WO2021208974A1 - 电路板组件以及电子设备 - Google Patents
电路板组件以及电子设备 Download PDFInfo
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- WO2021208974A1 WO2021208974A1 PCT/CN2021/087259 CN2021087259W WO2021208974A1 WO 2021208974 A1 WO2021208974 A1 WO 2021208974A1 CN 2021087259 W CN2021087259 W CN 2021087259W WO 2021208974 A1 WO2021208974 A1 WO 2021208974A1
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- WIPO (PCT)
- Prior art keywords
- shielding
- circuit board
- area
- board assembly
- electronic device
- Prior art date
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- 238000002955 isolation Methods 0.000 claims description 48
- 239000011231 conductive filler Substances 0.000 claims description 6
- 238000000926 separation method Methods 0.000 abstract 2
- 239000012528 membrane Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000009434 installation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000011900 installation process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
Definitions
- the embodiments of the present invention relate to the technical field of communication equipment, and in particular to a circuit board assembly and electronic equipment.
- one of the thinning processes is based on the improvement of the circuit board assembly, by attaching an insulating film to the surface of the circuit board and components, and then a layer of shielding film with conductive characteristics Attach it to the surface of the insulating film, and connect the edge of the shielding film to the edge of the circuit board to form a Faraday cage to electromagnetically shield the circuit board components, replacing the traditional metal shielding frame and metal shielding cover, thereby reducing the thickness
- the thickness of the circuit board assembly ultimately realizes the lightness and thinness of the electronic equipment.
- the above thinning treatment process in order to shield the devices on the circuit board assembly, it is usually necessary to weld a metal shielding wall on the circuit board.
- One end of the metal shielding wall is welded to the circuit board for grounding, and the other end is connected with The shielding film is connected and divided into multiple shielding chambers.
- the width of the welding end of the metal shielding wall must be greater than its own width, which will undoubtedly reduce the device installation space on the surface of the circuit board, and it is not convenient for different shielding chambers. ⁇ The routing.
- the embodiments of the present invention provide a circuit board assembly and electronic equipment, so as to solve the problem that the metal shielding wall reduces the device installation space on the surface of the circuit board and prevents the travel between different shielding chambers when the current circuit board assembly is shielded by cavity. The problem with the line.
- an embodiment of the present invention provides a circuit board assembly, including a circuit board body, an electronic device, and a shielding film assembly. ⁇ The electronic devices.
- the circuit board body has a first contact area
- the shielding film assembly includes a shielding layer and an insulating layer stacked in sequence, the insulating layer is located between the shielding layer and the electronic device, and the edge of the shielding layer It is electrically connected to the first grounding area.
- the electronic device includes a plurality of first devices, each of the first devices has a ground terminal, the ground terminals of the plurality of first devices are arranged adjacent to each other and form a shielding isolation portion, the shielding film assembly, the The shielding isolation portion and the circuit board body form at least two shielding cavities.
- the shielding film assembly is provided with a retreat area, and in the retreat area, the shielding layer is electrically connected to the shielding isolation portion.
- an embodiment of the present invention also provides an electronic device, including the aforementioned circuit board assembly.
- the ground terminals of a plurality of first devices are arranged adjacent to each other to form a shielding isolation part.
- the shielding film assembly, the shielding isolation part and the circuit board body form at least two shielding cavities, thereby realizing the cavity division. shield.
- the circuit board assembly disclosed in the embodiment of the present invention does not need to add a shielding structure inside the circuit board assembly, which undoubtedly increases the installation space on the surface of the circuit board body, facilitates the wiring of electronic devices, and also has both Cost advantage.
- FIG. 1 is a schematic structural diagram of a circuit board assembly in a top view angle according to an embodiment of the present invention
- FIG. 2 is a cross-sectional view from the A-A direction of FIG. 1 according to an embodiment of the present invention
- Fig. 3 is a cross-sectional view from the B-B direction of Fig. 1 according to an embodiment of the present invention
- an embodiment of the present invention discloses a circuit board assembly, which includes a circuit board body 100, an electronic device, and a shielding film assembly 200.
- the circuit board body 100 is a basic component of the circuit board assembly, which provides an installation support foundation for both the electronic device and the shielding film assembly 200. It should be understood that electronic devices generate electromagnetic waves during operation, and these electromagnetic waves will cause electromagnetic interference to other devices other than the circuit board assembly. Accordingly, the electronic devices on the circuit board assembly are also susceptible to electromagnetic interference from other devices. Therefore, in order to ensure the normal operation of electronic devices, it is necessary to electromagnetically shield the electronic devices on the circuit board assembly. In the embodiment of the present invention, electromagnetic shielding is achieved by the shielding film assembly 200.
- the electronic device is arranged on the surface of the circuit board body 100, and the shielding film assembly 200 is arranged on the electronic device, thereby shielding the electronic device on the circuit board body 100.
- the circuit board body 100 has a first grounding area 110, and the first grounding area 110 is connected to the ground network (GND) of the circuit board body 100.
- the shielding film assembly 200 includes a shielding layer 210 and an insulating layer 220 stacked in sequence, and the insulating layer 220 is located between the shielding layer 210 and the electronic device. It should be understood that the shielding film assembly 200 can realize the thinning design of the circuit board assembly, which can enable users to obtain a better experience of use; in order to enable the shielding film assembly 200 to be attached to the surface of the electronic device, the shielding film assembly 200 should It is a flexible structure. With this arrangement, the gap between the shielding film assembly 200 and the electronic device is reduced as much as possible, so that the overall thickness of the circuit board assembly is reduced, thereby achieving the reduction of the circuit board assembly.
- the shielding film assembly 200 Since the shielding film assembly 200 is a flexible structure, it will cause the shielding layer 210 to directly contact the electronic device, which may cause a short circuit. Therefore, in the embodiment of the present invention, the insulating layer 220 is located between the shielding layer 210 and the electronic device, which can separate the shielding layer 210 and the electronic device, thereby avoiding a short circuit failure.
- the edge of the shielding layer 210 is electrically connected to the first grounding area 110.
- the shielding structure needs to be grounded. As currents are formed on the shielding structure, a potential difference is formed in different parts of the shielding structure. Since the impedance of the ground signal is low, these currents can be conducted after the shielding structure is grounded.
- the edge of the shielding layer 210 is connected to the ground network on the circuit board body 100 through the first grounding area 110 to achieve grounding, and the current on the shielding layer 210 can be conducted through the first grounding area 110.
- the first grounding area 110 may be a grounding pad, and the shielding layer 210 may be electrically connected to the grounding pad by welding, hot pressing, or the like.
- the electronic device includes a plurality of first devices, and each first device has a ground terminal 310.
- the first device can be reliably connected to the circuit board body 100 through the ground terminal 310.
- the ground terminals 310 of the plurality of first devices are adjacently distributed and form a shielding isolation portion 300.
- the ground terminal 310 itself is a conductive structure. Therefore, when the ground terminals 310 are arranged adjacent to each other, the whole has conductive continuity, thereby achieving a shielding effect.
- the shielding film assembly 200, the shielding spacer 300, and the circuit board body 100 form at least two shielding cavities 400. Specifically, one end of the shielding isolation portion 300 is connected to the shielding film assembly 200, and the other end of the shielding isolation portion 300 is connected to the circuit board body 100. In this way, the shielding isolation portion 300 separates the internal shielding space of the circuit board assembly. In turn, a shielding cavity 400 is formed.
- the specific number of shielding cavities 400 is determined by the specific shape of the shielding isolation portion 300, and in this embodiment, the shape of the shielding isolation portion 300 may be various.
- the shielding isolation portion 300 may extend in a straight line, and divide the inside of the circuit board assembly into two shielding cavities 400.
- the shielding isolation portion 300 can also have other shapes, such as a cross shape, where the inside of the circuit board assembly is divided into four shielding cavities 400; in a T-shape, at this time, the inside of the circuit board assembly is divided into three shielding cavities 400.
- the embodiment of the present invention does not limit the extension linear feature of the shielding isolation portion 300, and it may also extend in a curved or broken line shape.
- the shielding isolation part 300 needs to be connected to the shielding membrane assembly 200, that is, one end of the ground terminal 310 constituting the shielding isolation part 300 needs to be connected to the shielding membrane assembly 200.
- the insulating layer 220 is located between the electronic device and the shielding layer 210, the insulating layer 220 will cause the ground terminal 310 and the shielding film assembly 200 to be non-conductive and continuous, so there will be electromagnetic leakage problems between the shielding film assembly 200 and the shielding isolation portion 300 .
- the shielding film assembly 200 is provided with a avoidance area 230, in the avoidance area 230, the shielding layer 210 is electrically connected to the shielding isolation portion 300.
- the avoidance area 230 is the area on the shielding film assembly 200 where the window is opened, specifically, the part of the shielding film assembly 200 is peeled off.
- the shielding layer 210 and the insulating layer 220 are usually connected by bonding. In the process of opening the shielding film assembly 200, the shielding layer 210 and the insulating layer 220 will not be separated.
- the ground terminal 310 is electrically connected to the ground network on the circuit board body 100, and is also electrically connected to the shielding layer 210, realizing the reliable grounding of the shielding layer 210 around the avoidance area 230, thereby avoiding the shielding film assembly 200 from being separated from the shielding.
- Electromagnetic leakage occurs between the parts 300; at the same time, the ground terminal 310 can fix the shielding layer 210 around the avoidance area 230, and as mentioned above, the shielding layer 210 and the insulating layer 220 are usually connected by bonding, so With this arrangement, it is equivalent to forming an attachment point on the electronic device, thereby realizing the fixation of the shielding membrane assembly 200, preventing the shielding membrane assembly 200 from falling off the electronic device at the avoidance area 230, and enhancing the electromagnetic shielding effect.
- the electrical connection relationship between the shielding isolation portion 300 and the shielding layer 210 can be various, and the embodiment of the present invention does not limit it, such as bonding, hot pressing, etc., but all need to ensure the shielding isolation portion
- the conductive relationship between 300 and the shielding layer 210 is sufficient.
- the shielding isolation portion 300 can be welded to the shielding layer 210. With such a configuration, the connection stability and reliability of the shielding isolation portion 300 and the shielding layer 210 can be improved. It should be understood that the shielding isolation portion 300 and the shielding layer 210 are welded, that is, the grounding terminal 310 included in the shielding isolation portion 300 is welded to the shielding layer 210.
- the shielding isolation portion 300 is inside the shielding membrane assembly 200 during the specific installation process, it is not convenient to connect the two. However, since the shielding membrane assembly 200 is provided with the avoiding area 230, the avoiding area 230 penetrates the shielding membrane assembly 200, and the shielding isolation portion 300 can be exposed to the shielding membrane assembly 200 through the avoiding area 230, and thus the shielding isolation portion 300 and The shield layer 210 is connected.
- the shielding isolation portion 300 is formed by arranging the ground terminals 310 of a plurality of first devices adjacently, and at the same time, the shielding membrane assembly 200, the shielding isolation portion 300 and the circuit board body 100 are formed There are at least two shielded cavities 400 to realize sub-cavity shielding.
- the ground terminal 310 itself is the structure on the circuit board assembly, and the shielding isolation portion 300 formed by it is It does not occupy additional installation space on the circuit board body 100, and at the same time, the first device can also be directly routed from the side. Therefore, the circuit board assembly disclosed in the embodiment of the present invention saves processing cost and is also practical.
- conductive fillers 320 may be provided in these gaps. It should be understood that because the conductive filler 320 is conductive, it can electrically connect adjacent ground terminals 310 to eliminate conductive discontinuities, thereby preventing electromagnetic leakage and avoiding electronic devices located in different shielding cavities 400 The mutual electromagnetic interference, optimizes the shielding effect.
- the ground terminals 310 included in the shielding isolation portion 300 should be arranged as close as possible to reduce the gap between them, reduce electromagnetic leakage, and improve the shielding effect.
- the embodiment of the present invention does not limit the specific type of the conductive filler 320.
- the conductive filler 320 may be a solder structure, and it may also be another conductive structure, such as a metal structure such as copper and aluminum.
- the specific opening position of the avoiding area 230 on the shielding film assembly 200 is not restricted.
- the avoidance area 230 may be disposed opposite to the shielding isolation part 300. It should be understood that the shielding layer 210 needs to be electrically connected to the shielding isolation portion 300. This arrangement avoids the need for excessively long electrical connections between the two, which undoubtedly facilitates the realization of the connection between the two and reduces the cost.
- this embodiment does not limit the specific shape of the avoidance area 230.
- the avoidance area 230 can usually match the linear feature of the shielding isolation portion 300.
- the shielding isolation portion 300 extends linearly, and the avoidance area 230 may be rectangular.
- Avoidance area According to the shielding isolation part 300 of different shapes, the avoidance area 230 can also be a square avoidance area, a circular avoidance area, etc.
- the ground terminal 310 of each first device is at least partially covered by the avoidance area 230, and the ground terminal 310 of each first device and the shielding layer 210 electrical connection.
- grounding terminals 310 there are also multiple grounding terminals 310. If each grounding terminal 310 is electrically connected to the shielding layer 210, the number of connection points between the shielding isolation portion 300 and the shielding membrane assembly 200 can be increased, which will undoubtedly improve the shielding membrane assembly. 200 overall installation adhesion. Even when the circuit board assembly is deformed, subjected to thermal stress, etc., it can be ensured that the shielding film assembly 200 does not fall off.
- the present embodiment does not limit the coverage relationship between the avoidance area 230 and the ground terminal 310.
- the avoidance area 230 a part of the ground terminal 310 may be exposed, or all of the ground terminal 310 may be exposed.
- the avoidance area 230 only needs small openings, and the small openings have little effect on the overall shielding effect of the circuit board assembly.
- the shielding layer 210 in the avoidance area 230 is usually cut and then peeled off to expose the shielding isolation portion 300; however, in this case, the shielding layer 210 surrounds the avoidance area There is usually a distance between the edge of 230 and the shielding isolation portion 300, and it cannot be directly connected. Therefore, it is undoubtedly necessary to provide an intermediate electrical connector between the two, which makes the connection operation more cumbersome.
- the shielding layer 210 may have an extension portion 211, and in the escape area 230, the extension portion 211 is electrically connected to the ground terminal 310 of the first device. Specifically, the extension portion 211 electrically connects the ground terminal 310 and the shielding layer 210 together.
- the extension portion 211 has a certain length, which can make up the distance between the ground terminal 310 and the shielding layer 210.
- the ground terminal 310 is connected to realize the fixation of the shielding film assembly 200.
- the embodiment of the present invention does not limit the specific type of the extension portion 211.
- the extension portion 211 may be generally formed integrally with the shielding layer 210, and it can be understood that the extension portion 211 is drawn from the shielding layer 210, or the shielding layer 210 forms the extension portion 211 by electroplating. With this arrangement, the conduction reliability and connection stability of the shielding layer 210 and the extension portion 211 can be improved, thereby making the grounding effect better.
- the cut part is not peeled off, and the connection between the cut part and the shielding layer 210 is retained, thereby forming the extension 211, that is, the extension
- the part 211 is a part of the shielding layer 210 in the area of the avoidance area 230.
- the extension portion 211 is bent and extends into the avoidance area 230. After the extension portion 211 is bent, it can pass through the avoidance area 230 and be electrically connected to the ground terminal 310, thereby realizing the electrical connection between the shielding layer 210 and the ground terminal 310, and finally The shielding film assembly 200 is attached and fixed.
- the shielding film assembly 200 should be a flexible structure.
- the shielding layer 210 may be a copper layer, that is, a copper foil. Copper foil is a conventional material in the electronic field and is easy to obtain. With this arrangement, the shielding layer 210 has good electrical conductivity and welding characteristics, which is conducive to achieving a stable connection between the shielding layer 210 and the ground terminal 310; at the same time, the shielding layer 210 also has good flexibility, which is beneficial to the shielding layer 210 and electronics. The attachment setting of the device.
- the embodiment of the present invention does not limit the specific type of the shielding layer 210, and it may also be a conductive metal layer such as an aluminum layer, a zinc layer, etc., or a non-metal layer with conductive characteristics.
- the circuit board body 100 may have a second ground area 120, and the shielding layer 210 is grounded.
- the terminal 310 is electrically connected to the second grounding area 120. With this arrangement, the grounding terminal 310 only needs to be installed on the second grounding area 120 to complete the grounding process of the grounding terminal 310.
- the embodiment of the present invention does not limit the specific structure type of the second grounding area 120.
- the second grounding area 120 may be a grounding pad area.
- the terminal 310 is installed on the ground pad area corresponding to the second ground area 120, which not only realizes the stable installation of the first device.
- the electronic device further includes a second device, and the second device is located in the shielding cavity 400.
- the shielding isolation portion 300 needs to be composed of the ground terminals 310 of the first device, and these ground terminals 310 need to be distributed adjacently. Therefore, the first device also has certain layout requirements, so it is also present in the circuit board assembly.
- the second device located in the shielding cavity 400.
- an embodiment of the present invention also discloses an electronic device, which includes the foregoing circuit board assembly.
- the electronic devices referred to in the embodiments of the present invention may be devices such as smart phones, tablet computers, e-book readers, wearable devices, etc.
- the embodiments of the present invention do not limit the specific types of electronic devices.
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
一种电路板组件以及电子设备，该电路板组件包括电路板本体（100）、电子器件和屏蔽膜组件（200），电子器件设置于电路板本体（100）的表面，屏蔽膜组件（200）罩设于电子器件；电路板本体（100）具有第一接地区（110），屏蔽膜组件（200）包括依次层叠设置的屏蔽层（210）和绝缘层（220），绝缘层（220）位于屏蔽层（210）与电子器件之间，屏蔽层（210）的边缘与第一接地区（110）电连接。电子器件包括多个第一器件，每个第一器件具有接地端子（310），多个第一器件的接地端子（310）相邻分布且形成屏蔽隔离部（300），屏蔽膜组件（200）、屏蔽隔离部（300）和电路板本体（100）形成至少两个屏蔽腔（400）；屏蔽膜组件（200）开设有避让区（230）。
Description
交叉引用
本发明要求在2020年04月17日提交中国专利局、申请号为202010305654.0、发明名称为“电路板组件以及电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
本发明实施例涉及通信设备技术领域，尤其涉及一种电路板组件以及电子设备。
随着科技的高速发展，电子设备(例如手机、平板电脑等)的性能不断优化，同时为了获得更佳的使用体验感，电子设备的轻薄化设计已成为发展趋势。目前，为了实现电子设备的轻薄化设计，其中一种减薄工艺是基于电路板组件进行改进，通过将绝缘薄膜贴附在电路板和元器件的表面，再将一层具有导电特性的屏蔽薄膜贴附在绝缘薄膜的表面，并将屏蔽薄膜的边沿与电路板的边缘接地区进行连接，形成法拉第笼对电路板组件进行电磁屏蔽，以代替传统的金属屏蔽框、金属屏蔽盖，进而减薄电路板组件的厚度，最终实现电子设备的轻薄化。
在应用上述的减薄处理工艺时，为了对电路板组件上的器件进行分腔屏蔽，通常需要在电路板上焊接金属屏蔽墙，金属屏蔽墙一端焊接在电路板上实现接地，而另一端与屏蔽薄膜连接，进而分隔成多个屏蔽腔室。但是，由于需要电路板给予金属屏蔽墙足够的支撑，金属屏蔽墙的焊接端的宽度势必需要大于其自身宽度，无疑会减少了电路板表面的器件安装空间，也不便于不同的屏蔽腔室之间的走线。
发明内容
本发明实施例提供一种电路板组件以及电子设备，以解决目前的电路板组件在进行分腔屏蔽时，金属屏蔽墙会减少电路板表面的器件安装空间以及阻碍不同的屏蔽腔室之间走线的问题。
第一方面，本发明实施例提供一种电路板组件，包括电路板本体、电子器件和屏蔽膜组件，所述电子器件设置于所述电路板本体的表面，所述屏蔽膜组件罩设于所述电子器件。
所述电路板本体具有第一接地区，所述屏蔽膜组件包括依次层叠设置的屏蔽层和绝缘层，所述绝缘层位于所述屏蔽层与所述电子器件之间，所述屏蔽层的边缘与所述第一接地区电连接。
所述电子器件包括多个第一器件，每个所述第一器件具有接地端子，多个所述第一器件的所述接地端子相邻分布且形成屏蔽隔离部，所述屏蔽膜组件、所述屏蔽隔离部和所述电路板本体形成至少两个屏蔽腔。
所述屏蔽膜组件开设有避让区，在所述避让区内，所述屏蔽层与所述屏蔽隔离部电连接。
第二方面，本发明实施例还提供一种电子设备，包括如前述的电路板组件。
本发明采用的技术方案能够达到以下有益效果：
在本发明实施例中，通过将多个第一器件的接地端子相邻布设以形成屏蔽隔离部，同时，屏蔽膜组件、屏蔽隔离部和电路板本体形成至少两个屏蔽腔，进而实现分腔屏蔽。
相较于现有技术，本发明实施例公开的电路板组件无需在电路板组件内部增加屏蔽结构，无疑增加了电路板本体表面的安装空间，并方便了电子器件的走线，同时还兼具成本优势。
此处所说明的附图用来提供对本发明的进一步理解，构成本发明的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。
图1为本发明实施例公开的电路板组件于俯视视角下的结构示意图；
图2为本发明实施例公开的关于图1的A-A向视角下的剖视图；
图3为本发明实施例公开的关于图1的B-B向视角下的剖视图；
附图标记说明：
100-电路板本体、110-第一接地区、120-第二接地区、
200-屏蔽膜组件、210-屏蔽层、211-延伸部、220-绝缘层、230-避让区、
300-屏蔽隔离部、310-接地端子、320-导电填充件、
400-屏蔽腔。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
以下结合附图，详细说明本发明各个实施例公开的技术方案。
请参考图1～图3，本发明实施例公开一种电路板组件，其包括电路板本体100、电子器件和屏蔽膜组件200。
电路板本体100是该电路板组件的基础构件，其为电子器件和屏蔽膜组件200均提供了安装支撑基础。应理解的是，电子器件在运行时会产生电磁波，这些电磁波会对该电路板组件之外的其他器件产生电磁干扰，相应的，该电路板组件上的电子器件也容易受到其他器件的电磁干扰，因此为了确保电子器件能够正常运行，需要对电路板组件上的电子器件进行电磁屏蔽。在本发明实施例中，电磁屏蔽是通过屏蔽膜组件200来实现。
在本发明实施例中，电子器件设置于电路板本体100的表面，屏蔽膜组件200罩设于电子器件，进而对电路板本体100上的电子器件进行屏蔽。
其中，电路板本体100具有第一接地区110，第一接地区110连通电路板本体100的地网络(GND)。屏蔽膜组件200包括依次层叠设置的屏蔽层210和绝缘层220，绝缘层220位于屏蔽层210与电子器件之间。应理解的是，屏蔽膜组件200能够实现电路板组件的减薄设计，能够使用户获得更佳的使用体验感；为了使得屏蔽膜组件200能够贴附于电子器件的表面，屏蔽膜组件200应为柔性结构件。如此设置下，屏蔽膜组件200与电子器件之间的间隙尽量地被减小，使得电路板组件的整体厚度变小，进而实现电路板组件的减薄。
由于屏蔽膜组件200是柔性结构件，会导致屏蔽层210与电子器件直接接触，会引起短路。因此，在本发明实施例中，绝缘层220处于屏蔽层210与电子器件之间，能够将屏蔽层210和电子器件分隔开，进而可避免发生短路故障。
同时，屏蔽层210的边缘与第一接地区110电连接。需要说明的是，屏蔽结构需要接地，由于屏蔽结构上会形成电流，导致屏蔽结构不同处形成电势差，由于地信号的阻抗较低，将屏蔽结构接地后能够将这些电流导走。具体而言，屏蔽层210的边缘通过第一接地区110与电路板本体100上的地网络连接，进而实现接地，则屏蔽层210上的电流可通过第一接地区110导走。第一接地区110可以为接地焊盘，屏蔽层210可以与该接地焊盘通过焊接、热压成型等方式实现电连接。
电子器件包括多个第一器件，每个第一器件具有接地端子310。具体的，通过接地端子310，可以将第一器件可靠连接于电路板本体100上。同时，多个第一器件的接地端子310相邻分布且形成屏蔽隔离部300。应理解的是，接地端子310自身是导电结构，因此当这些接地端子310相邻排布设置时，整体就具有了导电连续性，进而可以实现屏蔽作用。
屏蔽膜组件200、屏蔽隔离部300和电路板本体100形成至少两个屏蔽腔400。具体而言，屏蔽隔离部300的一端与屏蔽膜组件200相连，屏蔽隔离部300的另一端与电路板本体100相连，如此，屏蔽隔离部300就对电路板组件的内部屏蔽空间进行了分隔，进而形成屏蔽腔400。
应理解的是，屏蔽腔400的具体数量由屏蔽隔离部300的具体形状所决定，在本实施例中，屏蔽隔离部300的形状可以有多种。在一种具体的实施方式中，屏蔽隔离部300可以呈直线状延伸，并将电路板组件内部分隔为两个屏蔽腔400。当然，屏蔽隔离部300还可以为其他的形状，例如十字形，此时电路板组件内部被分隔为四个屏蔽腔400；丁字形，此时电路板组件内部被分隔为三个屏蔽腔400。同时，本发明实施例对屏蔽隔离部300的延伸线性特征也不做限制，其还可以呈曲线状或折线状延伸。
如前所述，屏蔽隔离部300的一端需要与屏蔽膜组件200相连，即组成屏蔽隔离部300的接地端子310一端需要与屏蔽膜组件200相连。但是，由于绝缘层220位于电子器件与屏蔽层210之间，绝缘层220会导致接地端子310与屏蔽膜组件200非导电连续，因此屏蔽膜组件200与屏蔽隔离部300之间会存在电磁泄漏问题。基于此，在本实施例中，屏蔽膜组件200开设有避让区230，在避让区230内，屏蔽层210与屏蔽隔离部300电连接。
应理解的是，避让区230即是在屏蔽膜组件200上进行开窗的区域，具体的，就是将屏蔽膜组件200的部分进行剥离。屏蔽层210与绝缘层220之间通常通过粘接实现连接，在对屏蔽膜组件200进行开窗的过程中，屏蔽层210与绝缘层220不会脱离。
同时，接地端子310与电路板本体100上的地网络电连接，同时还与屏蔽层210电连接，实现了避让区230周围的屏蔽层210的可靠接地，进而避免了屏蔽膜组件200与屏蔽隔离部300之间出现电磁泄漏；同时，接地端子310能够对避让区230周围的屏蔽层210进行固定，且如前所述，屏蔽层210与绝缘层220之间通常通过粘接实现连接，因此在如此设置下，相当于在电子器件上形成了一个附着点，进而实现了对屏蔽膜组件200的固定，能够防止屏蔽膜组件200在避让区230处与电子器件脱落，强化了电磁屏蔽效果。
在本发明实施例中，屏蔽隔离部300与屏蔽层210的电连接关系可以有多种，本发明实施例对其不做限制，例如粘接、热压成型等，但都需要确保屏蔽隔离部300与屏蔽层210的导电关系即可。在一种具体的实施方式中，屏蔽隔离部300可以与屏蔽层210焊接，如此设置下，可以提升屏蔽隔离部300与屏蔽层210的连接稳定性和可靠性。应理解的是，屏蔽隔离部300与屏蔽层210焊接，即是指屏蔽隔离部300包括的接地端子310与屏蔽层210焊接。
需要说明的是，由于在具体的安装过程中，屏蔽隔离部300处于屏蔽膜组件200内部，因此不便于连接二者。但是由于屏蔽膜组件200开设有避让区230，避让区230贯通屏蔽膜组件200，屏蔽隔离部300可以通过避让区230外露于屏蔽膜组件200，进而能够在避让区230内对屏蔽隔离部300与屏蔽层210进行连接。
通过上述说明可知，在本发明实施例中，通过将多个第一器件的接地端子310相邻布设以形成屏蔽隔离部300，同时，屏蔽膜组件200、屏蔽隔离部300和电路板本体100形成至少两个屏蔽腔400，进而实现分腔屏蔽。
在现有技术中，需要额外增设金属屏蔽墙来实现屏蔽，金属屏蔽墙的加工较为复杂，加工成本较高，而接地端子310本身即是电路板组件上的结构，其形成的屏蔽隔离部300不会额外占用电路板本体100上的安装空间，同时，第一器件也可以直接从侧面走线，因此本发明实施例所公开的电路板组件即节约了加工成本，又兼具有实用性。
请再次参考图1和图3，通常情况下，由于接地端子310自身的表面加工存在缺陷，以及电子器件的安装误差，在屏蔽隔离部300中，相邻两个接地端子310之间会存在缝隙，如此会使得屏蔽腔400上存在导电不连续点，进而会产生电磁泄漏，分处于不同的屏蔽腔400中的电子器件会受到电磁干扰。基于此，在可选的方案中，这些缝隙中可以设置有导电填充件320。应理解的是，由于导电填充件320具有导电性，能够将相邻的接地端子310进行电连接，消除导电不连续点，进而能够防止电磁泄漏，避免分处于不同的屏蔽腔400中的电子器件的相互电磁干扰，优化了屏蔽效果。
当然，在具体的安装过程中，屏蔽隔离部300包括的接地端子310之间应尽量紧密排布，以减小之间的缝隙，减弱电磁泄漏，提升屏蔽效果。本发明实施例不限制导电填充件320的具体类型，导电填充件320可选为焊锡结构件，其还可以为其他的导电结构件，例如铜、铝等金属结构件。
请再次参考图2，在本发明实施例中，未限制避让区230在屏蔽膜组件200上的具体开设位置。在可选的方案中，避让区230可以与屏蔽隔离部300相对设置。应理解的是，屏蔽层210需要与屏蔽隔离部300进行电连接，如此设置下，避免了二者之间设置过长的电连接件，无疑有利于实现二者的连接，也降低了成本。
同时，本实施例未对避让区230的具体形状做出限制，避让区230通常可以与屏蔽隔 离部300的延伸线性特征相匹配，例如屏蔽隔离部300呈直线状延伸，避让区230可以为矩形避让区；根据不同形状的屏蔽隔离部300，避让区230也可以为正方形避让区、圆形避让区等。
如前所述，第一器件有多个，其与避让区230的具体关系也有多种，本实施例对其不做限制。在一种具体的实施方式中，在垂直于电路板本体100的方向上，每个第一器件的接地端子310至少部分被避让区230覆盖，且每个第一器件的接地端子310与屏蔽层210电连接。
应理解的是，接地端子310也具有多个，如果每个接地端子310均与屏蔽层210电连接，就能够增加屏蔽隔离部300与屏蔽膜组件200的连接点数量，无疑能够提升屏蔽膜组件200整体的安装附着力。即使在电路板组件发生形变、承受热应力等情况下，也能够确保了屏蔽膜组件200不发生脱落。
当然，本实施例未限制避让区230与接地端子310的覆盖关系，在避让区230内，可以外露出接地端子310的部分，也可以外露出接地端子310的全部。通常情况下，避让区230仅需要小型开窗即可，小型开窗对电路板组件整体屏蔽效果的影响较小。
在对屏蔽层210进行开窗时，通常是将避让区230区域内的屏蔽层210切割之后进行剥离，以将屏蔽隔离部300暴露；但是，在这种情况下，屏蔽层210环绕于避让区230的边缘通常与屏蔽隔离部300之间存在一段距离，无法直接进行连接，则无疑需要在二者之间设置中间电连接件，使得连接操作更为繁琐。
基于此，在可选的方案中，屏蔽层210可以具有延伸部211，在避让区230内，延伸部211与第一器件的接地端子310电连接。具体而言，延伸部211将接地端子310与屏蔽层210电连接在一起，延伸部211具有一定的长度尺寸，能够弥补接地端子310与屏蔽层210的间距，同时屏蔽层210通过延伸部211与接地端子310连接，实现了对屏蔽膜组件200的固定。当然，本发明实施例对延伸部211的具体类型不做限制。
延伸部211通常可以与屏蔽层210一体成型，可以理解为延伸部211自屏蔽层210上引出，或者，屏蔽层210通过电镀的方式形成该延伸部211。如此设置下，可以提升屏蔽层210与延伸部211的导通可靠性和连接稳定性，进而使得接地效果更佳。
在一种具体的实施方式中，当屏蔽层210被切割后，不将被切割的部分进行剥离，且保留被切割的部分与屏蔽层210的连接，进而形成延伸部211，也就是说，延伸部211即是避让区230区域内的屏蔽层210的一部分。具体的，延伸部211弯折延伸入避让区230，延伸部211折弯之后能够穿过避让区230并与接地端子310电连接，进而实现了屏蔽层210与接地端子310的电连接，最终对屏蔽膜组件200实现附着固定。
如前所述，屏蔽膜组件200应为柔性结构件。基于此，在可选的方案中，屏蔽层210可以为铜层，即铜箔。铜箔为电子领域的常规材料，便于获得。如此设置下，屏蔽层210具有良好的导电特性和焊接特性，有利于实现屏蔽层210与接地端子310的稳定连接；同时，屏蔽层210还具备了良好的柔韧性，有利于屏蔽层210与电子器件的贴附设置。当然，本发明实施例不限制屏蔽层210的具体类型，其还可以为铝层、锌层等导电金属层，也可以为具有导电特性的非金属层。
为了便于实现接地端子310与电路板本体100的连接，以及提升二者的连接稳定性和可靠性，在可选的方案中，电路板本体100可以具有第二接地区120，屏蔽层210通过接 地端子310与第二接地区120电连接。如此设置下，只需要将接地端子310安装在第二接地区120上，即可完成接地端子310的接地工序。
当然，本发明实施例不限制第二接地区120的具体结构类型，在一个具体的实施例中，第二接地区120可选为接地焊盘区，在具体的安装过程中，只需要将接地端子310安装在第二接地区120对应的接地焊盘区上，既实现了第一器件的稳定安装。通常情况下，电子器件还包括第二器件，第二器件位于屏蔽腔400内。应理解的是，屏蔽隔离部300需要由第一器件的接地端子310构成，且这些接地端子310需要相邻分布，因此对第一器件也具有一定的布设要求，所以在电路板组件中也存在位于屏蔽腔400内的第二器件。
基于前述的电路板组件，本发明实施例还公开一种电子设备，其包括如前述的电路板组件。
当然，本发明实施例所指的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴装置等设备，本发明实施例不限制电子设备的具体种类。
本发明上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本发明的实施例而已，并不用于限制本发明。对于本领域技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本发明的权利要求范围之内。
Claims (10)
- 一种电路板组件，包括电路板本体(100)、电子器件和屏蔽膜组件(200)，所述电子器件设置于所述电路板本体(100)的表面，所述屏蔽膜组件(200)罩设于所述电子器件；所述电路板本体(100)具有第一接地区(110)，所述屏蔽膜组件(200)包括依次层叠设置的屏蔽层(210)和绝缘层(220)，所述绝缘层(220)位于所述屏蔽层(210)与所述电子器件之间，所述屏蔽层(210)的边缘与所述第一接地区(110)电连接；所述电子器件包括多个第一器件，每个所述第一器件具有接地端子(310)，多个所述第一器件的所述接地端子(310)相邻分布且形成屏蔽隔离部(300)，所述屏蔽膜组件(200)、所述屏蔽隔离部(300)和所述电路板本体(100)形成至少两个屏蔽腔(400)；所述屏蔽膜组件(200)开设有避让区(230)，在所述避让区(230)内，所述屏蔽层(210)与所述屏蔽隔离部(300)电连接。
- 根据权利要求1所述的电路板组件，其中，在所述屏蔽隔离部(300)中，相邻两个所述接地端子(310)之间存在缝隙，所述缝隙中设置有导电填充件(320)。
- 根据权利要求1所述的电路板组件，其中，所述屏蔽隔离部(300)呈直线状延伸，并将所述电路板组件内部分隔为两个所述屏蔽腔(400)。
- 根据权利要求1所述的电路板组件，其中，所述避让区(230)与所述屏蔽隔离部(300)相对设置。
- 根据权利要求4所述的电路板组件，其中，在垂直于所述电路板本体(100)的方向上，每个所述第一器件的所述接地端子(310)至少部分被所述避让区(230)覆盖，且每个所述第一器件的所述接地端子(310)与所述屏蔽层(210)电连接。
- 根据权利要求1所述的电路板组件，其中，所述屏蔽层(210)具有延伸部(211)，在所述避让区(230)内，所述延伸部(211)与所述第一器件的所述接地端子(310)电连接。
- 根据权利要求1所述的电路板组件，其中，所述电子器件还包括第二器件，所述第二器件位于所述屏蔽腔(400)内。
- 根据权利要求1所述的电路板组件，其中，所述电路板本体(100)具有第二接地区(120)，所述屏蔽层(210)通过所述接地端子(310)与所述第二接地区(120)电连接。
- 根据权利要求8所述的电路板组件，其中，所述第二接地区(120)为接地焊盘区。
- 一种电子设备，包括如权利要求1至9中任一项所述的电路板组件。
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| CN113573465B (zh) * | 2021-07-23 | 2023-04-04 | 华为技术有限公司 | 电路组件和电子设备 |
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| US20100108370A1 (en) * | 2008-11-03 | 2010-05-06 | Christopher James Kapusta | System and method of forming a patterned conformal structure |
| CN101932223A (zh) * | 2009-06-22 | 2010-12-29 | 通用电气公司 | 形成隔离的敷形屏蔽区的系统和方法 |
| CN110729176A (zh) * | 2019-10-15 | 2020-01-24 | 杭州见闻录科技有限公司 | 一种用于通信模块产品的emi屏蔽工艺和通信模块产品 |
| CN111491439A (zh) * | 2020-04-17 | 2020-08-04 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
| CN111511094A (zh) * | 2020-04-17 | 2020-08-07 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
-
2020
- 2020-04-17 CN CN202010305654.0A patent/CN111511094B/zh active Active
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- 2021-04-14 WO PCT/CN2021/087259 patent/WO2021208974A1/zh active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100108370A1 (en) * | 2008-11-03 | 2010-05-06 | Christopher James Kapusta | System and method of forming a patterned conformal structure |
| CN101932223A (zh) * | 2009-06-22 | 2010-12-29 | 通用电气公司 | 形成隔离的敷形屏蔽区的系统和方法 |
| CN110729176A (zh) * | 2019-10-15 | 2020-01-24 | 杭州见闻录科技有限公司 | 一种用于通信模块产品的emi屏蔽工艺和通信模块产品 |
| CN111491439A (zh) * | 2020-04-17 | 2020-08-04 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
| CN111511094A (zh) * | 2020-04-17 | 2020-08-07 | 维沃移动通信有限公司 | 电路板组件以及电子设备 |
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| CN111511094A (zh) | 2020-08-07 |
| CN111511094B (zh) | 2023-04-14 |
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