WO2021210668A1 - 耐熱絶縁電線 - Google Patents
耐熱絶縁電線 Download PDFInfo
- Publication number
- WO2021210668A1 WO2021210668A1 PCT/JP2021/015692 JP2021015692W WO2021210668A1 WO 2021210668 A1 WO2021210668 A1 WO 2021210668A1 JP 2021015692 W JP2021015692 W JP 2021015692W WO 2021210668 A1 WO2021210668 A1 WO 2021210668A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- layer
- conductor
- film layer
- resistant insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
- H01B7/292—Protection against damage caused by extremes of temperature or by flame using material resistant to heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/06—Insulation of windings
Definitions
- the present invention relates to a heat-resistant insulated electric wire used for wiring and winding in a device.
- Insulated wires are used in various products.
- an insulated wire When an insulated wire is used as a coil winding of a rotating electric device such as a motor, it is used in a state where a high voltage is applied. At that time, a violent partial discharge (corona discharge) may occur on the surface coated with insulation.
- Such partial discharge is a phenomenon that occurs when the insulating coating deteriorates at an accelerating rate due to a local temperature rise or generation of ozone or ions. The occurrence of partial discharge raises the problem of shortening the life of the equipment in which the component is used.
- Patent Document 1 proposes an insulated wire having an insulating film having a low dielectric constant and a high partial discharge starting voltage.
- This insulated wire is an insulated wire composed of a conductor and an insulating film that covers the conductor, and the insulating film is selected from (A) polyamideimide resin, polyimide resin, polyesterimide resin, and class H polyester resin1. It is formed by applying and baking a mixed resin of one or more kinds of resins and one or more kinds of resins selected from (B) fluororesin and polysulfone resin.
- Insulated electric wires used for wiring and winding in equipment are required to have heat resistance.
- a fluororesin layer is provided as an insulating coating layer constituting such a heat-resistant insulated wire
- the fluororesin has a high melting point and is extruded.
- the temperature at the time of molding must be raised to nearly 400 ° C., and the surface of the conductor tends to be oxidized.
- fluororesin may generate hydrofluoric acid (hydrofluoric acid) during combustion, and hydrofluoric acid may promote oxidation of the conductor surface.
- hydrofluoric acid hydrofluoric acid
- the oxide layer formed on the surface of the conductor is difficult to remove.
- the present invention has been made to solve the above problems, and an object thereof is a heat-resistant insulated electric wire used for wiring and winding in a device, which has a high partial discharge starting voltage, heat resistance and a conductor.
- the purpose of the present invention is to provide a heat-resistant insulated electric wire capable of suppressing surface oxidation.
- the heat-resistant insulating electric wire according to the present invention is a heat-resistant insulating electric wire having a conductor, a baking film layer provided on the outer periphery of the conductor, and an insulating film provided on the baking film layer, and is the baking film layer.
- the insulating film made of the fluororesin layer is provided on the baking film layer, it is possible to prevent the conductor surface from being oxidized by the heat generated during extrusion molding of the fluororesin or the generated hydrofluoric acid. be able to. As a result, it is a heat-resistant insulated wire in which oxidation of the conductor surface is suppressed. Further, since the fluororesin layer has heat resistance, the insulated wire itself also has heat resistance. Further, since a magnet wire having a baking film layer formed on the conductor can be used, the manufacturing cost can be reduced as compared with the case where oxidation is prevented by metal plating, and the adhesion between the conductor and the baking film layer is high. ..
- the baking film layer is a urethane resin layer, and the thickness is within the range of 5 to 30 ⁇ m.
- the diameter of the conductor is in the range of 0.08 to 0.30 mm, and the thickness of the insulating coating is in the range of 0.05 to 0.10 mm.
- the heat-resistant insulated wire according to the present invention has a dielectric strength of 4.0 kV or more.
- the fluororesin layer is an ETFE resin layer
- the fluororesin layer is a FEP resin layer
- the fluororesin layer is a PFA resin layer.
- a heat-resistant insulated electric wire that is used for wiring and winding in an apparatus, has a high partial discharge starting voltage, and can realize heat resistance and suppression of oxidation of the conductor surface.
- the heat-resistant insulated wire 10 As shown in FIGS. 1 and 2, the heat-resistant insulated wire 10 according to the present invention includes a conductor 1, a baking film layer 2 provided on the outer periphery of the conductor 1, and an insulating film 3 provided on the baking film layer 2.
- the heat-resistant insulated wire 10 having the above.
- the feature is that the baking film layer 2 is a thermosetting resin layer, and the insulating film 3 is an extrusion-coated fluororesin layer.
- this heat-resistant insulated wire 10 since the insulating film 3 made of a fluororesin layer is provided on the baking film layer 2, the conductor surface is oxidized by the heat generated during extrusion molding of the fluororesin and the generated hydrofluoric acid. Can be prevented. As a result, the heat-resistant insulated wire 10 is obtained in which oxidation of the conductor surface is suppressed. Further, since the fluororesin layer has heat resistance, the insulated wire itself also has heat resistance. Further, since the magnet wire having the baking film layer 2 formed on the conductor 1 can be used, the manufacturing cost can be reduced as compared with the case where oxidation is prevented by metal plating, and the space between the conductor 1 and the baking film layer 2 can be reduced. Adhesion is also high.
- the conductor 1 is not particularly limited as long as it is applied as the central conductor of the heat-resistant insulated wire 10, particularly the heat-resistant insulated wire 10 used for wiring and winding in the equipment, and any kind of conductor may be used.
- the material and twist composition do not matter.
- it may be composed of one strand extending in the longitudinal direction, may be composed by twisting several strands, or may be configured as a litz wire.
- the type of the strand is not particularly limited as long as it is a good conductive metal, but a good conductive metal conductor such as a copper wire, a copper alloy wire, an aluminum wire, an aluminum alloy wire, or a copper-aluminum composite wire can be preferably mentioned. can. From the viewpoint of coils, copper wire and copper alloy wire are particularly preferable.
- the enamel wire having the baking film layer 2 provided on the conductor 1 since the enamel wire having the baking film layer 2 provided on the conductor 1 is used, it is not necessary to provide a plating layer on the conductor surface, and the manufacturing cost is lower than that in the case of providing plating. Can be reduced.
- the cross-sectional shape of the wire is not particularly limited, but the cross-sectional shape may be a circular or substantially circular wire rod, or may be a rectangular shape.
- the cross-sectional shape of the conductor 1 is not particularly limited, but may be circular (including an elliptical shape), rectangular, or the like.
- the outer diameter of the conductor 1 is also not particularly limited, but for example, the circular wire is preferably about 0.08 to 0.30 mm.
- the baking film layer 2 is a thermosetting resin layer provided on the outer periphery of the conductor 1.
- the manufacturing cost can be reduced as compared with the case where oxidation is prevented by metal plating, and the conductor 1 and the baking coating layer 2 are combined. The close contact between them is also high.
- the baking film layer 2 is not particularly limited as long as it is a thermosetting resin layer, and various enamel coating layers can be mentioned.
- a baking film layer 2 formed by applying and baking a solderable enamel paint such as general-purpose polyurethane, modified polyurethane, or polyesterimide can be preferably mentioned, and a urethane resin layer made of general-purpose polyurethane or modified polyurethane is particularly preferable.
- the thickness of the baking film layer 2 is in the range of 5 to 30 ⁇ m. By doing so, the enamel urethane wire can be used and the manufacturing cost can be reduced.
- the insulating coating 3 is an extrusion-coated fluororesin layer provided on the baking coating layer 2.
- the fluororesin constituting the fluororesin layer is not particularly limited, and examples thereof include PFA, ETFE, and FEP. Since these fluororesins are excellent in heat resistance, the heat-resistant insulated wire 10 can be provided with high heat resistance. Further, since the fluororesin has a low dielectric constant, it is also advantageous in increasing the partial discharge start voltage.
- the conductor surface is oxidized by the heat generated during extrusion molding of the fluororesin, hydrofluoric acid generated, or the like. Can be prevented. As a result, it is a heat-resistant insulated wire in which oxidation of the conductor surface is suppressed.
- the thickness of the insulating coating 3 is preferably in the range of 0.05 to 0.10 mm, and the withstand voltage (dielectric breakdown voltage) of the heat-resistant insulated wire 10 is 4.0 kV or more, preferably 10.0 kV or more. be able to.
- the withstand voltage is obtained by twisting two insulated wires and measuring with a withstand voltage tester.
- An insulating outer cover (not shown) may be further provided on the outermost circumference of the heat-resistant insulated wire 10 as needed.
- the insulating coating 3 made of a fluororesin layer of a thermoplastic resin is not provided on the conductor 1, but is directly extruded onto the baking coating layer 2 made of a thermosetting resin provided on the conductor 1.
- the difference between general-purpose polyurethane and modified polyurethane is divided according to the type of diisocyanate, which is a polyurethane raw material, and as a result, the polymer structural skeleton of general-purpose polyurethane becomes a flexible structural skeleton.
- the polymer structural skeleton of modified polyurethane differs in that it has a rigid structural skeleton.
- Polyesterimide has a higher thermal decomposition temperature (TGI: 140 to 150 ° C.) and a higher soldering temperature (420 to 460 ° C.) than general-purpose polyurethane and modified polyurethane.
- TGI thermal decomposition temperature
- soldering temperature 420 to 460 ° C.
- the baking film layer 2 made of a thermosetting resin functions to prevent the conductor surface from being oxidized at the extrusion temperature of the fluororesin layer described later, and therefore can be decomposed even at the extrusion temperature of the fluororesin layer.
- the resin has "thermal stability” that is stable, and that it is easily decomposed at a soldering temperature according to the type of the baking film layer 2 and that the "solderability" is good.
- General-purpose polyurethane (TGI: 120 to 130 ° C., soldering temperature: 320 to 360 ° C.), modified polyurethane (TGI: 130 to 140 ° C., soldering temperature: 360 to 420 ° C.), polyesterimide listed as the baking film layer 2.
- TGI 140 to 150 ° C., soldering temperature: 420 to 460 ° C.
- the conductor surface is also oxidized by the heat generated when the fluororesin layer having a relatively high extrusion temperature is extruded. Can be prevented.
- the extrusion temperature of the fluororesin layer differs depending on the type of fluororesin. For example, PFA is about 330 to 420 ° C., ETFE is about 260 to 350 ° C., and FEP is about 280 to 380 ° C. PFA, FEP, and ETFE are in descending order of extrusion temperature, and ETFE has the lowest extrusion temperature.
- hydrofluoric acid generated during extrusion molding is related to the extrusion temperature in terms of ease of generation, and the higher the extrusion temperature, the more hydrofluoric acid is likely to be generated.
- PFA is most likely to occur
- FEP is most likely to occur
- ETFE is least likely to occur.
- the specific combination of the baking film layer 2 and the insulating film 3 is that when the insulating film 3 is extruded, the baking film layer 2 is not easily decomposed even when heat during extrusion molding is applied. As a result, the heat-stabilized baking film layer 2 is provided to prevent oxidation of the conductor surface due to heat during extrusion molding of the insulating film 3, hydrofluoric acid, or the like. Can be done. Further, after extrusion molding of the insulating coating 3, it is important that the solderability is good at the soldering temperature.
- the baking film layer 2 when the baking film layer 2 is a general-purpose polyurethane, a combination in which the insulating film 3 is an ETFE resin layer is preferable.
- the baking film layer 2 is a modified polyurethane, a combination in which the insulating film 3 is used as a FEP resin layer is preferable, and when the baking film layer 2 is polyesterimide, a combination in which the insulating film 3 is used as a PFA resin layer is preferable.
- general-purpose polyurethane since general-purpose polyurethane may be decomposed by heat of 260 ° C. or higher, when a fluororesin layer is extruded on it, it is thermally stable to extrude ETFE having the lowest extrusion temperature as the insulating film 3. It is preferable from the viewpoint of achieving both property and solderability. Since modified polyurethane may be decomposed by heat of 280 ° C. or higher, when a fluororesin layer is extruded on it, it is recommended to extrude FEP having a high extrusion temperature as an insulating film 3 for thermal stability and soldering. It is preferable from the viewpoint of compatibility of attachment. Since polyesterimide may be decomposed by heat of 310 ° C.
- extruding PFA having the highest extrusion temperature as an insulating film 3 is considered to be thermal stability. It is preferable from the viewpoint of achieving both solderability.
- Example 1 A magnet wire having a diameter of 0.270 mm provided with a baking film layer 2 having a thickness of 10 ⁇ m made of urethane resin on an unplated copper wire having a diameter of 0.250 mm was used, and a magnet wire having a thickness of 52 ⁇ m made of ETFE was used on the outer periphery thereof.
- the conductor resistance of the obtained heat-resistant insulated wire 10 was measured with an ohmmeter and found to be 0.358 ⁇ / m.
- the dielectric breakdown voltage was 22.28 kV as measured by a withstand voltage tester after twisting two strands.
- Example 2 A magnet wire having a diameter of 0.134 mm provided with a baking film layer 2 having a thickness of 7 ⁇ m made of urethane resin on an unplated copper wire having a diameter of 0.120 mm was used, and a magnet wire having a thickness of 52 ⁇ m made of PFA was used on the outer periphery thereof.
- the conductor resistance of the obtained heat-resistant insulated wire 10 was 1.556 ⁇ / m, and the dielectric breakdown voltage was 21.50 kV.
- Example 3 A magnet wire having a diameter of 0.200 mm provided with a baking film layer 2 having a thickness of 10 ⁇ m made of urethane resin on an unplated copper wire having a diameter of 0.180 mm was used, and a magnet wire having a thickness of 51 ⁇ m made of FEP was used on the outer periphery thereof.
- a heat-resistant insulated wire having a total outer diameter of 0.370 mm was produced by providing an insulating film having a thickness of 60 ⁇ m made of ETFE on an unplated copper wire having a diameter of 0.250 mm without providing a baking film layer.
- the conductor resistance of the obtained heat-resistant insulated wire was 0.383 ⁇ / m, and the dielectric breakdown voltage was 17.08 kV.
- Example 1 Next, an experiment was conducted on a preferable combination of the baking film layer 2 and the insulating film 3.
- the basic configuration is the same as in Example 1, and a single resin material (composite) with a single layer (not laminated, the same in the present application) having a thickness of 10 ⁇ m on an unplated copper wire having a diameter of 0.250 mm.
- a heat-resistant insulated wire 10 having a total outer diameter of 0.374 mm was produced.
- the general-purpose polyurethane used in the column of this example including the above Examples 1 to 3 is a general-purpose polyurethane (TGI: 125 ° C., baked with an enamel paint of trade name: TPU-5100 manufactured by Totoku Toryo Co., Ltd. Soldering temperature: 360 ° C.).
- the following modified polyurethane is a modified polyurethane (TGI: 130 ° C., soldering temperature: 380 ° C.) baked with an enamel paint of trade name: TSF-400N manufactured by Totoku Toryo Co., Ltd.
- the following polyesterimide is a polyesterimide (TGI: 140 ° C., soldering temperature: 460 ° C.) baked with an enamel paint of trade name: TSF-500 manufactured by Totoku Toryo Co., Ltd.
- the combination of the baking film layer 2 and the insulating film 3 used in the experiment is as follows.
- (Sample 1) General-purpose polyurethane and PFA (extrusion temperature: 330 to 420 ° C)
- (Sample 2) General-purpose polyurethane and ETFE (extrusion temperature: 260-350 ° C)
- (Sample 3) General-purpose polyurethane and FEP (extrusion temperature: 280 to 380 ° C)
- Modified polyurethane and PFA (extrusion temperature: 330 to 420 ° C)
- Modified polyurethane and ETFE (extrusion temperature: 260-350 ° C)
- (Sample 6) Modified polyurethane and FEP (extrusion temperature: 280 to 380 ° C)
- (Sample 7) Polyesterimide and ETFE (extrusion temperature: 260 to 350 ° C.)
- (Sample 8) Polyesterimide and PFA (extrusion temperature: 330 to
- the thermal stability, solderability, and oxidation state of the conductor surface were evaluated for Samples 1 to 9.
- the thermal stability the dielectric breakdown voltage of the obtained heat-resistant insulated wire was evaluated by the same method as in Examples 1 to 3, and the case where the dielectric breakdown voltage was 10 kV or more was regarded as “ ⁇ ” and the case where it was less than 10 kV was evaluated. It was set as " ⁇ ”.
- the solderability the obtained heat-resistant insulated wire was immersed in 96.5% tin solder at 360 ° C., 380 ° C., and 460 ° C. and the soldered state was visually confirmed, and it was determined that the solderability was good.
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Insulated Conductors (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Organic Insulating Materials (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/919,181 US20230162886A1 (en) | 2020-04-16 | 2021-04-16 | Heat-resistant insulated wire |
| PH1/2022/552677A PH12022552677A1 (en) | 2020-04-16 | 2021-04-16 | Heat-resistant insulated wire |
| EP21788633.2A EP4138100A4 (en) | 2020-04-16 | 2021-04-16 | HEAT-RESISTANT INSULATED ELECTRIC WIRE |
| JP2022515446A JPWO2021210668A1 (https=) | 2020-04-16 | 2021-04-16 | |
| CN202180028214.8A CN115398566B (zh) | 2020-04-16 | 2021-04-16 | 耐热绝缘电线的制造方法 |
| KR1020227028369A KR20230002294A (ko) | 2020-04-16 | 2021-04-16 | 내열 절연 전선 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-073286 | 2020-04-16 | ||
| JP2020073286 | 2020-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2021210668A1 true WO2021210668A1 (ja) | 2021-10-21 |
Family
ID=78084429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/015692 Ceased WO2021210668A1 (ja) | 2020-04-16 | 2021-04-16 | 耐熱絶縁電線 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230162886A1 (https=) |
| EP (1) | EP4138100A4 (https=) |
| JP (1) | JPWO2021210668A1 (https=) |
| KR (1) | KR20230002294A (https=) |
| CN (1) | CN115398566B (https=) |
| PH (1) | PH12022552677A1 (https=) |
| WO (1) | WO2021210668A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102771630B1 (ko) * | 2023-04-26 | 2025-02-24 | 국제케이블(주) | 수냉식 구동모터용 수밀형 권선코일 케이블 및 이의 제조방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005203334A (ja) * | 2003-12-17 | 2005-07-28 | Furukawa Electric Co Ltd:The | 絶縁ワイヤおよびその製造方法 |
| JP2010067521A (ja) | 2008-09-11 | 2010-03-25 | Sumitomo Electric Ind Ltd | 絶縁電線及びその製造方法、並びに、電気コイル及びモータ |
| JP2017188340A (ja) * | 2016-04-06 | 2017-10-12 | 古河電気工業株式会社 | 絶縁電線、コイルおよび電気・電子機器 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4782906B2 (ja) * | 1998-11-24 | 2011-09-28 | 住友電工ウインテック株式会社 | 絶縁電線 |
| JP2004533092A (ja) * | 2001-04-17 | 2004-10-28 | ジャド ワイヤ インコーポレーテツド | 電気導線のための多層絶縁システム |
| JP2003187649A (ja) * | 2001-12-20 | 2003-07-04 | Hitachi Cable Ltd | セミフレキシブル同軸線 |
| CN102385948B (zh) * | 2010-08-25 | 2015-08-19 | 日立金属株式会社 | 聚酯酰亚胺树脂绝缘涂料和使用该涂料的绝缘电线及线圈 |
| CN201946343U (zh) * | 2011-01-24 | 2011-08-24 | 江西联创电缆科技有限公司 | 航空航天用聚酰亚胺、聚四氟乙烯双层薄膜绕包绝缘电线电缆 |
| JP5454804B2 (ja) * | 2011-08-12 | 2014-03-26 | 古河電気工業株式会社 | 絶縁ワイヤ |
| JP2013131423A (ja) * | 2011-12-22 | 2013-07-04 | Hitachi Cable Ltd | 絶縁電線及びコイル |
| JP5391341B1 (ja) * | 2013-02-05 | 2014-01-15 | 古河電気工業株式会社 | 耐インバータサージ絶縁ワイヤ |
| JP6355304B2 (ja) * | 2013-06-28 | 2018-07-11 | 東京特殊電線株式会社 | はんだ付け可能な絶縁電線及びその製造方法 |
| JP6800931B2 (ja) * | 2018-09-28 | 2020-12-16 | 昭和電線ケーブルシステム株式会社 | 二重被覆電線の試験方法 |
-
2021
- 2021-04-16 JP JP2022515446A patent/JPWO2021210668A1/ja not_active Withdrawn
- 2021-04-16 CN CN202180028214.8A patent/CN115398566B/zh active Active
- 2021-04-16 EP EP21788633.2A patent/EP4138100A4/en active Pending
- 2021-04-16 US US17/919,181 patent/US20230162886A1/en not_active Abandoned
- 2021-04-16 WO PCT/JP2021/015692 patent/WO2021210668A1/ja not_active Ceased
- 2021-04-16 PH PH1/2022/552677A patent/PH12022552677A1/en unknown
- 2021-04-16 KR KR1020227028369A patent/KR20230002294A/ko active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005203334A (ja) * | 2003-12-17 | 2005-07-28 | Furukawa Electric Co Ltd:The | 絶縁ワイヤおよびその製造方法 |
| JP2010067521A (ja) | 2008-09-11 | 2010-03-25 | Sumitomo Electric Ind Ltd | 絶縁電線及びその製造方法、並びに、電気コイル及びモータ |
| JP2017188340A (ja) * | 2016-04-06 | 2017-10-12 | 古河電気工業株式会社 | 絶縁電線、コイルおよび電気・電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115398566B (zh) | 2025-08-19 |
| CN115398566A (zh) | 2022-11-25 |
| US20230162886A1 (en) | 2023-05-25 |
| KR20230002294A (ko) | 2023-01-05 |
| EP4138100A4 (en) | 2023-09-06 |
| PH12022552677A1 (en) | 2024-01-22 |
| JPWO2021210668A1 (https=) | 2021-10-21 |
| EP4138100A1 (en) | 2023-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20180131540A (ko) | 절연 전선, 코일 및 전기·전자 기기 | |
| US9508461B2 (en) | Polymeric overcoated anodized wire | |
| JP2015138626A (ja) | 絶縁電線とその製造方法、及び電気機器のコイルとその製造方法 | |
| EP3134906B1 (en) | Continuously transposed conductor | |
| US20200251243A1 (en) | Magnet Wire With Improved Enamel Adhesion | |
| JP4762474B2 (ja) | 多層絶縁電線及びそれを用いた変圧器 | |
| US10510464B1 (en) | Continuously transposed conductors and assemblies | |
| JP2002109965A (ja) | 絶縁被覆電気導体 | |
| JP6589783B2 (ja) | エナメル線、該エナメル線の製造方法、該エナメル線を用いたコイル、および該コイルを用いた電機部品 | |
| WO2021210668A1 (ja) | 耐熱絶縁電線 | |
| JP6355304B2 (ja) | はんだ付け可能な絶縁電線及びその製造方法 | |
| JP7805979B2 (ja) | エナメル線およびその製造方法 | |
| JP7561160B2 (ja) | 融着性絶縁電線及び自己融着コイル | |
| JP2019160507A (ja) | 絶縁電線、その製造方法、コイル、電気・電子機器および電気・電子機器の製造方法 | |
| JP2008066024A (ja) | 極細同軸ケーブル | |
| WO2022196736A1 (ja) | 導体と絶縁被膜の積層体、コイル、及び回転電機 | |
| JP7216555B2 (ja) | 放熱性の高い絶縁電線及びそれを用いたコイル | |
| JP7537903B2 (ja) | トランス用多層絶縁電線 | |
| JP2016195089A (ja) | エナメル線、該エナメル線を用いたコイルおよびそれ該コイルを用いた電機部品 | |
| JP2010262788A (ja) | 絶縁電線及びコイル | |
| JP5108251B2 (ja) | 絶縁電線およびこれを用いた電気コイル | |
| JPH09282948A (ja) | 絶縁電線及びその製造方法 | |
| JPH11111067A (ja) | 高周波用積層タイプ平角絶縁電線 | |
| US20220013253A1 (en) | Cable with improved corrosion resistance | |
| JP2025090173A (ja) | テープ巻き絶縁電線及びコイル |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21788633 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 2022515446 Country of ref document: JP Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| ENP | Entry into the national phase |
Ref document number: 2021788633 Country of ref document: EP Effective date: 20221116 |
|
| WWG | Wipo information: grant in national office |
Ref document number: 202180028214.8 Country of ref document: CN |