WO2021208974A1 - 电路板组件以及电子设备 - Google Patents
电路板组件以及电子设备 Download PDFInfo
- Publication number
- WO2021208974A1 WO2021208974A1 PCT/CN2021/087259 CN2021087259W WO2021208974A1 WO 2021208974 A1 WO2021208974 A1 WO 2021208974A1 CN 2021087259 W CN2021087259 W CN 2021087259W WO 2021208974 A1 WO2021208974 A1 WO 2021208974A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- shielding
- circuit board
- area
- board assembly
- electronic device
- Prior art date
Links
- 238000002955 isolation Methods 0.000 claims description 48
- 239000011231 conductive filler Substances 0.000 claims description 6
- 238000000926 separation method Methods 0.000 abstract 2
- 239000012528 membrane Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000009434 installation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000011900 installation process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
Definitions
- the embodiments of the present invention relate to the technical field of communication equipment, and in particular to a circuit board assembly and electronic equipment.
- one of the thinning processes is based on the improvement of the circuit board assembly, by attaching an insulating film to the surface of the circuit board and components, and then a layer of shielding film with conductive characteristics Attach it to the surface of the insulating film, and connect the edge of the shielding film to the edge of the circuit board to form a Faraday cage to electromagnetically shield the circuit board components, replacing the traditional metal shielding frame and metal shielding cover, thereby reducing the thickness
- the thickness of the circuit board assembly ultimately realizes the lightness and thinness of the electronic equipment.
- the above thinning treatment process in order to shield the devices on the circuit board assembly, it is usually necessary to weld a metal shielding wall on the circuit board.
- One end of the metal shielding wall is welded to the circuit board for grounding, and the other end is connected with The shielding film is connected and divided into multiple shielding chambers.
- the width of the welding end of the metal shielding wall must be greater than its own width, which will undoubtedly reduce the device installation space on the surface of the circuit board, and it is not convenient for different shielding chambers. ⁇ The routing.
- the embodiments of the present invention provide a circuit board assembly and electronic equipment, so as to solve the problem that the metal shielding wall reduces the device installation space on the surface of the circuit board and prevents the travel between different shielding chambers when the current circuit board assembly is shielded by cavity. The problem with the line.
- an embodiment of the present invention provides a circuit board assembly, including a circuit board body, an electronic device, and a shielding film assembly. ⁇ The electronic devices.
- the circuit board body has a first contact area
- the shielding film assembly includes a shielding layer and an insulating layer stacked in sequence, the insulating layer is located between the shielding layer and the electronic device, and the edge of the shielding layer It is electrically connected to the first grounding area.
- the electronic device includes a plurality of first devices, each of the first devices has a ground terminal, the ground terminals of the plurality of first devices are arranged adjacent to each other and form a shielding isolation portion, the shielding film assembly, the The shielding isolation portion and the circuit board body form at least two shielding cavities.
- the shielding film assembly is provided with a retreat area, and in the retreat area, the shielding layer is electrically connected to the shielding isolation portion.
- an embodiment of the present invention also provides an electronic device, including the aforementioned circuit board assembly.
- the ground terminals of a plurality of first devices are arranged adjacent to each other to form a shielding isolation part.
- the shielding film assembly, the shielding isolation part and the circuit board body form at least two shielding cavities, thereby realizing the cavity division. shield.
- the circuit board assembly disclosed in the embodiment of the present invention does not need to add a shielding structure inside the circuit board assembly, which undoubtedly increases the installation space on the surface of the circuit board body, facilitates the wiring of electronic devices, and also has both Cost advantage.
- FIG. 1 is a schematic structural diagram of a circuit board assembly in a top view angle according to an embodiment of the present invention
- FIG. 2 is a cross-sectional view from the A-A direction of FIG. 1 according to an embodiment of the present invention
- Fig. 3 is a cross-sectional view from the B-B direction of Fig. 1 according to an embodiment of the present invention
- an embodiment of the present invention discloses a circuit board assembly, which includes a circuit board body 100, an electronic device, and a shielding film assembly 200.
- the circuit board body 100 is a basic component of the circuit board assembly, which provides an installation support foundation for both the electronic device and the shielding film assembly 200. It should be understood that electronic devices generate electromagnetic waves during operation, and these electromagnetic waves will cause electromagnetic interference to other devices other than the circuit board assembly. Accordingly, the electronic devices on the circuit board assembly are also susceptible to electromagnetic interference from other devices. Therefore, in order to ensure the normal operation of electronic devices, it is necessary to electromagnetically shield the electronic devices on the circuit board assembly. In the embodiment of the present invention, electromagnetic shielding is achieved by the shielding film assembly 200.
- the electronic device is arranged on the surface of the circuit board body 100, and the shielding film assembly 200 is arranged on the electronic device, thereby shielding the electronic device on the circuit board body 100.
- the circuit board body 100 has a first grounding area 110, and the first grounding area 110 is connected to the ground network (GND) of the circuit board body 100.
- the shielding film assembly 200 includes a shielding layer 210 and an insulating layer 220 stacked in sequence, and the insulating layer 220 is located between the shielding layer 210 and the electronic device. It should be understood that the shielding film assembly 200 can realize the thinning design of the circuit board assembly, which can enable users to obtain a better experience of use; in order to enable the shielding film assembly 200 to be attached to the surface of the electronic device, the shielding film assembly 200 should It is a flexible structure. With this arrangement, the gap between the shielding film assembly 200 and the electronic device is reduced as much as possible, so that the overall thickness of the circuit board assembly is reduced, thereby achieving the reduction of the circuit board assembly.
- the shielding film assembly 200 Since the shielding film assembly 200 is a flexible structure, it will cause the shielding layer 210 to directly contact the electronic device, which may cause a short circuit. Therefore, in the embodiment of the present invention, the insulating layer 220 is located between the shielding layer 210 and the electronic device, which can separate the shielding layer 210 and the electronic device, thereby avoiding a short circuit failure.
- the edge of the shielding layer 210 is electrically connected to the first grounding area 110.
- the shielding structure needs to be grounded. As currents are formed on the shielding structure, a potential difference is formed in different parts of the shielding structure. Since the impedance of the ground signal is low, these currents can be conducted after the shielding structure is grounded.
- the edge of the shielding layer 210 is connected to the ground network on the circuit board body 100 through the first grounding area 110 to achieve grounding, and the current on the shielding layer 210 can be conducted through the first grounding area 110.
- the first grounding area 110 may be a grounding pad, and the shielding layer 210 may be electrically connected to the grounding pad by welding, hot pressing, or the like.
- the electronic device includes a plurality of first devices, and each first device has a ground terminal 310.
- the first device can be reliably connected to the circuit board body 100 through the ground terminal 310.
- the ground terminals 310 of the plurality of first devices are adjacently distributed and form a shielding isolation portion 300.
- the ground terminal 310 itself is a conductive structure. Therefore, when the ground terminals 310 are arranged adjacent to each other, the whole has conductive continuity, thereby achieving a shielding effect.
- the shielding film assembly 200, the shielding spacer 300, and the circuit board body 100 form at least two shielding cavities 400. Specifically, one end of the shielding isolation portion 300 is connected to the shielding film assembly 200, and the other end of the shielding isolation portion 300 is connected to the circuit board body 100. In this way, the shielding isolation portion 300 separates the internal shielding space of the circuit board assembly. In turn, a shielding cavity 400 is formed.
- the specific number of shielding cavities 400 is determined by the specific shape of the shielding isolation portion 300, and in this embodiment, the shape of the shielding isolation portion 300 may be various.
- the shielding isolation portion 300 may extend in a straight line, and divide the inside of the circuit board assembly into two shielding cavities 400.
- the shielding isolation portion 300 can also have other shapes, such as a cross shape, where the inside of the circuit board assembly is divided into four shielding cavities 400; in a T-shape, at this time, the inside of the circuit board assembly is divided into three shielding cavities 400.
- the embodiment of the present invention does not limit the extension linear feature of the shielding isolation portion 300, and it may also extend in a curved or broken line shape.
- the shielding isolation part 300 needs to be connected to the shielding membrane assembly 200, that is, one end of the ground terminal 310 constituting the shielding isolation part 300 needs to be connected to the shielding membrane assembly 200.
- the insulating layer 220 is located between the electronic device and the shielding layer 210, the insulating layer 220 will cause the ground terminal 310 and the shielding film assembly 200 to be non-conductive and continuous, so there will be electromagnetic leakage problems between the shielding film assembly 200 and the shielding isolation portion 300 .
- the shielding film assembly 200 is provided with a avoidance area 230, in the avoidance area 230, the shielding layer 210 is electrically connected to the shielding isolation portion 300.
- the avoidance area 230 is the area on the shielding film assembly 200 where the window is opened, specifically, the part of the shielding film assembly 200 is peeled off.
- the shielding layer 210 and the insulating layer 220 are usually connected by bonding. In the process of opening the shielding film assembly 200, the shielding layer 210 and the insulating layer 220 will not be separated.
- the ground terminal 310 is electrically connected to the ground network on the circuit board body 100, and is also electrically connected to the shielding layer 210, realizing the reliable grounding of the shielding layer 210 around the avoidance area 230, thereby avoiding the shielding film assembly 200 from being separated from the shielding.
- Electromagnetic leakage occurs between the parts 300; at the same time, the ground terminal 310 can fix the shielding layer 210 around the avoidance area 230, and as mentioned above, the shielding layer 210 and the insulating layer 220 are usually connected by bonding, so With this arrangement, it is equivalent to forming an attachment point on the electronic device, thereby realizing the fixation of the shielding membrane assembly 200, preventing the shielding membrane assembly 200 from falling off the electronic device at the avoidance area 230, and enhancing the electromagnetic shielding effect.
- the electrical connection relationship between the shielding isolation portion 300 and the shielding layer 210 can be various, and the embodiment of the present invention does not limit it, such as bonding, hot pressing, etc., but all need to ensure the shielding isolation portion
- the conductive relationship between 300 and the shielding layer 210 is sufficient.
- the shielding isolation portion 300 can be welded to the shielding layer 210. With such a configuration, the connection stability and reliability of the shielding isolation portion 300 and the shielding layer 210 can be improved. It should be understood that the shielding isolation portion 300 and the shielding layer 210 are welded, that is, the grounding terminal 310 included in the shielding isolation portion 300 is welded to the shielding layer 210.
- the shielding isolation portion 300 is inside the shielding membrane assembly 200 during the specific installation process, it is not convenient to connect the two. However, since the shielding membrane assembly 200 is provided with the avoiding area 230, the avoiding area 230 penetrates the shielding membrane assembly 200, and the shielding isolation portion 300 can be exposed to the shielding membrane assembly 200 through the avoiding area 230, and thus the shielding isolation portion 300 and The shield layer 210 is connected.
- the shielding isolation portion 300 is formed by arranging the ground terminals 310 of a plurality of first devices adjacently, and at the same time, the shielding membrane assembly 200, the shielding isolation portion 300 and the circuit board body 100 are formed There are at least two shielded cavities 400 to realize sub-cavity shielding.
- the ground terminal 310 itself is the structure on the circuit board assembly, and the shielding isolation portion 300 formed by it is It does not occupy additional installation space on the circuit board body 100, and at the same time, the first device can also be directly routed from the side. Therefore, the circuit board assembly disclosed in the embodiment of the present invention saves processing cost and is also practical.
- conductive fillers 320 may be provided in these gaps. It should be understood that because the conductive filler 320 is conductive, it can electrically connect adjacent ground terminals 310 to eliminate conductive discontinuities, thereby preventing electromagnetic leakage and avoiding electronic devices located in different shielding cavities 400 The mutual electromagnetic interference, optimizes the shielding effect.
- the ground terminals 310 included in the shielding isolation portion 300 should be arranged as close as possible to reduce the gap between them, reduce electromagnetic leakage, and improve the shielding effect.
- the embodiment of the present invention does not limit the specific type of the conductive filler 320.
- the conductive filler 320 may be a solder structure, and it may also be another conductive structure, such as a metal structure such as copper and aluminum.
- the specific opening position of the avoiding area 230 on the shielding film assembly 200 is not restricted.
- the avoidance area 230 may be disposed opposite to the shielding isolation part 300. It should be understood that the shielding layer 210 needs to be electrically connected to the shielding isolation portion 300. This arrangement avoids the need for excessively long electrical connections between the two, which undoubtedly facilitates the realization of the connection between the two and reduces the cost.
- this embodiment does not limit the specific shape of the avoidance area 230.
- the avoidance area 230 can usually match the linear feature of the shielding isolation portion 300.
- the shielding isolation portion 300 extends linearly, and the avoidance area 230 may be rectangular.
- Avoidance area According to the shielding isolation part 300 of different shapes, the avoidance area 230 can also be a square avoidance area, a circular avoidance area, etc.
- the ground terminal 310 of each first device is at least partially covered by the avoidance area 230, and the ground terminal 310 of each first device and the shielding layer 210 electrical connection.
- grounding terminals 310 there are also multiple grounding terminals 310. If each grounding terminal 310 is electrically connected to the shielding layer 210, the number of connection points between the shielding isolation portion 300 and the shielding membrane assembly 200 can be increased, which will undoubtedly improve the shielding membrane assembly. 200 overall installation adhesion. Even when the circuit board assembly is deformed, subjected to thermal stress, etc., it can be ensured that the shielding film assembly 200 does not fall off.
- the present embodiment does not limit the coverage relationship between the avoidance area 230 and the ground terminal 310.
- the avoidance area 230 a part of the ground terminal 310 may be exposed, or all of the ground terminal 310 may be exposed.
- the avoidance area 230 only needs small openings, and the small openings have little effect on the overall shielding effect of the circuit board assembly.
- the shielding layer 210 in the avoidance area 230 is usually cut and then peeled off to expose the shielding isolation portion 300; however, in this case, the shielding layer 210 surrounds the avoidance area There is usually a distance between the edge of 230 and the shielding isolation portion 300, and it cannot be directly connected. Therefore, it is undoubtedly necessary to provide an intermediate electrical connector between the two, which makes the connection operation more cumbersome.
- the shielding layer 210 may have an extension portion 211, and in the escape area 230, the extension portion 211 is electrically connected to the ground terminal 310 of the first device. Specifically, the extension portion 211 electrically connects the ground terminal 310 and the shielding layer 210 together.
- the extension portion 211 has a certain length, which can make up the distance between the ground terminal 310 and the shielding layer 210.
- the ground terminal 310 is connected to realize the fixation of the shielding film assembly 200.
- the embodiment of the present invention does not limit the specific type of the extension portion 211.
- the extension portion 211 may be generally formed integrally with the shielding layer 210, and it can be understood that the extension portion 211 is drawn from the shielding layer 210, or the shielding layer 210 forms the extension portion 211 by electroplating. With this arrangement, the conduction reliability and connection stability of the shielding layer 210 and the extension portion 211 can be improved, thereby making the grounding effect better.
- the cut part is not peeled off, and the connection between the cut part and the shielding layer 210 is retained, thereby forming the extension 211, that is, the extension
- the part 211 is a part of the shielding layer 210 in the area of the avoidance area 230.
- the extension portion 211 is bent and extends into the avoidance area 230. After the extension portion 211 is bent, it can pass through the avoidance area 230 and be electrically connected to the ground terminal 310, thereby realizing the electrical connection between the shielding layer 210 and the ground terminal 310, and finally The shielding film assembly 200 is attached and fixed.
- the shielding film assembly 200 should be a flexible structure.
- the shielding layer 210 may be a copper layer, that is, a copper foil. Copper foil is a conventional material in the electronic field and is easy to obtain. With this arrangement, the shielding layer 210 has good electrical conductivity and welding characteristics, which is conducive to achieving a stable connection between the shielding layer 210 and the ground terminal 310; at the same time, the shielding layer 210 also has good flexibility, which is beneficial to the shielding layer 210 and electronics. The attachment setting of the device.
- the embodiment of the present invention does not limit the specific type of the shielding layer 210, and it may also be a conductive metal layer such as an aluminum layer, a zinc layer, etc., or a non-metal layer with conductive characteristics.
- the circuit board body 100 may have a second ground area 120, and the shielding layer 210 is grounded.
- the terminal 310 is electrically connected to the second grounding area 120. With this arrangement, the grounding terminal 310 only needs to be installed on the second grounding area 120 to complete the grounding process of the grounding terminal 310.
- the embodiment of the present invention does not limit the specific structure type of the second grounding area 120.
- the second grounding area 120 may be a grounding pad area.
- the terminal 310 is installed on the ground pad area corresponding to the second ground area 120, which not only realizes the stable installation of the first device.
- the electronic device further includes a second device, and the second device is located in the shielding cavity 400.
- the shielding isolation portion 300 needs to be composed of the ground terminals 310 of the first device, and these ground terminals 310 need to be distributed adjacently. Therefore, the first device also has certain layout requirements, so it is also present in the circuit board assembly.
- the second device located in the shielding cavity 400.
- an embodiment of the present invention also discloses an electronic device, which includes the foregoing circuit board assembly.
- the electronic devices referred to in the embodiments of the present invention may be devices such as smart phones, tablet computers, e-book readers, wearable devices, etc.
- the embodiments of the present invention do not limit the specific types of electronic devices.
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (10)
- 一种电路板组件,包括电路板本体(100)、电子器件和屏蔽膜组件(200),所述电子器件设置于所述电路板本体(100)的表面,所述屏蔽膜组件(200)罩设于所述电子器件;所述电路板本体(100)具有第一接地区(110),所述屏蔽膜组件(200)包括依次层叠设置的屏蔽层(210)和绝缘层(220),所述绝缘层(220)位于所述屏蔽层(210)与所述电子器件之间,所述屏蔽层(210)的边缘与所述第一接地区(110)电连接;所述电子器件包括多个第一器件,每个所述第一器件具有接地端子(310),多个所述第一器件的所述接地端子(310)相邻分布且形成屏蔽隔离部(300),所述屏蔽膜组件(200)、所述屏蔽隔离部(300)和所述电路板本体(100)形成至少两个屏蔽腔(400);所述屏蔽膜组件(200)开设有避让区(230),在所述避让区(230)内,所述屏蔽层(210)与所述屏蔽隔离部(300)电连接。
- 根据权利要求1所述的电路板组件,其中,在所述屏蔽隔离部(300)中,相邻两个所述接地端子(310)之间存在缝隙,所述缝隙中设置有导电填充件(320)。
- 根据权利要求1所述的电路板组件,其中,所述屏蔽隔离部(300)呈直线状延伸,并将所述电路板组件内部分隔为两个所述屏蔽腔(400)。
- 根据权利要求1所述的电路板组件,其中,所述避让区(230)与所述屏蔽隔离部(300)相对设置。
- 根据权利要求4所述的电路板组件,其中,在垂直于所述电路板本体(100)的方向上,每个所述第一器件的所述接地端子(310)至少部分被所述避让区(230)覆盖,且每个所述第一器件的所述接地端子(310)与所述屏蔽层(210)电连接。
- 根据权利要求1所述的电路板组件,其中,所述屏蔽层(210)具有延伸部(211),在所述避让区(230)内,所述延伸部(211)与所述第一器件的所述接地端子(310)电连接。
- 根据权利要求1所述的电路板组件,其中,所述电子器件还包括第二器件,所述第二器件位于所述屏蔽腔(400)内。
- 根据权利要求1所述的电路板组件,其中,所述电路板本体(100)具有第二接地区(120),所述屏蔽层(210)通过所述接地端子(310)与所述第二接地区(120)电连接。
- 根据权利要求8所述的电路板组件,其中,所述第二接地区(120)为接地焊盘区。
- 一种电子设备,包括如权利要求1至9中任一项所述的电路板组件。
Applications Claiming Priority (2)
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CN202010305654.0A CN111511094B (zh) | 2020-04-17 | 2020-04-17 | 电路板组件以及电子设备 |
CN202010305654.0 | 2020-04-17 |
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CN111511094B (zh) * | 2020-04-17 | 2023-04-14 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
CN113573465B (zh) * | 2021-07-23 | 2023-04-04 | 华为技术有限公司 | 电路组件和电子设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100108370A1 (en) * | 2008-11-03 | 2010-05-06 | Christopher James Kapusta | System and method of forming a patterned conformal structure |
CN101932223A (zh) * | 2009-06-22 | 2010-12-29 | 通用电气公司 | 形成隔离的敷形屏蔽区的系统和方法 |
CN110729176A (zh) * | 2019-10-15 | 2020-01-24 | 杭州见闻录科技有限公司 | 一种用于通信模块产品的emi屏蔽工艺和通信模块产品 |
CN111491439A (zh) * | 2020-04-17 | 2020-08-04 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
CN111511094A (zh) * | 2020-04-17 | 2020-08-07 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
-
2020
- 2020-04-17 CN CN202010305654.0A patent/CN111511094B/zh active Active
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- 2021-04-14 WO PCT/CN2021/087259 patent/WO2021208974A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100108370A1 (en) * | 2008-11-03 | 2010-05-06 | Christopher James Kapusta | System and method of forming a patterned conformal structure |
CN101932223A (zh) * | 2009-06-22 | 2010-12-29 | 通用电气公司 | 形成隔离的敷形屏蔽区的系统和方法 |
CN110729176A (zh) * | 2019-10-15 | 2020-01-24 | 杭州见闻录科技有限公司 | 一种用于通信模块产品的emi屏蔽工艺和通信模块产品 |
CN111491439A (zh) * | 2020-04-17 | 2020-08-04 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
CN111511094A (zh) * | 2020-04-17 | 2020-08-07 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
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CN111511094B (zh) | 2023-04-14 |
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