WO2021200786A1 - 粘着シート - Google Patents

粘着シート Download PDF

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Publication number
WO2021200786A1
WO2021200786A1 PCT/JP2021/013190 JP2021013190W WO2021200786A1 WO 2021200786 A1 WO2021200786 A1 WO 2021200786A1 JP 2021013190 W JP2021013190 W JP 2021013190W WO 2021200786 A1 WO2021200786 A1 WO 2021200786A1
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WO
WIPO (PCT)
Prior art keywords
mpa
elongation
base material
tensile stress
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/013190
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
遼 佐々木
智史 川田
有紀 河原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to KR1020227017625A priority Critical patent/KR20220158677A/ko
Priority to JP2022512187A priority patent/JP7755572B2/ja
Priority to CN202180007680.8A priority patent/CN114867804B/zh
Publication of WO2021200786A1 publication Critical patent/WO2021200786A1/ja
Anticipated expiration legal-status Critical
Priority to JP2025167222A priority patent/JP2025182039A/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/199—Acids or hydroxy compounds containing cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to an adhesive sheet that can be suitably used as a work processing sheet used for processing a work such as a semiconductor wafer.
  • Semiconductor wafers such as silicon and gallium arsenide and various packages are manufactured in a large diameter state, cut (diced) into chips, peeled (picked up), and then moved to the next step, the mounting process.
  • a work such as a semiconductor wafer is back grinded, diced, washed, and dried while being attached to an adhesive sheet having a base material and an adhesive layer (hereinafter, may be referred to as a “work processing sheet”). , Expanding, picking up, mounting, etc. are performed.
  • dicing blade As one of the above-mentioned dicing methods, there is a method of cutting a work with a rotating round blade (dicing blade). In this method, in order to ensure that the work is cut, it is common to partially cut the work processing sheet to which the work is attached together with the work. When the work processing sheet is cut together with the work in this way, cutting chips made of the adhesive layer and the material constituting the base material may be generated from the work processing sheet.
  • Patent Document 1 discloses an invention in which a polyolefin-based film irradiated with an electron beam or a ⁇ (gamma) ray of 1 to 80 Mrad is used as a base film for a dicing sheet. Has been done.
  • a polyolefin-based film irradiated with an electron beam or a ⁇ (gamma) ray of 1 to 80 Mrad is used as a base film for a dicing sheet.
  • the semiconductor chips may be individually pushed up from the surface of the workpiece processing sheet opposite to the surface on which the semiconductor chips are laminated.
  • the work processing sheet is stretched (expanded) to separate the semiconductor chips from each other. Therefore, the work processing sheet is required to have excellent flexibility that enables good expansion.
  • Patent Document 1 the conventional dicing sheet as disclosed in Patent Document 1 does not have sufficient expandability.
  • the present invention has been made in view of such an actual situation, and an object of the present invention is to provide an adhesive sheet having good expandability.
  • the present invention is a pressure-sensitive adhesive sheet including a base material and a pressure-sensitive adhesive layer laminated on one side of the base material, wherein the base material contains a chlorine atom.
  • the angle between the reference direction and the plan view is 0 °, 10 °, 20 °, 30 °, 40 °, 50 °, 60 °, with any one direction in the plan view of the base material as the reference direction.
  • the tensile stresses up to 100% elongation are all within the range of 8 MPa or more and 30 MPa or less, and for the substrate, all the tensile stresses from 100% elongation to 200% elongation in the first measurement direction are all.
  • an adhesive sheet characterized by being within the range of 10 MPa or more and 40 MPa or less (Invention 1).
  • the pressure-sensitive adhesive sheet according to the above invention (Invention 1) has excellent flexibility when the base material satisfies the above-mentioned tensile stress conditions, and can be expanded well.
  • the amount of increase in tensile stress obtained by subtracting the tensile stress at 100% elongation from the tensile stress at 200% elongation in the first measurement direction for the base material is 1 MPa or more. , 20 MPa or less is preferable (Invention 2).
  • the second measurement direction when the direction formed by the angle between the first measurement direction and the first measurement direction is 90 °, which is one direction in the plan view of the base material, is defined as the second measurement direction.
  • the tensile stress from 10% elongation to 100% elongation in the second measurement direction is all within the range of 5 MPa or more and 30 MPa or less, and for the base material, the second measurement direction. It is preferable that the tensile stresses from 100% elongation to 200% elongation are all within the range of 10 MPa or more and 40 MPa or less (Invention 3).
  • the amount of increase in tensile stress obtained by subtracting the tensile stress at 100% elongation from the tensile stress at 200% elongation in the second measurement direction of the base material is 1 MPa or more. , 20 MPa or less is preferable (Invention 4).
  • the tensile elastic modulus of the base material in the first measurement direction is preferably 100 MPa or more and 1000 MPa or less (Invention 5).
  • the elongation at break of the base material in the first measurement direction is preferably 100% or more and 1000% or less (Invention 6).
  • the result measured when the tensile test of the base material is performed in the first measurement direction is the tensile stress (unit:%) with the tensile elongation (unit:%) as the horizontal axis.
  • the curve obtained by plotting on the coordinate plane with the unit: MPa) as the vertical axis there is no maximum point in the curve, or there are maximum points and minimum points in the curve.
  • the tensile stress value at the point where at least one is present and the maximum tensile elongation value is the minimum, and the tensile elongation value is the minimum among the minimum points.
  • the absolute value of the difference from the tensile stress value at that point is preferably 2.0 MPa or less (Invention 7).
  • the base material does not contain a halogen atom (Invention 8).
  • the work processing sheet is preferably a dicing sheet (Invention 10).
  • the adhesive sheet according to the present invention has good expandability.
  • the pressure-sensitive adhesive sheet according to the present embodiment includes a base material and a pressure-sensitive adhesive layer laminated on one side of the base material.
  • the adhesive sheet can be used for various purposes like a general adhesive sheet, it is particularly preferable to use it as a work processing sheet used for processing a work such as a semiconductor wafer. Is.
  • the adhesive sheet according to the present embodiment is preferably used as a sheet for picking up a work such as a semiconductor chip.
  • the base material in this embodiment does not contain chlorine atoms. By not containing chlorine atoms, the adhesive sheet according to the present embodiment can easily reduce the environmental load.
  • the term "chlorine atom-free" as used herein also includes the fact that chlorine atoms are not substantially contained. That is, the base material in the present embodiment may be, for example, one in which a component containing a chlorine atom is unintentionally mixed in a very small amount in the manufacturing process. In that case, the content of chlorine atoms in the base material may be 0.005% by mass or less, particularly 0.003% by mass or less, and further 0.0001% by mass or less. May be good.
  • the base material in the present embodiment has a tensile stress from 10% elongation to 100% elongation in the first measurement direction when a predetermined direction in the plan view is set as the first measurement direction. All are within the range of 8 MPa or more and 30 MPa or less, and the tensile stress from 100% elongation to 200% elongation in the first measurement direction is all within the range of 10 MPa or more and 40 MPa or less.
  • the adhesive sheet according to the present embodiment has extremely excellent flexibility when the base material satisfies these conditions. Therefore, the adhesive sheet according to the present embodiment can be expanded well when used for processing a work. Along with this, in the subsequent pickup process, it becomes easier to push up the chip from the back surface, and good pickup becomes possible.
  • the above-mentioned first measurement direction is simply the direction of tension in which the increase in tensile stress from 100% elongation to 200% elongation is the smallest when the tensile test of the base material is performed. Point to. More specifically, with an arbitrary direction in the plan view of the base material as a reference direction, the angles formed between the reference direction and the plan view are 0 °, 10 °, 20 °, 30 °, 40 °, 50 °, 60.
  • the direction in which the amount of increase in tensile stress obtained by subtracting the tensile stress at 100% elongation from the stress is the smallest is the first measurement direction.
  • the direction perpendicular to the flow direction (TD direction) at the time of its manufacture usually coincides with the first measurement direction.
  • the lower limit of the above-mentioned range in which the tensile stress from 10% elongation to 100% elongation is contained is preferably 9 MPa or more, and particularly 10 MPa or more. Is preferable.
  • the upper limit of the range is preferably 25 MPa or less, particularly preferably 20 MPa or less, and further preferably 15 MPa or less.
  • the lower limit of the above-mentioned range in which the tensile stress from 100% elongation to 200% elongation is contained is preferably 11 MPa or more, and particularly preferably 12 MPa or more.
  • the upper limit of the range is preferably 30 MPa or less, and particularly preferably 20 MPa or less.
  • the base material in the present embodiment has an increase in tensile stress obtained by subtracting the tensile stress at 100% elongation from the tensile stress at 200% elongation in the first measurement direction. It is preferably 1 MPa or more, particularly 1.5 MPa or more, and further preferably 1.8 MPa or more.
  • the amount of increase is preferably 20 MPa or less, more preferably 15 MPa or less, particularly preferably 10 MPa or less, and further preferably 5 MPa or less.
  • the amount of increase is 1 MPa or more, when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, it becomes difficult for stress to concentrate on a part of the base material, and it becomes easy to effectively suppress the breakage of the base material.
  • the amount of increase is 20 MPa or less
  • the base material is likely to be uniformly stretched when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, and the chips are easily separated from each other. Therefore, by satisfying the above-mentioned increase amount, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability.
  • the base material in the present embodiment has an increase in tensile stress of 0.5 MPa or more obtained by subtracting the tensile stress at 10% elongation from the tensile stress at 200% elongation in the first measurement direction. It is preferably 1 MPa or more, more preferably 1.5 MPa or more, and further preferably 2 MPa or more.
  • the amount of increase is preferably 25 MPa or less, particularly preferably 15 MPa or less, and further preferably 5 MPa or less. When the amount of increase is 0.5 MPa or more, stress is less likely to be concentrated on a part of the base material when expanding the pressure-sensitive adhesive sheet according to the present embodiment, and it is easy to effectively suppress breakage of the base material. Become.
  • the amount of increase is 25 MPa or less
  • the base material is likely to be uniformly stretched when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, and the chips are easily separated from each other. Therefore, by satisfying the above-mentioned increase amount, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability.
  • the ratio of the tensile stress at 200% elongation to the tensile stress at 100% elongation in the first measurement direction is preferably 0.5 or more, particularly 0.75. It is preferably 1 or more, and more preferably 1 or more. The ratio is preferably 3 or less, more preferably 2.5 or less, particularly preferably 2 or less, and further preferably 1.5 or less. When the above ratio is 0.5 or more, when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, it becomes difficult for stress to concentrate on a part of the base material, and it becomes easy to effectively suppress the breakage of the base material. ..
  • the ratio is 3 or less, when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, the base material is likely to be uniformly stretched, and the chips are easily separated from each other. Therefore, by satisfying the above-mentioned ratio, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability.
  • the base material in the present embodiment preferably has a tensile elastic modulus of 100 MPa or more in the first measurement direction, particularly preferably 200 MPa or more, and further preferably 300 MPa or more.
  • the tensile elastic modulus is preferably 1000 MPa or less, particularly preferably 800 MPa or less, and further preferably 600 MPa or less.
  • the base material in the present embodiment tends to have appropriate strength, the pressure-sensitive adhesive sheet has good handleability, and the desired work processing can be performed satisfactorily. It will be easier to do.
  • the pressure-sensitive adhesive sheet according to the present embodiment when expanding the pressure-sensitive adhesive sheet according to the present embodiment, it becomes difficult for stress to concentrate on a part of the base material, and it becomes easy to effectively suppress the breakage of the base material. Further, when the tensile elastic modulus is 1000 MPa or less, when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, the base material can be easily stretched uniformly, and the chips can be easily separated from each other. Therefore, when the tensile elastic modulus in the first measurement direction of the base material is within the above-mentioned upper limit value and lower limit value, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability. The details of the method for measuring the tensile elastic modulus are as described in Test Examples described later.
  • the base material in the present embodiment preferably has a breaking elongation in the first measurement direction of 100% or more, particularly preferably 200% or more, and further preferably 300% or more. ..
  • the elongation at break is preferably 1000% or less, particularly preferably 800% or less, and further preferably 600% or less.
  • the breaking elongation is 100% or more
  • the base material in the present embodiment tends to have the desired extensibility, and the adhesive sheet according to the present embodiment realizes excellent expandability and pick-up property. It will be easy.
  • the breaking elongation is 1000% or less, the processability of the base material becomes more excellent, and it becomes easy to manufacture a desired pressure-sensitive adhesive sheet.
  • the details of the method for measuring the elongation at break are as described in Test Examples described later.
  • the result measured when the tensile test of the front base material is performed in the first measurement direction is obtained by using the tensile elongation (unit:%) as the horizontal axis and the tensile stress (unit:%).
  • (Condition 1) There is no maximum point (hereinafter, may be referred to as "maximum point”) in the curve.
  • Consdition 2 There is at least one maximum point and one minimum point (hereinafter, may be referred to as "minimum point") in the curve, and the value of tensile elongation among the maximum points.
  • the absolute value of the difference between the tensile stress value at the point where is the minimum and the tensile stress value at the point where the tensile elongation value is the minimum among the minimum points is 2.0 MPa or less.
  • the tensile elongation (unit:%) was the horizontal axis, the tensile stress (unit: MPa) and the coordinate in the plane having a longitudinal axis, a state in which the curve C 1 and curve C 2 is present shows Has been done.
  • the curve C 1 is an example in the case where the above-mentioned condition 1 is satisfied.
  • the curve C 1 when gradually increasing the tensile elongation 0%, also increasing tensile stress along therewith (but is less likely to increase as it approaches the value to a predetermined tensile stress). Therefore, the curve C 1, that the tensile stress starts to decrease from increase, i.e. there is no maximum point.
  • the curve C 2 is an example when the condition 2 is satisfied.
  • the curve C 2 when having an increased tensile elongation 0%, first to the position of the point A, the tensile stress is increased. Then, at the point A as a boundary, the tensile stress starts to decrease. That is, the curve C 2 has a maximum point as the point A. After passing the point A and further increasing the tensile elongation, the tensile stress changes from decreasing to increasing at the point B, and then continues to increase. That is, the curve C 2 has a minimum point as the point B.
  • the absolute value of the difference between the tensile stress values of the points A and B (the value indicated by “ ⁇ ” in FIG. 1) is 2.0 MPa or less, so that the curve C 2 satisfies the condition 2. It will meet.
  • the condition 2 may be satisfied. .. In that case, from among the plurality of maximum points and minimum points, the maximum point at which the tensile elongation value is the minimum and the minimum point at which the tensile elongation value is the minimum are selected, and the absolute value of the difference between them is selected. Whether or not the condition 2 is satisfied is determined depending on whether or not is 2.0 MPa or less.
  • the pressure-sensitive adhesive sheet according to the present embodiment tends to have excellent expandability.
  • the difference ( ⁇ ) of the absolute values under the condition 2 is preferably 1.8 MPa or less, more preferably 1.6 MPa or less, particularly preferably 1.5 MPa or less, and further. It is preferably 1.3 MPa or less, and most preferably 1.0 MPa or less.
  • the lower limit of the difference ( ⁇ ) between the absolute values described above is not particularly limited and may be, for example, more than 0. The details of the measurement method of whether or not the above-mentioned conditions 1 and 2 are satisfied are as described in the test examples described later.
  • the base material in the present embodiment is said to be the second measurement direction when the direction formed by the angle formed with the first measurement direction described above is 90 °, which is one direction in the plan view of the base material.
  • the tensile stress from 10% elongation to 100% elongation in the second measurement direction is all within the range of 5 MPa or more and 30 MPa or less, and 200% elongation from 100% elongation in the second measurement direction. It is preferable that the tensile stress up to the time is all within the range of 10 MPa or more and 40 MPa or less.
  • the lower limit of the range in which the tensile stress from 10% elongation to 100% elongation, which is related to the second measurement direction, is contained is particularly 7. It is preferably 5 MPa or more, and more preferably 10 MPa or more.
  • the upper limit of the range is particularly preferably 25 MPa or less, and more preferably 20 MPa or less.
  • the lower limit of the range in which the tensile stress from 100% elongation to 200% elongation is contained in the second measurement direction described above is particularly preferably 11 MPa or more, and further. It is preferably 12 MPa or more.
  • the upper limit of the range is particularly preferably 35 MPa or less, and more preferably 30 MPa or less.
  • the base material in the present embodiment has an increase in tensile stress of 1 MPa or more obtained by subtracting the tensile stress at 100% elongation from the tensile stress at 200% elongation in the second measurement direction. It is preferable, particularly preferably 2 MPa or more, and further preferably 3 MPa or more.
  • the amount of increase is preferably 20 MPa or less, particularly preferably 15 MPa or less, and further preferably 10 MPa or less.
  • the amount of increase is 1 MPa or more, when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, it becomes difficult for stress to concentrate on a part of the base material, and it becomes easy to effectively suppress the breakage of the base material.
  • the amount of increase is 20 MPa or less
  • the base material is likely to be uniformly stretched when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, and the chips are easily separated from each other. Therefore, by satisfying the above-mentioned increase amount, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability.
  • the base material in the present embodiment has an increase in tensile stress of 1 MPa or more obtained by subtracting the tensile stress at 10% elongation from the tensile stress at 200% elongation in the second measurement direction. It is preferably 2 MPa or more, more preferably 3 MPa or more, and further preferably 4 MPa or more.
  • the amount of increase is preferably 30 MPa or less, particularly preferably 25 MPa or less, and further preferably 20 MPa or less.
  • the amount of increase is 30 MPa or less
  • the base material is likely to be uniformly stretched when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, and the chips are easily separated from each other. Therefore, by satisfying the above-mentioned increase amount, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability.
  • the base material in the present embodiment has an increase in tensile stress of 0.5 MPa or more obtained by subtracting the tensile stress at 50% elongation from the tensile stress at 150% elongation in the second measurement direction. It is preferably 1 MPa or more, more preferably 1.5 MPa or more, and further preferably 2 MPa or more.
  • the amount of increase is preferably 20 MPa or less, particularly preferably 15 MPa or less, and further preferably 10 MPa or less. When the amount of increase is 0.5 MPa or more, stress is less likely to be concentrated on a part of the base material when expanding the pressure-sensitive adhesive sheet according to the present embodiment, and it is easy to effectively suppress breakage of the base material. Become.
  • the amount of increase is 20 MPa or less
  • the base material is likely to be uniformly stretched when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, and the chips are easily separated from each other. Therefore, by satisfying the above-mentioned increase amount, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability.
  • the base material in the present embodiment has an increase in tensile stress of 2 MPa or more obtained by subtracting the tensile stress at 50% elongation from the tensile stress at 250% elongation in the second measurement direction. It is preferable, in particular, it is preferably 4 MPa or more, further preferably 5 MPa or more, and even more preferably 6 MPa or more.
  • the amount of increase is preferably 30 MPa or less, particularly preferably 25 MPa or less, and further preferably 20 MPa or less. When the amount of increase is 2 MPa or more, when expanding the pressure-sensitive adhesive sheet according to the present embodiment, it becomes difficult for stress to concentrate on a part of the base material, and it becomes easy to effectively suppress the breakage of the base material.
  • the amount of increase is 30 MPa or less
  • the base material is likely to be uniformly stretched when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, and the chips are easily separated from each other. Therefore, by satisfying the above-mentioned increase amount, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability.
  • the base material in the present embodiment preferably has a tensile elastic modulus of 100 MPa or more in the second measurement direction, particularly preferably 200 MPa or more, and further preferably 300 MPa or more.
  • the tensile elastic modulus is preferably 1000 MPa or less, particularly preferably 800 MPa or less, and further preferably 600 MPa or less.
  • the base material in the present embodiment tends to have appropriate strength, the pressure-sensitive adhesive sheet has good handleability, and the desired work processing can be performed satisfactorily. It will be easier to do.
  • the pressure-sensitive adhesive sheet according to the present embodiment when expanding the pressure-sensitive adhesive sheet according to the present embodiment, it becomes difficult for stress to concentrate on a part of the base material, and it becomes easy to effectively suppress the breakage of the base material. Further, when the tensile elastic modulus is 1000 MPa or less, when the pressure-sensitive adhesive sheet according to the present embodiment is expanded, the base material can be easily stretched uniformly, and the chips can be easily separated from each other. Therefore, when the tensile elastic modulus in the second measurement direction of the base material is within the above-mentioned upper limit value and lower limit value, the pressure-sensitive adhesive sheet according to the present embodiment has more excellent expandability. The details of the method for measuring the tensile elastic modulus are as described in Test Examples described later.
  • the base material in the present embodiment contains substantially no chlorine atom, and has tensile stress from 10% elongation to 100% elongation and 100% elongation to 200% elongation.
  • the composition is not limited as long as the above-mentioned physical properties relating to the tensile stress up to are satisfied.
  • the base material in the present embodiment is a resin film mainly made of a resin-based material. It is preferable to have.
  • Examples of the above resins include polyolefin-based resins such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, ethylene-norbornene copolymers and norbornene resins; polyester resins such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate; ethylene.
  • polyolefin-based resins such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, ethylene-norbornene copolymers and norbornene resins
  • polyester resins such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate
  • ethylene polyolefin-based resins
  • -Vinyl acetate copolymer ethylene-based copolymer such as ethylene- (meth) acrylic acid copolymer, ethylene- (meth) methyl acrylate copolymer, and other ethylene- (meth) acrylic acid ester copolymer; Examples thereof include (meth) acrylic acid ester copolymer; polyurethane; polyimide; polystyrene; polycarbonate; fluororesin. Further, it may be a modified resin such as a crosslinked resin of these resins or an ionomer resin.
  • (meth) acrylic acid” in this specification means both acrylic acid and methacrylic acid. The same applies to other similar terms.
  • polymer in the present specification also includes the concept of "copolymer”.
  • the base material in the present embodiment may be a laminated film in which a plurality of the above-mentioned resin films are laminated.
  • the materials constituting each layer may be the same type or different types.
  • the main material resin fluororesin, polyurethane or polyester resin
  • the main material resin is preferably contained in an amount of 50% by mass or more, and more preferably 60% by mass or more. It is preferable that it is contained in an amount of 70% by mass or more, and more preferably 80% by mass or more.
  • fluororesins examples include polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene (ETFE), tetrafluoroethylene / hexafluoroethylene (FEP), perfluoroalkoxy alkane (PFA), polyvinylidene fluoride (PVdF), and the like. Can be mentioned. Among these, polytetrafluoroethylene (PTFE) is particularly preferable.
  • polyurethane examples include polyurethane elastomers, and among them, thermoplastic polyurethane elastomers (TPUs) are preferably mentioned.
  • TPUs thermoplastic polyurethane elastomers
  • thermoplastic polyurethane elastomer is generally obtained by reacting a long-chain polyol, a chain extender, and a polyisocyanate, and is obtained from a reaction between a chain extender and a polyisocyanate with a soft segment having a constituent unit derived from the long-chain polyol. It consists of a hard segment having a polyurethane structure.
  • thermoplastic polyurethane elastomer is classified into polyester-based polyurethane elastomer, polyether-based polyurethane elastomer, polycarbonate-based polyurethane elastomer, and the like when classified according to the type of long-chain polyol used as its soft segment component.
  • the polyether polyurethane elastomer is preferably used as the base material in the present embodiment.
  • long-chain polyol examples include polyester polyols such as lactone-based polyester polyols and adipate-based polyester polyols; polyether polyols such as polypropylene (ethylene) polyols and polytetramethylene ether glycols; and polycarbonate polyols.
  • polyester polyols such as lactone-based polyester polyols and adipate-based polyester polyols
  • polyether polyols such as polypropylene (ethylene) polyols and polytetramethylene ether glycols
  • polycarbonate polyols examples of the long-chain polyol.
  • polyether polyols are preferably used, and their number average molecular weight is usually 600 to 5000.
  • polyisocyanate examples include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate (pure MDI), hexamethylene diisocyanate and the like. Of these, pure MDI is preferably used.
  • chain extender examples include low molecular weight polyhydric alcohols such as 1,4-butanediol and 1,6-hexanediol, and aromatic diamines.
  • polyester resin examples include those having an alicyclic structure in addition to those described above.
  • the alicyclic structure of the polyester resin has 6 or more carbon atoms constituting the ring. It is preferable to have.
  • the carbon number is preferably 14 or less, and particularly preferably 10 or less. In particular, the number of carbon atoms is preferably 6.
  • the alicyclic structure may be a monocyclic type composed of one ring, a bicyclic type composed of two rings, or a structure composed of three or more rings.
  • the polyester resin preferably contains a dicarboxylic acid having an alicyclic structure as a monomer unit constituting the polyester resin. .. From the same viewpoint, the polyester resin preferably contains a diol having an alicyclic structure as a monomer unit constituting the polyester resin. Although only one of such dicarboxylic acids and diols may be contained in the polyester resin, the polyester resin is a dicarboxylic acid and diol from the viewpoint of facilitating better flexibility. It is preferable to include both.
  • the structure of the dicarboxylic acid described above is not particularly limited as long as it has an alicyclic structure and two carboxy groups.
  • the dicarboxylic acid may have a structure in which two carboxy groups are bonded to the alicyclic structure, and an alkyl group or the like is further inserted between the alicyclic structure and the carboxy group. It may be.
  • Preferred examples of such a dicarboxylic acid are 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,4-decahydronaphthalenedicarboxylic acid, and 1,5-deca.
  • Examples thereof include hydronaphthalenedicarboxylic acid, 2,6-decahydronaphthalenedicarboxylic acid and 2,7-decahydronaphthalenedicarboxylic acid, and among these, 1,4-cyclohexanedicarboxylic acid is preferably used.
  • These dicarboxylic acids may be derivatives such as alkyl esters.
  • Such an alkyl ester derivative may be, for example, an alkyl ester having 1 or more and 10 or less carbon atoms. More specific examples include dimethyl ester, diethyl ester and the like, and dimethyl ester is particularly preferable.
  • the structure of the diol described above is not particularly limited as long as it has an alicyclic structure and two hydroxy groups.
  • the diol may have a structure in which two hydroxy groups are bonded to the alicyclic structure, and an alkyl group is further inserted between the alicyclic structure and the hydroxy group. You may.
  • Preferred examples of such diols are 1,2-cyclohexanedimethanol (particularly 1,2-cyclohexanedimethanol), 1,3-cyclohexanedimethanol (particularly 1,3-cyclohexanedimethanol), and 1,4-cyclohexanedimethanol. (Especially 1,4-cyclohexanedimethanol), 2,2-bis- (4-hydroxycyclohexyl) -propane and the like can be mentioned, and among these, 1,4-cyclohexanedimethanol is preferably used.
  • the polyester resin is obtained by dimerizing an unsaturated fatty acid as a monomer unit constituting the polyester resin from the viewpoint that the base material tends to have desired flexibility and more excellent expandability can be easily achieved. It is also preferable to contain dimer acid.
  • the number of carbon atoms of the unsaturated fatty acid is preferably 10 or more, and particularly preferably 15 or more.
  • the number of carbon atoms is preferably 30 or less, and particularly preferably 25 or less.
  • dimer acids include unsaturated fatty acids having 22 carbon atoms such as dicarboxylic acid having 36 carbon atoms and erucic acid obtained by dimerizing unsaturated fatty acids having 18 carbon atoms such as oleic acid and linoleic acid.
  • Examples thereof include a dicarboxylic acid having 44 carbon atoms obtained by dimerization.
  • a small amount of trimer acid obtained by quantifying the above-mentioned unsaturated fatty acid may also be generated.
  • the polyester resin may contain such a trimer acid together with the dimer acid.
  • the polyester resin may contain a monomer other than the above-mentioned dicarboxylic acid, diol and dimer acid as a monomer unit constituting the polyester resin.
  • monomers are aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, pimelli acid, suberic acid, azelaic acid, sebacic acid; phthalic acid, terephthalic acid, isophthalic acid, 2,6-naphthalene.
  • aromatic dicarboxylic acids such as dicarboxylic acid, 1,4-naphthalenedicarboxylic acid and 4,4'-diphenyldicarboxylic acid.
  • a diol component other than the diol having an alicyclic structure may be contained.
  • ethylene glycol, propylene glycol, butanediol, hexanediol, octanediol, decanediol; ethylene oxide adducts such as bisphenol A and bisphenol S; trimethylol propane and the like may be contained.
  • the heat of fusion measured at a heating rate of 20 ° C./min by differential scanning calorimetry is preferably 2 J / g or more, more preferably 5 J / g or more, and particularly 10 J. It is preferably / g or more, and more preferably 15 J / g or more.
  • the heat of fusion is preferably 150 J / g or less, more preferably 100 J / g or less, particularly preferably 70 J / g or less, and further preferably 50 J / g or less. In particular, it is preferably 30 J / g or less.
  • the amount of heat of melting is 150 J / g or less, the base material according to the present embodiment tends to have more excellent flexibility.
  • the heat of fusion can be measured using a differential scanning calorimeter (for example, DSC, manufactured by TA Instruments, product name "DSC Q2000”) according to JIS K 7121: 2012.
  • DSC differential scanning calorimeter
  • the above-mentioned film containing a polyester resin as a main material preferably contains an elastomer together with the polyester resin from the viewpoint of easily achieving desired tensile physical characteristics.
  • the elastomer is not particularly limited, and may be a thermosetting elastomer or a thermoplastic elastomer, but from the viewpoint that the base material in the present embodiment tends to have better flexibility, heat is used. It is preferably a plastic elastomer.
  • thermoplastic elastomer is not particularly limited, and for example, a styrene-based elastomer, an olefin-based elastomer, a polyester-based elastomer, a silicone-based elastomer, or the like can be used. These may be used alone or in combination of two or more.
  • a styrene-based elastomer it is preferable to use a styrene-based elastomer from the viewpoint of easily having more excellent flexibility.
  • styrene-based elastomer examples include a styrene-conjugated diene copolymer and a styrene-olefin copolymer.
  • Specific examples of the styrene / conjugated diene copolymer include a styrene / butadiene copolymer, a styrene / butadiene / styrene copolymer (SBS), a styrene / butadiene / butylene / styrene copolymer, and a styrene / isoprene copolymer.
  • Unhydrogenated styrene / conjugated diene copolymer such as styrene / isoprene / styrene copolymer (SIS), styrene / ethylene / isoprene / styrene copolymer; styrene / ethylene / propylene / styrene copolymer (SEPS), styrene •
  • SEPS styrene •
  • hydrogenated styrene / conjugated diene copolymers such as ethylene / butylene / styrene copolymer (SEBS). These may be used alone or in combination of two or more.
  • styrene-based elastomers a styrene-conjugated diene copolymer is preferable, and a hydrogenated styrene-conjugated diene copolymer is preferable, and further, styrene-ethylene / It is preferable to use a butylene / styrene copolymer.
  • the base material in the present embodiment does not contain a halogen atom from the viewpoint that the environmental load can be further reduced.
  • the halogen atom include a fluorine atom, a bromine atom, an iodine atom and the like in addition to the chlorine atom described above.
  • the term "halogen-free" here may mean that the halogen atom is not substantially contained, as in the case of the chlorine atom described above. In that case, the content of the halogen atom in the base material may be 0.005% by mass or less, particularly 0.003% by mass or less, and further 0.0001% by mass or less. May be good.
  • Additives such as flame retardants, plasticizers, lubricants, antioxidants, colorants, infrared absorbers, ultraviolet absorbers, and ion scavengers may be added to the base material in the present embodiment.
  • the content of these additives is not particularly limited, but is preferably in the range in which the base material exhibits a desired function.
  • the layer structure of the base material in the present embodiment may be a single layer or a plurality of layers. Further, the surface of the base material on which the pressure-sensitive adhesive layer is laminated may be subjected to surface treatment such as primer treatment, corona treatment, and plasma treatment in order to improve the adhesion to the pressure-sensitive adhesive layer.
  • the method for producing a base material in the present embodiment is not particularly limited, and for example, a melt extrusion method such as a T-die method or a round die method; a calendar method; a dry method, a wet method, or the like. A solution method or the like can be used. Among these, it is preferable to adopt the melt extrusion method or the calendar method from the viewpoint of efficiently producing the base material.
  • a single-layer base material is produced by a melt extrusion method
  • the material of the base material is kneaded, and pellets are produced directly from the obtained kneaded product or once pellets are produced, and then a film is formed using a known extruder. good.
  • a substrate composed of a plurality of layers is produced by a melt extrusion method
  • the components constituting each layer are kneaded, and pellets are produced directly from the obtained kneaded product or once pellets are produced, and then a known extruder is used.
  • a plurality of layers may be extruded at the same time to form a film.
  • the thickness of the base material in the present embodiment is preferably 20 ⁇ m or more, particularly preferably 40 ⁇ m or more, and further preferably 60 ⁇ m or more.
  • the thickness of the base material is preferably 600 ⁇ m or less, particularly preferably 300 ⁇ m or less, and further preferably 200 ⁇ m or less.
  • the pressure-sensitive adhesive sheet tends to have appropriate strength, and the work fixed on the pressure-sensitive adhesive sheet can be easily supported. As a result, it is possible to effectively suppress the occurrence of chipping during dicing.
  • the thickness of the base material is 600 ⁇ m or less, it becomes easy to satisfy the above-mentioned physical properties regarding the tensile stress from the elongation to the 100% elongation and the tensile stress from the 100% elongation to the 200% elongation. .. Further, when the thickness of the base film is 600 ⁇ m or less, the base film has better processability.
  • Adhesive Layer As the adhesive constituting the adhesive layer in the present embodiment, sufficient adhesive strength to the adherend (particularly, adhesive strength to the work that is sufficient for processing the work) is provided. As long as it can be exerted, it is not particularly limited.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer include acrylic pressure-sensitive adhesive, rubber-based pressure-sensitive adhesive, silicone-based pressure-sensitive adhesive, urethane-based pressure-sensitive adhesive, polyester-based pressure-sensitive adhesive, polyvinyl ether-based pressure-sensitive adhesive, and the like. Among these, it is preferable to use an acrylic pressure-sensitive adhesive from the viewpoint of easily exerting a desired adhesive strength.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer in the present embodiment may be a pressure-sensitive adhesive having no active energy ray-curable property, a pressure-sensitive adhesive having active energy ray-curable property (hereinafter, "active energy ray-curable pressure-sensitive adhesive”). It may be referred to as "agent"). Since the pressure-sensitive adhesive layer is composed of an active energy ray-curable pressure-sensitive adhesive, the pressure-sensitive adhesive layer can be cured by irradiation with active energy rays, and the adhesive force of the pressure-sensitive adhesive sheet to the adherend can be easily reduced. .. In particular, when the adhesive sheet according to the present embodiment is used as a work processing sheet, the processed work can be easily separated from the adhesive sheet by irradiation with active energy rays.
  • the active energy ray-curable pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer may be mainly composed of a polymer having active energy ray-curable property, or an active energy ray-curable polymer (active energy ray-curable).
  • the main component may be a mixture of a monomer having at least one active energy ray-curable group and / or an oligomer.
  • the polymer having active energy ray curability is a (meth) acrylic acid ester polymer in which a functional group having active energy ray curability (active energy ray curable group) is introduced into the side chain (hereinafter, "active energy ray curable”). It may be referred to as “polymer”).
  • This active energy ray-curable polymer is obtained by reacting an acrylic copolymer having a functional group-containing monomer unit with an unsaturated group-containing compound having a functional group bonded to the functional group. Is preferable.
  • (meth) acrylic acid means both acrylic acid and methacrylic acid. The same applies to other similar terms.
  • the concept of "polymer” shall also be included in “polymer”.
  • the weight average molecular weight of the active energy ray-curable polymer is preferably 10,000 or more, particularly preferably 150,000 or more, and further preferably 200,000 or more.
  • the weight average molecular weight is preferably 2.5 million or less, particularly preferably 2 million or less, and further preferably 1.5 million or less.
  • the weight average molecular weight (Mw) in the present specification is a standard polystyrene-equivalent value measured by a gel permeation chromatography method (GPC method).
  • the active energy ray-curable pressure-sensitive adhesive contains a mixture of an active energy ray-curable polymer component and a monomer and / or an oligomer having at least one active energy ray-curable group as a main component
  • the activity is concerned.
  • the energy ray non-curable polymer component for example, the acrylic copolymer before the reaction of the unsaturated group-containing compound can be used.
  • the active energy ray-curable monomer and / or oligomer for example, an ester of a polyhydric alcohol and (meth) acrylic acid can be used.
  • the weight average molecular weight of the acrylic polymer as the active energy ray non-curable polymer component is preferably 10,000 or more, particularly preferably 150,000 or more, and further preferably 200,000 or more. ..
  • the weight average molecular weight is preferably 2.5 million or less, particularly preferably 2 million or less, and further preferably 1.5 million or less.
  • the active energy rays When ultraviolet rays are used as the active energy rays for curing the active energy ray-curable pressure-sensitive adhesive, it is preferable to add a photopolymerization initiator to the pressure-sensitive adhesive. Further, an active energy ray non-curable polymer component or an oligomer component, a cross-linking agent or the like may be added to the pressure-sensitive adhesive.
  • the thickness of the pressure-sensitive adhesive layer in the present embodiment is preferably 1 ⁇ m or more, particularly preferably 2 ⁇ m or more, and further preferably 3 ⁇ m or more.
  • the thickness of the pressure-sensitive adhesive layer is preferably 50 ⁇ m or less, particularly preferably 40 ⁇ m or less, and further preferably 30 ⁇ m or less.
  • the thickness of the pressure-sensitive adhesive layer is 1 ⁇ m or more, the pressure-sensitive adhesive sheet according to the present embodiment can easily exhibit the desired adhesiveness. Further, when the thickness of the pressure-sensitive adhesive layer is 50 ⁇ m or less, it becomes easy to separate the adherend from the cured pressure-sensitive adhesive layer.
  • a release sheet may be laminated on the surface for the purpose of protecting the surface.
  • the configuration of the release sheet is arbitrary, and an example is one in which a plastic film is peeled off with a release agent or the like.
  • the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; and polyolefin films such as polypropylene and polyethylene.
  • the release agent a silicone type, a fluorine type, a long chain alkyl type or the like can be used, and among these, a silicone type which can obtain stable performance at a low cost is preferable.
  • the thickness of the release sheet is not particularly limited, and may be, for example, 20 ⁇ m or more and 250 ⁇ m or less.
  • the adhesive layer may be laminated on the surface of the pressure-sensitive adhesive layer opposite to the base material.
  • the adhesive sheet according to this embodiment can be used as a dicing / die bonding sheet.
  • a work is attached to the surface of the adhesive layer opposite to the pressure-sensitive adhesive layer, and the adhesive layer is diced together with the work to obtain a chip in which individualized adhesive layers are laminated. be able to.
  • the individualized adhesive layer allows the chip to be easily fixed to the object on which the chip is mounted.
  • thermosetting adhesive component As the material constituting the adhesive layer described above, a material containing a thermoplastic resin and a low molecular weight thermosetting adhesive component, a material containing a B stage (semi-curable) thermosetting adhesive component, and the like are used. It is preferable to use it.
  • a protective film forming layer may be laminated on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer.
  • the adhesive sheet according to the present embodiment can be used as a protective film forming and dicing sheet.
  • a work is attached to the surface of the protective film forming layer opposite to the adhesive layer, and the protective film forming layer is diced together with the work, whereby the individualized protective film forming layer is laminated. You can get the chips that have been made.
  • the work it is preferable to use a work having a circuit formed on one surface, and in this case, a protective film forming layer is usually laminated on a surface opposite to the surface on which the circuit is formed.
  • the individualized protective film forming layer is cured at a predetermined timing to form a protective film having sufficient durability on the chip.
  • the protective film forming layer is preferably made of an uncured curable adhesive.
  • the pressure-sensitive adhesive sheet manufacturing method according to the present embodiment is not particularly limited. For example, it is preferable to obtain an adhesive sheet by forming an adhesive layer on the release sheet and then laminating one side of the base material on the surface of the adhesive layer opposite to the release sheet.
  • the above-mentioned adhesive layer can be formed by a known method.
  • a tacky composition for forming a pressure-sensitive adhesive layer and, if desired, a coating solution further containing a solvent or dispersion medium are prepared.
  • the coating liquid is applied to the peelable surface of the release sheet (hereinafter, may be referred to as "peeling surface").
  • peeling surface the peelable surface of the release sheet
  • the pressure-sensitive adhesive layer can be formed by drying the obtained coating film.
  • the above-mentioned coating liquid can be applied by a known method, for example, a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, a gravure coating method, or the like.
  • the properties of the coating liquid are not particularly limited as long as it can be coated, and the coating liquid may contain a component for forming the pressure-sensitive adhesive layer as a solute or a dispersoid. ..
  • the release sheet may be peeled off as a process material, or the adhesive layer may be protected until it is attached to the adherend.
  • the adhesive composition for forming the adhesive layer contains the above-mentioned cross-linking agent
  • it is applied by changing the above-mentioned drying conditions (temperature, time, etc.) or by separately providing a heat treatment. It is preferable to proceed the cross-linking reaction between the polymer component in the film and the cross-linking agent to form a cross-linked structure in the pressure-sensitive adhesive layer at a desired abundance density. Further, in order to allow the above-mentioned cross-linking reaction to proceed sufficiently, after the pressure-sensitive adhesive layer and the base material are bonded together, curing may be carried out, for example, allowing the adhesive layer to stand in an environment at 23 ° C. and a relative humidity of 50% for several days. ..
  • the adhesive sheet according to this embodiment can be used for various purposes like a general adhesive sheet, but in particular, work processing used for processing a work such as a semiconductor wafer. It is preferable to use it as a sheet for use. In this case, after the adhesive surface of the adhesive sheet according to the present embodiment is attached to the work, the work can be processed on the adhesive sheet. Depending on the processing, the adhesive sheet according to the present embodiment can be used as a work processing sheet such as a back grind sheet, a dicing sheet, an expanding sheet, and a pickup sheet.
  • the work include semiconductor members such as semiconductor wafers and semiconductor packages, and glass members such as glass plates.
  • the adhesive sheet according to this embodiment can be expanded well. Therefore, the adhesive sheet according to the present embodiment is preferably used as a sheet for expanding (dicing sheet, expanding sheet, pickup sheet, etc.) among the above-mentioned work processing sheets.
  • the pressure-sensitive adhesive sheet according to the present embodiment includes the above-mentioned adhesive layer
  • the pressure-sensitive adhesive sheet can be used as a dicing / die-bonding sheet.
  • the pressure-sensitive adhesive sheet according to the present embodiment includes the above-mentioned protective film forming layer
  • the pressure-sensitive adhesive sheet can be used as a protective film forming and dicing sheet.
  • the pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheet according to the present embodiment is composed of the above-mentioned active energy ray-curable pressure-sensitive adhesive, it is also preferable to irradiate the following active energy rays at the time of use. .. That is, when the processing of the work is completed on the pressure-sensitive adhesive sheet and the processed work is separated from the pressure-sensitive adhesive sheet, it is preferable to irradiate the pressure-sensitive adhesive layer with active energy rays before the separation. As a result, the pressure-sensitive adhesive layer is cured, the adhesive force of the pressure-sensitive adhesive sheet to the processed work is satisfactorily reduced, and the processed work can be easily separated.
  • Adhesive Layer A release sheet (manufactured by Lintec Corporation, product name) in which one side of a polyethylene terephthalate film having a thickness of 50 ⁇ m is peeled off with a fluorine-based release agent from the silicone-based adhesive composition obtained above. It was applied to the peeled surface of "SP-PET 50E-0010YC"), and the obtained coating film was dried at 100 ° C. for 1 minute. As a result, a laminated body in which a pressure-sensitive adhesive layer having a thickness of 10 ⁇ m was formed on the peeled surface of the peeling sheet was obtained.
  • Adhesive Sheet One side of a polytetrafluoroethylene (PTFE) sheet as a base material (manufactured by Nichias Corporation, product name "Naflon PTFE tape TOMBO 9001", thickness: 100 ⁇ m) and the above step (2).
  • a pressure-sensitive adhesive sheet was obtained by laminating the surface of the obtained laminate on the side of the pressure-sensitive adhesive layer.
  • Example 2 (1) Preparation of Adhesive Composition 95 parts by mass of n-butyl acrylate and 5 parts by mass of acrylic acid were polymerized by a solution polymerization method to obtain a (meth) acrylic acid ester polymer. The weight average molecular weight (Mw) of this acrylic polymer was measured by the method described later and found to be 500,000.
  • Adhesive Layer A release sheet manufactured by Lintec Corporation, in which one side of a 38 ⁇ m-thick polyethylene terephthalate film is peeled off with a silicone-based release agent from the adhesive composition obtained in the above step (1). It was applied to the peeled surface of the product name "SP-PET38131"), and the obtained coating film was dried at 100 ° C. for 1 minute. As a result, a laminated body in which a pressure-sensitive adhesive layer having a thickness of 10 ⁇ m was formed on the peeled surface of the peeling sheet was obtained.
  • Adhesive Sheet One side of a thermoplastic polyurethane elastomer (TPU) sheet (manufactured by BASF, product name "Elastollan 1164D", thickness: 80 ⁇ m) as a base material and the laminate obtained in the above step (2).
  • An adhesive sheet was obtained by adhering the surface on the adhesive layer side of the body.
  • the above-mentioned weight average molecular weight (Mw) is a standard polystyrene-equivalent weight average molecular weight measured under the following conditions (GPC measurement) using gel permeation chromatography (GPC).
  • GPC measurement gel permeation chromatography
  • Example 3 12.90 kg of dimethyl 1,4-cyclohexanedicarboxylic acid (trans form ratio 98%), 11.47 kg of 1,4-cyclohexanedimethanol, ethylene glycol 0 in a reactor equipped with a stirrer, distillate tube and decompression device. .3 kg and 0.11 kg of an ethylene glycol solution containing 10% Mn acetate tetrahydrate were charged, heated to 200 ° C. under a nitrogen flow, and then heated to 230 ° C. over 1 hour.
  • the polyester resin (PEs) pellets thus obtained were dried at 85 ° C. for 4 hours or more, and then put into the hopper of a single-screw extruder equipped with a T-die. Then, under the conditions of a cylinder temperature of 220 ° C. and a die temperature of 220 ° C., the resin is extruded from a T-die in a state of being melt-kneaded and cooled by a cooling roll to obtain a sheet-like base material having a thickness of 80 ⁇ m. rice field. An adhesive sheet was obtained in the same manner as in Example 2 except that the base material was used.
  • the polyester resin contains about 50 mol% of 1,4-cyclohexanedimethanol, about 40.5 mol% of dimethyl 1,4-cyclohexanedicarboxylic acid, and a dimer derived from erucic acid as the monomers constituting the resin. It contained 9.5 mol% of acid. The ratio of the dimeric acid to the total dicarboxylic acid units constituting the polyester resin was 19.1 mol%.
  • the calorific value of melting of the polyester resin was measured using a differential scanning calorimeter (DSC, manufactured by TA Instruments, Inc., product name "DSC Q2000") according to JIS K7121: 2012, and found to be 20 J / g. Met.
  • DSC differential scanning calorimeter
  • the temperature is heated from room temperature to 250 ° C. at a heating rate of 20 ° C./min, held at 250 ° C. for 10 minutes, lowered to -60 ° C. at a temperature lowering rate of 20 ° C./min, and then at -60 ° C. for 10 minutes. Retained. Then, it was heated again to 250 ° C. at a heating rate of 20 ° C./min to obtain a DSC curve, and the melting point was measured.
  • SBES styrene / ethylene / butylene / styrene copolymer
  • a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 2 except that a base material (thickness: 80 ⁇ m) made of an ethylene / methacrylic acid copolymer (EMAA) was used as the base material.
  • a base material thickness: 80 ⁇ m
  • EMA ethylene / methacrylic acid copolymer
  • Example 2 A base material (thickness: 80 ⁇ m) made of EMAA and one surface of which has been subjected to electron beam irradiation (EB) is used as the base material, and an adhesive layer is provided on the surface of the base material that has been subjected to electron beam irradiation.
  • An adhesive sheet was obtained in the same manner as in Example 2 except that the sheets were laminated.
  • Test Example 1 Measurement of tensile physical characteristics of base material
  • the angles formed between the reference direction and the plan view are 0 °, 10 °, 20 °, 30 °, 40 °, with any one direction in the plan view as the reference direction.
  • a total of 18 directions were defined: 50 °, 60 °, 70 °, 80 °, 90 °, 100 °, 110 °, 120 °, 130 °, 140 °, 150 °, 160 ° and 170 °.
  • test pieces 15 mm ⁇ 150 mm.
  • test pieces in accordance with JIS K7127: 1999, a tensile tester (manufactured by Shimadzu Corporation, product name "Autograph AG-Xplus 100N") was used, the distance between chucks was set to 100 mm, and the temperature was 23 ° C. , A tensile test was conducted in which the test piece was pulled in the long side direction at a speed of 200 mm / min.
  • a tensile tester manufactured by Shimadzu Corporation, product name "Autograph AG-Xplus 100N"
  • the distance between chucks was set to 100 mm
  • the temperature was 23 ° C.
  • a tensile test was conducted in which the test piece was pulled in the long side direction at a speed of 200 mm / min.
  • the amount of increase in tensile stress obtained by subtracting the tensile stress at 100% elongation from the tensile stress at 200% elongation was calculated. Then, for the test piece having the smallest amount of rise, the direction parallel to the long side of the test piece (one of the 18 directions described above) was defined as the first measurement direction. Further, the direction in which the angle formed by the first measurement direction and the plan view is 90 ° was defined as the second measurement direction.
  • the second measurement direction is substantially parallel to the MD direction of the base material (flow direction at the time of manufacturing the base material), and the first measurement direction is the TD direction of the base material (perpendicular to the MD direction). It was almost parallel to the direction.
  • test piece 15 mm ⁇ 150 mm.
  • the tensile elastic modulus and elongation at break were measured for the test piece in accordance with JIS K7127: 1999. Specifically, the above test piece is set to a distance between chucks of 100 mm by a tensile tester (manufactured by Shimadzu Corporation, product name "Autograph AG-Xplus 100N"), and then 200 mm / min in an environment of 23 ° C.
  • test piece obtained in the same manner as above was subjected to a tensile test in which the test piece was pulled in the first measurement direction of the base film at a speed of 200 mm / min in an environment of 23 ° C., and the tensile elongation (%) was obtained.
  • the fluctuation of the tensile stress (MPa) was measured when the value was increased from 0% to 250%.
  • the tensile stress (MPa) at the time points of tensile elongation of 10%, 50%, 100%, 150%, 200% and 250% was recorded. Further, the amount of increase in tensile stress (MPa) is calculated from the time when the tensile elongation is 10% to the time when it is 200%, and the amount of increase in tensile stress (MPa) is calculated from the time when the tensile elongation is 100% to the time when it is 200%. bottom. Further, the ratio of the tensile stress at the time when the tensile elongation was 200% to the time when the tensile elongation was 100% was calculated. These results are also shown in Table 1 as measured values of each tensile property in the first measurement direction.
  • the measurement results are plotted on a coordinate plane having the tensile elongation (unit:%) as the horizontal axis and the tensile stress (unit: MPa) as the vertical axis, and a curve is drawn. Made. In the curve, it was confirmed whether or not there was a maximum point at which the tensile stress became maximum, and the results are shown in Table 1. Further, when the maximum point exists, it is further confirmed that there is a minimum point at which the tensile stress becomes the minimum, and then the maximum point (when there are a plurality of the maximum points, the value of the tensile elongation is the minimum).
  • the absolute value (MPa) of the difference between the tensile stresses between the minimum point (the maximum point) and the minimum point (the minimum point at which the tensile elongation value is the minimum when there are a plurality of points) is specified. The results are also shown in Table 1.
  • test piece for measuring the tensile physical characteristics in the second measurement direction was obtained. That is, the test piece of 15 mm ⁇ 150 mm was cut by cutting so that the side of 150 mm was parallel to the second measurement direction of the base material.
  • the tensile elastic modulus (MPa) was measured in the same manner as above, and the tensile stress (MPa) when the tensile elongation (%) was increased from 0% to 250%. ) was measured. Then, the tensile stress (MPa) at the time points of 10%, 50%, 100%, 150%, 200% and 250% is specified from the fluctuation of the tensile stress (MPa), and further, the tensile stress increases from these values. The amount (MPa) was calculated. The amount of increase is from 10% to 200%, 50% to 150%, 50% to 250%, and 100% to 200%. Was calculated. These results are also shown in Table 2 as measured values of each tensile property in the second measurement direction.
  • the adhesive sheet to which the chip and the ring frame obtained by dicing were attached was installed in an expanding device (manufactured by JCM Co., Ltd., product name "ME-300B"), and the ring frame was placed at a speed of 2 mm / sec. The withdrawal was performed until the withdrawal amount became 40 mm.
  • the withdrawal amount (mm) at the time of breakage was recorded. Then, the expandability was evaluated based on the following criteria. The results are shown in Tables 1 and 2 (the results shown in Tables 1 and 2 are the same). A: The withdrawal amount (mm) was 40 mm or more. F: The withdrawal amount (mm) was less than 40 mm.
  • the adhesive sheet of the present invention can be suitably used as a work processing sheet used for processing a work such as a semiconductor wafer.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023093908A (ja) * 2021-12-23 2023-07-05 リンテック株式会社 ワーク加工用シート、ワーク加工方法、および、ワーク加工用シートの使用
JP2024021488A (ja) * 2022-08-03 2024-02-16 リンテック株式会社 粘着シート

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155191A (ja) * 2010-01-28 2011-08-11 Hitachi Chem Co Ltd 半導体装置の製造方法及び回路部材接続用接着シート
JP2011165761A (ja) * 2010-02-05 2011-08-25 Hitachi Chem Co Ltd 半導体装置の製造方法及び回路部材接続用接着シート
JP2011173851A (ja) * 2010-02-25 2011-09-08 Kazki International:Kk 美容用貼付材
JP2011232767A (ja) * 2011-06-15 2011-11-17 Yamamoto Kogaku Co Ltd 偏光性成形体および同品の製造方法
JP2016069600A (ja) * 2014-10-01 2016-05-09 大和製罐株式会社 ポリエステル樹脂組成物
WO2018003312A1 (ja) * 2016-06-30 2018-01-04 リンテック株式会社 半導体加工用シート
JP2021050319A (ja) * 2019-09-19 2021-04-01 日東電工株式会社 粘着テープ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211234A (ja) 1991-12-05 1993-08-20 Lintec Corp ウェハ貼着用粘着シートおよびウェハダイシング方法
JP2011219563A (ja) * 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
WO2018083987A1 (ja) * 2016-11-02 2018-05-11 リンテック株式会社 ステルスダイシング用粘着シート

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155191A (ja) * 2010-01-28 2011-08-11 Hitachi Chem Co Ltd 半導体装置の製造方法及び回路部材接続用接着シート
JP2011165761A (ja) * 2010-02-05 2011-08-25 Hitachi Chem Co Ltd 半導体装置の製造方法及び回路部材接続用接着シート
JP2011173851A (ja) * 2010-02-25 2011-09-08 Kazki International:Kk 美容用貼付材
JP2011232767A (ja) * 2011-06-15 2011-11-17 Yamamoto Kogaku Co Ltd 偏光性成形体および同品の製造方法
JP2016069600A (ja) * 2014-10-01 2016-05-09 大和製罐株式会社 ポリエステル樹脂組成物
WO2018003312A1 (ja) * 2016-06-30 2018-01-04 リンテック株式会社 半導体加工用シート
JP2021050319A (ja) * 2019-09-19 2021-04-01 日東電工株式会社 粘着テープ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023093908A (ja) * 2021-12-23 2023-07-05 リンテック株式会社 ワーク加工用シート、ワーク加工方法、および、ワーク加工用シートの使用
JP7784294B2 (ja) 2021-12-23 2025-12-11 リンテック株式会社 ワーク加工用シート、ワーク加工方法、および、ワーク加工用シートの使用
JP2024021488A (ja) * 2022-08-03 2024-02-16 リンテック株式会社 粘着シート

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