 2 O 3 ) ⁇ B 2 O 3 is preferably 1, more preferably 1.2, more preferably 1.4, still more preferably 1.6, still more preferably.
• the upper limit of the mol% ratio (MgO + CaO + SrO + BaO-Al 2 O 3 ) ⁇ B 2 O 3 is preferably 10, more preferably 9.8, more preferably 9.6, still more preferably 9.4, still more preferably. It is 9.2, more preferably 9, still more preferably 8.5, still more preferably 8, still more preferably 7.5, still more preferably 7, still more preferably 6.5, and most preferably 6.
• the mol% ratio SiO 2 ⁇ CaO / MgO is an important component ratio in order to achieve both high Young's modulus, high thermal dimensional stability, and high productivity. Further, if the mol% ratio SiO 2 ⁇ CaO / MgO is too large or too small, the liquid phase temperature tends to rise. In order to improve the devitrification resistance, it is necessary to strictly control the mol% ratio SiO 2 ⁇ CaO / MgO. If the mol% ratio SiO 2 ⁇ CaO / MgO is too small, the strain point tends to decrease, and the thermal dimensional stability tends to decrease. In addition, Young's modulus tends to decrease.
• the lower limit of the mol% ratio SiO 2 ⁇ CaO / MgO is preferably 30, more preferably 33, more preferably 35, still more preferably 38, still more preferably 40, still more preferably 43, still more preferably 45, and further. It is preferably 47, more preferably 48, still more preferably 50, still more preferably 52, still more preferably 53, still more preferably 55, and most preferably 57.
• the meltability tends to be low and the cost of glass tends to be high.
• the upper limit of the mol% ratio SiO 2 ⁇ CaO / MgO is preferably 90, more preferably 87, more preferably 85, still more preferably 83, still more preferably 81, still more preferably 80, still more preferably 79, and further. It is preferably 77, more preferably 75, still more preferably 73, and most preferably 71.
• Al 2 O 3 ) ⁇ B 2 O 3 is 2 to 9, mol% ratio SiO 2 ⁇ CaO / MgO is 57 to 83, or SiO 2 66.7 to 70%, Al 2 O 3 13 to 16%, B 2 O 30 to 4%, Li 2 O + Na 2 O + K 2 O 0 to 0.5%, MgO 6.8 to 11%, CaO 3 to 11%, SrO 0 to 6%, BaO 0 It contains ⁇ 1%, MgO + CaO + SrO + BaO 15 ⁇ 18.4%, mol% ratio (Al 2 O 3 / CaO) ⁇ ⁇ B 2 O 3 / (MgO + CaO + SrO + BaO) ⁇ is 0 ⁇ 0.3, mol% ratio MgO / ( It is more preferable that CaO + SrO) is 0.6 to 1, mol% ratio (MgO + CaO + SrO + BaO-Al 2 O 3 ) ⁇ B 2 O 3 is 2 to 9, and mol%
• the following components may be added as optional components.
• the content of the components other than the above components is preferably 10% or less, particularly preferably 5% or less in total, from the viewpoint of accurately enjoying the effects of the present invention.
• P 2 O 5 is a component that enhances the strain point and is a component that can remarkably suppress the precipitation of devitrified crystals of alkaline earth aluminosilicate type such as anorthite. However, if a large amount of P 2 O 5 is contained, the glass tends to be phase-separated.
• the content of P 2 O 5 is preferably 0 to 2.5%, more preferably 0.0005 to 1.5%, still more preferably 0.001 to 0.5%, and particularly preferably 0.005 to 0. It is 3.3%.
• TiO 2 is a component that lowers high-temperature viscosity and enhances meltability, and is a component that suppresses solarization. However, if a large amount of TiO 2 is contained, the glass is colored and the transmittance tends to decrease. ..
• the content of TiO 2 is preferably 0 to 2.5%, more preferably 0.0005 to 1%, still more preferably 0.001 to 0.5%, and particularly preferably 0.005 to 0.1%. be.
• ZnO is a component that enhances meltability. However, when a large amount of ZnO is contained, the glass tends to be devitrified and the strain point tends to decrease.
• the ZnO content is preferably 0 to 6%, 0 to 5%, 0 to 4%, and particularly preferably less than 0 to 3%.
• Y 2 O 3 , Nb 2 O 5 , and La 2 O 3 have a function of increasing the strain point, Young's modulus, and the like.
• the total amount and individual content of these components are preferably 0 to 5%, more preferably 0 to 1%, still more preferably 0 to 0.5%, and particularly preferably 0 to less than 0.5%. If the total amount and individual content of Y 2 O 3 , Nb 2 O 5 , and La 2 O 3 are too large, the density and raw material cost tend to increase.
• SnO 2 is a component having a good clarification effect in a high temperature range, a component that increases a strain point, and a component that lowers a high temperature viscosity.
• the SnO 2 content is preferably 0 to 1%, 0.001 to 1%, 0.01 to 0.5%, and particularly preferably 0.05 to 0.3%. If the content of SnO 2 is too large, devitrified crystals of SnO 2 are likely to precipitate. If the SnO 2 content is less than 0.001%, it becomes difficult to enjoy the above effect.
• SnO 2 is suitable as a clarifying agent, but as a clarifying agent, F, SO 3 , C, or Al, Si, in place of SnO 2 or together with SnO 2, as long as the glass properties are not impaired.
• Metal powders such as, etc. can be added up to 5% (preferably up to 1%, particularly up to 0.5%).
• CeO 2 and the like can be added up to 5% (preferably up to 1%, particularly up to 0.5%).
• As 2 O 3 and Sb 2 O 3 are also effective.
• As 2 O 3 and Sb 2 O 3 are components that increase the environmental load.
• As 2 O 3 is a component that lowers the solarization resistance. Therefore, it is preferable that the non-alkali glass plate of the present invention does not substantially contain these components.
• Cl is a component that promotes the initial melting of the glass batch. Moreover, if Cl is added, the action of the clarifying agent can be promoted. As a result, it is possible to extend the life of the glass manufacturing kiln while reducing the melting cost. However, if the Cl content is too high, the strain point tends to decrease. Therefore, the Cl content is preferably 0 to 3%, more preferably 0.0005 to 1%, and particularly preferably 0.001 to 0.5%.
• a chloride of an alkaline earth metal oxide such as strontium chloride or a raw material such as aluminum chloride can be used.
• Fe 2 O 3 is a component that is inevitably mixed from the glass raw material and is a component that lowers the electrical resistivity.
• the content of Fe 2 O 3 is preferably 0 to 300 mass ppm, 80 to 250 mass ppm, and particularly 100 to 200 mass ppm. If the content of Fe 2 O 3 is too small, the raw material cost tends to rise. On the other hand, if the content of Fe 2 O 3 is too large, the electrical resistivity of the molten glass increases, making it difficult to perform electrical melting.
• the non-alkali glass plate of the present invention preferably has the following characteristics.
• the average coefficient of thermal expansion in the temperature range of 30 to 380 ° C. is preferably 30 ⁇ 10 -7 to 50 ⁇ 10 -7 / ° C., 32 ⁇ 10 -7 to 48 ⁇ 10 -7 / ° C., 33 ⁇ 10 -7 to It is 45 ⁇ 10 -7 / ° C, 34 ⁇ 10 -7 to 44 ⁇ 10 -7 / ° C, and particularly 35 ⁇ 10 -7 to 43 ⁇ 10 -7 / ° C. By doing so, it becomes easy to match with the coefficient of thermal expansion of Si used for the TFT.
• Young's modulus is preferably 80 GPa or more, 80 GPa or more, 81 GPa or more, 81.5 GPa or more, 82 GPa or more, 82.5 GPa or more, 83 GPa or more, 83.5 GPa or more, 84 GPa or more, 84.5 GPa or more, especially 85 to 120 GPa. be. If Young's modulus is too low, problems due to bending of the glass plate are likely to occur.
• the strain points are preferably 700 ° C. or higher, 705 ° C. or higher, 710 ° C. or higher, 715 ° C. or higher, 720 ° C. or higher, 725 ° C. or higher, 730 ° C. or higher, 732 ° C. or higher, 735 ° C. or higher, 737 ° C. or higher, particularly 740 to 800. °C.
• the heat shrinkage of the glass plate can be suppressed in the LTPS process.
• the liquid phase temperature is preferably 1350 ° C. or lower, less than 1350 ° C., 1300 ° C. or lower, 1290 ° C. or lower, 1285 ° C. or lower, 1280 ° C. or lower, 1275 ° C. or lower, 1270 ° C. or lower, particularly 1260 to 1200 ° C. By doing so, it becomes easy to prevent a situation in which devitrification crystals are generated during glass production and productivity is lowered. Further, since it is easy to mold by the overflow down draw method, it is easy to improve the surface quality of the glass plate and it is possible to reduce the manufacturing cost of the glass plate.
• the liquidus temperature is an index of devitrification resistance, and the lower the liquidus temperature, the better the devitrification resistance.
• the liquidus viscosity is preferably 10 4.0 dPa ⁇ s or more, 10 4.1 dPa ⁇ s or more, 10 4.2 dPa ⁇ s or more, and particularly 10 4.3 to 10 7.0 dPa ⁇ s.
• devitrification is less likely to occur during molding, which facilitates molding by the overflow downdraw method, and as a result, it is possible to improve the surface quality of the glass plate and reduce the manufacturing cost of the glass plate. Can be transformed into.
• the liquidus viscosity is an index of devitrification resistance and moldability, and the higher the liquidus viscosity, the better the devitrification resistance and moldability.
• the temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s is preferably 1650 ° C. or lower, 1630 ° C. or lower, 1610 ° C. or lower, and particularly 1400 to 1600 ° C. If the temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s is too high, it becomes difficult to melt the glass batch and the manufacturing cost of the glass plate rises.
• the temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s corresponds to the melting temperature, and the lower the temperature, the better the melting property.
• the ⁇ -OH value is an index showing the amount of water in the glass, and when the ⁇ -OH value is lowered, the strain point can be increased. Even if the glass composition is the same, the smaller the ⁇ -OH value, the smaller the heat shrinkage at the temperature below the strain point.
• the ⁇ -OH value is preferably 0.35 / mm or less, 0.30 / mm or less, 0.28 / mm or less, 0.25 / mm or less, and particularly 0.20 / mm or less. If the ⁇ -OH value is too small, the meltability tends to decrease. Therefore, the ⁇ -OH value is preferably 0.01 / mm or more, particularly 0.03 / mm or more.
• Examples of the method for lowering the ⁇ -OH value include the following methods. (1) Select a raw material with a low water content. (2) Add a component (Cl, SO 3, etc.) that lowers the ⁇ -OH value to the glass. (3) Reduce the amount of water in the atmosphere inside the furnace. (4) N 2 bubbling is performed in the molten glass. (5) Use a small melting furnace. (6) Increase the flow rate of the molten glass. (7) The electric melting method is adopted.
• ⁇ -OH value refers to a value obtained by measuring the transmittance of glass using FT-IR and using the following formula 1.
• the non-alkali glass plate of the present invention is preferably molded by the overflow down draw method.
• the overflow down draw method molten glass is overflowed from both sides of a heat-resistant gutter-shaped structure, and the overflowed molten glass is merged at the lower end of the gutter-shaped structure and stretched downward to produce a glass plate.
• the method In the overflow down draw method, the surface of the glass plate, which should be the surface, does not come into contact with the gutter-shaped refractory and is formed in a free surface state. Therefore, it is possible to inexpensively manufacture a glass plate that is unpolished and has good surface quality, and it is easy to reduce the thickness.
• a glass plate in addition to the overflow down draw method, it is also possible to form a glass plate by, for example, a down draw method (slot down method, etc.), a float method, or the like.
• a down draw method slot down method, etc.
• a float method or the like.
• the plate thickness is not particularly limited, but is preferably less than 0.7 mm, 0.6 mm or less, less than 0.6 mm, and particularly preferably 0.05 to 0.5 mm.
• the plate thickness can be adjusted by adjusting the flow rate at the time of glass production, the plate pulling speed, and the like.
• the non-alkali glass plate of the present invention is preferably used for an organic EL device, particularly a substrate for a display panel for an organic EL television, and a carrier for manufacturing an organic EL display panel.
• an organic EL device particularly a substrate for a display panel for an organic EL television
• a carrier for manufacturing an organic EL display panel In particular, in the use of organic EL televisions, after making a plurality of devices on a glass plate, each device is divided and cut to reduce the cost (so-called multi-chamfering). Since the non-alkali glass plate of the present invention has a low liquidus temperature and a high liquidus viscosity, it is easy to form a large glass plate, and such a requirement can be accurately satisfied.
• Tables 1 to 3 show examples (samples No. 1 to 32) of the present invention.
• a glass batch containing a glass raw material was placed in a platinum crucible so as to have the glass composition shown in the table, and melted at 1600 to 1650 ° C. for 24 hours.
• the glass batch it was stirred using a platinum stirrer to homogenize it.
• the molten glass was poured onto a carbon plate, formed into a plate shape, and then slowly cooled at a temperature near the slow cooling point for 30 minutes.
• the average thermal expansion coefficient CTE in the temperature range of 30 ⁇ 380 ° C., density, Young's modulus, strain point Ps, the annealing point Ta, the softening point Ts, the temperature in the high temperature viscosity 10 4 dPa ⁇ s, the high-temperature The temperature at a viscosity of 10 3 dPa ⁇ s, the temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s, the liquidus temperature TL, and the viscosity log 10 ⁇ TL at the liquidus temperature TL were evaluated.
• the average coefficient of thermal expansion CTE in the temperature range of 30 to 380 ° C. is a value measured by a dilatometer.
• Density is a value measured by the well-known Archimedes method.
• Young's modulus refers to the value measured by the well-known resonance method.
• strain point Ps, the slow cooling point Ta, and the softening point Ts are values measured based on the methods of ASTM C336 and C338.
• the temperature at the high temperature viscosity of 10 4 dPa ⁇ s, 10 3 dPa ⁇ s, and 10 2.5 dPa ⁇ s is a value measured by the platinum ball pulling method.
• the liquidus temperature TL is the temperature at which crystals precipitate after passing through a standard sieve of 30 mesh (500 ⁇ m) and placing the glass powder remaining in 50 mesh (300 ⁇ m) in a platinum boat and holding it in a temperature gradient furnace for 24 hours. be.
• the liquid phase viscosity log 10 ⁇ TL is a value obtained by measuring the viscosity of the glass at the liquid phase temperature TL by the platinum ball pulling method.
• the sample No. 1-32 the glass composition is regulated within a predetermined range, Young's modulus of more than 85 GPa, strain point 733 ° C. or higher, the liquidus temperature is 1295 ° C. or less, the liquidus viscosity is 10 4.0 dPa ⁇ s That is all. Therefore, the sample No. 1 to 32 are suitable for the substrate of an organic EL device because they are excellent in productivity and have a sufficiently high strain point and Young's modulus.
• the non-alkali glass plate of the present invention is suitable as a substrate for manufacturing organic EL devices, particularly display panels for organic EL televisions, and carriers for manufacturing organic EL display panels. Also for glass substrates for magnetic recording media, cover glasses for image sensors such as charge coupling elements (CCDs) and 1x proximity solid-state imaging elements (CIS), substrates and cover glasses for solar cells, substrates for organic EL lighting, etc. Suitable.
• CCDs charge coupling elements
• CIS proximity solid-state imaging elements

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• 2021
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