WO2021246091A1 - Dispositif d'inspection, système de montage de composant et procédé de fabrication de substrat - Google Patents

Dispositif d'inspection, système de montage de composant et procédé de fabrication de substrat Download PDF

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Publication number
WO2021246091A1
WO2021246091A1 PCT/JP2021/016757 JP2021016757W WO2021246091A1 WO 2021246091 A1 WO2021246091 A1 WO 2021246091A1 JP 2021016757 W JP2021016757 W JP 2021016757W WO 2021246091 A1 WO2021246091 A1 WO 2021246091A1
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WIPO (PCT)
Prior art keywords
component
identification information
mounting
unit
position detection
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PCT/JP2021/016757
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English (en)
Japanese (ja)
Inventor
正宏 木原
敬明 横井
昌弘 谷口
利彦 永冶
勝彦 赤坂
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2022528490A priority Critical patent/JPWO2021246091A1/ja
Priority to CN202180039366.8A priority patent/CN115669256A/zh
Publication of WO2021246091A1 publication Critical patent/WO2021246091A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present disclosure relates to an inspection device for inspecting parts mounted on a substrate, a component mounting system including this inspection device, and a substrate manufacturing method using this component mounting system.
  • a component mounting system equipped with a component mounting device that holds (picks up) a component by a mounting head and mounts the component on a board and an inspection device that receives a board on which the component is mounted by the component mounting device and inspects the component is known.
  • the component mounting device detects the position of the component held by the mounting head as the holding component position, and mounts the component on the substrate based on the detected position of the holding component.
  • the inspection device detects the position of the component mounted on the board as the mounting component position, and based on the amount of positional deviation from the detected mounting component position reference position (target mounting coordinate set on the board). It is designed to judge the quality of the mounted state.
  • the amount of misalignment calculated by the inspection device is fed back to the component mounting device and used to correct the operating parameters of the mounting head when the component mounting device mounts the component on the substrate (see, for example, Patent Document 1 below). .
  • the inspection device of one aspect of the present disclosure is an inspection device that inspects a component mounted on a substrate, and includes a mounted component position detecting unit that detects the position of the component mounted on the board as a mounted component position, and the above-mentioned.
  • the position deviation amount calculation unit that calculates the position deviation amount of the mounting component position from the predetermined reference position detected by the mounting component position detection unit and the position deviation amount calculated by the position deviation amount calculation unit.
  • the first identification information which is the identification information of the component position detection method used when the mounting component position is detected by the mounting component position detecting unit and the quality determining unit that determines the quality of the mounting state of the component based on the above.
  • a first output unit that outputs the misalignment amount calculated by the misalignment amount calculation unit.
  • the component mounting system of another aspect of the present disclosure inspects a component mounting device that holds a component by a mounting head and mounts the held component on a substrate, and the component mounted on the substrate by the component mounting device.
  • a component mounting system including an inspection device for mounting, wherein the inspection device is provided with a mounting component position detection unit that detects the position of the component mounted on the substrate as a mounting component position, and a mounting component position detection unit.
  • the mounting of the component is based on the misalignment amount calculation unit that calculates the amount of misalignment of the detected mounting component position from the predetermined reference position and the misalignment amount calculated by the misalignment amount calculation unit.
  • the quality determination unit for determining the quality of the state, the first identification information which is the identification information of the component position detection method used when the mounting component position is detected by the mounting component position detecting unit, and the misalignment amount calculation.
  • a first output unit for outputting the position deviation amount calculated by the unit is provided.
  • Another aspect of the substrate manufacturing method of the present disclosure is a board manufacturing method for manufacturing a mounting board on which a component is mounted on the board, the component holding step of holding the component by a mounting head, and the component holding step of the component holding step.
  • the holding part position detection process that detects the position of the part held by the mounting head as the holding part position
  • the holding part position detection step that detects the part held by the mounting head.
  • a component mounting step of operating the mounting head to mount the component on the board a mounting component position detection step of detecting the position of the component mounted on the board as the mounting component position by the component mounting process, and a mounting component position.
  • the part is based on the position deviation calculation step of calculating the position deviation amount of the mounted component position detected in the detection step from the predetermined reference position and the position deviation amount calculated in the position deviation amount calculation step.
  • the first identification information which is the identification information of the component position detection method used when the mounting component position is detected
  • the position deviation amount calculation step which determines the quality of the mounting state.
  • the component position detection used when the first output step for outputting the misalignment amount and the first identification information output in the first output step are used when the holding component position is detected in the holding component position detection step.
  • the operation parameter is corrected, the component is mounted on the substrate by using the corrected operation parameter.
  • Another aspect of the substrate manufacturing method of the present disclosure is a board manufacturing method for manufacturing a mounting board on which a component is mounted on the board, the component holding step of holding the component by a mounting head, and the component holding step of the component holding step.
  • the holding part position detection process that detects the position of the part held by the mounting head as the holding part position
  • the holding part position detection step that detects the part held by the mounting head.
  • a component mounting step of operating the mounting head to mount the component on the board a mounting component position detection step of detecting the position of the component mounted on the board as the mounting component position by the component mounting process, and a mounting component position.
  • the part is based on the position deviation calculation step of calculating the position deviation amount of the mounted component position detected in the detection step from the predetermined reference position and the position deviation amount calculated in the position deviation amount calculation step.
  • the first identification information which is the identification information of the component position detection method used when the mounting component position is detected, and the position deviation amount calculation step, which determines the quality of the mounting state.
  • the operation parameter is corrected by using the correction value obtained based on the position shift amount calculated in the position shift amount calculation step.
  • the component mounting step when the operation parameter is corrected in the correction process, the component is mounted on the substrate by using the corrected operation parameter.
  • FIG. 1 is a configuration diagram of a component mounting system according to the first embodiment of the present disclosure.
  • FIG. 2 is a perspective view of a component mounting device constituting the component mounting system according to the first embodiment of the present disclosure.
  • FIG. 3 is a block diagram showing a control system of the component mounting device according to the first embodiment of the present disclosure.
  • FIG. 4 is a diagram showing an example of a component position detection method used by the component mounting system according to the first embodiment of the present disclosure.
  • FIG. 5 is a diagram showing an example of mounting data stored in the component mounting device according to the first embodiment of the present disclosure.
  • FIG. 6 is a perspective view of an inspection device constituting the component mounting system according to the first embodiment of the present disclosure.
  • FIG. 7 is a block diagram showing a control system of the inspection device according to the first embodiment of the present disclosure.
  • FIG. 8 is a diagram showing an example of inspection reference data stored in the inspection apparatus according to the first embodiment of the present disclosure.
  • FIG. 9 is a diagram illustrating the amount of misalignment of parts calculated by the inspection device according to the first embodiment of the present disclosure.
  • FIG. 10 is a diagram showing an example of misalignment amount data output by the inspection device according to the first embodiment of the present disclosure.
  • FIG. 11 is a block diagram showing a control system of the management device according to the first embodiment of the present disclosure.
  • FIG. 12 is a flowchart showing a flow of component mounting work executed by the component mounting device according to the first embodiment of the present disclosure.
  • FIG. 13 is a flowchart showing a flow of inspection work executed by the inspection apparatus according to the first embodiment of the present disclosure.
  • FIG. 14 is a flowchart showing a flow of management work executed by the management device according to the first embodiment of the present disclosure.
  • FIG. 15 is a flowchart showing a flow of correction work of operation parameters executed by the component mounting device in the correction processing step according to the first embodiment of the present disclosure.
  • FIG. 16 is a flowchart showing a flow of component mounting work executed by the component mounting device according to the second embodiment of the present disclosure.
  • FIG. 17 is a flowchart showing a flow of management work executed by the management device according to the second embodiment of the present disclosure.
  • FIG. 18 is a flowchart showing a flow of correction work of operating parameters executed by the component mounting device according to the second embodiment of the present disclosure.
  • the component mounting device and the inspection device each detect the position of the component by using a unique component position detection method.
  • the component mounting device detects the position of the holding component by using the position of the center of gravity of a plurality of leads of the component as the representative position of the component
  • the inspection device detects the position of the mounted component by using the position of the center of gravity of the body of the component as the representative position of the component. do.
  • the component position detection method used when the inspection device detects the position of the mounted component and the component position detection method used when the component mounting device detects the position of the holding component are different, the calculation is performed by the inspection device. If the amount of misalignment is directly fed back to the component mounting device to correct the operating parameters, the mounting accuracy of the component may decrease.
  • an object of the present disclosure is to provide an inspection device, a component mounting system, and a substrate manufacturing method capable of correcting operating parameters at the time of component mounting without deteriorating the component mounting accuracy.
  • FIG. 1 shows the configuration of the component mounting system 1 according to the first embodiment of the present disclosure.
  • the component mounting system 1 includes a component mounting device 11, an inspection device 12, and a management device 13.
  • the component mounting device 11 receives the board KB from the device on the upstream side (for example, a solder printing device), and performs the component mounting work of mounting the component BH on the board KB.
  • the component mounting device 11 detects the holding component position, which is the position of the held component BH (that is, before being mounted on the board KB).
  • the component BH is mounted so that the detected position of the holding component matches the target mounting coordinates set on the board KB.
  • the inspection device 12 is arranged on the downstream side of the component mounting device 11, receives the board KB carried out from the component mounting device 11, and performs an inspection work to inspect the mounted state of the component BH mounted on the board KB. .. In this inspection work, the inspection device 12 detects the position of the mounted component, which is the position of each component BH mounted on the board KB, and the detected mounted component position is the target mounting coordinate (reference position) set on the board KB. ), And then the quality of the mounted state on the board KB is determined.
  • the management device 13 is connected to the component mounting device 11 and the inspection device 12 in a communicable state.
  • the management device 13 acquires information from the component mounting device 11 and the inspection device 12 and manages the respective operations.
  • FIG. 2 is a perspective view of the component mounting device 11 constituting the component mounting system 1.
  • the component mounting device 11 includes a board transport path 21, a component supply unit 22, a mounting head 23, a head moving mechanism 24, a component recognition camera 25, a mounting device display input unit 26, and a mounting device control unit 27.
  • the board transport path 21 carries in, positions, and carries out the board KB.
  • the component supply unit 22 is composed of, for example, a tape feeder, and supplies the component BH to a predetermined position.
  • the mounting head 23 includes a nozzle 23N extending downward. The mounting head 23 can raise and lower the nozzle 23N and rotate it around the vertical axis, and can attract the component BH supplied by the component supply unit 22 to the lower end of the nozzle 23N.
  • the head moving mechanism 24 includes an XY beam mechanism including a fixed beam 24a and a moving beam 24b that is movable with respect to the fixed beam 24a.
  • the head moving mechanism 24 moves the mounting head 23 in a horizontal plane by combining an operation of moving the moving beam 24b with respect to the fixed beam 24a and an operation of moving the mounting head 23 with respect to the moving beam 24b.
  • the mounting head 23 moves in a horizontal plane, moves the nozzle 23N up and down and rotates, and sucks and releases the component BH by the nozzle 23N to hold (pick up) the component BH supplied by the component supply unit 22.
  • the held component BH is mounted on the board KB.
  • the component recognition camera 25 is provided between the substrate transport path 21 and the component supply unit 22 with the imaging field of view facing upward.
  • the component recognition camera 25 captures the component BH from below when the mounting head 23 having the component BH adsorbed on the lower end of the nozzle 23N passes above.
  • the image of the component BH obtained by imaging the component recognition camera 25, that is, the image of the component BH held by the mounting head 23 (holding component image) is the position of the component BH held by the mounting head 23 (holding component position). ) And the recognition of its component BH.
  • the mounting device display input unit 26 is composed of, for example, a touch panel.
  • the mounting device display input unit 26 accepts input operations by the operator, and notifies the operator of the work to be performed by the operator and various information by screen, voice, or the like.
  • FIG. 3 is a block diagram showing a control system of a component mounting device.
  • the mounting device control unit 27 includes a mounting device storage unit 31, a mounting processing unit 32, a holding component position calculation unit 33, a feedback processing unit 34, and a mounting device communication unit 35.
  • the production data 41 is stored in the mounting device storage unit 31.
  • the production data 41 includes the component data 41a, the mounting program 41b, the second identification information 41c, and the mounting data 41d.
  • the component data 41a is data that defines the target mounting coordinates of the component BH set on the board KB, the type of the component BH mounted on the target mounting coordinates, the mounting direction, and the like.
  • each part of the component mounting device 11 (part supply unit 22, mounting head 23, head moving mechanism 24, This is a control program that operates the component recognition camera 25, etc.).
  • the second identification information 41c is identification information of the component position detection method used when detecting the position of the holding component which is the position of the component BH held by the mounting head 23 (information for distinguishing from other component position detection methods).
  • the component position detection method is a method for detecting the representative position of the component BH required when detecting the position of the component BH.
  • FIG. 4 is a diagram showing an example of a component position detection method used by the component mounting system 1.
  • a detection method based on the "lead number" or "body” of a lead component having a plurality of lead RDs projecting to the side of the body BD of the above is prepared.
  • the component position detection method based on the "position of the electrode” of the chip component is a component position detection method in which the midpoint position between the positions of the centers of gravity of the two electrodes DK of the chip component is the representative position of the component BH. And the number "0001" is assigned as the identification information.
  • the component position detection method based on the "outer shape" of a chip component is a component position detection method in which the position of the center of gravity of the entire outer shape of the chip component is the representative position of the component, and the number "0002" is assigned as identification information. ing.
  • the component position detection method based on the "body” of a chip component is a component position detection method in which the position of the center of gravity of the body BD of the chip component is the representative position of the component BH, and the number "0003" is assigned as identification information.
  • the component position detection method based on the "lead number" of a lead component is a component position detection method in which the center of gravity of a plurality of lead RDs having a specific number is set as a representative position of the component BH among a plurality of lead RDs possessed by the lead component. It is a method, and a number "0004" is assigned as identification information.
  • the component position detection method based on the "body” of the lead component is a component position detection method in which the position of the center of gravity of the body BD is the representative position of the component BH, and the number "0005" is assigned as the identification information.
  • FIG. 5 shows an example of mounting data 41d.
  • the misalignment amount data 42 is stored in the mounting device storage unit 31.
  • the misalignment amount data 42 is data calculated by the inspection device 12 and sent through the management device 13 as described later.
  • the mounting processing unit 32 operates the board transport path 21, the component supply unit 22, the mounting head 23, and the head moving mechanism 24 based on the mounting program 41b stored in the mounting device storage unit 31.
  • the board transport path 21 carries in and positions the board KB
  • the component supply unit 22 supplies the component BH
  • the head moving mechanism 24 and the mounting head 23 operate in conjunction with each other to repeatedly execute the mounting turn.
  • the component BH is mounted on the board KB one after another.
  • the mounting head 23 holds the component BH (part holding operation), passes above the component recognition camera 25 (passing above the camera), and mounts the component BH (mounting operation). ) In this order.
  • the mounting head 23 moves above the component supply unit 22 and attracts the component BH supplied by the component supply unit 22 by the nozzle 23N.
  • the mounting head 23 passes above the component recognition camera 25 and causes the component recognition camera 25 to take an image of the component BH attracted to the nozzle 23N from below.
  • an image of the component BH held by the mounting head 23 (holding component image) is acquired, and the component BH is recognized.
  • the mounting head 23 moves above the board KB, and the component BH is mounted at the target mounting coordinates on the board KB based on the recognition result of the component BH.
  • the holding component position calculation unit 33 calculates the position (representative position) of the component BH based on the holding component image acquired by the image pickup of the component recognition camera 25. For the calculation of the position of the component BH, one component position detection method selected from the above-mentioned plurality of component position detection methods is used. In this way, the component recognition camera 25 and the holding component position calculation unit 33 constitute a holding component position detecting unit 45 that detects the holding component position, which is the position of the component BH held by the mounting head 23.
  • the feedback processing unit 34 performs feedback processing based on the feedback information output from the inspection device 12.
  • the main content of the feedback process is the correction of the operating parameters of the mounting head 23 when the component mounting device 11 mounts the component BH on the board KB.
  • the "operation parameter" is control data for operating the mounting head 23 so that the component BH is mounted at the target mounting coordinates on the board KB.
  • the feedback processing unit 34 will be described after the description of the inspection device 12 and the management device 13.
  • the mounting device communication unit 35 is connected to both the management device 13 and the inspection device 12 so as to be able to communicate (see FIG. 3).
  • the mounting device communication unit 35 receives the information detected by the inspection device 12 via the management device 13.
  • FIG. 6 is a perspective view of the inspection device 12 constituting the component mounting system 1.
  • the inspection device 12 includes a substrate transport unit 51, an inspection camera 52, a camera moving mechanism 53, an inspection device display input unit 54, and an inspection device control unit 55.
  • the board transfer unit 51 carries in, positions, and carries out the board KB.
  • the inspection camera 52 points the imaging field of view downward.
  • the camera moving mechanism 53 includes an XY beam mechanism provided with a fixed beam 53a and a moving beam 53b that is movable with respect to the fixed beam 53a.
  • the camera moving mechanism 53 moves the inspection camera 52 in a horizontal plane by combining an operation of moving the moving side beam 53b with respect to the fixed side beam 53a and an operation of moving the inspection camera 52 with respect to the moving side beam 53b. It is moved, and each component BH mounted on the substrate KB is imaged from above by the component mounting device 11.
  • the inspection device display input unit 54 is composed of, for example, a touch panel.
  • the inspection device display input unit 54 accepts the input operation by the operator, and notifies the operator of the work to be performed by the operator and various information by screen, voice, or the like.
  • FIG. 7 is a block diagram showing a control system of the inspection device 12.
  • the inspection device control unit 55 includes an inspection device storage unit 61, an inspection processing unit 62, a mounted component position calculation unit 63, a misalignment amount calculation unit 64, a quality determination unit 65, and an inspection device communication unit 66 ( It is equipped with a first output unit).
  • the inspection data 71 is stored in the inspection device storage unit 61.
  • the inspection data 71 includes inspection component data 71a, inspection program 71b, first identification information 71c, and inspection reference data 71d.
  • the inspection part data 71a is the same data as the part data 41a of the production data 41 stored in the inspection device storage unit 61.
  • each part (board transfer unit) of the inspection device 12 is inspected to check whether each part BH mounted on the board KB by the component mounting device 11 is mounted in a predetermined direction at the target mounting coordinates.
  • 51, inspection camera 52, camera movement mechanism 53, etc. is a control program that operates.
  • the first identification information 71c is the identification information of the component position detection method used when detecting the position of the mounted component, which is the position of the component BH mounted on the board KB.
  • the component position detection method used when detecting the position of the mounted component is the same as the component position detection method (FIG. 4) used here when detecting the position of the holding component, but when detecting the position of the mounted component. It is sufficient that at least a part of the component position detection method used and the component position detection method used for detecting the holding component position match (common).
  • FIG. 8 is a diagram showing an example of inspection standard data stored in the inspection device.
  • FIG. 8 shows an example of inspection reference data 71d.
  • the first identification information 71c that is, the component position detection method
  • the first identification information 71c that is, the component position detection method
  • the inspection processing unit 62 acquires an image (inspection image) of each component BH by capturing all of the plurality of component BHs mounted on the substrate KB with the inspection camera 52. At this time, the inspection processing unit 62 takes an image on the inspection camera 52 while moving the inspection camera 52 above the substrate KB positioned by the substrate transport unit 51 based on the inspection program 71b stored in the inspection device storage unit 61. Have the operation repeated.
  • the mounted component position calculation unit 63 calculates the position of the component BH (mounted component position) based on the inspection image acquired by the inspection camera 52.
  • the component position detection method used when detecting the mounted component position of the component BH is defined for each component BH (see the “identification information” column in FIG. 8), and the defined component position detection method reads out. And used.
  • the mounted component position calculation unit 63 of the inspection camera 52 and the inspection device control unit 55 constitutes a mounted component position detecting unit 67 that detects the mounted component position, which is the position of the component BH mounted on the board KB. ..
  • the mounted component position detecting unit 67 detects the mounted component position of each component BH by the component position detecting method corresponding to the first identification information 71c defined in the inspection reference data 71d.
  • the misalignment amount calculation unit 64 determines the position of the mounted component of each component BH on the board KB detected by the mounted component position detection unit 67, and the predetermined component BH (stored in the inspection device storage unit 61). The amount of misalignment from the reference position MZ (target mounting coordinates) of is calculated.
  • FIG. 9 is a diagram illustrating the amount of misalignment of parts calculated by the inspection device 12.
  • FIG. 9 is an example of the inspection image GZ, and shows a state in which the representative position ZP of the target component BH deviates from the reference position MZ. In FIG.
  • the reference position MZ on the substrate KB is represented by the coordinates of the X-axis and the Y-axis orthogonal to each other in the plane of the substrate KB, it is between the representative position ZP of the component BH and the position of the reference position MZ.
  • the amount of misalignment (DX, DY) of the component BH is obtained from the difference (DX) in the X-axis direction and the difference (DY) in the Y-axis direction.
  • FIG. 10 shows an example of the misalignment amount data 42 output by the inspection device 12.
  • the misalignment amount data 42 includes the number of the component BH to be inspected (serial number: A001, A002, ...) And the inspection result corresponding to the number of the component BH, that is, the detected misalignment amount of the component BH (misalignment amount data 42).
  • identification information first identification information
  • the amount of misalignment itself is shown, but it is shown by the coordinates of the detected position of the component BH (position of the mounted component), and the amount of misalignment of the component BH is obtained from the difference between the position of the mounted component and the reference position MZ. It may be.
  • the quality determination unit 65 makes a quality determination to determine the quality (whether or not the mounted state is good) of each component BH based on the position deviation amount calculated by the position deviation amount calculation unit 64. Specifically, the misalignment amount of the component BH calculated by the misalignment amount calculation unit 64 is compared with the allowable value determined corresponding to the component BH, and whether the misalignment amount is equal to or less than the allowable value. Judge whether or not.
  • the quality determination unit 65 determines that the mounting state of the component BH is good when the misalignment amount of the component BH is equal to or less than the allowable value, and the misalignment amount of the component BH is the allowable value. If it exceeds, it is determined that the mounting state of the component BH is defective. For example, in the case of the example of FIG. 9, if the permissible value of the misalignment amount is RX in the X-axis direction and RY in the Y-axis direction, the pass / fail determination unit 65 is when DX ⁇ RX and DY ⁇ RY. It is determined that the mounting state of the component BH is good. On the other hand, when the quality determination unit 65 determines that DX> RX or DY> RY, the mounting state of the component BH is defective. It is assumed that the allowable value data for each component BH is stored in the inspection device storage unit 61.
  • the inspection device communication unit 66 is connected to both the management device 13 and the component mounting device 11 so as to be able to communicate (see FIG. 7).
  • the inspection device communication unit 66 was calculated by the first identification information 71c, which is the identification information of the component position detection method used by the mounting component position detection unit 67 to detect the mounting component position, and the misalignment amount calculation unit 64.
  • the misalignment amount data 42 for each component BH information on the pass / fail determination result for each component BH on the substrate KB determined by the pass / fail determination unit 65 is output (transmitted to the management device 13).
  • FIG. 11 is a block diagram showing a control system of the management device 13.
  • the management device 13 includes a management device storage unit 81, an identification information determination unit 82, a management device communication unit 83, and a management device display input unit 84.
  • the management device storage unit 81 stores the production master data 91, which is the master data of the production data 41 stored in the mounting device storage unit 31 of the component mounting device 11, and the inspection device storage unit 61 of the inspection device 12.
  • the inspection master data 92 which is the master data of the inspection data 71, is stored.
  • the identification information determination unit 82 acquires the first identification information 71c output from the inspection device 12 and the second identification information 41c output from the component mounting device 11. Then, by comparing the first identification information 71c and the second identification information 41c, it is determined whether or not the first identification information 71c matches the second identification information 41c.
  • the inspection information 93 and the identification information determination result 94 are stored in the management device storage unit 81.
  • the inspection information 93 is data such as the result of inspection by the inspection device 12 (positional deviation amount data 42 for each component BH and the result of quality determination), and the identification information determination result 94 is determined by the identification information determination unit 82. It is the data of the result (identification information determination result).
  • the management device communication unit 83 is connected to both the component mounting device 11 and the inspection device 12 so as to be able to communicate with each other.
  • the management device communication unit 83 transmits (transfers) information such as the misalignment amount data 42 detected and sent by the inspection device 12 to the component mounting device 11.
  • the feedback processing unit 34 included in the mounting device control unit 27 of the component mounting device 11 will be described.
  • the feedback processing unit 34 includes a correction unit 43 and an information aggregation unit 44.
  • the correction unit 43 obtains the correction value of the operation parameter when the mounting head 23 mounts the component BH on the board KB based on the misalignment amount sent from the management device 13 (that is, calculated by the inspection device 12). , The operation parameter is corrected using the obtained correction value.
  • the result (identification information determination result) determined by the identification information determination unit 82 of the management device 13 is transmitted to the correction unit 43 of the component mounting device 11.
  • the correction unit 43 receives from the management device 13 the result that the first identification information 71c is determined to match the second identification information 41c
  • the correction unit 43 operates parameters based on the amount of misalignment sent from the management device 13.
  • the correction value of is calculated, and the operation parameter is corrected using the calculated correction value.
  • the correction unit 43 receives from the management device 13 the result that the first identification information 71c is determined not to match the second identification information 41c, the misalignment amount data of the component BH determined to be inconsistent is received. 42 is not used as data for calculating the correction value of the operation parameter.
  • the identification information determination result 94 is stored in the management device storage unit 81, when it is determined that the first identification information 71c does not match the second identification information 41c. , It is possible for the operator to confirm these determination results.
  • the identification information determination result 94 is stored in the management device storage unit 81 here, but it may be stored in another storage unit.
  • the information aggregation unit 44 aggregates information on the mounting accuracy of the component BH using the misalignment amount data 42 of each component BH sent from the inspection device 12 through the management device 13. Specifically, the information totaling unit 44 determines that the first identification information 71c matches the second identification information 41c in the identification information determination unit 82. Information on the mounting accuracy of the component BH is aggregated using the information of the misalignment amount data 42. On the other hand, the information totaling unit 44 determines that the first identification information 71c does not match the second identification information 41c in the identification information determination unit 82, and the position of the component BH sent by the inspection device 12 is determined by the information aggregation unit 44. The deviation information is not used as data for aggregating information on the mounting accuracy of the component BH.
  • the flowchart shown in FIG. 12 shows the flow of the component mounting work (a board manufacturing method for manufacturing a mounting board on which the component BH is mounted on the board KB) performed by the component mounting device 11 in the component mounting system 1.
  • the component mounting device 11 receives the board KB sent from the upstream side by the board transport path 21 and positions it at a predetermined component mounting work position (step ST1).
  • the identifier attached to the surface of the board KB is read and stored.
  • the mounting head 23 is moved above the component supply unit 22, and the component BH supplied by the component supply unit 22 is held (picked up) by the nozzle 23N (step ST2). . Parts holding process).
  • the mounting head 23 is moved to pass above the component recognition camera 25, and the component recognition camera 25 is made to acquire an image of the component BH (holding component image) (step ST3).
  • the component recognition camera 25 acquires the image of the holding component
  • the second identification information 41c corresponding to the component BH projected on the image of the holding component is acquired (step ST4).
  • the component mounting device 11 After the component mounting device 11 acquires the second identification information 41c, the component mounting device 11 detects the position of the holding component, which is the position of the component BH held by the mounting head 23, by the component position detection method corresponding to the acquired second identification information 41c. (Step ST5. Holding component position detection step). Then, after correcting the operation parameters in a predetermined case (step ST6, correction processing step), the component BH held by the mounting head 23 is mounted on the target mounting coordinates on the board KB (step ST7, component mounting step). ).
  • the component mounting device 11 mounts the component BH held by the mounting head 23 at the target mounting coordinates on the board KB, and then the component position detection unit 45 used when the holding component position detecting unit 45 detects the holding component position in step ST5.
  • the second identification information 41c which is the identification information of the above, is output to the management device 13 together with the information of the identifier of the board KB read in step ST1 (step ST8, the second output step). Then, when all the parts BH to be mounted on the board KB are mounted, the board KB is carried out to the inspection device 12 on the downstream side (step ST9), and the component mounting work per board KB is completed.
  • the flowchart shown in FIG. 13 shows the flow of inspection work performed by the inspection device 12.
  • the inspection device 12 first receives the board KB from the component mounting device 11 and carries it in, and positions the board KB at a predetermined inspection work position (step ST11 shown in FIG. 13).
  • the inspection device 12 reads and stores the identifier attached to the surface of the board KB.
  • the inspection camera 52 is moved by the camera moving mechanism 53 to acquire an image (inspection image) of the component BH mounted on the board KB (step ST12).
  • the inspection device 12 acquires the identification information (first identification information 71c) corresponding to the component position detection method corresponding to the component BH for which the inspection image has been acquired (step ST13).
  • the inspection device 12 After the inspection device 12 acquires the first identification information 71c, the inspection device 12 uses the component position detection method corresponding to the acquired first identification information 71c, and is the position of the component BH mounted on the substrate KB based on the inspection image. The position is detected (step ST14. Mounting component position detection step). Then, when the position of the mounted component is detected, the amount of misalignment of the detected position of the mounted component from the predetermined reference position (target mounting coordinate) is calculated (step ST15, step of calculating the amount of misalignment).
  • the inspection device 12 determines whether or not the component BH is mounted on the substrate KB based on the calculated amount of misalignment (step ST16, pass / fail determination step). After determining the quality of the mounted state of the component BH, the determination result of the quality of each component, the identification information of the component position detection method used when detecting the position of the mounted component (first identification information 71c), and the position deviation calculation step.
  • the information on the amount of misalignment calculated by the misalignment calculation unit 64 is output from the inspection device communication unit 66 to the management device 13 together with the information on the identifier of the board KB read in step ST11 (step ST17, first output step). ). Then, when all the component BHs to be inspected on the substrate KB are inspected, the substrate KB is carried out to the downstream side (step ST18), and the inspection work for each substrate KB is completed.
  • the flowchart shown in FIG. 14 shows the flow of management work performed by the management device 13.
  • the management device 13 first acquires (receives) information on the first identification information 71c output by the inspection device 12 in step ST17 and the amount of misalignment of the component BH (step ST21).
  • the identifier of the board KB is also acquired at the same time.
  • the component mounting device 11 acquires (receives) the second identification information 41c output in the second output step of step ST8 (step ST22).
  • the identifier of the board KB is also acquired at the same time.
  • the order of these steps ST21 and ST22 may be reversed.
  • the management device 13 When the management device 13 acquires the first identification information 71c and the second identification information 41c, the management device 13 confirms that the identifiers of the board KB are the same, and then the first identification information 71c matches the second identification information 41c. It is determined whether or not (step ST23; identification information determination step). Then, the result obtained by the determination (identification information determination result 94) and the information of the misalignment amount of the component BH acquired in step ST17 are transmitted (output) to the component mounting device 11 (step ST24).
  • the flowchart shown in FIG. 15 shows the flow of the operation parameter correction work executed by the component mounting device 11 in the above-mentioned step ST6 (correction processing step).
  • the component mounting device 11 performs the operation parameter correction work
  • first whether or not the identification information determination result 94 output by the management device 13 in step ST24, that is, the first identification information 71c matches the second identification information 41c.
  • Information on the determination result and the amount of misalignment of the component BH is acquired (step ST31).
  • the identification information determination result 94 and the information on the amount of misalignment of the component BH acquired here are obtained from the board KB on which the component mounting device 11 is performing the component mounting work or the inspection device 12 is performing the inspection work at that time. Is also about the previously processed substrate KB (identification information determination result 94 and misalignment amount information).
  • the identification information determination result 94 indicates that "the first identification information matches the second identification information". It is determined whether or not the content is shown (step ST32). As a result, when the identification information determination result 94 is the content indicating that "the first identification information matches the second identification information" (Yes (Y) in step ST32), the information on the amount of misalignment is fed back. Store as data (step ST33). Then, it is determined whether or not the required number of data has been collected (step ST34), and as a result, if the required number of data has been collected (Yes (Y) in step ST34), the correction value of the operation parameter is calculated. The operation parameters are corrected (step ST35), and the information on the mounting accuracy of the component BH is aggregated using the information on the amount of misalignment (step ST36).
  • the determination in step ST34 may be based on whether or not the number of substrate KB on which the component BH is mounted and the inspection thereof has reached a certain number, or the amount of misalignment exceeds a predetermined reference. Whether or not the number of the substrate KB has reached a certain number may be used as a reference.
  • the correction value of the operation parameter is calculated by obtaining the average of the misalignment amount of the number of data that has reached a certain number, and the operation parameter is corrected by the correction value.
  • step ST36 for example, changes in the amount of misalignment are aggregated along the time series, and data is created that can confirm the state in which the amount of misalignment is gradually reduced by correcting the operation parameters.
  • step ST32 when the identification information determination result 94 does not indicate that "the first identification information matches the second identification information" (No (N) in step ST32), that is, in the inspection device 12. If the component position detection method used when detecting the mounting component position of the component BH is different from the component position detection method used when detecting the holding component position of the component BH in the component mounting device 11, it matches. The amount of misalignment of the component BH determined not to be used is not used as data for calculating the correction value of the operation parameter in the component mounting device 11.
  • the component position detection method used when the inspection device 12 detects the mounting component position of the component BH is different from the component position detection method used when the component mounting device 11 detects the holding component position of the component BH.
  • using the misalignment amount of the component BH detected by the inspection device 12 as it is for correcting the operation parameter corrects the operation parameter by using the misalignment amount that is inaccurate for the component mounting device 11. This is to avoid a situation in which the misalignment becomes larger than before the correction.
  • the aggregated result may be inaccurate, so the aggregation itself is not performed.
  • the inspection device 12 of the component mounting system 1 has identification information (first) of the component position detection method used when detecting the position (mounting component position) of the component BH mounted on the substrate KB.
  • the identification information 71c) is output together with the amount of positional deviation from the reference position (target mounting coordinates) of the mounting component position.
  • the management device 13 is a component position detection method used when detecting the first identification information 71c output from the inspection device 12 and the position (holding component position) of the component BH held by the component mounting device 11 by the mounting head 23.
  • the identification information (second identification information 41c) is compared with the identification information (second identification information 41c), and it is determined whether or not the first identification information 71c matches the second identification information 41c (step ST32).
  • the determination result indicates that the first identification information 71c matches the second identification information 41c
  • the determination result is based on the misalignment amount of the component BH calculated by the inspection device 12.
  • the operation parameters are corrected using the obtained correction values (step ST35).
  • the determination result does not indicate that the first identification information 71c matches the second identification information 41c
  • the misalignment amount of the component BH is not used as data for calculating the correction value of the operation parameter. It has become like.
  • the operation parameter can be corrected only when the first identification information 71c matches the second identification information 41c, and the component BH in the component mounting device 11 can be corrected. It is possible to correct the operating parameters at the time of component mounting without deteriorating the mounting accuracy.
  • the component mounting device 11 executes the component mounting operation according to the flow shown in the flowchart of FIG. 16, and the inspection device 12 performs the inspection operation according to the flow shown in the flowchart of FIG. 13 as in the case of the first embodiment.
  • the management device 13 executes the management work according to the flow shown in the flowchart of FIG. Further, the component mounting device 11 executes the operation parameter correction work according to the flow shown in the flowchart of FIG.
  • FIG. 16 is a flowchart showing the flow of the component mounting work executed by the component mounting device 11.
  • the component mounting device 11 first transfers the substrate KB sent from the upstream side by the substrate transport path 21 as in the case of the first embodiment. It is received and positioned at a predetermined component mounting work position (step ST41). After the board KB is positioned by the board transfer path 21, the mounting head 23 is moved above the component supply section 22 and the component BH supplied by the component supply section 22 is held (picked up) by the nozzle 23N (step ST42. Holding process).
  • the mounting head 23 is moved to pass above the component recognition camera 25, and the component recognition camera 25 is made to acquire an image (holding component image) of the component BH (step ST43). Then, when the component recognition camera 25 acquires the holding component image, the second identification information 41c corresponding to the component BH projected on the holding component image is acquired (step ST44).
  • the component mounting device 11 After the component mounting device 11 acquires the second identification information 41c, the component mounting device 11 detects the position of the holding component, which is the position of the component BH held by the mounting head 23, by the component position detection method corresponding to the acquired second identification information 41c. (Step ST45. Holding component position detection step). Then, after correcting the operation parameters in a predetermined case (step ST46, correction processing step), the component BH held by the mounting head 23 is mounted on the target mounting coordinates on the board KB (step ST47, component mounting step). ).
  • step ST48 the board KB is carried out to the inspection device 12 on the downstream side (step ST48), and the component mounting work per board KB is completed. do.
  • step ST48 the component mounting work per board KB is completed.
  • FIG. 17 is a flowchart showing the flow of management work executed by the management device.
  • the inspection device 12 first outputs the first identification information 71c and the component BH in the first output step (see FIG. 13) of the step ST17.
  • Step ST51 the information on the amount of misalignment of the above is acquired (received).
  • the management device 13 determines whether or not the first identification information 71c is predetermined identification information corresponding to the specific component detection method (step ST52. Identification information determination). Process). Then, the result obtained by the determination (identification information determination result 94) and the information of the misalignment amount of the component BH acquired in step ST17 are transmitted (output) to the component mounting device 11 (step ST53).
  • the first identification information 71c matches the second identification information 41c in the step ST52 corresponding to the step ST23 in the first embodiment as in the case of the first embodiment. Instead of making a determination, it is determined whether or not the first identification information 71c is predetermined identification information.
  • predetermined identification information identification information indicating a component position detection method corresponding to the second identification information 41c in the first embodiment is usually set, and the data is stored in the management device storage unit 81. ..
  • FIG. 18 is a flowchart showing the flow of the operation parameter correction work executed by the component mounting device 11.
  • the identification information determination result that is, the first identification information
  • step ST53 the management work by the management device 13
  • information on the amount of misalignment of the component BH are acquired (step ST61).
  • the identification information determination result 94 and the information on the amount of misalignment of the component BH acquired here are the same as in the case of the first embodiment, at that time, the component mounting device 11 is performing the component mounting work, or the inspection device 12 Is about the substrate KB processed before the substrate KB being inspected (identification information determination result 94 and information on the amount of misalignment).
  • the identification information determination result indicates that "the first identification information is the predetermined identification information". Whether or not it is determined (step ST62).
  • the identification information determination result is the content indicating that "the first identification information is the predetermined identification information" (Y in step ST62)
  • the information on the amount of misalignment is stored as feedback data (Y).
  • Step ST63 it is determined whether or not the required number of data has been collected (step ST64), and as a result, when the required number of data has been collected (Y in step ST64), the correction value is calculated and the operation parameters are corrected.
  • Step ST65 the information on the mounting accuracy of the component BH is aggregated using the information on the amount of misalignment (step ST66).
  • the procedure of determination in step ST64 is the same as in the case of the first embodiment.
  • step ST62 when the identification information determination result 94 does not indicate that "the first identification information is the predetermined identification information" (N in step ST62), that is, the component BH is mounted in the inspection device 12. If the component position detection method used when detecting the component position is different from the component position detection method used when detecting the holding component position of the component BH in the component mounting device 11, the information is not predetermined identification information.
  • the amount of misalignment of the component BH determined to be is not used as data for calculating the correction value of the operation parameter in the component mounting device 11, and is not used as data for aggregating the information regarding the mounting accuracy of the component BH.
  • the inspection information 93 and the identification information determination result 94 are stored in the management device storage unit 81. Therefore, when it is determined that the first identification information 71c does not match the predetermined identification information, the operator can confirm these determination results.
  • the inspection device 12 of the component mounting system 1 has identification information (first) of the component position detection method used when detecting the position (mounting component position) of the component BH mounted on the substrate KB.
  • the identification information 71c) is output together with the amount of positional deviation from the reference position (target mounting coordinates) of the mounting component position.
  • the management device 13 compares the first identification information 71c output from the inspection device 12 with the predetermined identification information set in advance, and determines whether or not the first identification information 71c is the predetermined identification information. (Step ST62).
  • the determination result has the content indicating that the first identification information 71c is the predetermined identification information, it is obtained based on the misalignment amount of the component BH calculated by the inspection device 12.
  • the operation parameter is corrected using the correction value (step ST65).
  • the determination result does not include that the first identification information 71c is the predetermined identification information, the misalignment amount of the component BH is not used as the data for calculating the correction value of the operation parameter. It has become like.
  • the operation parameter can be corrected only when the first identification information 71c matches the predetermined identification information, and the component BH in the component mounting device 11 can be mounted. It is possible to correct the operating parameters at the time of mounting parts without deteriorating the accuracy.
  • the identification information (first identification information) of the component position detection method used when the inspection device 12 detects the position of the mounted component is output, and the first identification information is output.
  • the component mounting device 11 matches the identification information (second identification information) of the component position detection method used when detecting the position of the holding component, or whether or not the identification information is predetermined. It has become so.
  • the operation parameter when the mounting head 23 mounts the component BH on the board KB when the first identification information matches the second identification information, or when the first identification information is the predetermined identification information.
  • the first identification information does not match the second identification information, or if the first identification information does not match the predetermined identification information, it is determined that they do not match, or the identification information does not match.
  • Information on the amount of misalignment of the determined component BH is not used as data for calculating the correction value of the operation parameter. Therefore, when the component position detection method used when the mounting component position is detected in the inspection device 12 matches the component position detection method used when the holding component position is detected in the component mounting device 11. It is possible to correct the operation parameters only for the component BH, and it is possible to correct the operation parameters at the time of component mounting without deteriorating the mounting accuracy of the component BH.
  • the present disclosure is not limited to the above-mentioned ones, and various modifications and the like are possible.
  • the information on the amount of misalignment is stored in the storage unit (mounting device storage unit 31) included in the component mounting device 11, but the information on the amount of misalignment is stored in another device.
  • it may be stored in the storage unit (management device storage unit 81) of the management device 13.
  • the identification information determination unit 82 is provided in the management device 13, but may be provided in the component mounting device 11.
  • the management device 13 does not necessarily have to be provided, and the same effect can be obtained by giving the function of the management device 13 to the component mounting device 11 or the like.
  • each component may be configured by dedicated hardware or may be realized by executing a software program suitable for each component.
  • Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.
  • a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention détermine si des informations d'identification (premières informations d'identification), dans un procédé de détection de position de composant utilisé lorsqu'une position de composant de montage est détectée par un dispositif d'inspection, coïncide avec des informations d'identification (secondes informations d'identification) dans un procédé de détection de position de composant, utilisé lorsqu'une position de composant de maintien est détectée par un dispositif de montage de composant. Lorsque les premières informations d'identification coïncident avec les secondes, un paramètre de fonctionnement est corrigé sur la base d'une quantité de désalignement calculée par le dispositif d'inspection lorsqu'une tête de montage monte un composant sur un substrat. Cependant, lorsque les premières informations d'identification ne coïncident pas avec les secondes, la quantité de désalignement d'un composant pour lequel les premières informations d'identification ne coïncident pas avec les secondes n'est pas utilisée comme données pour calculer une valeur de correction du paramètre de fonctionnement.
PCT/JP2021/016757 2020-06-05 2021-04-27 Dispositif d'inspection, système de montage de composant et procédé de fabrication de substrat WO2021246091A1 (fr)

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