WO2021208967A1 - 电路板组件以及电子设备 - Google Patents

电路板组件以及电子设备 Download PDF

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Publication number
WO2021208967A1
WO2021208967A1 PCT/CN2021/087243 CN2021087243W WO2021208967A1 WO 2021208967 A1 WO2021208967 A1 WO 2021208967A1 CN 2021087243 W CN2021087243 W CN 2021087243W WO 2021208967 A1 WO2021208967 A1 WO 2021208967A1
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Prior art keywords
circuit board
area
shielding
shielding layer
electronic device
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PCT/CN2021/087243
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English (en)
French (fr)
Inventor
付从华
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维沃移动通信有限公司
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Publication of WO2021208967A1 publication Critical patent/WO2021208967A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes

Definitions

  • the embodiments of the present invention relate to the technical field of communication equipment, and in particular to a circuit board assembly and electronic equipment.
  • the embodiments of the present invention provide a circuit board assembly and electronic equipment to solve the problem that the shielding film and the insulating film are likely to fall off when the current circuit board assembly is thinned, thereby reducing the shielding effect.
  • an embodiment of the present invention provides a circuit board assembly, which includes a circuit board body, an electronic device, and a shielding film assembly.
  • the electronic device wherein the circuit board body has a first contact area
  • the shielding film assembly includes a shielding layer and an insulating layer stacked in sequence, the insulating layer being located between the shielding layer and the electronic device , The edge of the shielding layer is electrically connected to the first grounding area.
  • the shielding film assembly is provided with a avoidance area, the electronic device includes a first device, and the first device includes a device body and a ground terminal. In the escape area, the shielding layer penetrates the insulating layer and is connected to The ground terminal is electrically connected.
  • an embodiment of the present invention also provides an electronic device, including the aforementioned circuit board assembly.
  • the shielding layer is fixed by electrically connecting the shielding layer with the ground terminal of the first device, thereby realizing the fixing of the shielding film assembly.
  • the circuit board assembly disclosed in the embodiment of the present invention can not only prevent the shielding film assembly from falling off the surface of the electronic device, but also can reliably ground the shielding layer to ensure that the circuit board assembly has a better shielding effect.
  • FIG. 1 is a schematic diagram of the structure of a circuit board assembly disclosed in an embodiment of the present invention
  • FIG. 2 is a schematic diagram of the structure of the extension part disclosed in the embodiment of the present invention in a top view angle;
  • 300-first device 310-device body, 320-grounding terminal, 321-electrical connector.
  • an embodiment of the present invention discloses a circuit board assembly, which includes a circuit board body 100, an electronic device, and a shielding film assembly 200.
  • the circuit board body 100 is a basic component of the circuit board assembly, which provides an installation support foundation for both the electronic device and the shielding film assembly 200. It should be understood that electronic devices generate electromagnetic waves during operation, and these electromagnetic waves will cause electromagnetic interference to other devices other than the circuit board assembly. Accordingly, the electronic devices on the circuit board assembly are also susceptible to electromagnetic interference from other devices. Therefore, in order to ensure the normal operation of electronic devices, it is necessary to electromagnetically shield the electronic devices on the circuit board assembly. In the embodiment of the present invention, electromagnetic shielding is achieved by the shielding film assembly 200.
  • the electronic device is arranged on the surface of the circuit board body 100, and the shielding film assembly 200 is arranged on the electronic device to shield the electronic device on the circuit board body 100.
  • the circuit board body 100 has a first grounding area 110, and the first grounding area 110 is usually connected to the ground network (GND) of the circuit board body 100.
  • the shielding film assembly 200 includes a shielding layer 210 and an insulating layer 220 stacked in sequence, and the insulating layer 220 is located between the shielding layer 210 and the electronic device. It should be understood that the shielding membrane assembly 200 can realize the thinning design of the circuit board assembly. In order to enable the shielding membrane assembly 200 to be attached to the surface of the electronic device, the shielding membrane assembly 200 should be a flexible structure. With this arrangement, the gap between the shielding film assembly 200 and the electronic device is reduced as much as possible, so that the overall thickness of the circuit board assembly is reduced, thereby achieving the reduction of the circuit board assembly.
  • the shielding layer 210 Since the shielding layer 210 is in direct contact with the electronic device, it will cause a short circuit, and the insulating layer 220 is located between the shielding layer 210 and the electronic device, which can separate the shielding layer 210 and the electronic device, thereby avoiding a short circuit failure.
  • the edge of the shielding layer 210 is electrically connected to the first grounding area 110.
  • the shielding structure usually needs to be grounded. Since currents are formed on the shielding structure, a potential difference is formed in different parts of the shielding structure, and the impedance of the ground signal is low. After the shielding structure is grounded, these currents can be conducted away.
  • the edge of the shielding layer 210 is connected to the ground network on the circuit board body 100 through the first grounding area 110 to achieve grounding, and the current on the shielding layer 210 can be conducted through the first grounding area 110.
  • the first grounding area 110 may be a grounding pad, and the shielding layer 210 may be electrically connected to the grounding pad by welding, hot pressing, or the like.
  • the shielding film assembly 200 is provided with a avoidance area 230.
  • the avoidance area 230 is the area where the shielding film assembly 200 is opened.
  • the shielding film assembly 200 since there are some large-sized electronic devices (such as integrated circuits) in the circuit board assembly, if the shielding film assembly 200 is attached to the surface of these electronic devices, the overall thickness of the circuit board assembly will be increased; at the same time, There are also some electronic devices whose top surface is mostly made of resin, glass, etc., which have good insulating properties and do not need to be shielded.
  • the shielding film assembly 200 is usually opened on the surface of these electronic devices, and at least part of the shielding film assembly 200 projected on the surface of these electronic devices is peeled off, that is, the avoidance area 230 is formed, but at the same time, the shielding is also caused.
  • the edge of the membrane assembly 200 surrounding the avoidance area 230 is difficult to connect to the ground network of the circuit board body 100, which affects the shielding effect.
  • there is no restriction on the specific window opening situation of the shielding film assembly 200 for example, windows can be opened correspondingly above all electronic devices.
  • the shielding layer 210 and the insulating layer 220 are usually connected by bonding. In the process of opening the shielding film assembly 200, the shielding layer 210 and the insulating layer 220 will not be separated.
  • the electronic device may include a first device 300, where the first device 300 includes a device body 310 and a ground terminal 320. Specifically, the ground terminal 320 is connected to the device body 310, and the ground terminal 320 may be connected to On the circuit board body 100, the first device 300 is fixed on the circuit board body 100 and grounded.
  • the shielding layer 210 penetrates the insulating layer 220 and is electrically connected to the ground terminal 320.
  • the ground terminal 320 is electrically connected to the ground network on the circuit board body 100, and is also electrically connected to the shielding layer 210, so as to achieve reliable grounding of the shielding layer 210 around the avoidance area 230, thereby preventing the shielding effect from being damaged.
  • the ground terminal 320 can fix the shielding layer 210 around the avoidance area 230, and as mentioned above, the shielding layer 210 and the insulating layer 220 are usually connected by bonding, so in this setting, It is equivalent to forming an attachment point on the electronic device, thereby realizing the fixation of the shielding film assembly 200, which can prevent the shielding film assembly 200 from falling off the electronic device at the avoidance area 230.
  • the shielding layer 210 is fixed by electrically connecting the shielding layer 210 to the ground terminal 320 of the electronic device, so as to realize the fixing of the shielding film assembly 200.
  • the circuit board assembly disclosed in the embodiment of the present invention can not only prevent the shielding film assembly 200 from falling off the surface of the electronic device, but also can reliably ground the shielding layer 210 to ensure that the circuit board assembly has a better shielding effect.
  • the avoiding area 230 at least partially covers the ground terminal 320.
  • the embodiment of the present invention does not limit the specific type of the avoidance area 230. In the avoidance area 230, only a part of the ground terminal 320 may be exposed, or all the ground terminals 320 may be exposed. It is only necessary that the shielding layer 210 can be electrically connected to the ground terminal 320. Can.
  • the avoidance area 230 only needs to have small openings, and the small openings have less influence on the overall shielding effect of the circuit board assembly.
  • the electrical connection relationship between the ground terminal 320 and the shielding layer 210 can be various.
  • the embodiment of the present invention does not limit it, such as bonding, hot pressing, etc., but it is necessary to ensure that the ground terminal 320 and the shielding layer 210 are connected to each other.
  • the conductive relationship of the shielding layer 210 is sufficient.
  • the ground terminal 320 can be welded to the shielding layer 210. With this arrangement, the stability and reliability of the connection between the grounding terminal 320 and the shielding layer 210 can be improved.
  • the shielding film assembly 200 should be a flexible structure.
  • the shielding layer 210 may be a copper layer, that is, a copper foil. Copper foil is a conventional material in the electronic field and is easy to obtain.
  • the shielding layer 210 has good electrical conductivity and welding characteristics, which is beneficial to realize a stable connection between the shielding layer 210 and the ground terminal 320; at the same time, the shielding layer 210 also has good flexibility, which is also beneficial to the shielding film assembly 200 Attach settings to electronic devices.
  • the embodiment of the present invention does not limit the specific type of the shielding layer 210, and it may also be a conductive metal layer such as an aluminum layer, a zinc layer, etc., or a non-metal layer with conductive characteristics.
  • the circuit board body 100 may have a second grounding area 120, and the shielding layer 210 is grounded.
  • the terminal 320 is electrically connected to the second grounding area 120.
  • the embodiment of the present invention does not limit the specific structure type of the second grounding area 120.
  • the second grounding area 120 may be a grounding pad area. In the specific installation process, only the grounding area is required.
  • the terminal 320 is installed on the ground pad area corresponding to the second ground area 120, which not only realizes the stable installation of the first device 300.
  • the shielding layer 210 and the insulating layer 220 in the avoiding area 230 are usually cut and then peeled off.
  • the shielding layer 210 around the avoiding area 230 is usually connected to the ground. There is a certain distance between the terminals 320, which cannot be directly connected.
  • the ground terminal 320 is provided with an electrical connector 321 on the side close to the shielding film assembly 200, the electrical connector 321 at least partially protrudes from the device body 310, and the shielding layer 210 is connected to the device body 310 through the electrical connector 321
  • the ground terminal 320 is electrically connected. It should be understood that the electrical connector 321 at least partially protrudes from the device body 310, that is, the electrical connector 321 has a certain length dimension, which can compensate for the distance between the ground terminal 320 and the shielding layer 210, and at the same time, the electrical connector 321 will be grounded.
  • the terminal 320 and the shielding layer 210 are connected together to realize the fixation of the shielding film assembly 200.
  • the electrical connection member 321 may be a pad electrode, a copper strip, or the like.
  • the shielding layer 210 may have an extension 211, and in the escape area 230, the extension 211 penetrates the insulating layer 220 and is electrically connected to the ground terminal 320. Similar to the electrical connector 321, the extension portion 211 electrically connects the ground terminal 320 and the shielding layer 210 together.
  • the extension portion 211 has a certain length, which can make up for the distance between the ground terminal 320 and the shielding layer 210, while the shielding layer 210 passes through The extension 211 is connected to the ground terminal 320 to realize the fixation of the shielding film assembly 200.
  • the embodiment of the present invention does not limit the specific type of the extension portion 211.
  • the extension portion 211 may be integrally formed with the shielding layer 210, which can be understood as the extension portion 211 being drawn from the shielding layer 210, or the shielding layer 210 forms the extension portion 211 by electroplating.
  • the conduction reliability and connection stability of the shielding layer 210 and the extension portion 211 can be improved, thereby making the grounding effect better.
  • the part is not peeled off, and one side of the part is connected with the shielding layer 210 to form the extension 211.
  • the extension 211 is a part of the shielding layer 210 in the area of the avoidance area 230. Specifically, the extension portion 211 is bent and extends into the avoidance area 230. After the extension portion 211 is bent, it can pass through the avoidance area 230 and be electrically connected to the ground terminal 320, thereby realizing the electrical connection between the shielding layer 210 and the ground terminal 320, and finally The shielding film assembly 200 is attached and fixed.
  • the electronic device may include a plurality of first devices 300, of course, the embodiment of the present invention does not limit the specific number of the first devices 300.
  • the embodiment of the present invention does not limit the specific relationship between the first device 300 and the avoidance area 230.
  • the ground terminal 320 of each first device 300 in a direction perpendicular to the circuit board body 100, is at least partially It is covered by the avoidance area 230, and the ground terminal 320 of each first device 300 is electrically connected to the shielding layer 210.
  • the number of ground terminals 320 will increase accordingly.
  • the number of connection points between the ground terminals 320 and the shielding layer 210 will also increase accordingly.
  • the density reaches a certain level, it will be able to The overall installation adhesion of the shielding membrane assembly 200 is improved, and even when the circuit board assembly is deformed, subjected to thermal stress, etc., it can be ensured that the shielding membrane assembly 200 does not fall off.
  • the electronic device also includes a second device, and in a direction perpendicular to the circuit board body 100, the shielding film assembly 200 covers the second device.
  • the shielding film assembly 200 covers the second device. It should be understood that, in order to ensure the shielding effect of the shielding film assembly 200, the size of the avoidance area 230 needs to be limited, so there is a second device completely covered by the shielding film assembly 200 in the circuit board assembly.
  • the specific shape of the avoidance area 230 is not limited.
  • the avoidance area 230 can be a square avoidance area or a rectangular avoidance area.
  • the avoidance area 230 can also be other Shape, such as round, irregular shape, etc.
  • an embodiment of the present invention also discloses an electronic device, which includes the foregoing circuit board assembly.
  • the electronic device referred to in the embodiment of the present invention may be a smart phone, a tablet computer, an e-book reader, a wearable device, etc., and the embodiment of the present invention does not limit the specific type of the electronic device.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种电路板组件以及电子设备，该电路板组件包括电路板本体（100）、电子器件和屏蔽膜组件（200），电子器件设置于电路板本体（100）的表面，屏蔽膜组件（200）罩设于电子器件；其中，电路板本体（100）具有第一接地区（110），屏蔽膜组件（200）包括依次层叠设置的屏蔽层（210）和绝缘层（220），绝缘层（220）位于屏蔽层（210）与电子器件之间，屏蔽层（210）的边缘与第一接地区（110）电连接；屏蔽膜组件（200）开设有避让区（230），电子器件包括第一器件（300），第一器件（300）包括器件本体（310）和接地端子（320），在避让区（230）内，屏蔽层（210）贯穿绝缘层（220），且与接地端子（320）电连接。

Description

电路板组件以及电子设备
交叉引用
本发明要求在2020年04月17日提交中国专利局、申请号为202010305664.4、发明名称为“电路板组件以及电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本发明实施例涉及通信设备技术领域，尤其涉及一种电路板组件以及电子设备。
背景技术
随着科技的高速发展，电子设备(例如手机、平板电脑等)的性能不断优化，同时为了获得更佳的使用体验感，电子设备的轻薄化设计已成为发展趋势。目前，为了实现电子设备的轻薄化设计，其中一种减薄工艺是基于电路板组件进行改进，通过将绝缘薄膜贴附在电路板和器件的表面，再将一层具有导电特性的屏蔽薄膜贴附在绝缘薄膜的表面，并将屏蔽薄膜的边沿与电路板的接地焊盘连接，形成法拉第笼对电路板组件进行电磁屏蔽，以代替传统的金属屏蔽框、金属屏蔽盖，进而减薄电路板组件的厚度，最终实现电子设备的轻薄化。
在应用上述的减薄处理工艺时，屏蔽薄膜与绝缘薄膜之间、绝缘薄膜与器件之间均容易存在间隙而遗留有汽泡，如此情况下会减弱屏蔽薄膜、绝缘薄膜的贴附可靠性，一旦屏蔽薄膜、绝缘薄膜出现脱落问题，就会降低屏蔽效果，造成电磁干扰。
发明内容
本发明实施例提供一种电路板组件以及电子设备，以解决目前的电路板组件在进行减薄处理时，易造成屏蔽薄膜和绝缘薄膜脱落而降低屏蔽效果的问题。
第一方面，本发明实施例提供一种电路板组件，其包括电路板本体、电子器件和屏蔽膜组件，所述电子器件设置于所述电路板本体的表面，所述屏蔽膜组件罩设于所述电子器件；其中，所述电路板本体具有第一接地区，所述屏蔽膜组件包括依次层叠设置的屏蔽层和绝缘层，所述绝缘层位于所述屏蔽层与所述电子器件之间，所述屏蔽层的边缘与所述第一接地区电连接。
所述屏蔽膜组件开设有避让区，所述电子器件包括第一器件，第一器件包括器件本体和接地端子，在所述避让区内，所述屏蔽层贯穿所述绝缘层，且与所述接地端子电连接。
第二方面，本发明实施例还提供一种电子设备，包括如前述的电路板组件。
本发明采用的技术方案能够达到以下有益效果：
在本发明实施例中，通过将屏蔽层与第一器件的接地端子电连接，以对屏蔽层进行固定，进而实现对屏蔽膜组件的固定。相较于现有技术，本发明实施例公开的电路板组件不 仅能够防止屏蔽膜组件从电子器件表面脱落，同时能够将屏蔽层可靠接地，确保了电路板组件具备较佳的屏蔽效果。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本发明的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。
图1为本发明实施例公开的电路板组件的结构示意图；
图2为本发明实施例公开的延伸部在俯视视角下的结构示意图；
附图标记说明：
100-电路板本体、110-第一接地区、120-第二接地区、
200-屏蔽膜组件、210-屏蔽层、211-延伸部、220-绝缘层、230-避让区、
300-第一器件、310-器件本体、320-接地端子、321-电连接件。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
以下结合附图，详细说明本发明各个实施例公开的技术方案。
请参考图1和图2，本发明实施例公开一种电路板组件，包括电路板本体100、电子器件和屏蔽膜组件200。
电路板本体100是该电路板组件的基础构件，其为电子器件和屏蔽膜组件200均提供了安装支撑基础。应理解的是，电子器件在运行时会产生电磁波，这些电磁波会对该电路板组件之外的其他器件产生电磁干扰，相应的，该电路板组件上的电子器件也容易受到其他器件的电磁干扰，因此为了确保电子器件能够正常运行，需要对电路板组件上的电子器件进行电磁屏蔽。在本发明实施例中，电磁屏蔽是通过屏蔽膜组件200来实现。
在本发明实施例中，电子器件设置于电路板本体100的表面，屏蔽膜组件200罩设于电子器件，以对电路板本体100上的电子器件进行屏蔽。
其中，电路板本体100具有第一接地区110，第一接地区110通常连通电路板本体100的地网络(GND)。屏蔽膜组件200包括依次层叠设置的屏蔽层210和绝缘层220，绝缘层220位于屏蔽层210与电子器件之间。应理解的是，屏蔽膜组件200能够实现电路板组件的减薄设计，为了使得屏蔽膜组件200能够贴附于电子器件的表面，屏蔽膜组件200应为柔性结构件。如此设置下，屏蔽膜组件200与电子器件之间的间隙尽量地被减小，使得电路板组件的整体厚度变小，进而实现电路板组件的减薄。
由于屏蔽层210与电子器件直接接触会导致短路，绝缘层220处于屏蔽层210与电子器件之间，能够将屏蔽层210和电子器件分隔开，进而可避免发生短路故障。
同时，屏蔽层210的边缘与第一接地区110电连接。应理解的是，屏蔽结构通常需要 接地，由于屏蔽结构上会形成电流，导致屏蔽结构不同处形成电势差，而地信号的阻抗较低，可将屏蔽结构接地后能够将这些电流导走。具体的，屏蔽层210的边缘通过第一接地区110与电路板本体100上的地网络连接，进而实现接地，则屏蔽层210上的电流可通过第一接地区110导走。第一接地区110可以为接地焊盘，屏蔽层210可以与该接地焊盘通过焊接、热压成型等方式实现电连接。
在本发明实施例中，屏蔽膜组件200开设有避让区230，应理解的是，该避让区230即是在屏蔽膜组件200上进行开窗的区域。在现有技术中，由于电路板组件中存在部分大尺寸的电子器件(例如集成电路等)，如果屏蔽膜组件200贴附于这些电子器件表面，会增大电路板组件整体的厚度；同时，还存在一些电子器件，其顶面多为树脂、玻璃等材质而具有良好的绝缘特性，也不需要对其进行屏蔽。
因此，通常会在这些电子器件表面进行屏蔽膜组件200的开窗，将投影在这些电子器件表面的屏蔽膜组件200的至少部分进行剥离，即形成该避让区230，但同时也就导致了屏蔽膜组件200环绕避让区230的边缘难以与电路板本体100的地网络连接，影响屏蔽效果。当然，在本发明实施例中，对于屏蔽膜组件200的具体开窗情况并未做出限制，例如全部的电子器件上方都可以对应进行开窗。需要说明的是，屏蔽层210与绝缘层220之间通常通过粘接实现连接，在对屏蔽膜组件200进行开窗的过程中，屏蔽层210与绝缘层220不会脱离。
在本发明实施例中，电子器件可以包括第一器件300，其中，第一器件300包括器件本体310和接地端子320，具体的，接地端子320与器件本体310相连，且接地端子320可连接于电路板本体100上，以将第一器件300固定在电路板本体100上并实现接地。
同时，在避让区230内，屏蔽层210贯穿绝缘层220，且与接地端子320电连接。应理解的是，接地端子320与电路板本体100上的地网络电连接，同时还与屏蔽层210电连接，实现了避让区230周围的屏蔽层210的可靠接地，进而避免了屏蔽效果受到开窗的影响；同时，接地端子320能够对避让区230周围的屏蔽层210进行固定，且如前所述，屏蔽层210与绝缘层220之间通常通过粘接实现连接，因此在如此设置下，相当于在电子器件上形成了一个附着点，进而实现了对屏蔽膜组件200的固定，能够防止屏蔽膜组件200在避让区230处与电子器件脱落。
通过上述说明可知，在本发明实施例中，通过将屏蔽层210与电子器件的接地端子320电连接，以对屏蔽层210进行固定，进而实现对屏蔽膜组件200的固定。相较于现有技术，本发明实施例公开的电路板组件不仅能够防止屏蔽膜组件200从电子器件表面脱落，同时能够将屏蔽层210可靠接地，确保了电路板组件具备较佳的屏蔽效果。
请再次参考图1和图2：
在本发明实施例中，在垂直于电路板本体100的方向上，避让区230至少部分覆盖接地端子320。本发明实施例未对避让区230的具体类型做出限制，在避让区230可以只外露出部分接地端子320，也可以全部露出接地端子320，只需要屏蔽层210能够与接地端子320电连接即可。
当然，也可以仅有接地端子320通过避让区230外露于屏蔽膜组件200。如此，避让区230仅需要小型开窗即可，小型开窗对电路板组件整体屏蔽效果的影响较小。
在本发明实施例中，接地端子320与屏蔽层210的电连接关系可以有多种，本发明实 施例对其不做限制，例如粘接、热压成型等，但都需要确保接地端子320与屏蔽层210的导电关系即可。在一个具体的实施例中，接地端子320可以与屏蔽层210焊接，如此设置下，可以提升接地端子320与屏蔽层210的连接稳定性和可靠性。
如前所述，屏蔽膜组件200应为柔性结构件。基于此，在可选的方案中，屏蔽层210可以为铜层，即铜箔。铜箔为电子领域的常规材料，便于获得。如此设置下，屏蔽层210具有良好的导电特性和焊接特性，有利于实现屏蔽层210与接地端子320的稳定连接；同时，屏蔽层210还具备了良好的柔韧性，也有利于屏蔽膜组件200与电子器件的贴附设置。当然，本发明实施例不限制屏蔽层210的具体类型，其还可以为铝层、锌层等导电金属层，也可以为具有导电特性的非金属层。
为了便于实现接地端子320与电路板本体100的连接，以及提升二者的连接稳定性和可靠性，在可选的方案中，电路板本体100可以具有第二接地区120，屏蔽层210通过接地端子320与第二接地区120电连接。如此设置下，只需要将接地端子320安装在第二接地区120上，即可完成接地端子320的接地工序。
当然，本发明实施例不限制第二接地区120的具体结构类型，在一个具体的实施例中，第二接地区120可选为接地焊盘区，在具体的安装过程中，只需要将接地端子320安装在第二接地区120对应的接地焊盘区上，既实现了第一器件300的稳定安装。
在对屏蔽膜组件200进行开窗时，通常是将避让区230区域内的屏蔽层210和绝缘层220切割之后进行剥离，但是在这种情况下，避让区230周围的屏蔽层210通常与接地端子320之间存在一段距离，无法直接进行连接。
基于此，在可选的方案中，接地端子320靠近屏蔽膜组件200的一侧设置有电连接件321，电连接件321至少部分凸出于器件本体310，屏蔽层210通过电连接件321与接地端子320电连接。应理解的是，电连接件321至少部分凸出于器件本体310，也就是说电连接件321具有一定的长度尺寸，能够弥补接地端子320与屏蔽层210的间距，同时电连接件321将接地端子320与屏蔽层210连接在一起，实现了对屏蔽膜组件200的固定。
当然，在本发明实施例中电连接件321的具体类型可以有多种，本发明实施例对其不做限制，例如电连接件321可以为垫高电极、铜条等。
在另一个可选的方案中，屏蔽层210可以具有延伸部211，在避让区230内，延伸部211贯穿绝缘层220，且与接地端子320电连接。与电连接件321同理，延伸部211将接地端子320与屏蔽层210电连接在一起，延伸部211具有一定的长度尺寸，能够弥补接地端子320与屏蔽层210的间距，同时屏蔽层210通过延伸部211与接地端子320连接，实现了对屏蔽膜组件200的固定。当然，本发明实施例对延伸部211的具体类型不做限制。
进一步可选的方案中，延伸部211可以与屏蔽层210一体成型，可以理解为延伸部211自屏蔽层210上引出，或者，屏蔽层210通过电镀的方式形成该延伸部211。如此设置下，可以提升屏蔽层210与延伸部211的导通可靠性和连接稳定性，进而使得接地效果更佳。
在一个具体的实施例中，当屏蔽层210被切割后，不将该部分进行剥离，并且使得该部分一侧与屏蔽层210存在连接关系，进而形成延伸部211。应理解的是，延伸部211即是避让区230区域内的屏蔽层210的一部分。具体的，延伸部211弯折延伸入避让区230，延伸部211折弯之后能够穿过避让区230并与接地端子320电连接，进而实现了屏蔽层 210与接地端子320的电连接，最终对屏蔽膜组件200实现附着固定。
电子器件可以包括多个第一器件300，当然，本发明实施例不限制第一器件300的具体数量。本发明实施例未对第一器件300与避让区230的具体关系做出限制，在一个实施例中，在垂直于电路板本体100的方向上，每个第一器件300的接地端子320至少部分被避让区230覆盖，且每个第一器件300的接地端子320与屏蔽层210电连接。
如此情况下，由于具有多个第一器件300，则接地端子320的数量相应增加，此时，接地端子320与屏蔽层210的连接点数量也相应增多，当其密度达到一定程度时，将能够提升屏蔽膜组件200整体的安装附着力，即使在电路板组件发生形变、承受热应力等情况下，也能够确保了屏蔽膜组件200不发生脱落。
通常情况下，电子器件还包括第二器件，在垂直于电路板本体100的方向上，屏蔽膜组件200覆盖第二器件。应理解的是，为了确保屏蔽膜组件200的屏蔽效果，避让区230的范围大小需要进行限制，因此在电路板组件中存在被屏蔽膜组件200完全覆盖的第二器件。
在本发明实施例中，未对避让区230的具体形状做出限制，为了适应电子器件自身的外形，避让区230可选为正方形避让区或者矩形避让区，当然，避让区230还可以为其它形状，例如圆形、不规则形状等。
基于前述的电路板组件，本发明实施例还公开一种电子设备，其包括如前述的电路板组件。本发明实施例所指的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴装置等设备，本发明实施例不限制电子设备的具体种类。
本发明上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本发明的实施例而已，并不用于限制本发明。对于本领域技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本发明的权利要求范围之内。

Claims (10)

  1. 一种电路板组件，包括电路板本体(100)、电子器件和屏蔽膜组件(200)，所述电子器件设置于所述电路板本体(100)的表面，所述屏蔽膜组件(200)罩设于所述电子器件；其中，所述电路板本体(100)具有第一接地区(110)，所述屏蔽膜组件(200)包括依次层叠设置的屏蔽层(210)和绝缘层(220)，所述绝缘层(220)位于所述屏蔽层(210)与所述电子器件之间，所述屏蔽层(210)的边缘与所述第一接地区(110)电连接；
    所述屏蔽膜组件(200)开设有避让区(230)，所述电子器件包括第一器件(300)，所述第一器件(300)包括器件本体(310)和接地端子(320)，在所述避让区(230)内，所述屏蔽层(210)贯穿所述绝缘层(220)，且与所述接地端子(320)电连接。
  2. 根据权利要求1所述的电路板组件，其中，在垂直于所述电路板本体(100)的方向上，所述避让区(230)至少部分覆盖所述接地端子(320)。
  3. 根据权利要求1所述的电路板组件，其中，所述电路板本体(100)具有第二接地区(120)，所述屏蔽层(210)通过所述接地端子(320)与所述第二接地区(120)电连接。
  4. 根据权利要求3所述的电路板组件，其中，所述第二接地区(120)为接地焊盘区。
  5. 根据权利要求1所述的电路板组件，其中，所述接地端子(320)靠近所述屏蔽膜组件(200)的一侧设置有电连接件(321)，所述电连接件(321)至少部分凸出于所述器件本体(310)，所述屏蔽层(210)通过所述电连接件(321)与所述接地端子(320)电连接。
  6. 根据权利要求1所述的电路板组件，其中，所述电子器件包括多个第一器件，在垂直于所述电路板本体(100)的方向上，每个所述第一器件(300)的接地端子(320)至少部分被所述避让区(230)覆盖，且每个所述第一器件(300)的接地端子(320)与所述屏蔽层(210)电连接。
  7. 根据权利要求1所述的电路板组件，其中，所述电子器件还包括第二器件，在垂直于所述电路板本体(100)的方向上，所述屏蔽膜组件(200)覆盖所述第二器件。
  8. 根据权利要求1所述的电路板组件，其中，所述避让区(230)为正方形避让区或矩形避让区。
  9. 根据权利要求1所述的电路板组件，其中，所述屏蔽层(210)具有延伸部(240)，在所述避让区(230)内，所述延伸部(240)贯穿所述绝缘层(220)，且与所述接地端子(320)电连接。
  10. 一种电子设备，包括如前述权利要求1至9中任一项所述的电路板组件。
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